JP2015188969A - Method and device for parting resin sheet - Google Patents
Method and device for parting resin sheet Download PDFInfo
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- JP2015188969A JP2015188969A JP2014067662A JP2014067662A JP2015188969A JP 2015188969 A JP2015188969 A JP 2015188969A JP 2014067662 A JP2014067662 A JP 2014067662A JP 2014067662 A JP2014067662 A JP 2014067662A JP 2015188969 A JP2015188969 A JP 2015188969A
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- resin sheet
- cutting
- scribing wheel
- adhesive tape
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims abstract description 78
- 239000011347 resin Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims description 13
- 239000002390 adhesive tape Substances 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims description 36
- 238000005096 rolling process Methods 0.000 claims description 8
- 229920002050 silicone resin Polymers 0.000 claims description 8
- 238000003892 spreading Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
本発明はシリコーンシート等の樹脂シートを分断するための分断方法及び分断装置に関するものである。 The present invention relates to a cutting method and a cutting apparatus for cutting a resin sheet such as a silicone sheet.
特許文献１には熱可塑性の樹脂シートを切断刃を用いて切断する方法が示されている。切断の際には刃を加熱し、切断刃の食い込み方向に往復運動させて切断している。又１枚の樹脂シートを切断する際に、切断する際のバリを除くために上下２枚の刃で切断する方法が特許文献２に示されている。 Patent Document 1 discloses a method of cutting a thermoplastic resin sheet using a cutting blade. During cutting, the blade is heated and reciprocated in the biting direction of the cutting blade for cutting. Further, Patent Document 2 discloses a method of cutting with two upper and lower blades in order to remove burrs when cutting one resin sheet.
従来の樹脂シートを分断する場合には、切断刃を用いて食い込み方向に往復運動させて切断しているため、高精度で正確に分断することは難しいという問題点があった。又上下２枚の刃で切断する方法では、上下の切断刃を正確に一致させることが難しいという問題点があった。 When the conventional resin sheet is divided, the cutting is performed by reciprocating in the biting direction using a cutting blade, so that there is a problem that it is difficult to accurately and accurately divide the resin sheet. Also, the method of cutting with two upper and lower blades has a problem that it is difficult to accurately match the upper and lower cutting blades.
本発明は樹脂シートを高精度で分断できる分断方法を提供することを目的とする。 An object of this invention is to provide the cutting method which can cut a resin sheet with high precision.
この課題を解決するために、本発明の樹脂シートの分断方法は、テーブル上に樹脂シートを保持し、前記樹脂シートに対して荷重をかけてスクライビングホイールを転動させることによって樹脂シートを分断するものである。 In order to solve this problem, the method for dividing a resin sheet according to the present invention divides the resin sheet by holding the resin sheet on a table and rolling the scribing wheel while applying a load to the resin sheet. Is.
この課題を解決するために、本発明の樹脂シートの分断方法は、枠状体の内側に張り渡された粘着テープの上面に樹脂シートを粘着させて保持し、テーブル上に前記枠状体を保持し、前記枠状体上に保持した前記樹脂シートに対して荷重をかけてスクライビングホイールを転動させることによって樹脂シートを分断し、前記粘着テープを下面より押し広げることによって分断した樹脂シートを分離するものである。 In order to solve this problem, the method for dividing a resin sheet according to the present invention is a method of adhering and holding a resin sheet on the upper surface of an adhesive tape stretched inside a frame-shaped body, and placing the frame-shaped body on a table. Holding the resin sheet by applying a load to the resin sheet held on the frame body and rolling the scribing wheel, and dividing the resin sheet by spreading the adhesive tape from the lower surface To separate.
この課題を解決するために、本発明の分断装置は、樹脂シートの分断に用いられる分断装置であって、粘着テープ上にスクライブの対象となる樹脂シートを保持した枠状体と、前記枠状体を保持するテーブルと、前記テーブルに保持された樹脂シートに対してスクライビングホイールを昇降させるスクライブヘッドと、前記スクライブヘッドと前記テーブルとを相対的に移動させる相対移動手段と、を具備し、前記樹脂シート上で前記スクライビングホイールを転動させることによって樹脂シートを分断するものである。 In order to solve this problem, the cutting device of the present invention is a cutting device used for cutting a resin sheet, the frame-shaped body holding a resin sheet to be scribed on an adhesive tape, and the frame shape A table that holds the body, a scribe head that raises and lowers a scribing wheel with respect to the resin sheet held on the table, and a relative movement means that relatively moves the scribe head and the table, The resin sheet is divided by rolling the scribing wheel on the resin sheet.
ここで前記樹脂シートは、シリコーン樹脂シートとしてもよい。 Here, the resin sheet may be a silicone resin sheet.
ここで前記スクライビングホイールは、１００°以下の刃先角度を有するものとしてもよい。 Here, the scribing wheel may have a cutting edge angle of 100 ° or less.
このような特徴を有する本発明によれば、樹脂シートを粘着テープ上に保持しテーブル上に固定した状態でスクライブすることによって分断し、粘着テープを拡張させて分離している。このため樹脂シートを所定の形状で正確に分断することができるという効果が得られる。 According to the present invention having such a feature, the resin sheet is divided by scribing while being held on the adhesive tape and fixed on the table, and the adhesive tape is expanded and separated. For this reason, the effect that the resin sheet can be accurately divided into a predetermined shape is obtained.
次に本発明の実施の形態による分断装置について説明する。図１に示すように、本実施の形態による分断装置１０は、移動台１１が一対の案内レール１２ａ，１２ｂに沿って、ｙ軸方向に移動自在に保持されている。ボ−ルネジ１３は移動台１１と螺合している。ボールネジ１３はモータ１４の駆動により回転し、移動台１１を案内レール１２ａ，１２ｂに沿ってｙ軸方向に移動させる。移動台１１の上面にはモータ１５が設けられている。モータ１５はテーブル１６をｘｙ平面で回転させて所定角度に位置決めするものである。このテーブル１６上には後述するように、スクライブの対象となる基板が載置され、図示しない真空吸引手段などにより保持される。 Next, the cutting apparatus according to the embodiment of the present invention will be described. As shown in FIG. 1, in the cutting apparatus 10 according to the present embodiment, a movable table 11 is held so as to be movable in the y-axis direction along a pair of guide rails 12 a and 12 b. The ball screw 13 is screwed with the movable table 11. The ball screw 13 is rotated by the drive of the motor 14 and moves the moving base 11 in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the movable table 11. The motor 15 rotates the table 16 on the xy plane and positions it at a predetermined angle. As will be described later, a substrate to be scribed is placed on the table 16 and held by a vacuum suction means (not shown).
分断装置１０には、移動台１１とその上部のテーブル１６をまたぐようにブリッジ２０がｘ軸方向に沿って支柱２１ａ，２１ｂにより架設されている。ブリッジ２０は横方向にビーム２２が設けられ、ビーム２２には駆動部２３が設けられる。駆動部２３はスライドベース２４をｘ軸方向に沿って移動させるものであって、モータ２５とモータ２５に連結されビーム２２の側面の中央に回転自在に保持された送りねじ２６から成り立っている。そして図１に示すように、スライドベース２４にはスクライブヘッド２７が取付けられている。スクライブヘッド２７の下端部には、チップホルダが取付けられている。チップホルダは下部に円板状のスクライビングホイール２８を回転自在に保持するものである。スクライブヘッド２７の内部には、チップホルダの昇降動作を可能とする昇降部、たとえば空気圧制御されるエアシリンダや電動制御されるリニアモータなどが設けられている。この実施の形態ではスクライビングホイール２８として頂角が１００°のスクライビングホイールを用いる。尚テーブル１６の移動機構及びスライドベース２４を移動させる駆動部は、スクライブヘッドをテーブルに対して相対的に移動させる相対移動手段を構成している。 In the cutting apparatus 10, a bridge 20 is constructed by struts 21a and 21b along the x-axis direction so as to straddle the movable table 11 and the table 16 on the upper side thereof. The bridge 20 is provided with a beam 22 in the lateral direction, and the beam 22 is provided with a drive unit 23. The drive unit 23 moves the slide base 24 along the x-axis direction, and includes a motor 25 and a feed screw 26 connected to the motor 25 and rotatably held at the center of the side surface of the beam 22. As shown in FIG. 1, a scribe head 27 is attached to the slide base 24. A chip holder is attached to the lower end of the scribe head 27. The chip holder holds a disc-shaped scribing wheel 28 at the lower portion in a rotatable manner. Inside the scribing head 27, an elevating part that allows the chip holder to move up and down, for example, an air cylinder that is pneumatically controlled, a linear motor that is electrically controlled, and the like are provided. In this embodiment, a scribing wheel having an apex angle of 100 ° is used as the scribing wheel 28. The moving mechanism of the table 16 and the drive unit for moving the slide base 24 constitute relative moving means for moving the scribe head relative to the table.
図２はテーブル１６とその上部に保持される樹脂シートの詳細を示す斜視図、図３はその側面図である。本実施の形態では、分断の対象をシリコーン樹脂シートとし、このシートを保持するために、半導体ウエハをチップに分離する際に用いられる円環の枠状体であるダイシングリング３１を使用している。図示のように、ダイシングリング３１の内側には上向きに粘着材を有する粘着テープ３２が貼り付けられている。この粘着テープ３２は塩化ビニル等の基材の層と、その上面に粘着材の層を有する２層構造のテープである。基材層は例えば厚さを８０μｍ、粘着材の層は２０μｍとし、合わせて１００μｍの厚さとする。そしてこの粘着テープ３２の上面中央には分断の対象となる樹脂シート３３、例えばシリコーン樹脂シートが貼り付けられる。樹脂シート３３は弾性を有しており、従来はスクライブによって分断できるとは考えられていなかったものである。本実施の形態では樹脂シート３３は０．００５〜１ｍｍの厚さ、ここでは例えば０．１ｍｍ厚さの略正方形状のシリコーン樹脂シートとする。この樹脂シート３３を１×１ｍｍ四方の多数の正方形の微小シートとなるように高精度で分断するものとする。 FIG. 2 is a perspective view showing details of the table 16 and a resin sheet held on the table 16, and FIG. 3 is a side view thereof. In the present embodiment, the object to be divided is a silicone resin sheet, and in order to hold the sheet, a dicing ring 31 that is an annular frame body used when separating the semiconductor wafer into chips is used. . As shown in the figure, an adhesive tape 32 having an adhesive material is attached inside the dicing ring 31 upward. This adhesive tape 32 is a two-layer tape having a base material layer such as vinyl chloride and an adhesive material layer on the top surface thereof. For example, the base material layer has a thickness of 80 μm, the adhesive material layer has a thickness of 20 μm, and the total thickness is 100 μm. A resin sheet 33 to be divided, for example, a silicone resin sheet is attached to the center of the upper surface of the adhesive tape 32. The resin sheet 33 has elasticity, and conventionally, it has not been considered that it can be divided by scribing. In the present embodiment, the resin sheet 33 is a substantially square silicone resin sheet having a thickness of 0.005 to 1 mm, for example, 0.1 mm. It is assumed that the resin sheet 33 is divided with high accuracy so as to be a large number of 1 × 1 mm square square sheets.
前述した分断装置１０のテーブル１６上には図２に示すように例えば０．３ｍｍ程度の厚さの保護用の薄いガラス板３４を載置する。そしてテーブル１６上には、ガラス板３４の上部に樹脂シート３３が位置するようにダイシングリング３１を配置する。そしてテーブル１６の下方より図示しない真空吸着手段等で樹脂シート３３を保持する。そうすれば図３に示すように粘着テープ３２の下面が吸着されるため、ガラス板３４と粘着テープ３２及びその上面の樹脂シート３３をテーブル１６上に保持することができる。 As shown in FIG. 2, a protective thin glass plate 34 having a thickness of, for example, about 0.3 mm is placed on the table 16 of the cutting apparatus 10 described above. On the table 16, the dicing ring 31 is arranged so that the resin sheet 33 is positioned above the glass plate 34. And the resin sheet 33 is hold | maintained from the lower part of the table 16 with the vacuum suction means etc. which are not illustrated. Then, since the lower surface of the adhesive tape 32 is adsorbed as shown in FIG. 3, the glass plate 34, the adhesive tape 32 and the resin sheet 33 on the upper surface can be held on the table 16.
次に樹脂シート３３の分断方法について説明する。まずスクライビングホイール２８の直下に樹脂シート３３が位置するようにスライドベース２４とテーブル１６を移動させる。そしてスクライブヘッド２７を下降させ、スクライビングホイール２８を樹脂シート３３の外側で樹脂シート３３の上面よりわずかに下となる位置にまで達するようにする。この状態でスライドベース２４をｘ軸方向に移動させることで、スクライビングホイール２８を樹脂シート３３に対して荷重をかけつつ転動させてスクライブすることができる。こうすればスクライブによってシリコーン樹脂等の樹脂シート３３を分断することができる。 Next, a method for dividing the resin sheet 33 will be described. First, the slide base 24 and the table 16 are moved so that the resin sheet 33 is positioned directly below the scribing wheel 28. Then, the scribe head 27 is lowered so that the scribing wheel 28 reaches a position slightly below the upper surface of the resin sheet 33 outside the resin sheet 33. By moving the slide base 24 in the x-axis direction in this state, the scribing wheel 28 can be scribed by rolling while applying a load to the resin sheet 33. If it carries out like this, the resin sheet 33, such as a silicone resin, can be parted by scribe.
次にスクライブヘッド２７を上昇させ、所定のピッチでテーブル１６をｙ軸方向にわずかに移動させた後、スクライブヘッド２７を降下させ、更にスクライビングホイール２８をビーム２２に沿ってｘ軸方向に移動させて同様にしてスクライブを繰り返す。ｘ軸方向に全てのスクライブが終了すると、テーブル１６をモータ１５により回転させて切断方向を変換し、同様にしてスクライブを繰り返す。そしてその上部よりスクライビングホイールで回転させ転動させることによって図４に示すように格子状に樹脂シート３３を分断する。 Next, the scribe head 27 is raised, the table 16 is slightly moved in the y-axis direction at a predetermined pitch, the scribe head 27 is lowered, and the scribing wheel 28 is further moved along the beam 22 in the x-axis direction. Repeat in the same way. When all scribing in the x-axis direction is completed, the table 16 is rotated by the motor 15 to change the cutting direction, and scribing is repeated in the same manner. Then, the resin sheet 33 is divided into a lattice shape as shown in FIG. 4 by rotating and rolling with a scribing wheel from above.
そして図５（ａ），（ｂ）に示すように、テーブル１６よりダイシングリング３１とその上部の樹脂シート３３を取り外し、ダイシングリング３１を保持しつつその中央の下部より粘着テープ３２を図５（ｂ）に示すように押し上げ部材３５を用いて下方から上に押し上げる。このときウエハ拡張装置を用いてもよい。こうすれば粘着テープ３２が押し広げられ、既に分断された各正方形状の樹脂片が粘着テープ３２上で分離され個片化が確認できると共に、各チップの取り出しが容易となる。 5 (a) and 5 (b), the dicing ring 31 and the upper resin sheet 33 are removed from the table 16, and the adhesive tape 32 is attached to the lower part of the center while holding the dicing ring 31 as shown in FIG. As shown in b), the push-up member 35 is used to push up from below. At this time, a wafer expansion apparatus may be used. In this way, the adhesive tape 32 is pushed and spread, and each divided resin piece in a square shape is separated on the adhesive tape 32, so that individualization can be confirmed, and each chip can be easily taken out.
この実施の形態では環状のダイシングリングに粘着テープを張架し、その上部に樹脂シートを粘着させて保持しているため、樹脂シートの取り扱いが容易となる。又分断した後も粘着テープを押し上げることによって分離した樹脂片を容易に取り出すことができる。このように半導体の製造工程で用いられるダイシングリングを樹脂シートの分断に有効に利用することができる。 In this embodiment, since the adhesive tape is stretched around the annular dicing ring and the resin sheet is adhered and held on the upper part, the resin sheet can be easily handled. Moreover, the separated resin piece can be easily taken out by pushing up the adhesive tape even after the separation. Thus, the dicing ring used in the semiconductor manufacturing process can be effectively used for dividing the resin sheet.
尚この実施の形態では、分断の対象となる樹脂シートをシリコーン樹脂から成るシートとして説明しているが、他の樹脂シート、例えばウレタン樹脂のシートであっても同様に本発明を適用することができる。 In this embodiment, the resin sheet to be divided is described as a sheet made of silicone resin. However, the present invention can be applied to other resin sheets such as urethane resin sheets as well. it can.
この実施の形態ではテーブル１６上に薄いガラス板３４を載置し、その上にダイシングリング３１内に張り渡された樹脂シート３３を保持しているが、ガラス板３４は単にテーブル１６を保護するものであるので、必ずしも用いる必要はない。 In this embodiment, a thin glass plate 34 is placed on the table 16 and a resin sheet 33 stretched in the dicing ring 31 is held thereon, but the glass plate 34 simply protects the table 16. Therefore, it is not always necessary to use it.
又この実施の形態ではスクライビングホイールとして頂角が１００°のホイールを用いているが、頂角がより小さいスクライビングホイールを用いてもよい。頂角が大きければスクライビングホイールの寿命が長くなるが、頂角が少なくなれば正確さを増すことができる。例えば頂角が３０°のスクライビングホイールを用いても同様にしてスクライブによって樹脂シートを分断することができる。従って少なくとも３０〜１００°の範囲では、いずれの頂角のスクライビングホイールを用いて樹脂シートを分断することができる。 In this embodiment, a wheel having an apex angle of 100 ° is used as the scribing wheel, but a scribing wheel having a smaller apex angle may be used. If the apex angle is large, the life of the scribing wheel will be long, but if the apex angle is small, the accuracy can be increased. For example, even when a scribing wheel having an apex angle of 30 ° is used, the resin sheet can be divided similarly by scribing. Therefore, in the range of at least 30 to 100 °, the resin sheet can be divided using any apex angle scribing wheel.
更にこの実施の形態では、樹脂シートを枠状のダイシングリングに張った粘着テープ上に保持するようにしているが、枠状体であれば足りるので、ダイシングリングに限定されるものではない。又枠状体を用いることなくテーブル上に樹脂シートを保持してスクライブすることで樹脂シートを分断することができる。 Furthermore, in this embodiment, the resin sheet is held on the adhesive tape stretched around the frame-shaped dicing ring, but the frame-shaped body is sufficient, and the present invention is not limited to the dicing ring. Further, the resin sheet can be divided by holding and scribing the resin sheet on the table without using a frame-like body.
本発明は分断装置を用いて樹脂シートを正確に分断することができるので、樹脂シートを精密に分断する分断装置に好適である。 Since the resin sheet can be accurately cut using the cutting device, the present invention is suitable for a cutting device for accurately cutting the resin sheet.
１０ 分断装置
１４，１５，２５ モータ
１６ テーブル
２４ スライドベース
２６ 送りねじ
２７ スクライブヘッド
２８ スクライビングホイール
３１ ダイシングリング
３２ 粘着テープ
３３ 樹脂シート
３４ ガラス板
10 Cutting Device 14, 15, 25 Motor 16 Table 24 Slide Base 26 Feed Screw 27 Scribe Head 28 Scribing Wheel 31 Dicing Ring 32 Adhesive Tape 33 Resin Sheet 34 Glass Plate
Claims (6)
前記樹脂シートに対して荷重をかけてスクライビングホイールを転動させることによって樹脂シートを分断する樹脂シートの分断方法。 Hold the resin sheet on the table,
A resin sheet dividing method in which a resin sheet is divided by applying a load to the resin sheet and rolling a scribing wheel.
テーブル上に前記枠状体を保持し、
前記枠状体上に保持した前記樹脂シートに対して荷重をかけてスクライビングホイールを転動させることによって樹脂シートを分断し、
前記粘着テープを下面より押し広げることによって分断した樹脂シートを分離する樹脂シートの分断方法。 Adhere and hold the resin sheet on the upper surface of the adhesive tape stretched inside the frame,
Holding the frame on the table,
The resin sheet is divided by rolling a scribing wheel with a load applied to the resin sheet held on the frame-shaped body,
A resin sheet dividing method for separating a resin sheet divided by spreading the adhesive tape from the lower surface.
粘着テープ上にスクライブの対象となる樹脂シートを保持した枠状体と、
前記枠状体を保持するテーブルと、
前記テーブルに保持された樹脂シートに対してスクライビングホイールを昇降させるスクライブヘッドと、
前記スクライブヘッドと前記テーブルとを相対的に移動させる相対移動手段と、を具備し、
前記樹脂シート上で前記スクライビングホイールを転動させることによって樹脂シートを分断する分断装置。 A cutting device used for cutting a resin sheet,
A frame-like body holding a resin sheet to be scribed on an adhesive tape;
A table for holding the frame,
A scribe head that raises and lowers a scribing wheel with respect to the resin sheet held on the table;
A relative movement means for relatively moving the scribe head and the table,
A cutting device for cutting the resin sheet by rolling the scribing wheel on the resin sheet.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014067662A JP6528356B2 (en) | 2014-03-28 | 2014-03-28 | Cutting method of resin sheet |
| TW103140866A TWI676539B (en) | 2014-03-28 | 2014-11-25 | Resin sheet breaking method and breaking device |
| KR1020140179197A KR20150112738A (en) | 2014-03-28 | 2014-12-12 | Dividing apparatus and dividing method of resin-sheet |
| CN201410798905.8A CN104942858B (en) | 2014-03-28 | 2014-12-19 | The method for dividing and break-up device of resin sheet |
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| JP2014067662A JP6528356B2 (en) | 2014-03-28 | 2014-03-28 | Cutting method of resin sheet |
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| JP2019002643A Division JP2019081252A (en) | 2019-01-10 | 2019-01-10 | Parting system of resin sheet |
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| JP6528356B2 JP6528356B2 (en) | 2019-06-12 |
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| KR (1) | KR20150112738A (en) |
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| JP6699196B2 (en) * | 2016-01-22 | 2020-05-27 | 三星ダイヤモンド工業株式会社 | Break device |
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| TW201536497A (en) | 2015-10-01 |
| JP6528356B2 (en) | 2019-06-12 |
| CN104942858B (en) | 2019-11-29 |
| KR20150112738A (en) | 2015-10-07 |
| TWI676539B (en) | 2019-11-11 |
| CN104942858A (en) | 2015-09-30 |
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