JP2015162093A - Insulating composition for touch panel, and touch panel - Google Patents
Insulating composition for touch panel, and touch panel Download PDFInfo
- Publication number
- JP2015162093A JP2015162093A JP2014036954A JP2014036954A JP2015162093A JP 2015162093 A JP2015162093 A JP 2015162093A JP 2014036954 A JP2014036954 A JP 2014036954A JP 2014036954 A JP2014036954 A JP 2014036954A JP 2015162093 A JP2015162093 A JP 2015162093A
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- touch panel
- insulating composition
- meth
- insulating
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- 125000003277 amino group Chemical group 0.000 claims abstract description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
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Landscapes
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Abstract
Description
本発明は、新規なタッチパネル用絶縁性組成物及びその硬化膜を有するタッチパネルに関する。 The present invention relates to a novel insulating composition for a touch panel and a touch panel having a cured film thereof.
現在、液晶ディスプレイ等の表示装置における入力手段として、タッチパネルが広く用いられている。タッチパネルの構成としては種々の方式が知られているが、明るい画面のディスプレイが実現できること、複数箇所のタッチを同時検出できること等の利点で、静電容量方式（投影型）のタッチパネルが注目されている。 Currently, touch panels are widely used as input means in display devices such as liquid crystal displays. Various types of touch panel configurations are known. Capacitance type (projection type) touch panels are attracting attention because of the advantages such as a bright screen display and the ability to detect multiple touches simultaneously. Yes.
静電容量方式のタッチパネルは、ＩＴＯ等の透明導電材料によって２層に形成されたモザイク状の電極パターンを画面内に有する。２層の電極パターンはそれぞれｘ軸方向とｙ軸方向に連なった形状を示し、ＭＡＭ（モリブデン−アルミニウム−モリブデンの３層構造の金属膜）等で形成された取出配線を介して外部の制御回路に接続される。タッチパネルの画面に指が触れると、その付近の電極パターンに静電容量の変化が生じ、これを制御回路が座標情報として検出して指の位置を識別することができる（例えば、特許文献１を参照）。 The capacitive touch panel has a mosaic electrode pattern formed in two layers with a transparent conductive material such as ITO in the screen. The two-layer electrode pattern has a continuous shape in the x-axis direction and the y-axis direction, and is connected to an external control circuit via an extraction wiring formed of MAM (molybdenum-aluminum-molybdenum three-layer metal film) or the like. Connected to. When a finger touches the screen of the touch panel, a change in capacitance occurs in an electrode pattern in the vicinity of the finger, and the control circuit can detect this as coordinate information to identify the position of the finger (for example, see Patent Document 1). reference).
このようなタッチパネルにおいては前面ガラス上にタッチパネル回路を一体形成することが行われており、電極パターンの絶縁層として透明な絶縁性組成物が使用されている。かかる絶縁層には透明性以外にも種々の特性が要求されており、ディスプレイの表面近くに位置することから必要となる耐光性、電極パターンや取出配線を形成するための金属エッチング液やエッチングレジストの剥離液に対する耐薬品性、絶縁層と接するガラスや金属（ＩＴＯ、ＭＡＭ等）に対する密着性等が特に重要視されている。 In such a touch panel, a touch panel circuit is integrally formed on a front glass, and a transparent insulating composition is used as an insulating layer of an electrode pattern. Such insulating layers are required to have various properties in addition to transparency, and are located near the surface of the display, so that they are required to have light resistance, metal etching solutions and etching resists for forming electrode patterns and lead wires. Particularly important are chemical resistance to the stripping solution, adhesion to glass or metal (ITO, MAM, etc.) in contact with the insulating layer, and the like.
絶縁層としては絶縁性の透明なインキ組成物が利用できるが、最近ではフォトリソグラフィーによる画像形成が可能なフォトレジストの適用が試みられている。フォトリソグラフィーのプロセスによれば、絶縁層を設けたい箇所のみに比較的薄い膜厚の絶縁層を容易に形成することができるため有益である。しかし、既存の材料、例えばカラーフィルターの保護膜用のオーバーコートレジストやスペーサー材料用のクリアレジスト、あるいは回路基板用のソルダーレジスト等をタッチパネル用途に転用した場合は、上述の特性が要求水準を満たさないという問題があった。 An insulating transparent ink composition can be used as the insulating layer, but recently, an application of a photoresist capable of forming an image by photolithography has been attempted. According to the photolithography process, an insulating layer having a relatively thin film thickness can be easily formed only in a portion where the insulating layer is to be provided, which is beneficial. However, when existing materials such as overcoat resists for color filter protective films, clear resists for spacer materials, solder resists for circuit boards, etc. are diverted to touch panel applications, the above characteristics meet the required level. There was no problem.
一方、タッチパネル用に設計が工夫された絶縁性組成物の提案も行われているが（例えば、特許文献２〜５を参照）、このような組成物においてもまだ十分な改善は図られておらず、更に高性能な材料の登場が望まれていた。 On the other hand, although an insulating composition whose design has been devised for a touch panel has been proposed (see, for example, Patent Documents 2 to 5), such a composition has not yet been sufficiently improved. In addition, the appearance of higher performance materials was desired.
本発明はかかる従来技術の課題に鑑みてなされたものであり、透明性、耐光性、耐薬品性及び密着性に優れ、フォトリソグラフィーによる画像形成が可能なタッチパネル用絶縁性組成物を提供することを目的とする。 The present invention has been made in view of the problems of the prior art, and provides an insulating composition for a touch panel that is excellent in transparency, light resistance, chemical resistance and adhesion, and capable of forming an image by photolithography. With the goal.
上記課題を解決するために検討した結果、本発明者等は、特定の構造を有する共重合体及び特定の官能基を有するシランカップリング剤を含有させた絶縁性組成物がタッチパネル用途に適することを見出し、本発明を完成した。 As a result of studying to solve the above problems, the present inventors have found that an insulating composition containing a copolymer having a specific structure and a silane coupling agent having a specific functional group is suitable for touch panel applications. The present invention has been completed.
すなわち、本発明は、
（Ａ）複数の繰返し単位を有する共重合体であって、下記一般式（１）で表される繰返し単位２０〜９０モル％、脂環構造を有する繰返し単位５〜５０モル％、及びこれらと共重合可能な重合性不飽和化合物に由来する繰返し単位５〜５０モル％で構成されると共に、数平均分子量が２千〜２万であり、尚且つ酸価が３５〜１２０ｍｇＫＯＨ／ｇである共重合体、及び
（Ｂ）アミノ基を有するシランカップリング剤
を含有することを特徴とするタッチパネル用絶縁性組成物である。
That is, the present invention
(A) A copolymer having a plurality of repeating units, the repeating unit represented by the following general formula (1) 20 to 90 mol%, the repeating unit having an alicyclic structure 5 to 50 mol%, and these A copolymer comprising 5 to 50 mol% of repeating units derived from a copolymerizable unsaturated compound, a number average molecular weight of 2,000 to 20,000, and an acid value of 35 to 120 mgKOH / g. An insulating composition for a touch panel, comprising a polymer and (B) a silane coupling agent having an amino group.
ここで、Ａ成分は芳香環を含有しない繰返し単位群のみから構成されることが好ましい。 Here, it is preferable that A component is comprised only from the repeating unit group which does not contain an aromatic ring.
また、本発明は上記のタッチパネル用絶縁性組成物の硬化膜を有するタッチパネルでもある。 Moreover, this invention is also a touchscreen which has the cured film of said insulating composition for touchscreens.
以下、本発明を詳細に説明する。
本発明の絶縁性組成物は、一般式（１）で表される繰返し単位２０〜９０モル％、脂環構造を有する繰返し単位５〜５０モル％、及びこれらと共重合可能な重合性不飽和化合物に由来する繰返し単位５〜５０モル％で構成されると共に、数平均分子量が２千〜２万であり、尚且つ酸価が３５〜１２０ｍｇＫＯＨ／ｇである共重合体（Ａ）を含有する。Ａ成分は、（メタ）アクリル酸誘導体に代表される重合性不飽和化合物を、常法によりラジカル重合して得られる重合体又は共重合体を基本骨格とすることが好ましい。ここで「（メタ）アクリル酸」とは、アクリル酸又はメタクリル酸をいう（以下も同様）。ラジカル重合に際しては、アゾ化合物や過酸化物等の公知のラジカル重合開始剤を使用することができ、更に公知の連鎖移動剤や重合禁止剤等を利用して重合度を制御してもよい。なお、一般式（１）で表される繰返し単位を２０〜９０モル％含むとは、共重合体（Ａ）を構成する総繰返し単位数に対して、一般式（１）で表される繰返し単位数の割合が２０〜９０モル％であることを示す。以下、繰返し単位のことをユニットともいう場合がある。
Hereinafter, the present invention will be described in detail.
The insulating composition of the present invention comprises 20 to 90 mol% of repeating units represented by the general formula (1), 5 to 50 mol% of repeating units having an alicyclic structure, and polymerizable unsaturated copolymerizable therewith. It is composed of 5 to 50 mol% of repeating units derived from the compound, and contains a copolymer (A) having a number average molecular weight of 2,000 to 20,000 and an acid value of 35 to 120 mgKOH / g. . The component A preferably includes a polymer or copolymer obtained by radical polymerization of a polymerizable unsaturated compound typified by a (meth) acrylic acid derivative by a conventional method as a basic skeleton. Here, “(meth) acrylic acid” means acrylic acid or methacrylic acid (the same applies hereinafter). In radical polymerization, known radical polymerization initiators such as azo compounds and peroxides can be used, and the degree of polymerization may be controlled using a known chain transfer agent or polymerization inhibitor. In addition, 20 to 90 mol% of repeating units represented by the general formula (1) means that the repeating units represented by the general formula (1) with respect to the total number of repeating units constituting the copolymer (A). It shows that the ratio of the number of units is 20 to 90 mol%. Hereinafter, the repeating unit may be referred to as a unit.
一般式（１）で表されるユニットをＡ成分に導入するには、グリセリン−１，３−ジ（メタ）アクリレートを原料として、これを直接ラジカル重合させる方法もあるが、架橋反応によるゲル化を防ぐために、（メタ）アクリル酸に由来するユニットを有する重合体若しくは共重合体に、（メタ）アクリル酸グリシジルを付加させるか、又は（メタ）アクリル酸グリシジルに由来するユニットを有する重合体若しくは共重合体に、（メタ）アクリル酸を付加させるかの２段階合成法によることが好ましい。かかる付加反応は常法によって行われればよく、三級アミン、四級アンモニウム塩、三級ホスフィン、四級ホスホニウム塩等の公知の反応触媒を適用することができる。 In order to introduce the unit represented by the general formula (1) into the component A, there is a method in which glycerin-1,3-di (meth) acrylate is used as a raw material, and this is directly radically polymerized. In order to prevent this, glycidyl (meth) acrylate is added to a polymer or copolymer having a unit derived from (meth) acrylic acid, or a polymer having a unit derived from glycidyl (meth) acrylate or It is preferable to use a two-step synthesis method in which (meth) acrylic acid is added to the copolymer. Such an addition reaction may be carried out by a conventional method, and known reaction catalysts such as tertiary amines, quaternary ammonium salts, tertiary phosphines, and quaternary phosphonium salts can be applied.
Ａ成分は、一般式（１）で表されるユニットの他に、脂環構造を有するユニットを５〜５０モル％有する。ここで、「脂環構造」とは、飽和又は不飽和の炭化水素基で構成される環構造をいい、芳香環は含まない。これをＡ成分に導入するには、脂環構造を有する重合性不飽和化合物を用いる方法が簡便であるため好ましい。脂環構造を有する重合性不飽和化合物の例としては、（メタ）アクリル酸シクロプロピル、（メタ）アクリル酸シクロブチル、（メタ）アクリル酸シクロペンチル、（メタ）アクリル酸シクロヘキシル、（メタ）アクリル酸ジシクロペンタニル、（メタ）アクリル酸ジシクロペンテニル、（メタ）アクリル酸イソボルニル、（メタ）アクリル酸アダマンチル等を挙げることができる。また、（メタ）アクリル酸に由来するユニットを有する重合体又は共重合体に、脂環構造を有するアルコールやアミン、エポキシ化合物等を反応させて得る方法もある。 A component has 5-50 mol% of units which have an alicyclic structure other than the unit represented by General formula (1). Here, the “alicyclic structure” means a ring structure composed of a saturated or unsaturated hydrocarbon group, and does not include an aromatic ring. In order to introduce this into the component A, a method using a polymerizable unsaturated compound having an alicyclic structure is preferable because it is simple. Examples of polymerizable unsaturated compounds having an alicyclic structure include cyclopropyl (meth) acrylate, cyclobutyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, dimethacrylate (meth) acrylate. Examples include cyclopentanyl, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, and the like. There is also a method obtained by reacting a polymer or copolymer having a unit derived from (meth) acrylic acid with an alcohol, amine or epoxy compound having an alicyclic structure.
脂環構造を有するユニットとしては少なくとも１つの脂環構造を有しているものであればよく、脂環構造から炭化水素基が分岐した形式の構造や、更にその任意の位置に、ハロゲン原子、ヒドロキシ基、スルファニル基、カルボニル基、チオカルボニル基、カルボキシ基、チオカルボキシ基、ジチオカルボキシ基、ホルミル基、シアノ基、ニトロ基、ニトロソ基、スルホ基、アミノ基、イミノ基、シリル基、エーテル基、チオエーテル基、エステル基、チオエステル基、ジチオエステル基、アミド基、チオアミド基、ウレタン基、チオウレタン基、ウレイド基、チオウレイド基等が置換基として導入された構造であってもよい。 The unit having an alicyclic structure may be any unit having at least one alicyclic structure, a structure in which a hydrocarbon group is branched from the alicyclic structure, and a halogen atom, Hydroxy group, sulfanyl group, carbonyl group, thiocarbonyl group, carboxy group, thiocarboxy group, dithiocarboxy group, formyl group, cyano group, nitro group, nitroso group, sulfo group, amino group, imino group, silyl group, ether group , A thioether group, an ester group, a thioester group, a dithioester group, an amide group, a thioamide group, a urethane group, a thiourethane group, a ureido group, a thioureido group, and the like may be introduced.
更に、Ａ成分は、前記一般式（１）で表されるユニットや前記脂環構造を有するユニットと共重合可能な重合性不飽和化合物に由来するユニットを５〜５０モル％有する。すなわち、Ａ成分には一般式（１）で表されるユニットや脂環構造を有するユニット以外の任意のユニットを共重合させることができ、例えば（メタ）アクリル酸、（メタ）アクリル酸エステル、（メタ）アクリル酸アミド、スチレン及びその誘導体、無水マレイン酸及びその誘導体、ビニルエーテル類、オレフィン類等に由来するユニットを導入することができる。ここで、耐光性の点からは紫外光領域になるべく吸収を持たない化合物を使用することが有利であり、そのためＡ成分は芳香環を含有しないユニット群のみから構成されることが好ましい。 Furthermore, A component has 5-50 mol% of units derived from the polymerizable unsaturated compound copolymerizable with the unit represented by the general formula (1) and the unit having the alicyclic structure. That is, the A component can be copolymerized with any unit other than the unit represented by the general formula (1) and the unit having an alicyclic structure, such as (meth) acrylic acid, (meth) acrylic acid ester, Units derived from (meth) acrylic acid amide, styrene and derivatives thereof, maleic anhydride and derivatives thereof, vinyl ethers, olefins and the like can be introduced. Here, from the viewpoint of light resistance, it is advantageous to use a compound that does not absorb as much as possible in the ultraviolet light region. Therefore, the component A is preferably composed only of a unit group that does not contain an aromatic ring.
上記の（メタ）アクリル酸エステルを構成するアルコール（Ｒ3ＯＨ）成分又は（メタ）アクリル酸アミドを構成するアミン（Ｒ4Ｒ5ＮＨ）成分としては、公知のものが特に制限なく利用できる。Ｒ3、Ｒ4及びＲ5の具体的な例としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｓｅｃ−ブチル基、ｔｅｒｔ−ブチル基、ペンチル基、イソペンチル基、ネオペンチル基、ｔｅｒｔ−ペンチル基、ヘキシル基、ヘプチル基、オクチル基、２−エチルヘキシル基、ノニル基、デシル基、ドデシル基、テトラデシル基、ヘキサデシル基、オクタデシル基、イコシル基、ビニル基、アリル基、エチニル基、フェニル基、トリル基、メシチル基、ナフチル基、アントリル基、フェナントリル基、ベンジル基、２−フェニルエチル基、２−フェニルビニル基等の飽和又は不飽和の一価の炭化水素基や、ピリジル基、ピペリジル基、ピペリジノ基、ピロリル基、ピロリジニル基、イミダゾリル基、イミダゾリジニル基、フリル基、テトラヒドロフリル基、チエニル基、テトラヒドロチエニル基、モルホリニル基、モルホリノ基、キノリル基等の飽和又は不飽和の一価の複素環基等を挙げることができる。更に、上記の炭化水素基及び複素環基等の任意の位置に、ハロゲン原子、ヒドロキシ基、スルファニル基、カルボニル基、チオカルボニル基、カルボキシ基、チオカルボキシ基、ジチオカルボキシ基、ホルミル基、シアノ基、ニトロ基、ニトロソ基、スルホ基、アミノ基、イミノ基、シリル基、エーテル基、チオエーテル基、エステル基、チオエステル基、ジチオエステル基、アミド基、チオアミド基、ウレタン基、チオウレタン基、ウレイド基、チオウレイド基等を置換基として導入した構造も挙げることができる。このような一価の基は目的とするＡ成分の構造に応じて適宜選定されればよいが、性能及び経済性の点から炭素原子数１〜２０の飽和又は不飽和の一価の炭化水素基であることが好ましく、炭素原子数１〜６の飽和又は不飽和の一価の炭化水素基であることがより好ましい（ただし脂環構造は含まない）。また、Ｒ4及びＲ5は水素原子であってもよく、Ｒ4及びＲ5が結合して環を形成していてもよい。 As the alcohol (R 3 OH) component constituting the (meth) acrylic acid ester or the amine (R 4 R 5 NH) component constituting the (meth) acrylic acid amide, known ones can be used without particular limitation. Specific examples of R 3 , R 4 and R 5 include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, isopentyl group, Neopentyl, tert-pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, icosyl, vinyl, allyl, ethynyl Group, phenyl group, tolyl group, mesityl group, naphthyl group, anthryl group, phenanthryl group, benzyl group, 2-phenylethyl group, 2-phenylvinyl group, etc., saturated or unsaturated monovalent hydrocarbon group, pyridyl Group, piperidyl group, piperidino group, pyrrolyl group, pyrrolidinyl group, imidazolyl group, imidazolidini And a saturated or unsaturated monovalent heterocyclic group such as a sulfur group, a furyl group, a tetrahydrofuryl group, a thienyl group, a tetrahydrothienyl group, a morpholinyl group, a morpholino group, and a quinolyl group. Furthermore, at any position such as the above hydrocarbon group and heterocyclic group, a halogen atom, a hydroxy group, a sulfanyl group, a carbonyl group, a thiocarbonyl group, a carboxy group, a thiocarboxy group, a dithiocarboxy group, a formyl group, a cyano group , Nitro group, nitroso group, sulfo group, amino group, imino group, silyl group, ether group, thioether group, ester group, thioester group, dithioester group, amide group, thioamide group, urethane group, thiourethane group, ureido group Moreover, the structure which introduce | transduced the thioureido group etc. as a substituent can also be mentioned. Such a monovalent group may be appropriately selected according to the structure of the target component A, but from the viewpoint of performance and economy, it is a saturated or unsaturated monovalent hydrocarbon having 1 to 20 carbon atoms. It is preferably a group, and more preferably a saturated or unsaturated monovalent hydrocarbon group having 1 to 6 carbon atoms (excluding an alicyclic structure). R 4 and R 5 may be a hydrogen atom, and R 4 and R 5 may be bonded to form a ring.
上記の他にも、エポキシ基を有するユニット〔例えば（メタ）アクリル酸グリシジル、（メタ）アクリル酸［４−（グリシジルオキシ）ブチル］、４−（グリシジルオキシメチル）スチレン等に由来するユニット〕や、アルコキシシリル基を有するユニット〔例えば（メタ）アクリル酸［３−（トリメトキシシリル）プロピル］、（メタ）アクリル酸［３−（トリエトキシシリル）プロピル］、４−（トリメトキシシリル）スチレン等に由来するユニット〕も共重合成分として好ましい。 In addition to the above, units having an epoxy group [eg, units derived from (meth) acrylic acid glycidyl, (meth) acrylic acid [4- (glycidyloxy) butyl], 4- (glycidyloxymethyl) styrene, etc.] , Units having an alkoxysilyl group [for example, (meth) acrylic acid [3- (trimethoxysilyl) propyl], (meth) acrylic acid [3- (triethoxysilyl) propyl], 4- (trimethoxysilyl) styrene, etc. The unit derived from is also preferred as a copolymerization component.
更に、スチレンの誘導体としてはα−メチルスチレンや、スチレンの芳香環にアルキル基、ハロゲン原子、ヒドロキシ基等を導入した化合物も使用できる。また、無水マレイン酸の誘導体としては、無水マレイン酸とアルコールのモノエステル又はジエステル、無水マレイン酸とアミンのアミド又はイミド等が使用できる。ビニルエーテル類としてはアルキルビニルエーテル等、オレフィン類としてはエチレン、プロピレン、ブタジエンや、これら化合物の水素原子がハロゲン原子やシアノ基で置換された構造等を例示することができる。その他、アルキルビニルケトン、酢酸ビニル等も利用できる。なお、この段落でいうアルキルは炭素数１〜２０の飽和又は不飽和の炭化水素基を表し、かかる炭化水素基は分岐構造を有していてもよく、任意の置換基で置換されていてもよい。 Furthermore, as a derivative of styrene, α-methylstyrene or a compound in which an alkyl group, a halogen atom, a hydroxy group or the like is introduced into the aromatic ring of styrene can be used. As the maleic anhydride derivative, maleic anhydride and alcohol monoester or diester, maleic anhydride and amine amide or imide, and the like can be used. Examples of vinyl ethers include alkyl vinyl ethers, examples of olefins include ethylene, propylene, butadiene, and structures in which hydrogen atoms of these compounds are substituted with halogen atoms or cyano groups. In addition, alkyl vinyl ketone, vinyl acetate and the like can be used. In addition, the alkyl as used in this paragraph represents a C1-C20 saturated or unsaturated hydrocarbon group, and such a hydrocarbon group may have a branched structure or may be substituted with an arbitrary substituent. Good.
Ａ成分は一般式（１）で表されるユニットを２０〜９０モル％含むことが必要であり、２５〜７５モル％含むことがより好ましく、３０〜６０モル％含むことが特に好ましい。一般式（１）で表されるユニットがこれより少ない場合は、絶縁性組成物の耐薬品性や密着性が不足する。一方、一般式（１）で表されるユニットが多いことによる機能上の問題はないが、その割合が大きすぎると酸価を所定の範囲に制御することとの両立が難しくなる。そのため、一般式（１）で表されるユニットの上限は９０モル％であることが必要である。また、Ａ成分は脂環構造を有するユニットを５〜５０モル％含むことが必要であり、７〜４０モル％含むことがより好ましく、１０〜３０モル％含むことが特に好ましい。脂環構造を有するユニットは透明性や耐光性を向上させる。 The component A is required to contain 20 to 90 mol% of the unit represented by the general formula (1), more preferably 25 to 75 mol%, particularly preferably 30 to 60 mol%. When the number of units represented by the general formula (1) is less than this, the chemical resistance and adhesion of the insulating composition are insufficient. On the other hand, there is no functional problem due to the large number of units represented by the general formula (1), but if the ratio is too large, it becomes difficult to achieve both control of the acid value within a predetermined range. Therefore, the upper limit of the unit represented by the general formula (1) needs to be 90 mol%. Moreover, A component needs to contain 5-50 mol% of units which have an alicyclic structure, It is more preferable to contain 7-40 mol%, It is especially preferable to contain 10-30 mol%. A unit having an alicyclic structure improves transparency and light resistance.
また、Ａ成分の数平均分子量は２千〜２万の範囲にあることが必要であり、５千〜１万５千の範囲にあることがより好ましい。数平均分子量がこれより小さい場合は絶縁性組成物の耐薬品性が不足し、反対に大きい場合はフォトリソグラフィーによる画像形成が困難となる。Ａ成分の重量平均分子量については特に制限はないが、分散度（重量平均分子量÷数平均分子量）が１〜４の範囲にあることが好ましい。これら分子量の値はＧＰＣ（ＳＥＣ）測定により求めることができる。 In addition, the number average molecular weight of the component A needs to be in the range of 2,000 to 20,000, and more preferably in the range of 5,000 to 15,000. When the number average molecular weight is smaller than this, the chemical resistance of the insulating composition is insufficient. On the other hand, when the number average molecular weight is larger, it is difficult to form an image by photolithography. Although there is no restriction | limiting in particular about the weight average molecular weight of A component, It is preferable that dispersity (weight average molecular weight / number average molecular weight) exists in the range of 1-4. These molecular weight values can be determined by GPC (SEC) measurement.
更に、Ａ成分の酸価は３５〜１２０ｍｇＫＯＨ／ｇであることが必要であり、５０〜８０ｍｇＫＯＨ／ｇであることがより好ましい。酸価がこの範囲を外れる場合は、アルカリ現像液への溶解性のバランスが失われてフォトリソグラフィーによる画像形成が困難となる。Ａ成分への酸価の付与は、典型的には（メタ）アクリル酸に由来するユニットを所定のモル比で共重合させることによって行えるが、下記のような一般式（２）で表されるユニットの導入も好ましい。一般式（２）で表されるユニットは、一般式（１）で表されるユニットにジカルボン酸無水物を付加させて合成することができる。なお、一般式（２）で表されるユニットは、前記一般式（１）で表されるユニットや前記脂環構造を有するユニットと共重合可能な重合性不飽和化合物に由来するユニットに分類され、Ａ成分がこれを含有する場合は１０〜３０モル％含むことが好ましい。 Furthermore, the acid value of the component A is required to be 35 to 120 mgKOH / g, and more preferably 50 to 80 mgKOH / g. When the acid value is out of this range, the balance of solubility in an alkaline developer is lost, and image formation by photolithography becomes difficult. The acid value can be imparted to the component A by typically copolymerizing units derived from (meth) acrylic acid at a predetermined molar ratio, which is represented by the following general formula (2). The introduction of units is also preferred. The unit represented by the general formula (2) can be synthesized by adding a dicarboxylic acid anhydride to the unit represented by the general formula (1). The unit represented by the general formula (2) is classified into a unit derived from a polymerizable unsaturated compound copolymerizable with the unit represented by the general formula (1) and the unit having the alicyclic structure. When the component A contains this, it is preferably contained in an amount of 10 to 30 mol%.
ジカルボン酸無水物としては公知のものが特に制限なく利用できるが、例えば、無水コハク酸（Ｚ＝エチレン基）、無水マレイン酸（Ｚ＝ビニレン基）、シクロヘキサン−１，２−ジカルボン酸無水物（Ｚ＝シクロヘキサン−１，２−ジイル基）、シクロヘキセン−１，２−ジカルボン酸無水物（Ｚ＝シクロヘキセン−１，２−ジイル基）、シクロヘキセン−４，５−ジカルボン酸無水物（Ｚ＝シクロヘキセン−４，５−ジイル基）、ノルボルナン−２，３−ジカルボン酸無水物（Ｚ＝ノルボルナン−２，３−ジイル基）、無水フタル酸（Ｚ＝１，２−フェニレン基）、ベンゼン−１，２，４−トリカルボン酸−１，２−無水物（Ｚ＝４−カルボキシ−１，２−フェニレン基）、シクロヘキサン−１，２，４−トリカルボン酸−１，２−無水物（Ｚ＝４−カルボキシシクロヘキサン−１，２−ジイル基）等を挙げることができる。
上記一般式（２）のユニット以外にも、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート等のヒドロキシ基を有する（メタ）アクリル酸エステルにジカルボン酸無水物を付加した構造に由来するユニットや、無水マレイン酸及びその誘導体に由来するユニット等も利用することができる。
Known dicarboxylic acid anhydrides can be used without particular limitation. For example, succinic anhydride (Z = ethylene group), maleic anhydride (Z = vinylene group), cyclohexane-1,2-dicarboxylic acid anhydride ( Z = cyclohexane-1,2-diyl group), cyclohexene-1,2-dicarboxylic acid anhydride (Z = cyclohexene-1,2-diyl group), cyclohexene-4,5-dicarboxylic acid anhydride (Z = cyclohexene- 4,5-diyl group), norbornane-2,3-dicarboxylic anhydride (Z = norbornane-2,3-diyl group), phthalic anhydride (Z = 1,2-phenylene group), benzene-1,2 , 4-tricarboxylic acid-1,2-anhydride (Z = 4-carboxy-1,2-phenylene group), cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride (Z = 4-carboxy-1,2-diyl group), and the like.
In addition to the unit of the general formula (2), (meth) acrylic acid ester having a hydroxy group such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate A unit derived from a structure obtained by adding a dicarboxylic acid anhydride to the unit, a unit derived from maleic anhydride and a derivative thereof, and the like can also be used.
Ａ成分がタッチパネル用の絶縁性組成物に適している理由は必ずしも明らかでないが、一般式（１）で表されるユニットの末端の重合性不飽和結合が硬化後に緻密な架橋構造を形成して耐薬品性を向上させると考えられること、また透明性や耐光性の向上に有効な脂環構造を有するユニットを含むことから、タッチパネル用途として理想的な硬化膜の形成を可能とできるものと推測される。また、Ａ成分については、組成の異なる２種類以上の共重合体を組み合わせて使用することができる。
なお、Ａ成分は絶縁性組成物の固形分中４０〜９０重量％含有することが好ましく、更には５０〜７０重量％含有することがより好ましい。ここで固形分とは、絶縁性組成物に含まれる溶剤以外の成分をいう（溶剤については後述する）。
The reason why the component A is suitable for an insulating composition for a touch panel is not necessarily clear, but the polymerizable unsaturated bond at the terminal of the unit represented by the general formula (1) forms a dense crosslinked structure after curing. Presumed that it is possible to form an ideal cured film for touch panel applications because it is thought to improve chemical resistance and includes a unit with an alicyclic structure effective for improving transparency and light resistance. Is done. Moreover, about A component, it can use combining 2 or more types of copolymers from which a composition differs.
In addition, it is preferable to contain 40-90weight% of A component in solid content of an insulating composition, and it is more preferable to contain 50-70weight% further. Here, solid content means components other than the solvent contained in an insulating composition (a solvent is mentioned later).
本発明の絶縁性組成物は、アミノ基を有するシランカップリング剤（Ｂ）を含有する。アミノ基としては１級、２級及び３級のアミノ基がいずれも使用でき、これらのうち少なくとも１つを有することが必要であるが、複数のアミノ基を有するものでもよい。また、シランカップリング剤の加水分解性基としてはアルコキシ基が好ましく、反応性に優れることから３つ以上のアルコキシ基を有することがより好ましい。このようなシランカップリング剤の具体的な例としては、３−アミノプロピルトリアルコキシシラン、３−アミノプロピル（メチル）ジアルコキシシラン、３−（メチルアミノ）プロピルトリアルコキシシラン、３−（フェニルアミノ）プロピルトリアルコキシシラン、３−［（２−アミノエチル）アミノ］プロピルトリアルコキシシラン、３−［（１，３−ジメチルブチリデン）アミノ］プロピルトリアルコキシシラン、Ｎ，Ｎ′−ビス［３−（トリアルコキシシリル）プロピル］エチレンジアミン、上記各化合物の部分加水分解重縮合物等を挙げることができる。ここで、アルコキシとしては、メトキシ又はエトキシであることが好ましい。このＢ成分は絶縁性組成物の密着性を向上させる効果を有するが、特に前記Ａ成分との組み合わせにおいて高い効果を示す。なお、このＢ成分については、２種類以上を組み合わせて使用してもよい。
さらに、Ｂ成分は絶縁性組成物の固形分中０．０１〜１０重量％含有することが好ましく、更には０．１〜５重量％含有することがより好ましい。
The insulating composition of the present invention contains a silane coupling agent (B) having an amino group. As the amino group, any of primary, secondary and tertiary amino groups can be used, and it is necessary to have at least one of these, but it may have a plurality of amino groups. Moreover, as a hydrolysable group of a silane coupling agent, an alkoxy group is preferable, and since it is excellent in reactivity, it is more preferable to have three or more alkoxy groups. Specific examples of such silane coupling agents include 3-aminopropyltrialkoxysilane, 3-aminopropyl (methyl) dialkoxysilane, 3- (methylamino) propyltrialkoxysilane, and 3- (phenylamino). ) Propyltrialkoxysilane, 3-[(2-aminoethyl) amino] propyltrialkoxysilane, 3-[(1,3-dimethylbutylidene) amino] propyltrialkoxysilane, N, N′-bis [3- (Trialkoxysilyl) propyl] ethylenediamine, partially hydrolyzed polycondensates of the above compounds, and the like. Here, the alkoxy is preferably methoxy or ethoxy. This B component has the effect of improving the adhesion of the insulating composition, but shows a high effect particularly in combination with the A component. In addition, about this B component, you may use it in combination of 2 or more types.
Furthermore, it is preferable to contain 0.01-10 weight% of B components in solid content of an insulating composition, and it is more preferable to contain 0.1-5 weight% further.
本発明の絶縁性組成物には、硬化性やフォトリソグラフィーの性能を制御する目的でＡ成分以外の重合性不飽和結合を有する化合物（Ｃ）を含有させることができる。Ｃ成分としては、従来、感光性組成物に用いられている公知の化合物を特に制限なく使用することができるが、例えば、ジエチレングリコールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジトリメチロールプロパンテトラ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート等の（メタ）アクリル酸エステル誘導体や、ビスフェノールＡ型エポキシジ（メタ）アクリレート、ビスフェノールＦ型エポキシジ（メタ）アクリレート、ビスフェノールフルオレン型エポキシジ（メタ）アクリレート、フェノールノボラック型エポキシポリ（メタ）アクリレート、クレゾールノボラック型エポキシポリ（メタ）アクリレート等の（メタ）アクリル酸エポキシエステル誘導体等を好ましく用いることができる。また、上記（メタ）アクリル酸誘導体と、構造中に（好ましくは複数の）イソシアネート基や酸無水物基等を有する化合物との反応生成物等も適している。なお、（メタ）アクリル酸誘導体以外にも、マレイン酸誘導体、マレイミド誘導体、クロトン酸誘導体、イタコン酸誘導体、ケイヒ酸誘導体、ビニル誘導体、ビニルアルコール誘導体、ビニルケトン誘導体、ビニル芳香族誘導体等も挙げることができる。これらの重合性不飽和結合を有する化合物は、更にエポキシ基等の熱反応性の官能基やカルボキシ基等のアルカリ溶解性の官能基等を有して、複合機能化されたものであってもよい。Ｃ成分の配合量は特に制限されるものではないが、絶縁性組成物の固形分中１〜５０重量％であることが好ましく、１０〜４０重量％であることがより好ましい。Ｃ成分は、１種類の化合物のみを用いてもよく、複数を組み合わせて用いてもよい。 The insulating composition of the present invention may contain a compound (C) having a polymerizable unsaturated bond other than the component A for the purpose of controlling curability and photolithography performance. As the component C, known compounds conventionally used in photosensitive compositions can be used without particular limitation. Examples thereof include diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and pentaerythritol. (Meth) acrylate derivatives such as tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol A type epoxy di (meth) acrylate, bisphenol F type epoxy di (meth) Acrylate, bisphenolfluorene type epoxy di (meth) acrylate, phenol novolac type epoxy poly (meth) acrylate, cresol novolac type epoxy poly (meth) acrylate, etc. It can be preferably used acrylic acid epoxy ester derivatives. In addition, a reaction product of the (meth) acrylic acid derivative and a compound having an (preferably plural) isocyanate group or an acid anhydride group in the structure is also suitable. In addition to (meth) acrylic acid derivatives, maleic acid derivatives, maleimide derivatives, crotonic acid derivatives, itaconic acid derivatives, cinnamic acid derivatives, vinyl derivatives, vinyl alcohol derivatives, vinyl ketone derivatives, vinyl aromatic derivatives, etc. it can. These compounds having a polymerizable unsaturated bond may be those having a multifunctional function, further having a thermally reactive functional group such as an epoxy group or an alkali-soluble functional group such as a carboxy group. Good. Although the compounding quantity of C component is not specifically limited, It is preferable that it is 1 to 50 weight% in solid content of an insulating composition, and it is more preferable that it is 10 to 40 weight%. As the component C, only one type of compound may be used, or a plurality of components may be used in combination.
本発明の絶縁性組成物には、光硬化性を高める目的で光重合開始剤及び／又は色素増感剤（Ｄ）を含有させることができる。Ｄ成分としては、従来感光性組成物に用いられている公知の化合物を特に制限なく使用することができるが、例えば、アセトフェノン、２−ヒドロキシ−２−メチル−１−フェニルプロパン−１−オン、ベンジルジメチルケタール等のアセトフェノン化合物、ベンゾフェノン、２，４，６−トリメチルベンゾフェノン、４，４′−ビス（Ｎ，Ｎ−ジエチルアミノ）ベンゾフェノン等のベンゾフェノン化合物、ベンゾインエチルエーテル、ベンゾイン−ｔｅｒｔ−ブチルエーテル等のベンゾインエーテル化合物、２−メチル−１−［４−（メチルスルファニル）フェニル］−２−モルホリノプロパン−１−オン、２−ベンジル−２−（Ｎ，Ｎ−ジメチルアミノ）−１−（４−モルホリノフェニル）ブタン−１−オン等のα−アミノアルキルフェノン化合物、チオキサントン、２，４−ジエチルチオキサントン等のチオキサントン化合物、３，３′，４，４′−テトラキス（ｔｅｒｔ−ブチルペルオキシカルボニル）ベンゾフェノン等の有機過酸化物、２，２′−ビス（２−クロロフェニル）−４，４′，５，５′−テトラフェニル−１，２−ビイミダゾール等のビイミダゾール化合物、ビス（η5−シクロペンタジエニル）ビス［２，６−ジフルオロ−３−（１−ピロリル）フェニル］チタン等のチタノセン化合物、２，４，６−トリス（トリクロロメチル）−１，３，５−トリアジン、２−［３，４−（メチレンジオキシ）フェニル］−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン等のトリアジン化合物、（２，４，６−トリメチルベンゾイル）ジフェニルホスフィンオキシド、ビス（２，４，６−トリメチルベンゾイル）フェニルホスフィンオキシド等のアシルホスフィンオキシド化合物、カンファーキノン等のキノン化合物、１−［４−（フェニルスルファニル）フェニル］オクタン−１，２−ジオン＝２−Ｏ−ベンゾイルオキシム、１−［９−エチル−６−（２−メチルベンゾイル）カルバゾール−３−イル］エタノン＝Ｏ−アセチルオキシム、（９−エチル−６−ニトロカルバゾール−３−イル）［４−（２−メトキシ−１−メチルエトキシ）−２−メチルフェニル］メタノン＝Ｏ−アセチルオキシム等のオキシムエステル化合物等を挙げることができる。これらの中でも絶縁性組成物の感度を高められる点で特にオキシムエステル化合物が好ましい。Ｄ成分の配合量は特に制限されるものではないが、絶縁性組成物の固形分中０．１〜１０重量％であることが好ましく、１〜５重量％であることがより好ましい。Ｄ成分は、１種類の化合物のみを用いてもよく、複数を組み合わせて用いてもよい。 The insulating composition of the present invention may contain a photopolymerization initiator and / or a dye sensitizer (D) for the purpose of enhancing photocurability. As the component D, known compounds conventionally used in photosensitive compositions can be used without particular limitation. For example, acetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, Acetophenone compounds such as benzyl dimethyl ketal, benzophenone, 2,4,6-trimethylbenzophenone, benzophenone compounds such as 4,4'-bis (N, N-diethylamino) benzophenone, benzoin such as benzoin ethyl ether and benzoin-tert-butyl ether Ether compounds, 2-methyl-1- [4- (methylsulfanyl) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2- (N, N-dimethylamino) -1- (4-morpholinophenyl) ) Α-Aminoalkylphenol such as butan-1-one Compounds, thioxanthone compounds such as thioxanthone and 2,4-diethylthioxanthone, organic peroxides such as 3,3 ′, 4,4′-tetrakis (tert-butylperoxycarbonyl) benzophenone, 2,2′-bis (2 -Chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2-biimidazole and other biimidazole compounds, bis (η 5 -cyclopentadienyl) bis [2,6-difluoro-3- ( 1-pyrrolyl) phenyl] titacene compounds such as titanium, 2,4,6-tris (trichloromethyl) -1,3,5-triazine, 2- [3,4- (methylenedioxy) phenyl] -4,6 -Triazine compounds such as bis (trichloromethyl) -1,3,5-triazine, (2,4,6-trimethylbenzoyl) diphenylphosphite Oxides, acylphosphine oxide compounds such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, quinone compounds such as camphorquinone, 1- [4- (phenylsulfanyl) phenyl] octane-1,2-dione = 2 -O-benzoyloxime, 1- [9-ethyl-6- (2-methylbenzoyl) carbazol-3-yl] ethanone = O-acetyloxime, (9-ethyl-6-nitrocarbazol-3-yl) [4 Examples include oxime ester compounds such as-(2-methoxy-1-methylethoxy) -2-methylphenyl] methanone = O-acetyloxime. Among these, an oxime ester compound is particularly preferable in terms of enhancing the sensitivity of the insulating composition. Although the compounding quantity of D component is not restrict | limited in particular, it is preferable that it is 0.1 to 10 weight% in the solid content of an insulating composition, and it is more preferable that it is 1 to 5 weight%. As the component D, only one type of compound may be used, or a plurality may be used in combination.
本発明の絶縁性組成物には、耐薬品性を更に高める目的でエポキシ化合物（Ｅ）を含有させることができる。Ｅ成分としては、エポキシ樹脂等として市販されている公知の化合物を特に制限なく使用することができるが、例えば、ビスフェノールＡ型エポキシ化合物、ビスフェノールＦ型エポキシ化合物、ビスフェノールフルオレン型エポキシ化合物、フェノールノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、多価アルコールのグリシジルエーテル、多価カルボン酸のグリシジルエステル、エポキシ基を有する重合体又は共重合体であってＡ成分に該当しない化合物、３，４−エポキシシクロヘキサンカルボン酸（３，４−エポキシシクロヘキシル）メチルに代表される脂環式エポキシ化合物、２，２−ビス（ヒドロキシメチル）−１−ブタノールの１，２−エポキシ−４−（２−オキシラニル）シクロヘキサン付加物（例えばダイセル社製「ＥＨＰＥ３１５０」）、エポキシ化ポリブタジエン（例えば日本曹達社製「ＮＩＳＳＯ−ＰＢ・ＪＰ−１００」）、シリコーン骨格を有するエポキシ化合物等を挙げることができる。これら成分としてはエポキシ当量が１００〜３００ｇ／ｅｑかつ数平均分子量が１００〜５千の化合物であることが好ましい。Ｅ成分の配合量は特に制限されるものではないが、絶縁性組成物の固形分中１〜２０重量％であることが好ましく、２〜１５重量％であることがより好ましい。Ｅ成分は、１種類の化合物のみを用いてもよく、複数を組み合わせて用いてもよい。 The insulating composition of the present invention can contain an epoxy compound (E) for the purpose of further improving chemical resistance. As the E component, known compounds that are commercially available as epoxy resins and the like can be used without particular limitation. For example, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, phenol novolac type Epoxy compound, cresol novolac type epoxy compound, glycidyl ether of polyhydric alcohol, glycidyl ester of polyvalent carboxylic acid, polymer or copolymer having epoxy group and not corresponding to component A, 3,4-epoxycyclohexane 1,2-epoxy-4- (2-oxiranyl) cyclohexane addition of 2,2-bis (hydroxymethyl) -1-butanol to alicyclic epoxy compounds represented by carboxylic acid (3,4-epoxycyclohexyl) methyl Thing (example If Daicel Ltd. "EHPE3150"), epoxidized polybutadiene (e.g., manufactured by Nippon Soda Co., Ltd. "NISSO-PB · JP-100"), and epoxy compounds having a silicone backbone. These components are preferably compounds having an epoxy equivalent of 100 to 300 g / eq and a number average molecular weight of 100 to 5,000. Although the compounding quantity of E component is not specifically limited, It is preferable that it is 1-20 weight% in solid content of an insulating composition, and it is more preferable that it is 2-15 weight%. As the E component, only one kind of compound may be used, or a plurality thereof may be used in combination.
本発明の絶縁性組成物には、溶剤（Ｆ）を含有させることができる。Ｆ成分としては公知の化合物を利用でき、例えばエステル系溶剤（ブチルアセテート、シクロヘキシルアセテート等）、ケトン系溶剤（メチルイソブチルケトン、シクロヘキサノン等）、エーテル系溶剤（ジエチレングリコールジメチルエーテル、ジエチレングリコールエチルメチルエーテル等）、アルコール系溶剤（３−メトキシブタノール、エチレングリコールモノ−ｔ−ブチルエーテル等）、芳香族系溶剤（トルエン、キシレン等）、脂肪族系溶剤、アミン系溶剤、アミド系溶剤等を特に制限なく使用することができる。安全性の点からはプロピレングリコール骨格を有するエステル系やエーテル系の溶剤、例えばプロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノブチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールジアセテート等が好ましく用いられる。また、類似の構造の３−メトキシブチルアセテート、３−メトキシ−３−メチルブチルアセテート、１，３−ブチレングリコールジアセテート等も好ましい。絶縁性組成物の固形分濃度については特に制限はないが、タッチパネル用絶縁性組成物としては固形分濃度が１０〜３０重量％の範囲に調整されることが一般的である。また、絶縁性組成物の塗布性を高めるため、常圧における沸点が１５０℃未満の溶剤３０〜９０重量％及び常圧における沸点が１５０℃以上の溶剤１０〜７０重量％を併用して、絶縁性組成物の乾燥性を制御することが好ましい。 The insulating composition of the present invention can contain a solvent (F). Known compounds can be used as the F component, for example, ester solvents (butyl acetate, cyclohexyl acetate, etc.), ketone solvents (methyl isobutyl ketone, cyclohexanone, etc.), ether solvents (diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, etc.), Use alcohol solvents (3-methoxybutanol, ethylene glycol mono-t-butyl ether, etc.), aromatic solvents (toluene, xylene, etc.), aliphatic solvents, amine solvents, amide solvents without particular limitation. Can do. From the viewpoint of safety, ester or ether solvents having a propylene glycol skeleton, such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether, propylene glycol monomethyl. Ether acetate, propylene glycol monoethyl ether acetate, propylene glycol diacetate and the like are preferably used. Further, 3-methoxybutyl acetate, 3-methoxy-3-methylbutyl acetate, 1,3-butylene glycol diacetate and the like having a similar structure are also preferable. Although there is no restriction | limiting in particular about the solid content density | concentration of an insulating composition, As a touch panel insulating composition, it is common that solid content density | concentration is adjusted in the range of 10-30 weight%. Further, in order to improve the coating property of the insulating composition, 30 to 90% by weight of a solvent having a boiling point of less than 150 ° C. at normal pressure and 10 to 70% by weight of a solvent having a boiling point of 150 ° C. or more at normal pressure are used in combination. It is preferable to control the drying property of the composition.
本発明の絶縁性組成物は、必要に応じてその他の任意の成分を含んだものであってもよく、例えばフィラー、樹脂、添加剤等を含有させることができる。ここで、フィラーとしてはシリカ、タルク等を、樹脂としてはビニル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリウレタン樹脂、ポリエーテル樹脂、メラミン樹脂等を、添加剤としては架橋剤、界面活性剤、粘度調整剤、湿潤剤、消泡剤、酸化防止剤、紫外線吸収剤等を挙げることができる。これら任意の成分としては公知の化合物を特に制限なく使用することができる。タッチパネル用絶縁性組成物としては特に界面活性剤（フッ素系界面活性剤、シリコーン系界面活性剤等）を使用することが有利であり、その場合の含有量は絶縁性組成物の固形分中０．０１〜３重量％であることが好ましい。また、（好ましくは２つ以上の）スルファニル基を有する化合物も、フォトリソグラフィーの性能を向上させる効果があることから有用である。 The insulating composition of the present invention may contain other optional components as necessary, and can contain, for example, a filler, a resin, an additive and the like. Here, silica, talc, etc. are used as fillers, vinyl resin, polyester resin, polyamide resin, polyimide resin, polyurethane resin, polyether resin, melamine resin, etc. are used as resins, and crosslinking agents, surfactants, Viscosity modifiers, wetting agents, antifoaming agents, antioxidants, ultraviolet absorbers and the like can be mentioned. As these optional components, known compounds can be used without particular limitation. As the insulating composition for the touch panel, it is particularly advantageous to use a surfactant (fluorine-based surfactant, silicone-based surfactant, etc.), and the content in that case is 0 in the solid content of the insulating composition. It is preferable that it is 0.01 to 3 weight%. A compound having a sulfanyl group (preferably two or more) is also useful because it has an effect of improving the performance of photolithography.
本発明の絶縁性組成物の製法は特に制限されるものではないが、共重合体（Ａ）、シランカップリング剤（Ｂ）及びその他の必要な成分を、溶剤（Ｆ）に配合し、均一に溶解又は分散させて絶縁性組成物を作製する方法が例示できる。 Although the manufacturing method of the insulating composition of the present invention is not particularly limited, the copolymer (A), the silane coupling agent (B) and other necessary components are blended in the solvent (F), and uniform. Examples thereof include a method of preparing an insulating composition by dissolving or dispersing in an aqueous solution.
本発明の絶縁性組成物は、基板等に塗布し、光照射、加熱焼成等で硬化させることによって硬化膜を得ることができる。絶縁性組成物を塗布する方法としては公知の方法が利用でき、例えばスピンコーター、バーコーター、スリットコーター等による塗布を挙げることができる。また、塗布後はホットプレートや減圧乾燥機等を用いて、絶縁性組成物の乾燥を行うことが好ましい。ただし、塗布及び乾燥の方法は特に制限されない。 The insulating composition of the present invention can be applied to a substrate or the like and cured by light irradiation, heat baking, or the like to obtain a cured film. As a method of applying the insulating composition, a known method can be used, and examples thereof include a spin coater, a bar coater, a slit coater and the like. Moreover, after application | coating, it is preferable to dry an insulating composition using a hotplate, a vacuum dryer, etc. FIG. However, the application and drying methods are not particularly limited.
光照射による硬化の方法も公知の方法が利用でき、例えばキセノンランプ、ハロゲンランプ、タングステンランプ、超高圧水銀灯、高圧水銀灯、中圧水銀灯、低圧水銀灯等を光源とする紫外光照射を挙げることができる。かかる光照射を行う際、フォトマスク等を用いて画像露光を行い、更に現像液で処理することにより基板上に画像を形成することができる。現像液としては、未露光部分を溶解し露光部分を溶解しない現像液であれば特に制限はないが、種々の添加剤を含むアルカリ水溶液であることが好ましい。ここで、現像液のアルカリ成分としては、例えばアルカリ金属の炭酸塩、アルカリ金属の水酸化物、四級アンモニウムの水酸化物等を、添加剤としては、例えば有機溶剤、界面活性剤、消泡剤、防カビ剤等を挙げることができる。現像方法についても公知の方法が利用でき、例えば浸漬現像、スプレー現像、ブラシ現像、超音波現像等を挙げることができる。光照射及び現像の方法も特に制限されるものではない。 A known method can be used for curing by light irradiation, and examples thereof include ultraviolet light irradiation using a xenon lamp, a halogen lamp, a tungsten lamp, an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a medium-pressure mercury lamp, a low-pressure mercury lamp and the like as a light source. . When such light irradiation is performed, an image can be formed on a substrate by performing image exposure using a photomask or the like and further processing with a developer. The developer is not particularly limited as long as it is a developer that dissolves an unexposed part and does not dissolve an exposed part, but is preferably an alkaline aqueous solution containing various additives. Here, examples of the alkali component of the developer include alkali metal carbonates, alkali metal hydroxides, and quaternary ammonium hydroxides. Examples of additives include organic solvents, surfactants, and antifoaming agents. Agents, fungicides and the like. As a developing method, a known method can be used, and examples thereof include immersion development, spray development, brush development, and ultrasonic development. The method of light irradiation and development is not particularly limited.
更に、硬化膜の強度を高めるため、光照射後に加熱焼成を行うことが好ましい。加熱焼成の方法も公知の方法が利用でき、例えばホットプレート、熱風オーブン等による処理を挙げることができるが、特に制限されない。 Furthermore, in order to increase the strength of the cured film, it is preferable to carry out heat baking after light irradiation. A known method can be used as the method for heating and baking, and examples thereof include a hot plate and a hot air oven, but are not particularly limited.
絶縁性組成物の硬化条件については特に制限されないが、光硬化については１０〜１０００ｍＪ／ｃｍ2の紫外光照射、熱硬化については２００〜２５０℃で２０〜６０分の加熱焼成を行うことが好ましい。 Although it does not restrict | limit in particular about the curing conditions of an insulating composition, About 10-1000 mJ / cm < 2 > ultraviolet light irradiation is used about photocuring, It is preferable to heat-fire for 20 to 60 minutes at 200-250 degreeC about thermosetting. .
なお、本発明の絶縁性組成物の硬化膜を使用してタッチパネルを作製する方法としては、公知の方法が利用できる。 In addition, a well-known method can be utilized as a method of producing a touch panel using the cured film of the insulating composition of the present invention.
本発明のタッチパネル用絶縁性組成物は、透明性、耐光性、耐薬品性及び密着性に優れる硬化膜を形成できることから、極めて有用である。更に、フォトリソグラフィーによる画像形成が可能となり、タッチパネルの生産性に優れる点でも好ましい。 The insulating composition for a touch panel of the present invention is extremely useful because it can form a cured film excellent in transparency, light resistance, chemical resistance and adhesion. Furthermore, image formation by photolithography is possible, which is preferable in terms of excellent touch panel productivity.
以下、実施例により本発明を更に詳細に説明するが、本発明はこれらに限定されない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these.
［実施例１］
（絶縁性組成物の作製）
表１に示す組成によって配合を行い、室温で３時間攪拌混合して固形分成分を溶剤に溶解又は分散させ、絶縁性組成物を作製した。組成の数値は重量部であり、固形分の合計が１００重量部となるように記載されている。固形分成分の中にははじめから溶剤（プロピレングリコールモノメチルエーテルアセテート）に溶解した状態で合成されたものもあるが、その場合は組成の数値には固形分としての重量部を示し、持ち込まれる溶剤分は溶剤の重量部に含めて記した。実施例の配合に使用した成分を以下に示す。なお、これらの合成例における樹脂の評価は、断りのない限り以下の通りに行った。
[Example 1]
(Preparation of insulating composition)
Mixing was performed according to the composition shown in Table 1, and the mixture was stirred and mixed at room temperature for 3 hours to dissolve or disperse the solid component in a solvent to prepare an insulating composition. The numerical value of a composition is a weight part, and is described so that the total of solid content may be 100 weight part. Some solid components were synthesized from the beginning in a solvent (propylene glycol monomethyl ether acetate), but in that case, the numerical value of the composition indicates the weight part as solid content, and the solvent to be brought in Minutes are included in the weight parts of the solvent. The components used in the formulation of the examples are shown below. In addition, unless otherwise indicated, evaluation of resin in these synthesis examples was performed as follows.
［分子量］
ゲルパーミュエーションクロマトグラフィー（GPC）（東ソー(株)製HLC-8220GPC、溶媒：テトラヒドロフラン、カラム：TSKgelSuperH-2000（２本）＋TSKgelSuperH-3000（１本）＋TSKgelSuperH-4000（１本）＋TSKgelSuper-H5000（１本）（東ソー(株)製）、温度：40℃、速度：0.6ml/min）にて測定し、標準ポリスチレン（東ソー(株)製ＰＳ−オリゴマーキット）換算値として数平均分子量(Mn)を求めた値である。
[Molecular weight]
Gel permeation chromatography (GPC) (HLC-8220GPC manufactured by Tosoh Corporation, solvent: tetrahydrofuran, column: TSKgelSuperH-2000 (2) + TSKgelSuperH-3000 (1) + TSKgelSuperH-4000 (1) + TSKgelSuper-H5000 ( 1) (manufactured by Tosoh Corporation), temperature: 40 ° C., speed: 0.6 ml / min), and number average molecular weight (Mn) as standard polystyrene (PS-oligomer kit made by Tosoh Corporation) conversion value Is the value obtained.
［酸価］
樹脂溶液をジオキサンに溶解させ、電位差滴定装置（平沼産業 (株)製COM-1600）を用いて1/10N−KOH水溶液で滴定して、固形分１ｇあたりに必要となったＫＯＨの量を酸価とした。
[Acid value]
The resin solution is dissolved in dioxane, and titrated with a 1 / 10N-KOH aqueous solution using a potentiometric titrator (COM-1600 manufactured by Hiranuma Sangyo Co., Ltd.). The amount of KOH required per gram of solid content is determined by acid. It was set as the value.
Ａ−１：メタクリル酸に由来するユニット｛１４｝−メタクリル酸メチルに由来するユニット｛３０｝−メタクリル酸シクロヘキシルに由来するユニット｛２０｝−一般式（１）で表され、Ｒ1、Ｒ2がともにメチル基であるユニット｛３６｝で構成される共重合体（数平均分子量１万、酸価５０ｍｇＫＯＨ／ｇ）
（波カッコ｛ ｝内はモル比を示し、以下も同様である。）
Ａ−２：メタクリル酸に由来するユニット｛３０｝−メタクリル酸メチルに由来するユニット｛２２｝−メタクリル酸シクロヘキシルに由来するユニット｛２８｝−一般式（１）で表され、Ｒ1、Ｒ2がともにメチル基であるユニット｛２０｝で構成される共重合体（数平均分子量１万５千、酸価１２０ｍｇＫＯＨ／ｇ）
Ａ−３：メタクリル酸に由来するユニット｛１０｝−メタクリル酸メチルに由来するユニット｛４０｝−アクリル酸ジシクロペンタニルに由来するユニット｛１０｝−一般式（１）で表され、Ｒ1、Ｒ2がともにメチル基であるユニット｛４０｝で構成される共重合体（数平均分子量５千、酸価３５ｍｇＫＯＨ／ｇ）
A-1: units derived from methacrylic acid {14} units derived from methyl methacrylate {30} units derived from cyclohexyl methacrylate {20} —represented by general formula (1), R 1 , R 2 A copolymer composed of units {36} in which both are methyl groups (number average molecular weight 10,000, acid value 50 mgKOH / g)
(In curly braces {} indicate molar ratios, and so on.)
A-2: Unit derived from methacrylic acid {30}-Unit derived from methyl methacrylate {22}-Unit derived from cyclohexyl methacrylate {28}-represented by general formula (1), R 1 , R 2 A copolymer composed of units {20} in which both are methyl groups (number average molecular weight 15,000, acid value 120 mgKOH / g)
A-3: units derived from methacrylic acid {10} units derived from methyl methacrylate {40} units derived from dicyclopentanyl acrylate {10} —represented by general formula (1), R 1 , A copolymer composed of units {40} in which both R 2 are methyl groups (number average molecular weight 5,000, acid value 35 mgKOH / g)
Ｂ−１：３−アミノプロピルトリエトキシシラン
Ｂ−２：３−（フェニルアミノ）プロピルトリメトキシシラン
Ｂ−３：３−［（２−アミノエチル）アミノ］プロピルトリメトキシシラン
ここで、「Ａ−」「Ｂ−」は、それぞれ本発明のＡ、Ｂ成分に該当することを示す。
B-1: 3-Aminopropyltriethoxysilane B-2: 3- (Phenylamino) propyltrimethoxysilane B-3: 3-[(2-aminoethyl) amino] propyltrimethoxysilane where “A- "B-" indicates that it corresponds to the A and B components of the present invention, respectively.
Ｃ−１：ペンタエリスリトールテトラアクリレート
Ｃ−２：ジペンタエリスリトールヘキサアクリレート
Ｄ−１：１−［４−（フェニルスルファニル）フェニル］オクタン−１，２−ジオン＝２−Ｏ−ベンゾイルオキシム
Ｄ−２：１−［９−エチル−６−（２−メチルベンゾイル）カルバゾール−３−イル］エタノン＝Ｏ−アセチルオキシム
Ｅ−１：フェノールノボラック型エポキシ化合物（三菱化学社製「ｊＥＲ１５４」）
Ｅ−２：２，２−ビス（ヒドロキシメチル）−１−ブタノールの１，２−エポキシ−４−（２−オキシラニル）シクロヘキサン付加物（ダイセル社製「ＥＨＰＥ３１５０」）
Ｆ−１：プロピレングリコールモノメチルエーテルアセテート
Ｆ−２：ジエチレングリコールエチルメチルエーテル
ここで「Ｃ−」「Ｄ−」「Ｅ−」「Ｆ−」は、それぞれ本発明のＣ〜Ｆ成分に該当することを示す。
C-1: Pentaerythritol tetraacrylate C-2: Dipentaerythritol hexaacrylate D-1: 1- [4- (phenylsulfanyl) phenyl] octane-1,2-dione = 2-O-benzoyloxime D-2: 1- [9-Ethyl-6- (2-methylbenzoyl) carbazol-3-yl] ethanone = O-acetyloxime E-1: Phenol novolac type epoxy compound (“jER154” manufactured by Mitsubishi Chemical Corporation)
E-2: 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol (“EHPE3150” manufactured by Daicel)
F-1: Propylene glycol monomethyl ether acetate F-2: Diethylene glycol ethyl methyl ether Here, “C-”, “D-”, “E-”, and “F-” correspond to the C to F components of the present invention, respectively. Show.
Ｓ−１：シリコーン系界面活性剤（ビックケミー・ジャパン社製「ＢＹＫ−３０２」）
Ｓ−２：フッ素系界面活性剤（ＤＩＣ社製「メガファックＦ−５５６」）
ここで「Ｓ−」は、必要に応じて用いられるその他の任意の成分を示す。
S-1: Silicone-based surfactant ("BYK-302" manufactured by Big Chemie Japan)
S-2: Fluorosurfactant (“Megafac F-556” manufactured by DIC)
Here, “S-” represents other optional components used as necessary.
（絶縁性組成物の評価：透明性）
上記絶縁性組成物を無アルカリガラス基板にスピンコーターを用いて塗布し、９０℃のホットプレートで２分間乾燥させて試験片を作製した。基板はあらかじめ低圧水銀灯で塗布面の光洗浄を行ったものを使用し、また塗布条件としては膜厚１．５μｍの硬化膜が得られるようにスピン回転数を調節した。次に、線幅１〜２５０μｍのライン＆スペース形状のテストパターンを有するフォトマスクを介して、照度３０ｍＷ／ｃｍ2の超高圧水銀灯で１００ｍＪ／ｃｍ2の紫外線（数値はｉ線基準）を照射して試験片に画像露光を行った。その後、試験片を２３℃の水酸化カリウム系アルカリ現像液（新日鉄住金化学社製「ＮＳＩＤ」の１００倍希釈液）で１分間処理し、更に水洗を行って画像を現像した。最後に試験片を２３０℃の熱風オーブンで３０分間焼成し、絶縁性組成物の硬化膜を得た。
Ｃ光源、２度視野における硬化膜の明度Ｙを分光光度計で測定し、次の基準により３段階評価を行った。
○（良好）：９９％以上、▲（やや不良）：９８％以上９９％未満、×（不良）：９８％未満。
(Evaluation of insulating composition: transparency)
The insulating composition was applied to an alkali-free glass substrate using a spin coater and dried on a hot plate at 90 ° C. for 2 minutes to prepare a test piece. The substrate used was that in which the coated surface was previously washed with a low-pressure mercury lamp, and the spin speed was adjusted so that a cured film having a film thickness of 1.5 μm was obtained as a coating condition. Next, 100 mJ / cm 2 of ultraviolet light (numerical value is based on i-line) is irradiated with an ultrahigh pressure mercury lamp with an illuminance of 30 mW / cm 2 through a photomask having a line & space test pattern with a line width of 1 to 250 μm. The test piece was subjected to image exposure. Thereafter, the test piece was treated for 1 minute with a 23 ° C. potassium hydroxide alkali developer (“NSID” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) for 1 minute, and further washed with water to develop the image. Finally, the test piece was baked in a hot air oven at 230 ° C. for 30 minutes to obtain a cured film of the insulating composition.
The lightness Y of the cured film in a C light source and a 2-degree visual field was measured with a spectrophotometer, and three-stage evaluation was performed according to the following criteria.
○ (good): 99% or more, ▲ (somewhat poor): 98% or more and less than 99%, × (defective): less than 98%.
（絶縁性組成物の評価：耐光性）
上記透明性評価と同様にして絶縁性組成物の硬化膜が形成された試験片を作製した。試験片をガラス面から２．５ｋＷのキセノンランプで５００時間照射した後、Ｃ光源、２度視野における硬化膜の明度Ｙを分光光度計で測定し、次の基準により３段階評価を行った。
○：９９％以上、▲：９８％以上９９％未満、×：９８％未満。
(Evaluation of insulating composition: light resistance)
A test piece on which a cured film of the insulating composition was formed was produced in the same manner as in the transparency evaluation. After irradiating the test piece with a 2.5 kW xenon lamp for 500 hours from the glass surface, the brightness Y of the cured film in a C light source and a two-degree field of view was measured with a spectrophotometer, and three-stage evaluation was performed according to the following criteria.
○: 99% or more, ▲: 98% or more and less than 99%, ×: less than 98%.
（絶縁性組成物の評価：耐薬品性）
上記透明性評価と同様にして絶縁性組成物の硬化膜が形成された試験片を作製した。試験片をエッチングレジストの剥離液（２−アミノエタノール３０％及びジエチレングリコールモノブチルエーテル７０％の混合液）に６０℃で１０分間浸漬させ、水洗、乾燥を行った後、硬化膜の膜厚を測定し、次の基準により３段階評価を行った。
○：剥離液浸漬前後の膜厚変化が２％以下、▲：２％を超え５％以下、×：５％を超える。
(Evaluation of insulating composition: chemical resistance)
A test piece on which a cured film of the insulating composition was formed was produced in the same manner as in the transparency evaluation. The test piece was immersed in an etching resist stripping solution (mixed solution of 2-aminoethanol 30% and diethylene glycol monobutyl ether 70%) at 60 ° C. for 10 minutes, washed with water, dried, and then the thickness of the cured film was measured. A three-stage evaluation was performed according to the following criteria.
○: Change in film thickness before and after immersion in stripping solution is 2% or less, ▲: more than 2% and 5% or less, ×: more than 5%.
（絶縁性組成物の評価：密着性）
上記透明性評価と同様にして絶縁性組成物の硬化膜が形成された試験片を作製した。ただし、基板としてはＩＴＯ膜又はＭＡＭ膜がそれぞれ蒸着された無アルカリガラス基板を用い、蒸着膜上に硬化膜を形成した。環境試験機を用いて試験片を１２１℃で湿度１００％の環境下に５時間保持した後、硬化膜に対してクロスカット−テープ剥離試験を行い、次の基準により３段階評価を行った。
○：剥離がない、▲：わずかに剥離が見られる、×：多数の剥離が見られる。
(Evaluation of insulating composition: adhesion)
A test piece on which a cured film of the insulating composition was formed was produced in the same manner as in the transparency evaluation. However, as the substrate, an alkali-free glass substrate on which an ITO film or a MAM film was deposited was used, and a cured film was formed on the deposited film. After holding the test piece in an environment of 100% humidity at 121 ° C. for 5 hours using an environmental testing machine, a cross cut-tape peeling test was performed on the cured film, and a three-stage evaluation was performed according to the following criteria.
○: No peeling, ▲: Slight peeling is observed, ×: Numerous peeling is observed.
（絶縁性組成物の評価：加工性）
上記透明性評価と同様にして絶縁性組成物の硬化膜が形成された試験片を作製した。形成された画像を光学顕微鏡で観察し、次の基準により３段階評価を行った。
○：画像パターンの欠けや現像残りが見られない、▲：わずかに欠けや現像残りが見られる、×：欠けや現像残りが見られる。
(Evaluation of insulating composition: workability)
A test piece on which a cured film of the insulating composition was formed was produced in the same manner as in the transparency evaluation. The formed image was observed with an optical microscope, and three-stage evaluation was performed according to the following criteria.
◯: No image pattern chipping or undeveloped residue is observed, ▲: Slightly chipped or undeveloped residue is observed, ×: Missing or undeveloped residue is observed.
実施例１の絶縁性組成物の評価結果を表２に示す。実施例１の絶縁性組成物はタッチパネル用途で要求される透明性、耐光性、耐薬品性及び密着性をともに満足しており、更にフォトリソグラフィーの加工性にも優れていた。 The evaluation results of the insulating composition of Example 1 are shown in Table 2. The insulating composition of Example 1 satisfied all the transparency, light resistance, chemical resistance and adhesion required for touch panel applications, and was excellent in photolithography processability.
［実施例２〜８］
実施例１の組成を表１に示すようにそれぞれ変更し、その他は実施例１と同様にして実施例２〜８の絶縁性組成物の作製及び評価を行った。評価結果を表２に示す。実施例２〜８の絶縁性組成物はタッチパネル用途で要求される透明性、耐光性、耐薬品性及び密着性をともに満足しており、更にフォトリソグラフィーの加工性にも優れていた。
[Examples 2 to 8]
The composition of Example 1 was changed as shown in Table 1, and the others were produced and evaluated in the same manner as Example 1 except for the insulating compositions of Examples 2-8. The evaluation results are shown in Table 2. The insulating compositions of Examples 2 to 8 satisfied both transparency, light resistance, chemical resistance and adhesion required for touch panel applications, and were excellent in photolithography processability.
［比較例１〜６］
実施例１の組成を表３に示すようにそれぞれ変更し、その他は実施例１と同様にして比較例１〜６の絶縁性組成物の作製及び評価を行った。比較例の配合に使用した成分を以下に示す。
[Comparative Examples 1-6]
The composition of Example 1 was changed as shown in Table 3, and the others were produced and evaluated in the same manner as Example 1 except for the insulating compositions of Comparative Examples 1-6. The components used for the formulation of the comparative example are shown below.
ＡＸ−１：メタクリル酸に由来するユニット｛１６｝−メタクリル酸メチルに由来するユニット｛１６｝−メタクリル酸ベンジルに由来するユニット｛６８｝で構成される共重合体（数平均分子量１万、酸価６０ｍｇＫＯＨ／ｇ）
ＡＸ−２：メタクリル酸に由来するユニット｛１８｝−メタクリル酸メチルに由来するユニット｛５０｝−メタクリル酸シクロヘキシルに由来するユニット｛２０｝−一般式（１）で表され、Ｒ1、Ｒ2がともにメチル基であるユニット｛１２｝で構成される共重合体（数平均分子量１万、酸価８０ｍｇＫＯＨ／ｇ）
ＡＸ−３：ビスフェノールフルオレン骨格を有するアルカリ現像型感光性樹脂（新日鉄住金化学社製「Ｖ−２５９ＭＥ」の固形分）
ＢＸ−１：３−（グリリジルオキシ）プロピルトリメトキシシラン
ＢＸ−２：３−（アクリロイルオキシ）プロピルトリメトキシシラン
ＢＸ−３：３−スルファニルプロピルトリメトキシシラン
ここで、「ＡＸ−」「ＢＸ−」はそれぞれ本発明のＡ、Ｂ成分の範囲を外れることを示す。
AX-1: Unit derived from methacrylic acid {16}-Unit derived from methyl methacrylate {16}-Copolymer composed of unit {68} derived from benzyl methacrylate (number average molecular weight 10,000, acid Value 60mgKOH / g)
AX-2: units derived from methacrylic acid {18} units derived from methyl methacrylate {50} units derived from cyclohexyl methacrylate {20} —represented by general formula (1), R 1 , R 2 A copolymer composed of units {12} in which both are methyl groups (number average molecular weight 10,000, acid value 80 mgKOH / g)
AX-3: Alkali developing photosensitive resin having a bisphenolfluorene skeleton (solid content of “V-259ME” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
BX-1: 3- (Glyridyloxy) propyltrimethoxysilane BX-2: 3- (acryloyloxy) propyltrimethoxysilane BX-3: 3-sulfanylpropyltrimethoxysilane where “AX-” “BX-” "" Indicates that they are out of the range of components A and B of the present invention.
比較例１〜６の絶縁性組成物の評価結果を表４に示す。比較例１〜６の絶縁性組成物は、タッチパネル用途で要求される諸特性を満足することができなかった。 Table 4 shows the evaluation results of the insulating compositions of Comparative Examples 1 to 6. The insulating compositions of Comparative Examples 1 to 6 could not satisfy various properties required for touch panel applications.
本発明の絶縁性組成物は、タッチパネルの絶縁層の形成に適するだけでなく、カラーフィルターの保護膜やスペーサー材料、あるいは回路基板のソルダーレジスト膜の形成にも好ましく使用できる。また、塗料やインキのトップコート、プラスチック類のハードコート、金属類の防錆膜、電子デバイスの絶縁膜、ＭＥＭＳデバイス、光学材料等にも応用できることから極めて有用である。 The insulating composition of the present invention is not only suitable for forming an insulating layer of a touch panel, but can also be preferably used for forming a protective film for a color filter, a spacer material, or a solder resist film for a circuit board. Further, it is extremely useful because it can be applied to top coats of paints and inks, hard coats of plastics, rust preventive films of metals, insulating films of electronic devices, MEMS devices, optical materials and the like.
Claims (3)
（Ｂ）アミノ基を有するシランカップリング剤
を含有することを特徴とするタッチパネル用絶縁性組成物。
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