JP2015090898A - 分割装置 - Google Patents
分割装置 Download PDFInfo
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- JP2015090898A JP2015090898A JP2013229618A JP2013229618A JP2015090898A JP 2015090898 A JP2015090898 A JP 2015090898A JP 2013229618 A JP2013229618 A JP 2013229618A JP 2013229618 A JP2013229618 A JP 2013229618A JP 2015090898 A JP2015090898 A JP 2015090898A
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- 239000000758 substrate Substances 0.000 claims abstract description 114
- 239000000463 material Substances 0.000 claims abstract description 105
- 238000011144 upstream manufacturing Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 6
- 230000009191 jumping Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000011143 downstream manufacturing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
2 吸引チャンバー
2a 開口
2A 吸引装置
2B ポーラスフィルム
3 移動台
3a ガイド部材
3A 分割部材
4 プッシャー
4D 押さえ部材
Claims (1)
- 所定のサイズの電子基板に分割するための割溝が形成された基板材料を該割溝に沿って分割する装置であって、上面に開口が形成された吸引チャンバーと、この吸引チャンバー内に3次元移動可能に載置された移動台と、この移動台上で割溝と平行に複数設けたガイド部材と、前記移動台上の中央位置で複数の前記ガイド部材の間に設けた分割部材と、これらガイド部材と分割部材上に設けられると共に前記吸引チャンバーの前記開口を塞ぐように設けたポーラスフィルムと、前記吸引チャンバーの上方に設けられたプッシャーと、このプッシャーの下方押圧面に設けられた押さえ部材と、を備えたことを特徴とする分割装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013229618A JP6174459B2 (ja) | 2013-11-05 | 2013-11-05 | 分割装置 |
Applications Claiming Priority (1)
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JP2013229618A JP6174459B2 (ja) | 2013-11-05 | 2013-11-05 | 分割装置 |
Publications (2)
Publication Number | Publication Date |
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JP2015090898A true JP2015090898A (ja) | 2015-05-11 |
JP6174459B2 JP6174459B2 (ja) | 2017-08-02 |
Family
ID=53194292
Family Applications (1)
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JP2013229618A Active JP6174459B2 (ja) | 2013-11-05 | 2013-11-05 | 分割装置 |
Country Status (1)
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JP (1) | JP6174459B2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4919630B1 (ja) * | 1970-01-23 | 1974-05-18 | ||
JPH07254577A (ja) * | 1994-03-16 | 1995-10-03 | Hitachi Ltd | 半導体ウエハのブレーキング方法および装置 |
WO2005123356A1 (en) * | 2004-06-16 | 2005-12-29 | Essel-Tech Co., Ltd. | Pressing roller apparatus for brittle material cleaving machine |
JP2012056229A (ja) * | 2010-09-10 | 2012-03-22 | Mitsuboshi Diamond Industrial Co Ltd | レーザ割断装置 |
WO2013073477A1 (ja) * | 2011-11-16 | 2013-05-23 | 日本電気硝子株式会社 | 板ガラス割断装置、板ガラス割断方法、板ガラス作製方法、および、板ガラス割断システム |
-
2013
- 2013-11-05 JP JP2013229618A patent/JP6174459B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4919630B1 (ja) * | 1970-01-23 | 1974-05-18 | ||
JPH07254577A (ja) * | 1994-03-16 | 1995-10-03 | Hitachi Ltd | 半導体ウエハのブレーキング方法および装置 |
WO2005123356A1 (en) * | 2004-06-16 | 2005-12-29 | Essel-Tech Co., Ltd. | Pressing roller apparatus for brittle material cleaving machine |
JP2012056229A (ja) * | 2010-09-10 | 2012-03-22 | Mitsuboshi Diamond Industrial Co Ltd | レーザ割断装置 |
WO2013073477A1 (ja) * | 2011-11-16 | 2013-05-23 | 日本電気硝子株式会社 | 板ガラス割断装置、板ガラス割断方法、板ガラス作製方法、および、板ガラス割断システム |
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JP6174459B2 (ja) | 2017-08-02 |
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