JP2015059204A - Acrylic tacky adhesive agent for portable electronic appliance, and double-sided tacky-adhesive tape for portable electronic appliance - Google Patents
Acrylic tacky adhesive agent for portable electronic appliance, and double-sided tacky-adhesive tape for portable electronic appliance Download PDFInfo
- Publication number
- JP2015059204A JP2015059204A JP2013195571A JP2013195571A JP2015059204A JP 2015059204 A JP2015059204 A JP 2015059204A JP 2013195571 A JP2013195571 A JP 2013195571A JP 2013195571 A JP2013195571 A JP 2013195571A JP 2015059204 A JP2015059204 A JP 2015059204A
- Authority
- JP
- Japan
- Prior art keywords
- portable electronic
- sensitive adhesive
- weight
- double
- acrylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 19
- 239000000853 adhesive Substances 0.000 title abstract description 24
- 239000006260 foam Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 229920000098 polyolefin Polymers 0.000 claims abstract description 28
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 15
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims abstract description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 79
- 239000010410 layer Substances 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 239000003522 acrylic cement Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000004873 anchoring Methods 0.000 abstract description 6
- 238000012360 testing method Methods 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 239000004417 polycarbonate Substances 0.000 description 13
- 239000003431 cross linking reagent Substances 0.000 description 12
- 238000004132 cross linking Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000004712 Metallocene polyethylene (PE-MC) Substances 0.000 description 7
- -1 azo compound Chemical class 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920013716 polyethylene resin Polymers 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- 235000007586 terpenes Nutrition 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 1
- NFWPZNNZUCPLAX-UHFFFAOYSA-N 4-methoxy-3-methylaniline Chemical compound COC1=CC=C(N)C=C1C NFWPZNNZUCPLAX-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011980 kaminsky catalyst Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
本発明は、被着体への粘着力が高く、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合には基材へのアンカー性にも優れ、その結果、優れた耐衝撃性を発揮できる携帯電子機器用アクリル粘着剤に関する。また、本発明は、該携帯電子機器用アクリル粘着剤からなる粘着剤層を有する携帯電子機器用両面粘着テープに関する。 The present invention has a high adhesive force to the adherend, and when used in a double-sided pressure-sensitive adhesive tape having a polyolefin foam or the like as a base material, the anchor property to the base material is excellent, and as a result, excellent impact resistance. The present invention relates to an acrylic pressure-sensitive adhesive for portable electronic devices capable of exhibiting Moreover, this invention relates to the double-sided adhesive tape for portable electronic devices which has an adhesive layer which consists of this acrylic adhesive for portable electronic devices.
携帯電話、携帯情報端末（Ｐｅｒｓｏｎａｌ Ｄｉｇｉｔａｌ Ａｓｓｉｓｔａｎｔｓ、ＰＤＡ）等の携帯電子機器は、使用者の手元から足元に落下することを考慮して衝撃が加わっても部品が外れたり破損したりしないよう部品の固定配置又は機器本体のデザインが検討されている。従って、部品を機器本体に固定するために用いられる両面粘着テープとしても、衝撃が加わった場合であっても部品が外れることがなく、かつ、部品に強い衝撃が加わらない両面粘着テープが望まれている。 Mobile electronic devices such as mobile phones and personal digital assistants (PDAs) are designed so that they do not come off or break even if an impact is applied in consideration of falling from the user's hand to the foot. Fixed arrangements or device body designs are being considered. Therefore, a double-sided pressure-sensitive adhesive tape that is used for fixing the component to the main body of the device is desired to prevent the component from coming off even when an impact is applied, and not to apply a strong shock to the component. ing.
携帯電子機器を構成する部品を機器本体に固定する衝撃吸収テープとして、例えば、ポリオレフィン発泡体等の緩衝性のある基材を用いた両面粘着テープが挙げられる。例えば、特許文献１及び２には、基材層の少なくとも片面にアクリル系粘着剤層が積層一体化されており、基材層が、特定の架橋度及び気泡のアスペクト比を有する架橋ポリオレフィン系樹脂発泡シートである衝撃吸収テープが記載されている。
Examples of the shock absorbing tape that fixes the parts constituting the portable electronic device to the device main body include a double-sided pressure-sensitive adhesive tape using a buffering base material such as a polyolefin foam. For example, in
しかしながら、近年、携帯電子機器をより一層薄く軽くするデザインが求められており、携帯電子機器が落下すると、これまで以上の非常に強い衝撃が加わるようになっている。また、携帯電子機器が落下する環境によっても強い衝撃が加わることがある。このため、このような強い衝撃が加わった場合に機器本体から部品が剥離してしまうという問題が生じていた。 However, in recent years, there has been a demand for a design that makes the portable electronic device thinner and lighter, and when the portable electronic device falls, a much stronger impact than ever is applied. Also, a strong impact may be applied depending on the environment in which the portable electronic device falls. For this reason, when such a strong impact was applied, the problem that components will peel from an apparatus main body has arisen.
本発明は、被着体への粘着力が高く、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合には基材へのアンカー性にも優れ、その結果、優れた耐衝撃性を発揮できる携帯電子機器用アクリル粘着剤を提供することを目的とする。また、本発明は、該携帯電子機器用アクリル粘着剤からなる粘着剤層を有する携帯電子機器用両面粘着テープを提供することを目的とする。 The present invention has a high adhesive force to the adherend, and when used in a double-sided pressure-sensitive adhesive tape having a polyolefin foam or the like as a base material, the anchor property to the base material is excellent, and as a result, excellent impact resistance. An object of the present invention is to provide an acrylic pressure-sensitive adhesive for portable electronic devices that can exhibit the above. Moreover, this invention aims at providing the double-sided adhesive tape for portable electronic devices which has an adhesive layer which consists of this acrylic adhesive for portable electronic devices.
本発明は、ブチルアクリレート４０〜８０重量部と２−エチルヘキシルアクリレート１０〜６０重量部とを含むモノマー混合物を共重合して得られた重量平均分子量が４０万〜１００万のアクリル共重合体１００重量部と、粘着付与樹脂３０〜５０重量部とを含有する携帯電子機器用アクリル粘着剤である。
以下に本発明を詳述する。
The present invention relates to an acrylic copolymer having a weight average molecular weight of 400,000 to 1,000,000 obtained by copolymerizing a monomer mixture containing 40 to 80 parts by weight of butyl acrylate and 10 to 60 parts by weight of 2-ethylhexyl acrylate. Part and an acrylic pressure-sensitive adhesive for portable electronic devices containing 30 to 50 parts by weight of a tackifying resin.
The present invention is described in detail below.
本発明者は、携帯電子機器を構成する部品を機器本体に固定するために用いられる両面粘着テープにおいて、携帯電子機器に強い衝撃が加わった場合に機器本体から部品が剥離してしまう原因が、被着体（例えば、樹脂、鋼（ＳＵＳ）、ガラス等からなるもの）との界面での粘着剤層の剥離と、ポリオレフィン発泡体等の基材との界面での粘着剤層の剥離とにあることを見出した。そして、強い衝撃が加わっても剥がれにくくするため、被着体への粘着力と、ポリオレフィン発泡体等の基材へのアンカー性（密着性）との両方に優れた粘着剤を得ることを検討した。
本発明者は、特定のアクリル共重合体と粘着付与樹脂とを含有する携帯電子機器用アクリル粘着剤は、被着体への粘着力が高く、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合には基材へのアンカー性にも優れ、その結果、優れた耐衝撃性を発揮できることを見出し、本発明を完成させるに至った。
In the double-sided pressure-sensitive adhesive tape used for fixing the component constituting the portable electronic device to the device main body, the present inventor causes the component to peel off from the device main body when a strong impact is applied to the portable electronic device. For peeling of the adhesive layer at the interface with the adherend (for example, made of resin, steel (SUS), glass, etc.) and peeling of the adhesive layer at the interface with the substrate such as polyolefin foam I found out. And in order to make it difficult to peel off even when a strong impact is applied, it is considered to obtain a pressure-sensitive adhesive that is excellent in both adhesion to the adherend and anchoring (adhesion) to the substrate such as polyolefin foam. did.
The present inventor has disclosed that an acrylic pressure-sensitive adhesive for portable electronic equipment containing a specific acrylic copolymer and a tackifying resin has high adhesive strength to an adherend, and is a double-sided pressure-sensitive adhesive tape based on a polyolefin foam or the like. When used in the above, it was found that the anchoring property to the base material was excellent, and as a result, excellent impact resistance could be exhibited, and the present invention was completed.
本発明の携帯電子機器用アクリル粘着剤は、ブチルアクリレート４０〜８０重量部と２−エチルヘキシルアクリレート１０〜６０重量部とを含むモノマー混合物を共重合して得られた重量平均分子量が４０万〜１００万のアクリル共重合体１００重量部と、粘着付与樹脂３０〜５０重量部とを含有する。
このような組成とすることで、携帯電子機器用アクリル粘着剤の被着体への粘着力と、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合の基材へのアンカー性との両方を高めることができる。
The acrylic adhesive for portable electronic devices of the present invention has a weight average molecular weight of 400,000 to 100 obtained by copolymerizing a monomer mixture containing 40 to 80 parts by weight of butyl acrylate and 10 to 60 parts by weight of 2-ethylhexyl acrylate. Contains 100 parts by weight of acryl copolymer and 30-50 parts by weight of tackifying resin.
By setting it as such a composition, the adhesive force to the adherend of the acrylic adhesive for portable electronic devices, and the anchoring property to the substrate when used for a double-sided adhesive tape having a polyolefin foam as a substrate, Both can be enhanced.
上記モノマー混合物は、ブチルアクリレート４０〜８０重量部と２−エチルヘキシルアクリレート１０〜６０重量部とを含んでいる。
ブチルアクリレートの含有量が４０重量部未満であると、携帯電子機器用アクリル粘着剤の粘着力が低くなり、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合に粘着剤層が基材との界面で剥がれやすくなる。ブチルアクリレートの含有量が８０重量部を超えると、接着面に強い衝撃が加わった場合に携帯電子機器用アクリル粘着剤が被着体から剥がれやすくなる。
２−エチルヘキシルアクリレートの含有量が１０重量部未満であると、接着面に強い衝撃が加わった場合に携帯電子機器用アクリル粘着剤が被着体から剥がれやすくなる。２−エチルヘキシルアクリレートの含有量が６０重量部を超えると、携帯電子機器用アクリル粘着剤の粘着力が低くなり、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合に粘着剤層が基材との界面で剥がれやすくなる。
The monomer mixture contains 40 to 80 parts by weight of butyl acrylate and 10 to 60 parts by weight of 2-ethylhexyl acrylate.
When the butyl acrylate content is less than 40 parts by weight, the adhesive strength of the acrylic adhesive for portable electronic devices is low, and the adhesive layer is based on a double-sided adhesive tape based on a polyolefin foam or the like. It becomes easy to peel off at the interface with the material. When the content of butyl acrylate exceeds 80 parts by weight, the acrylic adhesive for portable electronic devices is easily peeled off from the adherend when a strong impact is applied to the adhesive surface.
When the content of 2-ethylhexyl acrylate is less than 10 parts by weight, the acrylic pressure-sensitive adhesive for portable electronic devices is easily peeled off from the adherend when a strong impact is applied to the adhesive surface. When the content of 2-ethylhexyl acrylate exceeds 60 parts by weight, the adhesive strength of the acrylic adhesive for portable electronic devices is lowered, and the adhesive layer is formed when used for a double-sided adhesive tape based on polyolefin foam or the like. It becomes easy to peel off at the interface with the substrate.
上記モノマー混合物は、必要に応じてブチルアクリレート及び２−エチルヘキシルアクリレート以外の共重合可能な他の重合性モノマーを含んでいてもよい。
上記共重合可能な他の重合性モノマーとして、例えば、（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸ｎ−プロピル、（メタ）アクリル酸イソプロピル等のアルキル基の炭素数が１〜３の（メタ）アクリル酸アルキルエステル、メタクリル酸トリデシル、（メタ）アクリル酸ステアリル等のアルキル基の炭素数が１３〜１８の（メタ）アクリル酸アルキルエステル、（メタ）アクリル酸ヒドロキシアルキル、グリセリンジメタクリレート、（メタ）アクリル酸グリシジル、２−メタクリロイルオキシエチルイソシアネート、（メタ）アクリル酸、イタコン酸、無水マレイン酸、クロトン酸、マレイン酸、フマル酸等の官能性モノマーが挙げられる。
The monomer mixture may contain other polymerizable monomers other than butyl acrylate and 2-ethylhexyl acrylate as necessary.
Examples of other polymerizable monomers that can be copolymerized include, for example, carbon number of alkyl groups such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and isopropyl (meth) acrylate. 1 to 3 (meth) acrylic acid alkyl ester, tridecyl methacrylate, and (meth) acrylic acid alkyl ester having 13 to 18 carbon atoms such as stearyl (meth) acrylate, hydroxyalkyl (meth) acrylate , Glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, fumaric acid and the like.
なかでも、上記モノマー混合物は、更に、ブチルアクリレートと２−エチルヘキシルアクリレートとの合計１００重量部に対して２０重量部未満のエチルアクリレート又はメチルアクリレートを含むことが好ましい。２０重量部未満のエチルアクリレート又はメチルアクリレートを添加することで、携帯電子機器用アクリル粘着剤の被着体への粘着力を高め、接着面に強い衝撃が加わった場合に被着体から剥がれにくくすることができる。エチルアクリレート又はメチルアクリレートの含有量の好ましい下限は５重量部、より好ましい上限は１５重量部である。 Especially, it is preferable that the said monomer mixture contains further less than 20 weight part ethyl acrylate or methyl acrylate with respect to a total of 100 weight part of butyl acrylate and 2-ethylhexyl acrylate. By adding less than 20 parts by weight of ethyl acrylate or methyl acrylate, the adhesive strength of the acrylic pressure-sensitive adhesive for portable electronic devices is increased and it is difficult to peel off from the adherend when a strong impact is applied to the adhesive surface. can do. The minimum with preferable content of ethyl acrylate or methyl acrylate is 5 weight part, and a more preferable upper limit is 15 weight part.
上記モノマー混合物を共重合して上記アクリル共重合体を得るには、上記モノマー混合物を、重合開始剤の存在下にてラジカル反応させればよい。上記モノマー混合物をラジカル反応させる方法、即ち、重合方法としては、従来公知の方法が用いられ、例えば、溶液重合（沸点重合又は定温重合）、乳化重合、懸濁重合、塊状重合等が挙げられる。
上記重合開始剤は特に限定されず、例えば、有機過酸化物、アゾ化合物等が挙げられる。上記有機過酸化物として、例えば、１，１−ビス（ｔ−ヘキシルパーオキシ）−３，３，５−トリメチルシクロヘキサン、ｔ−ヘキシルパーオキシピバレート、ｔ−ブチルパーオキシピバレート、２，５−ジメチル−２，５−ビス（２−エチルヘキサノイルパーオキシ）ヘキサン、ｔ−ヘキシルパーオキシ−２−エチルヘキサノエート、ｔ−ブチルパーオキシ−２−エチルヘキサノエート、ｔ−ブチルパーオキシイソブチレート、ｔ−ブチルパーオキシ−３，５，５−トリメチルヘキサノエート、ｔ−ブチルパーオキシラウレート等が挙げられる。上記アゾ化合物として、例えば、アゾビスイソブチロニトリル、アゾビスシクロヘキサンカルボニトリル等が挙げられる。これらの重合開始剤は単独で用いてもよいし、２種以上を併用してもよい。
In order to copolymerize the monomer mixture to obtain the acrylic copolymer, the monomer mixture may be radically reacted in the presence of a polymerization initiator. As a method of radical reaction of the monomer mixture, that is, a polymerization method, a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
The said polymerization initiator is not specifically limited, For example, an organic peroxide, an azo compound, etc. are mentioned. Examples of the organic peroxide include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5 -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Examples include isobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-butylperoxylaurate. Examples of the azo compound include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.
上記アクリル共重合体の重量平均分子量（Ｍｗ）は、４０万〜１００万である。重量平均分子量が４０万未満であると、接着面に強い衝撃が加わった場合に携帯電子機器用アクリル粘着剤が被着体から剥がれやすくなる。重量平均分子量が１００万を超えると、携帯電子機器用アクリル粘着剤の粘着力が低くなり、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合に粘着剤層が基材との界面で剥がれやすくなる。重量平均分子量の好ましい下限は５０万、好ましい上限は９０万であり、より好ましい下限は６０万、より好ましい上限は８０万、更に好ましい下限は６５万、更に好ましい上限は７２万である。
重量平均分子量を上記範囲に調整するためには、重合開始剤、重合温度等の重合条件を調整すればよい。
なお、重量平均分子量（Ｍｗ）とは、ＧＰＣ（Ｇｅｌ Ｐｅｒｍｅａｔｉｏｎ Ｃｈｒｏｍａｔｏｇｒａｐｈｙ：ゲルパーミエーションクロマトグラフィ）による標準ポリスチレン換算の重量平均分子量である。
The acrylic copolymer has a weight average molecular weight (Mw) of 400,000 to 1,000,000. When the weight average molecular weight is less than 400,000, the acrylic pressure-sensitive adhesive for portable electronic devices is easily peeled off from the adherend when a strong impact is applied to the adhesive surface. When the weight average molecular weight exceeds 1,000,000, the adhesive strength of the acrylic adhesive for portable electronic devices becomes low, and the adhesive layer becomes an interface with the substrate when used for a double-sided adhesive tape having a polyolefin foam or the like as a substrate. It becomes easy to peel off. The preferable lower limit of the weight average molecular weight is 500,000, the preferable upper limit is 900,000, the more preferable lower limit is 600,000, the more preferable upper limit is 800,000, the still more preferable lower limit is 650,000, and the further preferable upper limit is 720,000.
In order to adjust the weight average molecular weight within the above range, polymerization conditions such as a polymerization initiator and a polymerization temperature may be adjusted.
In addition, a weight average molecular weight (Mw) is a weight average molecular weight of standard polystyrene conversion by GPC (Gel Permeation Chromatography: gel permeation chromatography).
本発明の携帯電子機器用アクリル粘着剤は、上記アクリル共重合体１００重量部に対して、粘着付与樹脂を３０〜５０重量部含有する。
上記粘着付与樹脂の含有量が３０重量部未満であると、接着面に強い衝撃が加わった場合に携帯電子機器用アクリル粘着剤が被着体から剥がれやすくなる。上記粘着付与樹脂の含有量が５０重量部を超えると、携帯電子機器用アクリル粘着剤の粘着力が強くなりすぎるため、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合に貼り直しが難しくなる等、取扱い性が低下する。上記粘着付与樹脂の含有量の好ましい上限は４５重量部、より好ましい上限は４０重量部である。
The acrylic pressure-sensitive adhesive for portable electronic devices of the present invention contains 30 to 50 parts by weight of a tackifier resin with respect to 100 parts by weight of the acrylic copolymer.
When the content of the tackifying resin is less than 30 parts by weight, the acrylic pressure-sensitive adhesive for portable electronic devices is easily peeled off from the adherend when a strong impact is applied to the bonding surface. When the content of the tackifying resin exceeds 50 parts by weight, the adhesive strength of the acrylic adhesive for portable electronic devices becomes too strong. Handling becomes difficult, such as becoming difficult. The upper limit with preferable content of the said tackifying resin is 45 weight part, and a more preferable upper limit is 40 weight part.
上記粘着付与樹脂として、例えば、ロジンエステル系樹脂、水添ロジン系樹脂、テルペン系樹脂、テルペンフェノール系樹脂、クマロンインデン系樹脂、脂環族飽和炭化水素系樹脂、Ｃ５系石油樹脂、Ｃ９系石油樹脂、Ｃ５−Ｃ９共重合系石油樹脂等が挙げられる。これらの粘着付与樹脂は単独で用いてもよいし、２種以上を併用してもよい。なかでも、上記粘着付与樹脂は、上記アクリル共重合体１００重量部に対して、重合ロジンエステル系樹脂１０〜２０重量部と、テルペンフェノール系樹脂１０〜２０重量部と、水添ロジン系樹脂１０〜２０重量部とを含む３種類の粘着付与樹脂の混合物であることが好ましい。 Examples of the tackifier resins include rosin ester resins, hydrogenated rosin resins, terpene resins, terpene phenol resins, coumarone indene resins, alicyclic saturated hydrocarbon resins, C5 petroleum resins, and C9 resins. Examples thereof include petroleum resins and C5-C9 copolymer petroleum resins. These tackifying resins may be used alone or in combination of two or more. Among them, the tackifying resin is composed of 10 to 20 parts by weight of a polymerized rosin ester resin, 10 to 20 parts by weight of a terpene phenol resin, and 10 hydrogenated rosin resins with respect to 100 parts by weight of the acrylic copolymer. It is preferable that it is a mixture of 3 types of tackifying resin containing -20 weight part.
基材の両面に粘着剤層を有する携帯電子機器用両面粘着テープであって、少なくとも一方の粘着剤層が、本発明の携帯電子機器用アクリル粘着剤からなる携帯電子機器用両面粘着テープもまた、本発明の１つである。
本発明の携帯電子機器用両面粘着テープにおいては、少なくとも一方の粘着剤層が本発明の携帯電子機器用アクリル粘着剤からなっていれば、両面の粘着剤層が同じ組成であってもよいし、それぞれ異なる組成であってもよい。
A double-sided pressure-sensitive adhesive tape for portable electronic devices having a pressure-sensitive adhesive layer on both sides of the base material, wherein at least one pressure-sensitive adhesive layer comprises the acrylic pressure-sensitive adhesive for portable electronic devices of the present invention. This is one of the present inventions.
In the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention, as long as at least one pressure-sensitive adhesive layer is composed of the acrylic pressure-sensitive adhesive for portable electronic devices of the present invention, the double-sided pressure-sensitive adhesive layers may have the same composition. , Each may have a different composition.
上記粘着剤層は、架橋剤が添加されることにより上記粘着剤層を構成する樹脂（上記アクリル共重合体及び／又は上記粘着付与樹脂）の主鎖間に架橋構造が形成されていることが好ましい。
上記架橋剤は特に限定されず、例えば、イソシアネート系架橋剤、アジリジン系架橋剤、エポキシ系架橋剤、金属キレート型架橋剤等が挙げられる。なかでも、イソシアネート系架橋剤が好ましい。上記粘着剤層にイソシアネート系架橋剤が添加されることで、イソシアネート系架橋剤のイソシアネート基と上記粘着剤層を構成する樹脂中のアルコール性水酸基とが反応して、上記粘着剤層の架橋が緩くなる。従って、上記粘着剤層は、断続的に加わる剥離応力を分散させることができ、強い衝撃が加わった場合に被着体の変形に伴って生じる剥離応力に対し、被着体からの剥離耐性がより向上する。
上記架橋剤の添加量は、上記アクリル共重合体１００重量部に対して０．０１〜１０重量部が好ましく、０．１〜３重量部がより好ましい。
In the pressure-sensitive adhesive layer, a crosslinking structure may be formed between main chains of the resin (the acrylic copolymer and / or the tackifying resin) constituting the pressure-sensitive adhesive layer by adding a crosslinking agent. preferable.
The said crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an aziridine type crosslinking agent, an epoxy-type crosslinking agent, a metal chelate type crosslinking agent etc. are mentioned. Of these, isocyanate-based crosslinking agents are preferred. By adding an isocyanate-based crosslinking agent to the pressure-sensitive adhesive layer, the isocyanate group of the isocyanate-based crosslinking agent reacts with the alcoholic hydroxyl group in the resin constituting the pressure-sensitive adhesive layer, thereby cross-linking the pressure-sensitive adhesive layer. It becomes loose. Therefore, the pressure-sensitive adhesive layer can disperse the peeling stress applied intermittently, and has a resistance to peeling from the adherend against the peeling stress caused by the deformation of the adherend when a strong impact is applied. More improved.
The addition amount of the crosslinking agent is preferably 0.01 to 10 parts by weight and more preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
上記粘着剤層の架橋度（ゲル分率）は、高すぎても低すぎても、上記粘着剤層が被着体の変形に伴って生じる剥離応力によって被着体から剥離しやすくなることがあるので、５〜５０重量％が好ましく、１０〜４０重量％がより好ましく、１５〜３５重量％が特に好ましい。
なお、粘着剤層の架橋度（ゲル分率）は、粘着剤層をＷ１（ｇ）採取し、この粘着剤層を酢酸エチル中に２３℃にて２４時間浸漬して不溶解分を２００メッシュの金網で濾過し、金網上の残渣を真空乾燥して乾燥残渣の重量Ｗ２（ｇ）を測定し、下記式（１）により算出する。
架橋度（ゲル分率）（重量％）＝１００×Ｗ２／Ｗ１ （１）
Even if the degree of cross-linking (gel fraction) of the pressure-sensitive adhesive layer is too high or too low, the pressure-sensitive adhesive layer can be easily peeled off from the adherend due to the peeling stress caused by the deformation of the adherend. Therefore, 5 to 50% by weight is preferable, 10 to 40% by weight is more preferable, and 15 to 35% by weight is particularly preferable.
The degree of cross-linking (gel fraction) of the pressure-sensitive adhesive layer was determined by collecting W1 (g) of the pressure-sensitive adhesive layer and immersing this pressure-sensitive adhesive layer in ethyl acetate at 23 ° C. for 24 hours to give an insoluble content of 200 mesh. The residue on the wire mesh is vacuum-dried, and the weight W2 (g) of the dry residue is measured and calculated by the following formula (1).
Cross-linking degree (gel fraction) (% by weight) = 100 × W2 / W1 (1)
上記粘着剤層の厚みは特に限定されないが、粘着剤層の厚み（片面の粘着剤層の厚み）が１０〜１５０μｍであることが好ましい。厚みが１０μｍ未満であると、上記粘着剤層は、耐衝撃性が低下することがある。厚みが１５０μｍを超えると、上記粘着剤層は、リワーク性又は再剥離性が損なわれることがある。 Although the thickness of the said adhesive layer is not specifically limited, It is preferable that the thickness (thickness of the adhesive layer of one side) of an adhesive layer is 10-150 micrometers. When the thickness is less than 10 μm, the pressure-sensitive adhesive layer may have reduced impact resistance. When the thickness exceeds 150 μm, the pressure-sensitive adhesive layer may have impaired reworkability or removability.
上記基材は特に限定されず、例えば、樹脂フィルム、シート状発泡体等が挙げられる。上記シート状発泡体として、ポリオレフィン発泡体が特に好ましい。
上記ポリオレフィン発泡体は緩衝性を有するため、携帯電子機器用両面粘着テープの耐衝撃性を高めることができる。また、上記粘着剤層は、本発明の携帯電子機器用アクリル粘着剤からなるため、上記ポリオレフィン発泡体等の基材へのアンカー性にも優れたものとなる。
The said base material is not specifically limited, For example, a resin film, a sheet-like foam, etc. are mentioned. As the sheet-like foam, a polyolefin foam is particularly preferable.
Since the polyolefin foam has buffering properties, the impact resistance of the double-sided pressure-sensitive adhesive tape for portable electronic devices can be improved. Moreover, since the said adhesive layer consists of the acrylic adhesive for portable electronic devices of this invention, it becomes the thing excellent also in the anchor property to base materials, such as the said polyolefin foam.
上記ポリオレフィン発泡体は、ポリオレフィン系樹脂を含む発泡体であれば特に限定されず、例えば、ポリエチレン系発泡体、ポリプロピレン系発泡体、エチレン−プロピレン系発泡体等が挙げられるが、耐衝撃性が向上することから、重合触媒として四価の遷移金属を含むメタロセン化合物を用いて得られたポリオレフィン系樹脂を含む発泡体（本明細書において「メタロセン系ポリオレフィン発泡体」ともいう）が好ましい。なかでも、メタロセン化合物を用いて得られたポリエチレン系樹脂を含む発泡体（本明細書において「メタロセン系ポリエチレン発泡体」ともいう）がより好ましい。
上記メタロセン化合物として、例えば、カミンスキー触媒等が挙げられる。
The polyolefin foam is not particularly limited as long as it is a foam containing a polyolefin resin, and examples thereof include a polyethylene foam, a polypropylene foam, an ethylene-propylene foam, and the impact resistance is improved. Therefore, a foam containing a polyolefin resin obtained by using a metallocene compound containing a tetravalent transition metal as a polymerization catalyst (also referred to as “metallocene polyolefin foam” in the present specification) is preferable. Among these, a foam containing a polyethylene resin obtained by using a metallocene compound (also referred to as “metallocene polyethylene foam” in the present specification) is more preferable.
Examples of the metallocene compounds include Kaminsky catalysts.
上記メタロセン系ポリエチレン発泡体に含まれる上記メタロセン化合物を用いて得られたポリエチレン系樹脂として、例えば、上記メタロセン化合物を用いて、エチレンと、必要に応じて配合される他のα−オレフィンとを共重合することにより得られたポリエチレン系樹脂等が挙げられる。上記他のα−オレフィンとして、例えば、プロペン、１−ブテン、１−ペンテン、１−ヘキセン等が挙げられる。 As a polyethylene resin obtained using the metallocene compound contained in the metallocene polyethylene foam, for example, using the metallocene compound, ethylene and another α-olefin blended as necessary may be used. Examples thereof include polyethylene-based resins obtained by polymerization. Examples of the other α-olefin include propene, 1-butene, 1-pentene, 1-hexene and the like.
上記メタロセン系ポリエチレン発泡体は、上記メタロセン化合物を用いて得られたポリエチレン系樹脂に加えて、更に、他のオレフィン系樹脂を含んでいてもよい。上記他のオレフィン系樹脂として、例えば、ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体等が挙げられる。
なお、この場合、上記メタロセン系ポリエチレン発泡体における上記メタロセン化合物を用いて得られたポリエチレン系樹脂の含有量は、４０重量％以上が好ましい。上記メタロセン化合物を用いて得られたポリエチレン系樹脂の含有量が４０重量％以上であると、上記メタロセン系ポリエチレン発泡体の厚みが薄くても高い圧縮強度を得ることができる。
The metallocene polyethylene foam may further contain another olefin resin in addition to the polyethylene resin obtained using the metallocene compound. Examples of the other olefin-based resin include polyethylene, polypropylene, ethylene-propylene copolymer, and the like.
In this case, the content of the polyethylene resin obtained by using the metallocene compound in the metallocene polyethylene foam is preferably 40% by weight or more. When the content of the polyethylene resin obtained by using the metallocene compound is 40% by weight or more, high compressive strength can be obtained even if the metallocene polyethylene foam is thin.
上記ポリオレフィン発泡体は、架橋されていることが好ましい。上記ポリオレフィン発泡体を架橋することで、耐衝撃性を向上させることができる。
上記ポリオレフィン発泡体を架橋する方法は特に限定されず、例えば、上記ポリオレフィン発泡体に電子線、α線、β線、γ線等の電離性放射線を照射する方法、上記ポリオレフィン発泡体に予め配合しておいた有機過酸化物を加熱により分解させる方法等が挙げられる。
The polyolefin foam is preferably cross-linked. By cross-linking the polyolefin foam, impact resistance can be improved.
The method for crosslinking the polyolefin foam is not particularly limited. For example, a method of irradiating the polyolefin foam with ionizing radiation such as electron beam, α ray, β ray, γ ray, Examples include a method of decomposing the organic peroxide by heating.
上記ポリオレフィン発泡体の製造方法は特に限定されないが、ポリオレフィン系樹脂と発泡剤とを含有する発泡性樹脂組成物を調製し、この発泡性樹脂組成物を押出機を用いてシート状に押出加工する際に発泡剤を発泡させ、得られたポリオレフィン発泡体を必要に応じて架橋する方法が好ましい。 The method for producing the polyolefin foam is not particularly limited, but a foamable resin composition containing a polyolefin resin and a foaming agent is prepared, and the foamable resin composition is extruded into a sheet using an extruder. In this case, it is preferable to foam the foaming agent and crosslink the obtained polyolefin foam as necessary.
上記基材の厚みは特に限定されないが、１２０〜３００μｍが好ましい。厚みが１２０μｍ未満であると、上記基材は、強度が低下し、強い衝撃が加わった場合に破壊することがある。厚みが３００μｍを超えると、上記基材は、柔軟性が低下し、強い衝撃が加わった場合に上記粘着剤層との界面で剥離することがあり、また、被着体の形状に沿って密着させて貼り合わせることが困難になることがある。 Although the thickness of the said base material is not specifically limited, 120-300 micrometers is preferable. When the thickness is less than 120 μm, the substrate may be broken when the strength is lowered and a strong impact is applied. When the thickness exceeds 300 μm, the base material is less flexible and may peel off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied, and adheres along the shape of the adherend. And sticking together may be difficult.
本発明の携帯電子機器用両面粘着テープは、両面粘着テープの総厚みが１５０〜４００μｍであることが好ましい。総厚みが１５０μｍ未満であると、両面粘着テープは、耐衝撃性が低下することがある。総厚みが４００μｍを超えると、両面粘着テープは、携帯電子機器を構成する部品を機器本体に接着固定する用途に適さないことがある。 As for the double-sided adhesive tape for portable electronic devices of this invention, it is preferable that the total thickness of a double-sided adhesive tape is 150-400 micrometers. When the total thickness is less than 150 μm, the impact resistance of the double-sided pressure-sensitive adhesive tape may be lowered. When the total thickness exceeds 400 μm, the double-sided pressure-sensitive adhesive tape may not be suitable for use in bonding and fixing components constituting the portable electronic device to the device body.
本発明の携帯電子機器用両面粘着テープの製造方法として、例えば、以下のような方法が挙げられる。
まず、アクリル共重合体、粘着付与樹脂、必要に応じて架橋剤等に溶剤を加えて粘着剤Ａの溶液を作製して、この粘着剤Ａの溶液を基材の表面に塗布し、溶液中の溶剤を完全に乾燥除去して粘着剤層Ａを形成する。次に、形成された粘着剤層Ａの上に離型フィルムをその離型処理面が粘着剤層Ａに対向した状態に重ね合わせる。
次いで、上記離型フィルムとは別の離型フィルムを用意し、この離型フィルムの離型処理面に粘着剤Ｂの溶液を塗布し、溶液中の溶剤を完全に乾燥除去することにより、離型フィルムの表面に粘着剤層Ｂが形成された積層フィルムを作製する。得られた積層フィルムを粘着剤層Ａが形成された基材の裏面に、粘着剤層Ｂが基材の裏面に対向した状態に重ね合わせて積層体を作製する。そして、上記積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得ることができる。
As a manufacturing method of the double-sided adhesive tape for portable electronic devices of this invention, the following methods are mentioned, for example.
First, a solution of an adhesive A is prepared by adding a solvent to an acrylic copolymer, a tackifier resin, and a cross-linking agent as necessary, and the solution of the adhesive A is applied to the surface of the substrate. The solvent is completely removed by drying to form the pressure-sensitive adhesive layer A. Next, the release film is superimposed on the pressure-sensitive adhesive layer A so that the release treatment surface faces the pressure-sensitive adhesive layer A.
Next, a release film different from the above release film is prepared, the adhesive B solution is applied to the release treatment surface of the release film, and the solvent in the solution is completely removed by drying, thereby releasing the release film. A laminated film in which the pressure-sensitive adhesive layer B is formed on the surface of the mold film is produced. The obtained laminated film is laminated on the back surface of the base material on which the pressure-sensitive adhesive layer A is formed, with the pressure-sensitive adhesive layer B facing the back surface of the base material to produce a laminate. And by pressing the said laminated body with a rubber roller etc., the double-sided adhesive tape which has an adhesive layer on both surfaces of a base material, and the surface of the adhesive layer was covered with the release film can be obtained.
また、同様の要領で積層フィルムを２組作製し、これらの積層フィルムを基材の両面のそれぞれに、積層フィルムの粘着剤層を基材に対向させた状態に重ね合わせて積層体を作製し、この積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得てもよい。 In addition, two sets of laminated films are produced in the same manner, and a laminated body is produced by superposing these laminated films on both sides of the base material with the adhesive layer of the laminated film facing the base material. By pressing the laminate with a rubber roller or the like, a double-sided pressure-sensitive adhesive tape having an adhesive layer on both surfaces of the base material and having the surface of the adhesive layer covered with a release film may be obtained.
本発明の携帯電子機器用両面粘着テープの用途は特に限定されないが、携帯電子機器を構成する部品を機器本体に接着固定する用途が好ましい。具体的には、本発明の携帯電子機器用両面粘着テープは、例えば、携帯電子機器の液晶表示パネルを機器本体に接着固定する両面粘着テープとして用いることができる。
また、これらの用途における本発明の携帯電子機器用両面粘着テープの形状は特に限定されないが、長方形、額縁状、円形、楕円形、ドーナツ型等が挙げられる。
The use of the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention is not particularly limited, but the use of bonding and fixing components constituting the portable electronic device to the device body is preferable. Specifically, the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention can be used, for example, as a double-sided pressure-sensitive adhesive tape for bonding and fixing a liquid crystal display panel of a portable electronic device to a device body.
Moreover, the shape of the double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention in these uses is not particularly limited, and examples thereof include a rectangle, a frame shape, a circle, an ellipse, and a donut shape.
本発明によれば、被着体への粘着力が高く、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合には基材へのアンカー性にも優れ、その結果、優れた耐衝撃性を発揮できる携帯電子機器用アクリル粘着剤を提供することができる。また、本発明によれば、該携帯電子機器用アクリル粘着剤からなる粘着剤層を有する携帯電子機器用両面粘着テープを提供することができる。 According to the present invention, the adhesive strength to an adherend is high, and when used in a double-sided pressure-sensitive adhesive tape having a polyolefin foam or the like as a base material, the anchoring property to the base material is excellent. It is possible to provide an acrylic pressure-sensitive adhesive for portable electronic devices that can exhibit impact properties. Moreover, according to this invention, the double-sided adhesive tape for portable electronic devices which has an adhesive layer which consists of this acrylic adhesive for portable electronic devices can be provided.
以下に実施例を挙げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されない。 EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples.
（実施例１）
（１）粘着剤溶液の調製
温度計、攪拌機、冷却管を備えた反応器に表１に示す単量体と酢酸エチルとを加え、窒素置換した後、反応器を加熱して還流を開始した。続いて、上記反応器内に、重合開始剤としてラウロイルパーオキシド０．１重量部を添加した。７０℃、５時間還流させて、アクリル共重合体の溶液を得た。得られたアクリル共重合体について、カラムとしてＷａｔｅｒ社製「２６９０ Ｓｅｐａｒａｔｉｏｎｓ Ｍｏｄｅｌ」を用いてＧＰＣ法により重量平均分子量を測定したところ、４５万であった。
得られたアクリル共重合体の溶液に含まれるアクリル共重合体の固形分１００重量部に対して、重合ロジンエステル１４重量、テルペンフェノール１０重量部、水添ロジンエステル１０重量部、酢酸エチル１２５重量部、イソシアネート系架橋剤（積水フーラー社製「硬化剤 ＵＡ」）１．０重量部を添加し、攪拌して、アクリル粘着剤が酢酸エチルに溶解した粘着剤溶液を得た。
Example 1
(1) Preparation of pressure-sensitive adhesive solution To a reactor equipped with a thermometer, stirrer, and condenser, the monomers and ethyl acetate shown in Table 1 were added and purged with nitrogen, and then the reactor was heated to start refluxing. . Subsequently, 0.1 part by weight of lauroyl peroxide was added as a polymerization initiator in the reactor. The mixture was refluxed at 70 ° C. for 5 hours to obtain an acrylic copolymer solution. When the weight average molecular weight of the obtained acrylic copolymer was measured by a GPC method using “2690 Separations Model” manufactured by Water as a column, it was 450,000.
14 parts by weight of polymerized rosin ester, 10 parts by weight of terpene phenol, 10 parts by weight of hydrogenated rosin ester, 125 parts by weight of ethyl acetate with respect to 100 parts by weight of the solid content of the acrylic copolymer contained in the resulting acrylic copolymer solution. Part and an isocyanate-based crosslinking agent (“curing agent UA” manufactured by Sekisui Fuller Co., Ltd.) (1.0 part by weight) were added and stirred to obtain a pressure-sensitive adhesive solution in which the acrylic pressure-sensitive adhesive was dissolved in ethyl acetate.
（２）両面粘着テープの製造
厚み１４０μｍの架橋メタロセン系ポリエチレン発泡体（ＭＤ方向の２３℃の破断伸度：５５２％、見かけ密度：０．４４ｇ／ｃｍ３、厚み方向の２５％圧縮強度：２０８ｋＰａ）の表面に、得られた粘着剤溶液を塗布し、１００℃で５分間乾燥させることにより、厚み３０μｍの粘着剤層を形成した。形成された粘着剤層の表面に対して離型処理が施された厚み５０μｍのＰＥＴフィルムを貼り合わせた。
次いで、別の離型処理が施された厚み５０μｍのＰＥＴフィルムを用意し、このＰＥＴフィルムの離型処理面に粘着剤溶液を塗布し、１００℃で５分間乾燥させることにより、厚み３０μｍの粘着剤層を形成した。この粘着剤層を架橋メタロセン系ポリエチレン発泡体の表面と貼り合わせた。これにより、離型処理が施された厚み５０μｍのＰＥＴフィルムで覆われた両面粘着テープを得た。
なお、形成された粘着剤層をＷ１（ｇ）採取し、この粘着剤層を酢酸エチル中に２３℃にて２４時間浸漬して不溶解分を２００メッシュの金網で濾過し、金網上の残渣を真空乾燥して乾燥残渣の重量Ｗ２（ｇ）を測定し、下記式（１）により粘着剤層の架橋度（ゲル分率）を算出した。
架橋度（ゲル分率）（重量％）＝１００×Ｗ２／Ｗ１ （１）
(2) Production of double-sided pressure-sensitive adhesive tape Cross-linked metallocene polyethylene foam having a thickness of 140 μm (breaking elongation at 23 ° C. in MD direction: 552%, apparent density: 0.44 g / cm 3 , 25% compressive strength in thickness direction: 208 kPa The obtained pressure-sensitive adhesive solution was applied to the surface and dried at 100 ° C. for 5 minutes to form a pressure-sensitive adhesive layer having a thickness of 30 μm. A PET film having a thickness of 50 μm subjected to a release treatment was bonded to the surface of the formed pressure-sensitive adhesive layer.
Next, a PET film having a thickness of 50 μm, which has been subjected to another release treatment, is prepared, an adhesive solution is applied to the release treatment surface of this PET film, and dried at 100 ° C. for 5 minutes. An agent layer was formed. This pressure-sensitive adhesive layer was bonded to the surface of a crosslinked metallocene polyethylene foam. Thereby, the double-sided adhesive tape covered with the 50-micrometer-thick PET film by which the mold release process was performed was obtained.
In addition, W1 (g) was collected for the formed pressure-sensitive adhesive layer, this pressure-sensitive adhesive layer was immersed in ethyl acetate at 23 ° C. for 24 hours, and the insoluble matter was filtered through a 200-mesh wire mesh. Was dried in vacuo, the weight W2 (g) of the dry residue was measured, and the degree of crosslinking (gel fraction) of the pressure-sensitive adhesive layer was calculated from the following formula (1).
Cross-linking degree (gel fraction) (% by weight) = 100 × W2 / W1 (1)
（実施例２〜９、比較例１〜９）
表１又は表２に記載されたとおり単量体及び粘着付与樹脂の種類及び量を変更したこと以外は実施例１と同様にして、両面粘着テープを得た。
(Examples 2-9, Comparative Examples 1-9)
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the types and amounts of the monomer and tackifying resin were changed as described in Table 1 or Table 2.
（評価）
実施例及び比較例で得られた両面粘着テープに対して下記の評価を行った。評価結果を表１、表２に示した。
(Evaluation)
The following evaluation was performed on the double-sided pressure-sensitive adhesive tapes obtained in Examples and Comparative Examples. The evaluation results are shown in Tables 1 and 2.
（１）プッシュ試験
＜試験方法＞
得られた両面粘着テープをトムソン刃により外寸４６×６１ｍｍ、内寸４２×５７ｍｍとする幅２ｍｍの額縁状に打ち抜き、試験片を作製した。
得られた試験片（額縁状）の一方の離型フィルムを剥離除去し、外寸５５×６５ｍｍ、厚み１ｍｍのポリカーボネート板（タキロン社製、以下ＰＣ板）にローラーを用いて貼り合わせた。続いて、もう一方の離型フィルムを剥離除去し、中央部に３８×５０ｍｍの開口部を設けた外寸８０×１１５ｍｍ、厚み２ｍｍのＰＣ板に、ＰＣ板の開口部の中心と試験片の中心とがほぼ一致するように静かに載せ、上部から５ｋｇの重りを１０秒間載せて２つのＰＣ板を貼り合わせ、その後、２３℃で２４時間静置して接着養生を行って試験サンプルを作製した。
この試験サンプルを、開口部を設けたＰＣ板が上面となるように固定治具にセットし、開口部側から下面のＰＣ板を押していき、ＰＣ板が剥がれたときの荷重を測定した。また、外寸５５×６５ｍｍ、厚み１ｍｍのＰＣ板に代えて同サイズの鋼板（ＳＵＳ板）又はガラス板を用いてこれらの板が剥がれたときの荷重を測定した。測定は２３℃にて行った。
(1) Push test <Test method>
The obtained double-sided pressure-sensitive adhesive tape was punched into a frame shape having a width of 2 mm with an outer dimension of 46 × 61 mm and an inner dimension of 42 × 57 mm by a Thomson blade, and a test piece was produced.
One release film of the obtained test piece (frame shape) was peeled and removed, and bonded to a polycarbonate plate (made by Takiron, hereinafter referred to as PC plate) having an outer dimension of 55 × 65 mm and a thickness of 1 mm using a roller. Subsequently, the other release film was peeled and removed, and the center of the opening of the PC plate and the test piece were placed on a PC plate having an outer dimension of 80 × 115 mm and a thickness of 2 mm provided with an opening of 38 × 50 mm in the center. Gently place it so that it is almost coincident with the center, put a 5 kg weight from the top for 10 seconds and paste the two PC plates together, and then let stand at 23 ° C for 24 hours to perform adhesion curing and prepare a test sample did.
This test sample was set on a fixing jig so that the PC plate provided with the opening was on the upper surface, the lower PC plate was pushed from the opening side, and the load when the PC plate was peeled was measured. Moreover, it replaced with the PC board of outer dimensions 55x65mm and thickness 1mm, and measured the load when these boards peeled using the steel plate (SUS board) or glass plate of the same size. The measurement was performed at 23 ° C.
＜プッシュ試験の判定＞
○○○ ＰＣ板、ＳＵＳ板、ガラス板の全てが１４０Ｎ以上の荷重が加わるまで剥がれなかった。
○○ ＰＣ板、ＳＵＳ板、ガラス板の全てが１２０Ｎ以上の荷重が加わるまで剥がれず、そのうち２つ以上が１４０Ｎ以上の荷重が加わるまで剥がれなかった。
○ ＰＣ板、ＳＵＳ板、ガラス板の全てが１２０Ｎ以上の荷重が加わるまで剥がれなかった。
× ＰＣ板、ＳＵＳ板、ガラス板のいずれかが１２０Ｎ未満の荷重で剥がれた。
<Judgment of push test>
XX: The PC plate, SUS plate, and glass plate were not peeled off until a load of 140 N or more was applied.
○○ All of the PC plate, SUS plate, and glass plate were not peeled off until a load of 120 N or more was applied, and two or more of them were not peeled off until a load of 140 N or more was applied.
○ All of the PC plate, SUS plate, and glass plate did not peel off until a load of 120 N or more was applied.
X Any of the PC plate, SUS plate, and glass plate was peeled off with a load of less than 120N.
（２）基材（ポリオレフィン発泡体）へのアンカー性
＜試験方法＞
図１に、実施例、比較例で得られた両面粘着テープの基材（ポリオレフィン発泡体）へのアンカー性についての試験方法の模式図を示す。
得られた両面粘着テープを縦３０ｍｍ、横３０ｍｍの大きさに切り取り、正方形の試験片を作製した。
得られた試験片の一方の離型フィルムを剥離除去し、短辺４０ｍｍ、長辺６５ｍｍ、厚み３ｍｍの金属板（ＳＵＳ板）の両側の短辺からそれぞれ５ｍｍの位置に試験片の両端を合わせ、長辺から５ｍｍの位置に試験片の片端を合わせ、ローラーを用いて金属板と試験片とを貼り合わせた。次いで、金属板に貼り合わせた試験片のもう一方の離型フィルムを剥離除去し、短辺４０ｍｍ、長辺８０ｍｍ、厚み２ｍｍの金属板（ＳＵＳ板）の両側の短辺からそれぞれ５ｍｍの位置に試験片の両端を合わせ、短辺４０ｍｍ、長辺６５ｍｍ、厚み３ｍｍの金属板がはみ出すように長辺から５ｍｍの位置に試験片の片端を合わせ、試験片の上から金属板を押しあてた。次いで、金属板の上に５ｋｇの重りを１０秒間載せて試験片を介して２つの金属板を貼り合わせた。得られた測定サンプルを２３℃で２４時間静置した。
図１に示すように、測定サンプル（試験片１を介して２つの金属板２を貼り合わせたもの）を、固定治具（図示しない）を用いて短辺４０ｍｍ、長辺６５ｍｍの金属板の長辺を測定台に垂直に立てて固定した。試験片が貼られている側の短辺４０ｍｍ、長辺８０ｍｍの金属板の表面を振り子ハンマー３（ハンマーの腕の長さ４００ｍｍ、ハンマーヘッドの重さ１．７ｋｇ）で叩いた。試験片が金属板から剥がれるまで振り子ハンマーを繰り返し振り落とした。なお、振り子ハンマーを振り落とすたびに振り落とす前の高さを段階的に高くしていき、金属板から剥がれた時点で測定を終えた。金属板から剥がれた試験片の表面を目視で観察した。測定は２３℃にて行った。
(2) Anchorability to substrate (polyolefin foam) <Test method>
In FIG. 1, the schematic diagram of the test method about the anchor property to the base material (polyolefin foam) of the double-sided adhesive tape obtained by the Example and the comparative example is shown.
The obtained double-sided pressure-sensitive adhesive tape was cut into a size of 30 mm length and 30 mm width to produce a square test piece.
One release film of the obtained test piece is peeled and removed, and both ends of the test piece are aligned at positions of 5 mm from the short sides on both sides of a metal plate (SUS plate) having a short side of 40 mm, a long side of 65 mm, and a thickness of 3 mm. One end of the test piece was aligned at a position 5 mm from the long side, and the metal plate and the test piece were bonded using a roller. Next, the other release film of the test piece bonded to the metal plate is peeled and removed, and the metal plate (SUS plate) having a short side of 40 mm, a long side of 80 mm, and a thickness of 2 mm is placed at a position of 5 mm from each short side. Both ends of the test piece were aligned, and one end of the test piece was aligned at a position 5 mm from the long side so that a metal plate having a short side of 40 mm, a long side of 65 mm, and a thickness of 3 mm protruded, and the metal plate was pressed against the test piece. Next, a 5 kg weight was placed on the metal plate for 10 seconds, and the two metal plates were bonded together via a test piece. The obtained measurement sample was allowed to stand at 23 ° C. for 24 hours.
As shown in FIG. 1, a measurement sample (two
＜アンカー性の判定＞
○ 粘着剤層と基材との界面でのアンカー剥離ではなく、基材が２つに割れたことにより試験片が金属板から剥離した。両方の金属板の表面に破れた基材が観察された。
× 基材は２つに割れず、粘着剤層と基材との界面でアンカー剥離していた。一方の金属板の表面に剥がれた基材が観察され、他方の金属板の表面に粘着剤層が観察された。
<Determination of anchor property>
○ The test piece peeled from the metal plate because the base material was broken in two, not anchor peeling at the interface between the adhesive layer and the base material. A torn substrate was observed on the surfaces of both metal plates.
X The base material was not broken into two, and the anchor was peeled off at the interface between the pressure-sensitive adhesive layer and the base material. The base material peeled on the surface of one metal plate was observed, and the adhesive layer was observed on the surface of the other metal plate.
本発明によれば、被着体への粘着力が高く、ポリオレフィン発泡体等を基材とする両面粘着テープに用いた場合には基材へのアンカー性にも優れ、その結果、優れた耐衝撃性を発揮できる携帯電子機器用アクリル粘着剤を提供することができる。また、本発明によれば、該携帯電子機器用アクリル粘着剤からなる粘着剤層を有する携帯電子機器用両面粘着テープを提供することができる。 According to the present invention, the adhesive strength to an adherend is high, and when used in a double-sided pressure-sensitive adhesive tape having a polyolefin foam or the like as a base material, the anchoring property to the base material is excellent. It is possible to provide an acrylic pressure-sensitive adhesive for portable electronic devices that can exhibit impact properties. Moreover, according to this invention, the double-sided adhesive tape for portable electronic devices which has an adhesive layer which consists of this acrylic adhesive for portable electronic devices can be provided.
１ 試験片
２ 金属板（ＳＵＳ板）
３ 振り子ハンマー
1
3 Pendulum hammer
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013195571A JP6426887B2 (en) | 2013-09-20 | 2013-09-20 | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013195571A JP6426887B2 (en) | 2013-09-20 | 2013-09-20 | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015059204A true JP2015059204A (en) | 2015-03-30 |
| JP6426887B2 JP6426887B2 (en) | 2018-11-21 |
Family
ID=52816993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013195571A Active JP6426887B2 (en) | 2013-09-20 | 2013-09-20 | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6426887B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016035747A1 (en) * | 2014-09-02 | 2016-03-10 | 積水化学工業株式会社 | Double-sided adhesive tape for portable electronic device |
| JP2016183274A (en) * | 2015-03-26 | 2016-10-20 | 積水化学工業株式会社 | Double-sided adhesive tape for shock resistance |
| JP2017106013A (en) * | 2015-12-09 | 2017-06-15 | 積水化学工業株式会社 | Heat-resistant adhesive tape |
| CN107709492A (en) * | 2016-01-26 | 2018-02-16 | 积水化学工业株式会社 | Double-faced adhesive tape |
| JP6294541B1 (en) * | 2016-06-10 | 2018-03-14 | 積水化学工業株式会社 | Double-sided adhesive tape |
| CN110177848A (en) * | 2017-03-15 | 2019-08-27 | 积水化学工业株式会社 | Double-faced adhesive tape |
| WO2022065392A1 (en) * | 2020-09-23 | 2022-03-31 | 積水化学工業株式会社 | Double-sided adhesive tape |
| KR102389857B1 (en) * | 2020-12-08 | 2022-04-21 | 한나영 | A bumper case for mobile phone |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04314776A (en) * | 1991-04-11 | 1992-11-05 | Nitto Denko Corp | Pressure-sensitive adhesive |
| JP2007176989A (en) * | 2005-12-27 | 2007-07-12 | Sanyo Chem Ind Ltd | Antistatic film for fixing electronic member |
| JP2008189756A (en) * | 2007-02-02 | 2008-08-21 | Nitto Denko Corp | (meth)acrylic adhesive composition and (meth)acrylic adhesive tape |
| WO2008111412A1 (en) * | 2007-03-09 | 2008-09-18 | Sekisui Chemical Co., Ltd. | Adhesive, double-sided adhesive sheet and display |
| JP2010215906A (en) * | 2009-02-20 | 2010-09-30 | Sekisui Chem Co Ltd | Adhesive sheet for use in electronic device |
| JP2012246444A (en) * | 2011-05-30 | 2012-12-13 | Cheil Industries Inc | Adhesive composition, optical member, and adhesive sheet |
| JP2013040329A (en) * | 2011-07-15 | 2013-02-28 | Nitto Denko Corp | Double-sided adhesive sheet |
-
2013
- 2013-09-20 JP JP2013195571A patent/JP6426887B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04314776A (en) * | 1991-04-11 | 1992-11-05 | Nitto Denko Corp | Pressure-sensitive adhesive |
| JP2007176989A (en) * | 2005-12-27 | 2007-07-12 | Sanyo Chem Ind Ltd | Antistatic film for fixing electronic member |
| JP2008189756A (en) * | 2007-02-02 | 2008-08-21 | Nitto Denko Corp | (meth)acrylic adhesive composition and (meth)acrylic adhesive tape |
| WO2008111412A1 (en) * | 2007-03-09 | 2008-09-18 | Sekisui Chemical Co., Ltd. | Adhesive, double-sided adhesive sheet and display |
| JP2010215906A (en) * | 2009-02-20 | 2010-09-30 | Sekisui Chem Co Ltd | Adhesive sheet for use in electronic device |
| JP2012246444A (en) * | 2011-05-30 | 2012-12-13 | Cheil Industries Inc | Adhesive composition, optical member, and adhesive sheet |
| JP2013040329A (en) * | 2011-07-15 | 2013-02-28 | Nitto Denko Corp | Double-sided adhesive sheet |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016035747A1 (en) * | 2014-09-02 | 2016-03-10 | 積水化学工業株式会社 | Double-sided adhesive tape for portable electronic device |
| JPWO2016035747A1 (en) * | 2014-09-02 | 2017-06-15 | 積水化学工業株式会社 | Double-sided adhesive tape for portable electronic devices |
| JP2016183274A (en) * | 2015-03-26 | 2016-10-20 | 積水化学工業株式会社 | Double-sided adhesive tape for shock resistance |
| JP2017106013A (en) * | 2015-12-09 | 2017-06-15 | 積水化学工業株式会社 | Heat-resistant adhesive tape |
| CN107709492A (en) * | 2016-01-26 | 2018-02-16 | 积水化学工业株式会社 | Double-faced adhesive tape |
| JP6294541B1 (en) * | 2016-06-10 | 2018-03-14 | 積水化学工業株式会社 | Double-sided adhesive tape |
| JP2018150501A (en) * | 2016-06-10 | 2018-09-27 | 積水化学工業株式会社 | Double sided pressure sensitive adhesive tape |
| CN110177848A (en) * | 2017-03-15 | 2019-08-27 | 积水化学工业株式会社 | Double-faced adhesive tape |
| WO2022065392A1 (en) * | 2020-09-23 | 2022-03-31 | 積水化学工業株式会社 | Double-sided adhesive tape |
| KR102389857B1 (en) * | 2020-12-08 | 2022-04-21 | 한나영 | A bumper case for mobile phone |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6426887B2 (en) | 2018-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6426887B2 (en) | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices | |
| JP6557470B2 (en) | Double-sided adhesive tape for portable electronic devices | |
| JP6499586B2 (en) | Double-sided adhesive tape for portable electronic devices | |
| JP2016183274A (en) | Double-sided adhesive tape for shock resistance | |
| JP6412453B2 (en) | Adhesive composition and adhesive tape | |
| JP6523725B2 (en) | Double-sided adhesive tape | |
| CN106232757B (en) | Double-sided adhesive tape | |
| JP2019077880A (en) | Double-sided adhesive tape | |
| JP6411127B2 (en) | Acrylic adhesive and adhesive sheet for electronic devices | |
| JP6505518B2 (en) | Double-sided adhesive tape | |
| JP6557501B2 (en) | Adhesive tape | |
| WO2016052399A1 (en) | Double-sided adhesive tape | |
| JP2016069611A (en) | Double-sided adhesive tape | |
| JP6511314B2 (en) | Adhesive tape | |
| JP2019214739A (en) | Acryl adhesive and adhesive sheet for electronic apparatus | |
| JP6523125B2 (en) | Double-sided adhesive tape, double-sided adhesive tape for fixing electronic device parts and double-sided adhesive tape for fixing automotive parts | |
| JP2016125044A (en) | Double-sided adhesive tape | |
| JP6460788B2 (en) | Adhesive sheet | |
| JP6578422B2 (en) | Acrylic adhesive and adhesive sheet for electronic devices | |
| JP2016160276A (en) | Adhesive tape | |
| JP2016098259A (en) | Double sided adhesive tape | |
| JP2019065301A (en) | Adhesive sheet | |
| WO2020175368A1 (en) | Dual-sided pressure-sensitive adhesive tape, electronic apparatus component, and electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160608 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170321 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170530 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170727 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170808 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170927 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180206 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180426 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180507 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180710 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180829 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181002 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181026 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6426887 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |