JP2015050223A - 半導体エネルギー線検出素子 - Google Patents
半導体エネルギー線検出素子 Download PDFInfo
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- JP2015050223A JP2015050223A JP2013179147A JP2013179147A JP2015050223A JP 2015050223 A JP2015050223 A JP 2015050223A JP 2013179147 A JP2013179147 A JP 2013179147A JP 2013179147 A JP2013179147 A JP 2013179147A JP 2015050223 A JP2015050223 A JP 2015050223A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 451
- 238000001514 detection method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 239000012535 impurity Substances 0.000 claims abstract description 39
- 238000002161 passivation Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 16
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- 230000004048 modification Effects 0.000 description 22
- 238000012986 modification Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Light Receiving Elements (AREA)
- Measurement Of Radiation (AREA)
Abstract
Description
Claims (7)
- 互いに対向する第一主面と第二主面とを有する半導体基板を備えた半導体エネルギー線検出素子であって、
前記半導体基板は、
前記第一主面側に位置する第一導電型の第一半導体領域と、
前記第二主面側に位置し、前記第一半導体領域よりも不純物濃度が高い第一導電型の第二半導体領域と、
前記第一主面側に位置し、前記第一半導体領域とでエネルギー線感応領域を構成する、第二導電型の第三半導体領域と、
前記第一主面側において前記第三半導体領域が位置する領域の周囲を囲むように位置する、第二導電型の第四半導体領域と、
前記第一主面側において前記半導体基板の外縁に沿うように位置する、第二導電型の第五半導体領域と、を有することを特徴とする半導体エネルギー線検出素子。 - 前記半導体基板は、前記第一主面側において前記第四半導体領域の周囲を囲むように前記第四半導体領域と前記第五半導体領域との間に位置し、前記第一半導体領域よりも不純物濃度が高い第一導電型の半導体領域を更に有することを特徴とする請求項1に記載の半導体エネルギー線検出素子。
- 前記半導体基板は、前記半導体基板の側面に前記第一半導体領域が露出しないように前記側面側に位置し、前記第一半導体領域よりも不純物濃度が高い第一導電型の半導体領域を更に有することを特徴とする請求項1又は2に記載の半導体エネルギー線検出素子。
- 前記半導体基板の側面として露出する前記第一半導体領域の表面を覆うように配置され、覆われた前記第一半導体領域の前記表面側に所定の極性の固定電荷を存在させるためのパッシベーション材料からなる膜と、を更に備えることを特徴とする請求項1又は2に記載の半導体エネルギー線検出素子。
- 第一導電型がP型であると共に、第二導電型がN型であり、
前記パッシベーション材料が、Al2O3であることを特徴とする請求項4に記載の半導体エネルギー線検出素子。 - 前記半導体基板の前記第一主面として前記第二半導体領域と前記第三半導体領域との間の領域において露出する前記第一半導体領域の表面を覆うように配置され、覆われた前記第一半導体領域の前記表面側に所定の極性の固定電荷を存在させるためのパッシベーション材料からなる膜と、を更に備えることを特徴とする請求項1に記載の半導体エネルギー線検出素子。
- 第一導電型がN型であると共に、第二導電型がP型であり、
前記パッシベーション材料が、SiO2又はSi3N4であることを特徴とする請求項6に記載の半導体エネルギー線検出素子。
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JP2013179147A JP6170379B2 (ja) | 2013-08-30 | 2013-08-30 | 半導体エネルギー線検出素子 |
PCT/JP2014/070482 WO2015029705A1 (ja) | 2013-08-30 | 2014-08-04 | 半導体エネルギー線検出素子 |
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JP2013179147A JP6170379B2 (ja) | 2013-08-30 | 2013-08-30 | 半導体エネルギー線検出素子 |
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JP2015050223A true JP2015050223A (ja) | 2015-03-16 |
JP6170379B2 JP6170379B2 (ja) | 2017-07-26 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017150616A1 (ja) * | 2016-03-03 | 2017-09-08 | 浜松ホトニクス株式会社 | 半導体光検出素子 |
WO2018042785A1 (ja) * | 2016-08-29 | 2018-03-08 | 浜松ホトニクス株式会社 | 距離センサ及び距離画像センサ |
WO2019049900A1 (ja) * | 2017-09-08 | 2019-03-14 | 浜松ホトニクス株式会社 | 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01216581A (ja) * | 1988-02-25 | 1989-08-30 | Fuji Electric Co Ltd | 半導体装置 |
JPH05275731A (ja) * | 1992-03-25 | 1993-10-22 | Sharp Corp | フォトダイオード |
JP2002314120A (ja) * | 2001-04-18 | 2002-10-25 | Hamamatsu Photonics Kk | ホトダイオード |
JP2007335596A (ja) * | 2006-06-14 | 2007-12-27 | Hamamatsu Photonics Kk | フォトダイオードアレイ |
JP2010239005A (ja) * | 2009-03-31 | 2010-10-21 | Kinki Univ | 裏面照射型撮像素子の製造方法、その製造方法により製造された裏面照射型撮像素子及びそれを備えた撮像装置 |
JP2011138905A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 固体撮像装置 |
WO2012117931A1 (ja) * | 2011-03-02 | 2012-09-07 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
US20120235262A1 (en) * | 2009-12-01 | 2012-09-20 | Selex Galileo Limited | Infra red detectors and methods of manufacture |
-
2013
- 2013-08-30 JP JP2013179147A patent/JP6170379B2/ja not_active Expired - Fee Related
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2014
- 2014-08-04 WO PCT/JP2014/070482 patent/WO2015029705A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01216581A (ja) * | 1988-02-25 | 1989-08-30 | Fuji Electric Co Ltd | 半導体装置 |
JPH05275731A (ja) * | 1992-03-25 | 1993-10-22 | Sharp Corp | フォトダイオード |
JP2002314120A (ja) * | 2001-04-18 | 2002-10-25 | Hamamatsu Photonics Kk | ホトダイオード |
JP2007335596A (ja) * | 2006-06-14 | 2007-12-27 | Hamamatsu Photonics Kk | フォトダイオードアレイ |
JP2010239005A (ja) * | 2009-03-31 | 2010-10-21 | Kinki Univ | 裏面照射型撮像素子の製造方法、その製造方法により製造された裏面照射型撮像素子及びそれを備えた撮像装置 |
US20120235262A1 (en) * | 2009-12-01 | 2012-09-20 | Selex Galileo Limited | Infra red detectors and methods of manufacture |
JP2011138905A (ja) * | 2009-12-28 | 2011-07-14 | Toshiba Corp | 固体撮像装置 |
WO2012117931A1 (ja) * | 2011-03-02 | 2012-09-07 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017150616A1 (ja) * | 2016-03-03 | 2017-09-08 | 浜松ホトニクス株式会社 | 半導体光検出素子 |
JPWO2017150616A1 (ja) * | 2016-03-03 | 2018-12-27 | 浜松ホトニクス株式会社 | 半導体光検出素子 |
US10529772B2 (en) | 2016-03-03 | 2020-01-07 | Hamamatsu Photonics K.K. | Semiconductor light detection element |
US10930700B2 (en) | 2016-03-03 | 2021-02-23 | Hamamatsu Photonics K.K. | Semiconductor light detection element |
WO2018042785A1 (ja) * | 2016-08-29 | 2018-03-08 | 浜松ホトニクス株式会社 | 距離センサ及び距離画像センサ |
JPWO2018042785A1 (ja) * | 2016-08-29 | 2019-06-24 | 浜松ホトニクス株式会社 | 距離センサ及び距離画像センサ |
US11215698B2 (en) | 2016-08-29 | 2022-01-04 | Hamamatsu Photonics K.K. | Distance sensor and distance image sensor |
WO2019049900A1 (ja) * | 2017-09-08 | 2019-03-14 | 浜松ホトニクス株式会社 | 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ |
JP2019050256A (ja) * | 2017-09-08 | 2019-03-28 | 浜松ホトニクス株式会社 | 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ |
US11398572B2 (en) | 2017-09-08 | 2022-07-26 | Hamamatsu Photonics K.K. | Semiconductor wafer manufacturing method, method of manufacturing semiconductor energy beam detecting element, and semiconductor wafer |
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JP6170379B2 (ja) | 2017-07-26 |
WO2015029705A1 (ja) | 2015-03-05 |
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