JP2015030157A - Manufacturing method of transparent conductive laminate - Google Patents

Manufacturing method of transparent conductive laminate Download PDF

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JP2015030157A
JP2015030157A JP2013160282A JP2013160282A JP2015030157A JP 2015030157 A JP2015030157 A JP 2015030157A JP 2013160282 A JP2013160282 A JP 2013160282A JP 2013160282 A JP2013160282 A JP 2013160282A JP 2015030157 A JP2015030157 A JP 2015030157A
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transparent conductive
film
protective film
layer
conductive laminate
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有史 橋本
Yuji Hashimoto
有史 橋本
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Toppan Inc
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Toppan Printing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a transparent conductive laminate having excellent surface smoothness and allowing formation of an accurate electrode pattern on front and back sides in post processing, and a manufacturing method thereof.SOLUTION: A manufacturing method of a transparent conductive laminate 30 includes: a process of bonding a transparent conductive film 10 at least having, on one surface of a transparent base film 1, a hard coat layer 2 and a transparent conductive layer 3 sequentially laminated, and a protective film 20 having an adhesive layer 4 formed on one side of a substrate film 5 at the side of the adhesive layer; and a process of heat-treatment. The difference of maximum heat shrinkage rate to 45 degrees diagonal to a flow direction matching the direction of the transparent conductive film 10 and the protective film 20 when bonded is within 0.2%.

Description

本発明は、液晶ディスプレイや有機ＥＬディスプレイなどのフラットパネルディスプレイに用いられる透明導電性積層体及びその製造方法に関する。   The present invention relates to a transparent conductive laminate used for flat panel displays such as liquid crystal displays and organic EL displays, and a method for producing the same.

液晶ディスプレイ、プラズマディスプレイ、有機ＥＬディスプレイ等の表示装置においては、フィルム基材上に表面を保護するためのハードコート層や透明導電層を設けたタッチパネル用の透明導電性積層体が用いられている。   In display devices such as liquid crystal displays, plasma displays, and organic EL displays, a transparent conductive laminate for a touch panel provided with a hard coat layer and a transparent conductive layer for protecting the surface on a film substrate is used. .

これらのタッチパネル用の透明導電性積層体は、一般的には透明なプラスチックフィルム基材上に、目的に応じた機能を供する機能性膜をロール・ツー・ロール加工（巻取り状のフィルム原反による連続した加工）で形成して製造される。   In these transparent conductive laminates for touch panels, a functional film that provides a function according to the purpose is generally roll-to-roll processed on a transparent plastic film substrate (rolled film raw film). Produced by continuous processing).

一般にプラスチックフィルム基材のロール・ツー・ロール加工では、巻取り張力に起因する反りやスリップの発生、さらには平滑な塗布面の貼り付きやブロッキングが起こり易く、生産性や品質に悪影響を及ぼすことが知られている。   In general, roll-to-roll processing of plastic film base material tends to cause warpage and slip due to winding tension, and sticking and blocking of a smooth coated surface, which adversely affects productivity and quality. It has been known.

また最近では２種以上のプラスチックフィルム基材を積層して、より高度で複数の機能を付与した光学用のフィルム積層体が開発されている。   Recently, an optical film laminate has been developed in which two or more types of plastic film base materials are laminated to provide a plurality of higher-level functions.

上記のような２種以上のプラスチックフィルム基材を積層することで、より高機能を付与した前記光学用フィルム積層体の製造においては、例えば、透明導電層のエッチングによるパターン形成等の後加工で、先の反りがより大きな問題となり、前記積層体の平坦性がより厳しく求められる。   In the production of the optical film laminate having higher functions by laminating two or more kinds of plastic film bases as described above, for example, by post-processing such as pattern formation by etching of the transparent conductive layer Further, the warp of the tip becomes a bigger problem, and the flatness of the laminate is required more strictly.

これらの問題に対して、例えば特許文献１の提案がされている。具体的には透明導電層を有したフィルム基材を２枚用いて、それぞれの前記透明導電層が外側に配置されるように積層し、その後電極をパターン形成するものである。この提案は電極形成には効果あるものの、反りに関しては何ら効果がなく、反りによるパターン精度の低下が依然して不安材料として残る。   For these problems, for example, a proposal in Patent Document 1 has been made. Specifically, two film base materials each having a transparent conductive layer are used and laminated such that each of the transparent conductive layers is disposed on the outside, and then electrodes are patterned. Although this proposal is effective for electrode formation, it has no effect on the warp, and a decrease in pattern accuracy due to the warp still remains as an anxiety material.

特開２００９−０７０１９１号公報JP 2009-070191 A

本発明は、平坦性に優れ、且つ、後加工で表裏に精度よく電極パターンが形成できる透明導電性積層体及びその製造方法を提供するものである。   The present invention provides a transparent conductive laminate that is excellent in flatness and that can accurately form electrode patterns on both sides by post-processing, and a method for producing the same.

上記の課題を解決するための手段として、請求項１に記載の発明は、透明基材フィルムの一方の面に少なくともハードコート層と透明導電層を順次積層してなる透明導電性フィルムと、基材フィルムの一方の面に粘着層が形成された保護フィルムの前記粘着層の面とを貼り合わせる貼り合わせ工程と、熱処理をする工程とからなる透明導電性積層体の製造方法において、
前記透明導電性フィルムと保護フィルムとの貼り合せたときの方向が一致する流れ方向
斜め４５度に対する最大熱収縮率の差が０．２％以内であることを特徴とする透明導電性積層体の製造方法である。 As a means for solving the above problems, the invention described in claim 1 includes a transparent conductive film formed by sequentially laminating at least a hard coat layer and a transparent conductive layer on one surface of a transparent substrate film, In the manufacturing method of a transparent conductive laminate comprising a bonding step of bonding the surface of the adhesive layer of the protective film having an adhesive layer formed on one surface of the material film, and a step of heat treatment,
A difference in maximum heat shrinkage with respect to 45 degrees oblique in the flow direction in which directions when the transparent conductive film and the protective film are bonded is within 0.2%. It is a manufacturing method.

また、請求項２に記載の発明は、前記貼り合わせ工程がロール・ツー・ロール方式で行われることを特徴とする請求項１に記載の透明導電性積層体の製造方法である。   The invention described in claim 2 is the method for producing a transparent conductive laminate according to claim 1, wherein the bonding step is performed by a roll-to-roll method.

本発明に係る請求項１の発明によれば、粘着層を介して、透明導電性フィルムと保護フィルムとを、貼り合せたときの方向が一致する流れ方向斜め４５度に対する最大熱収縮率の差を０．２％以内とすることにより、流れ方向及び幅方向の熱収縮を抑制することができる。また、貼り合わせ後の熱処理により、流れ方向に対する左右斜め方向の反り発生を緩和することができる。   According to invention of Claim 1 which concerns on this invention, the difference of the maximum heat shrinkage | contraction with respect to 45 degree | times slanting of the flow direction in which the direction when a transparent conductive film and a protective film match together through an adhesion layer corresponds. By making the content within 0.2%, thermal shrinkage in the flow direction and the width direction can be suppressed. Further, the occurrence of warpage in the diagonal direction with respect to the flow direction can be reduced by the heat treatment after bonding.

また、請求項２によれば、貼り合わせ工程をロール・ツー・ロール方式にて行うことにより、平坦性に優れた透明導電性積層体を連続して効率よく製造することができる。   Moreover, according to Claim 2, the transparent conductive laminated body excellent in flatness can be continuously manufactured efficiently by performing a bonding process by a roll-to-roll system.

本発明に係る透明導電性積層体の断面を示す模式図である。It is a schematic diagram which shows the cross section of the transparent conductive laminated body which concerns on this invention. 透明導電性積層体の熱収縮に係る斜め４５度の方向を示す平面模式図である。It is a plane schematic diagram which shows the 45-degree direction which concerns on the thermal contraction of a transparent conductive laminated body.

以下、本発明を図に基づいて詳細に説明する。
本発明の一実施形態としては、図１（ａ）に示すような、透明基材フィルム１の一方の面にハードコート層２と透明導電層３を順次積層してなる透明導電性フィルム１０と、基材フィルム５の一方の面に粘着層が形成された保護フィルム２０の前記粘着層４の面とを、貼り合わせてなる透明導電性積層体３０であって、前記透明導電性フィルム１０と前記保護フィルム２０との貼り合せたときの方向が一致する流れ方向斜め４５度に対する最大熱収縮率の差が０．２％以内であることを特徴とする透明導電性積層体３０である。 Hereinafter, the present invention will be described in detail with reference to the drawings.
As one embodiment of the present invention, as shown in FIG. 1A, a transparent conductive film 10 formed by sequentially laminating a hard coat layer 2 and a transparent conductive layer 3 on one surface of a transparent substrate film 1; The transparent conductive laminate 30 is formed by laminating the surface of the adhesive layer 4 of the protective film 20 having an adhesive layer formed on one surface of the base film 5, and the transparent conductive film 10 The transparent conductive laminate 30 is characterized in that a difference in maximum heat shrinkage with respect to 45 degrees oblique in the flow direction in which the directions when bonded to the protective film 20 coincide is within 0.2%.

また、本発明の一実施形態として、図１（ｂ）に示すような、透明基材フィルム１の両方の面にハードコート層２を設け、その一方の面に透明導電層３を積層してなる透明導電性フィルム１０の他方の面のハードコート層２と、基材フィルム５の一方の面に粘着層が形成された保護フィルム２０の前記粘着層４とを貼り合わせることによって透明導電性積層体３０を得ることもできる。   As one embodiment of the present invention, as shown in FIG. 1 (b), a hard coat layer 2 is provided on both sides of a transparent substrate film 1, and a transparent conductive layer 3 is laminated on one side thereof. A transparent conductive laminate is formed by laminating the hard coat layer 2 on the other surface of the transparent conductive film 10 and the adhesive layer 4 of the protective film 20 having an adhesive layer formed on one surface of the base film 5. A body 30 can also be obtained.

またさらに、本発明の一実施形態として、図１（ｃ）に示すような、透明基材フィルム１の一方の面にハードコート層２と透明導電層３を順次積層してなる透明導電性フィルム１０の透明導電層３と、基材フィルム５の一方の面に粘着層が形成された保護フィルム２０の前記粘着層４とを貼り合わせることによって透明導電性積層体３０を得ることもできる。   Furthermore, as one embodiment of the present invention, as shown in FIG. 1 (c), a transparent conductive film obtained by sequentially laminating a hard coat layer 2 and a transparent conductive layer 3 on one surface of a transparent substrate film 1. The transparent conductive laminated body 30 can also be obtained by bonding the 10 transparent conductive layers 3 and the adhesive layer 4 of the protective film 20 having an adhesive layer formed on one surface of the base film 5.

図１に示す（ａ）、（ｂ）、（ｃ）のいずれの形態においても、貼り合わせ前の、透明導電性フィルム１０と保護フィルム２０との流れ方向斜め４５度に対する最大熱収縮率の差が０．２％を超えると、修正することが極めて難しいとされている斜め方向の反りが生じ、後工程での透明導電層３のパターン形成での精度や作業性の低下を招く可能性がある。   In any of the forms (a), (b), and (c) shown in FIG. 1, the difference in the maximum heat shrinkage ratio with respect to 45 degrees oblique in the flow direction between the transparent conductive film 10 and the protective film 20 before bonding. If it exceeds 0.2%, warping in an oblique direction, which is considered to be extremely difficult to correct, occurs, and there is a possibility that accuracy and workability in pattern formation of the transparent conductive layer 3 in the subsequent process may be reduced. is there.

図２は、本発明に用いられる透明導電性フィルム１０及び保護フィルム２０の流れ方向に対する斜め４５度での熱収縮率の測定位置と、前記二者を貼り合わせて得られる透明導電性積層体３０の反りの高さを測定する位置を示している。図２中のＤ１は斜め左４５度
方向を示し、Ｄ２は斜め右４５度方向を示す。また、図２中の角１、角２、角３、角４は得られた透明導電性積層体３０を３０ｃｍ角にカットしたときの四隅の位置を示す。 FIG. 2 shows a transparent conductive laminate 30 obtained by pasting together the measurement position of the heat shrinkage rate at 45 degrees oblique to the flow direction of the transparent conductive film 10 and the protective film 20 used in the present invention. The position at which the height of the warp is measured is shown. In FIG. 2, D1 indicates a 45 ° oblique left direction, and D2 indicates a 45 ° oblique right direction. Moreover, corner 1, corner 2, corner 3, and corner 4 in FIG. 2 indicate positions of four corners when the obtained transparent conductive laminate 30 is cut into 30 cm square.

また、本発明に係る前記透明導電性積層体の斜め４５度方向の熱収縮率とは、貼り合わせ前の常温での前記透明導電性積層体の図２のＤ１及びＤ２に位置する２点間距離Ｌ０、１５０℃、１時間保存後の同２点間距離Ｌ１とした時の、（Ｌ０−Ｌ１）／Ｌ０の百分率（％）で表したものである。なお、縦方向（流れ方向）、横方向（幅方向）の熱収縮率もそれぞれの方向での同様の測定にて行った。 In addition, the heat shrinkage rate in the oblique 45 degree direction of the transparent conductive laminate according to the present invention is the distance between two points located at D1 and D2 in FIG. 2 of the transparent conductive laminate at normal temperature before bonding. This is expressed as a percentage (%) of (L 0 -L 1 ) / L 0 when the distance L 0 is 150 ° C. and the distance L1 between the two points after storage for 1 hour. The heat shrinkage rate in the vertical direction (flow direction) and the horizontal direction (width direction) was also measured by the same measurement in each direction.

本発明に用いられる前記透明基材フィルム１及び基材フィルム５としては、熱可塑性樹脂、有機無機複合材など、本発明の加工工程に支障のない範囲の透明性、耐熱性、機械的強度を有するフィルム基材であれば利用できる。   The transparent base film 1 and the base film 5 used in the present invention have transparency, heat resistance, and mechanical strength within a range that does not hinder the processing steps of the present invention, such as thermoplastic resins and organic-inorganic composite materials. Any film substrate can be used.

具体的には、ポリエチレン、ポリプロピレン、ポリエステル、ポリ塩化ビニル、セロハン、ポリアミド、ポリビニルアルコール系、ポリカーボネート、ポリアセテート、アキリル系、ポリスチレン、フッ素樹脂、トリアセチルセルロースなどのフィルムが挙げられる。   Specific examples include polyethylene, polypropylene, polyester, polyvinyl chloride, cellophane, polyamide, polyvinyl alcohol, polycarbonate, polyacetate, akyryl, polystyrene, fluororesin, and triacetyl cellulose.

また、ハードコート層２としては、硬度は勿論のこと透明性、機械特性、耐熱性、耐薬品性等に優れることが要求され、具体的には架橋結合が可能である多官能のアクリレートを主成分とするモノマーやオリゴマーを架橋してなる電離放射線硬化性樹脂から形成されることが望ましい。   Further, the hard coat layer 2 is required to be excellent in transparency, mechanical properties, heat resistance, chemical resistance, etc. as well as hardness, and specifically, a polyfunctional acrylate capable of cross-linking is mainly used. It is desirable to form from an ionizing radiation curable resin formed by crosslinking monomers and oligomers as components.

前記多官能アクリレートとしては、例えばトリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ジペンタエリスリトールヘキサアクリレート、ポリエステルアクリレート等が好ましい。これらは単独で用いてもよく、２種以上併用してもよい。また、これらのアクリレートの他にエポキシアクリレート、ウレタンアクリレート等のアクリレート系樹脂を併用することも可能である。   As the polyfunctional acrylate, for example, trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, polyester acrylate and the like are preferable. These may be used alone or in combination of two or more. In addition to these acrylates, acrylate resins such as epoxy acrylate and urethane acrylate may be used in combination.

前記電離放射線が紫外線の場合には、光重合開始剤が必要であり、例えばベンゾインやそのアルキルエーテル類、アセトフェノン類、ベンゾフェノン類などが利用できる。   When the ionizing radiation is ultraviolet light, a photopolymerization initiator is required. For example, benzoin, its alkyl ethers, acetophenones, benzophenones, etc. can be used.

また、前記電離放射線硬化性樹脂からなる組成物としては、その塗液の貯蔵安定性や塗工適性を付与するために、各種添加剤や溶剤を含むことができる。   The composition comprising the ionizing radiation curable resin can contain various additives and solvents in order to impart storage stability and coating suitability of the coating liquid.

本発明に係る透明導電層３としては、例えば、インジウム・スズ複合酸化物（ＩＴＯ）、スズ酸化物、銅、アルミニウム、ニッケル、クロムなどの材料が挙げられ、単独、二種以上の複合あるいは積層でもよい。また、これらの材料を用いて透明導電層を形成する方法としては、スパッタ法、真空蒸着法、イオンプレーティング法のＰＶＤ法、あるいはＣＶＤ法、塗工法及び印刷法等が利用できる。   Examples of the transparent conductive layer 3 according to the present invention include materials such as indium-tin composite oxide (ITO), tin oxide, copper, aluminum, nickel, and chromium. But you can. Moreover, as a method of forming a transparent conductive layer using these materials, sputtering method, vacuum deposition method, PVD method of ion plating method, CVD method, coating method, printing method and the like can be used.

また、本発明に係る粘着層としては、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤等が挙げられるが、この限りではない。厚みは１０μｍ〜２００μｍが好ましい。厚みが１０μｍ未満であると、密着性が十分に確保できないことや、僅かな厚みムラで色味のムラが目立ちやすくなる。また、２００μｍを超えると、透明性が劣り、外観に不具合が生じる他に、透明導電性積層体としての総厚が厚くなることや、コスト高、生産性が劣るといった問題が生じる。   Examples of the pressure-sensitive adhesive layer according to the present invention include, but are not limited to, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive. The thickness is preferably 10 μm to 200 μm. If the thickness is less than 10 μm, sufficient adhesion cannot be ensured, and unevenness in color becomes conspicuous due to slight thickness unevenness. On the other hand, when the thickness exceeds 200 μm, the transparency is inferior and the appearance is inferior. In addition, the total thickness of the transparent conductive laminate is increased, the cost is high, and the productivity is inferior.

こうして保護フィルム２０を貼り合せた透明導電性フィルム１０を熱処理することにより、反りを生じることなく透明導電層３を結晶化させることができる。そして結晶化した
透明導電層３をエッチングしてタッチパネル用の透明導電性積層体を製造することができる。 Thus, by heat-treating the transparent conductive film 10 on which the protective film 20 is bonded, the transparent conductive layer 3 can be crystallized without causing warpage. And the transparent conductive laminated body for touch panels can be manufactured by etching the crystallized transparent conductive layer 3.

以下、本発明を実施例により具体的に説明する。なお、実施例としては図１（ｂ）に示す形態で実施した。   Hereinafter, the present invention will be specifically described by way of examples. In addition, as an Example, it implemented with the form shown in FIG.1 (b).

（透明導電性フィルムの作製）
厚さが１２５μｍのポリエチレンテレフタレート（ＰＥＴ）フィルムの両面に、紫外線硬化型アクリル系樹脂を含むハードコート層形成用組成物（ＤＩＣ社製：ユニディツクＶ−９５００）を、紫外線硬化後の膜厚が３μｍとなるように塗布し、その後紫外線照射して硬化させてハードコート層を形成した。なお、この時、巻取り張力・スピード、乾燥温度を変えて２条件で加工した。 (Preparation of transparent conductive film)
A composition for forming a hard coat layer (DIC: Unidic V-9500) containing an ultraviolet curable acrylic resin on both sides of a polyethylene terephthalate (PET) film having a thickness of 125 μm and a film thickness after UV curing of 3 μm. Then, it was cured by irradiating with ultraviolet rays to form a hard coat layer. At this time, the processing was performed under two conditions by changing the winding tension / speed and the drying temperature.

次に、上記２条件で加工したハードコート層の一方の面に、ＩＴＯをスパッタリングにより膜厚３０ｎｍの透明導電層を形成して、２種類の透明導電性フィルムＡ１及、Ａ２を作製した。   Next, a transparent conductive layer having a thickness of 30 nm was formed by sputtering ITO on one surface of the hard coat layer processed under the above two conditions to produce two types of transparent conductive films A1 and A2.

(保護フィルムの作製)
厚さ５０μｍの二軸延伸ＰＥＴの一方の面に、乾燥後の膜厚が２５μｍになるようにアクリル系粘着剤を塗布し、巻取り張力・スピード、乾燥温度を調整して２種類の保護フィルムＢ１、Ｂ２を作製した。 (Preparation of protective film)
Two types of protective films are applied to one surface of biaxially stretched PET with a thickness of 50 μm by applying an acrylic adhesive so that the film thickness after drying is 25 μm, and adjusting the winding tension / speed and drying temperature. B1 and B2 were produced.

上記で作製した透明導電性フィルムＡ１、Ａ２及び保護フィルムＢ１、Ｂ２のそれぞれの縦方向、横方向、左右斜め４５度方向（Ｄ１、Ｄ２）の熱収縮率を測定した。測定結果を以下の表１に示す。   The thermal contraction rate of each of the transparent conductive films A1 and A2 and the protective films B1 and B2 prepared above in the vertical direction, the horizontal direction, and the 45 ° diagonal direction (D1, D2) was measured. The measurement results are shown in Table 1 below.

Figure 2015030157
Figure 2015030157

＜実施例１＞
前記透明導電性フィルムＡ１の透明導電層が積層されていない面と前記保護フィルムＢ１の粘着層の面とを、貼り合せたときの方向が一致する流れ方向斜め４５度に対する最大熱収縮率の差が０．２％以内となるように、ロール・ツー・ロール方式で加圧して貼り合わせ、その後熱処理をして透明導電性積層体を作製した。 <Example 1>
Difference in maximum heat shrinkage ratio with respect to 45 degrees oblique in the flow direction in which the direction when the transparent conductive layer of the transparent conductive film A1 is not laminated and the surface of the adhesive layer of the protective film B1 coincide with each other. So as to be within 0.2%, pressure was applied by a roll-to-roll method, followed by heat treatment to produce a transparent conductive laminate.

＜実施例２＞
前記透明導電性フィルムＡ２と前記保護フィルムＢ２とを貼り合せた以外は、実施例１と同様にして透明導電性積層体を作製した。 <Example 2>
A transparent conductive laminate was produced in the same manner as in Example 1 except that the transparent conductive film A2 and the protective film B2 were bonded together.

＜比較例１＞
前記透明導電性フィルムＡ１と前記保護フィルムＢ２とを貼り合せた以外は、実施例１と同様にして透明導電性積層体を作製した。 <Comparative Example 1>
A transparent conductive laminate was produced in the same manner as in Example 1 except that the transparent conductive film A1 and the protective film B2 were bonded together.

＜比較例２＞
前記透明導電性フィルムＡ２と前記保護フィルムＢ１とを貼り合せた以外は、実施例１と同様にして透明導電性積層体を作製した。 <Comparative example 2>
A transparent conductive laminate was produced in the same manner as in Example 1 except that the transparent conductive film A2 and the protective film B1 were bonded together.

＜評価＞
実施例１、２及び比較例１、２で得られた透明導電性積層体を、それぞれ３０ｃｍ角にカットし、その後、１５０℃で１時間放置した後、1時間室温で冷却してから、角１、角
２、角３、角４の位置で反りの高さを測定した。なお、上に凸状となるような曲率を持つ角の場合には、裏返して置き、平面からの高さを測定し、その値をマイナスと表示した。結果を以下の表２に示す。 <Evaluation>
The transparent conductive laminates obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were each cut into 30 cm squares, then allowed to stand at 150 ° C. for 1 hour, and then cooled at room temperature for 1 hour. The height of the warp was measured at positions of 1, 2, 2, and 4. In addition, in the case of a corner having a curvature that is convex upward, the corner was turned over, the height from the plane was measured, and the value was displayed as minus. The results are shown in Table 2 below.

Figure 2015030157
Figure 2015030157

＜比較結果＞
実施例１に用いた透明導電性フィルムＡ１と保護フィルムＢ１との組合せは、貼り合せたときの方向が一致する斜め４５度方向の最大熱収縮率の差が０．１７％であり、その四隅の反りは２〜５ｍｍと良好な結果が得られた。また、実施例２に用いた透明導電性フィルムＡ２と保護フィルムＢ２との組合せは、同斜め４５度方向の最大熱収縮率の差が０．０５％であり、その四隅の反りは−１〜３ｍｍと極めて良好な結果が得られた。 <Comparison result>
The combination of the transparent conductive film A1 and the protective film B1 used in Example 1 has a maximum heat shrinkage difference of 0.17% in an oblique 45 degree direction in which the directions when bonded are the same. The warp of 2 to 5 mm was a good result. In addition, the combination of the transparent conductive film A2 and the protective film B2 used in Example 2 has a difference in maximum heat shrinkage in the oblique 45 degree direction of 0.05%, and the warpage at the four corners is -1 to -1. A very good result of 3 mm was obtained.

一方、比較例１に用いた透明導電性フィルムＡ１と保護フィルムＢ２との組合せは、貼り合せたときの方向が一致する斜め４５度方向の最大熱収縮率の差が０．２２％であり、貼り合わせで得られた透明導電性積層体の四隅の反りは−１〜１５ｍｍと大きな値を示した。また、比較例２に用いた透明導電性フィルムＡ２と保護フィルムＢ１との組合せは、同斜め４５度方向の最大熱収縮率の差が０．２０％であり、貼り合わせで得られた透明導電性積層体の四隅の反りは−４〜１０ｍｍと大きな値を示し、実用上問題のある反りが生じた。   On the other hand, the combination of the transparent conductive film A1 and the protective film B2 used in Comparative Example 1 is 0.22% in the difference in the maximum heat shrinkage in the oblique 45 ° direction in which the directions when bonded are the same, The warping of the four corners of the transparent conductive laminate obtained by bonding showed a large value of −1 to 15 mm. In addition, the combination of the transparent conductive film A2 and the protective film B1 used in Comparative Example 2 has a maximum heat shrinkage difference of 0.20% in the oblique 45 degree direction, and the transparent conductive film obtained by bonding. The warp at the four corners of the conductive laminate showed a large value of -4 to 10 mm, and a warp having a practical problem occurred.

本発明は平坦性に優れた透明導電性積層体を提供することができ、例えば透明導電層のパターニング等の要求に応じた後加工が容易であり、各種ディスプレイ用のタッチパネルや太陽電池の透明電極に利用することができる。   The present invention can provide a transparent conductive laminate excellent in flatness, for example, easy post-processing according to requirements such as patterning of a transparent conductive layer, and a transparent electrode for various display touch panels and solar cells. Can be used.

１・・・・透明基材フィルム
２・・・・ハードコート層
３・・・・透明導電層
４・・・・粘着層
５・・・・基材フィルム
１０・・・透明導電性フィルム
２０・・・保護フィルム
３０・・・透明導電性積層体
Ｄ１・・・斜め左４５度方向
Ｄ２・・・斜め右４５度方向 DESCRIPTION OF SYMBOLS 1 ... Transparent substrate film 2 ... Hard coat layer 3 ... Transparent conductive layer 4 ... Adhesive layer 5 ... Base film 10 ... Transparent conductive film 20 ..Protective film 30 ... transparent conductive laminate D1 ... diagonal left 45 degrees direction D2 ... diagonal right 45 degrees direction

Claims (2)

透明基材フィルムの一方の面に少なくともハードコート層と透明導電層を順次積層してなる透明導電性フィルムと、基材フィルムの一方の面に粘着層が形成された保護フィルムの前記粘着層の面とを貼り合わせる貼り合わせ工程と、熱処理をする工程とからなる透明導電性積層体の製造方法において、
前記透明導電性フィルムと保護フィルムとの貼り合せたときの方向が一致する流れ方向斜め４５度に対する最大熱収縮率の差が０．２％以内であることを特徴とする透明導電性積層体の製造方法。 A transparent conductive film formed by sequentially laminating at least a hard coat layer and a transparent conductive layer on one surface of the transparent substrate film; and the adhesive layer of the protective film having an adhesive layer formed on one surface of the substrate film. In the method for producing a transparent conductive laminate comprising a laminating step of laminating the surfaces and a step of heat treatment,
A difference in maximum heat shrinkage with respect to 45 degrees oblique in the flow direction in which directions when the transparent conductive film and the protective film are bonded is within 0.2%. Production method. 前記貼り合わせ工程がロール・ツー・ロール方式で行われることを特徴とする請求項１に記載の透明導電性積層体の製造方法。   The method for producing a transparent conductive laminate according to claim 1, wherein the bonding step is performed by a roll-to-roll method.
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JP2017087604A (en) * 2015-11-12 2017-05-25 東洋インキＳｃホールディングス株式会社 Conductive laminate and metal oxide composition
JP2019073598A (en) * 2017-10-13 2019-05-16 王子ホールディングス株式会社 Film and conductive film
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US11939499B2 (en) 2019-05-28 2024-03-26 Toyobo Co., Ltd. Multilayer film and use of same
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017087604A (en) * 2015-11-12 2017-05-25 東洋インキＳｃホールディングス株式会社 Conductive laminate and metal oxide composition
JP2019073598A (en) * 2017-10-13 2019-05-16 王子ホールディングス株式会社 Film and conductive film
US11934226B2 (en) 2019-02-08 2024-03-19 Toyobo Co., Ltd. Foldable display and portable terminal device
US11997916B2 (en) 2019-02-08 2024-05-28 Toyobo Co., Ltd. Polyester film and use thereof
US11926720B2 (en) 2019-05-28 2024-03-12 Toyobo Co., Ltd. Polyester film and application therefor
US11939499B2 (en) 2019-05-28 2024-03-26 Toyobo Co., Ltd. Multilayer film and use of same
JP7480581B2 (en) 2019-05-28 2024-05-10 東洋紡株式会社 Polyester film and its uses
WO2023068300A1 (en) * 2021-10-22 2023-04-27 日東電工株式会社 Method for producing multilayer body, and multilayer body

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