JP2015012287A - 発光素子パッケージ - Google Patents
発光素子パッケージ Download PDFInfo
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- JP2015012287A JP2015012287A JP2014088135A JP2014088135A JP2015012287A JP 2015012287 A JP2015012287 A JP 2015012287A JP 2014088135 A JP2014088135 A JP 2014088135A JP 2014088135 A JP2014088135 A JP 2014088135A JP 2015012287 A JP2015012287 A JP 2015012287A
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- 238000000465 moulding Methods 0.000 claims abstract description 79
- 239000000463 material Substances 0.000 claims description 18
- 239000011247 coating layer Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000000605 extraction Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 55
- 239000004065 semiconductor Substances 0.000 description 37
- 239000000758 substrate Substances 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 8
- 239000011162 core material Substances 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 230000001788 irregular Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 229910019897 RuOx Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910002704 AlGaN Inorganic materials 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- -1 for example Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
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- 229920005989 resin Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229910005540 GaP Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- DZLPZFLXRVRDAE-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] DZLPZFLXRVRDAE-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/06102—Disposition the bonding areas being at different heights
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/1701—Structure
- H01L2224/1703—Bump connectors having different sizes, e.g. different diameters, heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (22)
- 互いに対向する第1及び第2面を有し、前記第1面上に配置された少なくとも一つのキャビティを含むパッケージボディーと、
前記キャビティ内に実装される少なくとも一つの発光素子と、
前記キャビティ上に配置されたモールディング部材とを含み、
少なくとも一つの第1リセス部が前記キャビティに隣接して配置され、前記少なくとも一つの第1リセス部は前記キャビティの高さより低い高さを有し、
前記少なくとも一つの第1リセス部は、前記パッケージボディーの前記第1面上において前記モールディング部材の境界を定義する、発光素子パッケージ。 - 前記第1リセス部の形状は、前記キャビティの形状と同一である、請求項1に記載の発光素子パッケージ。
- 前記第1面上にある前記キャビティの縁と前記第1リセス部の縁との間の領域上に、前記モールディング部材と前記パッケージボディーとの間に配置されたコーティング層をさらに含む、請求項1に記載の発光素子パッケージ。
- 前記コーティング層は、前記モールディング部材との界面エネルギーが低い物質を含む、請求項3に記載の発光素子パッケージ。
- 前記コーティング層は酸化物またはポリマーを含む、請求項4に記載の発光素子パッケージ。
- 前記発光素子と前記パッケージボディーとの間に配置されるサブマウントをさらに含む、請求項1に記載の発光素子パッケージ。
- 前記パッケージボディーは、
前記サブマウントと隣接して配置された少なくとも一つの第2リセス部をさらに含む、請求項6に記載の発光素子パッケージ。 - 前記サブマウントは、第1方向の幅を有し、第2方向の長さを有し、
前記第1方向において前記サブマウントの幅よりさらに大きい幅を有する前記少なくとも一つの第2リセス部は、前記第2方向に配列された複数の第2リセス部を含む、請求項7に記載の発光素子パッケージ。 - 前記少なくとも一つの第2リセス部は複数の第2リセス部を含み、前記複数の第2リセス部の長さ及び幅は互いに同一である、請求項7に記載の発光素子パッケージ。
- 前記少なくとも一つの第2リセス部は複数の第2リセス部を含み、前記複数の第2リセス部の長さ及び幅は互いに異なる、請求項7に記載の発光素子パッケージ。
- 前記少なくとも一つの第2リセス部の内部の少なくとも一部は空気である、請求項7に記載の発光素子パッケージ。
- 前記少なくとも一つの第2リセス部の内部の少なくとも一部に前記モールディング部材が配置された、請求項7に記載の発光素子パッケージ。
- 前記パッケージボディーと前記発光素子とを電気的に接続するワイヤをさらに含み、
前記ワイヤがボンディングされる前記パッケージボディーのワイヤボンディング領域はラフネスを含む、請求項1に記載の発光素子パッケージ。 - 前記ワイヤボンディング領域の表面平均粗さは1.6μmより大きく、25μmより小さい、請求項14に記載の発光素子パッケージ。
- 前記パッケージボディーはアルミニウムを含み、前記ワイヤは金(Au)を含む、請求項14に記載の発光素子パッケージ。
- 前記第1リセス部の縁は、前記キャビティの縁に最も近い内側縁部である、請求項3に記載の発光素子パッケージ。
- 前記モールディング部材は、前記第1リセス部の縁を越えて拡張されない、請求項3に記載の発光素子パッケージ。
- 互いに対向し、第1高さだけ互いに離隔した第1及び第2面を有するパッケージボディーと、
前記パッケージボディーの前記第1面上に配置され、前記第1高さより低い第2高さを有し、トップにおいて第1幅を有し、ボトムにおいて第2幅を有するキャビティと、
前記キャビティに配置され、膨らんだ形状を有するモールディング部材とを含み、
前記パッケージボディーの前記第1面から前記膨らんだ形状のピークまでの第3高さは、前記第1幅の0.15乃至0.35である、発光素子パッケージ。 - 前記モールディング部材は、前記キャビティに充填される時点である硬化する前の形態において、3,000mPa*secより小さい粘度を有する、請求項19に記載の発光素子パッケージ。
- 前記第1面上に形成され、前記第2高さよりさらに低い高さを有するリセス部や突出部をさらに含み、
前記リセス部や前記突出部が前記キャビティを取り囲むように、前記リセス部や前記突出部は前記第1幅よりさらに大きい幅を有し、前記リセス部や前記突出部の幅は前記パッケージボディーの幅より小さい、請求項19に記載の発光素子パッケージ。 - 前記リセス部や前記突出部は、前記モールディング部材の物質が前記リセス部に流れ込むか、または前記突出部を越えて延びることを防止することで、前記膨らんだ形状の前記ピークは前記第1幅の0.15乃至0.35である、請求項21に記載の発光素子パッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020130074209A KR20150001268A (ko) | 2013-06-27 | 2013-06-27 | 발광 소자 패키지 |
KR10-2013-0074209 | 2013-06-27 |
Publications (3)
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JP2015012287A true JP2015012287A (ja) | 2015-01-19 |
JP2015012287A5 JP2015012287A5 (ja) | 2017-06-08 |
JP6510763B2 JP6510763B2 (ja) | 2019-05-08 |
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JP2014088135A Active JP6510763B2 (ja) | 2013-06-27 | 2014-04-22 | 発光素子パッケージ |
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US (1) | US9356200B2 (ja) |
EP (1) | EP2819186B1 (ja) |
JP (1) | JP6510763B2 (ja) |
KR (1) | KR20150001268A (ja) |
CN (2) | CN104253201B (ja) |
Cited By (1)
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JP2019047123A (ja) * | 2017-09-05 | 2019-03-22 | エルジー イノテック カンパニー リミテッド | 半導体素子パッケージ |
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KR20160038568A (ko) * | 2014-09-30 | 2016-04-07 | (주)포인트엔지니어링 | 복수의 곡면 캐비티를 포함하는 칩 기판 |
US11038086B2 (en) * | 2016-03-07 | 2021-06-15 | Semicon Light Co., Ltd. | Semiconductor light-emitting element and manufacturing method therefor |
DE102016204887A1 (de) * | 2016-03-23 | 2017-09-28 | E.G.O. Elektro-Gerätebau GmbH | Anzeigevorrichtung für ein Elektrogerät und Elektrogerät |
US11715817B2 (en) * | 2018-05-03 | 2023-08-01 | Suzhou Lekin Semiconductor Co., Ltd. | Light-emitting element package and light-emitting element module including same |
JP7252820B2 (ja) * | 2019-04-12 | 2023-04-05 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
Citations (15)
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JPH09307145A (ja) * | 1996-05-13 | 1997-11-28 | Nichia Chem Ind Ltd | 光半導体装置 |
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Also Published As
Publication number | Publication date |
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EP2819186A1 (en) | 2014-12-31 |
CN104253201A (zh) | 2014-12-31 |
CN109390451A (zh) | 2019-02-26 |
US20150001573A1 (en) | 2015-01-01 |
KR20150001268A (ko) | 2015-01-06 |
US9356200B2 (en) | 2016-05-31 |
JP6510763B2 (ja) | 2019-05-08 |
CN104253201B (zh) | 2018-10-30 |
EP2819186B1 (en) | 2016-04-06 |
CN109390451B (zh) | 2022-04-05 |
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