JP2014530496A - ロードステーション - Google Patents
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- JP2014530496A JP2014530496A JP2014530824A JP2014530824A JP2014530496A JP 2014530496 A JP2014530496 A JP 2014530496A JP 2014530824 A JP2014530824 A JP 2014530824A JP 2014530824 A JP2014530824 A JP 2014530824A JP 2014530496 A JP2014530496 A JP 2014530496A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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Abstract
Description
Claims (20)
- 制御された環境を保持するように構成されたチャンバを形成するフレームと、
前記フレームに接続された搬送ロボットと、
前記フレーム内に配置された基板カセットホルダーをそれぞれが有することができる1つまたは2つ以上の基板カセット保持場所
とを備えた基板ロードステーションであって、
前記1つまたは2つ以上の基板カセット保持場所のそれぞれは、各カセットと前記搬送ロボットとの間で基板搬送をもたらすために、前記搬送ロボットとの連絡のために各基板カセットを取り外し可能に所定の位置で支持するように構成され、前記1つまたは2つ以上の基板カセット保持場所は、前記基板ロードステーションの基板カセット保持能力を変えるために1つまたは2つ以上の基板カセットホルダーと他の基板カセットホルダーとの互換性をもたらすように構成される基板ロードステーション。 - 前記基板カセット保持場所のそれぞれは、前記フレーム内に配置され、前記基板カセットが前記搬送ロボットの中心旋回軸と径方向に向かい合うようにそれぞれの基板カセットを保持するように構成される請求項1記載の基板ロードステーション。
- 前記1つまたは2つ以上の基板カセットホルダーのそれぞれは、内部に第1のサイズの基板を有する基板カセットを保持するように構成され、他の前記基板カセットホルダーのそれぞれは、内部に第2のサイズの基板を有する基板カセットを保持するように構成され、前記第1のサイズの基板は前記第2のサイズの基板と異なるサイズを有する請求項1記載の基板ロードステーション。
- 前記基板ロードステーションは基板カセット保持場所の1つまたは2つ以上の階層を備える請求項1記載の基板ロードステーション。
- 前記1つまたは2つ以上の階層は垂直方向に積み重ねられた階層である請求項4記載の基板ロードステーション。
- 前記搬送ロボットは、それぞれの前記階層上の前記基板保持場所のそれぞれにアクセスするように構成される請求項4記載の基板ロードステーション。
- 前記フレームは前記基板カセット保持場所のそれぞれに対応する1つまたは2つ以上のドアを備え、前記基板保持場所は、それぞれのドアの位置に依存するロード位置と搬送ロボットアクセス位置との間を移動するように構成される請求項1記載の基板ロードステーション。
- 前記基板ロードステーションは、2ワイド装置フロントエンドモジュールに対するSEMI規格に規定された空間的な寸法の範囲内に適合するサイズにされる請求項1記載の基板ロードステーション。
- 各基板カセットは少なくとも1つの基板を保持するように構成され、前記少なくとも1つの基板は、発光ダイオードの形成、有機発光ダイオードの形成、および液晶ディスプレイの形成のうちの少なくとも1つのためのものである請求項1記載の基板ロードステーション。
- 基板処理セクションと、
前記基板処理セクションに連絡可能に接続された基板ロードステーション
とを備えた基板処理ツールであって、
前記基板ロードステーションは、
チャンバを形成するフレームと、
前記フレームに接続された搬送ロボットと、
前記フレーム内に配置された基板カセットホルダーをそれぞれが有することができる1つまたは2つ以上の基板カセット保持場所
とを備え、
前記1つまたは2つ以上の基板カセット保持場所のそれぞれは、各カセットと前記搬送ロボットとの間で基板搬送をもたらすために、前記搬送ロボットとの連絡のために各基板カセットを取り外し可能に所定の位置で支持するように構成され、前記1つまたは2つ以上の基板カセット保持場所は、前記基板ロードステーションの基板カセット保持能力を変えるために1つまたは2つ以上の基板カセットホルダーと他の基板カセットホルダーとの互換性をもたらすように構成される基板処理ツール。 - 各基板カセットホルダーは基板保持カセットを自動材料ハンドリングシステムから受け取るように構成される請求項10記載の基板処理ツール。
- 1つまたは2つ以上の基板カセットホルダーのそれぞれは、内部に第1のサイズの基板を有する基板カセットを保持するように構成され、他の前記基板カセットホルダーのそれぞれは、内部に第2のサイズの基板を有する基板カセットを保持するように構成され、前記第1のサイズの基板は前記第2のサイズの基板と異なるサイズを有する請求項10記載の基板処理ツール。
- 前記基板ロードステーションは搬送ロボットおよび前記1つまたは2つ以上の基板カセットホルダーのそれぞれを備え、前記1つまたは2つ以上の他のカセットホルダーのそれぞれは、前記搬送ロボットの径方向の伸長および収縮の軸と径方向に並べられるように前記フレーム内に配置される請求項10記載の基板処理ツール。
- 前記基板ロードステーションは、基板カセット保持場所の1つまたは2つ以上の階層を備える請求項10記載の基板処理ツール。
- 前記1つまたは2つ以上の階層は垂直方向に積み重ねられた階層である請求項14記載の基板処理ツール。
- 前記搬送ロボットは、それぞれの前記階層上の前記基板保持場所のそれぞれにアクセスするように構成される請求項14記載の基板処理ツール。
- 各基板カセットは少なくとも1つの基板を保持するように構成され、前記少なくとも1つの基板は、発光ダイオードの形成、有機発光ダイオードの形成、および液晶ディスプレイの形成のうちの少なくとも1つのためのものである請求項10記載の基板処理ツール。
- 制御された環境を保持するように構成されたチャンバを形成するフレームを有する基板ロードステーションと、
基板カセットホルダー
とを備えた基板処理装置であって、
前記基板カセットホルダーは、基板搬送ロボットによる1つまたは2つ以上の基板カセットからの基板の搬送のために1つまたは並置の2つ以上の基板カセットを保持するように構成され、前記基板カセットホルダーは、基板保持ステーションのカセット保持能力が、選択可能な機構の選択で選択可能であるように、前記選択可能な機構により基板カセット保持能力を定める基板処理装置。 - 前記選択可能な機構は、前記基板カセットホルダーの取り外し可能な取り付けのために構成された1つまたは2つ以上の基板カセットホルダーモジュール、内部に第1のサイズの基板を有する基板カセットを保持するように構成された少なくとも1つの前記基板カセットホルダーモジュール、および内部に第2のサイズの基板を有する基板カセットを保持するように構成された少なくとも1つの他の前記基板カセットホルダーモジュールを備え、前記第1のサイズの基板は前記第2のサイズの基板とは異なるサイズを有する請求項18記載の基板処理装置。
- 各基板カセットは少なくとも1つの基板を保持するように構成され、前記少なくとも1つの基板は、発光ダイオードの形成、有機発光ダイオードの形成、および液晶ディスプレイの形成のうちの少なくとも1つのためのものである請求項18記載の基板処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161534681P | 2011-09-14 | 2011-09-14 | |
US61/534,681 | 2011-09-14 | ||
PCT/US2012/055374 WO2013040330A1 (en) | 2011-09-14 | 2012-09-14 | Load station |
Publications (3)
Publication Number | Publication Date |
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JP2014530496A true JP2014530496A (ja) | 2014-11-17 |
JP2014530496A5 JP2014530496A5 (ja) | 2015-10-01 |
JP6106176B2 JP6106176B2 (ja) | 2017-03-29 |
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JP2014530824A Active JP6106176B2 (ja) | 2011-09-14 | 2012-09-14 | ロードステーション |
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US (1) | US9812343B2 (ja) |
JP (1) | JP6106176B2 (ja) |
KR (1) | KR102058985B1 (ja) |
CN (1) | CN103917466B (ja) |
WO (1) | WO2013040330A1 (ja) |
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US10515834B2 (en) * | 2015-10-12 | 2019-12-24 | Lam Research Corporation | Multi-station tool with wafer transfer microclimate systems |
US9502275B1 (en) * | 2015-10-20 | 2016-11-22 | Lam Research Corporation | Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs |
CN105414943B (zh) * | 2015-12-02 | 2018-06-01 | 深圳创维-Rgb电子有限公司 | 自动装配螺钉的设备和自动化组装*** |
US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
CN109244186B (zh) * | 2018-09-19 | 2024-02-27 | 通威太阳能(安徽)有限公司 | 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法 |
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- 2012-09-14 WO PCT/US2012/055374 patent/WO2013040330A1/en active Application Filing
- 2012-09-14 CN CN201280055812.5A patent/CN103917466B/zh active Active
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US20150249029A1 (en) | 2015-09-03 |
CN103917466B (zh) | 2019-01-04 |
US9812343B2 (en) | 2017-11-07 |
JP6106176B2 (ja) | 2017-03-29 |
CN103917466A (zh) | 2014-07-09 |
KR102058985B1 (ko) | 2020-02-07 |
KR20140076576A (ko) | 2014-06-20 |
WO2013040330A1 (en) | 2013-03-21 |
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