JP2014519996A - 粉末を選択的に溶融させることによって部品を製造するための装置 - Google Patents
粉末を選択的に溶融させることによって部品を製造するための装置 Download PDFInfo
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- JP2014519996A JP2014519996A JP2014510860A JP2014510860A JP2014519996A JP 2014519996 A JP2014519996 A JP 2014519996A JP 2014510860 A JP2014510860 A JP 2014510860A JP 2014510860 A JP2014510860 A JP 2014510860A JP 2014519996 A JP2014519996 A JP 2014519996A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0086—Welding welding for purposes other than joining, e.g. built-up welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Abstract
Description
Claims (10)
- 例えばレーザビームまたは電子ビームなどのビームを生成するための手段と、粉末(2)の層(12)へのビーム衝突の点を移動させるための手段とを備えており、粉末を選択的に溶融させることによって部品を製造するための装置であって、
ビーム(11)による粉末(2)の局所的な溶融の際に生じる溶融した粉末の飛散物(24)を収集するための収集要素(14)であって、該要素に衝突し、あるいは該要素へと落下する溶融した粉末の飛散物(24)を、凝固時に該要素へと付着するような方式で収集するために適しており、ビーム(11)を通すための開口(15)を有している収集要素(14)と、
前記収集要素(14)を粉末(2)の層(12)の上方でビーム(11)と一緒に移動させるように設計された手段とを備えることを特徴とする、装置。 - 収集要素(14)が、フレーム(20)に搭載され、前記収集要素を移動させるための手段が、フレーム(20)を2つの直交する方向に移動させるための手段を備えていることを特徴とする、請求項1に記載の装置。
- 収集要素(14)が、フレーム(20)の内側に配置され、フレーム(20)が、接続アーム(21)を介して収集要素(14)へと接続された周縁(22、23)を有していることを特徴とする、請求項2に記載の装置。
- 収集要素(14)が、ビーム(11)および粒子(24)を通すための開口(15)を有している例えば円板の形態のプレートであり、前記開口が、ビーム(11)の断面よりも大きい断面を有していることを特徴とする、請求項1から3のいずれか一項に記載の装置。
- 前記開口(15)が、上方へと末広がりであり、例えば円錐台の形状であることを特徴とする、請求項4に記載の装置。
- プレート(14)が、上方へと突き出す内周および外周縁(18および19)を有していることを特徴とする、請求項4または5に記載の装置。
- 収集要素(14)が、管状であり、飛散物(24)が、収集要素(14)の内壁(25)に収集されることを特徴とする、請求項1または2に記載の装置。
- 収集要素(14)の高さが、5mmよりも大きいことを特徴とする、請求項7に記載の装置。
- 収集要素(14)が、先細りの断面の中空領域を有していることを特徴とする、請求項7または8に記載の装置。
- 請求項1から9のいずれか一項に記載の装置の助けによって粉末(2)を選択的に溶融させることによって部品を製造する方法であって、粉末(2)がビーム(11)によって溶融させられているときに形成される飛散物(24)の少なくとも一部が、収集要素(14)に衝突または収集要素(14)へと落下した溶融粉末の飛散物(24)の凝固により、収集要素(14)によって収集されるような方式で、ビーム(11)と収集要素(14)とを一緒に移動させることによって層ごとに部品を構築することからなる、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1154415A FR2975320B1 (fr) | 2011-05-20 | 2011-05-20 | Installation de fabrication d'une piece par fusion selective de poudre |
FR1154415 | 2011-05-20 | ||
PCT/FR2012/051076 WO2012160291A1 (fr) | 2011-05-20 | 2012-05-15 | Installation de fabrication d'une pièce par fusion sélective de poudre |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014519996A true JP2014519996A (ja) | 2014-08-21 |
JP5932976B2 JP5932976B2 (ja) | 2016-06-08 |
Family
ID=46321110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014510860A Expired - Fee Related JP5932976B2 (ja) | 2011-05-20 | 2012-05-15 | 粉末を選択的に溶融させることによって部品を製造するための装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20140103015A1 (ja) |
EP (1) | EP2709790B1 (ja) |
JP (1) | JP5932976B2 (ja) |
CN (1) | CN103547397A (ja) |
BR (1) | BR112013029065A2 (ja) |
CA (1) | CA2835541A1 (ja) |
FR (1) | FR2975320B1 (ja) |
RU (1) | RU2603737C2 (ja) |
WO (1) | WO2012160291A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010011059A1 (de) * | 2010-03-11 | 2011-09-15 | Global Beam Technologies Ag | Verfahren und Vorrichtung zur Herstellung eines Bauteils |
BR112015025346A2 (pt) * | 2013-04-05 | 2017-07-18 | Federal Mogul Corp | pistão produzido através do uso de técnicas de fabricação de aditivos |
FR3014339B1 (fr) | 2013-12-06 | 2016-01-08 | Snecma | Procede de fabrication d'une piece par fusion selective de poudre |
US20180345371A1 (en) * | 2017-05-31 | 2018-12-06 | General Electric Company | Apparatus and method for angular and rotational additive manufacturing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06246465A (ja) * | 1993-03-03 | 1994-09-06 | Nippon Steel Corp | レーザー加工装置 |
DE102004031881A1 (de) * | 2004-06-30 | 2006-01-26 | Concept Laser Gmbh | Vorrichtung zum Absaugen von Gasen, Dämpfen und/oder Partikeln aus dem Arbeitsbereich einer Laserbearbeitungsmaschine |
JP2009006350A (ja) * | 2007-06-27 | 2009-01-15 | Sony Corp | レーザ加工装置とその加工方法、デブリ回収機構とその回収方法、並びに表示パネルの製造方法 |
JP2009108348A (ja) * | 2007-10-26 | 2009-05-21 | Panasonic Electric Works Co Ltd | 金属粉末焼結部品の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE504560C2 (sv) * | 1993-05-12 | 1997-03-03 | Ralf Larson | Sätt och anordning för skiktvis framställning av kroppar från pulver |
RU2139783C1 (ru) * | 1997-12-30 | 1999-10-20 | Закрытое акционерное общество "ТехноЛазер" | Устройство для лазерной резки |
EP1149660A1 (en) * | 2000-04-03 | 2001-10-31 | Rexam Beverage Packaging AB | Method and device for dust protection in a laser processing apparatus |
US6593540B1 (en) * | 2002-02-08 | 2003-07-15 | Honeywell International, Inc. | Hand held powder-fed laser fusion welding torch |
FR2935617B1 (fr) * | 2008-09-08 | 2010-10-29 | Commissariat Energie Atomique | Procede et dispositif de traitement d'une surface |
DE102008060046A1 (de) * | 2008-12-02 | 2010-06-10 | Eos Gmbh Electro Optical Systems | Verfahren zum Bereitstellen einer identifizierbaren Pulvermenge und Verfahren zur Herstellung eines Objekts |
-
2011
- 2011-05-20 FR FR1154415A patent/FR2975320B1/fr active Active
-
2012
- 2012-05-15 BR BR112013029065A patent/BR112013029065A2/pt not_active IP Right Cessation
- 2012-05-15 JP JP2014510860A patent/JP5932976B2/ja not_active Expired - Fee Related
- 2012-05-15 CA CA2835541A patent/CA2835541A1/fr not_active Abandoned
- 2012-05-15 RU RU2013156668/02A patent/RU2603737C2/ru not_active IP Right Cessation
- 2012-05-15 US US14/118,623 patent/US20140103015A1/en not_active Abandoned
- 2012-05-15 CN CN201280024405.8A patent/CN103547397A/zh active Pending
- 2012-05-15 WO PCT/FR2012/051076 patent/WO2012160291A1/fr active Application Filing
- 2012-05-15 EP EP12728685.4A patent/EP2709790B1/fr active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06246465A (ja) * | 1993-03-03 | 1994-09-06 | Nippon Steel Corp | レーザー加工装置 |
DE102004031881A1 (de) * | 2004-06-30 | 2006-01-26 | Concept Laser Gmbh | Vorrichtung zum Absaugen von Gasen, Dämpfen und/oder Partikeln aus dem Arbeitsbereich einer Laserbearbeitungsmaschine |
JP2009006350A (ja) * | 2007-06-27 | 2009-01-15 | Sony Corp | レーザ加工装置とその加工方法、デブリ回収機構とその回収方法、並びに表示パネルの製造方法 |
JP2009108348A (ja) * | 2007-10-26 | 2009-05-21 | Panasonic Electric Works Co Ltd | 金属粉末焼結部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
RU2603737C2 (ru) | 2016-11-27 |
EP2709790A1 (fr) | 2014-03-26 |
FR2975320A1 (fr) | 2012-11-23 |
CA2835541A1 (fr) | 2012-11-29 |
CN103547397A (zh) | 2014-01-29 |
BR112013029065A2 (pt) | 2017-02-07 |
JP5932976B2 (ja) | 2016-06-08 |
RU2013156668A (ru) | 2015-06-27 |
WO2012160291A1 (fr) | 2012-11-29 |
FR2975320B1 (fr) | 2015-05-29 |
US20140103015A1 (en) | 2014-04-17 |
EP2709790B1 (fr) | 2019-08-14 |
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