JP2014229714A - Heat radiation structure and manufacturing method of the same - Google Patents

Heat radiation structure and manufacturing method of the same Download PDF

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JP2014229714A
JP2014229714A JP2013107466A JP2013107466A JP2014229714A JP 2014229714 A JP2014229714 A JP 2014229714A JP 2013107466 A JP2013107466 A JP 2013107466A JP 2013107466 A JP2013107466 A JP 2013107466A JP 2014229714 A JP2014229714 A JP 2014229714A
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heat
metal member
resin
mold
heat dissipation
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JP6242590B2 (en
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昭夫 宮本
Akio Miyamoto
昭夫 宮本
満淳 市川
Manjun Ichikawa
満淳 市川
豊 松富
Yutaka Matsutomi
豊 松富
藤井　昌浩
Masahiro Fujii
昌浩 藤井
岡本　昭男
Akio Okamoto
昭男 岡本
利和 岩本
Toshikazu Iwamoto
利和 岩本
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Ube Machinery Corp Ltd
Ube Corp
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Ube Machinery Corp Ltd
Ube Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure capable of obtaining sufficient heat radiation effect, and to provide a manufacturing method of the heat radiation structure.SOLUTION: A heat radiation structure 1 includes: a metal member 10 having heat conductivity; and a resin heat radiation member 20 having heat conductivity. A metal member 10 includes a heat receiving part 18 which receives heat from a heat source 2. The resin heat radiation member 20 is integrally molded with the metal member 10 by injection molding and is provided thermally contacting with the heat receiving part 18. The metal member 10 includes: a first surface 12; a second surface 14; and through holes 16. The resin heat radiation member 20 includes: an engagement part 26 provided at the first surface 12 side; multiple protruding parts 24 provided at the second surface 14 side protruding therefrom; and connection parts 28 which connect the engagement part 26 with the multiple protruding parts 24 through the through holes 16.

Description

本発明は、金属部材と樹脂製放熱部材とを組み合わせた放熱構造体及びその製造方法に関する。   The present invention relates to a heat dissipation structure in which a metal member and a resin heat dissipation member are combined, and a method for manufacturing the same.

従来、発熱する機械や電気部品等の熱源に取り付けられ、熱源の温度を下げるための部品として、放熱体（ヒートシンク）が用いられている。これら放熱体は、一般に、熱が伝導しやすい銅やアルミニウム等の金属により形成されている。しかしながら、銅やアルミニウム等の金属により形成された放熱体は、高熱伝導率ではあるものの、重量が重く、また、製造コストが高いという問題がある。   Conventionally, a radiator (heat sink) is used as a component that is attached to a heat source such as a machine or an electrical component that generates heat and lowers the temperature of the heat source. These heat radiators are generally formed of a metal such as copper or aluminum that easily conducts heat. However, although a heat radiator formed of a metal such as copper or aluminum has high thermal conductivity, there is a problem that the weight is heavy and the manufacturing cost is high.

このような問題を解決するため、近年、高い伝導率を有する金属部材と、熱伝導性樹脂からなる放熱部材とを組み合わせたハイブリッド構造を有する放熱体が提案されている（特許文献１）。このようなハイブリッド構造を有する放熱体によれば、熱伝導性樹脂からなる放熱部材を用いることにより、全体に占める金属部材の比率を減少させることができるため、従来の金属製放熱体よりも重量を軽くすることが可能である。   In order to solve such a problem, in recent years, a heat radiator having a hybrid structure in which a metal member having high conductivity and a heat radiating member made of a heat conductive resin are combined has been proposed (Patent Document 1). According to the heat radiating body having such a hybrid structure, the ratio of the metal member to the whole can be reduced by using the heat radiating member made of the heat conductive resin, so that it is heavier than the conventional metal heat radiating body. Can be lightened.

特開平１１−１７３６９号公報Japanese Patent Laid-Open No. 11-17369

しかしながら、特許文献１の放熱体は、熱源に接触する金属板に、接着剤等によりピン状の樹脂製放熱部材を接着させるものであることから、金属板と樹脂製放熱部材との接着圧力が十分ではないという問題がある。また、特許文献１の放熱体は、金属板と樹脂製放熱部材との接着圧力が十分でないことから、金属板と樹脂製放熱部材との接合箇所の熱抵抗が大きく、熱が滞留しやすいため、十分な放熱効果を得られないおそれがあるという問題がある。   However, since the heat radiator of Patent Document 1 is such that a pin-shaped resin heat radiating member is bonded to a metal plate in contact with a heat source with an adhesive or the like, the bonding pressure between the metal plate and the resin heat radiating member is low. There is a problem that it is not enough. Moreover, since the heat radiation body of patent document 1 has insufficient adhesive pressure of a metal plate and resin-made heat radiating members, since the thermal resistance of the joining location of a metal plate and resin-made heat radiating members is large, heat | fever stays easily. There is a problem that a sufficient heat dissipation effect may not be obtained.

本発明は、十分な放熱効果を得ることが可能な放熱構造体及びその製造方法を提供することを目的とする。   An object of this invention is to provide the thermal radiation structure which can acquire sufficient thermal radiation effect, and its manufacturing method.

以上の課題を解決するために、本発明に係る放熱構造体は、熱伝導性を有する金属部材と、熱伝導性を有する樹脂製放熱部材とを備える放熱構造体であって、前記金属部材は、熱源からの熱を受熱可能な受熱部を有し、前記樹脂製放熱部材は、前記金属部材に射出成形により一体成形されており、前記受熱部と熱的に接触して設けられていることを特徴とする。   In order to solve the above problems, a heat dissipation structure according to the present invention is a heat dissipation structure including a metal member having thermal conductivity and a resin heat dissipation member having thermal conductivity. A heat receiving portion capable of receiving heat from a heat source, and the resin heat radiating member is integrally formed with the metal member by injection molding, and is provided in thermal contact with the heat receiving portion. It is characterized by.

本発明に係る放熱構造体において、前記金属部材は、前記受熱部が設けられた第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有することが好ましい。前記樹脂製放熱部材は、前記第１の面側に設けられた係止部と、前記第２の面側に突出して設けられた複数の突出部と、前記貫通孔を介して前記係止部と各突出部とを連結する連結部とを有するとしても良く、前記第１の面側に設けられた前記係止部には、複数の突出部が突出して設けられるとしても良い。また、前記樹脂製放熱部材は、前記第１の面側に設けられた第１係止部と、前記第２の面側に設けられた第２係止部と、前記貫通孔を介して前記第１係止部と前記第２係止部とを連結する連結部とを有し、前記第１係止部及び前記第２係止部の少なくとも一方に、複数の突出部が突出して設けられるとしても良い。   In the heat dissipation structure according to the present invention, the metal member includes a first surface provided with the heat receiving portion, a second surface facing in a direction different from the first surface, and the first surface from the first surface. It is preferable to have a plurality of through holes penetrating over the second surface. The resin heat radiation member includes a locking portion provided on the first surface side, a plurality of protruding portions provided protruding on the second surface side, and the locking portion via the through hole. And a connecting portion that connects each protruding portion, and the locking portion provided on the first surface side may be provided with a plurality of protruding portions. Further, the resin heat radiation member includes a first locking portion provided on the first surface side, a second locking portion provided on the second surface side, and the through hole. A connecting portion that connects the first locking portion and the second locking portion, and at least one of the first locking portion and the second locking portion is provided with a plurality of protruding portions protruding from the first locking portion; It is also good.

また、本発明に係る放熱構造体において、前記樹脂製放熱部材は、熱伝導率に異方性を付与する熱伝導率調整材を含有しており、前記受熱部から熱的に離れる方向への配向度が０．２５を超えることが好ましい。   Moreover, in the heat dissipation structure according to the present invention, the resin heat dissipation member contains a thermal conductivity adjusting material that imparts anisotropy to the thermal conductivity, and is in a direction that is thermally separated from the heat receiving portion. It is preferable that the degree of orientation exceeds 0.25.

本発明に係る放熱構造体の製造方法は、熱伝導性を有する金属部材と、熱伝導性を有する樹脂製放熱部材とを備える放熱構造体を射出成形により成形する放熱構造体の製造方法であって、前記金属部材を金型内に配置させる配置工程と、前記金属部材における熱源からの熱を受熱可能な受熱部となる領域を被覆した状態において、前記金型内に樹脂材料を充填させ、前記金属部材に前記樹脂製放熱部材を一体成形させる成形工程とを備えることを特徴とする。   A method for manufacturing a heat dissipation structure according to the present invention is a method for manufacturing a heat dissipation structure in which a heat dissipation structure including a metal member having thermal conductivity and a resin heat dissipation member having thermal conductivity is formed by injection molding. In the state where the metal member is disposed in the mold, and in the state where the metal member is covered with a region that becomes a heat receiving portion capable of receiving heat from a heat source, the mold is filled with a resin material, And a molding step of integrally molding the resin heat dissipation member on the metal member.

本発明に係る放熱構造体の製造方法において、前記配置工程は、前記受熱部が設けられる第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有する金属部材を金型内に配置させる工程であることが好ましい。前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた係止部と、前記第２の面側に突出して設けられた複数の突出部と、前記貫通孔を介して前記係止部と各突出部とを連結する連結部とを有する樹脂製放熱部材を一体成形させる工程であるとしても良い。また、前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた係止部と、前記係止部上に設けられた複数の第１突出部と、前記第２の面側に突出して設けられた複数の第２突出部と、前記貫通孔を介して前記係止部と各第２突出部とを連結する連結部とを有する樹脂製放熱部材を一体成形させる工程であるとしても良い。さらに、前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた第１係止部と、前記第２の面側に設けられた第２係止部と、前記貫通孔を介して前記第１係止部と前記第２係止部とを連結する連結部と、前記第１係止部及び前記第２係止部の少なくとも一方に設けられた突出部とを有する樹脂製放熱部材を一体成形させる工程であるとしても良い。   In the method for manufacturing a heat dissipation structure according to the present invention, the arranging step includes a first surface on which the heat receiving portion is provided, a second surface facing in a direction different from the first surface, and the first surface. It is preferable that it is the process of arrange | positioning the metal member which has several through-hole penetrated over the said 2nd surface in a metal mold | die. In the molding step, a resin material is filled in the mold in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is provided on the first surface side. And a plurality of protrusions provided to protrude toward the second surface side, and a connecting portion that connects the engagement part and each protrusion through the through hole. It may be a step of integrally forming the heat dissipating member. In the molding step, the metal material is filled with a resin material in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is filled with the first surface side. A plurality of first protrusions provided on the engagement part, a plurality of second protrusions provided protruding on the second surface side, and the through hole. It is good also as a process of integrally forming the resin-made heat radiating member which has the connecting part which connects the above-mentioned locking part and each 2nd projection part via. Further, in the molding step, the metal material is filled with a resin material in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is filled with the first surface side. The first locking portion provided on the second surface, the second locking portion provided on the second surface side, and the first locking portion and the second locking portion are connected via the through hole. It is good also as the process of integrally forming the resin-made heat radiating member which has the connection part to perform, and the projection part provided in at least one of the 1st locking part and the 2nd locking part.

また、本発明に係る放熱構造体の製造方法において、前記樹脂材料は、熱伝導率に異方性を付与する熱伝導率調整材を含有しており、前記成形工程は、前記金型内に前記樹脂材料を充填させる際に、前記金型内のキャビティ容積を所定の方向に変動させ、前記キャビティ容積の変動方向への前記熱伝導率調整材の配向度を０．２５より大きくさせる変動工程を更に備えることが好ましい。   Moreover, in the manufacturing method of the heat dissipation structure according to the present invention, the resin material contains a thermal conductivity adjusting material that imparts anisotropy to thermal conductivity, and the molding step is performed in the mold. When filling the resin material, the changing step of changing the cavity volume in the mold in a predetermined direction and making the degree of orientation of the thermal conductivity adjusting material in the changing direction of the cavity volume larger than 0.25. Is preferably further provided.

本発明によれば、十分な放熱効果を得ることが可能な放熱構造体及びその製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the thermal radiation structure which can acquire sufficient thermal radiation effect, and its manufacturing method can be provided.

第１実施形態に係る放熱構造体の受熱面側の概略構成を示す斜視図である。It is a perspective view which shows schematic structure by the side of the heat receiving surface of the thermal radiation structure which concerns on 1st Embodiment. 第１実施形態に係る放熱構造体の放熱面側の概略構成を示す斜視図である。It is a perspective view which shows schematic structure by the side of the thermal radiation of the thermal radiation structure which concerns on 1st Embodiment. 図１のＡ−Ａ´線に沿った概略断面図である。It is a schematic sectional drawing in alignment with the AA 'line of FIG. 図１のＢ−Ｂ´線に沿った概略断面図である。It is a schematic sectional drawing in alignment with the BB 'line of FIG. 第１実施形態に係る放熱構造体に用いられる金属部材の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the metal member used for the thermal radiation structure which concerns on 1st Embodiment. 第１実施形態に係る放熱構造体の製造工程の例を示す工程図である。図６（ａ）は、金型の型開き状態を示す模式図である。図６（ｂ）は、金型内に金属部材を配置させた状態を示す模式図である。図６（ｃ）は、金型内に樹脂材料を射出充填させた状態を示す模式図である。図６（ｄ）は、成形された放熱構造体を取り出す状態を示す模式図である。It is process drawing which shows the example of the manufacturing process of the thermal radiation structure which concerns on 1st Embodiment. Fig.6 (a) is a schematic diagram which shows the mold open state of a metal mold | die. FIG.6 (b) is a schematic diagram which shows the state which has arrange | positioned the metal member in a metal mold | die. FIG. 6C is a schematic view showing a state in which a resin material is injected and filled into a mold. FIG.6 (d) is a schematic diagram which shows the state which takes out the shape | molded heat dissipation structure. 樹脂製放熱体を２種類の樹脂材料で製造する工程の例を示す工程図である。図７（ａ）は、金型内に金属部材を配置させた状態を示す模式図である。図７（ｂ）は、可動側金型の金型面を変更させた状態を示す模式図である。図７（ｃ）は、金型内に第２の樹脂材料を射出充填させた状態を示す模式図である。図７（ｄ）は、成形された放熱構造体を取り出す状態を示す模式図である。It is process drawing which shows the example of the process of manufacturing a resin-made heat radiator with two types of resin materials. Fig.7 (a) is a schematic diagram which shows the state which has arrange | positioned the metal member in a metal mold | die. FIG.7 (b) is a schematic diagram which shows the state which changed the metal mold | die surface of the movable side metal mold | die. FIG.7 (c) is a schematic diagram which shows the state which injected and filled the 2nd resin material in the metal mold | die. FIG. 7D is a schematic diagram showing a state in which the molded heat dissipation structure is taken out. 樹脂製放熱体を３種類の樹脂材料で成形した場合の放熱構造体の例を示す概略断面図である。It is a schematic sectional drawing which shows the example of the thermal radiation structure at the time of shape | molding the resin-made thermal radiation body with three types of resin materials. 第２実施形態に係る放熱構造体における樹脂製放熱部材の熱伝導率調整材の配向状態を示す模式図である。It is a schematic diagram which shows the orientation state of the heat conductivity adjusting material of the resin-made heat radiating members in the heat radiating structure which concerns on 2nd Embodiment. 第２実施形態に係る放熱構造体の製造工程の例を示す工程図である。図１０（ａ）は、金型の型開き状態を示す模式図である。図１０（ｂ）は、金型内に金属部材を配置させた状態を示す模式図である。図１０（ｃ）は、金型内に樹脂材料を射出充填させた状態を示す模式図である。図１０（ｄ）は、樹脂材料の射出充填中に金型を少量だけ型開きさせた状態を示す模式図である。図１０（ｅ）は、成形された放熱構造体を取り出す状態を示す模式図である。It is process drawing which shows the example of the manufacturing process of the thermal radiation structure which concerns on 2nd Embodiment. Fig.10 (a) is a schematic diagram which shows the mold open state of a metal mold | die. FIG.10 (b) is a schematic diagram which shows the state which has arrange | positioned the metal member in a metal mold | die. FIG.10 (c) is a schematic diagram which shows the state which injected and filled the resin material in the metal mold | die. FIG. 10D is a schematic view showing a state where the mold is opened by a small amount during injection filling of the resin material. FIG. 10E is a schematic diagram showing a state where the molded heat dissipation structure is taken out. 成形工程における金型内の樹脂の流動経路及び熱伝導率調整材の向きを図示した模式図である。図１１（ａ）は、金型内に樹脂材料を射出充填させた状態を示す模式図である。図１１（ｂ）は、樹脂材料の射出充填中に金型を少量だけ型開きさせた状態を示す模式図である。It is the schematic diagram which illustrated the flow path of the resin in the metal mold | die in a shaping | molding process, and the direction of a heat conductivity adjusting material. Fig.11 (a) is a schematic diagram which shows the state which injected and filled the resin material in the metal mold | die. FIG. 11B is a schematic diagram showing a state where the mold is opened by a small amount during injection filling of the resin material. 通常の射出成形により樹脂製放熱体を成形した場合における熱伝導率調整材の状態を示す模式図である。It is a schematic diagram which shows the state of the heat conductivity adjusting material at the time of shape | molding the resin-made heat radiator by normal injection molding. 熱伝導率に異方性を付与する熱伝導率調整材の配向度と該配向度に対する熱伝導率を示すグラフである。It is a graph which shows the thermal conductivity with respect to the orientation degree of the thermal conductivity adjusting material which provides anisotropy to thermal conductivity, and this orientation degree.

次に、本発明に係る放熱構造体の第１実施形態について、図１〜図６を参照しながら詳細に説明する。図１〜図４は、第１実施形態に係る放熱構造体１の概略構成を示す斜視図又は断面図である。図５は、第１実施形態において使用される金属部材１０の概略構成を示す斜視図である。図６は、第１実施形態に係る放熱構造体１の製造工程の一例を示す工程図である。   Next, a first embodiment of a heat dissipation structure according to the present invention will be described in detail with reference to FIGS. FIGS. 1-4 is a perspective view or sectional drawing which shows schematic structure of the thermal radiation structure 1 which concerns on 1st Embodiment. FIG. 5 is a perspective view showing a schematic configuration of the metal member 10 used in the first embodiment. FIG. 6 is a process diagram illustrating an example of a manufacturing process of the heat dissipation structure 1 according to the first embodiment.

第１実施形態に係る放熱構造体１は、例えば自動車用ハイパワーＬＥＤ等の熱源２の冷却のために用いられる放熱体（ヒートシンク）である。第１実施形態に係る放熱構造体１は、例えば図１〜図４に示すように、熱伝導率が相対的に高い金属部材１０と、熱伝導率が相対的に低い樹脂製放熱部材２０とを組み合わせたハイブリッド構造を有している。   The heat dissipating structure 1 according to the first embodiment is a heat dissipating body (heat sink) used for cooling a heat source 2 such as a high power LED for automobiles. The heat dissipation structure 1 according to the first embodiment includes, for example, as shown in FIGS. 1 to 4, a metal member 10 having a relatively high thermal conductivity, and a resin heat dissipation member 20 having a relatively low thermal conductivity. Has a hybrid structure.

第１実施形態に係る放熱構造体１は、図１及び図２に示すように、熱源２が設置される受熱面（表面）４と、受熱面４と異なる方向を向く放熱面（裏面）６を有している。受熱面４は、図１、図３及び図４に示すように、樹脂製放熱部材２０の板状部（係止部）２６の略中央部が矩形状に開口することにより、金属部材１０の一部が露出され、この露出された金属部材１０の部分が、熱源２を設置する受熱部１８として機能するよう構成されている。また、受熱面４の受熱部１８を除く領域には、樹脂製放熱部材２０の第１放熱フィン部２２（第１突出部）が一方向に並列して複数設けられている。放熱面６には、樹脂製放熱部材２０の第２放熱フィン部（第２突出部）２４が一方向に並列して複数設けられている。以上のような構成を有する放熱構造体１は、金属部材１０の受熱部１８が熱源２と熱的に接触することにより、熱源２から発生した熱を金属部材１０の全体に伝達させ、金属部材１０と熱的に接触した樹脂製放熱部材２０を介して、大気中に放熱させるように機能する。以下、このような第１実施形態に係る放熱構造体１を構成する金属部材１０及び樹脂製放熱部材２０の具体的な構成について、詳細に説明する。   As shown in FIGS. 1 and 2, the heat dissipating structure 1 according to the first embodiment includes a heat receiving surface (front surface) 4 on which the heat source 2 is installed, and a heat dissipating surface (back surface) 6 facing in a different direction from the heat receiving surface 4. have. As shown in FIGS. 1, 3, and 4, the heat receiving surface 4 is formed by opening a substantially central portion of the plate-like portion (locking portion) 26 of the resin heat radiating member 20 in a rectangular shape. A part of the metal member 10 is exposed, and the exposed portion of the metal member 10 is configured to function as the heat receiving portion 18 where the heat source 2 is installed. Further, a plurality of first heat radiating fin portions 22 (first projecting portions) of the resin heat radiating member 20 are provided in parallel in one direction in a region excluding the heat receiving portion 18 of the heat receiving surface 4. The heat radiating surface 6 is provided with a plurality of second heat radiating fin portions (second projecting portions) 24 of the resin heat radiating member 20 in parallel in one direction. In the heat dissipation structure 1 having the above-described configuration, the heat receiving portion 18 of the metal member 10 is in thermal contact with the heat source 2 to transmit heat generated from the heat source 2 to the entire metal member 10. It functions to dissipate heat into the atmosphere through the resin heat dissipating member 20 that is in thermal contact with the air. Hereinafter, specific configurations of the metal member 10 and the resin heat radiating member 20 constituting the heat radiating structure 1 according to the first embodiment will be described in detail.

金属部材１０は、例えば銅やアルミニウム等の金属材料から形成されており、図５に示すように、表面（第１の面）１２及び裏面（第１の面と異なる方向を向く第２の面）１４を有する矩形板状に形成されている。また、金属部材１０は、表面１２から裏面１４に亘って貫通する複数の貫通孔１６を有している。これら複数の貫通孔１６は、円形状の孔であり、金属部材１０の縦方向及び横方向にそれぞれ千鳥配置となるように形成されている。このような金属部材１０としては、例えば金属板にパンチ加工を施すことにより製造される金属製多孔板（パンチングメタル）を用いることができる。金属部材１０の表面１２及び裏面１４には、樹脂製放熱部材２０との接触面積を増大させるために、微小な凹凸を設けることが好ましい。   The metal member 10 is formed of a metal material such as copper or aluminum, for example, and as shown in FIG. 5, a front surface (first surface) 12 and a back surface (second surface facing a different direction from the first surface). ) 14 is formed in a rectangular plate shape. Further, the metal member 10 has a plurality of through holes 16 penetrating from the front surface 12 to the back surface 14. The plurality of through holes 16 are circular holes, and are formed in a staggered arrangement in the vertical direction and the horizontal direction of the metal member 10. As such a metal member 10, for example, a metal perforated plate (punched metal) produced by punching a metal plate can be used. In order to increase the contact area with the resin heat radiation member 20, it is preferable to provide minute irregularities on the front surface 12 and the back surface 14 of the metal member 10.

樹脂製放熱部材２０は、図１〜図４に示すように、金属部材１０の表面１２上に積層された板状部２６と、板状部２６上に一方向に並列して立設された複数の第１放熱フィン部２２と、金属部材１０の裏面１４上に第１放熱フィン部２２と同方向に並列して立設された複数の第２放熱フィン部２４と、板状部２６と第２放熱フィン部２４とを金属部材１０の貫通孔１６を介して連結する連結部２８とを備えている。これら板状部２６、第１放熱フィン部２２、第２放熱フィン部２４及び連結部２８は、熱伝導性を有する樹脂材料により一体成形されている。   As shown in FIGS. 1 to 4, the resin heat radiation member 20 is erected in parallel in one direction on the plate-like portion 26 laminated on the surface 12 of the metal member 10 and the plate-like portion 26. A plurality of first radiating fin portions 22, a plurality of second radiating fin portions 24 erected in parallel with the first radiating fin portion 22 on the back surface 14 of the metal member 10, and a plate-like portion 26 A connecting portion 28 that connects the second radiating fin portion 24 via the through hole 16 of the metal member 10 is provided. The plate-like portion 26, the first radiating fin portion 22, the second radiating fin portion 24, and the connecting portion 28 are integrally formed of a resin material having thermal conductivity.

板状部２６は、図３及び図４に示すように、金属部材１０の表面１２及び側面を覆うように設けられており、その略中央部に略矩形状の開口３０が形成されている。この板状部２６は、第２放熱フィン部２４を金属部材１０の裏面１４上に離脱不能に密着させるための係止部として機能する。板状部２６の四隅には、放熱構造体１を設置対象に設置させるための取り付け孔３２が形成されている（図１及び図２参照）。各第１放熱フィン部２２は、金属部材１０の縦方向又は横方向に沿って延びる矩形平板形状を有しており、板状部２６上に垂直に立設されている。また、各第１放熱フィン部２２は、板状部２６から離れる方向に向かって先細状となる断面台形形状を有している。各第２放熱フィン部２４は、金属部材１０の縦方向又は横方向に沿って延びる矩形平板形状を有しており、金属部材１０の裏面１４上に垂直に立設されている。各第２放熱フィン部２４は、第１放熱フィン部２２の高さよりも高い高さを有しており、第１放熱フィン部２２よりも放熱効率が高くなるように構成されている。また、各第２放熱フィン部２４は、金属部材１０から離れる方向に向かって先細状となる断面台形形状を有している。連結部２８は、図４に示すように、各第２放熱フィン部２４の長手方向の少なくとも両端部、本実施形態においては各第２放熱フィン部２４の長手方向に沿って複数設けられている。一の連結部２８と隣接する連結部２８との間隔は、狭ピッチであることが好ましい。   As shown in FIGS. 3 and 4, the plate-like portion 26 is provided so as to cover the surface 12 and the side surface of the metal member 10, and a substantially rectangular opening 30 is formed at a substantially central portion thereof. The plate-like portion 26 functions as a locking portion for bringing the second radiating fin portion 24 into intimate contact with the back surface 14 of the metal member 10. At the four corners of the plate-like portion 26, attachment holes 32 for installing the heat dissipation structure 1 on the installation target are formed (see FIGS. 1 and 2). Each first heat radiating fin portion 22 has a rectangular flat plate shape extending along the vertical direction or the horizontal direction of the metal member 10, and is erected vertically on the plate-like portion 26. In addition, each first radiating fin portion 22 has a trapezoidal cross-sectional shape that tapers in a direction away from the plate-like portion 26. Each second radiating fin portion 24 has a rectangular flat plate shape extending along the vertical direction or the horizontal direction of the metal member 10, and is erected vertically on the back surface 14 of the metal member 10. Each second radiating fin portion 24 has a height higher than that of the first radiating fin portion 22, and is configured to have a higher radiating efficiency than the first radiating fin portion 22. Each of the second heat radiating fin portions 24 has a trapezoidal cross section that tapers in a direction away from the metal member 10. As shown in FIG. 4, a plurality of connecting portions 28 are provided along at least both ends in the longitudinal direction of each second radiating fin portion 24, and in the present embodiment, along the longitudinal direction of each second radiating fin portion 24. . It is preferable that the space | interval of the one connection part 28 and the adjacent connection part 28 is a narrow pitch.

樹脂製放熱部材２０を形成する樹脂材料の樹脂としては、射出成形が可能な熱可塑性樹脂であれば、良く、例えば、高密度ポリエチレン（ＨＤＰＥ）、中密度ポリエチレン（ＭＤＰＥ）、低密度ポリエチレン（ＬＤＰＥ）、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）、超高分子量ポリエチレン（ＵＨＭＷＰＥ）、ポリプロピレン（ＰＰ）、エチレン／プロピレン共重合体（ＥＰＲ）、エチレン／ブテン共重合体（ＥＢＲ）、エチレン／酢酸ビニル共重合体（ＥＶＡ）、エチレン／アクリル酸共重合体（ＥＡＡ）、エチレン／メタクリル酸共重合体（ＥＭＡＡ）、エチレン／アクリル酸メチル共重合体（ＥＭＡ）、エチレン／メタクリル酸メチル共重合体（ＥＭＭＡ）、エチレン／アクリル酸エチル共重合体（ＥＥＡ）等のポリオレフィン系樹脂及び、アクリル酸、メタクリル酸、マレイン酸、フマル酸、イタコン酸、クロトン酸、メサコン酸、シトラコン酸、グルタコン酸、シス−４−シクロヘキセン−１，２−ジカルボン酸、エンドビシクロ−［２．２．１］−５−ヘプテン−２，３−ジカルボン酸等のカルボキシル基及びその金属塩（Ｎａ、Ｚｎ、Ｋ、Ｃａ、Ｍｇ）、無水マレイン酸、無水イタコン酸、無水シトラコン酸、エンドビシクロ−［２．２．１］−５−ヘプテン−２，３−ジカルボン酸無水物等の酸無水物基、アクリル酸グリシジル、メタクリル酸グリシジル、エタクリル酸グリシジル、イタコン酸グリシジル、シトラコン酸グリシジル等のエポキシ基等の官能基が含有された化合物により変性された、上記ポリオレフィン系樹脂、ポリブチレンテレフタレート（ＰＢＴ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリトリメチレンテレフタレート（ＰＴＴ）、ポリエチレンイソフタレート（ＰＥＩ）、ＰＥＴ／ＰＥＩ共重合体、ポリアリレート（ＰＡＲ）、ポリブチレンナフタレート（ＰＢＮ）、ポリエチレンナフタレート（ＰＥＮ）、液晶ポリエステル（ＬＣＰ）、ポリ乳酸（ＰＬＡ）、ポリグリコール酸（ＰＧＡ）等のポリエステル系樹脂、ポリアセタール（ＰＯＭ）、ポリフェニレンオキシド（ＰＰＯ）等のポリエーテル系樹脂、ポリスルホン（ＰＳＦ）、ポリエーテルスルホン（ＰＥＳ）等のポリスルホン系樹脂、ポリフェニレンサルファイド樹脂（ＰＰＳ）、ポリチオエーテルスルホン樹脂（ＰＴＥＳ）等のポリチオエーテル系樹脂、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリアリルエーテルケトン（ＰＡＥＫ）等のポリケトン系樹脂、ポリアクリロニトリル（ＰＡＮ）、ポリメタクリロニトリル、アクリロニトリル／スチレン共重合体（ＡＳ）、メタクリロニトリル／スチレン共重合体、アクリロニトリル／ブタジエン／スチレン共重合体（ＡＢＳ）、メタクリロニトリル／スチレン／ブタジエン共重合体（ＭＢＳ）等のポリニトリル系樹脂、ポリメタクリル酸メチル（ＰＭＭＡ）、ポリメタクリル酸エチル（ＰＥＭＡ）等のポリメタクリレート系樹脂、ポリ酢酸ビニル（ＰＶＡｃ）等のポリビニルエステル系樹脂、ポリ塩化ビニリデン（ＰＶＤＣ）、ポリ塩化ビニル（ＰＶＣ）、塩化ビニル／塩化ビニリデン共重合体、塩化ビニリデン／メチルアクリレート共重合体等のポリビニル系樹脂、酢酸セルロース、酪酸セルロース等のセルロース系樹脂、ポリカーボネート（ＰＣ）等のポリカーボネート系樹脂、熱可塑性ポリイミド（ＰＩ）、ポリアミドイミド（ＰＡＩ）、ポリエーテルイミド等のポリイミド系樹脂、ポリフッ化ビニリデン（ＰＶＤＦ）、ポリフッ化ビニル（ＰＶＦ）、エチレン／テトラフルオロエチレン共重合体（ＥＴＦＥ）、ポリクロロトリフルオロエチレン（ＰＣＴＦＥ）、エチレン／クロロトリフルオロエチレン共重合体（ＥＣＴＦＥ）、テトラフルオロエチレン／ヘキサフルオロプロピレン共重合体（ＴＦＥ／ＨＦＰ，ＦＥＰ）、テトラフルオロエチレン／ヘキサフルオロプロピレン／フッ化ビニリデン共重合体（ＴＦＥ／ＨＦＰ／ＶＤＦ，ＴＨＶ）、テトラフルオロエチレン／パーフルオロ（アルキルビニルエーテル）共重合体（ＰＦＡ）等のフッ素系樹脂、ポリウレタンエラストマー等の熱可塑性ポリウレタン系樹脂、ポリアミド系樹脂等が挙げられる。これらは１種又は２種以上を用いることができる。これらの中でも、成形性等の取り扱いの容易さや高い耐熱性、機械強度からポリアミド樹脂が好ましい。   The resin of the resin material forming the resin heat radiating member 20 may be any thermoplastic resin that can be injection molded. For example, high-density polyethylene (HDPE), medium-density polyethylene (MDPE), and low-density polyethylene (LDPE). ), Linear low density polyethylene (LLDPE), ultra high molecular weight polyethylene (UHMWPE), polypropylene (PP), ethylene / propylene copolymer (EPR), ethylene / butene copolymer (EBR), ethylene / vinyl acetate co Polymer (EVA), ethylene / acrylic acid copolymer (EAA), ethylene / methacrylic acid copolymer (EMAA), ethylene / methyl acrylate copolymer (EMA), ethylene / methyl methacrylate copolymer (EMMA) ), Polyolefin trees such as ethylene / ethyl acrylate copolymer (EEA) And acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, mesaconic acid, citraconic acid, glutaconic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, endobicyclo- [2.2. 1] -5-heptene-2,3-dicarboxylic acid and other carboxyl groups and metal salts thereof (Na, Zn, K, Ca, Mg), maleic anhydride, itaconic anhydride, citraconic anhydride, endobicyclo- [2 2.1] Acid anhydride groups such as 5-heptene-2,3-dicarboxylic acid anhydride, epoxy groups such as glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, glycidyl citraconic acid, etc. The above-mentioned polyolefin resin modified with a compound containing a functional group, polybutylene terephthalate (P T), polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polyethylene isophthalate (PEI), PET / PEI copolymer, polyarylate (PAR), polybutylene naphthalate (PBN), polyethylene naphthalate (PEN) ), Polyester resins such as liquid crystalline polyester (LCP), polylactic acid (PLA), polyglycolic acid (PGA), polyether resins such as polyacetal (POM) and polyphenylene oxide (PPO), polysulfone (PSF), polyether Polysulfone resins such as sulfone (PES), polythioether resins such as polyphenylene sulfide resin (PPS) and polythioether sulfone resin (PTES), polyether ether ketone (PEEK), polyallyl ether -Polyketone resins such as terketone (PAEK), polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile / styrene copolymer (AS), methacrylonitrile / styrene copolymer, acrylonitrile / butadiene / styrene copolymer (ABS) ), Polynitrile resins such as methacrylonitrile / styrene / butadiene copolymer (MBS), polymethacrylate resins such as polymethyl methacrylate (PMMA) and polyethyl methacrylate (PEMA), polyvinyl acetate (PVAc), etc. Polyvinyl ester resins, polyvinylidene chloride (PVDC), polyvinyl chloride (PVC), polyvinyl chloride / vinylidene chloride copolymers, polyvinylidene chloride / methyl acrylate copolymers, etc., cellulose acetate, cellulose butyrate Cellulose resins such as polycarbonate (PC), polycarbonate resins such as polycarbonate (PC), polyimide resins such as thermoplastic polyimide (PI), polyamideimide (PAI), and polyetherimide, polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF) ), Ethylene / tetrafluoroethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), ethylene / chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene / hexafluoropropylene copolymer (TFE / HFP) , FEP), tetrafluoroethylene / hexafluoropropylene / vinylidene fluoride copolymer (TFE / HFP / VDF, THV), tetrafluoroethylene / perfluoro (alkyl vinyl ether) copolymer (PFA) Fluorine-based resins, thermoplastic polyurethane resins and polyurethane elastomers and the like, polyamide resins. These can use 1 type (s) or 2 or more types. Among these, polyamide resin is preferable from the viewpoint of ease of handling such as moldability, high heat resistance, and mechanical strength.

ポリアミド系樹脂としては、例えば、ポリアミド６、ポリアミド１１、ポリアミド１２、ポリアミド２６、ポリアミド４６、ポリアミド６６、ポリアミド６９、ポリアミド６１０、ポリアミド６１１、ポリアミド６１２、ポリアミド６Ｔ、ポリアミド６I、ポリアミド６Ｔ、ポリアミド９６、ポリアミド９９、ポリアミド９１０、ポリアミド９１２、ポリアミド６２、ポリアミド８２、ポリアミド９２、ポリアミド１０２、ポリアミド１２２、ポリアミド９Ｔ、ポリアミドＴＭＨＴ、ポリアミド９Ｔ、ポリアミド９Ｎ、ポリアミド１０６、ポリアミド１０９、ポリアミド１０１０、ポリアミド１０１２、ポリアミド１０Ｔ、ポリアミド１０Ｔ、ポリアミド１０Ｎ、ポリアミド１２６、ポリアミド１２９、ポリアミド１２１０、ポリアミド１２１２、ポリアミド１２Ｔ、ポリアミド１２Ｔ、ポリアミド１２Ｎ、ポリアミドＭＸＤ６、ポリアミドＭＸＤ８、ポリアミドＭＸＤ９、ポリアミドＭＸＤ１０、ポリアミドＭＸＤ１２、ポリアミドＭＸＤＴ、ポリアミドＭＸＤＩ、ポリアミドＭＸＤＮ、ポリアミドＰＡＣＭ１２、ポリアミドＰＡＣＭＴ、ポリアミドＰＡＣＭＩ、ポリアミドジメチルＰＡＣＭ１２、ポリアミドＩＰＤ６、ポリアミドＩＰＤＴやこれらのポリアミド共重合体が挙げられる。この中でも放熱構造体の機械的特性および耐薬品性などの材料機能と価格のバランスの観点から、ポリアミド６、ポリアミド１２、ポリアミド６６、ポリアミド９２、ポリアミド６／６６共重合体（ポリアミド６とポリアミド６６の共重合体、以下、共重合体は同様に記載）、ポリアミド６／１２共重合体、ポリアミド６／６６／１２共重合体及びポリアミド６２／９２共重合体よりなる群から選択される少なくとも１種のポリアミド系樹脂が好ましく、ポリアミド６、ポリアミド６６、ポリアミド６／６６共重合体及びポリアミド６／１２共重合体よりなる群から選択される少なくとも１種のポリアミド系樹脂がより好ましく、放熱構造体の成形性、機械物性、耐久性の観点から、ポリアミド６および／またはポリアミド６６がより好ましい。これらは１種又は２種以上を用いることができる。   Examples of polyamide resins include polyamide 6, polyamide 11, polyamide 12, polyamide 26, polyamide 46, polyamide 66, polyamide 69, polyamide 610, polyamide 611, polyamide 612, polyamide 6T, polyamide 6I, polyamide 6T, polyamide 96, Polyamide 99, Polyamide 910, Polyamide 912, Polyamide 62, Polyamide 82, Polyamide 92, Polyamide 102, Polyamide 122, Polyamide 9T, Polyamide TMHT, Polyamide 9T, Polyamide 9N, Polyamide 106, Polyamide 109, Polyamide 1010, Polyamide 1012, Polyamide 10T , Polyamide 10T, polyamide 10N, polyamide 126, polyamide 129, polyamide 1210, polyamide 121 2, Polyamide 12T, Polyamide 12T, Polyamide 12N, Polyamide MXD6, Polyamide MXD8, Polyamide MXD9, Polyamide MXD10, Polyamide MXD12, Polyamide MXDT, Polyamide MXDI, Polyamide MXDN, Polyamide PACM12, Polyamide PACMT, Polyamide PACMI, Polyamide dimethyl PACM12, Polyamide IPD6 And polyamide IPDT and polyamide copolymers thereof. Among these, polyamide 6, polyamide 12, polyamide 66, polyamide 92, polyamide 6/66 copolymer (polyamide 6 and polyamide 66 are used from the viewpoint of balance between material functions such as mechanical characteristics and chemical resistance of the heat dissipation structure and price. Copolymer, hereinafter referred to as copolymer), at least one selected from the group consisting of polyamide 6/12 copolymer, polyamide 6/66/12 copolymer and polyamide 62/92 copolymer A kind of polyamide resin is preferable, and at least one kind of polyamide resin selected from the group consisting of polyamide 6, polyamide 66, polyamide 6/66 copolymer and polyamide 6/12 copolymer is more preferable. From the viewpoint of moldability, mechanical properties, and durability, polyamide 6 and / or polyamide 66 are more preferred. . These can use 1 type (s) or 2 or more types.

尚、ポリアミド樹脂の末端基の種類及びその濃度や分子量分布に特別の制約は無く、分子量調節や成形加工時の溶融安定化のため、分子量調節剤として、酢酸、ステアリン酸等のモノカルボン酸、メタキシリレンジアミン、イソホロンジアミン等のジアミン、モノアミン、ジカルボン酸のうちの１種あるいは２種以上を適宜組合せて添加することができる。   In addition, there is no special restriction on the type and concentration and molecular weight distribution of the end group of the polyamide resin, and for molecular weight adjustment and melt stabilization at the time of molding, as a molecular weight regulator, monocarboxylic acids such as acetic acid and stearic acid, One or more of diamines such as metaxylylenediamine and isophoronediamine, monoamines, and dicarboxylic acids can be added in appropriate combination.

また、樹脂製放熱部材２０を形成する樹脂材料は、熱伝導率調整材を含み、その熱伝導率調整材として、例えば、ガラス繊維、ガラスビーズ、シリカゲル、石英等酸化ケイ素類や、酸化アルミニウム、酸化アルミニウム、酸化マグネシウム、酸化ベリリウム、酸化チタン、酸化ジルコニウム、酸化亜鉛、酸化セリウム等の金属酸化物や、窒化ホウ素、窒化アルミニウム、窒化ケイ素等の窒素化合物や、ウォラストナイト、タルク、カオリン、ゾノトライト、マイカ、ゼオライト等の鉱物類や、炭化ケイ素、ダイヤモンド、グラファイト、炭素繊維、鱗片状黒鉛、フラーレン、カーボンナノチューブ等炭素化合物や、チタン酸バリウム、チタン酸カリウム、硫酸カルシウム、珪酸カルシウム等が挙げられる。これらは１種又は２種以上を用いることができる。また、これらの熱伝導率調整材は、配向制御したときの熱伝導率の観点から、所定のアスペクト比を有する長尺形状のものが好ましい。また、必要に応じて、酸化防止剤、帯電防止剤、難燃剤、難燃助剤、熱安定剤、繊維状補強材等を添加してもよい。繊維状補強材としては、上記ガラス繊維や炭素繊維の他、アラミド繊維、アルミナ繊維、炭化珪素繊維、アスベスト繊維、石膏繊維、金属繊維等が挙げられる。   In addition, the resin material forming the resin heat dissipation member 20 includes a thermal conductivity adjusting material. Examples of the thermal conductivity adjusting material include silicon oxides such as glass fiber, glass beads, silica gel, and quartz, aluminum oxide, Metal oxides such as aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, zirconium oxide, zinc oxide, cerium oxide, nitrogen compounds such as boron nitride, aluminum nitride, silicon nitride, wollastonite, talc, kaolin, zonotrite And minerals such as mica and zeolite, carbon compounds such as silicon carbide, diamond, graphite, carbon fiber, flaky graphite, fullerene and carbon nanotubes, barium titanate, potassium titanate, calcium sulfate, calcium silicate, etc. . These can use 1 type (s) or 2 or more types. In addition, these thermal conductivity adjusting materials are preferably elongated in shape having a predetermined aspect ratio from the viewpoint of thermal conductivity when orientation control is performed. Moreover, you may add antioxidant, an antistatic agent, a flame retardant, a flame retardant adjuvant, a heat stabilizer, a fibrous reinforcement, etc. as needed. Examples of the fibrous reinforcing material include aramid fibers, alumina fibers, silicon carbide fibers, asbestos fibers, gypsum fibers, metal fibers and the like in addition to the glass fibers and carbon fibers.

次に、第１実施形態に係る放熱構造体１を製造する方法の一例について、図６を用いて説明する。本実施形態において例示する方法は、概略的には、金属部材１０を金型４０内に配置させ、金属部材１０における熱源２からの熱を受熱可能な受熱部１８となる領域を被覆した状態において、金型４０内に熱伝導性を有する樹脂材料を充填させ、金属部材１０に樹脂製放熱部材２０を一体成形（インサート成形又はアウトサート成形）させる方法である。以下、本実施形態に係る製造方法に使用可能な金型４０と、放熱構造体１を製造するための具体的な方法について、詳細に説明する。   Next, an example of a method for manufacturing the heat dissipation structure 1 according to the first embodiment will be described with reference to FIG. The method illustrated in the present embodiment is generally in a state where the metal member 10 is disposed in the mold 40 and the region that becomes the heat receiving portion 18 capable of receiving heat from the heat source 2 in the metal member 10 is covered. In this method, the mold 40 is filled with a resin material having thermal conductivity, and the resin heat radiation member 20 is integrally formed (insert molding or outsert molding) on the metal member 10. Hereinafter, the metal mold 40 that can be used in the manufacturing method according to this embodiment and a specific method for manufacturing the heat dissipation structure 1 will be described in detail.

本実施形態に係る製造方法に使用可能な金型４０は、図６に示すように、射出成形装置の固定盤（図示せず）に取り付けられた固定金型４２と、射出成形装置の可動盤（図示せず）に取り付けられた可動金型４４とから構成されている。これら固定金型４２及び可動金型４４は、型締めされることにより、金属部材１０に樹脂製放熱部材２０を一体成形させるための金型キャビティ４６が形成されるように構成されている。固定金型４２は、射出ユニット（図示せず）から射出された溶融樹脂が金型キャビティ４６内に向けて流動する樹脂流路（図示せず）と、この樹脂流路の金型キャビティ４６内に連通されるゲート部分に設けられた樹脂流路開閉機構（図示せず）とを有している。樹脂流路は、内部の溶融樹脂を溶融状態で流動・保持させるための保温・加熱手段を備えたホットランナとすることができる。可動金型４４は、型開閉機構（図示せず）により固定金型４２に対して接近若しくは離間する方向に移動可能に構成されている。可動金型４４は、金属部材１０の受熱部１８となる領域を被覆するための被覆用金型ブロック４８が内蔵されている。また、固定金型４２及び可動金型４４は、それぞれ、金型キャビティ４６内において金属部材１０を狭持するための保持用金型ブロック（図示せず）が内蔵されている。これら被覆用金型ブロック４８及び保持用金型ブロックは、例えば油圧、空圧及びスプリング等の適宜の手段により、金属部材１０に対して進退可能に構成されている。なお、図６に示す金型４０は、本実施形態に係る製造方法に使用可能な金型の一例であり、これに限定されず、金属部材１０に樹脂製放熱部材２０を一体成形（インサート成形又はアウトサート成形）させることが可能なものであれば、いかなるものを用いても良い。   As shown in FIG. 6, the mold 40 that can be used in the manufacturing method according to the present embodiment includes a fixed mold 42 attached to a fixed plate (not shown) of the injection molding apparatus, and a movable plate of the injection molding apparatus. It is comprised from the movable metal mold | die 44 attached to (not shown). The fixed mold 42 and the movable mold 44 are configured so that a mold cavity 46 for integrally molding the resin heat radiation member 20 to the metal member 10 is formed by clamping. The fixed mold 42 includes a resin flow path (not shown) through which molten resin injected from an injection unit (not shown) flows into the mold cavity 46, and the mold cavity 46 in the resin flow path. And a resin flow path opening / closing mechanism (not shown) provided at the gate portion communicating with the. The resin flow path can be a hot runner provided with heat retaining / heating means for allowing the molten resin inside to flow and hold in a molten state. The movable mold 44 is configured to be movable in a direction approaching or separating from the fixed mold 42 by a mold opening / closing mechanism (not shown). The movable mold 44 incorporates a coating mold block 48 for covering a region that becomes the heat receiving portion 18 of the metal member 10. Each of the fixed mold 42 and the movable mold 44 includes a holding mold block (not shown) for holding the metal member 10 in the mold cavity 46. The covering mold block 48 and the holding mold block are configured to be movable back and forth with respect to the metal member 10 by appropriate means such as hydraulic pressure, pneumatic pressure, and a spring. The mold 40 shown in FIG. 6 is an example of a mold that can be used in the manufacturing method according to the present embodiment. The mold 40 is not limited to this, and the resin heat radiating member 20 is integrally formed with the metal member 10 (insert molding). Alternatively, any material may be used as long as it can be subjected to outsert molding.

このような金型４０を用いて放熱構造体１を製造するためには、まず、図６（ａ）に示す型開き状態において、固定金型４２と可動金型４４との間に金属部材１０を挿入し、適宜のタイミングで、金属部材１０を固定金型４２及び可動金型４４の保持用金型ブロックにより狭持させる。次に、図６（ｂ）に示すように、固定金型４２と可動金型４４とを型閉じ及び型締めさせると共に、被覆用金型ブロック４８を金属部材１０の受熱部１８となる領域に当接させる。これにより、金属部材１０が、受熱部１８となる領域が被覆された状態において、金型キャビティ４６内に配置される（配置工程）。次に、この状態において、図６（ｃ）に示すように、第１放熱フィン部２２及び第２放熱フィン部２４の長手方向（固定金型４２及び可動金型４４の内面に形成された溝が延びる方向）に沿って、金型キャビティ４６内に溶融状態の熱伝導性樹脂材料を射出充填する（射出充填工程）。金型キャビティ４６内に射出された熱伝導性樹脂材料は、金属部材１０の表面１２及び側面と可動金型４４の内面により形成される空間４６ａを流動すると共に、金属部材１０の貫通孔１６を介して金属部材１０の裏面１４と固定金型４２の内面により形成される空間４６ｂを流動し、金型キャビティ４６内に充填される。その後所定の期間、金型キャビティ４６内に充填された熱伝導性樹脂材料を冷却固化させることにより、金属部材１０と、樹脂製放熱部材２０とからなる放熱構造体１が成形される。そして最後に、図６（ｄ）に示すように、可動金型４４を固定金型４２から離間させることにより金型４０を型開きさせ、図示しない製品取出手段により放熱構造体１を金型４０外へ搬出させる。以上の成形サイクルを繰り返し実行することにより、放熱構造体１を連続して成形することができる。   In order to manufacture the heat dissipation structure 1 using such a mold 40, first, the metal member 10 is interposed between the fixed mold 42 and the movable mold 44 in the mold open state shown in FIG. Is inserted, and the metal member 10 is held between the fixed mold 42 and the holding mold block of the movable mold 44 at an appropriate timing. Next, as shown in FIG. 6 (b), the fixed mold 42 and the movable mold 44 are closed and clamped, and the covering mold block 48 is placed in the region to be the heat receiving portion 18 of the metal member 10. Make contact. Thereby, the metal member 10 is arrange | positioned in the metal mold | die cavity 46 in the state in which the area | region used as the heat receiving part 18 was coat | covered (arrangement | positioning process). Next, in this state, as shown in FIG. 6C, the longitudinal direction of the first radiating fin portion 22 and the second radiating fin portion 24 (grooves formed on the inner surfaces of the fixed die 42 and the movable die 44). In the mold cavity 46, the molten heat conductive resin material is injection-filled along the direction (in the extending direction) (injection filling step). The thermally conductive resin material injected into the mold cavity 46 flows through the space 46 a formed by the surface 12 and the side surface of the metal member 10 and the inner surface of the movable mold 44, and passes through the through hole 16 of the metal member 10. Through the space 46 b formed by the back surface 14 of the metal member 10 and the inner surface of the fixed mold 42, and fills the mold cavity 46. Thereafter, the heat conductive resin material filled in the mold cavity 46 is cooled and solidified for a predetermined period, whereby the heat dissipation structure 1 including the metal member 10 and the resin heat dissipation member 20 is formed. Finally, as shown in FIG. 6D, the mold 40 is opened by separating the movable mold 44 from the fixed mold 42, and the heat radiating structure 1 is moved to the mold 40 by a product take-out means (not shown). Take it out. By repeatedly executing the above molding cycle, the heat dissipation structure 1 can be continuously molded.

第１実施形態に係る放熱構造体１によれば、金属部材と樹脂製放熱部材とを組み合わせたハイブリッド構造を有する放熱構造体であっても、十分な放熱効果を得ることが可能である。すなわち、第１実施形態に係る放熱構造体１は、金属部材１０が、熱源２からの熱を受熱可能な受熱部１８を有し、樹脂製放熱部材２０が、金属部材１０の受熱部１８と熱的に接触して設けられている。これにより、熱伝導率が相対的に低い樹脂製放熱部材２０に先行して、熱伝導率が相対的に高い金属部材１０が熱源２からの熱を受熱し、金属部材１０の全体に熱を分散させた状態にて樹脂製放熱部材２０に伝達させることができるため、熱伝導率が相対的に低い樹脂製放熱部材２０を用いても効率的に放熱させることが可能となる。また、第１実施形態に係る放熱構造体１は、樹脂製放熱部材２０が金属部材１０に射出成形により一体成形（インサート成形又はアウトサート成形）されている。これにより、金属部材１０と樹脂製放熱部材２０との界面を密着させることができ、十分な接触圧力を確保することができるため、熱抵抗を大幅に減少させることができ、熱の滞留を抑えることが可能となる。   According to the heat dissipation structure 1 according to the first embodiment, a sufficient heat dissipation effect can be obtained even with a heat dissipation structure having a hybrid structure in which a metal member and a resin heat dissipation member are combined. That is, in the heat dissipation structure 1 according to the first embodiment, the metal member 10 has the heat receiving portion 18 that can receive the heat from the heat source 2, and the resin heat dissipation member 20 is connected to the heat receiving portion 18 of the metal member 10. It is provided in thermal contact. Thereby, prior to the resin heat radiation member 20 having a relatively low thermal conductivity, the metal member 10 having a relatively high thermal conductivity receives heat from the heat source 2 and heats the entire metal member 10. Since it can be transmitted to the resin heat radiating member 20 in a dispersed state, it is possible to efficiently dissipate heat even if the resin heat radiating member 20 having a relatively low thermal conductivity is used. In the heat dissipation structure 1 according to the first embodiment, the resin heat dissipation member 20 is integrally formed (insert molding or outsert molding) on the metal member 10 by injection molding. As a result, the interface between the metal member 10 and the resin heat radiating member 20 can be brought into close contact, and sufficient contact pressure can be ensured, so that the thermal resistance can be greatly reduced, and heat retention is suppressed. It becomes possible.

また、第１実施形態に係る放熱構造体１は、金属部材１０が、受熱部１８が設けられた第１の面（表面）１２と、第１の面１２と異なる方向を向く第２の面（裏面）１４と、第１の面１２から第２の面１４に亘って貫通する複数の貫通孔１６とを有し、また、樹脂製放熱部材２０が、第１の面側に設けられた板状部（係止部）２６と、第２の面側に突出して設けられた複数の第２放熱フィン部（突出部）２４と、貫通孔１６を介して係止部２６と各突出部２４とを連結する連結部２８とを有している。特に、第１実施形態に係る放熱構造体１は、樹脂製放熱部材２０の連結部２８が、放熱フィン（第１放熱フィン部２２及び第２放熱フィン部２４）の長手方向の少なくとも両端部、好ましくは放熱フィンの長手方向に沿って狭ピッチで複数設けられている。これにより、連結部２８を介して接続された係止部２６と突出部２４とを連結部２８の軸方向（貫通孔１６の貫通方向）に発生する冷却固化収縮力によって金属部材１０を強固に狭持させることができるため、金属部材１０と樹脂製放熱部材２０との界面をより一層密着させることができ、放熱効率をより一層向上させることができる。   Further, in the heat dissipation structure 1 according to the first embodiment, the metal member 10 has a first surface (surface) 12 provided with the heat receiving portion 18 and a second surface facing a different direction from the first surface 12. (Rear surface) 14 and a plurality of through holes 16 penetrating from the first surface 12 to the second surface 14, and the resin heat dissipating member 20 is provided on the first surface side. A plate-like portion (locking portion) 26, a plurality of second radiating fin portions (protruding portions) 24 provided protruding from the second surface side, and the locking portion 26 and each protruding portion via the through-hole 16. 24 and a connecting portion 28 that connects the two. In particular, in the heat dissipation structure 1 according to the first embodiment, the connecting portion 28 of the resin heat dissipation member 20 has at least both end portions in the longitudinal direction of the heat dissipation fins (the first heat dissipation fin portion 22 and the second heat dissipation fin portion 24), Preferably, a plurality are provided at a narrow pitch along the longitudinal direction of the radiating fin. As a result, the metal member 10 is solidified by the cooling and solidification contraction force generated in the axial direction of the connecting portion 28 (through direction of the through hole 16) between the engaging portion 26 and the protruding portion 24 connected via the connecting portion 28. Since it can be pinched, the interface between the metal member 10 and the resin heat radiating member 20 can be further adhered, and the heat radiation efficiency can be further improved.

第１実施形態に係る放熱構造体１において、樹脂製放熱部材２０は、１種類の樹脂材料から形成されるものとして説明したが、これに限定されず、２種以上の樹脂材料から成形しても良い。   In the heat dissipation structure 1 according to the first embodiment, the resin heat dissipating member 20 has been described as being formed from one type of resin material, but is not limited thereto, and is molded from two or more types of resin materials. Also good.

まず、樹脂製放熱体を２種類の樹脂材料から成形する態様について、図７を用いて説明する。図７は、樹脂製放熱体を２種類の樹脂材料で製造する工程の例を示す工程図である。樹脂製放熱体を２種類の樹脂材料から成形する場合には、前述の可動金型４４に代えて、図７に示すような回転金型５０を使用した金型４０´を用いることができる。なお、固定金型４２は、前述の固定金型４２と同様のものを用いることが可能である。回転金型５０は、型開閉機構（図示せず）により固定金型４２に対して接近若しくは離間する方向に移動可能に構成されている。また、回転金型５０は、回転機構（図示せず）により回転軸（図示せず）を中心として回転可能に構成されている。回転金型５０は、固定金型４２との間に第１金型キャビティ５２を形成可能な第１金型面５０ａと、固定金型４２との間に第２金型キャビティ５４を形成可能な第２金型面５０ｂとを有している。第１金型面５０ａには、金属部材１０の一部の貫通孔１６を閉塞可能な突起５６が適宜設けられている。第１金型キャビティ５２は、放熱構造体１´の放熱面側を成形するためのキャビティ空間であり、第２金型キャビティ５４は、放熱構造体１´の受熱面側を成形するためのキャビティ空間である。回転金型５０には、前述の可動金型４４と同様に、金属部材１０の受熱部１８となる領域を被覆するための被覆用金型ブロック４８と、金属部材１０を狭持するための保持用金型ブロック（図示せず）とが内蔵されている。なお、図７に示す金型４０´は、積層成形に使用可能な金型の一例であり、これに限定されず、金属部材１０に２種以上の樹脂材料からなる樹脂製放熱部材２０´を一体成形（インサート成形又はアウトサート成形）させることが可能なものであれば、いかなるものを用いても良い。   First, the aspect which shape | molds a resin-made heat radiator from two types of resin materials is demonstrated using FIG. FIG. 7 is a process diagram showing an example of a process of manufacturing a resin heat radiator with two types of resin materials. In the case where the resin radiator is molded from two types of resin materials, a mold 40 ′ using a rotating mold 50 as shown in FIG. 7 can be used instead of the movable mold 44 described above. The fixed mold 42 can be the same as the fixed mold 42 described above. The rotary mold 50 is configured to be movable in a direction approaching or separating from the fixed mold 42 by a mold opening / closing mechanism (not shown). Further, the rotating mold 50 is configured to be rotatable about a rotating shaft (not shown) by a rotating mechanism (not shown). The rotary mold 50 can form a second mold cavity 54 between the first mold surface 50 a capable of forming the first mold cavity 52 between the rotating mold 50 and the fixed mold 42. And a second mold surface 50b. On the first mold surface 50a, a protrusion 56 capable of closing a part of the through hole 16 of the metal member 10 is appropriately provided. The first mold cavity 52 is a cavity space for molding the heat dissipation surface side of the heat dissipation structure 1 ′, and the second mold cavity 54 is a cavity for molding the heat receiving surface side of the heat dissipation structure 1 ′. It is space. In the rotary mold 50, similarly to the movable mold 44 described above, a coating mold block 48 for covering the region to be the heat receiving portion 18 of the metal member 10 and a holding for holding the metal member 10 are held. A mold block (not shown) is built in. The mold 40 ′ shown in FIG. 7 is an example of a mold that can be used for laminate molding. The mold 40 ′ is not limited to this, and a resin heat radiating member 20 ′ made of two or more kinds of resin materials is provided on the metal member 10. Any material that can be integrally molded (insert molding or outsert molding) may be used.

このような固定金型４２及び回転金型５０を用いて樹脂製放熱体を２種類の樹脂材料から成形する方法について、図７を用いて説明する。まず、図７（ａ）に示すように、固定金型４２と回転金型５０の第１金型面５０ａとの間において金属部材１０を保持用金型ブロックにより狭持させ、固定金型４２と回転金型５０とを型閉じ及び型締めさせる。これにより、金属部材１０の一部の貫通孔１６が突起５６によって塞がれた状態において、金属部材１０が第１金型キャビティ５２内に配置される（配置工程）。次に、この状態において、図７（ｂ）に示すように、第２放熱フィン部２４´の長手方向（固定金型４２の内面に形成された溝が延びる方向）に沿って、第１金型キャビティ５２内に溶融状態の第１の樹脂材料を射出充填する（第１射出充填工程）。その後所定の期間、第１金型キャビティ５２内に充填された第１の樹脂材料を冷却固化させることにより、金属部材１０の裏面１４上に積層された板状部２５´と、板状部２５´上に立設された複数の第２放熱フィン部２４´と、突起５６によって塞がれていない貫通孔１６内に充填された連結部２８ａ´とからなる放熱面側の構造体５８が成形される。そして、放熱面側の構造体５８が成形された後、回転金型５０を固定金型４２から離間させると共に、回転金型５０を回転させ、第２金型面５０ｂを固定金型４２と対向させる。次に、図７（ｃ）に示すように、固定金型４２と回転金型５０とを型閉じ及び型締めさせると共に、被覆用金型ブロック４８を金属部材１０の受熱部１８となる領域に当接させる。次に、この状態において、第１放熱フィン部２２´の長手方向（回転金型５０の内面に形成された溝が延びる方向）に沿って、第２金型キャビティ５４内に溶融状態の第２の樹脂材料を射出充填する（第２射出充填工程）。その後所定の期間、第２金型キャビティ５４内に充填された第２の樹脂材料を冷却固化させることにより、金属部材１０の表面１２上に積層された板状部２６´と、板状部２６´上に立設された複数の第１放熱フィン部２２´と、第１射出充填工程において突起５６によって塞がれていた貫通孔１６内に充填された連結部２８ｂ´とからなる受熱面側の構造体６０が成形される。ここで、放熱面側の構造体５８と受熱面側の構造体６０は、いずれも樹脂材料から成形されているため、相互に接着して一体的に成形される。これにより、金属部材１０と、放熱面側の構造体５８及び受熱面側の構造体６０からなる樹脂製放熱部材２０´とが一体となり、放熱構造体１´が成形される。そして最後に、図７（ｄ）に示すように、回転金型５０を固定金型４２から離間させることにより金型４０´を型開きさせ、図示しない製品取出手段により放熱構造体１´を金型４０´外へ搬出させる。以上の成形サイクルを繰り返し実行することにより、２種類の樹脂材料を積層させた放熱構造体１´を連続して成形することができる。   A method of molding a resin heat radiator from two types of resin materials using such a fixed mold 42 and a rotating mold 50 will be described with reference to FIG. First, as shown in FIG. 7A, the metal member 10 is held between the fixed mold 42 and the first mold surface 50 a of the rotating mold 50 by the holding mold block, and the fixed mold 42. And the rotary mold 50 are closed and clamped. Thereby, the metal member 10 is arranged in the first mold cavity 52 in a state where a part of the through holes 16 of the metal member 10 is blocked by the protrusions 56 (arrangement step). Next, in this state, as shown in FIG. 7B, along the longitudinal direction of the second radiating fin portion 24 '(the direction in which the groove formed on the inner surface of the fixed mold 42 extends), the first metal The mold cavity 52 is filled with a molten first resin material (first injection filling step). Thereafter, by cooling and solidifying the first resin material filled in the first mold cavity 52 for a predetermined period, a plate-like portion 25 ′ laminated on the back surface 14 of the metal member 10, and the plate-like portion 25. The structure 58 on the heat radiating surface side is formed by a plurality of second heat radiating fin portions 24 ′ standing on the ′ and the connecting portions 28 a ′ filled in the through holes 16 not covered by the protrusions 56. Is done. Then, after the structure 58 on the heat radiating surface side is formed, the rotating mold 50 is separated from the fixed mold 42 and the rotating mold 50 is rotated so that the second mold surface 50 b faces the fixed mold 42. Let Next, as shown in FIG. 7 (c), the stationary mold 42 and the rotating mold 50 are closed and clamped, and the covering mold block 48 is placed in the region to be the heat receiving portion 18 of the metal member 10. Make contact. Next, in this state, a second molten state is formed in the second mold cavity 54 along the longitudinal direction of the first radiating fin portion 22 ′ (the direction in which the groove formed on the inner surface of the rotating mold 50 extends). The resin material is injected and filled (second injection filling step). Thereafter, by cooling and solidifying the second resin material filled in the second mold cavity 54 for a predetermined period, the plate-like portion 26 ′ laminated on the surface 12 of the metal member 10, and the plate-like portion 26. 'A plurality of first heat radiating fin portions 22' erected on the heat receiving surface side including the connecting portion 28b 'filled in the through hole 16 closed by the projection 56 in the first injection filling step The structure 60 is formed. Here, since the structure 58 on the heat radiating surface side and the structure 60 on the heat receiving surface side are both formed from a resin material, they are bonded together and formed integrally. As a result, the metal member 10 and the resin heat radiating member 20 ′ including the heat radiating surface side structure 58 and the heat receiving surface side structure 60 are integrated to form the heat radiating structure 1 ′. Finally, as shown in FIG. 7 (d), the mold 40 'is opened by separating the rotating mold 50 from the fixed mold 42, and the heat dissipation structure 1' is formed by the product take-out means (not shown). It is carried out of the mold 40 '. By repeatedly executing the above molding cycle, the heat dissipation structure 1 ′ in which two types of resin materials are laminated can be continuously molded.

放熱面側の構造体５８は、優れた熱伝導性を有する必要があることから、放熱面側の構造体５８を成形するための第１の樹脂材料は、第１実施形態に係る放熱構造体１の樹脂製放熱部材２０と同様に、熱伝導性を有する樹脂材料を用いることが好ましい。一方、受熱面側の構造体６０は、優れた熱伝導性能が要求されない場合があり、この場合には、例えば第１の樹脂材料よりも剛性に優れた樹脂材料や、絶縁性を有する樹脂材料等から成形することが可能である。   Since the structure 58 on the heat radiating surface side needs to have excellent thermal conductivity, the first resin material for forming the structure 58 on the heat radiating surface side is the heat radiating structure according to the first embodiment. It is preferable to use a resin material having thermal conductivity, similarly to the resin heat radiation member 20 of FIG. On the other hand, the heat receiving surface side structure 60 may not be required to have excellent heat conduction performance. In this case, for example, a resin material having higher rigidity than the first resin material, or a resin material having insulation properties. It is possible to mold from the above.

また、例えば図８に示すように、金属部材１０の表面１２側に成形される受熱面側の構造体６２と、金属部材１０の裏面１４側に成形される放熱面側の構造体６４と、金属部材１０の貫通孔１６内に充填される連結部６６とを異なる樹脂材料から成形することも可能である。   For example, as shown in FIG. 8, the heat receiving surface side structure 62 formed on the front surface 12 side of the metal member 10, and the heat dissipation surface side structure 64 formed on the back surface 14 side of the metal member 10, It is also possible to form the connecting portion 66 filled in the through hole 16 of the metal member 10 from a different resin material.

次に、本発明に係る放熱構造体の第２実施形態について、図９〜図１１を参照しながら詳細に説明する。図９は、第２実施形態に係る放熱構造体１００における樹脂製放熱部材１２０の熱伝導率調整材１２１の配向状態を示す模式図である。図１０は、第２実施形態に係る放熱構造体１００の製造工程の一例を示す工程図である。図１１は、成形工程における金型４０内の樹脂の流動経路及び熱伝導率調整材１２１の向きを図示した模式図である。なお、第２実施形態に係る放熱構造体１００の基本的な構成は、第１実施形態に係る放熱構造体１と概ね同様であるため、説明を省略する。   Next, 2nd Embodiment of the thermal radiation structure which concerns on this invention is described in detail, referring FIGS. 9-11. FIG. 9 is a schematic diagram illustrating an orientation state of the thermal conductivity adjusting member 121 of the resin heat dissipation member 120 in the heat dissipation structure 100 according to the second embodiment. FIG. 10 is a process diagram illustrating an example of a manufacturing process of the heat dissipation structure 100 according to the second embodiment. FIG. 11 is a schematic diagram illustrating the flow path of the resin in the mold 40 and the direction of the thermal conductivity adjusting material 121 in the molding process. Note that the basic configuration of the heat dissipation structure 100 according to the second embodiment is substantially the same as that of the heat dissipation structure 1 according to the first embodiment, and a description thereof will be omitted.

第２実施形態に係る放熱構造体１００の樹脂製放熱部材１２０は、熱伝導率に異方性を付与する熱伝導率調整材である熱伝導率調整材１２１を１種以上含有している。熱伝導率調整材１２１は、図９に示すように、例えば線状若しくは棒状等の所定のアスペクト比を有する長尺形状を有している。   The resin heat radiation member 120 of the heat dissipation structure 100 according to the second embodiment contains one or more kinds of heat conductivity adjusting materials 121 that are heat conductivity adjusting materials that impart anisotropy to the heat conductivity. As shown in FIG. 9, the thermal conductivity adjusting material 121 has a long shape having a predetermined aspect ratio such as a linear shape or a rod shape.

樹脂製放熱部材１２０は、金属板部材１０の受熱部１８から熱的に離れる方向に樹脂製放熱部材１２０に含有される熱伝導率調整材１２１の配向度が０．２５を超える。ここで、受熱部１８から熱的に離れる方向とは、受熱部１８により受けた熱源２からの熱が放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）を介して大気中に放散されるまでの熱の流れの最短経路の方向をいう。第２実施形態では、放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）が金属部材１０に対して垂直に立設されているため、受熱部１８から熱的に離れる方向は、放熱フィンの高さ方向（突出方向）である。また、本実施形態において、配向度とは、所望方向に対して垂直に配向しているものを０、所望方向に配向しているものを１とし、熱伝導率に異方性を付与する熱伝導率調整材（所定のアスペクト比を有する長尺形状の熱伝導率調整材）が、樹脂材料（母材）内で、所望方向に配向している割合を示したものである。このように、熱伝導性に優れた長尺形状の熱伝導率調整材１２１の大部分が配向されていることにより、樹脂製放熱部材１２０には、熱伝導率に異方性が付与されている。   In the resin heat dissipating member 120, the degree of orientation of the thermal conductivity adjusting material 121 contained in the resin heat dissipating member 120 in the direction of thermally separating from the heat receiving portion 18 of the metal plate member 10 exceeds 0.25. Here, the direction of thermally separating from the heat receiving unit 18 means that the heat from the heat source 2 received by the heat receiving unit 18 enters the atmosphere via the radiation fins (the first radiation fin unit 122 and the second radiation fin unit 124). The direction of the shortest path of heat flow until it is dissipated. In the second embodiment, since the radiating fins (the first radiating fin portion 122 and the second radiating fin portion 124) are erected perpendicular to the metal member 10, the direction of thermally separating from the heat receiving portion 18 is It is the height direction (protrusion direction) of a radiation fin. Further, in this embodiment, the degree of orientation is defined as 0 that is oriented perpendicular to the desired direction, 1 that is oriented in the desired direction, and heat that imparts anisotropy to the thermal conductivity. The conductivity adjusting material (long-shaped thermal conductivity adjusting material having a predetermined aspect ratio) shows the ratio of orientation in a desired direction in the resin material (base material). As described above, since most of the elongated thermal conductivity adjusting material 121 excellent in thermal conductivity is oriented, the resin heat radiating member 120 is provided with anisotropy in thermal conductivity. Yes.

次に、第２実施形態に係る放熱構造体１００を製造する方法の一例について、図１０及び図１１を用いて説明する。なお、金型は、第１実施形態に係る放熱構造体１を製造する際に用いた金型４０と同様のものを用いることができるため、同一符号を用いることにより説明を省略する。また、図１１（ａ）及び図１１（ｂ）は、第１放熱フィン部１２２及び第２放熱フィン部１２４の長手方向（固定金型４２及び可動金型４４の内面に形成された溝が延びる方向）に沿った断面図である。図１１（ａ）及び図１１（ｂ）に示す矢印は、樹脂材料の流動方向を示している。   Next, an example of a method for manufacturing the heat dissipation structure 100 according to the second embodiment will be described with reference to FIGS. 10 and 11. In addition, since the thing similar to the metal mold | die 40 used when manufacturing the thermal radiation structure 1 which concerns on 1st Embodiment can be used for a metal mold | die, description is abbreviate | omitted by using the same code | symbol. 11 (a) and 11 (b), the longitudinal direction of the first radiating fin portion 122 and the second radiating fin portion 124 (grooves formed on the inner surfaces of the fixed mold 42 and the movable mold 44 extend). It is sectional drawing along a direction. The arrows shown in FIGS. 11A and 11B indicate the flow direction of the resin material.

具体的には、まず、第１実施形態に係る放熱構造体１を製造する方法と同様に、図１０（ａ）〜図１０（ｃ）に示すように、固定金型４２と可動金型４４との間に金属部材１０を配置させ、金属部材１０における熱源２からの熱を受熱可能な受熱部１８となる領域を被覆した状態において、金型４０内に熱伝導性樹脂材料を射出充填させる。この際、金型４０内に射出充填された樹脂材料は、図１１（ａ）に示すように、金属部材１０の表面１２及び側面と可動金型４４の内面により形成される空間４６ａを流動すると共に、金属部材１０の貫通孔１６を介して金属部材１０の裏面１４と固定金型４２の内面により形成される空間４６ｂを流動し、金型キャビティ４６内に充填される。樹脂材料に含有される熱伝導率調整材１２１は、樹脂材料の流動抵抗により、基本的に樹脂材料の流動方向に沿った方向に向いて、すなわち、熱伝導率調整材１２１の長手方向が樹脂材料の流動方向と概ね平行な状態において、樹脂材料と共に金型キャビティ４６内に充填される。したがって、金型４０内に樹脂材料を射出充填させた状態では、樹脂材料に含有される熱伝導率調整材１２１の大部分が、放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向と直交する方向に向いている。   Specifically, first, similarly to the method of manufacturing the heat dissipation structure 1 according to the first embodiment, as shown in FIGS. 10A to 10C, the fixed mold 42 and the movable mold 44. The metal member 10 is disposed between the metal member 10 and the metal member 10 is injected and filled with a thermally conductive resin material in the mold 40 in a state where the metal member 10 covers a region to be the heat receiving portion 18 capable of receiving heat from the heat source 2. . At this time, the resin material injected and filled into the mold 40 flows in a space 46 a formed by the surface 12 and the side surface of the metal member 10 and the inner surface of the movable mold 44 as shown in FIG. At the same time, it flows through the space 46 b formed by the back surface 14 of the metal member 10 and the inner surface of the fixed mold 42 through the through hole 16 of the metal member 10, and is filled in the mold cavity 46. The thermal conductivity adjusting material 121 contained in the resin material is basically oriented in the direction along the flow direction of the resin material due to the flow resistance of the resin material, that is, the longitudinal direction of the thermal conductivity adjusting material 121 is the resin. The mold cavity 46 is filled together with the resin material in a state substantially parallel to the flow direction of the material. Therefore, in the state in which the resin material is injected and filled into the mold 40, most of the thermal conductivity adjusting material 121 contained in the resin material is the radiating fin (the first radiating fin portion 122 and the second radiating fin portion 124). ) In the direction perpendicular to the height direction.

次に、金型４０内に樹脂材料を充填させる際、すなわち、金型４０内に樹脂材料を射出している途中若しくは金型４０内に射出された樹脂材料が冷却固化する前に、図１０（ｄ）に示すように、可動金型４４を放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向に少量だけ型開きさせ、金型４０内のキャビティ容積を変動させる（変動工程）。これにより、金型４０内に射出充填された樹脂材料は、図１１（ｂ）に示すように、金型４０内のキャビティ容積が変動した方向、すなわち、放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向に流動する。また、樹脂材料が放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向に流動することにより、樹脂材料の流動方向に沿った方向、すなわち、放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向への樹脂材料に含有される熱伝導率調整材１２１の配向度は０．２５を超える。   Next, when the mold 40 is filled with the resin material, that is, while the resin material is being injected into the mold 40 or before the resin material injected into the mold 40 is cooled and solidified, FIG. As shown in FIG. 4D, the movable mold 44 is opened by a small amount in the height direction of the radiation fins (the first radiation fin part 122 and the second radiation fin part 124), and the cavity volume in the mold 40 is changed. (Variation process). As a result, the resin material injected and filled in the mold 40 has a direction in which the cavity volume in the mold 40 fluctuates, as shown in FIG. 11B, that is, the radiation fins (the first radiation fin portion 122 and It flows in the height direction of the second radiating fin portion 124). In addition, the resin material flows in the height direction of the radiation fins (the first radiation fin portion 122 and the second radiation fin portion 124), so that the direction along the flow direction of the resin material, that is, the radiation fin (the first radiation fin). The degree of orientation of the thermal conductivity adjusting material 121 contained in the resin material in the height direction of the fin portion 122 and the second radiating fin portion 124) exceeds 0.25.

そして、熱伝導率調整材１２１の向きを放熱フィン（第１放熱フィン部１２２及び第２放熱フィン部１２４）の高さ方向に整列させた状態において、金型キャビティ４６内に充填された熱伝導性樹脂材料を冷却固化させることにより、熱伝導率調整材１２１の配向制御がなされた第２実施形態に係る放熱構造体１００が成形される。そして最後に、図１０（ｅ）に示すように、可動金型４４を固定金型４２から離間させることにより金型４０を型開きさせ、図示しない製品取出手段により放熱構造体１００を金型４０外へ搬出させる。以上の成形サイクルを繰り返し実行することにより、放熱構造体１００を連続して成形することができる。   Then, in the state where the direction of the thermal conductivity adjusting material 121 is aligned with the height direction of the radiation fins (the first radiation fin portion 122 and the second radiation fin portion 124), the heat conduction filled in the mold cavity 46 is performed. By cooling and solidifying the conductive resin material, the heat dissipation structure 100 according to the second embodiment in which the orientation of the thermal conductivity adjusting material 121 is controlled is formed. Finally, as shown in FIG. 10 (e), the mold 40 is opened by separating the movable mold 44 from the fixed mold 42, and the heat dissipation structure 100 is moved to the mold 40 by a product take-out means (not shown). Take it out. By repeatedly executing the above molding cycle, the heat dissipation structure 100 can be continuously molded.

第２実施形態に係る放熱構造体１００によれば、第１実施形態に係る放熱構造体１と同様に、熱伝導率が相対的に低い樹脂製放熱部材１２０に先行して、熱伝導率が相対的に高い金属部材１０が熱源２からの熱を受熱し、金属部材１０の全体に熱を分散させた状態にて樹脂製放熱部材１２０に伝達させることができるため、熱伝導率が相対的に低い樹脂製放熱部材１２０を用いても効率的に放熱させることが可能となる。また、第２実施形態に係る放熱構造体１００は、第１実施形態に係る放熱構造体１と同様に、樹脂製放熱部材２０が金属部材１０に射出成形により一体成形（インサート成形又はアウトサート成形）されており、これにより、金属部材１０と樹脂製放熱部材２０との界面を密着させることができるため、熱抵抗を大幅に減少させることができ、熱の滞留を抑えることが可能となる。   According to the heat dissipation structure 100 according to the second embodiment, similarly to the heat dissipation structure 1 according to the first embodiment, the thermal conductivity is preceded by the resin heat dissipation member 120 having a relatively low thermal conductivity. Since the relatively high metal member 10 receives heat from the heat source 2 and can be transferred to the resin heat radiating member 120 in a state in which the heat is dispersed throughout the metal member 10, the heat conductivity is relatively high. Even if a low resin heat radiating member 120 is used, heat can be efficiently radiated. Further, in the heat dissipation structure 100 according to the second embodiment, similarly to the heat dissipation structure 1 according to the first embodiment, the resin heat dissipation member 20 is integrally formed with the metal member 10 by injection molding (insert molding or outsert molding). As a result, the interface between the metal member 10 and the resin heat radiating member 20 can be brought into close contact with each other, so that the thermal resistance can be greatly reduced, and the retention of heat can be suppressed.

また、第２実施形態に係る放熱構造体１００は、樹脂製放熱部材１２０が、熱伝導率に異方性を付与する熱伝導率調整材１２１を含有しており、金属部材１０の受熱部１８から熱的に離れる方向への配向度が０．２５を超える。これにより、樹脂製放熱部材１２０の第１放熱フィン部１２２及び第２放熱フィン部１２４における熱伝導の主方向（主熱伝導方向）が、図９に示すように、金属部材１０の受熱部１８から熱的に離れる方向（本実施形態では第１放熱フィン部１２２及び第２放熱フィン部１２４の高さ方向）と一致するため、熱の滞留をより一層抑え、金属部材と樹脂製放熱部材とを組み合わせたハイブリッド構造を有する放熱構造体であっても、十分な放熱効果を得ることが可能となる。これに対し、前述した変動工程を経ずに成形した放熱構造体、すなわち、図１０（ｃ）及び図１１（ａ）の状態で冷却固化させた放熱構造体は、図１２に示すように、熱伝導率調整材１２１の向きが放熱フィンの高さ方向と直交している。このため、樹脂製放熱部材の放熱フィンにおける主熱伝導方向が、放熱フィンの高さ方向と直交する方向となり、熱の滞留を引き起こす可能性があるという問題がある。第２実施形態に係る放熱構造体１００は、前述した変動工程によって熱伝導率調整材１２１の配向制御を実行することにより、このような問題を解決したものである。   In the heat dissipation structure 100 according to the second embodiment, the resin heat dissipation member 120 includes a thermal conductivity adjusting material 121 that imparts anisotropy to the thermal conductivity, and the heat receiving portion 18 of the metal member 10. The degree of orientation in the direction away from the heat exceeds 0.25. As a result, the main direction of heat conduction (main heat conduction direction) in the first radiating fin portion 122 and the second radiating fin portion 124 of the resin radiating member 120 is the heat receiving portion 18 of the metal member 10 as shown in FIG. In the direction (the height direction of the first heat dissipating fin portion 122 and the second heat dissipating fin portion 124 in this embodiment) away from the heat, further restraining the heat retention, the metal member and the resin heat dissipating member, Even if the heat dissipation structure has a hybrid structure combining the above, a sufficient heat dissipation effect can be obtained. On the other hand, the heat dissipation structure formed without going through the above-described changing process, that is, the heat dissipation structure cooled and solidified in the state of FIGS. 10C and 11A, as shown in FIG. The direction of the thermal conductivity adjusting material 121 is orthogonal to the height direction of the heat radiating fins. For this reason, there exists a problem that the main heat conduction direction in the radiation fin of a resin-made heat radiating member turns into a direction orthogonal to the height direction of a radiation fin, and may cause a heat retention. The heat dissipation structure 100 according to the second embodiment solves such a problem by performing orientation control of the thermal conductivity adjusting material 121 by the above-described variation process.

さらに、図１３に示すように、樹脂材料中の、熱伝導率に異方性を付与する熱伝導率調整材の配向度の向上は、該配向度に対する熱伝導率を向上させる。出願人は、熱伝導率に異方性を付与する熱伝導率調整材（アスペクト比を有する熱伝導率調整材）と、熱伝導率に異方性を付与しない熱伝導率調整材（アスペクト比を有しない（球状）熱伝導率調整材）をそれぞれ同率配合した樹脂材料を比較した各種検証により、熱伝導率に異方性を付与しない熱伝導率調整材（同図中：無配向材）の熱伝導率が、熱伝導率に異方性を付与する熱伝導率調整材の配向度０．２５に対応する熱伝導率を超えることがないことを見出した。すなわち、熱伝導率に異方性を付与しない熱伝導率調整材と比較し、熱伝導率に異方性を付与する熱伝導率調整材の配向度が０．２５を超えると熱伝達率に優位性を生じる。   Furthermore, as shown in FIG. 13, the improvement in the degree of orientation of the thermal conductivity adjusting material imparting anisotropy to the thermal conductivity in the resin material improves the thermal conductivity with respect to the degree of orientation. Applicant has a thermal conductivity adjusting material that imparts anisotropy to thermal conductivity (a thermal conductivity adjusting material having an aspect ratio) and a thermal conductivity adjusting material that does not impart anisotropy to a thermal conductivity (aspect ratio) (Spherical) thermal conductivity adjusting material) that does not give anisotropy to the thermal conductivity by various verifications comparing resin materials blended in the same ratio (spherical) (in the figure: non-oriented material) It has been found that the thermal conductivity does not exceed the thermal conductivity corresponding to the degree of orientation 0.25 of the thermal conductivity adjusting material imparting anisotropy to the thermal conductivity. That is, in comparison with a thermal conductivity adjusting material that does not impart anisotropy to thermal conductivity, when the degree of orientation of the thermal conductivity adjusting material that imparts anisotropy to thermal conductivity exceeds 0.25, Create an advantage.

本発明に係る放熱構造体及びその製造方法は、上述した実施形態に限定されるものではなく、本発明の技術思想を逸脱しない範囲内において種々の改変を行なうことができる。例えば、第１及び第２実施形態に係る放熱構造体において、樹脂製放熱部材の放熱部は、フィン形状に形成されるものとして説明したが、これに限定されず、熱源を目的温度に冷却可能な形状であれば、例えばピン形状などの任意の形状に形成することができる。このように任意の形状からなる樹脂製放熱部材を成形する場合においても、第１実施形態の説明において前述した種々の樹脂材料を好適に用いることができる。また、第１及び第２実施形態に係る放熱構造体では、１０枚の第１放熱フィン部と、１５枚の第２放熱フィン部とを図示したが、これに限定されず、第１放熱フィン部及び第２放熱フィン部の設置数は、任意の数とすることができる。さらに、受熱面側の第１放熱フィン部は、設けなくても良い。   The heat dissipation structure and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the technical idea of the present invention. For example, in the heat dissipating structure according to the first and second embodiments, the heat dissipating part of the resin heat dissipating member has been described as being formed in a fin shape, but is not limited thereto, and the heat source can be cooled to the target temperature. Any shape can be used, for example, a pin shape. As described above, even when a resin heat dissipation member having an arbitrary shape is molded, the various resin materials described above in the description of the first embodiment can be suitably used. Further, in the heat dissipation structure according to the first and second embodiments, the ten first heat dissipating fin portions and the fifteen second heat dissipating fin portions are illustrated, but the present invention is not limited thereto, and the first heat dissipating fins are illustrated. The number of parts and the second radiating fins can be set to an arbitrary number. Furthermore, the first heat radiating fin portion on the heat receiving surface side may not be provided.

第１及び第２実施形態に係る放熱構造体では、金属部材の受熱部が、樹脂製放熱部材に開口が形成されることにより露出され、熱源と直接接触するものとして説明したが、これに限定されず、例えば熱伝導性を有する緩衝材等の中間部材を介して、受熱部が熱源から受熱する構成としても良い。   In the heat radiating structure according to the first and second embodiments, the heat receiving portion of the metal member has been described as being exposed by forming an opening in the resin heat radiating member and in direct contact with the heat source. For example, the heat receiving unit may receive heat from the heat source through an intermediate member such as a buffer material having thermal conductivity.

第１及び第２実施形態に係る放熱構造体では、金属部材の裏面が露出されているものとして説明したが、これに限定されず、金属部材の表面が露出される構成としても良く、また、金属部材の受熱部以外の領域を樹脂製放熱部材によって鋳包む構成としても良い。金属部材の受熱部以外の領域を樹脂製放熱部材によって鋳包む構成とする場合には、金属と樹脂の線膨張係数差による剥離をより一層防止することができる。更に、金属部材の受熱部以外の領域を樹脂製放熱部材によって鋳包む構成とする場合には、先に説明したように、放熱面側及び受熱面側のいずれか一方の構造体を、絶縁性を有する樹脂材料等から成形して取付部を設けたり、樹脂製放熱部材の周縁部に、放熱面側及び受熱面側の構造体の樹脂材料とは異なる機能（例えば絶縁性等）を有する樹脂材料からなる別の構造体を積層したりしても良い。   In the heat dissipation structure according to the first and second embodiments, the back surface of the metal member has been described as being exposed. However, the present invention is not limited thereto, and the surface of the metal member may be exposed. A region other than the heat receiving portion of the metal member may be cast with a resin heat radiating member. In the case where the region other than the heat receiving portion of the metal member is cast with the resin heat radiating member, peeling due to a difference in linear expansion coefficient between the metal and the resin can be further prevented. Furthermore, when the region other than the heat receiving portion of the metal member is cast with a resin heat radiating member, as described above, one of the structures on the heat radiating surface side and the heat receiving surface side is insulated. A resin having a function different from the resin material of the structure on the heat radiating surface side and the heat receiving surface side (for example, insulating properties) on the peripheral portion of the resin heat radiating member. Another structure made of a material may be laminated.

第１及び第２実施形態に係る放熱構造体において、金属部材の貫通孔は、千鳥配置となるように形成された複数の円形状の孔であるとしたが、これに限定されず、孔の形状及び孔の配置は、任意の形状及び配置とすることができる。また、第２実施形態に係る放熱構造体において、貫通孔が形成された金属部材を用いたが、これに限定されず、貫通孔が形成されていない板状の金属部材を用いても良い。この場合、金属部材を樹脂製放熱部材により鋳包むことにより、金属部材と樹脂製放熱部材との界面の密着性を確保することができる。   In the heat dissipation structure according to the first and second embodiments, the through hole of the metal member is a plurality of circular holes formed in a staggered arrangement, but is not limited thereto, The shape and arrangement of the holes can be any shape and arrangement. Further, in the heat dissipation structure according to the second embodiment, the metal member in which the through hole is formed is used. However, the present invention is not limited to this, and a plate-like metal member in which the through hole is not formed may be used. In this case, the adhesion of the interface between the metal member and the resin heat dissipation member can be ensured by casting the metal member with the resin heat dissipation member.

第２実施形態に係る放熱構造体では、可動金型を放熱フィンの高さ方向に少量だけ型開きさせ、金型内のキャビティ容積を変動させるものとして説明したが、これに限定されず、金型内のキャビティ容積の変動方向は、受熱部から熱的に接近若しくは離間する方向と概ね同方向であれば、任意の方向とすることができる。すなわち、金型内のキャビティ容積の変動方向は、受熱部により受けた熱源からの熱が放熱フィンを介して大気中に放散されるまでの熱の流れの最短経路の方向に概ね沿った方向であれば良い。また、第２実施形態に係る放熱構造体では、金型内のキャビティ容積を変動させる方法として、射出成形時に金型を少量だけ型開きさせる方法（拡張方法）を例に挙げて説明したが、これに限定されるものではなく、例えば射出圧縮成形や射出プレス成形等において実行される、射出成形時に金型を型閉じさせる方法（圧縮方法）を採用してもよい。さらに、金型内のキャビティ容積を変動させる方法として、可動金型を型開閉方向に移動させる態様を例に挙げて説明したが、これに限定されず、例えば金型内に配置される中子等の可動部により金型内のキャビティ容積を変動させる態様等、種々の態様を採用することができる。   In the heat dissipation structure according to the second embodiment, it has been described that the movable mold is opened by a small amount in the height direction of the heat dissipation fin, and the cavity volume in the mold is changed. The direction of variation of the cavity volume in the mold can be any direction as long as the direction is substantially the same as the direction of thermal approach or separation from the heat receiving portion. That is, the direction of variation of the cavity volume in the mold is substantially along the direction of the shortest path of the heat flow until the heat from the heat source received by the heat receiving part is dissipated into the atmosphere through the radiation fins. I just need it. Further, in the heat dissipation structure according to the second embodiment, as a method of changing the cavity volume in the mold, a method of opening the mold by a small amount at the time of injection molding (expansion method) has been described as an example. However, the present invention is not limited to this. For example, a method (compression method) of closing the mold at the time of injection molding performed in injection compression molding or injection press molding may be employed. Furthermore, as an example of a method for changing the cavity volume in the mold, the mode in which the movable mold is moved in the mold opening / closing direction has been described as an example. However, the present invention is not limited to this. For example, the core disposed in the mold Various modes such as a mode in which the cavity volume in the mold is changed by a movable part such as the above can be adopted.

第２実施形態に係る放熱構造体において、樹脂製放熱部材は、１種類の樹脂材料から形成されるものとして説明したが、これに限定されず、図７及び図８を用いて前述したとおり、２種以上の樹脂材料から成形しても良い。   In the heat dissipation structure according to the second embodiment, the resin heat dissipating member has been described as being formed from one type of resin material, but is not limited thereto, as described above with reference to FIGS. You may shape | mold from 2 or more types of resin materials.

１，１００ 放熱構造体、２ 熱源、１０ 金属部材、１２ 第１の面（表面）、１４ 第２の面（裏面）、１６ 貫通孔、１８ 受熱部、２０，２０´，１２０ 樹脂製放熱部材、２２，２２´，１２２ 第１放熱フィン部（突出部，第１突出部）、２４，２４´，１２４ 第２放熱フィン部（突出部，第２突出部）、２６，２６´ 板状部（係止部，第１係止部）、２８，２８ａ´，２８ｂ´，６６ 連結部、１２１ 熱伝導率調整材   DESCRIPTION OF SYMBOLS 1,100 Heat dissipation structure, 2 Heat source, 10 Metal member, 12 1st surface (front surface), 14 2nd surface (back surface), 16 Through-hole, 18 Heat receiving part, 20, 20 ', 120 Resin heat dissipation member , 22, 22 ′, 122 First radiating fin portion (protruding portion, first protruding portion), 24, 24 ′, 124 Second radiating fin portion (protruding portion, second protruding portion), 26, 26 ′ (Locking part, first locking part), 28, 28a ', 28b', 66 connecting part, 121 thermal conductivity adjusting material

Claims (10)

熱伝導性を有する金属部材と、熱伝導性を有する樹脂製放熱部材とを備える放熱構造体であって、
前記金属部材は、熱源からの熱を受熱可能な受熱部を有し、
前記樹脂製放熱部材は、前記金属部材に射出成形により一体成形されており、前記受熱部と熱的に接触して設けられている
ことを特徴とする放熱構造体。 A heat dissipation structure comprising a metal member having thermal conductivity and a resin heat dissipation member having thermal conductivity,
The metal member has a heat receiving part capable of receiving heat from a heat source,
The heat dissipation structure is characterized in that the resin heat dissipation member is integrally formed with the metal member by injection molding and is in thermal contact with the heat receiving portion. 前記金属部材は、前記受熱部が設けられた第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有し、
前記樹脂製放熱部材は、前記第１の面側に設けられた係止部と、前記第２の面側に突出して設けられた複数の突出部と、前記貫通孔を介して前記係止部と各突出部とを連結する連結部とを有する
ことを特徴とする請求項１に記載の放熱構造体。 The metal member penetrates from the first surface on which the heat receiving portion is provided, a second surface facing a direction different from the first surface, and the first surface to the second surface. A plurality of through holes,
The resin heat radiation member includes a locking portion provided on the first surface side, a plurality of protruding portions provided protruding on the second surface side, and the locking portion via the through hole. The heat radiating structure according to claim 1, further comprising: a connecting portion that connects the protrusions to each other. 前記第１の面側に設けられた前記係止部に、複数の突出部が突出して設けられる
ことを特徴とする請求項２に記載の放熱構造体。 The heat dissipating structure according to claim 2, wherein a plurality of protrusions are provided to protrude from the locking part provided on the first surface side. 前記金属部材は、前記受熱部が設けられた第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有し、
前記樹脂製放熱部材は、前記第１の面側に設けられた第１係止部と、前記第２の面側に設けられた第２係止部と、前記貫通孔を介して前記第１係止部と前記第２係止部とを連結する連結部とを有し、
前記第１係止部及び前記第２係止部の少なくとも一方に、複数の突出部が突出して設けられる
ことを特徴とする請求項１に記載の放熱構造体。 The metal member penetrates from the first surface on which the heat receiving portion is provided, a second surface facing a direction different from the first surface, and the first surface to the second surface. A plurality of through holes,
The resin heat dissipating member includes a first locking portion provided on the first surface side, a second locking portion provided on the second surface side, and the first via the through hole. A connecting portion that connects the locking portion and the second locking portion;
The heat dissipating structure according to claim 1, wherein a plurality of projecting portions protrude from at least one of the first locking portion and the second locking portion. 前記樹脂製放熱部材は、熱伝導率に異方性を付与する熱伝導率調整材を含有しており、
前記受熱部から熱的に離れる方向への前記熱伝導率調整材の配向度が０．２５を超える
ことを特徴とする請求項１〜４いずれか１項に記載の放熱構造体。 The resin heat radiating member contains a thermal conductivity adjusting material that imparts anisotropy to the thermal conductivity,
The heat dissipation structure according to any one of claims 1 to 4, wherein the degree of orientation of the thermal conductivity adjusting material in a direction thermally away from the heat receiving portion exceeds 0.25. 熱伝導性を有する金属部材と、熱伝導性を有する樹脂製放熱部材とを備える放熱構造体を射出成形により成形する放熱構造体の製造方法であって、
前記金属部材を金型内に配置させる配置工程と、
前記金属部材における熱源からの熱を受熱可能な受熱部となる領域を被覆した状態において、前記金型内に樹脂材料を充填させ、前記金属部材に前記樹脂製放熱部材を一体成形させる成形工程とを備える
ことを特徴とする放熱構造体の製造方法。 A heat dissipation structure manufacturing method comprising molding a heat dissipation structure comprising a metal member having thermal conductivity and a resin heat dissipation member having thermal conductivity by injection molding,
An arrangement step of arranging the metal member in a mold;
A molding step of filling a resin material into the mold and integrally molding the resin heat radiating member in the metal member in a state where a region to be a heat receiving portion capable of receiving heat from a heat source in the metal member is covered The manufacturing method of the heat radiating structure characterized by comprising. 前記配置工程は、前記受熱部が設けられる第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有する金属部材を金型内に配置させる工程であり、
前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた係止部と、前記第２の面側に突出して設けられた複数の突出部と、前記貫通孔を介して前記係止部と各突出部とを連結する連結部とを有する樹脂製放熱部材を一体成形させる工程である
ことを特徴とする請求項６に記載の放熱構造体の製造方法。 The arranging step includes a first surface on which the heat receiving portion is provided, a second surface facing in a direction different from the first surface, and a plurality of penetrating from the first surface to the second surface. Is a step of arranging a metal member having a through hole in the mold,
In the molding step, a resin material is filled in the mold in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is provided on the first surface side. And a plurality of protrusions provided to protrude toward the second surface side, and a connecting portion that connects the engagement part and each protrusion through the through hole. The method of manufacturing a heat dissipation structure according to claim 6, wherein the heat dissipation member is integrally formed. 前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた係止部と、前記係止部上に設けられた複数の第１突出部と、前記第２の面側に突出して設けられた複数の第２突出部と、前記貫通孔を介して前記係止部と各第２突出部とを連結する連結部とを有する樹脂製放熱部材を一体成形させる工程である
ことを特徴とする請求項７に記載の放熱構造体の製造方法。 In the molding step, a resin material is filled in the mold in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is provided on the first surface side. The plurality of first protruding portions provided on the locking portion, the plurality of second protruding portions provided to protrude to the second surface side, and the through hole. The method for manufacturing a heat radiating structure according to claim 7, wherein the step is a step of integrally forming a resin heat radiating member having a connecting portion that connects the locking portion and each second protrusion. 前記配置工程は、前記受熱部が設けられる第１の面と、前記第１の面と異なる方向を向く第２の面と、前記第１の面から前記第２の面に亘って貫通する複数の貫通孔とを有する金属部材を金型内に配置させる工程であり、
前記成形工程は、前記金属部材の前記第１の面の前記受熱部となる領域を被覆した状態において前記金型内に樹脂材料を充填させ、前記金属部材に、前記第１の面側に設けられた第１係止部と、前記第２の面側に設けられた第２係止部と、前記貫通孔を介して前記第１係止部と前記第２係止部とを連結する連結部と、前記第１係止部及び前記第２係止部の少なくとも一方に設けられた突出部とを有する樹脂製放熱部材を一体成形させる工程である
ことを特徴とする請求項６に記載の放熱構造体の製造方法。 The arranging step includes a first surface on which the heat receiving portion is provided, a second surface facing in a direction different from the first surface, and a plurality of penetrating from the first surface to the second surface. Is a step of arranging a metal member having a through hole in the mold,
In the molding step, a resin material is filled in the mold in a state where the region to be the heat receiving portion of the first surface of the metal member is covered, and the metal member is provided on the first surface side. A first locking portion, a second locking portion provided on the second surface side, and a connection for connecting the first locking portion and the second locking portion via the through hole It is the process of integrally forming the resin heat-radiating member which has a part and the protrusion part provided in at least one of the said 1st latching | locking part and the said 2nd latching | locking part. Manufacturing method of heat dissipation structure. 前記樹脂材料は、熱伝導率に異方性を付与する熱伝導率調整材を含有しており、
前記成形工程は、前記金型内に前記樹脂材料を充填させる際に、前記金型内のキャビティ容積を所定の方向に変動させ、前記キャビティ容積の変動方向への前記熱伝導率調整材の配向度を０．２５より大きくさせる変動工程を更に備える
ことを特徴とする請求項６〜９いずれか１項に記載の放熱構造体の製造方法。 The resin material contains a thermal conductivity adjusting material that imparts anisotropy to the thermal conductivity,
In the molding step, when the resin material is filled in the mold, the cavity volume in the mold is changed in a predetermined direction, and the thermal conductivity adjusting material is oriented in the direction of change of the cavity volume. The manufacturing method of the heat radiating structure according to any one of claims 6 to 9, further comprising a fluctuating step of making the degree larger than 0.25.
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