JP2014201617A - Adhesive for encapsulating an electronic component - Google Patents
Adhesive for encapsulating an electronic component Download PDFInfo
- Publication number
- JP2014201617A JP2014201617A JP2013076662A JP2013076662A JP2014201617A JP 2014201617 A JP2014201617 A JP 2014201617A JP 2013076662 A JP2013076662 A JP 2013076662A JP 2013076662 A JP2013076662 A JP 2013076662A JP 2014201617 A JP2014201617 A JP 2014201617A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic component
- leveling agent
- manufacturing
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 62
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 claims abstract description 43
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 43
- -1 polysiloxane Polymers 0.000 claims abstract description 32
- 238000007789 sealing Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 15
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 239000012945 sealing adhesive Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 21
- 239000004721 Polyphenylene oxide Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 229920000570 polyether Polymers 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 229920006294 polydialkylsiloxane Polymers 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 230000000717 retained effect Effects 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- QXBYUPMEYVDXIQ-UHFFFAOYSA-N 4-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound CC1CCCC2C(=O)OC(=O)C12 QXBYUPMEYVDXIQ-UHFFFAOYSA-N 0.000 description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 125000003748 selenium group Chemical class *[Se]* 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- YSHRTXBTHVBWTL-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)butoxy]ethanol Chemical compound OCCOCC(CC)OCC1CO1 YSHRTXBTHVBWTL-UHFFFAOYSA-N 0.000 description 1
- SURWYRGVICLUBJ-UHFFFAOYSA-N 2-ethyl-9,10-dimethoxyanthracene Chemical compound C1=CC=CC2=C(OC)C3=CC(CC)=CC=C3C(OC)=C21 SURWYRGVICLUBJ-UHFFFAOYSA-N 0.000 description 1
- BDPJILVXUVJWBF-UHFFFAOYSA-N 2-ethyl-9,10-dipropoxyanthracene Chemical compound CCC1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 BDPJILVXUVJWBF-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- LQOPXMZSGSTGMF-UHFFFAOYSA-N 6004-79-1 Chemical compound C1CC2C3C(=O)OC(=O)C3C1C2 LQOPXMZSGSTGMF-UHFFFAOYSA-N 0.000 description 1
- NYEVBSJUVMRZNE-UHFFFAOYSA-N 9,10-dibutoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 NYEVBSJUVMRZNE-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- JWJMBKSFTTXMLL-UHFFFAOYSA-N 9,10-dimethoxyanthracene Chemical compound C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 JWJMBKSFTTXMLL-UHFFFAOYSA-N 0.000 description 1
- LBQJFQVDEJMUTF-UHFFFAOYSA-N 9,10-dipropoxyanthracene Chemical compound C1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 LBQJFQVDEJMUTF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- QPFYXYFORQJZEC-FOCLMDBBSA-N Phenazopyridine Chemical compound NC1=NC(N)=CC=C1\N=N\C1=CC=CC=C1 QPFYXYFORQJZEC-FOCLMDBBSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- RRFQCEWDBIZSDW-UHFFFAOYSA-N benzenediazonium fluoro(dioxido)borane Chemical compound [O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1 RRFQCEWDBIZSDW-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229940070891 pyridium Drugs 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical class C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical class [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical group 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
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- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、電子部品の封止用エポキシ系接着剤に関し、詳細には、透明基板を透明な接着剤で封止してなる電子部品の製造に好適な、透明性、低粘度、透明基板との濡れ性、低アウトガス等の特性を有し、経時安定な電子部品の封止用エポキシ系接着剤に関する。 The present invention relates to an epoxy-based adhesive for sealing electronic components, and in particular, a transparent, low-viscosity, transparent substrate suitable for manufacturing an electronic component formed by sealing a transparent substrate with a transparent adhesive. The present invention relates to an epoxy-based adhesive for sealing electronic components, which has characteristics such as wettability and low outgas.
表示素子や発光素子等の電子部品において、シーリング部材である透明基板を封止接着するために透明な接着剤が使用されている。このような接着剤としては、例えば、特許文献１には、無機充填剤及びシランカップリング剤を必須成分として含有してなる密着性を高めた光硬化性エポキシ樹脂組成物が開示されている。 In electronic parts such as display elements and light emitting elements, a transparent adhesive is used for sealing and bonding a transparent substrate as a sealing member. As such an adhesive, for example, Patent Document 1 discloses a photocurable epoxy resin composition with improved adhesion, containing an inorganic filler and a silane coupling agent as essential components.
また、特許文献２には、エポキシ樹脂、光重合開始剤及びカップリング剤を含有してなり、シーリング部材との密着性を高めた接着剤用光硬化性樹脂組成物が開示されている。特許文献３には、オキセタン化合物に対してスルフォニウム塩型光カチオン重合開始剤を用いて遅延硬化性を高めた封止用樹脂組成物が開示されている。 Patent Document 2 discloses a photocurable resin composition for an adhesive that contains an epoxy resin, a photopolymerization initiator, and a coupling agent and has improved adhesion to a sealing member. Patent Document 3 discloses a sealing resin composition in which delayed curable property is enhanced by using a sulfonium salt-type photocationic polymerization initiator for an oxetane compound.
特許文献４には、有機電界発光素子の封止に用いる接着樹脂としてエポキシ樹脂やアクリル樹脂等の樹脂を広く一般的に参照しつつ、水分遮断能の向上を図って接着樹脂を用いることが開示されている。 Patent Document 4 discloses that an adhesive resin is used in order to improve moisture blocking ability while widely referring to resins such as epoxy resins and acrylic resins as an adhesive resin used for sealing an organic electroluminescent element. Has been.
ところで、電子部品の封止用接着剤を用いてシーリング部材である透明基板を貼り合わせる際に、透明基板に対する接着剤の濡れ性が充分に確保されていないとハジキが発生し、封止にムラが生じ、表示素子や発光素子等の電子部品の光学特性が損なわれる。このような欠陥が製造過程で生じると品質にばらつきが生じ、製品の歩留りが大きく低下する可能性があり、品質向上における製造工程上の問題点として近年クローズアップされてきた。しかしながら、従来技術においては、必ずしもこのような課題が充分に認識されていたとは言えず、例えば、カップリング剤を含有する光硬化性エポキシ樹脂系接着剤は、ハジキ発生が認められ、また、カップリング剤は一般的に分子量２００〜３００程度の低分子量成分であるのでアウトガスの問題があった。 By the way, when bonding a transparent substrate as a sealing member using an adhesive for sealing electronic components, repelling occurs if the wettability of the adhesive with respect to the transparent substrate is not sufficiently secured, resulting in uneven sealing. Occurs, and the optical characteristics of electronic parts such as display elements and light emitting elements are impaired. If such a defect occurs in the manufacturing process, the quality may vary and the yield of the product may be greatly reduced. In recent years, this has been highlighted as a problem in the manufacturing process in improving quality. However, in the prior art, it cannot be said that such a problem has been sufficiently recognized. For example, a photocurable epoxy resin-based adhesive containing a coupling agent is recognized to have repellency and a cup. Since the ring agent is generally a low molecular weight component having a molecular weight of about 200 to 300, there is a problem of outgassing.
従って本発明は、シーリング部材である透明基板を接着剤で封止してなる電子部品の製造に好適な、透明性、低粘度、透明基板との濡れ性、低アウトガス等の特性を有し、しかもこれらの特性が経時安定な封止用接着剤、これを用いた、ハジキ等による封止欠陥の発生を抑えることができて製品歩留りを向上させることができる、表示素子や発光素子等の、透明基板で封止された電子部品の製造方法を提供することを目的とする。 Therefore, the present invention has characteristics such as transparency, low viscosity, wettability with a transparent substrate, and low outgas, which are suitable for manufacturing an electronic component formed by sealing a transparent substrate as a sealing member with an adhesive. In addition, these adhesives have stable properties over time, and the use of this adhesive can suppress the occurrence of sealing defects due to cissing and improve product yield, such as display elements and light emitting elements, It is an object of the present invention to provide a method for manufacturing an electronic component sealed with a transparent substrate.
本発明は、エポキシ樹脂、硬化剤及び／又は重合開始剤、並びにシリコン系レベリング剤を含有する電子部品封止用接着剤である。
本発明はまた、電子発光層を挟んで二枚の基板を封止用接着剤で封止接着した構造を有する電子部品の製造方法であって、（１）前記二枚の基板のうちの少なくとも一枚の表面に、上記電子部品封止用接着剤を印刷塗布する工程、（２）前記二枚のうちのいずれかの基板上に予め形成された前記電子発光層を挟んで、前記二枚の基板を前記塗布された接着剤を介して貼り合わせる工程、（３）前記塗布された接着剤を硬化させる工程、を有する電子部品の製造方法である。
The present invention is an adhesive for electronic component sealing containing an epoxy resin, a curing agent and / or a polymerization initiator, and a silicon leveling agent.
The present invention is also a method for manufacturing an electronic component having a structure in which two substrates are sealed and bonded with a sealing adhesive across an electroluminescent layer, and (1) at least one of the two substrates A step of printing and applying the electronic component sealing adhesive on one surface; (2) sandwiching the electroluminescent layer formed in advance on one of the two substrates; A step of bonding the substrate through the applied adhesive, and (3) a step of curing the applied adhesive.
（１）本発明の電子部品封止用接着剤は、レベリング剤として特定分子種のものを用いることにより、ガラス等の透明基板との濡れ性が充分に確保できる。しかも、低分子量成分を必須成分に含有しないことが可能であり、あるいは印刷性の低下なしに脱泡することが可能であり、低アウトガスにすることができる。また所定範囲のＨＬＢ値を有するものを用いることにより、透明性が高く、またレベリング剤を特定範囲の量で含有することにより、充分な硬化性を維持しつつ、経時安定的にガラス等の透明基板との濡れ性が充分に確保される。また所定範囲の分子量を有するものを用いることにより、改善されたハジキ防止性能を経時安定に発揮することが可能で、印刷塗布した形状の保持性に優れた特性を経時に維持するので、電子部品の印刷塗布による封止工程を含む電子部品の製造方法に好適に適用することができる。
（２）本発明の電子部品封止用接着剤を用いることにより、有機ＬＥＤ素子等の二枚の基板を封止用接着剤で封止接着した構造を有する電子部品を、ハジキ発生による製品瑕疵なしに高い生産効率で製造することができる。
(1) The adhesive for electronic component sealing of the present invention can ensure sufficient wettability with a transparent substrate such as glass by using a specific molecular species as a leveling agent. In addition, it is possible not to contain a low molecular weight component as an essential component, or it is possible to defoam without lowering printability, and it is possible to reduce the outgas. Further, by using a material having an HLB value in a predetermined range, transparency is high, and by containing a leveling agent in an amount in a specific range, it is possible to stably maintain transparency such as glass while maintaining sufficient curability. Sufficient wettability with the substrate is ensured. In addition, by using a material having a molecular weight within a predetermined range, it is possible to stably exhibit improved repellency prevention performance over time, and maintain characteristics with excellent retention of printed and applied shapes over time. It can apply suitably for the manufacturing method of an electronic component including the sealing process by printing application | coating.
(2) By using the electronic component sealing adhesive of the present invention, an electronic component having a structure in which two substrates, such as organic LED elements, are sealed and bonded with a sealing adhesive, Can be manufactured with high production efficiency.
本発明の電子部品封止用接着剤において、エポキシ樹脂としては、エポキシ系接着剤に一般に用いられているものを好適に適用することができ、例えば、多官能のエポキシ樹脂としては、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、脂環式エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ポリエーテル型エポキシ樹脂、シリコーン変性エポキシ樹脂等を挙げることができる。これらは単独で用いてもよく、２種以上を組み合わせて使用してもよい。例えば、常温で固体のエポキシ樹脂は常温で液状のエポキシ樹脂と組み合わせて常温で液状となるように配合することができる。これらのうち、ナフタレン型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂が好ましく、ナフタレン型エポキシ樹脂が耐湿性の点でより好ましい。また３，４−エポキシシクロヘキシルメチル−３’，４’−エポキシシクロヘキサンカルボキシレート、３，４−エポキシシクロヘキシルメチル−３’，４’−エポキシシクロヘキサンカルボキシレートとε−カプロラクトンの付加物、１，２，８，９−ジエポキシリモネンなどの脂環式エポキシ樹脂を併用して粘度調節することもできる。 In the electronic component sealing adhesive of the present invention, as the epoxy resin, those generally used for epoxy adhesives can be suitably applied. For example, as a polyfunctional epoxy resin, bisphenol A type Epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, glycidylamine type epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin, polyether type epoxy resin, Examples thereof include silicone-modified epoxy resins. These may be used alone or in combination of two or more. For example, an epoxy resin that is solid at room temperature can be combined with an epoxy resin that is liquid at room temperature so as to be liquid at room temperature. Among these, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol AD type epoxy resin are preferable, and naphthalene type epoxy resin is more preferable in terms of moisture resistance. 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate and ε-caprolactone adduct, 1,2, Viscosity can also be adjusted by using an alicyclic epoxy resin such as 8,9-diepoxy limonene together.
また、粘度調節のために１官能のエポキシ樹脂を、エポキシ樹脂全体の０〜５０重量％程度用いることができる。このような１官能エポキシ樹脂としては、フェニルグリシジルエーテル、２−エチルヘキシルグリシジルエーテル、エチルジエチレングリコールグリシジルエーテル、ジシクロペンタジエングリシジルエーテル、２−ヒドロキシエチルグリシジルエーテル等を挙げることができる。 In addition, a monofunctional epoxy resin can be used in an amount of about 0 to 50% by weight based on the total epoxy resin for viscosity adjustment. Examples of such monofunctional epoxy resins include phenyl glycidyl ether, 2-ethylhexyl glycidyl ether, ethyl diethylene glycol glycidyl ether, dicyclopentadiene glycidyl ether, and 2-hydroxyethyl glycidyl ether.
また、任意に、粘度調節のために、脂肪族鎖式オキセタン化合物、脂環式オキセタン化合物などのオキセタン化合物を含有してもよい。例えば、３−エチル−３−ヒドロキシメチルオキセタン、ジ［１−エチル（３−オキセタニル）］メチルエーテル、３−エチル−３−（２−エチルヘキシロキシメチル）オキセタン等を挙げることができる。オキセタン化合物は、例えば、エポキシ樹脂１００重量部に対して０〜１００重量部用いることができる。 Moreover, you may contain oxetane compounds, such as an aliphatic chain type oxetane compound and an alicyclic oxetane compound, arbitrarily for viscosity adjustment. For example, 3-ethyl-3-hydroxymethyloxetane, di [1-ethyl (3-oxetanyl)] methyl ether, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, and the like can be given. For example, 0 to 100 parts by weight of the oxetane compound can be used with respect to 100 parts by weight of the epoxy resin.
本発明の電子部品封止用接着剤において、硬化剤としては、例えば、アミン系硬化剤、フェノール系硬化剤、酸無水物等があげられる。酸無水物としては、例えば、無水フタル酸、無水マレイン酸、無水トリメリット酸、無水ピロメリット酸、ヘキサヒドロ無水フタル酸、３−メチル−ヘキサヒドロ無水フタル酸、４−メチル−ヘキサヒドロ無水フタル酸、あるいは３−メチル−ヘキサヒドロ無水フタル酸と４−メチル−ヘキサヒドロ無水フタル酸との混合物、テトラヒドロ無水フタル酸、無水ナジック酸、無水メチルナジック酸、ノルボルナン−２，３−ジカルボン酸無水物、メチルノルボルナン−２，３−ジカルボン酸無水物等を挙げることができ、アミン系硬化剤としては、例えば、メタフェニレンジアミン、ジメチルジフェニルメタン、ジアミノジフェニルスルホン、ｍ−キシレンジアミン、プロピルアミン等を挙げることができる。 In the electronic component sealing adhesive of the present invention, examples of the curing agent include amine-based curing agents, phenol-based curing agents, and acid anhydrides. Examples of the acid anhydride include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, or A mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, norbornane-2,3-dicarboxylic anhydride, methylnorbornane-2 1,3-dicarboxylic acid anhydride and the like, and examples of the amine curing agent include metaphenylenediamine, dimethyldiphenylmethane, diaminodiphenylsulfone, m-xylenediamine, and propylamine.
上記硬化剤の配合量としては、組成物中のエポキシ樹脂（Ａ）中のエポキシ基のモル数に対して硬化剤官能基のモル数が０．６〜１．２倍が好ましく、０．７〜１．０倍がより好ましい。硬化剤の配合量が上述の範囲より少ないと硬化不良となるおそれがあり、多いと硬化剤がブリードするおそれがある。 As the compounding amount of the curing agent, the number of moles of the curing agent functional group is preferably 0.6 to 1.2 times the number of moles of the epoxy group in the epoxy resin (A) in the composition, 0.7 -1.0 time is more preferable. When the blending amount of the curing agent is less than the above range, curing may be poor, and when it is large, the curing agent may bleed.
本発明の電子部品封止用接着剤において、任意成分として、硬化促進剤を使用してもよい。上記硬化促進剤としては、各種のものを使用可能だが、好ましくは、例えば、トリアルキルホスフィン、トリフェニルホスフィン、４級ホスホニウム塩、４級アンモニウム塩、イミダゾール類、第３級アミン等を挙げることができる。これらはマイクロカプセル型のものであってもよい。上記硬化促進剤の配合量は、エポキシ樹脂１００重量部に対して、０．１〜３０重量部が好ましい。 In the electronic component sealing adhesive of the present invention, a curing accelerator may be used as an optional component. As the curing accelerator, various types can be used, and preferably, for example, trialkylphosphine, triphenylphosphine, quaternary phosphonium salt, quaternary ammonium salt, imidazoles, tertiary amine and the like can be mentioned. it can. These may be of microcapsule type. As for the compounding quantity of the said hardening accelerator, 0.1-30 weight part is preferable with respect to 100 weight part of epoxy resins.
本発明の電子部品封止用接着剤において、重合開始剤としては、例えば、ジアゾニウム塩、スルホニウム塩、ヨードニウム塩、セレニウム塩、メタロセン化合物等の光カチオン重合開始剤を挙げることができる。これらを具体的に例示すれば、ベンゼンジアゾニウムヘキサフルオロアンチモネート、ベンゼンジアゾニウムヘキサフルオロフォスフェート、ベンゼンジアゾニウムヘキサフルオロボレート、芳香族ジアゾニウム塩、ジアリルヨードニウム塩、トリアリルスルホニウム塩、トリアリルセレニウム塩、ジアルキルフェナシルスルホニウム塩、ジアルキルヒドロキシフェニルスルホニウム塩、メタロセン化合物等の光カチオン重合開始剤が挙げられ、また、トリアリルピリリウム塩、ベンジルピリジウムチオシアネート等を用いることもできる。これらは１種のみ、又は２種以上を併用することができる。 In the electronic component sealing adhesive of the present invention, examples of the polymerization initiator include photocationic polymerization initiators such as diazonium salts, sulfonium salts, iodonium salts, selenium salts, and metallocene compounds. Specific examples thereof include benzenediazonium hexafluoroantimonate, benzenediazonium hexafluorophosphate, benzenediazonium hexafluoroborate, aromatic diazonium salt, diallyl iodonium salt, triallylsulfonium salt, triallyl selenium salt, dialkylphenate. Examples include photocationic polymerization initiators such as silsulfonium salts, dialkylhydroxyphenylsulfonium salts, metallocene compounds, and triallyl pyrylium salts, benzyl pyridium thiocyanate, and the like. These can be used alone or in combination of two or more.
上記重合開始剤の配合量としては、エポキシ樹脂１００重量部に対して、好ましくは１〜１０重量部であり、より好ましくは０．５〜５重量部である。 As a compounding quantity of the said polymerization initiator, Preferably it is 1-10 weight part with respect to 100 weight part of epoxy resins, More preferably, it is 0.5-5 weight part.
更に、必要に応じ、増感剤として、例えば、アントラセン、９，１０−ジメトキシアントラセン、９，１０−ジプロポキシアントラセン、９，１０−ジブトキシアントラセン、２−エチル−９，１０−ジメトキシアントラセン、２−エチル−９，１０−ジブトキシアントラセン、２−エチル−９，１０−ジプロポキシアントラセン等を使用することもできる。これら増感剤を添加する場合、添加量は、エポキシ樹脂１００重量部に対して、好ましくは０．１〜３０重量部であり、より好ましくは０．１〜１０重量部である。 Furthermore, if necessary, as a sensitizer, for example, anthracene, 9,10-dimethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 2 -Ethyl-9,10-dibutoxyanthracene, 2-ethyl-9,10-dipropoxyanthracene and the like can also be used. When these sensitizers are added, the addition amount is preferably 0.1 to 30 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin.
本発明の電子部品封止用接着剤においては、上記硬化剤、上記重合開始剤、又は上記硬化剤と上記重合開始剤とを用いることができる。これらは必要に応じて適宜選択すればよい。たとえば、感熱性や感光性を付与したい場合等において、熱硬化剤と光重合開始剤を配合することができる。 In the electronic component sealing adhesive of the present invention, the curing agent, the polymerization initiator, or the curing agent and the polymerization initiator can be used. What is necessary is just to select these suitably as needed. For example, when it is desired to impart heat sensitivity or photosensitivity, a thermosetting agent and a photopolymerization initiator can be blended.
本発明の電子部品封止用接着剤においては、ＨＬＢ値が３〜１５のシリコン系レベリング剤を用いることが望ましい。ＨＬＢ値がこの範囲外であるとエポキシ樹脂との相溶性が悪くなり、充分な透明性が確保できない。より好ましくは６〜１４である。なお、ＨＬＢ値は、以下の計算方法により計算することができる。
グリフィン法：［（親水部分の分子量）÷（全体の分子量）］×２０
In the electronic component sealing adhesive of the present invention, it is desirable to use a silicon leveling agent having an HLB value of 3 to 15. When the HLB value is outside this range, the compatibility with the epoxy resin is deteriorated, and sufficient transparency cannot be ensured. More preferably, it is 6-14. The HLB value can be calculated by the following calculation method.
Griffin method: [(molecular weight of hydrophilic portion) ÷ (total molecular weight)] × 20
上記シリコン系レベリング剤としては、例えば、ポリエーテル変性、ポリエステル変性、アラルキル変性などの有機変性ポリシロキサンを挙げることができる。これらのうち、ポリエーテル変性ポリシロキサンが、エポキシ樹脂との相溶性の観点から好ましい。ポリエーテル変性ポリシロキサンとしては、エチレンオキサイド、プロピレンオキサイド、ブチレンオキサイド、テトラメチレンオキサイドなどのアルキレンオキサイド変性ポリシロキサンが好ましく挙げられるが、これらのうち、エチレンオキサイド及び／又はプロピレンオキサイドで変性されたポリジアルキルシロキサン（ポリジメチルシロキサン、ポリジエチルシロキサン、ポリジプロピルシロキサン、ポリジブチルシロキサン、ポリジペンチルシロキサン等）がより好ましい。 Examples of the silicon leveling agent include organically modified polysiloxanes such as polyether-modified, polyester-modified, and aralkyl-modified. Of these, polyether-modified polysiloxane is preferable from the viewpoint of compatibility with the epoxy resin. Preferred examples of the polyether-modified polysiloxane include alkylene oxide-modified polysiloxanes such as ethylene oxide, propylene oxide, butylene oxide, and tetramethylene oxide. Among these, polydialkyl modified with ethylene oxide and / or propylene oxide. Siloxane (polydimethylsiloxane, polydiethylsiloxane, polydipropylsiloxane, polydibutylsiloxane, polydipentylsiloxane, etc.) is more preferable.
このようなシリコン系レベリング剤として、ポリジアルキルシロキサンを例示すれば、例えば、側鎖型ポリエーテル変性ポリジアルキルシロキサン（ポリジアルキルシロキサンの側鎖の一部をポリエーテル変性したもの）、末端型ポリエーテル変性ポリジアルキルシロキサン（ポリジアルキルシロキサンの末端をポリエーテル変性したものであって片方の末端を変性した片末端型、両末端を変性した両末端型がある。）、側鎖・末端型ポリエーテル変性ポリジアルキルシロキサン（ポリジアルキルシロキサンの側鎖の一部と末端をポリエーテル変性したもの）を挙げることができる。側鎖型ポリエーテル変性ポリジアルキルシロキサンとしては、下記式（１）で表されるポリエーテル変性ポリジメチルシロキサンを例示することができる。他のポリジアルキルシロキサンも同様に表すことができる。 Examples of such silicon leveling agents include polydialkylsiloxanes. For example, side-chain polyether-modified polydialkylsiloxane (polydialkylsiloxane with part of the side chain polyether-modified), terminal-type polyether Modified polydialkyl siloxane (polydialkyl siloxane end modified with polyether, one end modified with one end modified, both ends modified with both ends), side chain / terminal polyether modified Examples thereof include polydialkylsiloxanes (polydialkylsiloxanes having part of the side chain and terminal modified with polyether). Examples of the side chain polyether-modified polydialkylsiloxane include polyether-modified polydimethylsiloxane represented by the following formula (1). Other polydialkylsiloxanes can be similarly represented.
式（１）中、ＰＥはポリエーテル残基を表す。ＲはＨ又はアルキル基（例えば、メチル基、エチル基等）を表す。ｘ、ｙ、ｚはそれぞれ繰り返し数を表す。 In formula (1), PE represents a polyether residue. R represents H or an alkyl group (for example, a methyl group, an ethyl group, etc.). x, y, and z each represent the number of repetitions.
上記シリコン系レベリング剤は、表面張力が１５〜３０ｍＮ／ｍのものが好ましい。上記表面張力は、後述する液滴法で測定することができる。 The silicon leveling agent preferably has a surface tension of 15 to 30 mN / m. The surface tension can be measured by a droplet method described later.
上記シリコン系レベリング剤は、分子量（重量平均分子量Ｍｗ。以下、断らないかぎり同様。）が１０，０００〜５０，０００のものが、低重量減率、印刷性等の観点から好ましい。より好ましくは２０，０００〜３５，０００である。 The silicon leveling agent preferably has a molecular weight (weight average molecular weight Mw; hereinafter the same unless otherwise specified) from the viewpoint of low weight loss, printability, and the like. More preferably, it is 20,000-35,000.
またシリコン系レベリング剤以外の他のレベリング剤、例えば、アクリル系レベリング剤、フッ素系レベリング剤を併用することもできる。この場合、他のレべリング剤の配合割合は、レベリング剤全体のうち５０重量％未満とすることが好ましい。他のレベリング剤を併用する場合もＨＬＢ値は上記範囲であることが好ましく、あるいは、レベリング剤全体としてのＨＬＢ値が上記範囲内であるようにしてもよい。また、他のレベリング剤の分子量も上記範囲であることが好ましい。 In addition, other leveling agents other than the silicon leveling agent, for example, an acrylic leveling agent and a fluorine leveling agent may be used in combination. In this case, the blending ratio of the other leveling agents is preferably less than 50% by weight of the whole leveling agent. Also when other leveling agents are used in combination, the HLB value is preferably within the above range, or the HLB value as a whole leveling agent may be within the above range. Moreover, it is preferable that the molecular weight of another leveling agent is also in the above range.
本発明の電子部品封止用接着剤において、レベリング剤の配合量は、エポキシ樹脂１００重量部に対して、例えば、０．０１〜６重量部であり、０．２〜４重量部が好ましい。レベリング剤の配合量がエポキシ樹脂１００重量部に対して、０．２〜４重量部であると、接着剤の経時安定性や印刷性が良好であり、この範囲より少ないと経時安定性が悪くなり、この範囲を超えると接着剤の硬化性に影響がある。 In the electronic component sealing adhesive of the present invention, the amount of the leveling agent is, for example, 0.01 to 6 parts by weight and preferably 0.2 to 4 parts by weight with respect to 100 parts by weight of the epoxy resin. When the blending amount of the leveling agent is 0.2 to 4 parts by weight with respect to 100 parts by weight of the epoxy resin, the temporal stability and printability of the adhesive are good, and when less than this range, the temporal stability is poor. If this range is exceeded, the curability of the adhesive is affected.
本発明の電子部品封止用接着剤において、必要により添加される任意成分としては、無機フィラー、シランカップリング剤、消泡剤、粘着剤等が挙げられる。例えば、シランカップリング剤を添加すると、液状樹脂と無機フィラーの馴染みを向上できるという効果がある。シランカップリングとしては、例えば、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、メルカプトシラン、スルフィドシラン、ウレイドシラン、アミノシラン等が挙げられる。また無機フィラーとしては、例えば、タルク、シリカ、炭酸カルシウム、マイカ、アルミナを挙げることができる。このような無機フィラーは、耐湿性を目的として配合することができる。 In the electronic component sealing adhesive of the present invention, optional components added as necessary include inorganic fillers, silane coupling agents, antifoaming agents, pressure-sensitive adhesives, and the like. For example, the addition of a silane coupling agent has the effect of improving the familiarity between the liquid resin and the inorganic filler. Examples of the silane coupling include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4- Epoxycyclohexyl) ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, mercaptosilane, sulfide silane, ureidosilane, aminosilane and the like. Examples of the inorganic filler include talc, silica, calcium carbonate, mica, and alumina. Such an inorganic filler can be mix | blended for the purpose of moisture resistance.
上記無機フィラーの配合量としては、エポキシ樹脂１００重量部に対して、１０〜８０重量部が好ましく、２０〜７０重量部がより好ましい。 As a compounding quantity of the said inorganic filler, 10-80 weight part is preferable with respect to 100 weight part of epoxy resins, and 20-70 weight part is more preferable.
本発明の電子部品封止用接着剤は、ガラス等の透明基板との濡れ性が充分に確保できるようにするために、好ましくは表面張力が２５〜４０ｍＮ／ｍ、より好ましくは３０〜３５ｍＮ／ｍにすることができる。上記表面張力は、液滴法で測定することができる。液滴法とは、鉛直方向に向けた細管の先端から液体を押し出し、細管の先端に液滴がぶら下がるようにし、その液滴の形状から表面張力を求める方法であり、具体的には、液滴の最大径ｄと、液滴の最下端から上記最大径ｄに等しい距離だけ上昇した位置における液滴径ｓとを測定して、以下の式により算出する方法である。
表面張力γ＝Δρ・ｇ・ｄ２×（１／Ｈ）
上記式中、Δρは密度差、ｇは重力加速度、ｄは液滴の最大径、１／Ｈはｓ／ｄから求める補正係数である。もしも温度により値が有意に異なる場合は２５℃での値とする。
The adhesive for electronic component sealing of the present invention preferably has a surface tension of 25 to 40 mN / m, more preferably 30 to 35 mN / m in order to ensure sufficient wettability with a transparent substrate such as glass. m. The surface tension can be measured by a droplet method. The droplet method is a method in which a liquid is extruded from the tip of a narrow tube oriented in the vertical direction so that the droplet hangs from the tip of the narrow tube, and the surface tension is obtained from the shape of the droplet. In this method, the maximum diameter d of the droplet and the droplet diameter s at a position elevated from the lowermost end of the droplet by a distance equal to the maximum diameter d are measured and calculated by the following equation.
Surface tension γ = Δρ · g · d2 × (1 / H)
In the above formula, Δρ is a density difference, g is a gravitational acceleration, d is a maximum droplet diameter, and 1 / H is a correction coefficient obtained from s / d. If the value varies significantly depending on the temperature, the value is 25 ° C.
本発明の電子部品封止用接着剤は、塗布性、特に印刷塗布性の観点から、２５℃における粘度が１０００〜１０００００ｍＰａ・ｓであることが好ましく、２０００〜５００００ｍＰａ・ｓであることがより好ましい。粘度はE型粘度計で測定することができる。 The adhesive for electronic component sealing of the present invention preferably has a viscosity at 25 ° C. of 1000 to 100,000 mPa · s, more preferably 2000 to 50000 mPa · s, from the viewpoint of applicability, particularly print applicability. . The viscosity can be measured with an E-type viscometer.
また、本発明の電子部品封止用接着剤は、透明度を確保する観点から、全光線透過率が、９０％以上であることが好ましく、９５％以上であることがより好ましい。上記全光線透過率は、接着剤の硬化前後で実質的に変化しないが、もしも変化がある場合は、接着剤の硬化後の値であることが好ましい。 Moreover, the adhesive for electronic component sealing of the present invention has a total light transmittance of preferably 90% or more, and more preferably 95% or more, from the viewpoint of ensuring transparency. The total light transmittance is not substantially changed before and after curing of the adhesive, but if there is a change, it is preferably a value after curing of the adhesive.
本発明の電子部品封止用接着剤は、低分子量成分、例えば、溶剤、シランカップリング剤等を使用しないことにより、アウトガスを低減することができる。 The adhesive for electronic component sealing of the present invention can reduce outgassing by not using a low molecular weight component such as a solvent or a silane coupling agent.
本発明の電子部品封止用接着剤の硬化条件としては、光硬化の場合は、ＵＶ、電子線等を照射するが、例えばＵＶ照射の場合、照射量は、例えば、１００〜１００００ｍＪ／ｃｍ２程度とすることができる。照射装置としては、例えば、紫外線ランプ（キセノンランプ、キセノン水銀ランプ、メタルハライドランプ等）、アーク式照射装置等を使用することができる。 As curing conditions for the adhesive for sealing an electronic component of the present invention, UV, electron beam, etc. are irradiated in the case of photocuring. It can be. As the irradiation device, for example, an ultraviolet lamp (xenon lamp, xenon mercury lamp, metal halide lamp, etc.), an arc type irradiation device, or the like can be used.
本発明の電子部品封止用接着剤の硬化条件としては、熱硬化の場合は、例えば、５０〜１００℃、３０〜１８０分の条件を好ましく適用できる。 As curing conditions for the adhesive for sealing electronic components of the present invention, in the case of thermosetting, for example, conditions of 50 to 100 ° C. and 30 to 180 minutes can be preferably applied.
本発明の電子部品封止用接着剤の製造方法としては、原料が均一に混合するように配合すればよく、例えば、上述した所要の各成分を、常法により、例えば、６０〜８０℃、１０〜１０００Ｐａで、３０分から２時間、撹拌混合し、必要に応じて脱泡処理を行う。 As a manufacturing method of the adhesive for electronic component sealing of this invention, what is necessary is just to mix | blend so that a raw material may mix uniformly, For example, each required component mentioned above is a normal method, for example, 60-80 degreeC, The mixture is stirred and mixed at 10 to 1000 Pa for 30 minutes to 2 hours, and defoaming is performed as necessary.
本発明の電子部品封止用接着剤は、一液型とすることも、二液型とすることもできる。二液型の場合は接着剤成分のうち、樹脂成分と硬化剤及び開始剤成分とをそれぞれに別液とすればよい。 The adhesive for electronic component sealing of the present invention can be a one-pack type or a two-pack type. In the case of the two-component type, the resin component, the curing agent, and the initiator component among the adhesive components may be separated from each other.
本発明の電子部品封止用接着剤は、その用途として、ＴＦＴ、ＬＥＤ、有機ＥＬ等の発光電子部品や、液晶表示装置、光導波路基板、水晶振動子、ＭＥＭＳ、パワーデバイス等の電子部品において、透明基板を封止接着する用途に好適に使用することができる。この場合において、上記透明基板としては、ガラスを挙げることができるが、これに限定されるものではなく、例えば、ＰＥＴ等の透明樹脂であってもよい。 The electronic component sealing adhesive of the present invention can be used in light emitting electronic components such as TFT, LED, and organic EL, and in electronic components such as liquid crystal display devices, optical waveguide substrates, crystal resonators, MEMS, and power devices. It can be suitably used for applications in which a transparent substrate is sealed and bonded. In this case, examples of the transparent substrate include glass, but are not limited thereto, and may be, for example, a transparent resin such as PET.
本発明の電子部品封止用接着剤は、本発明の電子部品製造方法に好適に適用することができる。すなわち、本発明の電子部品製造方法は、電子発光層を挟んで二枚の基板を封止用接着剤で封止接着した構造を有する電子部品の製造方法であって、（１）前記二枚の基板のうちの少なくとも一枚の表面に、本発明の電子部品封止用接着剤を印刷塗布する工程、（２）前記二枚のうちのいずれかの基板上に予め形成された前記電子発光層を挟んで、前記二枚の基板を前記塗布された接着剤を介して貼り合わせる工程、（３）前記塗布された接着剤を硬化させる工程、を有する電子部品の製造方法である。 The electronic component sealing adhesive of the present invention can be suitably applied to the electronic component manufacturing method of the present invention. That is, the electronic component manufacturing method of the present invention is a method for manufacturing an electronic component having a structure in which two substrates are sealed and bonded with a sealing adhesive with an electroluminescent layer interposed therebetween. A step of printing and applying the electronic component sealing adhesive of the present invention on the surface of at least one of the substrates; (2) the electroluminescence previously formed on one of the two substrates An electronic component manufacturing method comprising: a step of bonding the two substrates through the applied adhesive with a layer interposed therebetween; and (3) a step of curing the applied adhesive.
上記電子部品としては、例えば、表示装置であってもよく、発光装置、照明装置等であってもよい。また、上記電子発光層としては、有機ＬＥＤ発光層であってもよい。また必要に応じて、電子発光層が接着剤と直接接触するのを防ぐため、電子発光層表面に無機パッシベーション膜等の保護膜を設けても良い。無機パッシベーション膜は、例えば、ＳｉＯ２、Ｓｉ３Ｎ４、Ａｌ２Ｏ３、ＩＴＯ、ＳｉＯｘＮｙ等からなる膜を挙げることができる。 The electronic component may be, for example, a display device, a light emitting device, a lighting device, or the like. Further, the electroluminescent layer may be an organic LED luminescent layer. If necessary, a protective film such as an inorganic passivation film may be provided on the surface of the electroluminescent layer in order to prevent the electroluminescent layer from coming into direct contact with the adhesive. Examples of the inorganic passivation film include a film made of SiO2, Si3N4, Al2O3, ITO, SiOxNy, or the like.
上記基板としては、二枚の基板は、いずれもガラス基板であってもよいが、それに限定されず、ガラスと樹脂、樹脂と樹脂、等であってもよい。 As the substrate, the two substrates may be glass substrates, but are not limited thereto, and may be glass and resin, resin and resin, or the like.
上記工程（１）において、本発明の電子部品封止用接着剤を印刷塗布する方法としては、スクリーンプリント、グラビア、フレキソ、インクジェット等の方法により、透明基板の表面、好ましくは全面に、厚さ５〜５０μｍ程度で塗布することができる。また、減圧下に印刷することも接着材中に気泡を生じないようにするうえで好ましい。その後、必要があれば、塗布された前記接着剤から溶剤を揮発させ乾燥させる。乾燥は、室温にて通気乾燥させても良いし、例えば、５０〜１００℃、１０秒〜１０分の条件で加熱乾燥させても良い。 In the above step (1), as a method for printing and applying the electronic component sealing adhesive of the present invention, a method such as screen printing, gravure, flexo, ink jet, or the like is used. It can apply | coat by about 5-50 micrometers. It is also preferable to print under reduced pressure so as not to generate bubbles in the adhesive. Thereafter, if necessary, the solvent is volatilized from the applied adhesive and dried. Drying may be carried out by aeration at room temperature, for example, by heating at 50 to 100 ° C. for 10 seconds to 10 minutes.
上記工程（２）においては、予め基板上に形成された電子発光層を挟んで、二枚の基板、そのうちの少なくとも一枚は透明基板であることが通常であるが、シールド部材として上記基板で電子発光層を覆い、かつ、封止接着剤で隙間を満たして封止しつつ、基板同士を接着剤を介して貼り合わせる。この際に工程を減圧下に行うこともできる。 In the step (2), two substrates, usually at least one of which is a transparent substrate, sandwiching an electroluminescent layer previously formed on the substrate, is usually the above substrate as a shielding member. The substrates are bonded together with an adhesive while covering the electroluminescent layer and filling the gap with a sealing adhesive. At this time, the process may be performed under reduced pressure.
あるいは、その代わり又はさらに、工程（１）で塗布された接着剤層の真空脱泡を行う工程を、工程（２）の前に実施することもできる。真空脱泡は、例えば、６０〜８０℃、０．０１〜１０Ｐａで、１から５時間で行うことができる。 Alternatively, or in addition, the step of performing vacuum defoaming of the adhesive layer applied in step (1) can be performed before step (2). The vacuum defoaming can be performed, for example, at 60 to 80 ° C. and 0.01 to 10 Pa in 1 to 5 hours.
上記工程（３）において、接着剤を光硬化させることが好ましい。 In the step (3), the adhesive is preferably photocured.
以下、実施例により本発明をさらに具体的に説明するが、以下の記載は専ら説明のためであって、本発明はこれらの実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, the following description is only for description and the present invention is not limited to these Examples.
以下の実施例、比較例中の略号の意味は以下のとおり。なお、表中の配合量の単位は重量部である。
液状エポキシ樹脂：ＡＥＲ２６０（商品名）、旭化成ケミカルズ社製、ビスフェノールＡ型エポキシ樹脂、エポキシ当量１８９ｇ／ｅｑ
固形エポキシ樹脂：ＡＥＲ６０６４（商品名）、旭化成ケミカルズ社製、ビスフェノールＡ型エポキシ樹脂、エポキシ当量９２５ｇ／ｅｑ
カップリング剤１：スルフィド系カップリング剤ＴＳＬ８３８０（商品名）、モメンティブ・パフォーマンス・マテリアルズ・ジャパン社製
カップリング剤２：シラン系カップリング剤Ａ１８７（商品名）、モメンティブ・パフォーマンス・マテリアルズ・ジャパン社製
重合開始剤１：トリアリルスルホニウムヘキサフルオロアンチモン系重合開始剤ＡＴ６９７６（商品名）、Ａｃｅｔｏ Ｃｈｅｍｉｃａｌ社製、５０％プロピレンカーボネート溶液
重合開始剤２：重合開始剤ＡＴ６９７６（商品名）、溶剤含有せず
ＢＹＫ−３３３：シリコン系レベリング剤、ポリエーテル変性ポリジメチルシロキサン、ＨＬＢ値７．０
ＯＫ−０１：シリコン系レベリング剤、側鎖型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ／ＰＯ変性であるレベリング剤、ＨＬＢ値８．０
ＯＫ−０２：シリコン系レベリング剤、側鎖型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ／ＰＯ変性であるレベリング剤、ＨＬＢ値１２．０
ＯＫ−０３：シリコン系レベリング剤、側鎖型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ／ＰＯ変性であるレベリング剤、ＨＬＢ値８．０
ＯＫ−０４：シリコン系レベリング剤、側鎖型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ変性であるレベリング剤、ＨＬＢ値１３．０
ＯＫ−０５：シリコン系レベリング剤、側鎖型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ変性であるレベリング剤、ＨＬＢ値１２．０
ＯＫ−０６：シリコン系レベリング剤、末端型ポリエーテル変性ジメチルシロキサンのポリエーテル変性がＥＯ変性であるレベリング剤、ＨＬＢ値１０．０
Ｓ１４５：サーフロンＳ１４５（商品名）、ＡＧＣセイケミカル社製、フルオロアルキル系レベリング剤、ＨＬＢ値１３．０
The meanings of the abbreviations in the following examples and comparative examples are as follows. In addition, the unit of the compounding quantity in a table | surface is a weight part.
Liquid epoxy resin: AER260 (trade name), manufactured by Asahi Kasei Chemicals Corporation, bisphenol A type epoxy resin, epoxy equivalent 189 g / eq
Solid epoxy resin: AER6064 (trade name), manufactured by Asahi Kasei Chemicals Corporation, bisphenol A type epoxy resin, epoxy equivalent 925 g / eq
Coupling agent 1: Sulfide coupling agent TSL8380 (trade name), Momentive Performance Materials Japan Co. coupling agent 2: Silane coupling agent A187 (trade name), Momentive Performance Materials Japan Polymerization initiator 1: Triallylsulfonium hexafluoroantimony polymerization initiator AT6976 (trade name), manufactured by Aceto Chemical, 50% propylene carbonate solution polymerization initiator 2: Polymerization initiator AT6976 (trade name), containing solvent BYK-333: Silicon-based leveling agent, polyether-modified polydimethylsiloxane, HLB value 7.0
OK-01: Silicon-based leveling agent, leveling agent in which polyether modification of side chain polyether-modified dimethylsiloxane is EO / PO modification, HLB value 8.0
OK-02: Silicon-based leveling agent, leveling agent in which the polyether modification of the side chain polyether-modified dimethylsiloxane is EO / PO modification, HLB value 12.0
OK-03: Silicon-based leveling agent, leveling agent in which the polyether modification of the side chain polyether-modified dimethylsiloxane is EO / PO modification, HLB value 8.0
OK-04: Leveling agent with silicon level, leveling agent with polyether modification of side chain polyether-modified dimethylsiloxane being EO modification, HLB value 13.0
OK-05: Silicon-based leveling agent, leveling agent in which polyether modification of side chain polyether-modified dimethylsiloxane is EO modification, HLB value 12.0
OK-06: Silicon-based leveling agent, leveling agent in which polyether modification of terminal polyether-modified dimethylsiloxane is EO modification, HLB value 10.0
S145: Surflon S145 (trade name), manufactured by AGC Seikagaku Co., Ltd., fluoroalkyl leveling agent, HLB value 13.0
なおＯＫ−０１〜ＯＫ−０６は以下の方法で調製した。
すなわち、上記した各ＥＯ及び／又はＰＯ変性を行ったエチレン１３．４重量部、トルエン２０重量部、テトラクロロ白金酸（H２ＰｔＣｌ４）０．０１重量部を反応容器に仕込み、密閉下で加熱し、圧抜きしながら１ｋｇ／ｃｍ２（ゲージ圧）で、内温１３４℃まで加熱した。次いでこの反応容器内へポリジメチルシロキサン１００重量部を攪拌下に圧入した。さらに同一温度に２時間保った。その後冷却し、反応液をストリッピングして、ＯＫ−０１〜ＯＫ−０６の各ポリエーテル変性ポリジメチルシロキサンを得た。
OK-01 to OK-06 were prepared by the following method.
That is, 13.4 parts by weight of the above-mentioned EO and / or PO-modified ethylene, 20 parts by weight of toluene, 0.01 parts by weight of tetrachloroplatinic acid (H 2 PtCl 4) were charged in a reaction vessel, and heated in a sealed state. While depressurizing, the inner temperature was heated to 134 ° C. at 1 kg / cm 2 (gauge pressure). Next, 100 parts by weight of polydimethylsiloxane was pressed into the reaction vessel with stirring. Furthermore, it was kept at the same temperature for 2 hours. Thereafter, the mixture was cooled and the reaction solution was stripped to obtain each polyether-modified polydimethylsiloxane of OK-01 to OK-06.
実施例１〜１０、比較例１〜３
表１の配合（重量部）で各成分を混合し、５００Ｐａで、１時間の条件下で脱泡して、実施例、比較例の各接着剤を調製した。得られた接着剤を、ダミー電子発光層を形成したガラス基板（５ｃｍ×５ｃｍの光学ガラス）に、スクリーンプリント(スクリーン印刷機：ミナミ社製ＭＫ−２８０ＳＡ)で、塗布厚み２０μｍになるように全面塗布した。この基板を１Ｐａ、７０℃、４時間の条件で真空脱泡したのち、別のガラス基板を、ダミー電子発光層を挟んではりつけた。つぎに、ガラス基板の上からＵＶ照射（６０００ｍＪ／ｃｍ２）して接着剤を硬化した。表２の評価項目を下記の方法で評価した。結果を表２に示した。ただし、相溶性の評価結果が悪かった比較例３については、その他の評価は行わなかった。
また、全光線透過度をＵＶ硬化後の各試料について、６２０ｎｍの波長で透過率を測定（島津社製：ＵＶ−２４５０使用。）したところ、実施例１〜１０は全て、透過率９０％以上であった。
実施例で調製した各接着剤について、常温（２５℃）での粘度をＥ型粘度計（５ｒｐｍ）で測定した結果、２０００〜５００００ｍＰａ・ｓの範囲内の粘度であることを確かめた。
Examples 1-10, Comparative Examples 1-3
Each component was mixed by the mixing | blending (weight part) of Table 1, and it degas | foamed on conditions of 500 Pa for 1 hour, and each adhesive agent of an Example and a comparative example was prepared. The obtained adhesive is coated on a glass substrate (5 cm × 5 cm optical glass) on which a dummy electroluminescent layer is formed by screen printing (screen printing machine: MK-280SA manufactured by Minami Co., Ltd.) so that the coating thickness is 20 μm. Applied. This substrate was degassed under vacuum at 1 Pa, 70 ° C. for 4 hours, and another glass substrate was attached with a dummy electroluminescent layer interposed therebetween. Next, the adhesive was cured by UV irradiation (6000 mJ / cm 2) from above the glass substrate. The evaluation items in Table 2 were evaluated by the following methods. The results are shown in Table 2. However, the other evaluation was not performed about the comparative example 3 whose compatibility evaluation result was bad.
Further, the transmittance of each sample after UV curing was measured at a wavelength of 620 nm (manufactured by Shimadzu Corporation: using UV-2450), and all of Examples 1 to 10 had a transmittance of 90% or more. Met.
About each adhesive agent prepared in the Example, as a result of measuring the viscosity in normal temperature (25 degreeC) with an E-type viscosity meter (5 rpm), it was confirmed that it is a viscosity within the range of 2000-50000 mPa * s.
評価方法
レベリング剤分子量：レベリング剤の分子量をＧＰＣで測定したＭｗ値。
表面張力１：レベリング剤について、２５℃雰囲気下、表面張力計（協和界面社製：ＤＭ−３０１）を用い液滴法により測定した。
表面張力２：調製した接着剤について、２５℃雰囲気下、表面張力計（協和界面社製：ＤＭ−３０１）を用い液滴法により測定した。
相溶性：ガラス瓶に（レベリング剤を含まない）接着剤を１００重量部測りとり、各種レベリング剤／シランカップリング剤を１重量部加え混合し、外観を観察した。以下の基準で評価した。
○：白濁は観察されなかった
×：白濁が観察された
印刷性１：調製した接着剤を全面塗布後、真空脱泡することなく、７０℃、１０分間放置し、外観を観察した。以下の基準で評価した。
○：印刷形状が保持できた
×：印刷形状が保持できなかった
印刷性２：調製した接着剤を全面塗布し、真空脱泡後の外観を、上記と同様にして観察した。以下の基準で評価した。
◎：印刷形状が保持できた
○：印刷形状の一部が保持できなかった
×：印刷形状のほとんどが保持できなかった
経時安定性：調製した接着剤を５℃、１ヶ月保管した後、上記と同じく、印刷性の評価（外観を観察）を行った。以下の基準で評価した。
◎：印刷形状が保持できた
○：印刷形状の一部が保持できなかった
×：印刷形状のほとんどが保持できなかった
Evaluation method Leveling agent molecular weight: Mw value obtained by measuring the molecular weight of the leveling agent by GPC.
Surface tension 1: The leveling agent was measured by a droplet method in a 25 ° C. atmosphere using a surface tension meter (manufactured by Kyowa Interface Co., Ltd .: DM-301).
Surface tension 2: The prepared adhesive was measured by a droplet method using a surface tension meter (manufactured by Kyowa Interface Co., Ltd .: DM-301) in an atmosphere of 25 ° C.
Compatibility: 100 parts by weight of an adhesive (not containing a leveling agent) was weighed into a glass bottle, 1 part by weight of various leveling agents / silane coupling agents were added and mixed, and the appearance was observed. Evaluation was made according to the following criteria.
○: No white turbidity was observed x: Printability in which white turbidity was observed 1: After coating the prepared adhesive on the entire surface, it was allowed to stand at 70 ° C. for 10 minutes without vacuum defoaming, and the appearance was observed. Evaluation was made according to the following criteria.
◯: Print shape could be maintained x: Print shape could not be maintained Printability 2: The prepared adhesive was applied over the entire surface, and the appearance after vacuum defoaming was observed in the same manner as described above. Evaluation was made according to the following criteria.
A: The printed shape could be retained. O: A part of the printed shape could not be retained. X: Most of the printed shape could not be retained. Stability over time: After the prepared adhesive was stored at 5 ° C. for 1 month, the above In the same manner as above, the printability was evaluated (observation of appearance). Evaluation was made according to the following criteria.
◎: Print shape could be retained ○: Part of the print shape could not be retained ×: Most of the print shape could not be retained
実施例の結果から本発明の接着剤は、透明性が高く、表面張力が充分に低く、透明基板との濡れ性が確保され、印刷性に優れており、しかもこれらの特性が経時安定であった。印刷性２に示すように、塗布時の泡の噛み込みを防ぐための脱泡を行っても、印刷塗布した形状の保持性に優れた特性を維持する。特に、１０，０００〜５０，０００の分子量範囲である場合により優れた特性を発揮し、このことは、脱泡によっても、アウトガスを抑えることも可能な接着剤層を、印刷塗布で形成することができることを示す。従って、本発明の接着剤は、電子部品の印刷塗布による封止工程を含む電子部品の製造方法に好適に適用することができることがわかった。 From the results of the examples, the adhesive of the present invention has high transparency, sufficiently low surface tension, ensures wettability with a transparent substrate, has excellent printability, and these characteristics are stable over time. It was. As shown in the printability 2, even when defoaming is performed to prevent the entrapment of bubbles at the time of application, the characteristics excellent in the retainability of the printed and applied shape are maintained. In particular, when the molecular weight is in the range of 10,000 to 50,000, it exhibits better characteristics, which means that an adhesive layer that can suppress outgassing by defoaming is formed by printing. Show that you can. Therefore, it turned out that the adhesive agent of this invention can be applied suitably for the manufacturing method of an electronic component including the sealing process by the printing application | coating of an electronic component.
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