JP2014146995A - モジュール - Google Patents
モジュール Download PDFInfo
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- JP2014146995A JP2014146995A JP2013014851A JP2013014851A JP2014146995A JP 2014146995 A JP2014146995 A JP 2014146995A JP 2013014851 A JP2013014851 A JP 2013014851A JP 2013014851 A JP2013014851 A JP 2013014851A JP 2014146995 A JP2014146995 A JP 2014146995A
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- wiring
- antenna
- duplexer
- inductor
- impedance
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- 239000000758 substrate Substances 0.000 claims description 41
- 239000004020 conductor Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 description 57
- 230000005540 biological transmission Effects 0.000 description 30
- 238000010586 diagram Methods 0.000 description 12
- 238000010897 surface acoustic wave method Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Transceivers (AREA)
Abstract
【解決手段】本発明は、アンテナパッド60aを含むデュプレクサ60と、アンテナパッド60aに接続され、かつアンテナに接続されるアンテナ配線55aと、アンテナ配線55aを介さずにアンテナパッド60aに接続された配線56aと、配線56aに接続されたインダクタL2と、を具備するモジュールである。本発明によればインピーダンス整合を適切に取ることが可能である。
【選択図】図7
Description
26、60 デュプレクサ
28a 受信端子
28b 送信端子
45 圧電基板
46 IDT
50a 多層基板
54a、60a アンテナパッド
54b、54c パッド
55a アンテナ配線
55b 送信配線
55c 受信配線
55f、56a 配線
59、59a ビア配線
100 モジュール
L1、L2、L3 インダクタ
Claims (7)
- アンテナ端子を含むデュプレクサと、
前記アンテナ端子に接続され、かつアンテナに接続される第1配線と、
前記第1配線を介さずに前記アンテナ端子に接続された第2配線と、
前記第2配線に接続されたインダクタと、を具備することを特徴とするモジュール。 - 前記デュプレクサは基板に実装され、
前記第1配線及び前記第2配線は前記基板に設けられていることを特徴とする請求項1記載のモジュール。 - 前記基板は、積層された複数の導体層を含む多層基板であり、
前記第1配線と前記第2配線とは、異なる導体層に設けられていることを特徴とする請求項2記載のモジュール。 - 前記デュプレクサは弾性波フィルタを含み、
前記弾性波フィルタはIDTを備えることを特徴とする請求項1から3いずれか一項記載のモジュール。 - 前記デュプレクサは前記基板の上面にフリップチップ実装され、
前記アンテナ端子は、前記基板の上面に設けられたアンテナパッドと接続され、
前記第1配線は前記アンテナパッドと接続され、
前記第2配線は前記第1配線を介さずに前記アンテナパッドと接続されていることを特徴とする請求項2から4いずれか一項記載のモジュール。 - 前記インダクタの一端は前記第2配線に接続され、前記インダクタの他端は接地されていることを特徴とする請求項1から5いずれか一項記載のモジュール。
- 前記インダクタは前記基板に実装されたチップ部品に含まれることを特徴とする請求項2から6いずれか一項記載のモジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013014851A JP6112654B2 (ja) | 2013-01-29 | 2013-01-29 | モジュール |
US14/091,826 US9571062B2 (en) | 2013-01-29 | 2013-11-27 | Module |
SG2013090618A SG2013090618A (en) | 2013-01-29 | 2013-12-06 | Module |
CN201410039620.6A CN103973256B (zh) | 2013-01-29 | 2014-01-27 | 模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013014851A JP6112654B2 (ja) | 2013-01-29 | 2013-01-29 | モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014146995A true JP2014146995A (ja) | 2014-08-14 |
JP6112654B2 JP6112654B2 (ja) | 2017-04-12 |
Family
ID=51222327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013014851A Active JP6112654B2 (ja) | 2013-01-29 | 2013-01-29 | モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US9571062B2 (ja) |
JP (1) | JP6112654B2 (ja) |
CN (1) | CN103973256B (ja) |
SG (1) | SG2013090618A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10447411B2 (en) * | 2015-08-25 | 2019-10-15 | Samsung Electro-Mechanics Co., Ltd. | Acoustic wave device and method of manufacturing the same |
CN108432131B (zh) * | 2015-12-28 | 2021-06-04 | 株式会社村田制作所 | 多工器 |
JP6669132B2 (ja) * | 2017-06-23 | 2020-03-18 | 株式会社村田製作所 | マルチプレクサ、送信装置および受信装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004328676A (ja) * | 2003-04-28 | 2004-11-18 | Fujitsu Media Device Kk | 分波器及び電子装置 |
JP2005102098A (ja) * | 2003-08-29 | 2005-04-14 | Kyocera Corp | 高周波モジュール及びそれを用いた無線通信装置 |
JP2007259296A (ja) * | 2006-03-24 | 2007-10-04 | Toshiba Corp | アンテナ共用器および携帯電話 |
WO2009028683A1 (ja) * | 2007-08-30 | 2009-03-05 | Kyocera Corporation | 電子部品 |
WO2010140445A1 (ja) * | 2009-06-04 | 2010-12-09 | 株式会社村田製作所 | 弾性波装置及びデュプレクサ |
JP4713636B2 (ja) * | 2006-03-08 | 2011-06-29 | 京セラ株式会社 | 分波器および通信装置 |
WO2012063516A1 (ja) * | 2010-11-09 | 2012-05-18 | 株式会社村田製作所 | 弾性波フィルタ装置 |
WO2013008435A1 (ja) * | 2011-07-08 | 2013-01-17 | 株式会社村田製作所 | 回路モジュール |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3833569B2 (ja) | 2001-12-21 | 2006-10-11 | 富士通メディアデバイス株式会社 | 分波器及びこれを用いた電子装置 |
JP3910187B2 (ja) | 2004-04-27 | 2007-04-25 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP2007036856A (ja) * | 2005-07-28 | 2007-02-08 | Fujitsu Media Device Kk | 共振器、フィルタおよびアンテナ分波器 |
WO2008146525A1 (ja) | 2007-05-28 | 2008-12-04 | Murata Manufacturing Co., Ltd. | デュプレクサ及び弾性波装置 |
EP2352229A4 (en) | 2008-11-05 | 2014-11-26 | Hitachi Metals Ltd | HIGH FREQUENCY SWITCHING, HIGH FREQUENCY ELEMENT AND MULTI-BAND COMMUNICATION DEVICE |
JPWO2011061904A1 (ja) | 2009-11-19 | 2013-04-04 | パナソニック株式会社 | 弾性波フィルタ装置とこれを用いたアンテナ共用器 |
JP5653161B2 (ja) | 2010-10-18 | 2015-01-14 | 太陽誘電株式会社 | 分波器 |
-
2013
- 2013-01-29 JP JP2013014851A patent/JP6112654B2/ja active Active
- 2013-11-27 US US14/091,826 patent/US9571062B2/en active Active
- 2013-12-06 SG SG2013090618A patent/SG2013090618A/en unknown
-
2014
- 2014-01-27 CN CN201410039620.6A patent/CN103973256B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004328676A (ja) * | 2003-04-28 | 2004-11-18 | Fujitsu Media Device Kk | 分波器及び電子装置 |
JP2005102098A (ja) * | 2003-08-29 | 2005-04-14 | Kyocera Corp | 高周波モジュール及びそれを用いた無線通信装置 |
JP4713636B2 (ja) * | 2006-03-08 | 2011-06-29 | 京セラ株式会社 | 分波器および通信装置 |
JP2007259296A (ja) * | 2006-03-24 | 2007-10-04 | Toshiba Corp | アンテナ共用器および携帯電話 |
WO2009028683A1 (ja) * | 2007-08-30 | 2009-03-05 | Kyocera Corporation | 電子部品 |
WO2010140445A1 (ja) * | 2009-06-04 | 2010-12-09 | 株式会社村田製作所 | 弾性波装置及びデュプレクサ |
WO2012063516A1 (ja) * | 2010-11-09 | 2012-05-18 | 株式会社村田製作所 | 弾性波フィルタ装置 |
WO2013008435A1 (ja) * | 2011-07-08 | 2013-01-17 | 株式会社村田製作所 | 回路モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN103973256A (zh) | 2014-08-06 |
US9571062B2 (en) | 2017-02-14 |
JP6112654B2 (ja) | 2017-04-12 |
US20140210684A1 (en) | 2014-07-31 |
SG2013090618A (en) | 2014-08-28 |
CN103973256B (zh) | 2017-05-24 |
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