JP2014140080A - 高効率モジュール - Google Patents
高効率モジュール Download PDFInfo
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- JP2014140080A JP2014140080A JP2014095666A JP2014095666A JP2014140080A JP 2014140080 A JP2014140080 A JP 2014140080A JP 2014095666 A JP2014095666 A JP 2014095666A JP 2014095666 A JP2014095666 A JP 2014095666A JP 2014140080 A JP2014140080 A JP 2014140080A
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Abstract
【解決手段】ベース電極、エミッタ電極、およびコレクタ電極を備えた第1の機能素子2と、第2の機能素子3とを備えたモジュール1において、第1の機能素子2のいずれかの電極と、第2の機能素子3のいずれかの電極とに直接接続するフレーム4を備え、そのフレーム4の一部を端子とする。
【選択図】図2
Description
(Schottky barrier diode)130、コイル140、コンデンサ150、及び、制御用IC160を備えている。同期整流方式DC−DCコンバータ100は、制御用IC160による制御でハイサイドMOSFET110とローサイドMOSFET120とを交互に導通させることにより、降圧を行う。同期整流方式DC−DCコンバータ100は、導通状態での電圧降下が低減できるため、回路の効率を向上できるという利点がある。
能化の妨げとなる。
aに接続している。フレーム6の上面は、ハイサイド用MOSFETチップ2のドレイン電極2cに接続している。フレーム7の他方端部分の下面は、ハイサイド用MOSFETチップ2のゲート電極2aに接続している。フレーム8の他方端部分の下面は、ローサイド用MOSFETチップ3のゲート電極3aに接続している。
する配線抵抗および配線インダクタンスは抑制されている。
MOSFETチップ2とローサイド用MOSFETチップ3とが並べて配置されている点で第1実施形態とは異なる。また、モジュール1Bにおいては、両チップ2,3が並べて配置されているため、フレーム4Bないし8Bの配置および形状(図7参照)と、モジュール1Bの下面に設けられている各端子4Baないし8Baの配置および形状(図5参照)とが第1実施形態とは異なる。
増幅された信号を供給することによりIGBT40を駆動する。
2 ハイサイド用MOSFETチップ
2a ゲート電極
2b ソース電極
2c ドレイン電極
3 ローサイド用MOSFETチップ
3a ゲート電極
3b ソース電極
3c ドレイン電極
4,5,6,7,8 フレーム
4a 出力端子
5a グランド端子
6a 入力端子
7a ハイサイド用MOSFETチップ制御用端子
8a ローサイド用MOSFETチップ制御用端子
9 樹脂パッケージ
10 SBDチップ
11 ダイオードチップ
Claims (4)
- 第1の機能素子と第2の機能素子とを備えたモジュールであって、
上記第1の機能素子は、ベース電極、エミッタ電極、およびコレクタ電極を備え、
上記第1の機能素子のいずれかの電極と、上記第2の機能素子のいずれかの電極とに直接接続するフレームを備え、
上記フレームの一部を端子とする
ことを特徴とするモジュール。 - 上記第2の機能素子は、ベース電極、エミッタ電極、およびコレクタ電極を備える
ことを特徴とする、請求項1に記載のモジュール。 - 上記第1の機能素子と上記第2の機能素子とは、上記フレームをはさんで対向するように配置されている
ことを特徴とする、請求項1または2に記載のモジュール。 - 上記第1の機能素子のコレクタ電極と上記第2の機能素子のエミッタ電極とが、上記フレームに直接接続されている
ことを特徴とする、請求項2または3に記載のモジュール。
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JP2014095666A JP2014140080A (ja) | 2014-05-07 | 2014-05-07 | 高効率モジュール |
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JP2014095666A JP2014140080A (ja) | 2014-05-07 | 2014-05-07 | 高効率モジュール |
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JP2016118438A Division JP6373901B2 (ja) | 2016-06-15 | 2016-06-15 | 高効率モジュール |
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JP2014140080A true JP2014140080A (ja) | 2014-07-31 |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161724A (ja) * | 1987-12-18 | 1989-06-26 | Citizen Watch Co Ltd | 表面実装用半導体装置の製造方法 |
JPH10116935A (ja) * | 1996-10-08 | 1998-05-06 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2000243887A (ja) * | 1999-02-23 | 2000-09-08 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP2004047850A (ja) * | 2002-07-15 | 2004-02-12 | Mitsubishi Electric Corp | パワー半導体装置 |
JP2005302951A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 電力用半導体装置パッケージ |
JP2006134990A (ja) * | 2004-11-04 | 2006-05-25 | Fuji Electric Holdings Co Ltd | 半導体装置 |
JP2006216940A (ja) * | 2005-01-07 | 2006-08-17 | Toshiba Corp | 半導体装置 |
JP2006253734A (ja) * | 2006-06-27 | 2006-09-21 | Renesas Technology Corp | 半導体装置 |
JP2007205358A (ja) * | 2007-03-26 | 2007-08-16 | Hitachi Industrial Equipment Systems Co Ltd | 無給油式スクリュー圧縮機とその運転方法 |
JP2008108912A (ja) * | 2006-10-25 | 2008-05-08 | Toyota Motor Corp | パワートランジスタ素子のパッケージ構造 |
JP2009043820A (ja) * | 2007-08-07 | 2009-02-26 | Rohm Co Ltd | 高効率モジュール |
-
2014
- 2014-05-07 JP JP2014095666A patent/JP2014140080A/ja active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161724A (ja) * | 1987-12-18 | 1989-06-26 | Citizen Watch Co Ltd | 表面実装用半導体装置の製造方法 |
JPH10116935A (ja) * | 1996-10-08 | 1998-05-06 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2000243887A (ja) * | 1999-02-23 | 2000-09-08 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP2004047850A (ja) * | 2002-07-15 | 2004-02-12 | Mitsubishi Electric Corp | パワー半導体装置 |
JP2005302951A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 電力用半導体装置パッケージ |
JP2006134990A (ja) * | 2004-11-04 | 2006-05-25 | Fuji Electric Holdings Co Ltd | 半導体装置 |
JP2006216940A (ja) * | 2005-01-07 | 2006-08-17 | Toshiba Corp | 半導体装置 |
JP2006253734A (ja) * | 2006-06-27 | 2006-09-21 | Renesas Technology Corp | 半導体装置 |
JP2008108912A (ja) * | 2006-10-25 | 2008-05-08 | Toyota Motor Corp | パワートランジスタ素子のパッケージ構造 |
JP2007205358A (ja) * | 2007-03-26 | 2007-08-16 | Hitachi Industrial Equipment Systems Co Ltd | 無給油式スクリュー圧縮機とその運転方法 |
JP2009043820A (ja) * | 2007-08-07 | 2009-02-26 | Rohm Co Ltd | 高効率モジュール |
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