JP2014137939A - LED lamp - Google Patents
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- JP2014137939A JP2014137939A JP2013006726A JP2013006726A JP2014137939A JP 2014137939 A JP2014137939 A JP 2014137939A JP 2013006726 A JP2013006726 A JP 2013006726A JP 2013006726 A JP2013006726 A JP 2013006726A JP 2014137939 A JP2014137939 A JP 2014137939A
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
本発明は、主に屋外での使用を目的としたＬＥＤランプに関する。 The present invention relates to an LED lamp mainly intended for outdoor use.
近年、環境意識の高まりから、省電力化に優れたＬＥＤ素子を光源に使用した、電源回路が内蔵された電球形のＬＥＤランプが盛んに用いられるようになってきた。特に最近は、高輝度なＬＥＤランプが求められるようになってきており、そのために使用されるＬＥＤ素子も出力の大きなものが使用され、供給する電力も大きくなってきている。これに伴ってＬＥＤ素子が実装された基板の温度上昇を抑制するとともに、ＬＥＤ素子を点灯する点灯回路から発生する熱がＬＥＤ素子に影響しないように対策が必要である。そのために、両者間での熱的な影響を減らし、それぞれの放熱を効率的に行うためのＬＥＤランプが検討されている。 In recent years, due to the increase in environmental awareness, bulb-type LED lamps incorporating power supply circuits using LED elements excellent in power saving as light sources have been actively used. In particular, a high-intensity LED lamp has recently been demanded, and the LED element used for that purpose has a large output, and the power to be supplied has increased. Along with this, it is necessary to take measures to suppress the temperature rise of the substrate on which the LED element is mounted and to prevent the heat generated from the lighting circuit for lighting the LED element from affecting the LED element. Therefore, an LED lamp for reducing the thermal influence between the two and efficiently radiating each of them has been studied.
例えば、特許文献１に記載されている発光素子ランプでは、発光素子と、口金と螺合する断熱性の筒状部材の一部とが、熱伝導性のケースに収納され、この筒状部材の内部空間に点灯回路が収納されている。筒状部材は断熱性であるため、ケースと口金の間で熱伝導が行われ難くなっており、点灯回路で発生した熱も発光素子に伝わりにくくなっている。 For example, in the light-emitting element lamp described in Patent Document 1, a light-emitting element and a part of a heat-insulating cylindrical member screwed into a base are housed in a heat conductive case. A lighting circuit is housed in the internal space. Since the cylindrical member is heat-insulating, it is difficult for heat conduction to occur between the case and the base, and heat generated in the lighting circuit is also difficult to be transmitted to the light emitting element.
しかしながら、特許文献１に記載されている発光素子ランプでは、断熱性の筒状部材の一部が熱伝導性のケース内に位置しているため、断熱性の筒状部材といえども、ＬＥＤ素子と電源基板に実装された電気部品との間で熱のやり取りが起きる可能性がある。 However, in the light emitting element lamp described in Patent Document 1, since a part of the heat insulating cylindrical member is located in the heat conductive case, the LED element can be used even if it is a heat insulating cylindrical member. There is a possibility that heat exchange occurs between the power supply and the electrical components mounted on the power supply board.
本発明は、このような点に鑑みなされたもので、ＬＥＤ素子から生じる熱を、点灯回路基板に実装された電子部品に伝導させないで効率的に放熱させ、その逆に点灯回路基板に実装された電子部品からの発熱もＬＥＤ素子に影響を与えず放熱させ、高輝度で長寿命なＬＥＤランプを提供するものである。 The present invention has been made in view of such points, and efficiently dissipates heat generated from the LED element without conduction to the electronic components mounted on the lighting circuit board, and vice versa. The heat generated from the electronic components is also dissipated without affecting the LED element, thereby providing an LED lamp with high brightness and long life.
請求項１に記載の発明にあたっては、ＬＥＤ素子が実装されたＬＥＤ基板と、前記ＬＥＤ基板を配置して放熱する放熱部材と、前記ＬＥＤ基板を覆うように装着された透光性カバーと、一端に口金が接合された筒状の絶縁筐体とを備えたＬＥＤランプにおいて、前記放熱部材の一部を外気に露出させ、前記絶縁筐体に収納される回路基板ホルダは、前記放熱部材よりも熱伝導性が小さな絶縁性材料で形成され、点灯回路基板を収納した該回路基板ホルダの外殻の一部を前記絶縁筐体に内接させていることを特徴とするものである。 In the invention according to claim 1, an LED board on which an LED element is mounted, a heat dissipation member that dissipates heat by disposing the LED board, a translucent cover that is mounted so as to cover the LED board, and one end In an LED lamp including a cylindrical insulating housing with a base joined to, a part of the heat radiating member is exposed to the outside air, and the circuit board holder housed in the insulating housing is more than the heat radiating member. A part of the outer shell of the circuit board holder that houses the lighting circuit board is formed in an insulating material having a low thermal conductivity, and is inscribed in the insulating casing.
請求項２に記載の発明にあたっては、前記回路基板ホルダの一端にある開口部は、前記放熱部材よりも熱伝導性の小さな絶縁性材料からなる蓋部材で塞がれていることを特徴とするものである。 The invention according to claim 2 is characterized in that the opening at one end of the circuit board holder is closed with a lid member made of an insulating material having a lower thermal conductivity than the heat dissipation member. Is.
請求項３に記載の発明にあたっては、前記点灯回路基板に実装された、熱的特性で最大定格温度の低い電子部品、及び発熱量の大きい電子部品を、放熱性樹脂で前記回路基板ホルダと熱的に接合させたことを特徴とするものである。 According to a third aspect of the present invention, an electronic component mounted on the lighting circuit board and having a low thermal rating and a maximum rated temperature and an electronic part having a large calorific value are heat-dissipated between the circuit board holder and a heat-dissipating resin. It is characterized by being joined together.
請求項４に記載の発明にあたっては、前記熱的特性で最大定格温度の低い電子部品、及び発熱量の大きい電子部品を、略円板形状をした前記点灯回路基板の直径方向に背丈の低い方から高い方へ順に配設し、前記電子部品が前記放熱樹脂で埋設されるように前記回路基板ホルダを傾けて前記放熱樹脂を注入したことを特徴とするものである。 In the invention according to claim 4, the electronic component having a low maximum rated temperature in the thermal characteristics and the electronic component having a large calorific value, the one having a lower height in the diameter direction of the lighting circuit board having a substantially disc shape. The heat-dissipating resin is injected by inclining the circuit board holder so that the electronic components are embedded with the heat-dissipating resin.
請求項５に記載の発明にあたっては、前記回路基板ホルダの底部の一部を内方に突出させ、前記放熱樹脂を注入することを特徴とするものである。 The invention according to claim 5 is characterized in that a part of the bottom portion of the circuit board holder protrudes inward and the heat radiation resin is injected.
請求項１に記載の発明によれば、一部が外気に露出した放熱部材が、ＬＥＤ基板と絶縁筐体の間に位置しているので、ＬＥＤ素子で発生した熱が、放熱部材の外気露出部分で放熱され、放熱部材よりも熱伝導性の小さな絶縁筐体には熱伝導しないようになる。そのため、前記回路基板ホルダの内部に配置された点灯回路基板に実装された電子部品への熱伝導も抑制され、また、電子部品で発生した熱も回路基板ホルダから絶縁筐体に伝導し外気に放熱されるのでＬＥＤ素子に熱伝導されにくく、ＬＥＤ素子と電子部品相互間の熱的な影響を抑制した高輝度で長寿命なＬＥＤランプを提供できる。 According to the first aspect of the present invention, since the heat radiation member partially exposed to the outside air is located between the LED substrate and the insulating housing, the heat generated by the LED element is exposed to the outside air of the heat radiation member. Heat is dissipated in the portion, and heat conduction is prevented from occurring in an insulating housing having a smaller thermal conductivity than the heat radiating member. Therefore, heat conduction to the electronic components mounted on the lighting circuit board disposed inside the circuit board holder is also suppressed, and heat generated in the electronic parts is also conducted from the circuit board holder to the insulating housing to the outside air. Since the heat is dissipated, it is difficult to conduct heat to the LED element, and it is possible to provide a high-brightness and long-life LED lamp that suppresses the thermal influence between the LED element and the electronic component.
請求項２に記載の発明によれば、絶縁材料からなる蓋部材は、放熱性部材よりも熱伝導性が小さく、前記絶縁筐体の開口部を塞ぐことでＬＥＤ素子と電子部品相互間の熱的な影響を更に抑制した高輝度で長寿命なＬＥＤランプを提供できる。 According to the second aspect of the present invention, the lid member made of an insulating material has a lower thermal conductivity than the heat radiating member, and heats between the LED element and the electronic component by closing the opening of the insulating housing. LED lamps with high brightness and long life can be provided in which the influence of light is further suppressed.
請求項３の発明によれば、前記回路基板ホルダの開口部から、放熱樹脂を注入することで、熱的に耐久性の劣る電子部品や発熱量が多い電子部品からの発熱が効率的に前記回路基板ホルダに伝導され放熱されるので、電子部品の使用寿命を延ばすことができる高輝度、長寿命なＬＥＤランプを提供できる。 According to the invention of claim 3, by injecting the heat radiating resin from the opening of the circuit board holder, the heat generation from the electronic component having a poor thermal durability or the electronic component having a large heat generation amount is efficiently performed. Since it is conducted to the circuit board holder and dissipated, it is possible to provide a high-brightness, long-life LED lamp that can extend the service life of electronic components.
請求項４ないし５の発明によれば、前記放熱樹脂の注入量を削減した、より軽量でコストを削減できる高輝度、長寿命なＬＥＤランプを提供できる。 According to the fourth to fifth aspects of the present invention, it is possible to provide a LED lamp having a high brightness and a long life that can reduce the cost by reducing the injection amount of the heat radiation resin.
以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施の形態は一例であり、これに限定されるものではない。図１は本実施形態に係わるＬＥＤランプ１を上方から見た斜視図で、図２は本実施形態に係るＬＥＤランプ１を斜め上方から見た分解斜視図である。また図３は本実施形態に係わるＬＥＤランプ１を斜め下方から見た分解斜視図である。 Preferred embodiments of the present invention will be described below with reference to the drawings. Note that this embodiment is merely an example, and the present invention is not limited to this. FIG. 1 is a perspective view of an LED lamp 1 according to the present embodiment as viewed from above, and FIG. 2 is an exploded perspective view of the LED lamp 1 according to the present embodiment as viewed from obliquely above. FIG. 3 is an exploded perspective view of the LED lamp 1 according to this embodiment as viewed obliquely from below.
本実施形態に係わるＬＥＤランプ１は、図１〜図３に示すように、ＬＥＤ素子２１を光源として備えるＬＥＤ基板２と、該ＬＥＤ基板２を載置する放熱部材３と、前記放熱部材３を他端に備える絶縁筐体４と、ＬＥＤ基板を覆う透光性カバー９と、前記ＬＥＤ素子２１を点灯させる点灯回路基板７と、前記点灯回路基板７を内部に収納し前記絶縁筐体４と接して点灯回路基板７からの発熱を放熱する回路基板ホルダ５と、回路基板ホルダ５内に充填して点灯回路基板７から発生した熱を回路基板ホルダ５に伝熱する放熱樹脂１６（図５、図６）と、前記回路基板ホルダ５の開口部を塞ぐ絶縁蓋６と、前記絶縁筐体４の一端に設けられた口金とを備えている。更にＬＥＤランプ１は後述するような防水機能を有している。 As shown in FIGS. 1 to 3, the LED lamp 1 according to the present embodiment includes an LED substrate 2 including an LED element 21 as a light source, a heat dissipation member 3 on which the LED substrate 2 is placed, and the heat dissipation member 3. Insulating housing 4 provided at the other end, translucent cover 9 covering the LED substrate, lighting circuit substrate 7 for lighting the LED element 21, and housing the lighting circuit substrate 7 therein, the insulating housing 4 A circuit board holder 5 that contacts and dissipates heat generated from the lighting circuit board 7 and a heat-dissipating resin 16 that fills the circuit board holder 5 and transfers heat generated from the lighting circuit board 7 to the circuit board holder 5 (FIG. 5). 6), an insulating lid 6 that closes the opening of the circuit board holder 5, and a base provided at one end of the insulating housing 4. Further, the LED lamp 1 has a waterproof function as described later.
ＬＥＤ素子２１としては公知の種々のＬＥＤを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのＬＥＤ素子２１を用いている。またチップオンボード型のＬＥＤモジュールを使用してもよい。 Various known LEDs can be used as the LED element 21. In the present embodiment, a high-luminance type LED element 21 that emits white light for illumination is used. A chip-on-board type LED module may be used.
ＬＥＤ基板２は、基板２２と複数のＬＥＤ素子２１で構成され、基板２２は、略円盤状の平板で公知のガラスエポキシ基板、セラミックス基板等のプリント基板等を用いることができる。本実施形態では、ガラス布・ガラス不織布複合基材エポキシ樹脂銅張積層板（ＣＥＭ−３）が用いられ、複数のＬＥＤ素子２１がＬＥＤ実装面２３に実装されている。ＬＥＤ基板２の中央部分には、ＬＥＤ素子２１に点灯回路基板７から給電するために、図示しない給電線を通す貫通孔２５が設けられており、複数のバインドネジ１２で放熱部材３の載置面３３に基板下面２４を密着させて接合するための透孔２６が複数穿設されている。 The LED substrate 2 includes a substrate 22 and a plurality of LED elements 21. The substrate 22 is a substantially disk-shaped flat plate, and a known printed circuit board such as a glass epoxy substrate or a ceramic substrate can be used. In this embodiment, a glass cloth / glass nonwoven fabric composite base material epoxy resin copper-clad laminate (CEM-3) is used, and a plurality of LED elements 21 are mounted on the LED mounting surface 23. A through-hole 25 through which a power supply line (not shown) is passed in order to supply power to the LED element 21 from the lighting circuit board 7 is provided in the central portion of the LED board 2. A plurality of through-holes 26 are formed for bonding the substrate lower surface 24 in close contact with the surface 33.
放熱部材３は、熱伝導率の高い材料（例えば、アルミニウム、銅などの金属材料や酸化金属材料など）で形成されていることが好ましい。本実施形態では、アルミニウムを用いて、表面が黒塗装処理されたものを使用しているが、これに限定されるものではなくアルマイト処理でも良い。 The heat dissipating member 3 is preferably formed of a material having high thermal conductivity (for example, a metal material such as aluminum or copper or a metal oxide material). In the present embodiment, aluminum is used and the surface is black-coated, but the present invention is not limited to this, and alumite treatment may be used.
ここでの放熱部材３は全体が略空洞の円盤形状であり、筒壁３１と、前記筒壁３１の上部には軸心から径方向に環状に突出した係止部３４と、環状溝形状のホルダ３６とを備え、筒壁３１の上端部に設けられた載置面３３を有し、前記載置面３３の中央部分（筒部の中心軸を含む。）に貫通孔３５が設けられている。一方、筒壁３１の下端側は開口部３９となっており、内壁３０１の周内には等間隔で配置されたリブ３８が突設されている。ＬＥＤランプ１を組立てた時、底部３７が絶縁筐体４のフランジ４４の上面に接合される。 The heat dissipating member 3 here has a generally hollow disk shape, a cylindrical wall 31, a locking portion 34 projecting annularly in the radial direction from the axial center, and an annular groove-shaped upper portion of the cylindrical wall 31. A mounting surface 33 provided at the upper end of the cylindrical wall 31, and a through hole 35 is provided in the central portion of the mounting surface 33 (including the central axis of the cylindrical portion). Yes. On the other hand, the lower end side of the cylindrical wall 31 is an opening 39, and ribs 38 arranged at equal intervals protrude from the circumference of the inner wall 301. When the LED lamp 1 is assembled, the bottom 37 is joined to the upper surface of the flange 44 of the insulating housing 4.
この放熱部材３の載置面３３にあるネジ止め下穴３０２にバインドネジ１２を螺着することでＬＥＤ基板２を接合する。この放熱部材３の筒壁３１の外周面には放熱効率を上げるためにフィン３２が形成されている。なお、前記載置面３３に放熱グリースの塗布あるいは熱伝導性ゴム等を挟み込み、隙間を無くすことが好ましい。これによって、ＬＥＤ素子２１で発生した熱が、ＬＥＤ基板２に伝わり、更に放熱部材３に伝導しやすくなり、筒壁３１に放射状に複数形成したフィン３２から効率的に外気に放熱されるようになる。 The LED board 2 is joined by screwing the bind screw 12 into the screwed pilot hole 302 in the mounting surface 33 of the heat radiating member 3. Fins 32 are formed on the outer peripheral surface of the cylindrical wall 31 of the heat radiating member 3 in order to increase the heat radiation efficiency. In addition, it is preferable that a gap is eliminated by applying heat-dissipating grease or heat conductive rubber or the like to the mounting surface 33 described above. As a result, the heat generated in the LED element 21 is transmitted to the LED substrate 2 and more easily conducted to the heat radiating member 3, so that heat is efficiently radiated to the outside air from the fins 32 formed radially on the cylindrical wall 31. Become.
絶縁筐体４は、放熱部材３よりも熱伝導性の小さな樹脂を用いて形成されている。本実施形態では、ガラス繊維強化ナイロン樹脂を使用したが、これに限定されるものではなく、ポリエチレンテレフタレート、ポリウレタン、ポリカーボネート、ポリフェニレンサルファイド、ポリアミドイミド、ポリイミド、ポリアミド、フェノール樹脂、アクリル樹脂等公知の樹脂材料や、これらにガラス繊維等を含有した強化樹脂が使用できる。 The insulating housing 4 is formed using a resin having a smaller thermal conductivity than the heat radiating member 3. In this embodiment, glass fiber reinforced nylon resin is used, but is not limited to this, and known resins such as polyethylene terephthalate, polyurethane, polycarbonate, polyphenylene sulfide, polyamide imide, polyimide, polyamide, phenol resin, acrylic resin, etc. Materials and reinforced resins containing glass fibers or the like can be used.
この絶縁筐体４は、筒部４１の一端部に径の大きな開口部４８が形成され、他端に移動するにつれ内径が徐々に小さくなる内部が中空な筒状をなしている。 The insulating housing 4 is formed in a cylindrical shape in which an opening 48 having a large diameter is formed at one end portion of the cylindrical portion 41 and the inner diameter gradually decreases as it moves to the other end.
前記開口部４８側の内壁４０１には点灯回路基板７を収納した回路基板ホルダ５と絶縁蓋６をタッピンネジ１４によって絶縁筐体４に接合するためのネジ止めボス４０２が一体で形成されている。絶縁筐体４で最大の外径を有するフランジ４４は筒部４１から径方向外方に薄板状に延出しており、フランジ４４から上方には開口部４８を内径とした環状延出部と、環状凸部４０３を形成している。一方、フランジ４４の下方側はストレート部４２を経てテーパ部４０５に移行する。また、前記フランジ４４の下部にはリブ４０６を外殻円周上に複数本ずつ等分分割されて形成しており、後述の照明器具のソケットに装着もしくは取外す際の指掛け部として、着脱操作性を良くしている。 The inner wall 401 on the opening 48 side is integrally formed with a screw boss 402 for joining the circuit board holder 5 housing the lighting circuit board 7 and the insulating lid 6 to the insulating housing 4 with the tapping screw 14. A flange 44 having the maximum outer diameter in the insulating housing 4 extends in a thin plate shape radially outward from the cylindrical portion 41, and an annular extending portion having an opening 48 as an inner diameter above the flange 44, An annular convex portion 403 is formed. On the other hand, the lower side of the flange 44 moves to the tapered portion 405 through the straight portion 42. In addition, a plurality of ribs 406 are equally divided on the outer circumference of the outer circumference of the flange 44 at the lower portion of the flange 44, and can be attached and detached as a finger-hanging portion when being attached to or removed from a socket of a lighting fixture to be described later. Is improving.
前記筒部４１の他端の突出筒部４３には口金８が螺合するネジ山が設けられたネジ部４６が形成され、前記ネジ部４６には軸長方向に一部給電線を通すための凹部４７が形成され、ネジ部４６の下端面の中心部分に貫通孔４０７が穿設されている。 The protruding cylindrical portion 43 at the other end of the cylindrical portion 41 is formed with a screw portion 46 provided with a screw thread into which the base 8 is screwed, and a part of the feeder line is passed through the screw portion 46 in the axial direction. The recess 47 is formed, and a through hole 407 is formed in the central portion of the lower end surface of the screw portion 46.
点灯回路基板７は、薄板略円板形状をしたプリント基板であり、その実装面７１（裏面側）に複数の電子部品７４が実装されており、例えば整流・平滑回路、ＤＣ／ＤＣコンバータ等から点灯回路を構成している。前記複数の電子部品７４はそれぞれ大きさが異なり、熱的にも最大定格温度の低い電解コンデンサや、発熱量の大きなＦＥＴ，ＩＣ、逆に最大定格温度の高いインダクタや、フィルムコンデンサ等があり、各電子部品を、その熱的な特性に応じて所望の位置に配置することができる。また、一部の電子部品７５は点灯回路基板７の他の主面（表面側）に数個実装されている。外周縁に設けた一対の第二の端面カット部７３ａ、７３ｂは、回路基板ホルダ５に内設された一対の回路基板載置リブ５９と一部干渉するのを避けるための逃げである。また、回路基板ホルダ５に形成された給電用凹部５０１との干渉を避けるために第一の端面カット部７２が形成されている。この点灯回路基板７は、透孔７７にタッピンネジ１４を挿通し回路基板ホルダ５に内設されたネジ止めボス５６に螺着することで回路基板ホルダ５に接合される。点灯回路基板７の外周部に設けられたＵ字状切り欠き７６には、点灯回路基板７が接合された回路基板ホルダ５を絶縁蓋６で覆い、絶縁筐体４に接合するために使用するタッピンネジ１３が挿通される。 The lighting circuit board 7 is a thin printed board having a substantially disk shape, and a plurality of electronic components 74 are mounted on its mounting surface 71 (back surface side). For example, the lighting circuit board 7 includes a rectifying / smoothing circuit, a DC / DC converter, and the like. A lighting circuit is configured. The plurality of electronic components 74 are different in size, and include an electrolytic capacitor having a low maximum rated temperature in terms of heat, a FET or IC having a large calorific value, and an inductor having a high maximum rated temperature, or a film capacitor. Each electronic component can be arranged at a desired position according to its thermal characteristics. Some electronic components 75 are mounted on the other main surface (front side) of the lighting circuit board 7. The pair of second end face cut portions 73 a and 73 b provided on the outer peripheral edge are escapes for avoiding partial interference with the pair of circuit board mounting ribs 59 provided in the circuit board holder 5. Further, a first end face cut portion 72 is formed in order to avoid interference with the power supply recess 501 formed in the circuit board holder 5. The lighting circuit board 7 is joined to the circuit board holder 5 by inserting the tapping screw 14 into the through hole 77 and screwing it onto a screwing boss 56 provided in the circuit board holder 5. The U-shaped notch 76 provided on the outer peripheral portion of the lighting circuit board 7 is used for covering the circuit board holder 5 to which the lighting circuit board 7 is bonded with the insulating lid 6 and bonding the circuit board holder 5 to the insulating housing 4. A tapping screw 13 is inserted.
回路基板ホルダ５は、一端が開口した中空の椀形円筒形状をしており、前記絶縁筐体４同様、放熱部材３よりも熱伝導性の小さな樹脂、本実施形態では、ガラス繊維強化ナイロン樹脂を使用して形成されている。前記基板ホルダ５の内部には前記点灯回路基板７をネジ止め固定するためのネジ止めボス５６と複数の回路基板載置面５７及び、一対の回路基板載置リブ５９を内設している。また、外殻のストレート部５１には給電用凹部５０１を凹設し、図示しない給電線を通すスペースを確保している。回路基板ホルダ５の外殻に形成するテーパ部５２は、回路基板ホルダ５を絶縁筐体４に装着した際に絶縁筐体４のテーパ部４０５に内接する形状としている。カット部５３は、後述するがＬＥＤランプ１の内部に空気の流路を確立するために形成されている。 The circuit board holder 5 has a hollow bowl-shaped cylindrical shape that is open at one end. Like the insulating casing 4, the circuit board holder 5 is a resin having a lower thermal conductivity than the heat radiating member 3, in this embodiment, a glass fiber reinforced nylon resin. Is formed using. Inside the substrate holder 5, a screwing boss 56 for fixing the lighting circuit substrate 7 with screws, a plurality of circuit board mounting surfaces 57, and a pair of circuit board mounting ribs 59 are provided. In addition, a power supply recess 501 is provided in the straight portion 51 of the outer shell to secure a space for passing a power supply line (not shown). The tapered portion 52 formed on the outer shell of the circuit board holder 5 has a shape inscribed in the tapered portion 405 of the insulating housing 4 when the circuit board holder 5 is attached to the insulating housing 4. The cut part 53 is formed in order to establish an air flow path inside the LED lamp 1 as will be described later.
前記点灯回路基板７を前記回路基板ホルダ５に固定する際には、まず、図５、図６に示すように放熱樹脂１６を回路基板ホルダ５内に注入し、次いで点灯回路基板７を実装された電子部品７４側から挿入する。図５ａに示すように、放熱樹脂１６は熱的特性で最大定格温度の低い電解コンデンサや、発熱量の大きなＦＥＴ，ＩＣの中で最も背丈の低い電子部品７４の頂部が埋設される程度に充填し所望の温度で硬化させる。放熱樹脂１６は回路基板ホルダ５内部の熱伝導率の低い空気層を追い出し、電子部品７４から発生する熱を回路基板ホルダ５の外殻へ伝える。回路基板ホルダ５を絶縁筐体４に装着すると、回路基板ホルダ５の外殻に形成するテーパ部５２が絶縁筐体４のテーパ部４０５に内接する構造としているので、前記回路基板５の外殻に伝えられた熱は絶縁筐体４から効果的に外気に放熱される。 When fixing the lighting circuit board 7 to the circuit board holder 5, first, as shown in FIGS. 5 and 6, the heat radiation resin 16 is injected into the circuit board holder 5, and then the lighting circuit board 7 is mounted. Inserted from the electronic component 74 side. As shown in FIG. 5a, the heat-dissipating resin 16 is filled to such an extent that the top portion of the electronic component 74 having the lowest height among the electrolytic capacitor having a low maximum rated temperature due to its thermal characteristics, and the FET and IC having a large calorific value is embedded. And cured at the desired temperature. The heat dissipating resin 16 expels the air layer having a low thermal conductivity inside the circuit board holder 5 and transfers heat generated from the electronic component 74 to the outer shell of the circuit board holder 5. When the circuit board holder 5 is attached to the insulating casing 4, the tapered portion 52 formed on the outer shell of the circuit board holder 5 is inscribed in the tapered portion 405 of the insulating casing 4. The heat transferred to is effectively dissipated from the insulating housing 4 to the outside air.
前記放熱樹脂１６は、電気不導体で熱伝導性の高いシリカ、アルミナ等の顔料が含有された樹脂であり、加熱前は流動性が有り回路基板ホルダ５の中空部に充填され、時間経過によって硬化し流動性が無くなるものである。本実施形態では熱硬化性のシリカ含有シリコン樹脂を用いた。 The heat-dissipating resin 16 is a resin containing a pigment such as silica, alumina or the like, which is an electrically non-conductive and highly heat-conductive material, and has fluidity before heating and is filled in the hollow portion of the circuit board holder 5, It will harden and lose its fluidity. In the present embodiment, a thermosetting silica-containing silicon resin is used.
次にこの放熱樹脂１６の使用量を削減してコスト削減を図る手法について説明する。前述したように放熱樹脂１６は、熱的特性で最大定格温度の低い電解コンデンサや、発熱量の大きなＦＥＴ，ＩＣの頂部が埋設される程度に充填すれば放熱効果が得られるので、図５ｂに示すように、略円板形状をしたプリント基板の直径方向に前記最大定格温度の低い電解コンデンサや、発熱量の大きなＦＥＴ，ＩＣの背丈を考慮して低い方から高い方へ順に配置実装し、ジグ１７を使い回路基板ホルダ５を傾斜させて放熱樹脂１６を充填しても良い。放熱樹脂１６の硬化後は図５ｃに示すように、放熱樹脂１６が傾斜した状態で電子部品７４の頂部を覆う。この方法によって放熱樹脂１６の使用量を削減できる。また、図６ａのように回路基板ホルダ５の底部に内方に向けて凹設部１８を設け、回路基板ホルダ５内の無駄なスペースを省き放熱樹脂１６を削減することができる。更に、図６ｂに示すように、ジグ１７を使用して回路基板ホルダ５を傾斜させて放熱樹脂１６を充填しても良く、放熱樹脂１６が硬化すれば、図６ｃのように放熱樹脂１６の削減が図れコスト削減が可能となる。尚且つ、より軽量化したＬＥＤランプ１を作製することができる。 Next, a method for reducing the cost by reducing the amount of the heat radiation resin 16 used will be described. As described above, if the heat radiation resin 16 is filled to such an extent that the top of an electrolytic capacitor having a low maximum rated temperature due to thermal characteristics, a FET or IC having a large calorific value is buried, the heat radiation effect can be obtained. As shown, in the diameter direction of the printed circuit board having a substantially disk shape, the electrolytic capacitor with a low maximum rated temperature, the FET with a large calorific value, and the height of the IC are arranged and mounted in order from the low to the high, The jig 17 may be used to incline the circuit board holder 5 and fill with the heat radiation resin 16. After the heat radiation resin 16 is cured, as shown in FIG. 5c, the top of the electronic component 74 is covered with the heat radiation resin 16 inclined. This method can reduce the amount of heat radiation resin 16 used. Further, as shown in FIG. 6a, a recessed portion 18 is provided inwardly at the bottom of the circuit board holder 5, so that a useless space in the circuit board holder 5 can be omitted and the heat radiation resin 16 can be reduced. Further, as shown in FIG. 6b, the jig 17 may be used to incline the circuit board holder 5 to fill the heat radiating resin 16, and once the heat radiating resin 16 is cured, Reduction can be achieved and cost can be reduced. Moreover, the lighter LED lamp 1 can be manufactured.
絶縁蓋６は、蓋部６２と筒部６１を有する有底浅皿状に、ガラス繊維強化ナイロン樹脂を使用して形成されており、中央部にＬＥＤ基板２に電気的接続をするための接続線を通す貫通孔６４が穿設されている。絶縁蓋６は、前記回路基板ホルダ５の開口部を塞ぎ、タッピンネジ１３によって透孔６６、点灯回路基板６の外周縁に設けられたＵ字状切り欠き７６、更に回路基板ホルダ５の透孔５８を貫通し、絶縁筐体４に内設されたネジ止めボス４０２に螺着されることで回路基板ホルダ５並びに点灯回路基板７と共に絶縁筐体４に接合される。絶縁蓋６によって放熱部材３の熱が、点灯回路基板７に伝わりにくくなっている。尚、筒部６１に設けた一対の逃げ部６７ａ、６７ｂは、回路基板ホルダ５に内設された一対の回路基板載置リブ５９との干渉を避けるための逃げ部である。また、切り欠き６８は、後述するがＬＥＤランプ１の内部に空気の流路を確立するために形成されている。 The insulating lid 6 is formed using a glass fiber reinforced nylon resin in the shape of a bottomed shallow dish having a lid portion 62 and a cylindrical portion 61, and a connection for making an electrical connection to the LED substrate 2 in the center portion. A through hole 64 through which a wire passes is formed. The insulating lid 6 closes the opening of the circuit board holder 5, has a through hole 66 by a tapping screw 13, a U-shaped notch 76 provided on the outer peripheral edge of the lighting circuit board 6, and a through hole 58 in the circuit board holder 5. And is screwed onto a screw boss 402 provided in the insulating housing 4 so as to be joined to the insulating housing 4 together with the circuit board holder 5 and the lighting circuit board 7. The insulating lid 6 makes it difficult for the heat of the heat radiating member 3 to be transmitted to the lighting circuit board 7. The pair of relief portions 67 a and 67 b provided in the cylindrical portion 61 are escape portions for avoiding interference with the pair of circuit board mounting ribs 59 provided in the circuit board holder 5. Moreover, the notch 68 is formed in order to establish the air flow path inside the LED lamp 1 as will be described later.
絶縁蓋６で回路基板ホルダ５の開口部を塞ぐ際に、点灯回路基板７と絶縁蓋６の間に熱伝導性ゴム等を挟み込み隙間を無くすと、点灯回路基板７の実装面７１に実装された電子部品７４からの発熱ばかりでなく、主面に実装された電子部品７５からの発熱も回路基板ホルダ５に伝導され効率よく絶縁筐体４から外気に放熱される。 When the insulating cover 6 closes the opening of the circuit board holder 5, if a heat conductive rubber or the like is sandwiched between the lighting circuit board 7 and the insulating cover 6 to eliminate the gap, the circuit board holder 5 is mounted on the mounting surface 71 of the lighting circuit board 7. In addition to heat generated from the electronic component 74, heat generated from the electronic component 75 mounted on the main surface is also conducted to the circuit board holder 5 and efficiently radiated from the insulating housing 4 to the outside air.
図示しないが、口金８を介して供給される商業用電力の給電線は、点灯回路基板７から回路基板ホルダ５の給電用凹部５０１を通って引き出され、絶縁筐体４の円筒内部を通して貫通孔４０７から外部に臨ませておく。また点灯回路基板７とＬＥＤ基板２を電気的に接続する図示しない接続線は絶縁蓋６の中心部に穿設した貫通孔６４に挿通し外部へ引き出しておく。 Although not shown, a commercial power feed line supplied via the base 8 is drawn from the lighting circuit board 7 through the power feed recess 501 of the circuit board holder 5 and passes through the inside of the cylinder of the insulating housing 4. Let 407 face the outside. A connection line (not shown) that electrically connects the lighting circuit board 7 and the LED board 2 is inserted into a through hole 64 formed in the center of the insulating lid 6 and drawn out to the outside.
口金８はネジ部分のシェル部８１と先端部のアイレット部８２とを有し、前記点灯回路基板７から引き出され絶縁筐体４の貫通孔４０７から外部に臨ませておいた給電線を電気的に接続して、シェル部８１を絶縁筐体４の突出筒部４３に形成されたネジ部４６と螺合する。 The base 8 has a shell portion 81 of a screw portion and an eyelet portion 82 of a tip portion, and electrically feeds a feeder line drawn out from the lighting circuit board 7 and facing the outside through a through hole 407 of the insulating housing 4. The shell portion 81 is screwed with the screw portion 46 formed on the protruding cylinder portion 43 of the insulating housing 4.
次にＬＥＤ基板２を装着した放熱部材３を絶縁筐体４に接合する。まず、前記点灯回路基板７とＬＥＤ基板２を電気的に接続する図示しない接続線を放熱部材３の貫通孔３５及び、ＬＥＤ基板２の貫通孔２５を挿通し、第一の環状弾性部材１０を絶縁筐体４の環状凸部４０３に載置して、開口部４８を形成する環状延出部４５に前記放熱部材３の開口部３９を係合させ、フランジ４４の下方側から透孔４９に挿通させたバインドネジ１５によって放熱部材３に螺着する。接合後、前記接続線をＬＥＤ基板２に半田で電気的に接続する。第一の環状弾性部材１０は、放熱部材３と絶縁筐体４の接合面からの水分や埃の浸入を防止する。 Next, the heat dissipation member 3 on which the LED substrate 2 is mounted is joined to the insulating housing 4. First, a connection line (not shown) that electrically connects the lighting circuit board 7 and the LED board 2 is inserted through the through hole 35 of the heat radiating member 3 and the through hole 25 of the LED board 2, and the first annular elastic member 10 is attached. The opening 39 of the heat radiating member 3 is engaged with the annular extending portion 45 that forms the opening 48 by being placed on the annular protrusion 403 of the insulating housing 4, and the through hole 49 is formed from the lower side of the flange 44. The heat sink member 3 is screwed by the bind screw 15 inserted. After joining, the connection line is electrically connected to the LED substrate 2 with solder. The first annular elastic member 10 prevents moisture and dust from entering from the joint surface between the heat radiating member 3 and the insulating housing 4.
透光性カバー９は、ポリカーボネート樹脂を用いてドーム形状に形成されている。この透光性カバー９の筒部９１の内壁に、一対の係止爪９２を備える。放熱部材３の軸心方向に向けて溝形状で形成されたホルダ３６に第二の環状弾性部材１１を装着して、この第二の環状弾性部材１１の外径を放熱部材３の軸心方向に潰すように弾性変形させながら前記係止爪９２を放熱部材３の係止部３４に係止することによって、透光性カバー９が放熱部材３に固定される。第二の環状弾性部材１１によって、透光性カバー９の内側への水分や埃の侵入を防止できる。（図４ｂ） The translucent cover 9 is formed in a dome shape using a polycarbonate resin. A pair of locking claws 92 are provided on the inner wall of the cylindrical portion 91 of the translucent cover 9. The second annular elastic member 11 is attached to a holder 36 formed in a groove shape toward the axial direction of the heat radiating member 3, and the outer diameter of the second annular elastic member 11 is set to the axial direction of the heat radiating member 3. The translucent cover 9 is fixed to the heat dissipating member 3 by engaging the engaging claws 92 with the engaging portions 34 of the heat dissipating member 3 while being elastically deformed so as to collapse. The second annular elastic member 11 can prevent moisture and dust from entering the inside of the translucent cover 9. (Fig. 4b)
これにより透光性カバー９の装着が完了しＬＥＤランプ１が完成する。 Thereby, the mounting of the translucent cover 9 is completed, and the LED lamp 1 is completed.
図２〜図３、及び図４ｂに示しているように、点灯回路基板７に実装された電子部品７４から生じる熱は、放熱樹脂１６を通して回路基板ホルダ５に伝導し、回路基板ホルダ５のテーパ部５２と接している絶縁筐体４から外気に放熱され、ＬＥＤ基板２に実装されたＬＥＤ素子２１からの発熱は、密着固定されている放熱部材３の載置面３３に伝導し、更に放熱部材３のフィン３２から外気に放熱されるので、ＬＥＤ素子２１と電子部品７４とは、相互に熱的な影響を受けることがなく、それぞれで発生した熱は独立した伝熱経路で放熱される。 As shown in FIGS. 2 to 3 and 4 b, the heat generated from the electronic component 74 mounted on the lighting circuit board 7 is conducted to the circuit board holder 5 through the heat radiation resin 16, and the taper of the circuit board holder 5 is obtained. The heat generated from the LED element 21 mounted on the LED board 2 is conducted to the mounting surface 33 of the heat-dissipating member 3 that is closely attached and fixed. Since the heat is radiated from the fins 32 of the member 3 to the outside air, the LED element 21 and the electronic component 74 are not thermally affected by each other, and the heat generated in each is radiated through independent heat transfer paths. .
図４に示すように、本実施形態に係わるＬＥＤランプ１は、規格上（ＪＩＳＣ７７０９−１）、口金８のシェル部８１と先端部のアイレット部８２間の傾斜面に一対の貫通孔８３を設けている。この貫通孔８３と連通して空気の流路をＬＥＤランプ１の内部に形成している。貫通孔８３から流入した空気は、絶縁筐体４の筒部４１内を通り、回路基板ホルダ５に形成したカット部５３、給電用凹部５０１及び、絶縁蓋６の切り欠き６８を通じて放熱部材３の貫通孔３５とＬＥＤ基板２の貫通孔２５とを抜け透光性カバー９の内壁まで到達する。このようにＬＥＤランプ１の内部は密閉状態ではなく空気の流路が確立されているので、常時、内圧が外気圧と同じになるようにコントロールされている。そのため、点灯状態から消灯した際のＬＥＤランプ１内の温度変化による内圧低下が発生しないのでＬＥＤランプ１内への水分の吸引現象を引き起こさない。また消灯状態から点灯した際の発熱による内圧上昇も防げるので、内圧上昇によって引き起こされる透光性カバー９と放熱部材３の係合解除等も発生しない。 As shown in FIG. 4, the LED lamp 1 according to this embodiment is provided with a pair of through-holes 83 on the inclined surface between the shell portion 81 of the base 8 and the eyelet portion 82 at the tip, according to the standard (JISC7709-1). ing. An air flow path is formed inside the LED lamp 1 in communication with the through hole 83. The air flowing in from the through hole 83 passes through the cylindrical portion 41 of the insulating housing 4, and passes through the cut portion 53 formed in the circuit board holder 5, the power feeding recess 501, and the notch 68 of the insulating lid 6. The light passes through the through hole 35 and the through hole 25 of the LED substrate 2 and reaches the inner wall of the translucent cover 9. Thus, since the inside of the LED lamp 1 is not sealed but an air flow path is established, the internal pressure is always controlled to be the same as the external pressure. For this reason, a decrease in internal pressure due to a temperature change in the LED lamp 1 when the LED lamp 1 is turned off from the lighting state does not occur, so that a phenomenon of sucking moisture into the LED lamp 1 is not caused. Further, since an increase in internal pressure due to heat generation when the lamp is turned on from the extinguished state can be prevented, disengagement between the translucent cover 9 and the heat radiating member 3 caused by the increase in internal pressure does not occur.
図７に示すように、本実施形態のＬＥＤランプ１を屋外の看板照明等に使用する場合には、防水構造のある専用のランプホルダ（２００）を使用する。このランプホルダ（２００）は開口部端面（２０１）に防水用パッキン（２０２）が装着されており、防水用パッキン（２０２）とＬＥＤランプ１の絶縁筐体４が密着して、内部のソケット部（２０３）に水分が侵入しない構造とされている。（図７ａ）そのため、このランプホルダ（２００）にはＬＥＤランプ１の口金８に対応するソケット部（２０３）にコイルスプリング（２０４）による弾性機能があり伸び縮みするので、ＬＥＤランプ１を回転させて口金８とソケット部がくっついてから、ソケット部にきっちりと口金８が接続されるまでＬＥＤランプ１を引っ張りながら回す操作を繰り返し行う必要がある。（図７ｂ）この操作性を良くするために本実施形態のＬＥＤランプ１の絶縁筐体４には指掛け部としてのリブ４０６が配設されている。 As shown in FIG. 7, when the LED lamp 1 of the present embodiment is used for outdoor signage illumination or the like, a dedicated lamp holder (200) having a waterproof structure is used. This lamp holder (200) has a waterproof packing (202) attached to the opening end surface (201), and the waterproof packing (202) and the insulating casing 4 of the LED lamp 1 are in close contact with each other, so that the socket portion inside The structure is such that moisture does not enter (203). (FIG. 7a) Therefore, since this lamp holder (200) has an elastic function by the coil spring (204) in the socket part (203) corresponding to the base 8 of the LED lamp 1, the LED lamp 1 is rotated. After the base 8 and the socket part are attached, it is necessary to repeat the operation of pulling and turning the LED lamp 1 until the base 8 is firmly connected to the socket part. (FIG. 7b) In order to improve this operability, the insulating casing 4 of the LED lamp 1 of the present embodiment is provided with ribs 406 as finger-hanging portions.
１ ＬＥＤランプ
２ ＬＥＤ基板
３ 放熱部材
４ 絶縁筐体
５ 回路基板ホルダ
６ 絶縁蓋
７ 点灯回路基板
８ 口金
９ 透光性カバー
１０ 第一の環状弾性部材
１１ 第二の環状弾性部材
１２ バインドネジ
１３ タッピンネジ
１４ タッピンネジ
１５ バインドネジ
１６ 放熱樹脂
１７ ジグ
２００ ランプホルダ
DESCRIPTION OF SYMBOLS 1 LED lamp 2 LED board 3 Heat radiation member 4 Insulation housing 5 Circuit board holder 6 Insulation lid 7 Lighting circuit board 8 Base 9 Translucent cover 10 First annular elastic member 11 Second annular elastic member 12 Bind screw 13 Tapping screw 14 Tapping screw 15 Bind screw 16 Heat radiation resin 17 Jig 200 Lamp holder
Claims (5)
前記ＬＥＤ基板を配置して放熱する放熱部材と、
前記ＬＥＤ基板を覆うように装着された透光性カバーと、
一端に口金が接合された筒状の絶縁筐体と、を備えたＬＥＤランプにおいて、
前記放熱部材の一部を外気に露出させ、
前記絶縁筐体に収納される回路基板ホルダは、
前記放熱部材よりも熱伝導性が小さな絶縁性材料で形成され、
点灯回路基板を収納した該回路基板ホルダの外殻の一部を
前記絶縁筐体に内接させていることを特徴とするＬＥＤランプ。 An LED substrate on which an LED element is mounted;
A heat dissipating member for dissipating heat by disposing the LED substrate;
A translucent cover mounted to cover the LED substrate;
In an LED lamp provided with a cylindrical insulating housing having a base bonded to one end,
Exposing part of the heat dissipation member to the outside air;
The circuit board holder housed in the insulating casing is
Formed of an insulating material having lower thermal conductivity than the heat dissipation member,
An LED lamp characterized in that a part of the outer shell of the circuit board holder containing the lighting circuit board is inscribed in the insulating casing.
前記放熱部材よりも熱伝導性の小さな絶縁性材料からなる蓋部材で塞がれていることを
特徴とする請求項１に記載のＬＥＤランプ。 The opening at one end of the circuit board holder having a bottomed bowl-shaped cylindrical shape,
The LED lamp according to claim 1, wherein the LED lamp is covered with a lid member made of an insulating material having a thermal conductivity smaller than that of the heat radiating member.
熱的特性で最大定格温度の低い電子部品、及び発熱量の大きい電子部品を、
放熱性樹脂で前記回路基板ホルダと熱的に接合させたことを特徴とする
請求項１ないし２に記載のＬＥＤランプ。 Mounted on the lighting circuit board,
Electronic components with a low maximum rated temperature due to thermal characteristics and electronic components with a large calorific value
The LED lamp according to claim 1, wherein the LED lamp is thermally bonded to the circuit board holder with a heat dissipating resin.
略円板形状をした前記点灯回路基板の直径方向に背丈の低い方から高い方へ順に配設し、
前記電子部品が前記放熱樹脂で埋設されるように
前記回路基板ホルダを傾けて前記放熱樹脂を注入したことを特徴とする
請求項３に記載のＬＥＤランプ。 An electronic component with a low maximum rated temperature and an electronic component with a large calorific value in the thermal characteristics,
Arranged in order from low to high height in the diameter direction of the lighting circuit board having a substantially disk shape,
4. The LED lamp according to claim 3, wherein the heat dissipation resin is injected by inclining the circuit board holder so that the electronic component is embedded with the heat dissipation resin. 5.
前記放熱樹脂を注入することを特徴とした
請求項３ないし４のいずれかに記載のＬＥＤランプ。
Projecting a part of the bottom of the circuit board holder inward,
The LED lamp according to claim 3, wherein the heat radiation resin is injected.
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