JP2014124882A - 液体噴射ヘッド及び液体噴射装置 - Google Patents
液体噴射ヘッド及び液体噴射装置 Download PDFInfo
- Publication number
- JP2014124882A JP2014124882A JP2012284504A JP2012284504A JP2014124882A JP 2014124882 A JP2014124882 A JP 2014124882A JP 2012284504 A JP2012284504 A JP 2012284504A JP 2012284504 A JP2012284504 A JP 2012284504A JP 2014124882 A JP2014124882 A JP 2014124882A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- flow path
- ink
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 187
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 46
- 229910001936 tantalum oxide Inorganic materials 0.000 claims abstract description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 86
- 230000003628 erosive effect Effects 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 252
- 230000001681 protective effect Effects 0.000 description 198
- 239000000853 adhesive Substances 0.000 description 50
- 230000001070 adhesive effect Effects 0.000 description 50
- 238000000034 method Methods 0.000 description 34
- 239000000463 material Substances 0.000 description 17
- 230000007423 decrease Effects 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000002940 repellent Effects 0.000 description 11
- 239000005871 repellent Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000002120 nanofilm Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 150000004703 alkoxides Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 230000009545 invasion Effects 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- YPQJHZKJHIBJAP-UHFFFAOYSA-N [K].[Bi] Chemical compound [K].[Bi] YPQJHZKJHIBJAP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- -1 lanthanum aluminate Chemical class 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical compound [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】液体を吐出するノズル開口21が設けられたノズルプレート20と、前記ノズル開口21に連通する圧力発生室12が設けられた流路形成基板10と、少なくとも具備し、前記ノズルプレート20がシリコン基板で形成されており、を少なくとも前記流路形成基板10と前記ノズルプレート20とは、原子層堆積によって形成された酸化タンタル膜201、203が接合面を含む全面に設けられた後、接合されている。
【選択図】 図3
Description
かかる態様では、流路形成基板とノズルプレートとに酸化タンタル膜を設けることで、流路形成基板及びノズルプレートが液体によって侵食されるのを抑制することができる。また、流路形成基板とノズルプレートとの接合面に酸化タンタル膜を設けたため、接着界面から侵入した液体によって基板が侵食されるのを抑制することができる。したがって、接合強度が低下するのを抑制して、液体の漏出、吐出不良及び積層された基板の剥離を抑制することができる。
かかる態様では、液体の漏出、吐出不良及び基板の剥離などの破壊を抑制した液体噴射装置を実現できる。
(実施形態1)
図1は、本発明の実施形態1に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの分解斜視図であり、図2はインクジェット式記録ヘッドの第2の方向の断面図であり、図3は、図2の要部を拡大した断面図である。
以上、本発明の基本的な構成について説明したが、本発明の基本的な構成は上述したものに限定されるものではない。
Claims (5)
- 液体を吐出するノズル開口が設けられたノズルプレートと、前記ノズル開口に連通する圧力発生室が設けられた流路形成基板と、を少なくとも具備し、
前記ノズルプレートがシリコン基板で形成されており、
少なくとも前記流路形成基板と前記ノズルプレートとは、原子層堆積によって形成された酸化タンタル膜が接合面を含む全面に設けられた後、接合されていることを特徴とする液体噴射ヘッド。 - 前記酸化タンタル膜は、0.3Å以上、50nm以下の厚さで形成されていることを特徴とする請求項1記載の液体噴射ヘッド。
- 前記流路形成基板と前記ノズルプレートとの間には、前記圧力発生室と前記ノズル開口とを連通するノズル連通路が設けられた連通板を具備することを特徴とする請求項1又は2記載の液体噴射ヘッド。
- 前記連通板が、シリコン基板で形成されており、前記酸化タンタル膜が、前記連通板の接合面を含む全面に設けられていることを特徴とする請求項3記載の液体噴射ヘッド。
- 請求項1〜4の何れか一項に記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284504A JP6201313B2 (ja) | 2012-12-27 | 2012-12-27 | 液体噴射ヘッド及び液体噴射装置 |
US14/141,159 US8936355B2 (en) | 2012-12-27 | 2013-12-26 | Liquid ejecting head and liquid ejecting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284504A JP6201313B2 (ja) | 2012-12-27 | 2012-12-27 | 液体噴射ヘッド及び液体噴射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014124882A true JP2014124882A (ja) | 2014-07-07 |
JP6201313B2 JP6201313B2 (ja) | 2017-09-27 |
Family
ID=51016733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012284504A Active JP6201313B2 (ja) | 2012-12-27 | 2012-12-27 | 液体噴射ヘッド及び液体噴射装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8936355B2 (ja) |
JP (1) | JP6201313B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017534494A (ja) * | 2014-11-19 | 2017-11-24 | メムジェット テクノロジー リミテッド | 改善された耐用寿命を有するインクジェットノズル装置 |
US10850514B2 (en) | 2018-03-20 | 2020-12-01 | Brother Kogyo Kabushiki Kaisha | Liquid ejecting head and method for manufacturing liquid ejecting head |
US10913275B2 (en) | 2018-03-22 | 2021-02-09 | Brother Kogyo Kabushiki Kaisha | Liquid discharge head and method of manufacturing liquid discharge head |
JPWO2021199731A1 (ja) * | 2020-03-30 | 2021-10-07 | ||
WO2022070334A1 (ja) * | 2020-09-30 | 2022-04-07 | コニカミノルタ株式会社 | インクジェットヘッドおよびその製造方法、ならびに画像形成装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6492756B2 (ja) | 2015-02-25 | 2019-04-03 | ブラザー工業株式会社 | 液体吐出装置 |
US9828672B2 (en) | 2015-03-26 | 2017-11-28 | Lam Research Corporation | Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma |
JP2016198908A (ja) * | 2015-04-08 | 2016-12-01 | キヤノン株式会社 | 液体吐出ヘッド |
JP6672647B2 (ja) * | 2015-09-08 | 2020-03-25 | セイコーエプソン株式会社 | Memsデバイス、液体噴射ヘッド、及び液体噴射装置 |
EP3248784B1 (en) | 2016-05-26 | 2020-02-19 | Canon Kabushiki Kaisha | Liquid ejection head, method for manufacturing the same, and printing method |
JP2021506126A (ja) | 2017-12-07 | 2021-02-18 | ラム リサーチ コーポレーションLam Research Corporation | チャンバ調整における耐酸化保護層 |
US10760158B2 (en) * | 2017-12-15 | 2020-09-01 | Lam Research Corporation | Ex situ coating of chamber components for semiconductor processing |
CN111511560B (zh) * | 2017-12-26 | 2021-12-07 | 柯尼卡美能达株式会社 | 喷墨头的制造方法、喷墨头以及喷墨记录装置 |
CN110722880B (zh) * | 2018-07-17 | 2021-01-12 | 精工爱普生株式会社 | 头单元以及液体喷出装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004001527A (ja) * | 2002-05-31 | 2004-01-08 | Hewlett-Packard Development Co Lp | チャンバおよび流体噴出器ヘッド |
JP2008074016A (ja) * | 2006-09-22 | 2008-04-03 | Fujifilm Corp | ノズルプレートの製造方法、液体吐出ヘッド及び画像形成装置 |
JP2009018449A (ja) * | 2007-07-10 | 2009-01-29 | Seiko Epson Corp | 噴射ヘッドの製造方法 |
JP2009279830A (ja) * | 2008-05-22 | 2009-12-03 | Seiko Epson Corp | 液体噴射ヘッドおよびそれを備えた液体噴射装置 |
JP2010188715A (ja) * | 2009-01-21 | 2010-09-02 | Toshiba Tec Corp | インクジェットヘッドおよびインクジェットヘッドの製造方法 |
JP2011156845A (ja) * | 2010-02-04 | 2011-08-18 | Seiko Epson Corp | 液体噴射ヘッド、及び、液体噴射ヘッドの製造方法 |
JP2011206920A (ja) * | 2010-03-26 | 2011-10-20 | Seiko Epson Corp | 液体噴射ヘッド及びその製造方法並びに液体噴射装置 |
JP2012143981A (ja) * | 2011-01-13 | 2012-08-02 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2012218188A (ja) * | 2011-04-04 | 2012-11-12 | Seiko Epson Corp | 液体噴射ヘッドの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3726909B2 (ja) * | 2002-07-10 | 2005-12-14 | セイコーエプソン株式会社 | 液体噴射ヘッドの製造方法 |
JP2009083140A (ja) | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 液体吐出ヘッド及びその製造方法 |
JP2011088369A (ja) | 2009-10-23 | 2011-05-06 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
-
2012
- 2012-12-27 JP JP2012284504A patent/JP6201313B2/ja active Active
-
2013
- 2013-12-26 US US14/141,159 patent/US8936355B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004001527A (ja) * | 2002-05-31 | 2004-01-08 | Hewlett-Packard Development Co Lp | チャンバおよび流体噴出器ヘッド |
JP2008074016A (ja) * | 2006-09-22 | 2008-04-03 | Fujifilm Corp | ノズルプレートの製造方法、液体吐出ヘッド及び画像形成装置 |
JP2009018449A (ja) * | 2007-07-10 | 2009-01-29 | Seiko Epson Corp | 噴射ヘッドの製造方法 |
JP2009279830A (ja) * | 2008-05-22 | 2009-12-03 | Seiko Epson Corp | 液体噴射ヘッドおよびそれを備えた液体噴射装置 |
JP2010188715A (ja) * | 2009-01-21 | 2010-09-02 | Toshiba Tec Corp | インクジェットヘッドおよびインクジェットヘッドの製造方法 |
JP2011156845A (ja) * | 2010-02-04 | 2011-08-18 | Seiko Epson Corp | 液体噴射ヘッド、及び、液体噴射ヘッドの製造方法 |
JP2011206920A (ja) * | 2010-03-26 | 2011-10-20 | Seiko Epson Corp | 液体噴射ヘッド及びその製造方法並びに液体噴射装置 |
JP2012143981A (ja) * | 2011-01-13 | 2012-08-02 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2012218188A (ja) * | 2011-04-04 | 2012-11-12 | Seiko Epson Corp | 液体噴射ヘッドの製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017534494A (ja) * | 2014-11-19 | 2017-11-24 | メムジェット テクノロジー リミテッド | 改善された耐用寿命を有するインクジェットノズル装置 |
US10850514B2 (en) | 2018-03-20 | 2020-12-01 | Brother Kogyo Kabushiki Kaisha | Liquid ejecting head and method for manufacturing liquid ejecting head |
US10913275B2 (en) | 2018-03-22 | 2021-02-09 | Brother Kogyo Kabushiki Kaisha | Liquid discharge head and method of manufacturing liquid discharge head |
JPWO2021199731A1 (ja) * | 2020-03-30 | 2021-10-07 | ||
WO2021199731A1 (ja) * | 2020-03-30 | 2021-10-07 | 富士フイルム株式会社 | 液体吐出構造体、液体吐出ヘッド及び液体吐出装置 |
JP7334335B2 (ja) | 2020-03-30 | 2023-08-28 | 富士フイルム株式会社 | 液体吐出構造体、液体吐出ヘッド及び液体吐出装置 |
WO2022070334A1 (ja) * | 2020-09-30 | 2022-04-07 | コニカミノルタ株式会社 | インクジェットヘッドおよびその製造方法、ならびに画像形成装置 |
Also Published As
Publication number | Publication date |
---|---|
US8936355B2 (en) | 2015-01-20 |
US20140184705A1 (en) | 2014-07-03 |
JP6201313B2 (ja) | 2017-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6201313B2 (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP2014124887A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
US9327500B2 (en) | Nozzle plate, liquid ejecting head, and liquid ejecting apparatus | |
US9358784B2 (en) | Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head | |
US9302481B2 (en) | Nozzle plate, liquid ejecting head, and liquid ejecting apparatus | |
JP2014124883A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP7087521B2 (ja) | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 | |
JP4240233B2 (ja) | 液体噴射ヘッド及びこれを有する液体噴射装置 | |
JP2021115703A (ja) | 液体噴射ヘッド、液体噴射装置 | |
JP6103194B2 (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP2014124880A (ja) | ノズルプレート、液体噴射ヘッド及び液体噴射装置 | |
US8936351B2 (en) | Nozzle plate, liquid ejecting head, and liquid ejecting apparatus | |
JP2014124876A (ja) | ノズルプレート、液体噴射ヘッド及び液体噴射装置 | |
JP2014151469A (ja) | 液体吐出ヘッド及び液体吐出装置 | |
JP2014124870A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP5754198B2 (ja) | 液体噴射ヘッド、液体噴射装置及び圧電アクチュエーター | |
JP2010228274A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP6274423B2 (ja) | 圧電アクチュエーター、液体噴射ヘッド及び液体噴射装置 | |
JP2014124884A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP6020154B2 (ja) | 液体噴射ヘッドの製造方法及び液体噴射装置の製造方法 | |
JP2019162798A (ja) | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 | |
JP2014124878A (ja) | ノズルプレート、液体噴射ヘッド及び液体噴射装置 | |
JP2014124881A (ja) | ノズルプレート並びにそれを具備する液体噴射ヘッド及び液体噴射装置 | |
JP2016179622A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP2014124886A (ja) | 液体噴射ヘッド及び液体噴射装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20150109 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151117 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20160610 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20160624 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170404 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170417 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170801 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170814 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6201313 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |