JP2014079820A - Method for manufacturing polishing composition - Google Patents
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- JP2014079820A JP2014079820A JP2012227406A JP2012227406A JP2014079820A JP 2014079820 A JP2014079820 A JP 2014079820A JP 2012227406 A JP2012227406 A JP 2012227406A JP 2012227406 A JP2012227406 A JP 2012227406A JP 2014079820 A JP2014079820 A JP 2014079820A
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- 239000000203 mixture Substances 0.000 title claims abstract description 129
- 238000005498 polishing Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 99
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910001868 water Inorganic materials 0.000 claims abstract description 63
- 239000002994 raw material Substances 0.000 claims abstract description 40
- 239000007769 metal material Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000470 constituent Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- 238000011109 contamination Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 229910052755 nonmetal Inorganic materials 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- -1 polypropylene Polymers 0.000 description 6
- 150000007514 bases Chemical class 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000010422 painting Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229960005141 piperazine Drugs 0.000 description 1
- 229960003506 piperazine hexahydrate Drugs 0.000 description 1
- AVRVZRUEXIEGMP-UHFFFAOYSA-N piperazine;hexahydrate Chemical compound O.O.O.O.O.O.C1CNCCN1 AVRVZRUEXIEGMP-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
本発明は、研磨用組成物の製造方法に関する。 The present invention relates to a method for producing a polishing composition.
研磨用組成物は、例えば、砥粒、塩基性化合物、水等を混合することで製造される。得られた研磨用組成物は、例えばシリコン基板を研磨対象物とした研磨に用いられる。研磨には、定盤を備えた研磨装置が用いられる(例えば、特許文献1参照)。研磨装置では、研磨対象物への金属成分の混入を抑制するために、研磨用組成物と接触する接液部をフッ素系樹脂でコーティングした構成が知られている。 The polishing composition is produced, for example, by mixing abrasive grains, a basic compound, water and the like. The obtained polishing composition is used for polishing using, for example, a silicon substrate as an object to be polished. For polishing, a polishing apparatus having a surface plate is used (for example, see Patent Document 1). In the polishing apparatus, a configuration in which a liquid contact portion that comes into contact with the polishing composition is coated with a fluorine-based resin in order to suppress mixing of a metal component into the object to be polished is known.
研磨用組成物を製造する製造過程において、研磨用組成物に金属成分が混入されるおそれがある。
本発明は、こうした実情に鑑みてなされたものであり、その目的は、金属成分の混入を抑制することの容易な研磨用組成物の製造方法を提供することにある。
In the production process for producing the polishing composition, the metal component may be mixed into the polishing composition.
This invention is made | formed in view of such a situation, The objective is to provide the manufacturing method of the polishing composition which can suppress mixing of a metal component easily.
上記の目的を達成するために、本発明の一態様では、原料を混合する工程を有する研磨用組成物の製造方法であって、前記工程では、前記原料としての水の接する部位の一部又は全部に非金属材料を用いた設備を用いる研磨用組成物の製造方法が提供される。 In order to achieve the above object, in one embodiment of the present invention, there is provided a method for producing a polishing composition comprising a step of mixing raw materials, wherein in the step, a part of a portion in contact with water as the raw material or Provided is a method for producing a polishing composition using equipment that uses a nonmetallic material for all.
この製造方法によれば、原料を混合する工程において、例えば、原料としての水の接する部位の一部に非金属材料を用いた設備を用いることにより、原料としての水と金属材料との接触が部分的に回避される。前記設備において、水と接する部位の全面積に対する、非金属材料を用いて構成した部位の占有面積は、5%以上であることが好ましく、より好ましくは30%以上、更に好ましくは50%以上、一層好ましくは80%以上であり、特に好ましくは90%以上である。 According to this manufacturing method, in the step of mixing the raw materials, for example, by using equipment using a non-metallic material for a part of the portion in contact with the water as the raw material, the contact between the water as the raw material and the metal material is achieved. Partially avoided. In the equipment, the occupied area of the part constituted by using the nonmetallic material with respect to the total area of the part in contact with water is preferably 5% or more, more preferably 30% or more, and further preferably 50% or more, More preferably, it is 80% or more, and particularly preferably 90% or more.
上記研磨用組成物の製造方法では、前記設備は、金属材料を用いて構成される本体と、その本体に積層される積層部とを有する構成部材を含み、前記積層部が前記水の接する部位を構成することが好ましい。 In the method for producing a polishing composition, the facility includes a component having a main body configured using a metal material and a laminated portion laminated on the main body, and the laminated portion is in contact with the water. It is preferable to constitute.
上記研磨用組成物の製造方法では、前記積層部が同一の非金属材料を用いて構成されることが好ましい。 In the said manufacturing method of polishing composition, it is preferable that the said laminated part is comprised using the same nonmetallic material.
本発明によれば、金属成分の混入を抑制することが容易となる効果が得られる。 According to the present invention, it is possible to obtain an effect that it is easy to suppress mixing of metal components.
以下、本発明の一実施形態を説明する。
研磨用組成物の製造方法は、原料を混合する工程を有する。この工程では、原料としての水の接する部位の全部に非金属材料を用いた設備を用いる。本実施形態における設備は、第1混合物を得るための第1混合容器、第2混合物を得るための第2混合容器、及び第1混合物と第2混合物とを混合する主混合容器を備える。第1混合容器と主混合容器とは第1配管部により連結されている。第2混合容器と主混合容器とは第2配管部により連結されている。
Hereinafter, an embodiment of the present invention will be described.
The manufacturing method of polishing composition has the process of mixing a raw material. In this step, equipment using a non-metallic material is used for all of the parts in contact with water as a raw material. The equipment in this embodiment includes a first mixing container for obtaining a first mixture, a second mixing container for obtaining a second mixture, and a main mixing container for mixing the first mixture and the second mixture. The 1st mixing container and the main mixing container are connected by the 1st piping part. The 2nd mixing container and the main mixing container are connected by the 2nd piping part.
第1混合容器は、第1混合物を収容する容器と、撹拌機又は分散機とを備えている。容器は、金属材料を用いて構成される本体と、その本体の内面に積層されるとともに非金属材料を用いて構成される積層部とを有する。本実施形態では、第1混合容器の内面の全体が、積層部によって構成されている。撹拌機又は分散機としては、例えば、翼式撹拌機、超音波分散機、及びホモミキサーが挙げられる。撹拌機又は分散機は、金属材料を用いて構成される本体と、本体に積層されるとともに非金属材料を用いて構成される積層部とを有する。 The first mixing container includes a container for storing the first mixture and a stirrer or a disperser. The container includes a main body configured using a metal material, and a stacked portion configured using a non-metallic material while being stacked on the inner surface of the main body. In the present embodiment, the entire inner surface of the first mixing container is constituted by the stacked portion. Examples of the stirrer or disperser include a wing stirrer, an ultrasonic disperser, and a homomixer. The stirrer or the disperser includes a main body configured using a metal material, and a stacked unit configured using a non-metallic material while being stacked on the main body.
第1混合容器の有する積層部は、第1混合物が接する部位を構成している。すなわち、第1混合容器内で調製される第1混合物は、本体に接することなく、積層部のみに接する。 The laminated portion of the first mixing container constitutes a portion that is in contact with the first mixture. That is, the 1st mixture prepared in a 1st mixing container contacts only a lamination | stacking part, without contacting a main body.
本体を構成する金属材料としては、特に限定されないが、例えば、耐食性に優れるとともにコスト的に有利であるという観点からステンレス鋼が好適に用いられる。
積層部を構成する非金属材料としては、例えば、樹脂材料及びセラミックスが挙げられる。樹脂材料としては、例えば、オレフィン系樹脂、塩化ビニル系樹脂、フッ素系樹脂、アクリル系樹脂、アクリロニトリル−ブタジエン−スチレン共重合樹脂(ABS樹脂)、及びポリイソブチレン樹脂が挙げられる。
Although it does not specifically limit as a metal material which comprises a main body, For example, stainless steel is used suitably from a viewpoint that it is excellent in corrosion resistance and advantageous in cost.
Examples of the non-metallic material constituting the laminated portion include a resin material and ceramics. Examples of the resin material include olefin resin, vinyl chloride resin, fluorine resin, acrylic resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), and polyisobutylene resin.
オレフィン系樹脂としては、例えば、ポリプロピレン系樹脂、及びポリエチレン系樹脂が挙げられる。塩化ビニル系樹脂としては、例えば、ポリ塩化ビニル系樹脂、及びポリ塩化ビニリデン系樹脂が挙げられる。フッ素系樹脂としては、例えば、ポリテトラフルオロエチレン(PTFE)、テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体(PFA)、テトラフルオロエチレン・エチレン共重合体(ETFE)、テトラフルオロエチレン・ヘキサフルオロプロピレン共重合体(FEP)、ポリビニリデンフルオライド(PVDF)、及びエチレン-クロロトリフルオロエチレンコポリマー(ECTFE)が挙げられる。セラミックスとしては、例えば、六方晶窒化ホウ素が挙げられる。 Examples of the olefin resin include a polypropylene resin and a polyethylene resin. Examples of the vinyl chloride resin include polyvinyl chloride resins and polyvinylidene chloride resins. Examples of the fluororesin include polytetrafluoroethylene (PTFE), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene / ethylene copolymer (ETFE), and tetrafluoroethylene / hexafluoropropylene. Copolymer (FEP), polyvinylidene fluoride (PVDF), and ethylene-chlorotrifluoroethylene copolymer (ECTFE). An example of the ceramic is hexagonal boron nitride.
非金属材料の中でも、撥水性に優れるという観点から、フッ素系樹脂が好ましい。
第2混合容器及び主混合容器についても、第1混合容器と同様に本体及び積層部を有する。第2混合容器の有する積層部は、第2混合物と接する部位を構成するとともに、主混合容器の有する積層部は、第1混合物及び第2混合物、並びに第1混合物と第2混合物との混合物と接する部位を構成する。
Among non-metallic materials, a fluororesin is preferable from the viewpoint of excellent water repellency.
Similarly to the first mixing container, the second mixing container and the main mixing container also have a main body and a laminated portion. The laminated portion of the second mixing container constitutes a portion in contact with the second mixture, and the laminated portion of the main mixing container includes the first mixture and the second mixture, and the mixture of the first mixture and the second mixture. It constitutes the part that touches.
第1配管部は、筒状の管体と、第1混合容器から主混合容器に第1混合物を移送させるポンプとを備える。管体は、金属材料を用いて構成される本体と、その内面に積層されるとともに非金属材料を用いて構成される積層部とを有する。ポンプは、ケーシングとケーシング内に収容される回転体とを備える。ケーシング及び回転体は、金属材料を用いて構成される本体と、本体に積層されるとともに非金属材料を用いて構成される積層部とを有する。第1配管部の有する積層部は、第1混合物と接する部位を構成する。すなわち、第1配管部の有する積層部は、第1混合物を通じる流路を形成する。 The first piping section includes a tubular tube body and a pump for transferring the first mixture from the first mixing container to the main mixing container. The tubular body has a main body configured using a metal material, and a stacked portion configured using a non-metallic material while being stacked on the inner surface thereof. The pump includes a casing and a rotating body accommodated in the casing. The casing and the rotating body have a main body configured using a metal material, and a stacked portion configured using a non-metallic material while being stacked on the main body. The laminated part which the 1st piping part has constitutes the part which touches the 1st mixture. That is, the laminated part which the 1st piping part has forms the flow path which lets a 1st mixture pass.
第2配管部についても、第1配管部と同様に本体及び積層部を有する。第2配管部の有する積層部は、第2混合物と接する部位を構成する。すなわち、第2配管部の有する積層部は、第2混合物を通じる流路を形成する。 The second piping part also has a main body and a laminated part as in the first piping part. The laminated part which the 2nd piping part has constitutes the part which touches the 2nd mixture. That is, the laminated part which the 2nd piping part has forms the flow path which lets a 2nd mixture pass.
設備の有する積層部は、同一の非金属材料を用いて構成されることが好ましい。設備の有する積層部の厚みは、例えば0.1mm以上、5mm以下の範囲であることが好ましい。 It is preferable that the laminated portion of the equipment is configured using the same non-metallic material. The thickness of the laminated portion of the equipment is preferably in the range of 0.1 mm to 5 mm, for example.
設備の有する積層部は、コーティングにより形成される。コーティングは、塗装及び溶射を含む。塗装方法としては、例えば、ディッピング、スプレーガン、刷毛塗り、及びローラー塗りが挙げられる。塗装としては、焼き付け塗装を採用することもできる。溶射としては、ガス式溶射及び電気式溶射のいずれであってもよい。 The laminated portion of the equipment is formed by coating. Coating includes painting and spraying. Examples of the coating method include dipping, spray gun, brush coating, and roller coating. As the painting, baking painting can also be adopted. As the thermal spraying, either gas type thermal spraying or electric thermal spraying may be used.
原料を混合する工程では、第1混合容器で第1混合物が調製される。本実施形態の第1混合物は、研磨用組成物の原料として、砥粒及び水を含む。砥粒の材料としては、例えば、酸化ケイ素、酸化アルミニウム、酸化ジルコニウム、酸化セリウム、及び酸化チタンが挙げられる。 In the step of mixing the raw materials, the first mixture is prepared in the first mixing container. The 1st mixture of this embodiment contains an abrasive grain and water as a raw material of polishing composition. Examples of the abrasive material include silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, and titanium oxide.
水は、砥粒の分散媒として用いられる。水は、例えば、遷移金属イオンの合計含有量が100ppb以下とされることが好ましい。例えば、イオン交換樹脂を用いる不純物イオンの除去、フィルターによる異物の除去、蒸留等の操作によって水の純度を高めることができる。具体的には、例えば、イオン交換水、純水、超純水、又は蒸留水を用いることが好ましい。なお、研磨用組成物の製造方法において、第1混合物以外の原料として研磨用組成物に含有される水についても同様の品質の水が用いられることが好ましい。 Water is used as a dispersion medium for abrasive grains. For example, the water preferably has a total content of transition metal ions of 100 ppb or less. For example, the purity of water can be increased by operations such as removal of impurity ions using an ion exchange resin, removal of foreign matters by a filter, and distillation. Specifically, it is preferable to use, for example, ion exchange water, pure water, ultrapure water, or distilled water. In addition, in the manufacturing method of polishing composition, it is preferable that the water of the same quality is used also about the water contained in polishing composition as raw materials other than a 1st mixture.
原料を混合する工程では、第2混合容器で第2混合物が調製される。本実施形態の第2混合物は、研磨用組成物の原料として、塩基性化合物及び水を含む。
塩基性化合物としては、例えば、アルカリ金属の水酸化物、水酸化第四級アンモニウム又はその塩、アンモニア、及びアミンが挙げられる。アルカリ金属の水酸化物としては、例えば、水酸化カリウム、及び水酸化ナトリウムが挙げられる。水酸化第四級アンモニウム又はその塩としては、例えば、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、及び水酸化テトラブチルアンモニウムが挙げられる。アミンとしては、例えば、メチルアミン、ジメチルアミン、トリメチルアミン、エチルアミン、ジエチルアミン、トリエチルアミン、エチレンジアミン、モノエタノールアミン、N−(β−アミノエチル)エタノールアミン、ヘキサメチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、無水ピペラジン、ピペラジン六水和物、1−(2−アミノエチル)ピペラジン、N−メチルピペラジン、及びグアニジンが挙げられる。
In the step of mixing the raw materials, the second mixture is prepared in the second mixing container. The 2nd mixture of this embodiment contains a basic compound and water as a raw material of polishing composition.
Examples of the basic compound include an alkali metal hydroxide, quaternary ammonium hydroxide or a salt thereof, ammonia, and an amine. Examples of the alkali metal hydroxide include potassium hydroxide and sodium hydroxide. Examples of the quaternary ammonium hydroxide or a salt thereof include tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabutylammonium hydroxide. Examples of amines include methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, ethylenediamine, monoethanolamine, N- (β-aminoethyl) ethanolamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, anhydrous piperazine, Examples include piperazine hexahydrate, 1- (2-aminoethyl) piperazine, N-methylpiperazine, and guanidine.
原料を混合する工程では、第1混合容器内の第1混合物を主混合容器に供給し、第2混合容器内の第2混合物を主混合容器に供給する。主混合容器に対する第1混合物及び第2混合物の供給する順序は、特に限定されない。供給された第1混合物及び第2混合物は、主混合容器内で混合される。主混合容器内では、第1混合物と第2混合物との混合物が調製される。 In the step of mixing the raw materials, the first mixture in the first mixing container is supplied to the main mixing container, and the second mixture in the second mixing container is supplied to the main mixing container. The order of supplying the first mixture and the second mixture to the main mixing container is not particularly limited. The supplied first mixture and second mixture are mixed in the main mixing container. In the main mixing vessel, a mixture of the first mixture and the second mixture is prepared.
研磨用組成物の製造方法は、研磨用組成物中の異物を削減して、より品質の高い研磨用組成物を得るという観点から、第1混合物と第2混合物との混合物をろ過するろ過工程を有することが好ましい。ろ過工程を実施するろ過器と、主混合容器とはろ過器用配管部により連結されることが好ましい。ろ過器用配管部にはポンプが設けられることで、主混合容器からろ過器に混合物は移送されるように構成される。ろ過器としては、フィルターがケーシング内に収容された周知のろ過器を用いることができる。ろ過器用配管部及びろ過器において、第1混合物と第2混合物との混合物が接する部位は、上述したように積層部によって構成されることが好ましい。なお、フィルターの材質及び構造は特に限定されるものではない。フィルターの材質としては、例えば、セルロース、ポリアミド、ポリスルホン、ポリエーテルスルホン、ポリプロピレン、ポリテトラフルオロエチレン(PTFE)、ポリカーボネート、ポリアミド(ナイロン)、及びガラスが挙げられる。フィルターの材質としては、細かい目開きでの精密なろ過を実施する観点から、PTFE、ポリカーボネート、又はポリアミドが好ましく、ポリアミドが最も好ましい。フィルターの構造としては、例えばデプス、プリーツ、及びメンブレンが挙げられる。 The method for producing a polishing composition is a filtration step of filtering the mixture of the first mixture and the second mixture from the viewpoint of reducing foreign matters in the polishing composition and obtaining a higher-quality polishing composition. It is preferable to have. It is preferable that the filter which implements a filtration process and the main mixing container are connected by the piping part for filters. The filter pipe is provided with a pump so that the mixture is transferred from the main mixing container to the filter. As the filter, a known filter in which a filter is accommodated in a casing can be used. In the piping section for a filter and the filter, it is preferable that the portion where the mixture of the first mixture and the second mixture is in contact is constituted by the laminated section as described above. The material and structure of the filter are not particularly limited. Examples of the filter material include cellulose, polyamide, polysulfone, polyethersulfone, polypropylene, polytetrafluoroethylene (PTFE), polycarbonate, polyamide (nylon), and glass. The filter material is preferably PTFE, polycarbonate, or polyamide, and most preferably polyamide, from the viewpoint of carrying out precise filtration with fine openings. Examples of the filter structure include depth, pleats, and membranes.
得られた研磨用組成物は、容器に充填されて保管又は運搬される。研磨用組成物は、使用時に必要に応じて水や塩基性の水溶液で希釈される。
研磨用組成物を用いた研磨には、例えば、片面研磨装置や両面研磨装置を用いることができる。研磨に用いられる研磨パッドは、その材質、硬度や厚み等の物性等について特に限定されない。研磨パッドとしては、例えば、ポリウレタンタイプ、不織布タイプ、及びスウェードタイプのいずれのタイプのものを使用してもよい。また、研磨パッドは、砥粒を含むものであっても、砥粒を含まないものであってもよい。
The obtained polishing composition is filled in a container and stored or transported. The polishing composition is diluted with water or a basic aqueous solution as necessary at the time of use.
For polishing using the polishing composition, for example, a single-side polishing apparatus or a double-side polishing apparatus can be used. The polishing pad used for polishing is not particularly limited in terms of its material, physical properties such as hardness and thickness. As the polishing pad, for example, any of polyurethane type, non-woven fabric type, and suede type may be used. The polishing pad may contain abrasive grains or may not contain abrasive grains.
研磨対象物としては、例えば、シリコン基板、ステンレス等の金属、酸化シリコン基板、プラスチック基板、ガラス基板、及び石英基板が挙げられる。特に、半導体用基板では、金属成分による汚染を低減することが求められる。このため、半導体用基板を得るための研磨に用いられる研磨用組成物には、金属成分の含有量を極力低減することが求められる。こうした観点から、本実施形態で製造された研磨用組成物は、半導体用基板を得るための研磨に用いられることが好適である。 Examples of the object to be polished include a silicon substrate, a metal such as stainless steel, a silicon oxide substrate, a plastic substrate, a glass substrate, and a quartz substrate. In particular, semiconductor substrates are required to reduce contamination due to metal components. For this reason, it is calculated | required for the polishing composition used for grinding | polishing for obtaining the board | substrate for semiconductors to reduce content of a metal component as much as possible. From such a viewpoint, the polishing composition produced in the present embodiment is preferably used for polishing for obtaining a semiconductor substrate.
次に、研磨用組成物の製造方法の作用について説明する。
研磨用組成物の製造方法は、研磨用組成物の原料を混合する工程を有している。こうした工程を実施する設備では、原料としての水と設備とが接触する時間が比較的長い。このため、原料としての水の接触する部位が金属材料を用いて構成されている場合、金属材料から金属成分が溶出し易く、溶出した金属成分は研磨用組成物に混入し易くなる。この点、本実施形態の製造方法では、第1混合物、第2混合物、及び第1混合物と第2混合物との混合物が接する部位、すなわち原料としての水が接する部位が、非金属材料を用いて構成されている。このため、研磨用組成物の原料を混合する工程において、原料としての水と金属材料との接触が回避される。
Next, the effect | action of the manufacturing method of polishing composition is demonstrated.
The manufacturing method of polishing composition has the process of mixing the raw material of polishing composition. In the facility for performing such a process, the time for contact between the water as the raw material and the facility is relatively long. For this reason, when the site | part which the water as a raw material contacts is comprised using the metal material, a metal component tends to elute from a metal material, and the eluted metal component becomes easy to mix in polishing composition. In this regard, in the manufacturing method of the present embodiment, the portion where the first mixture, the second mixture, and the mixture of the first mixture and the second mixture are in contact, that is, the portion where the water as the raw material is in contact is made of a nonmetallic material. It is configured. For this reason, in the process of mixing the raw material of polishing composition, the contact with the water and metal material as a raw material is avoided.
以上詳述した本実施形態によれば、次のような効果が発揮される。
(1)研磨用組成物の原料を混合する工程では、原料としての水の接する部位の全部に非金属材料を用いて構成した設備を用いる。このため、研磨用組成物に対する金属成分の混入を抑制することが容易となる。
According to the embodiment described in detail above, the following effects are exhibited.
(1) In the step of mixing the raw material of the polishing composition, equipment constructed using a non-metallic material is used for all of the parts in contact with water as the raw material. For this reason, it becomes easy to suppress mixing of the metal component with respect to polishing composition.
(2)本実施形態で用いる設備は、金属材料を用いて構成される本体と、その本体に積層される積層部とを有する構成部材(第1混合容器、第2混合容器、主混合容器、第1配管部及び第2配管部)を用いて構成されている。こうした積層部を有する構成部材により、原料としての水の接触する部位が構成されている。この場合、構成部材の有する本体を金属材料から形成することができるため、構成部材の耐久性や耐衝撃性を高めることが容易となる。 (2) The equipment used in the present embodiment is a structural member (a first mixing container, a second mixing container, a main mixing container, a main body configured using a metal material, and a laminated portion stacked on the main body. 1st piping part and 2nd piping part) are comprised. The component which has such a lamination | stacking part comprises the site | part which the water as a raw material contacts. In this case, since the main body of the constituent member can be formed from a metal material, it is easy to improve the durability and impact resistance of the constituent member.
(3)積層部は、同一の非金属材料から構成されることが好ましい。この場合、例えば、塗装又は溶射により、積層部を容易に形成することができる。
(変更例)
前記実施形態は、次のように変更されてもよい。
(3) It is preferable that a laminated part is comprised from the same nonmetallic material. In this case, for example, the laminated portion can be easily formed by painting or spraying.
(Example of change)
The embodiment may be modified as follows.
・前記設備の有する構成部材において、積層部の少なくとも一部を省略し、積層部を有しない部位を非金属材料に変更されてもよい。例えば、第1混合容器の有する容器に、容器の外部から第1混合物を視認可能とする窓部材が設けられ、その窓部材に第1混合物が接するように構成されてもよい。窓部材を構成する非金属材料としては、例えば、可視光の透過性(透明性)を有する樹脂材料を用いることができる。このような窓部材は、第1混合容器以外の設備において、原料としての水の接する部位に設けることもできる。可視光の透過性(透明性)を有する樹脂材料としては、例えば、透明ポリプロピレン系樹脂、及び透明ポリ塩化ビニル系樹脂が挙げられる。 -In the component which the said equipment has, at least one part of a lamination | stacking part may be abbreviate | omitted and the site | part which does not have a lamination | stacking part may be changed into a nonmetallic material. For example, the container which the 1st mixing container has is provided with the window member which makes the 1st mixture visible from the exterior of a container, and it may be constituted so that the 1st mixture may touch the window member. As the non-metallic material constituting the window member, for example, a resin material having visible light transparency (transparency) can be used. Such a window member can also be provided in the site | part which water as a raw material contacts in installations other than a 1st mixing container. Examples of the resin material having visible light transparency (transparency) include transparent polypropylene-based resins and transparent polyvinyl chloride-based resins.
・前記設備において、原料としての水の接する部位の少なくとも一部は、非金属材料単体を用いた構成部材によって構成されてもよい。前記設備において、例えば、上記の可視光の透過性(透明性)を有する樹脂材料からなる管体を用いることは、通液状態を視認することができるという観点から好ましい。 -In the said equipment, at least one part of the site | part which water contacts as a raw material may be comprised by the structural member using a nonmetallic material single-piece | unit. In the facility, for example, it is preferable to use a tubular body made of a resin material having visible light transparency (transparency) from the viewpoint that a liquid passing state can be visually recognized.
・前記設備において、原料としての水の接する部位以外の部位は、金属材料を用いて構成されてもよいし、非金属材料を用いて構成されてもよい。
・前記設備は、3つ以上の混合容器を備える設備や第1配管部、第2配管部及びろ過器用配管部以外の配管部を有する設備に変更されてもよい。このように設備を変更した場合においても、原料としての水の接する部位の全体が、非金属材料を用いて構成されていることが好ましい。
-In the said equipment, site | parts other than the site | part which water contacts as a raw material may be comprised using a metallic material, and may be comprised using a nonmetallic material.
-The said equipment may be changed into the equipment which has piping parts other than the equipment provided with three or more mixing containers, the 1st piping part, the 2nd piping part, and the piping part for filters. Even when the equipment is changed in this way, it is preferable that the entire portion in contact with water as a raw material is configured using a non-metallic material.
・前記設備は、第1混合容器、第2混合容器及び主混合容器を備えているが、第1混合容器及び第2混合容器の少なくとも一方は省略されてもよい。これに伴って、第1配管部及び第2配管部の少なくとも一方も省略される。例えば、第1混合容器及び第2混合容器のいずれも省略された場合、主混合容器に、複数種の原料を直接投入し、その主混合容器内で水を含む混合物を得る設備とされる。 The equipment includes a first mixing container, a second mixing container, and a main mixing container, but at least one of the first mixing container and the second mixing container may be omitted. Along with this, at least one of the first piping portion and the second piping portion is also omitted. For example, when both the first mixing container and the second mixing container are omitted, a plurality of types of raw materials are directly charged into the main mixing container, and the mixture containing water is obtained in the main mixing container.
・前記第1混合容器及び第2混合容器のいずれか一方は、撹拌機又は分散機を有しない容器に変更されてもよい。こうした容器を用いて、例えば、前記製造方法を使用時の研磨用組成物を製造する製造方法に変更して実施することができる。この製造方法は、研磨用組成物の原料を混合する工程として、水を含む混合物と水とを混合することで、混合物を水で希釈する工程を有する。この工程において、例えば、第1混合容器には、水を含む混合物が収容される。この混合物は、第1混合容器内で更に混合されることでより均一な状態とされる。一方、撹拌機又は分散機を有しない第2容器には水が収容される。そして、水を含む混合物と水とは主混合容器に供給される。主混合容器では水を含む混合物と水とが混合された混合物が得られる。得られた混合物は、必要に応じて、ろ過された後に、使用時の研磨用組成物とされる。 -Either one of the said 1st mixing container and the 2nd mixing container may be changed into the container which does not have a stirrer or a disperser. Using such a container, for example, the production method can be changed to a production method for producing a polishing composition at the time of use. This manufacturing method has the process of diluting a mixture with water by mixing the mixture containing water and water as a process of mixing the raw material of polishing composition. In this step, for example, a mixture containing water is accommodated in the first mixing container. This mixture is further mixed in the first mixing container to be more uniform. On the other hand, water is accommodated in the second container that does not have a stirrer or a disperser. And the mixture containing water and water are supplied to the main mixing container. In the main mixing container, a mixture containing water and a mixture containing water is obtained. The obtained mixture is filtered as necessary, and then used as a polishing composition at the time of use.
・前記第1配管部又は第2配管部には、管体の有する流路を開閉する開閉弁等の弁体が備えられていてもよい。こうした弁体において、水を含む混合物が接する部位は、非金属材料を用いて構成されることが好ましい。 -The said 1st piping part or the 2nd piping part may be equipped with valve bodies, such as an on-off valve which opens and closes the flow path which a pipe body has. In such a valve body, it is preferable that the part which the mixture containing water contacts is configured using a non-metallic material.
・前記ポンプは省略されてもよい。例えば、第1混合物及び第2混合物の少なくとも一方の混合物が主混合容器へ自重で供給されるように、混合容器及び第2混合容器の少なくとも一方を配置されてもよい。 -The pump may be omitted. For example, at least one of the mixing container and the second mixing container may be arranged such that at least one of the first mixture and the second mixture is supplied to the main mixing container by its own weight.
・前記第1混合容器において、塩基性化合物が混合されてもよい。また、前記第1混合容器又は第2混合容器において、砥粒及び塩基性化合物以外の添加剤が混合されてもよい。添加剤としては、例えば、界面活性剤、水溶性高分子、キレート剤、防腐剤、防黴剤、及び防錆剤が挙げられる。 -A basic compound may be mixed in the first mixing vessel. In the first mixing container or the second mixing container, additives other than the abrasive grains and the basic compound may be mixed. Examples of the additive include surfactants, water-soluble polymers, chelating agents, preservatives, antifungal agents, and rust inhibitors.
・前記実施形態及び変更例として記載した設備において、原料としての水の接する部位の全体が、非金属材料を用いて構成されているが、前記部位の一部に非金属材料を用いてもよい。この場合であっても、原料としての水と金属材料との接触が部分的に回避されるため、研磨用組成物に対する金属成分の混入を抑制することが容易となる。 -In the facility described as the embodiment and the modified example, the entire portion that contacts water as a raw material is configured using a non-metallic material, but a non-metallic material may be used for a part of the portion. . Even in this case, since contact between water as a raw material and the metal material is partially avoided, it is easy to suppress the mixing of the metal component into the polishing composition.
上記実施形態及び変更例から把握できる技術的思想について以下に記載する。
(イ)前記設備は、水を含む第1混合物を得る第1混合容器と、水を含む第2混合物を得る第2混合容器と、第1混合物と第2混合物とを混合する主混合容器と、第1混合容器と主混合容器とを連結する第1配管部と、第2混合容器と主混合容器とを連結する第2配管部とを備える、研磨用組成物の製造方法。
The technical idea that can be grasped from the embodiment and the modified examples will be described below.
(A) The equipment includes a first mixing container for obtaining a first mixture containing water, a second mixing container for obtaining a second mixture containing water, and a main mixing container for mixing the first mixture and the second mixture. A method for producing a polishing composition, comprising: a first piping part that connects the first mixing container and the main mixing container; and a second piping part that connects the second mixing container and the main mixing container.
(ロ)前記原料を混合する工程は、水を含む混合物と水とを混合することで前記混合物を希釈する工程であり、前記設備は、水を含む混合物を更に混合する混合容器と、水を収容する容器と、前記混合物と前記水とを混合する主混合容器と、前記混合容器と主混合容器とを連結する配管部と、前記容器と前記主混合容器とを連結する配管部とを備える、研磨用組成物の製造方法。 (B) The step of mixing the raw materials is a step of diluting the mixture by mixing a mixture containing water and water, and the equipment further includes a mixing container for further mixing the mixture containing water, and water. A container for housing, a main mixing container for mixing the mixture and the water, a piping part for connecting the mixing container and the main mixing container, and a piping part for connecting the container and the main mixing container. The manufacturing method of polishing composition.
次に、実施例を挙げて前記実施形態を具体的に説明する。
(実施例1)
実施例1では、試験用の設備を用いて原料を混合する工程を実施した。この試験用の設備では、水を含む混合物の接する部位の全部がフッ素系樹脂(商品名:テフロン)を用いて構成されている。また、この試験用の設備では、水を含む混合物が接する部位の大部分は、ステンレス鋼(SUS304)を用いて構成される本体と、フッ素系樹脂を用いて構成される積層部とを有する構成部材を用いて構成されている。
Next, the embodiment will be specifically described with reference to examples.
Example 1
In Example 1, the process of mixing raw materials was performed using test equipment. In this test facility, all of the parts in contact with the mixture containing water are made of a fluororesin (trade name: Teflon). Further, in this test facility, most of the portions that come into contact with the water-containing mixture have a main body constituted by using stainless steel (SUS304) and a laminated portion constituted by using a fluorine-based resin. It is comprised using the member.
第1混合容器に、原料としてコロイダルシリカ、アンモニア、及び水を供給し、それら原料を混合することで第1混合物を調製した。第2混合容器に、原料としてヒドロキシエチルセルロース、アンモニア、及び水を供給し、それら原料を混合することで、第2混合物を調製した。第1混合物及び第2混合物をそれぞれ第1配管部及び第2配管部を通じて主混合容器に供給した後、第1混合物と第2混合物とを混合した。得られた混合物中における金属成分(Cr、Fe、及びNi)の含有量をICP発光分析装置“ICPS−8100”(株式会社島津製作所製)によって測定した。その結果を表1に示す。 Colloidal silica, ammonia, and water were supplied as raw materials to the first mixing container, and the first mixture was prepared by mixing these raw materials. A second mixture was prepared by supplying hydroxyethyl cellulose, ammonia, and water as raw materials to the second mixing vessel and mixing these raw materials. After supplying the 1st mixture and the 2nd mixture to the main mixing container through the 1st piping part and the 2nd piping part, respectively, the 1st mixture and the 2nd mixture were mixed. The content of metal components (Cr, Fe, and Ni) in the obtained mixture was measured by an ICP emission analyzer “ICPS-8100” (manufactured by Shimadzu Corporation). The results are shown in Table 1.
(実施例2)
実施例2では、試験用の設備を変更した以外は、実施例1と同様に混合物を製造した。実施例2で用いた試験用の設備では、水を含む混合物の接する部位の全部がフッ素系樹脂(商品名:テフロン)を用いて構成され、積層部が省略されている。得られた混合物中における金属成分の含有量を実施例1と同様に測定した。その結果を表1に示す。
(Example 2)
In Example 2, a mixture was produced in the same manner as in Example 1 except that the test equipment was changed. In the test equipment used in Example 2, all of the parts that come into contact with the mixture containing water are configured using a fluorine-based resin (trade name: Teflon), and the laminated portion is omitted. The content of the metal component in the obtained mixture was measured in the same manner as in Example 1. The results are shown in Table 1.
(実施例3)
実施例3では、試験用の設備を変更した以外は、実施例1と同様に混合物を製造した。実施例3で用いた試験用の設備では、水を含む混合物の接する部位の全部がポリプロピレン樹脂を用いて構成され、積層部が省略されている。得られた混合物中における金属成分の含有量を実施例1と同様に測定した。その結果を表1に示す。
(Example 3)
In Example 3, a mixture was produced in the same manner as in Example 1 except that the test equipment was changed. In the test equipment used in Example 3, all of the parts in contact with the mixture containing water are made of polypropylene resin, and the laminated part is omitted. The content of the metal component in the obtained mixture was measured in the same manner as in Example 1. The results are shown in Table 1.
(実施例4)
実施例4では、試験用の設備を変更した以外は、実施例1と同様に混合物を製造した。実施例4で用いた試験用の設備では、水を含む混合物の接する部位の全部がポリ塩化ビニル樹脂を用いて構成され、積層部が省略されている。得られた混合物中における金属成分の含有量を実施例1と同様に測定した。その結果を表1に示す。
(Example 4)
In Example 4, a mixture was produced in the same manner as in Example 1 except that the test equipment was changed. In the test equipment used in Example 4, all of the parts in contact with the mixture containing water are made of polyvinyl chloride resin, and the laminated part is omitted. The content of the metal component in the obtained mixture was measured in the same manner as in Example 1. The results are shown in Table 1.
Claims (3)
前記工程では、前記原料としての水の接する部位の一部又は全部に非金属材料を用いた設備を用いることを特徴とする研磨用組成物の製造方法。 A method for producing a polishing composition comprising a step of mixing raw materials,
In the step, a method for producing a polishing composition is characterized in that a facility using a non-metallic material is used for a part or all of a portion in contact with water as the raw material.
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