JP2014044946A - 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 - Google Patents
異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 Download PDFInfo
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- JP2014044946A JP2014044946A JP2013160116A JP2013160116A JP2014044946A JP 2014044946 A JP2014044946 A JP 2014044946A JP 2013160116 A JP2013160116 A JP 2013160116A JP 2013160116 A JP2013160116 A JP 2013160116A JP 2014044946 A JP2014044946 A JP 2014044946A
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Abstract
【解決手段】導電性粒子3を含有する異方性導電フィルム1の製造方法において、同方向に連続した複数の溝10が形成されたシート2の溝10に、導電性粒子3を埋め込み、導電性粒子3を配列し、溝10が形成された側のシート2表面に、延伸可能なベースフィルム6上に熱硬化性樹脂層5が形成された第1の樹脂フィルム4をラミネートして導電性粒子3を転着させ、第1の樹脂フィルム4を、導電性粒子3の配列方向と直交する方向を除く方向に1軸延伸し、第2の樹脂フィルム7をラミネートする。第1の樹脂フィルムを導電性粒子の配列方向と直交する方向を除く方向に1軸延伸する際に、少なくとも第1の樹脂フィルムの元の長さの1.5倍より長く1軸延伸する。
【選択図】図2
Description
同方向に連続した複数の溝が形成されたシート2は、図3に示すように、例えば所定の溝10が形成された樹脂シートであり、例えばペレットを溶融させた状態で溝パターンが形成された金型に流し込み、冷やして固めることで所定の溝10を転写させる方法により形成することができる。あるいは、シート2は、溝パターンが形成された金型を樹脂シートの軟化点以上の温度に加熱し、当該金型に樹脂シートを押し付けることで転写する方法により形成することができる。
導電性粒子3としては、異方性導電フィルムにおいて使用されている公知の何れの導電性粒子を挙げることができる。導電性粒子3としては、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いは、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。樹脂粒子の表面に金属をコートしたものである場合、樹脂粒子としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン(AS)樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。
溝10に導電性粒子3が充填、配列されたシート2にラミネートされる第1の樹脂フィルム4は、延伸可能なベースフィルム6上に光又は熱硬化性の樹脂層5が形成された熱硬化型あるいは紫外線硬化型の接着フィルムである。第1の樹脂フィルム4は、シート2にラミネートされることにより、溝10のパターンに配列された導電性粒子3が転着され、異方性導電フィルム1を構成する。
また、導電性粒子3が転着された第1の樹脂フィルム4にラミネートされる第2の樹脂フィルム7も、第1の樹脂フィルム4と同様に、ベースフィルム9上に光又は熱硬化性の樹脂層8が形成された熱硬化型あるいは紫外線硬化型の接着フィルムである。第2の樹脂フィルム7の樹脂層8は第1の樹脂フィルム4の樹脂層5と同一のものを用いることができ、ベースフィルム9は第1の樹脂フィルム4のベースフィルム6と同一のものを用いることができる。第2の樹脂フィルム7は、導電性粒子3が転着された第1の樹脂フィルム4にラミネートされることにより、第1の樹脂フィルム4とともに異方性導電フィルム1を構成する。
次いで、異方性導電フィルム1の製造工程について説明する。
次に、本発明の一実施形態に係る異方性導電フィルムの構成について、図面を使用しながら説明する。図7は、本発明の一実施形態に係る異方性導電フィルムの部分斜視図であり、図8(a)は、図7のP−P断面図であり、図8(b)は、図7のQ−Q断面図であり、図9は、本発明の一実施形態に係る異方性導電フィルムの導電性粒子の配列状態を示す平面図である。
次に、本発明の一実施形態に係る接続構造体の構成について、図面を使用しながら説明する。図10は、本発明の一実施形態に係る異方性導電フィルムを適用した接続構造体の構成を示す概略断面図である。本発明の一実施形態に係る接続構造体50は、例えば、図10に示すように、前述した異方性導電フィルム1を介して、ICチップ等の電子部品52をフレキシブル配線基板や液晶パネル等の基板54上に電気的及び機械的に接続固定したものである。電子部品52には、接続端子としてバンプ56が形成されている。一方、基板54の上面には、バンプ56と対向する位置に電極58が形成されている。
4 第1の樹脂フィルム、5 第1の樹脂層、5a、5b 部位、5c、5d 断崖部、
6 ベースフィルム、7 第2の樹脂フィルム、8 第2の樹脂層、
9 ベースフィルム、10 溝、12 スキージ、13 傾斜面、14 凸部、
15 凹部、16 クリアランス、50 接続構造体、52 電子部品、54 基板、
56 バンプ、58 電極
Claims (11)
- 導電性粒子を含有する異方性導電フィルムの製造方法において、
同方向に連続した複数の溝が形成されたシートの上記溝に、導電性粒子を埋め込み、上記導電性粒子を配列し、
上記溝が形成された側の上記シート表面に、延伸可能なベースフィルム上に光又は熱硬化性の樹脂層が形成された第1の樹脂フィルムの上記樹脂層をラミネートし、
上記第1の樹脂フィルムの上記樹脂層に上記導電性粒子を転着させ、
上記導電性粒子が上記樹脂層に転着した上記第1の樹脂フィルムを、上記導電性粒子の配列方向と直交する方向を除く方向に1軸延伸し、
更に上記導電性粒子が配置された上記第1の樹脂フィルムの上記樹脂層に、ベースフィルム上に光又は熱硬化性の樹脂層が形成された第2の樹脂フィルムをラミネートする異方性導電フィルムの製造方法。 - 上記第1及び第2の樹脂フィルムの上記樹脂層は、エポキシ樹脂またはアクリル樹脂を主成分とする請求項1に記載の異方性導電フィルムの製造方法。
- 上記溝の幅が、上記導電性粒子の粒子径の1倍〜2.5倍未満であり、
上記溝の深さが、上記導電性粒子の粒子径の0.5〜2倍である請求項1又は請求項2に記載の異方性導電フィルムの製造方法。 - 上記溝の幅が、上記導電性粒子の粒子径の1倍〜2倍未満であり、
上記溝の深さが、上記導電性粒子の粒子径の0.5〜1.5倍である請求項1又は請求項2に記載の異方性導電フィルムの製造方法。 - 上記第1の樹脂フィルムを上記導電性粒子の配列方向と直交する方向を除く方向に1軸延伸する際に、少なくとも上記第1の樹脂フィルムの元の長さの1.5倍より長く1軸延伸する請求項1乃至請求項4のいずれか1項に記載の異方性導電フィルムの製造方法。
- 少なくとも2層構成よりなる異方導電性フィルムであって、
一の層を構成する第1の樹脂層と、
上記第1の樹脂層にラミネートされた第2の樹脂層と、
上記第1の樹脂層と上記第2の樹脂層のうち、少なくとも上記第1の樹脂層に接した複数の導電性粒子とを備え、
上記導電性粒子は、上記第1の樹脂層において第1の方向に規則的に配列して形成した粒子列が上記第1の方向と異なる第2の方向に規則的に複数並列して設けられ、
上記第1の樹脂層は、上記第1の方向における上記導電性粒子の間の部位を上記第2の方向における上記導電性粒子の間の部位よりも薄く形成されている異方性導電フィルム。 - 上記第1の樹脂層は、上記第1の方向における上記導電性粒子の間にクリアランスが設けられる請求項6に記載の異方性導電フィルム。
- 上記第1の樹脂層は、上記粒子列の各列間が上記第1の方向に延在した凸部となっている請求項7に記載の異方性導電フィルム。
- 上記導電性粒子は、上記第1の樹脂層の上記第1の方向に延在するように形成された凹部内に配置される請求項7又は請求項8に記載の異方性導電フィルム。
- 上記導電性粒子は、上記凹部内で上記第1の方向に延在するように略直線状に配置される請求項9に記載の異方性導電フィルム。
- 電子部品の接続に、請求項6乃至10のいずれか1項に記載の異方導電性フィルムを用いた接続構造体。
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