JP2013197294A - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- JP2013197294A JP2013197294A JP2012062524A JP2012062524A JP2013197294A JP 2013197294 A JP2013197294 A JP 2013197294A JP 2012062524 A JP2012062524 A JP 2012062524A JP 2012062524 A JP2012062524 A JP 2012062524A JP 2013197294 A JP2013197294 A JP 2013197294A
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- 238000007789 sealing Methods 0.000 claims abstract description 72
- 239000004065 semiconductor Substances 0.000 claims abstract description 72
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 59
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
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- 230000005855 radiation Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】実施形態に係る照明装置は、基板上に実装された複数の半導体光源と、封止部と、を具備する。前記封止部は、前記半導体光源のそれぞれの上に設けられ、前記半導体光源から放射される一次光により励起される蛍光体を含有する波長変換部と、隣り合う任意の波長変換部の間に前記蛍光体を設けるか、又は、前記複数の半導体光源の上に設けられた前記波長変換部のうちの任意の波長変換部の形状又は特性を他の波長変換部とは異なるように設けることにより波長変換部から出射する光色を調整する光色調整部と、を含む。
【選択図】図1
Description
図1(a)は、第1実施形態に係る照明装置100を表す模式断面図である。同図に示すように、照明装置100は、例えば、電球形ランプであり、発光部110と、筐体3と、発光部110を覆うカバー5と、を備える。
図6は、第2実施形態に係る照明装置の発光部130を表す模式断面図である。発光部130は、基板60の上に実装された複数の半導体光源30と、半導体光源30を封止する封止部70と、を含む。封止部70は、個々の半導体光源30の上にポッティングされ、半導体光源30からの一次光により励起される蛍光体を含む。本実施形態では、隣り合う封止部70は、相互に離間して設けられる。また、本実施形態における波長変換部は、封止部70の全体である。
Claims (7)
- 基板上に実装された複数の半導体光源と;
前記半導体光源のそれぞれの上に設けられ、前記半導体光源から放射される一次光により励起される蛍光体を含有する波長変換部と、隣り合う任意の波長変換部の間に前記蛍光体を設けるか、又は、前記複数の半導体光源の上に設けられた前記波長変換部のうちの任意の波長変換部の形状又は特性を他の波長変換部とは異なるように設けることにより波長変換部から出射する光色を調整する光色調整部と、を含む封止部と;
を具備することを特徴とする照明装置。 - 前記波長変換部の高さを前記半導体光源の配列ピッチで除した比は、0.2以上、1.0以下であることを特徴とする請求項1記載の照明装置。
- 前記光色調整部は、前記波長変換部の配列、形状、蛍光体の量、および、蛍光体の組成の少なくともいずれか1つにおいて、不規則な部分を設けることによって構成されることを特徴とする請求項1または2記載の照明装置。
- 前記封止部における前記波長変換部の前記基板に対して垂直な断面は、ドーム形状であることを特徴とする請求項1〜3のいずれか1つに記載の照明装置。
- 前記光色調整部は、前記半導体光源の平面配置における対角線上に設けられたことを特徴とする請求項1〜4のいずれか1つに記載の照明装置。
- 前記光色調整部は、前記半導体光源の平面配置における中央部に設けられたことを特徴とする請求項1〜5のいずれか1つに記載の照明装置。
- 前記光色調整部は、前記蛍光体の含有量が少ない波長変換部で形成されており、この光色調整部が前記半導体光源の平面配置における周辺部に設けられたことを特徴とする請求項1〜6のいずれか1つに記載の照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012062524A JP2013197294A (ja) | 2012-03-19 | 2012-03-19 | 照明装置 |
EP12173785.2A EP2642175A1 (en) | 2012-03-19 | 2012-06-27 | Luminaire and manufacturing method of the same |
US13/536,251 US20130241393A1 (en) | 2012-03-19 | 2012-06-28 | Luminaire and manufacturing method of the same |
CN2012102229656A CN103325928A (zh) | 2012-03-19 | 2012-06-28 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012062524A JP2013197294A (ja) | 2012-03-19 | 2012-03-19 | 照明装置 |
Publications (1)
Publication Number | Publication Date |
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JP2013197294A true JP2013197294A (ja) | 2013-09-30 |
Family
ID=46419939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012062524A Pending JP2013197294A (ja) | 2012-03-19 | 2012-03-19 | 照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130241393A1 (ja) |
EP (1) | EP2642175A1 (ja) |
JP (1) | JP2013197294A (ja) |
CN (1) | CN103325928A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2016143261A1 (ja) * | 2015-03-11 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 発光装置、発光装置の製造方法 |
JP2018068608A (ja) * | 2016-10-28 | 2018-05-10 | コニカミノルタ株式会社 | 超音波探触子およびその製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2505214A (en) * | 2012-08-23 | 2014-02-26 | Thorpe F W Plc | Luminaire |
US8845380B2 (en) * | 2012-12-17 | 2014-09-30 | Xicato, Inc. | Automated color tuning of an LED based illumination device |
US8870617B2 (en) | 2013-01-03 | 2014-10-28 | Xicato, Inc. | Color tuning of a multi-color LED based illumination device |
DE102013110320B3 (de) * | 2013-09-19 | 2014-09-25 | AEMtec GmbH, Berlin | Sensorvorrichtung zur Überwachung eines Schmierstoffzustands sowie Verfahren zur Fertigung der Sensorvorrichtung |
JP6233750B2 (ja) * | 2014-03-14 | 2017-11-22 | パナソニックIpマネジメント株式会社 | 発光装置およびその製造方法、照明用光源、並びに照明装置 |
JP6288061B2 (ja) * | 2015-12-10 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR102634692B1 (ko) | 2016-02-12 | 2024-02-08 | 삼성전자주식회사 | 반도체 발광 소자 패키지 |
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JP2008235824A (ja) * | 2007-03-23 | 2008-10-02 | Sharp Corp | 発光装置およびその製造方法 |
JP2009259868A (ja) * | 2008-04-11 | 2009-11-05 | Sharp Corp | 発光装置の色度調整方法および製造方法 |
WO2009141982A1 (ja) * | 2008-05-19 | 2009-11-26 | 株式会社 東芝 | 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置 |
JP2010147318A (ja) * | 2008-12-19 | 2010-07-01 | Stanley Electric Co Ltd | 半導体発光装置及び駆動方法 |
JP2012004412A (ja) * | 2010-06-18 | 2012-01-05 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2013165214A (ja) * | 2012-02-13 | 2013-08-22 | Panasonic Corp | 発光装置および照明器具 |
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TWI419375B (zh) * | 2005-02-18 | 2013-12-11 | Nichia Corp | 具備控制配光特性用之透鏡之發光裝置 |
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JP2009302339A (ja) * | 2008-06-13 | 2009-12-24 | Sanken Electric Co Ltd | 半導体発光装置 |
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2012
- 2012-03-19 JP JP2012062524A patent/JP2013197294A/ja active Pending
- 2012-06-27 EP EP12173785.2A patent/EP2642175A1/en not_active Withdrawn
- 2012-06-28 CN CN2012102229656A patent/CN103325928A/zh active Pending
- 2012-06-28 US US13/536,251 patent/US20130241393A1/en not_active Abandoned
Patent Citations (6)
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JP2008235824A (ja) * | 2007-03-23 | 2008-10-02 | Sharp Corp | 発光装置およびその製造方法 |
JP2009259868A (ja) * | 2008-04-11 | 2009-11-05 | Sharp Corp | 発光装置の色度調整方法および製造方法 |
WO2009141982A1 (ja) * | 2008-05-19 | 2009-11-26 | 株式会社 東芝 | 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置 |
JP2010147318A (ja) * | 2008-12-19 | 2010-07-01 | Stanley Electric Co Ltd | 半導体発光装置及び駆動方法 |
JP2012004412A (ja) * | 2010-06-18 | 2012-01-05 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2013165214A (ja) * | 2012-02-13 | 2013-08-22 | Panasonic Corp | 発光装置および照明器具 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2016143261A1 (ja) * | 2015-03-11 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 発光装置、発光装置の製造方法 |
JP2018068608A (ja) * | 2016-10-28 | 2018-05-10 | コニカミノルタ株式会社 | 超音波探触子およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130241393A1 (en) | 2013-09-19 |
EP2642175A1 (en) | 2013-09-25 |
CN103325928A (zh) | 2013-09-25 |
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