JP2013183105A - Circuit board and manufacturing method of the same - Google Patents

Circuit board and manufacturing method of the same Download PDF

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Publication number
JP2013183105A
JP2013183105A JP2012047221A JP2012047221A JP2013183105A JP 2013183105 A JP2013183105 A JP 2013183105A JP 2012047221 A JP2012047221 A JP 2012047221A JP 2012047221 A JP2012047221 A JP 2012047221A JP 2013183105 A JP2013183105 A JP 2013183105A
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circuit pattern
upper electrode
jig
horizontal
circuit board
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JP5673584B2 (en
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Munehiko Masutani
宗彦 増谷
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Toyota Industries Corp
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Toyota Industries Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board in which an upper electrode is stably bonded on a top face of a circuit pattern, and provide a manufacturing method of the circuit board.SOLUTION: A circuit board comprises: a circuit pattern 22; and an upper electrode 30 bonded on a top face of the circuit pattern 22 by a bonding material 40. The upper electrode 30 includes: a horizontal part 36 which extends along the top face of the circuit pattern 22 and serves as a part bonded with the top face of the circuit pattern 22 by the bonding material; a standing part 34 for external connection; and horizontal parts 31, 33 and vertical parts 32, 35 which serve as a jig receiving for receiving a jig.

Description

本発明は、回路基板およびその製造方法に関するものである。   The present invention relates to a circuit board and a manufacturing method thereof.

特許文献１に開示の電力半導体装置においては、炭化シリコンを基体として用いる電力半導体素子が搭載されたユニットと、ユニットのパッケージ部より熱伝導率が低い材質からなり、ユニットを被う外側パッケージを備え、ユニットと外部機器とを接続する電極は、ユニットから外部機器へ伝達される熱を外部へ放熱する拡張部分を有する。   The power semiconductor device disclosed in Patent Document 1 includes a unit on which a power semiconductor element using silicon carbide as a base is mounted, and an outer package that is made of a material having a lower thermal conductivity than the unit package and covers the unit. The electrode connecting the unit and the external device has an extended portion that radiates heat transferred from the unit to the external device to the outside.

特許第４２６２４５３号公報Japanese Patent No. 4262453

ところで、回路基板を製造する際に、回路パターンの上面に接合する上部電極を安定して配置する手段がなく、回路パターンの上に離間して上部電極を配置してその間に接合材を配する必要がある。   By the way, when manufacturing a circuit board, there is no means for stably arranging the upper electrode to be bonded to the upper surface of the circuit pattern, and the upper electrode is spaced apart on the circuit pattern and the bonding material is arranged therebetween. There is a need.

本発明の目的は、回路パターンの上面に上部電極を安定して接合することができる回路基板およびその製造方法を提供することにある。   An object of the present invention is to provide a circuit board capable of stably bonding an upper electrode to an upper surface of a circuit pattern, and a method for manufacturing the circuit board.

請求項１に記載の発明では、回路パターンと、前記回路パターンの上面に接合材により接合された上部電極と、を備えた回路基板であって、前記上部電極は、前記回路パターンの上面に沿って延び前記回路パターンの上面と接合材により接合される部位と、外部接続用の立設部とを有するとともに、治具を受ける治具受部を具備してなることを要旨とする。   The invention according to claim 1 is a circuit board comprising a circuit pattern and an upper electrode bonded to the upper surface of the circuit pattern by a bonding material, the upper electrode extending along the upper surface of the circuit pattern. The gist of the present invention is to have a jig receiving portion that receives a jig and has a portion that extends and is joined to the upper surface of the circuit pattern by a bonding material and a standing portion for external connection.

これにより、上部電極は、回路パターンの上面に沿って延び回路パターンの上面と接合材により接合される部位と、外部接続用の立設部とを有するとともに、治具を受ける治具受部を具備しており、上部電極での治具受部を用いて治具を受けることができる。これにより、回路パターンと上部電極との間に接合材を容易に配置することができる。その結果、回路パターンの上面に上部電極を安定して接合することができる。   Thus, the upper electrode extends along the upper surface of the circuit pattern, has a portion bonded to the upper surface of the circuit pattern by the bonding material, and a standing portion for external connection, and a jig receiving portion for receiving the jig. And a jig can be received using a jig receiving portion on the upper electrode. Thereby, a bonding material can be easily disposed between the circuit pattern and the upper electrode. As a result, the upper electrode can be stably bonded to the upper surface of the circuit pattern.

請求項２に記載のように、請求項１に記載の回路基板において、前記上部電極は、前記回路パターンと接触する接触部を有するとよい。この場合、上部電極は回路パターンと接触しているので上下方向の位置決めができる。   As described in claim 2, in the circuit board according to claim 1, the upper electrode may have a contact portion that contacts the circuit pattern. In this case, since the upper electrode is in contact with the circuit pattern, it can be positioned in the vertical direction.

請求項３に記載のように、請求項１または２に記載の回路基板において、前記上部電極は、前記治具に対する位置決め部を有するとよい。
請求項４に記載の発明では、回路パターンの上に、外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて前記上部電極における前記回路パターンの上面に沿って延び前記回路パターンの上面と接合される部位と前記回路パターンの上面とを空隙を介して対向配置させる第１の工程と、前記上部電極における前記回路パターンの上面と接合される部位と前記回路パターンの上面との空隙に接合材を注入して前記回路パターンと前記上部電極とを接合する第２の工程と、を有することを要旨とする。 As described in claim 3, in the circuit board according to claim 1 or 2, the upper electrode may have a positioning portion for the jig.
According to a fourth aspect of the present invention, a jig receiving portion for receiving a jig in an upper electrode having a standing portion for external connection is received by the jig on the circuit pattern, and the upper surface of the circuit pattern in the upper electrode. A first step of extending along the upper surface of the circuit pattern and a portion of the upper surface of the circuit pattern and the upper surface of the circuit pattern facing each other through a gap; and a portion of the upper electrode bonded to the upper surface of the circuit pattern And a second step of bonding the circuit pattern and the upper electrode by injecting a bonding material into the gap with the upper surface of the circuit pattern.

請求項４に記載の発明によれば、第１の工程において、回路パターンの上に、外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて上部電極における回路パターンの上面に沿って延び回路パターンの上面と接合される部位と回路パターンの上面とが空隙を介して対向配置される。第２の工程において、上部電極における回路パターンの上面と接合される部位と回路パターンの上面との空隙に接合材が注入されて回路パターンと上部電極とが接合される。   According to the invention described in claim 4, in the first step, the jig receiving portion for receiving the jig in the upper electrode having the standing portion for external connection is received by the jig on the circuit pattern. A portion of the electrode that extends along the upper surface of the circuit pattern and is joined to the upper surface of the circuit pattern is opposed to the upper surface of the circuit pattern via a gap. In the second step, a bonding material is injected into a gap between a portion of the upper electrode to be bonded to the upper surface of the circuit pattern and the upper surface of the circuit pattern to bond the circuit pattern and the upper electrode.

これにより、請求項１に記載の回路基板が得られる。
請求項５に記載の発明では、回路パターンの上面に接合材を配置する第１の工程と、外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて前記上部電極における前記回路パターンの上面に沿って延び前記回路パターンの上面と接合される部位と前記回路パターンの上面とを前記接合材を介して対向配置させて前記回路パターンと前記上部電極とを前記接合材により接合する第２の工程と、を有することを要旨とする。 Thereby, the circuit board according to claim 1 is obtained.
According to the fifth aspect of the present invention, the first step of placing the bonding material on the upper surface of the circuit pattern and the jig receiving portion for receiving the jig in the upper electrode having the external connection standing portion are received by the jig. A portion of the upper electrode extending along the upper surface of the circuit pattern and bonded to the upper surface of the circuit pattern, and the upper surface of the circuit pattern are arranged to face each other with the bonding material interposed therebetween. And a second step of joining together with the joining material.

請求項５に記載の発明によれば、第１の工程において、回路パターンの上面に接合材が配置される。第２の工程において、外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて上部電極における回路パターンの上面に沿って延び回路パターンの上面と接合される部位と回路パターンの上面とが接合材を介して対向配置されて回路パターンと上部電極とが接合材により接合される。   According to the invention described in claim 5, in the first step, the bonding material is arranged on the upper surface of the circuit pattern. In the second step, a jig receiving portion for receiving a jig in the upper electrode having a standing portion for external connection is received by the jig and is extended along the upper surface of the circuit pattern in the upper electrode and bonded to the upper surface of the circuit pattern. The circuit pattern and the upper surface of the circuit pattern are opposed to each other via a bonding material, and the circuit pattern and the upper electrode are bonded by the bonding material.

これにより、請求項１に記載の回路基板が得られる。   Thereby, the circuit board according to claim 1 is obtained.

本発明によれば、回路パターンの上面に上部電極を安定して接合することができる。   According to the present invention, the upper electrode can be stably bonded to the upper surface of the circuit pattern.

（ａ）は実施形態における回路基板の平面図、（ｂ）は（ａ）のＡ−Ａ線での縦断面図、（ｃ）は回路基板の右側面図。(A) is a top view of the circuit board in embodiment, (b) is a longitudinal cross-sectional view in the AA line of (a), (c) is a right view of a circuit board. ケース内に収納した状態での回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board in the state accommodated in the case. （ａ）は上部電極の平面図、（ｂ）は上部電極の正面図、（ｃ）は上部電極の右側面図。(A) is a top view of an upper electrode, (b) is a front view of an upper electrode, (c) is a right side view of the upper electrode. （ａ）は接合前の回路基板の平面図、（ｂ）は（ａ）のＡ−Ａ線での縦断面図、（ｃ）は回路基板の右側面図。(A) is a top view of the circuit board before joining, (b) is a longitudinal cross-sectional view in the AA line of (a), (c) is a right view of a circuit board. 別例の回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board of another example. （ａ）は別例の回路基板の平面図、（ｂ）は（ａ）のＡ−Ａ線での縦断面図、（ｃ）は回路基板の右側面図。(A) is a top view of the circuit board of another example, (b) is a longitudinal cross-sectional view in the AA line of (a), (c) is a right view of a circuit board. 別例の回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board of another example. 別例の回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board of another example. 別例の回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board of another example. 別例の回路基板の縦断面図。The longitudinal cross-sectional view of the circuit board of another example. （ａ）は別例の回路基板の平面図、（ｂ）は（ａ）のＡ−Ａ線での縦断面図、（ｃ）は（ａ）のＢ−Ｂ線での縦断面図。(A) is a top view of the circuit board of another example, (b) is a longitudinal cross-sectional view in the AA line of (a), (c) is a longitudinal cross-sectional view in the BB line of (a). （ａ）は別例の回路基板の平面図、（ｂ）は（ａ）のＡ−Ａ線での縦断面図、（ｃ）は（ａ）のＢ−Ｂ線での縦断面図。(A) is a top view of the circuit board of another example, (b) is a longitudinal cross-sectional view in the AA line of (a), (c) is a longitudinal cross-sectional view in the BB line of (a). （ａ）は別例の上部電極の正面図、（ｂ）は別例の回路基板の接合前での縦断面図。(A) is a front view of the upper electrode of another example, (b) is a longitudinal cross-sectional view before joining of the circuit board of another example. （ａ）は別例の上部電極の正面図、（ｂ）は別例の回路基板の接合前での縦断面図。(A) is a front view of the upper electrode of another example, (b) is a longitudinal cross-sectional view before joining of the circuit board of another example. （ａ）は別例の上部電極の正面図、（ｂ）は別例の回路基板の接合前での縦断面図。(A) is a front view of the upper electrode of another example, (b) is a longitudinal cross-sectional view before joining of the circuit board of another example.

以下、本発明を具体化した一実施形態を図面に従って説明する。
なお、図面において、水平面を、直交するＸ，Ｙ方向で規定するとともに、上下方向をＺ方向で規定している。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
In the drawings, the horizontal plane is defined by the orthogonal X and Y directions, and the vertical direction is defined by the Z direction.

図１に示すように、回路基板１０は、パターン付セラミック基板２０と上部電極３０と接合材４０とを備えている。パターン付セラミック基板２０はセラミック基板（絶縁基板）２１の上面に回路パターン（導体パターン）２２が形成されている。パターン付セラミック基板２０の回路パターン２２には半導体素子５０が実装される。   As shown in FIG. 1, the circuit board 10 includes a patterned ceramic substrate 20, an upper electrode 30, and a bonding material 40. The patterned ceramic substrate 20 has a circuit pattern (conductor pattern) 22 formed on the upper surface of a ceramic substrate (insulating substrate) 21. A semiconductor element 50 is mounted on the circuit pattern 22 of the patterned ceramic substrate 20.

上部電極３０は、回路パターン２２上に配置される。接合材４０によりパターン付セラミック基板２０の回路パターン２２の上面に上部電極３０が接合される。
回路基板１０は、図２に示すように、ケース６０の内部に収納される。ケース６０の内部にはポッティング材としての樹脂６１が充填される。 The upper electrode 30 is disposed on the circuit pattern 22. The upper electrode 30 is bonded to the upper surface of the circuit pattern 22 of the patterned ceramic substrate 20 by the bonding material 40.
As shown in FIG. 2, the circuit board 10 is accommodated in the case 60. The case 60 is filled with a resin 61 as a potting material.

回路基板１０の上部電極３０は、図３に示すように、一定幅の１枚の帯板を屈曲形成することにより形成されている。上部電極３０は、水平部３１と、垂直部３２と、水平部３３と、立設部３４と、垂直部３５と、水平部３６を有する。水平部３１がパターン付セラミック基板２０に載置され、垂直部３２が水平部３１の左端から上方に延びている。水平部３３が垂直部３２の上端から左側に水平に延び、立設部３４が水平部３３の左端から上方に延びている。垂直部３５が水平部３１の右端から上方に延び、水平部３６が垂直部３５の上端から右側に水平に延びている。   As shown in FIG. 3, the upper electrode 30 of the circuit board 10 is formed by bending a single strip having a constant width. The upper electrode 30 includes a horizontal part 31, a vertical part 32, a horizontal part 33, a standing part 34, a vertical part 35, and a horizontal part 36. The horizontal portion 31 is placed on the patterned ceramic substrate 20, and the vertical portion 32 extends upward from the left end of the horizontal portion 31. The horizontal portion 33 extends horizontally from the upper end of the vertical portion 32 to the left side, and the standing portion 34 extends upward from the left end of the horizontal portion 33. The vertical portion 35 extends upward from the right end of the horizontal portion 31, and the horizontal portion 36 extends horizontally from the upper end of the vertical portion 35 to the right side.

上部電極３０における水平部３６が回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位である。また、立設部３４が外部接続用の部位である。水平部３１，３３および垂直部３２，３５が、治具を受ける治具受部である。また、水平部３１が回路パターン２２と接触する接触部（接地部）である。   The horizontal portion 36 of the upper electrode 30 extends along the upper surface of the circuit pattern 22 and is a portion that is bonded to the upper surface of the circuit pattern 22 by a bonding material. Further, the standing portion 34 is a part for external connection. The horizontal portions 31 and 33 and the vertical portions 32 and 35 are jig receiving portions that receive the jig. Further, the horizontal portion 31 is a contact portion (grounding portion) that contacts the circuit pattern 22.

図３（ａ）に示すように、平面視において四角形状をなす水平部３１には円形の貫通孔３１ａが形成されている。また、平面視において四角形状をなす水平部３３にはＸ方向に延びる長孔３３ａが貫通する状態で形成されている。さらに、平面視において四角形状をなす水平部３６には円形の貫通孔３６ａが形成されている。上部電極３０の水平部３６の貫通孔３６ａを通して接合材としてのはんだが滴下されるようになっている。長孔３３ａと円形の貫通孔３１ａが治具に対する位置決め部である。   As shown in FIG. 3A, a circular through hole 31a is formed in the horizontal portion 31 having a quadrangular shape in plan view. Further, a long hole 33a extending in the X direction is formed through the horizontal portion 33 having a quadrangular shape in plan view. Further, a circular through hole 36a is formed in the horizontal portion 36 having a quadrangular shape in plan view. Solder as a bonding material is dropped through the through hole 36 a of the horizontal portion 36 of the upper electrode 30. The long hole 33a and the circular through hole 31a are positioning portions for the jig.

図４に示すように、はんだ付け装置の治具７０は、板部７１と、突起部７２，７３からなる。板部７１はＹ方向に延びる板状をなしている。板部７１の下面は、上部電極３０の水平部３１，３３の上面および垂直部３２による形状（段差形状）と当接する形状となっている。さらに、治具７０の板部７１の下面には突起部７２，７３が形成されている。突起部７２は上部電極３０の水平部３３の長孔３３ａに嵌入することができる。また、突起部７３は上部電極３０の水平部３１の円形の貫通孔３１ａに嵌入することができる。この治具７０の突起部７２，７３が上部電極３０に上から長孔３３ａおよび円形の貫通孔３１ａと嵌合して、上部電極３０を支えている。このとき、治具７０の板部７１の表面と上部電極３０の水平部３１，３３の上面と面接触する。   As shown in FIG. 4, the jig 70 of the soldering apparatus includes a plate portion 71 and projecting portions 72 and 73. The plate portion 71 has a plate shape extending in the Y direction. The lower surface of the plate portion 71 has a shape that abuts the shape (step shape) formed by the upper surfaces of the horizontal portions 31 and 33 and the vertical portion 32 of the upper electrode 30. Further, protrusions 72 and 73 are formed on the lower surface of the plate portion 71 of the jig 70. The protrusion 72 can be fitted into the long hole 33 a of the horizontal portion 33 of the upper electrode 30. Further, the protrusion 73 can be fitted into the circular through hole 31 a of the horizontal portion 31 of the upper electrode 30. The protrusions 72 and 73 of the jig 70 are fitted to the upper electrode 30 from above with the elongated hole 33a and the circular through hole 31a to support the upper electrode 30. At this time, the surface of the plate portion 71 of the jig 70 is in surface contact with the upper surfaces of the horizontal portions 31 and 33 of the upper electrode 30.

次に、回路基板の製造方法（組立て工程）について説明する。
まず、セラミック基板２１に回路パターン２２が形成されたパターン付セラミック基板２０を用意する。また、図３に示した上部電極３０を用意する。 Next, a circuit board manufacturing method (assembly process) will be described.
First, a patterned ceramic substrate 20 having a circuit pattern 22 formed on a ceramic substrate 21 is prepared. Moreover, the upper electrode 30 shown in FIG. 3 is prepared.

そして、図４に示すように、治具７０に上部電極３０をセットした状態で治具７０によって上部電極３０をパターン付セラミック基板２０にセットする。つまり、図３に示すように、上部電極３０に長孔３３ａおよび円形の貫通孔３１ａが設けられており、図４に示すように、治具７０で位置決めしつつ上部電極３０の水平部３６が回路パターン２２に対し空中配置される。即ち、上部電極３０の水平部３６と回路パターン２２との間に空隙Ｇ１が形成される。また、横方向（Ｘ，Ｙ方向）と縦方向（Ｚ方向）が決められる。   Then, as shown in FIG. 4, the upper electrode 30 is set on the patterned ceramic substrate 20 by the jig 70 while the upper electrode 30 is set on the jig 70. That is, as shown in FIG. 3, the upper electrode 30 is provided with a long hole 33a and a circular through hole 31a. As shown in FIG. 4, the horizontal portion 36 of the upper electrode 30 is positioned while being positioned by the jig 70. The circuit pattern 22 is disposed in the air. That is, a gap G 1 is formed between the horizontal portion 36 of the upper electrode 30 and the circuit pattern 22. Further, a horizontal direction (X, Y direction) and a vertical direction (Z direction) are determined.

このようにして、回路パターン２２の上に、上部電極３０における水平部３１，３３および垂直部３２，３５の形成箇所（段差がついた領域）を治具７０で押さえて上部電極３０の水平部３６と回路パターン２２の上面とを空隙Ｇ１を介して対向配置させる。   In this manner, the horizontal portions 31 and 33 and the vertical portions 32 and 35 of the upper electrode 30 are formed on the circuit pattern 22 by pressing the jigs 70 with the jig 70. 36 and the upper surface of the circuit pattern 22 are arranged to face each other through the gap G1.

そして、離間している部分（空隙Ｇ１）に接合材（はんだ）４０を充填・凝固する。つまり、上部電極３０の水平部３６と回路パターン２２の上面との空隙Ｇ１に接合材４０を注入して回路パターン２２と上部電極３０とを接合する。   Then, the bonding material (solder) 40 is filled and solidified in the separated portion (gap G1). That is, the bonding material 40 is injected into the gap G <b> 1 between the horizontal portion 36 of the upper electrode 30 and the upper surface of the circuit pattern 22 to bond the circuit pattern 22 and the upper electrode 30.

その後、治具７０を取り外す。これにより、図１に示した回路基板１０が得られる。
このようにして、パターン付セラミック基板２０の上に配置する上部電極３０の横方向と縦方向の位置を決められるように上部電極３０に長孔３３ａおよび円形の貫通孔３１ａが設けられており、その部分を利用して上部電極３０を支える治具７０が設置され、上部電極３０の接合部（水平部３６）を空中配置できる。 Thereafter, the jig 70 is removed. Thereby, the circuit board 10 shown in FIG. 1 is obtained.
In this way, the upper electrode 30 is provided with the long holes 33a and the circular through holes 31a so that the positions of the upper electrode 30 arranged on the patterned ceramic substrate 20 in the horizontal direction and the vertical direction can be determined. A jig 70 for supporting the upper electrode 30 is installed using the portion, and the joint portion (horizontal portion 36) of the upper electrode 30 can be disposed in the air.

次に、回路基板１０の作用について説明する。
図２において、回路基板１０がケース６０の内部に収納され、ケース６０の内部には樹脂６１が充填されている。樹脂６１から上部電極３０の上端部が出ている（露出している）。 Next, the operation of the circuit board 10 will be described.
In FIG. 2, the circuit board 10 is accommodated in a case 60, and the case 60 is filled with a resin 61. The upper end portion of the upper electrode 30 protrudes from the resin 61 (exposed).

そして、上部電極３０における樹脂６１から外部に露出した部分と外部機器とを接続する。このとき、回路基板１０の回路パターン２２および接合材（はんだ）４０は樹脂６１にて封止されており、水分等から保護される。   And the part exposed to the exterior from the resin 61 in the upper electrode 30 and an external apparatus are connected. At this time, the circuit pattern 22 and the bonding material (solder) 40 of the circuit board 10 are sealed with the resin 61 and are protected from moisture and the like.

一般的に、回路基板の上に外部機器との接続用電極板を配置する際、電極板はＬ字状をなし、立設部が外部機器との接続部となっている。そして、Ｌ字状の上部電極で上部に直接取り出すことができる。また、ポッティング材を流し込み固める方法においては、上部電極を横（水平方向）に取り出すことは難しい。さらに、滴下はんだ方法や導電性接着剤を後から封入する方法において、接合材を後から入れるときは上部電極の接合部を回路パターンに対し空隙を介して空中に配置しておく必要があるが、浮いた状態で上部電極を保持することが難しい。   Generally, when an electrode plate for connection with an external device is arranged on a circuit board, the electrode plate is L-shaped, and the standing portion is a connection portion with the external device. And it can take out directly to upper part with an L-shaped upper electrode. Further, in the method of pouring and hardening the potting material, it is difficult to take out the upper electrode sideways (horizontal direction). Furthermore, in the soldering method or the method of encapsulating the conductive adhesive later, it is necessary to place the joint of the upper electrode in the air via a gap with respect to the circuit pattern when inserting the joining material later. It is difficult to hold the upper electrode in a floating state.

本実施形態では、上部電極３０の接合部（水平部３６）を空中配置したまま接合できるので、接合後の上部電極３０はパターン付セラミック基板２０から直上へ配線することが可能となる。つまり、滴下はんだ方法や導電性接着剤を後から封入することを想定した場合に有用である。   In the present embodiment, since the joining portion (horizontal portion 36) of the upper electrode 30 can be joined in the air, the joined upper electrode 30 can be wired directly from the patterned ceramic substrate 20. That is, it is useful when it is assumed that a dripping solder method or a conductive adhesive is encapsulated later.

また、本実施形態の上部電極３０は立設部３４を有し、上部に電極を取り出すことができる構造となっている。さらに、本実施形態の上部電極３０は水平部３６がパターン付セラミック基板の回路パターン２２に接触する部分となっている。さらに、離間した部位での２つの位置決め用孔３１ａ，３３ａ、あるいは、長孔３３ａにより、横方向（Ｘ，Ｙ方向）の位置決めができる構造となっている。このような構造の上部電極３０に対し治具７０で上部電極３０の水平部３１，３３および垂直部３２，３５付近を押さえるとともに横方向の位置を決める。そして、接合材４０を注入して接合材４０により上部電極３０を回路パターン２２に接合した後に治具７０を取り外す。その結果、パターン付セラミック基板２０から上方向に電極を取り出すことが可能となり、設計の自由度が大きくなる。   Further, the upper electrode 30 of the present embodiment has a standing portion 34 and has a structure in which the electrode can be taken out from the upper portion. Furthermore, the upper electrode 30 of the present embodiment is a portion where the horizontal portion 36 contacts the circuit pattern 22 of the patterned ceramic substrate. Further, the structure is such that the positioning in the lateral direction (X, Y direction) can be performed by the two positioning holes 31a, 33a or the long holes 33a in the separated portions. The upper electrode 30 having such a structure is pressed by the jig 70 near the horizontal portions 31 and 33 and the vertical portions 32 and 35 of the upper electrode 30, and the lateral position is determined. Then, the jig 70 is removed after the bonding material 40 is injected and the upper electrode 30 is bonded to the circuit pattern 22 by the bonding material 40. As a result, it becomes possible to take out the electrode from the patterned ceramic substrate 20 upward, and the degree of freedom in design increases.

以上のごとく本実施形態によれば、以下のような効果を得ることができる。
（１）回路基板１０の構造として、回路パターン２２と、回路パターン２２の上面に接合材４０により接合された上部電極３０と、を備える。上部電極３０は、回路パターン２２の上面に沿って延び回路パターン２２の上面と接合材により接合される部位としての水平部３６と、外部接続用の立設部３４とを有するとともに、治具７０を受ける治具受部としての水平部３１，３３および垂直部３２，３５を具備している。よって、上部電極３０での治具受部としての水平部３１，３３および垂直部３２，３５を用いて治具７０を受けることができる。これにより、回路パターン２２と上部電極３０との間に接合材４０を容易に配置することができる。その結果、回路パターン２２の上面に上部電極３０を安定して接合することができる。 As described above, according to the present embodiment, the following effects can be obtained.
(1) As a structure of the circuit board 10, a circuit pattern 22 and an upper electrode 30 bonded to the upper surface of the circuit pattern 22 by a bonding material 40 are provided. The upper electrode 30 extends along the upper surface of the circuit pattern 22, has a horizontal portion 36 as a portion joined to the upper surface of the circuit pattern 22 by a bonding material, and a standing portion 34 for external connection, and a jig 70. The horizontal parts 31 and 33 and the vertical parts 32 and 35 as a jig | tool receiving part which receives are comprised. Therefore, the jig 70 can be received using the horizontal parts 31 and 33 and the vertical parts 32 and 35 as jig receiving parts in the upper electrode 30. Thereby, the bonding material 40 can be easily disposed between the circuit pattern 22 and the upper electrode 30. As a result, the upper electrode 30 can be stably bonded to the upper surface of the circuit pattern 22.

（２）上部電極３０は、回路パターン２２と接触する接触部としての水平部３１を有する。よって、上部電極３０は回路パターン２２と接触しているので上下方向の位置決めができる。つまり、上下方向（Ｚ方向）の位置決めが容易である。詳しくは、図４（ｂ）において隙間δに示すように上部電極３０における水平部３６と回路パターン２２との距離（公差）を一定にでき、接合材（はんだ）４０を一定量配置することができる。   (2) The upper electrode 30 has a horizontal portion 31 as a contact portion in contact with the circuit pattern 22. Therefore, since the upper electrode 30 is in contact with the circuit pattern 22, it can be positioned in the vertical direction. That is, positioning in the vertical direction (Z direction) is easy. Specifically, as shown by a gap δ in FIG. 4B, the distance (tolerance) between the horizontal portion 36 and the circuit pattern 22 in the upper electrode 30 can be made constant, and a certain amount of the bonding material (solder) 40 can be arranged. it can.

（３）上部電極３０は、治具７０に対する位置決め部としての長孔３３ａと円形の貫通孔３１ａを有するので、水平方向（Ｘ，Ｙ方向）の位置決めが容易である。
（４）回路基板の製造方法として、第１の工程と第２の工程とを有する。第１の工程では、回路パターン２２の上に、外部接続用の立設部３４を有する上部電極３０における治具７０を受ける治具受部としての水平部３１，３３および垂直部３２，３５を治具７０で受けて上部電極３０における回路パターン２２の上面に沿って延び回路パターン２２の上面と接合される部位としての水平部３６と回路パターン２２の上面とを空隙Ｇ１を介して対向配置させる。第２の工程では、上部電極３０における回路パターン２２の上面と接合される部位としての水平部３６と回路パターン２２の上面との空隙Ｇ１に接合材４０を注入して回路パターン２２と上部電極３０とを接合する。これにより、（１）の回路基板１０が得られる。 (3) Since the upper electrode 30 has the long hole 33a and the circular through hole 31a as positioning portions for the jig 70, positioning in the horizontal direction (X, Y direction) is easy.
(4) The circuit board manufacturing method includes a first step and a second step. In the first step, horizontal portions 31 and 33 and vertical portions 32 and 35 as jig receiving portions that receive the jig 70 in the upper electrode 30 having the standing portion 34 for external connection are formed on the circuit pattern 22. The horizontal portion 36 that extends along the upper surface of the circuit pattern 22 in the upper electrode 30 and is joined to the upper surface of the circuit pattern 22 and the upper surface of the circuit pattern 22 are opposed to each other via the gap G1. . In the second step, the bonding material 40 is injected into the gap G1 between the horizontal portion 36 as a portion to be bonded to the upper surface of the circuit pattern 22 in the upper electrode 30 and the upper surface of the circuit pattern 22, and the circuit pattern 22 and the upper electrode 30 are then injected. And join. Thereby, the circuit board 10 of (1) is obtained.

実施形態は前記に限定されるものではなく、例えば、次のように具体化してもよい。
・上述したように上部電極を配置してから接合材（はんだ等）を入れる場合について説明したが、これに代わり、接合材（溶融はんだ等）を置いてから上部電極を配置する場合でもよい。つまり、上記（４）に代わり回路基板の製造方法として、次の第１の工程と第２の工程を有する。第１の工程では、回路パターン２２の上面に接合材４０を配置する。第２の工程では、外部接続用の立設部３４を有する上部電極３０における治具７０を受ける治具受部としての水平部３１，３３および垂直部３２，３５を治具７０で受けて上部電極３０における回路パターン２２の上面に沿って延び回路パターン２２の上面と接合される部位としての水平部３６と回路パターン２２の上面とを接合材４０を介して対向配置させて回路パターン２２と上部電極３０とを接合材４０により接合する。 The embodiment is not limited to the above, and may be embodied as follows, for example.
As described above, the case where the bonding material (solder or the like) is inserted after the upper electrode is disposed has been described. Alternatively, the upper electrode may be disposed after the bonding material (molten solder or the like) is disposed. In other words, instead of the above (4), the circuit board manufacturing method includes the following first step and second step. In the first step, the bonding material 40 is disposed on the upper surface of the circuit pattern 22. In the second step, the horizontal portions 31 and 33 and the vertical portions 32 and 35 as jig receiving portions for receiving the jig 70 in the upper electrode 30 having the externally connected standing portion 34 are received by the jig 70 and the upper portion is received. The electrode 30 extends along the upper surface of the circuit pattern 22, the horizontal portion 36 as a portion to be bonded to the upper surface of the circuit pattern 22 and the upper surface of the circuit pattern 22 are arranged to face each other with a bonding material 40 therebetween, and the upper portion of the circuit pattern 22. The electrode 30 is bonded with the bonding material 40.

・図５に示すように、パターン付セラミック基板２０が接合される放熱板８０に、治具７０の取付部（位置決め部）が設けられていてもよい。この場合、治具７０の素材は電気伝導性がある素材や絶縁性の素材でもよい。また、治具７０が絶縁性の素材の場合、治具７０を除去せずに搭載したままでもよい。   As shown in FIG. 5, an attachment portion (positioning portion) for the jig 70 may be provided on the heat radiating plate 80 to which the patterned ceramic substrate 20 is bonded. In this case, the material of the jig 70 may be an electrically conductive material or an insulating material. Further, when the jig 70 is an insulating material, the jig 70 may be mounted without being removed.

・図１に代わり図６に示す構成としてもよい。図６において、上部電極３０は、パターン付セラミック基板２０に接触する水平部３１と、水平部３１の左端から上方に延びる垂直部３５と、垂直部３５の上端から左側に水平に延びる水平部３６と、水平部３６の左端から上方に延びる立設部３４とを有する。平面視において四角形状をなす水平部３１にはＸ方向に延びる長孔３１ｂが貫通する状態で形成されている。長孔３１ｂに治具７０の突起７５が嵌合して長孔３１ｂが、横方向位置決め部分となっている。平面視において四角形状をなす水平部３６には円形の貫通孔３６ａが形成されている。水平部３６の貫通孔３６ａを通して接合材４０としてのはんだが滴下される。   -It is good also as a structure shown in FIG. 6 instead of FIG. In FIG. 6, the upper electrode 30 includes a horizontal portion 31 that contacts the patterned ceramic substrate 20, a vertical portion 35 that extends upward from the left end of the horizontal portion 31, and a horizontal portion 36 that extends horizontally from the upper end of the vertical portion 35 to the left side. And a standing portion 34 extending upward from the left end of the horizontal portion 36. A long hole 31b extending in the X direction is formed through the horizontal portion 31 having a quadrangular shape in plan view. The protrusion 75 of the jig 70 is fitted into the long hole 31b, and the long hole 31b serves as a lateral positioning portion. A circular through hole 36a is formed in the horizontal portion 36 having a quadrangular shape in plan view. Solder as the bonding material 40 is dropped through the through hole 36 a of the horizontal portion 36.

このように、上部電極３０での治具受部としての水平部３１および垂直部３５を用いて治具７０を受けることができる。これにより、回路パターン２２と上部電極３０との間に接合材４０を容易に配置することができる。その結果、回路パターン２２の上面に上部電極３０を安定して接合することができる。また、図６の上部電極３０は、図１との対比において接合部の場所が違う構造となっており、接合材４０の配置位置（接合部）から電極取出部までの距離を短くすることができる。つまり、図１に示す距離Ｌ１に比べて図６に示す距離Ｌ２を短くすることができる。   Thus, the jig 70 can be received using the horizontal portion 31 and the vertical portion 35 as the jig receiving portion in the upper electrode 30. Thereby, the bonding material 40 can be easily disposed between the circuit pattern 22 and the upper electrode 30. As a result, the upper electrode 30 can be stably bonded to the upper surface of the circuit pattern 22. Further, the upper electrode 30 in FIG. 6 has a structure in which the location of the joining portion is different from that in FIG. 1, and the distance from the arrangement position (joining portion) of the joining material 40 to the electrode extraction portion can be shortened. it can. That is, the distance L2 shown in FIG. 6 can be made shorter than the distance L1 shown in FIG.

・図７，８，９，１０に示すように、上部電極における回路パターン２２との接触部分が二箇所（広義には複数）あってもよい。詳しくは、図７において、上部電極９０は、立設部９１と、立設部９１の下端から水平方向の左側に延びる水平部９２および水平方向の右側に延びる水平部９３を有し、水平部９３の左端において垂直部９４が形成され、垂直部９４の下端が回路パターン２２と接触する。また、水平部９３の右端において垂直部９５が形成され、垂直部９５の下端から水平部９６が延びており、水平部９６の下面が回路パターン２２と接触する。この場合、水平部９３が、回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位であり、水平部９６および垂直部９５が治具を受ける治具受部となる。水平部９３に接合材通過孔９３ａが形成されているとともに水平部９６に治具挿入口（貫通孔）９６ａが形成されている。   As shown in FIGS. 7, 8, 9, and 10, there may be two (a plurality in a broad sense) contact portions with the circuit pattern 22 in the upper electrode. Specifically, in FIG. 7, the upper electrode 90 includes a standing portion 91, a horizontal portion 92 extending to the left in the horizontal direction from the lower end of the standing portion 91, and a horizontal portion 93 extending to the right in the horizontal direction. A vertical portion 94 is formed at the left end of 93, and the lower end of the vertical portion 94 is in contact with the circuit pattern 22. Further, a vertical portion 95 is formed at the right end of the horizontal portion 93, the horizontal portion 96 extends from the lower end of the vertical portion 95, and the lower surface of the horizontal portion 96 is in contact with the circuit pattern 22. In this case, the horizontal portion 93 extends along the upper surface of the circuit pattern 22 and is a portion joined to the upper surface of the circuit pattern 22 by a bonding material, and the horizontal portion 96 and the vertical portion 95 receive a jig. It becomes. A bonding material passage hole 93 a is formed in the horizontal portion 93 and a jig insertion opening (through hole) 96 a is formed in the horizontal portion 96.

図８において、上部電極１００は立設部１０１と、立設部１０１の下端から水平方向の左側に延びる水平部１０２および立設部１０１の途中から水平方向の右側に延びる水平部１０３を有し、水平部１０２の下面が回路パターン２２と接触する。また、水平部１０３の右端において垂直部１０４が形成され、垂直部１０４の下端から水平部１０５が延びており、水平部１０５の下面が回路パターン２２と接触する。この場合、水平部１０３が、回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位であり、水平部１０５および垂直部１０４が治具を受ける治具受部となる。水平部１０３に接合材通過孔１０３ａが形成されているとともに水平部１０５に治具挿入口（貫通孔）１０５ａが形成されている。   In FIG. 8, the upper electrode 100 has a standing portion 101, a horizontal portion 102 that extends from the lower end of the standing portion 101 to the left in the horizontal direction, and a horizontal portion 103 that extends from the middle of the standing portion 101 to the right in the horizontal direction. The lower surface of the horizontal portion 102 is in contact with the circuit pattern 22. A vertical portion 104 is formed at the right end of the horizontal portion 103, a horizontal portion 105 extends from the lower end of the vertical portion 104, and the lower surface of the horizontal portion 105 is in contact with the circuit pattern 22. In this case, the horizontal portion 103 is a portion that extends along the upper surface of the circuit pattern 22 and is joined to the upper surface of the circuit pattern 22 by a bonding material, and the horizontal portion 105 and the vertical portion 104 receive a jig. It becomes. A bonding material passage hole 103 a is formed in the horizontal portion 103 and a jig insertion hole (through hole) 105 a is formed in the horizontal portion 105.

図９において、上部電極１１０は、立設部１１１と、立設部１１１の下端から水平方向の右側に延びる水平部１１２を有し、水平部１１２の下面が回路パターン２２と接触する。水平部１１２の右端において垂直部１１３が形成され、垂直部１１３の上端から水平部１１４が延びており、水平部１１４の右端において垂直部１１５が形成され、垂直部１１５の下端から水平部１１６が延び、水平部１１６の下面が回路パターン２２と接触する。この場合、水平部１１４が、回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位であり、水平部１１２，１１６および垂直部１１３，１１５が治具を受ける治具受部となる。水平部１１４に接合材通過孔１１４ａが形成されているとともに水平部１１２，１１６に治具挿入口（貫通孔）１１２ａ，１１６ａが形成されている。   In FIG. 9, the upper electrode 110 has a standing portion 111 and a horizontal portion 112 extending to the right in the horizontal direction from the lower end of the standing portion 111, and the lower surface of the horizontal portion 112 is in contact with the circuit pattern 22. A vertical portion 113 is formed at the right end of the horizontal portion 112, a horizontal portion 114 extends from the upper end of the vertical portion 113, a vertical portion 115 is formed at the right end of the horizontal portion 114, and a horizontal portion 116 is formed from the lower end of the vertical portion 115. The lower surface of the horizontal portion 116 is in contact with the circuit pattern 22. In this case, the horizontal portion 114 extends along the upper surface of the circuit pattern 22 and is joined to the upper surface of the circuit pattern 22 by a bonding material, and the horizontal portions 112 and 116 and the vertical portions 113 and 115 receive a jig. It becomes a jig receiving part. A bonding material passage hole 114 a is formed in the horizontal portion 114, and jig insertion holes (through holes) 112 a and 116 a are formed in the horizontal portions 112 and 116.

図１０において、上部電極１２０は立設部１２１の下端が回路パターン２２と接触する。立設部１２１の途中から水平方向の右側に延びる水平部１２２を有し、水平部１２２の右端において垂直部１２３が形成され、垂直部１２３の下端から水平部１２４が延びており、水平部１２４の下面が回路パターン２２と接触する。この場合、水平部１２２が、回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位であり、水平部１２４および垂直部１２３が治具を受ける治具受部となる。水平部１２２に接合材通過孔１２２ａが形成されているとともに水平部１２４に治具挿入口（貫通孔）１２４ａが形成されている。   In FIG. 10, the lower end of the upright portion 121 of the upper electrode 120 is in contact with the circuit pattern 22. The horizontal portion 122 extends to the right in the horizontal direction from the middle of the standing portion 121, the vertical portion 123 is formed at the right end of the horizontal portion 122, the horizontal portion 124 extends from the lower end of the vertical portion 123, and the horizontal portion 124. The lower surface of this contacts the circuit pattern 22. In this case, the horizontal portion 122 extends along the upper surface of the circuit pattern 22 and is a portion joined to the upper surface of the circuit pattern 22 by a bonding material, and the horizontal portion 124 and the vertical portion 123 receive a jig. It becomes. A bonding material passage hole 122 a is formed in the horizontal portion 122, and a jig insertion opening (through hole) 124 a is formed in the horizontal portion 124.

・上部電極において、接合部分が複数あってもよい。このとき、二つの接合部分の間の部位に回路パターンと接触する部位があってもよい。
・図１１に示す構成としてもよい。図１１において、上部電極２００は、水平部２０１と、立設部２０２を具備し、立設部２０２は四角板状をなし、上側は左右に幅広となっており、左右に段差部２０３ａ，２０３ｂが形成されている。この段差部２０３ａ，２０３ｂが、治具を受ける治具受部となっている。治具２１０は、板部２１１と、２つの係合部（フック部）２１２ａ，２１２ｂからなり、板部２１１の一方の面には係合部２１２ａ，２１２ｂが突設されている。係合部２１２ａ，２１２ｂは棒材をＬ字状に屈曲形成して構成されており、板部２１１の一面から水平方向に延び、その先端において上方に延びている。この係合部２１２ａ，２１２ｂは上部電極２００の両側の治具受部としての段差部２０３ａ，２０３ｂに下から係合して、上部電極２００を両側から支えることができる。この場合、水平部２０１が、回路パターン２２の上面に沿って延び、回路パターン２２の上面と接合材により接合される部位である。このように、上部電極３０での治具受部としての段差部２０３ａ，２０３ｂを用いて治具２１０を受けることができる。これにより、回路パターン２２と上部電極２００との間に接合材４０を容易に配置することができる。その結果、回路パターン２２の上面に上部電極２００を安定して接合することができる。 -There may be a plurality of joints in the upper electrode. At this time, there may be a portion in contact with the circuit pattern at a portion between the two joint portions.
-It is good also as a structure shown in FIG. In FIG. 11, the upper electrode 200 includes a horizontal portion 201 and an upright portion 202, the upright portion 202 has a square plate shape, the upper side is wide on the left and right, and the step portions 203a and 203b on the left and right. Is formed. The step portions 203a and 203b serve as jig receiving portions that receive the jig. The jig 210 includes a plate portion 211 and two engagement portions (hook portions) 212a and 212b. Engagement portions 212a and 212b project from one surface of the plate portion 211. The engaging portions 212a and 212b are formed by bending a bar material into an L shape, extending horizontally from one surface of the plate portion 211, and extending upward at the tip thereof. The engaging portions 212a and 212b can be engaged with step portions 203a and 203b as jig receiving portions on both sides of the upper electrode 200 from below to support the upper electrode 200 from both sides. In this case, the horizontal portion 201 is a portion that extends along the upper surface of the circuit pattern 22 and is bonded to the upper surface of the circuit pattern 22 by a bonding material. As described above, the jig 210 can be received using the step portions 203 a and 203 b as the jig receiving portions in the upper electrode 30. Thereby, the bonding material 40 can be easily disposed between the circuit pattern 22 and the upper electrode 200. As a result, the upper electrode 200 can be stably bonded to the upper surface of the circuit pattern 22.

・図１１に代わり図１２示すように構成してもよい。図１２において上部電極２００の立設部２０２にはピンが入る貫通孔２０５ａ，２０５ｂが設けられている。また、治具２１０については板部２１１に突起部（ピン）２１５ａ，２１５ｂが設けられている。そして、治具２１０の突起部（ピン）２１５ａ，２１５ｂを上部電極２００の貫通孔２０５ａ，２０５ｂに挿入することにより上部電極２００を支持して上部電極２００が回路パターン２２に対して離間した（浮いた）状態で上部電極２００の位置を決定する。このようにして、上部電極２００における治具受部は、立設部２０２に設けられ、治具２１０の突起部２１５ａ，２１５ｂが挿入される貫通孔２０５ａ，２０５ｂであってもよい。   -Instead of FIG. 11, you may comprise as shown in FIG. In FIG. 12, through holes 205 a and 205 b for receiving pins are provided in the standing portion 202 of the upper electrode 200. The jig 210 is provided with projections (pins) 215 a and 215 b on the plate portion 211. The protrusions (pins) 215a and 215b of the jig 210 are inserted into the through holes 205a and 205b of the upper electrode 200, thereby supporting the upper electrode 200 and separating the upper electrode 200 from the circuit pattern 22 (floating). In this state, the position of the upper electrode 200 is determined. Thus, the jig receiving portion in the upper electrode 200 may be the through holes 205a and 205b provided in the standing portion 202 and into which the protrusions 215a and 215b of the jig 210 are inserted.

・図１１に代わり図１３に示すように構成してもよい。図１３（ａ）において上部電極２００には水平方向に延びる腰掛部２０６が設けられ、腰掛部２０６は立設部２０２と水平部２０１との間に形成されている。腰掛部２０６には貫通孔２０６ａが形成されている。また、治具２１０については図１３（ｂ）に示すように、水平方向に延びる腰掛受け部２１３が設けられ、腰掛受け部２１３には上方に延びる位置決めピン２１４が形成されている。そして、治具２１０の腰掛受け部２１３に上部電極２００の腰掛部２０６を載せるとともに治具２１０の位置決めピン２１４を上部電極２００の貫通孔２０６ａに挿入することにより上部電極２００を支持する。上部電極２００での治具受部としての腰掛部２０６を用いて治具２１０を受けることができる。なお、ピン２１４の長さは上部電極２００と回路パターン２２を接合した後に、上部電極２００の貫通孔２０６ａから抜き取ることができるようにする。また、貫通孔２０６ａおよび位置決めピン２１４の数は１つでも２つ以上でもよい。   -Instead of FIG. 11, you may comprise as shown in FIG. In FIG. 13A, the upper electrode 200 is provided with a stool portion 206 extending in the horizontal direction, and the stool portion 206 is formed between the standing portion 202 and the horizontal portion 201. A through hole 206 a is formed in the seat portion 206. As shown in FIG. 13B, the jig 210 is provided with a seat receiving portion 213 extending in the horizontal direction, and a positioning pin 214 extending upward is formed on the seat receiving portion 213. Then, the stool portion 206 of the upper electrode 200 is placed on the stool receiving portion 213 of the jig 210, and the upper electrode 200 is supported by inserting the positioning pin 214 of the jig 210 into the through hole 206 a of the upper electrode 200. The jig 210 can be received by using a seating portion 206 as a jig receiving portion in the upper electrode 200. The length of the pin 214 is set so that it can be extracted from the through hole 206a of the upper electrode 200 after the upper electrode 200 and the circuit pattern 22 are joined. Further, the number of through holes 206a and positioning pins 214 may be one or two or more.

・図１３に代わり図１４に示すようにしてもよい。図１４において、上部電極２００は立設部２０２から右側に水平部２０１が延びるとともに左側に水平部２０７が設けられている。水平部２０１，２０７が回路パターン２２ａと回路パターン２２ｂの両方の上側に配置される。また、水平部２０１，２０７の間の部位において腰掛部２０６が形成され、腰掛部２０６に治具２１０が配置される。腰掛部２０６には治具２１０のピン２３０が通る貫通孔２０６ａが形成されている。水平部２０１，２０７には、はんだが通る貫通孔２０１ａ，２０７ａが形成されている。   -Instead of FIG. 13, you may make it show in FIG. In FIG. 14, the upper electrode 200 has a horizontal portion 201 extending on the right side from the standing portion 202 and a horizontal portion 207 provided on the left side. The horizontal portions 201 and 207 are arranged above both the circuit pattern 22a and the circuit pattern 22b. Further, a seating portion 206 is formed at a portion between the horizontal portions 201 and 207, and the jig 210 is disposed on the seating portion 206. A through hole 206 a through which the pin 230 of the jig 210 passes is formed in the seating portion 206. In the horizontal portions 201 and 207, through holes 201a and 207a through which solder passes are formed.

・図１１に代わり図１５に示すようにしてもよい。図１５において、上部電極２００の立設部２０２の下端から水平方向の左右に延びる折返部２０８が形成されている。治具２１０の係合部（フック部）２１２ａが上部電極２００の立設部２０２の治具受部としての段差部２０３ａに係合する。このようにすることにより、上部電極２００における重心を左右の中心に持っていくことができる。よって、上部電極２００が立ちやすく取り扱いが容易になる。また、上部電極２００において図２に示したポッティング材としての樹脂６１との接触面積が増加するので強固に固定できる。   -Instead of FIG. 11, you may make it show in FIG. In FIG. 15, a folded portion 208 extending from the lower end of the standing portion 202 of the upper electrode 200 to the left and right in the horizontal direction is formed. An engaging portion (hook portion) 212 a of the jig 210 engages with a step portion 203 a as a jig receiving portion of the standing portion 202 of the upper electrode 200. In this way, the center of gravity of the upper electrode 200 can be brought to the left and right centers. Therefore, the upper electrode 200 is easy to stand and easy to handle. Further, since the contact area of the upper electrode 200 with the resin 61 as the potting material shown in FIG. 2 increases, the upper electrode 200 can be firmly fixed.

・パターン付セラミック基板２０が置かれる搬送用治具に対して治具７０が位置決めされていてもよい。
・パターン付セラミック基板２０を用いたが、これに代わり、単純な導電性の基板、例えば、銅板（ヒートスプレッダ等）でもよい。 The jig 70 may be positioned with respect to the conveyance jig on which the patterned ceramic substrate 20 is placed.
Although the patterned ceramic substrate 20 is used, instead of this, a simple conductive substrate such as a copper plate (heat spreader or the like) may be used.

１０…回路基板、２２…回路パターン、３０…上部電極、３１…水平部、３１ａ…貫通孔、３１ｂ…長孔、３２…垂直部、３３…水平部、３３ａ…長孔、３４…立設部、３５…垂直部、３６…水平部、４０…接合材、７０…治具、９０…上部電極、９１…立設部、９３…水平部、９４…垂直部、９５…垂直部、９６…水平部、９６ａ…治具挿入口、１００…上部電極、１０１…立設部、１０２…水平部、１０３…水平部、１０４…垂直部、１０５…水平部、１１０…上部電極、１１１…立設部、１１２…水平部、１１２ａ…治具挿入口、１１４…水平部、１１６…水平部、１２０…上部電極、１２１…立設部、１２２…水平部、１２３…垂直部、１２４…水平部、１２４ａ…治具挿入口、２００…上部電極、２０１…水平部、２０２…立設部、２０３ａ，２０３ｂ…段差部、２０５ａ，２０５ｂ…貫通孔、２０６…腰掛部、２０６ａ…貫通孔、２０７…水平部、Ｇ１…空隙。   DESCRIPTION OF SYMBOLS 10 ... Circuit board, 22 ... Circuit pattern, 30 ... Upper electrode, 31 ... Horizontal part, 31a ... Through-hole, 31b ... Long hole, 32 ... Vertical part, 33 ... Horizontal part, 33a ... Long hole, 34 ... Standing part 35 ... vertical part, 36 ... horizontal part, 40 ... bonding material, 70 ... jig, 90 ... upper electrode, 91 ... standing part, 93 ... horizontal part, 94 ... vertical part, 95 ... vertical part, 96 ... horizontal Part 96a ... Jig insertion slot 100 ... Upper electrode 101 ... Erecting part 102 ... Horizontal part 103 ... Horizontal part 104 ... Vertical part 105 ... Horizontal part 110 ... Upper electrode 111 ... Erecting part 112 ... Horizontal portion 112a ... Jig insertion port 114 ... Horizontal portion 116 ... Horizontal portion 120 ... Upper electrode 121 ... Standing portion 122 ... Horizontal portion 123 ... Vertical portion 124 ... Horizontal portion 124a ... Jig insertion slot, 200 ... Upper electrode, 201 ... Horizontal part, 202 ... Erecting part 203a, 203b ... stepped portion, 205a, 205b ... through hole, 206 ... seat portion, 206a ... through hole, 207 ... horizontal section, G1 ... void.

Claims (5)

回路パターンと、
前記回路パターンの上面に接合材により接合された上部電極と、
を備えた回路基板であって、
前記上部電極は、前記回路パターンの上面に沿って延び前記回路パターンの上面と接合材により接合される部位と、外部接続用の立設部とを有するとともに、治具を受ける治具受部を具備してなることを特徴とする回路基板。 Circuit pattern,
An upper electrode bonded to the upper surface of the circuit pattern by a bonding material;
A circuit board comprising:
The upper electrode has a portion that extends along the upper surface of the circuit pattern and is joined to the upper surface of the circuit pattern by a bonding material, and a standing portion for external connection, and a jig receiving portion that receives a jig. A circuit board comprising the circuit board. 前記上部電極は、前記回路パターンと接触する接触部を有することを特徴とする請求項１に記載の回路基板。   The circuit board according to claim 1, wherein the upper electrode has a contact portion that contacts the circuit pattern. 前記上部電極は、前記治具に対する位置決め部を有することを特徴とする請求項１または２に記載の回路基板。   The circuit board according to claim 1, wherein the upper electrode has a positioning portion for the jig. 回路パターンの上に、外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて前記上部電極における前記回路パターンの上面に沿って延び前記回路パターンの上面と接合される部位と前記回路パターンの上面とを空隙を介して対向配置させる第１の工程と、
前記上部電極における前記回路パターンの上面と接合される部位と前記回路パターンの上面との空隙に接合材を注入して前記回路パターンと前記上部電極とを接合する第２の工程と、
を有することを特徴とする回路基板の製造方法。 The upper surface of the circuit pattern extends along the upper surface of the circuit pattern in the upper electrode by receiving a jig receiving portion for receiving the jig in the upper electrode having a standing portion for external connection on the circuit pattern. A first step of disposing the portion to be bonded to the upper surface of the circuit pattern with a gap therebetween,
A second step of bonding the circuit pattern and the upper electrode by injecting a bonding material into a gap between a portion of the upper electrode bonded to the upper surface of the circuit pattern and the upper surface of the circuit pattern;
A method of manufacturing a circuit board, comprising: 回路パターンの上面に接合材を配置する第１の工程と、
外部接続用の立設部を有する上部電極における治具を受ける治具受部を治具で受けて前記上部電極における前記回路パターンの上面に沿って延び前記回路パターンの上面と接合される部位と前記回路パターンの上面とを前記接合材を介して対向配置させて前記回路パターンと前記上部電極とを前記接合材により接合する第２の工程と、
を有することを特徴とする回路基板の製造方法。 A first step of disposing a bonding material on the upper surface of the circuit pattern;
A jig receiving portion for receiving a jig in the upper electrode having a standing portion for external connection, and a portion that extends along the upper surface of the circuit pattern in the upper electrode and is joined to the upper surface of the circuit pattern; A second step in which the upper surface of the circuit pattern is disposed oppositely via the bonding material, and the circuit pattern and the upper electrode are bonded by the bonding material;
A method of manufacturing a circuit board, comprising:
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Citations (8)

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JPH0851178A (en) * 1994-08-05 1996-02-20 Nippon Avionics Co Ltd Ball grid array package and forming method of ball grid array
JPH08138590A (en) * 1994-11-04 1996-05-31 Noritake Co Ltd Fluorescent display tube
JP2001068621A (en) * 1999-06-21 2001-03-16 Shinko Electric Ind Co Ltd Semiconductor device and its manufacture
JP2002164104A (en) * 2000-11-22 2002-06-07 Ando Electric Co Ltd Probe card
JP2002222891A (en) * 2001-01-29 2002-08-09 Kyocera Corp Wiring board with pin, and electronic device using the board
JP2009232512A (en) * 2008-03-19 2009-10-08 Hitachi Ltd Control unit of motor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04137663A (en) * 1990-09-28 1992-05-12 Toshiba Corp Solid-state image sensor
JPH05335478A (en) * 1992-05-28 1993-12-17 Fujitsu Ltd Multichip module and manufacturing method thereof
JPH0851178A (en) * 1994-08-05 1996-02-20 Nippon Avionics Co Ltd Ball grid array package and forming method of ball grid array
JPH08138590A (en) * 1994-11-04 1996-05-31 Noritake Co Ltd Fluorescent display tube
JP2001068621A (en) * 1999-06-21 2001-03-16 Shinko Electric Ind Co Ltd Semiconductor device and its manufacture
JP2002164104A (en) * 2000-11-22 2002-06-07 Ando Electric Co Ltd Probe card
JP2002222891A (en) * 2001-01-29 2002-08-09 Kyocera Corp Wiring board with pin, and electronic device using the board
JP2009232512A (en) * 2008-03-19 2009-10-08 Hitachi Ltd Control unit of motor

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