JP2013157581A - 研磨用組成物 - Google Patents
研磨用組成物 Download PDFInfo
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- JP2013157581A JP2013157581A JP2012019451A JP2012019451A JP2013157581A JP 2013157581 A JP2013157581 A JP 2013157581A JP 2012019451 A JP2012019451 A JP 2012019451A JP 2012019451 A JP2012019451 A JP 2012019451A JP 2013157581 A JP2013157581 A JP 2013157581A
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- Prior art keywords
- acid
- polishing
- polishing composition
- phase change
- change alloy
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims abstract description 210
- 239000000203 mixture Substances 0.000 title claims abstract description 114
- 239000000956 alloy Substances 0.000 claims abstract description 54
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 54
- 230000008859 change Effects 0.000 claims abstract description 52
- 239000006061 abrasive grain Substances 0.000 claims abstract description 40
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 19
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- 150000002903 organophosphorus compounds Chemical class 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
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- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 10
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 10
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- 229940005605 valeric acid Drugs 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
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Abstract
【解決手段】本発明の研磨用組成物は、相変化合金を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、砥粒と飽和モノカルボン酸及び有機リン化合物から選ばれる少なくとも1以上である脆性膜形成剤を含有することを特徴とする研磨用組成物である。
【選択図】なし
Description
<1>相変化合金を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、砥粒及び脆性膜形成剤を含み、前記脆性膜形成剤が飽和モノカルボン酸及び有機リン化合物から選ばれる少なくとも1以上であることを特徴とする研磨用組成物。
<2>砥粒が、コロイダルシリカである研磨用組成物。
<3>コロイダルシリカが、有機酸を固定化されたコロイダルシリカである研磨用組成物。
<4>脆性膜形成剤が、飽和モノカルボン酸から選ばれる少なくとも1以上である研磨用組成物。
<5>飽和モノカルボン酸が酢酸、グリコール酸、乳酸及びサリチル酸から選ばれる少なくとも1以上である研磨用組成物。
<6>脆性膜形成剤が、有機リン化合物から選ばれる少なくとも1以上である研磨用組成物。
<7>有機リン酸がホスホン酸、アルキルホスホン酸、HEDP及びホスフィン酸から選ばれる少なくとも1以上である研磨用組成物。
<8>相変化合金を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、脆性膜形成剤を含むことを特徴とする研磨用組成物。
<9>相変化合金としてGST有する研磨対象物を研磨する用途で使用される研磨用組成物。
<10>上記<1>〜<8>のいずれかの研磨用組成物を用いて、相変化合金を有する研磨対象物の表面を研磨することを特徴とする研磨方法。
<11>上記<1>〜<8>のいずれかの研磨用組成物を用いて、相変化合金を有する研磨対象物の表面を研磨する工程を有することを特徴とする基板の製造方法。
本実施形態の研磨用組成物は、砥粒と特定の脆性膜形成剤を含む。
研磨用組成物は、砥粒を含有する。砥粒は、無機粒子、有機粒子、及び有機無機複合粒子のいずれであってもよい。無機粒子の具体例としては、例えば、シリカ、アルミナ、セリア、チタニアなどの金属酸化物からなる粒子、並びに窒化ケイ素粒子、炭化ケイ素粒子及び窒化ホウ素粒子が挙げられる。有機粒子の具体例としては、例えばポリメタクリル酸メチル(PMMA)粒子が挙げられる。その中でもシリカ粒子が好ましく、特に好ましいのはコロイダルシリカである。
研磨用組成物は、飽和モノカルボン酸及び有機リン酸から選ばれる少なくとも1以上である脆性膜形成剤を含む。従来の金属含有表面を研磨するための典型的な研磨用組成物では、その研磨用組成物に含まれる酸化剤で研磨対象の金属を酸化して金属酸化物を形成し、さらに錯化剤で金属酸化物を溶解することで研磨する。それに対して本発明の研磨用組成物は、その研磨用組成物に含まれる上記脆性膜形成剤が、相変化合金表面と錯形成して不溶性の脆性膜を形成し、その脆性膜を砥粒で機械的に研磨することで高い研磨速度が得られると考えられる。
研磨用組成物のpHの上限は特に限定されないが、12であることが好ましく、より好ましくは10である。pHが低くなるにつれて、研磨用組成物の操作性が向上する。
研磨用組成物には、酸化剤をさらに含有させることができる。酸化剤は研磨対象物の表面を酸化する作用を有し、研磨用組成物中に酸化剤を加えた場合には、研磨用組成物による研磨速度の向上効果がある。しかし、研磨対象物が相変化合金を有する場合、従来の金属含有表面を研磨するための典型的な研磨用組成物で研磨すると、過度な研磨を引き起こす。これは、従来の半導体で使用される金属(例えばCu)と相変化合金の特性の違いに基づくと考えられ、研磨対象物が相変化合金を有する場合は酸化剤の含有量は低いほうが好ましい。
研磨用組成物には、錯化剤をさらに含有させることができる。研磨用組成物中に含まれる錯化剤は、相変化合金の表面を化学的にエッチングする作用を有し、研磨用組成物による研磨速度を向上させる働きをする。しかし、研磨対象物が相変化合金を有する場合、従来の金属含有表面を研磨するための典型的な研磨用組成物で研磨すると、過剰なエッチングを引き起こし、その結果過度な研磨を引き起こす。これは、従来の半導体で使用される金属(例えばCu)と相変化合金の特性の違いに基づくと考えられ、研磨対象物が相変化合金を有する場合は錯化剤の含有量は低いほうが好ましい。
研磨用組成物には、金属防食剤をさらに含有させることができる。研磨用組成物中に金属防食剤を加えた場合には、研磨用組成物を用いて研磨した後の相変化合金にディッシング等の表面欠陥がより生じにくくなる効果がある。また、その金属防食剤は、研磨用組成物中に酸化剤及び/又は錯化剤が含まれている場合には、酸化剤による相変化合金表面の酸化を緩和するとともに、酸化剤による相変化合金表面の金属の酸化により生じる金属イオンと反応して不溶性の錯体を生成する働きをする。その結果、錯化剤による相変化合金へのエッチングを抑制することができ、過度な研磨を抑制することができる。
従来の金属含有表面を研磨するための典型的な研磨用組成物では、その研磨用組成物に含まれる酸化剤で研磨対象の金属を酸化して金属酸化物を形成し、さらに錯化剤で金属酸化物を溶解することで研磨する。それに対して本実施形態の研磨用組成物は、その研磨用組成物に含まれる脆性膜形成剤が、相変化合金表面と錯形成して不溶性膜を形成し、その不溶性膜を砥粒で機械的に研磨していると考えられる。その結果、研磨速度を向上することができる。
・ 前記実施形態の研磨用組成物は、必要に応じて、界面活性剤や水溶性高分子、防腐剤のような公知の添加剤をさらに含有してもよい。
・ 前記実施形態の研磨用組成物は一液型であってもよいし、二液型を始めとする多液型であってもよい。
・ 前記実施形態の研磨用組成物は、研磨用組成物の原液を水で希釈することにより調製されてもよい。
表1に記載の組成となるように各成分を混合することにより、実施例1〜14及び比較例1〜21の研磨用組成物を調整した。表1の“脆性膜形成剤”欄の“種類”欄には、実施例においては各研磨用組成物中に含まれる飽和モノカルボン酸及び有機リン化合物から選ばれる脆性膜形成剤の種類を、比較例においては当該飽和モノカルボン酸及び有機リン化合物から選ばれる脆性膜形成剤以外の添加剤や各研磨用組成物中に含まれる従来の金属含有表面を研磨するための典型的な研磨用組成物に含まれる錯化剤、防食剤から選定した添加剤の種類を示す。また、“含有量(質量%)”欄には、各研磨用組成物中の当該脆性膜形成剤又は脆性膜形成剤以外の添加剤の含有量を示す。同欄において、“−”表記は当該脆性膜形成剤又は脆性膜形成剤以外の添加剤を含有していないことを示す。表1の“pH”欄には、各研磨用組成物中のpHを示す。また、表1中の砥粒は、約60nmの平均二次粒子径(平均一次粒子径30nm)を有するコロイダルシリカを使用し、“砥粒”欄に含有量を示す。また、pHは無機酸又は無機塩基を添加して所定の値に調整した。なお、表1中には示していないが、各研磨用組成物には、酸化剤として過酸化水素水が2.1質量%になるように添加されている。
Claims (11)
- 相変化合金を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、
砥粒及び脆性膜形成剤を含み、
前記脆性膜形成剤が飽和モノカルボン酸及び有機リン化合物から選ばれる少なくとも1以上であることを特徴とする研磨用組成物。 - 前記砥粒が、コロイダルシリカである、請求項1に記載の研磨用組成物。
- 前記コロイダルシリカが、有機酸を固定化されたコロイダルシリカである、請求項2に記載の研磨用組成物。
- 前記脆性膜形成剤が、飽和モノカルボン酸から選ばれる少なくとも1以上である、請求項1に記載の研磨用組成物。
- 前記飽和モノカルボン酸が酢酸、グリコール酸、乳酸及びサリチル酸から選ばれる少なくとも1以上である、請求項4に記載の研磨用組成物。
- 前記脆性膜形成剤が、有機リン化合物から選ばれる少なくとも1以上である、請求項1に記載の研磨用組成物。
- 前記有機リン酸がホスホン酸、アルキルホスホン酸、HEDP及びホスフィン酸から選ばれる少なくとも1以上である、請求項6に記載の研磨用組成物。
- 相変化合金を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、
脆性膜形成剤を含むことを特徴とする研磨用組成物。 - 前記相変化合金がGSTである、請求項1〜8のいずれか一項に記載の研磨用組成物。
- 請求項1〜8のいずれか一項に記載の研磨用組成物を用いて、相変化合金を有する研磨対象物の表面を研磨することを特徴とする研磨方法。
- 請求項1〜8のいずれか一項に記載の研磨用組成物を用いて、相変化合金を有する研磨対象物の表面を研磨する工程を有することを特徴とする基板の製造方法。
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