JP2013157319A - ホルダおよびホルダ使用のledモジュール - Google Patents
ホルダおよびホルダ使用のledモジュール Download PDFInfo
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- JP2013157319A JP2013157319A JP2013000509A JP2013000509A JP2013157319A JP 2013157319 A JP2013157319 A JP 2013157319A JP 2013000509 A JP2013000509 A JP 2013000509A JP 2013000509 A JP2013000509 A JP 2013000509A JP 2013157319 A JP2013157319 A JP 2013157319A
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
【解決手段】開口を有するベースを含むホルダが提供される。LEDエミッタを有するLEDアレイは、LEDエミッタが開口内に収まるように配置できる。ホルダは、LEDアレイ上の表面の接点にはんだ付け可能なパッドを含む。ホルダは、パッドに電気的に接続される接点をさらに含む。パッドおよび接点は、ベース内にインサート成形された端子として提供されてもよい。ベースは、一体化コネクタを含むことができ、コネクタは、その内部に延びる端子の接点を有する。
【選択図】なし
Description
本願は2012年1月5日出願の米国特許仮出願番号第61/583,270号、2012年1月11日出願の同第61/585,325号、2012年1月18日出願の同第61/587,997号、2012年7月16日出願の同第61/672,084号、および2012年12月3日出願の同第61/732,754号に基づく優先権を主張し、それら全ては本明細書にその全体が参照により組み込まれる。
Claims (20)
- 絶縁性で、外縁部および開口を含むベースと、
電気的に一緒に接続された第1のパッドおよび第1の接点と、
電気的に一緒に接続された第2のパッドおよび第2の接点であって、前記第1のパッドおよび第1の接点から電気的に絶縁された第2のパッドおよび第2の接点と、を備え、
前記ベースが、前記第1および第2のパッドを支持し、前記第1および第2の接点、ならびに、前記第1および第2のパッドの両方が、表面の接点にはんだ付けされるように構成された表面を提供するホルダ。 - 前記第1のパッドおよび第1の接点が第1の端子であり、前記第2のパッドおよび前記第2の接点が第2の端子であり、前記第1および第2の端子が前記ベース内にインサート成形されている、請求項1に記載のホルダ。
- 前記ベース内にインサート成形された第3の端子および第4の端子をさらに備え、該第3および第4の端子が、表面の接点にはんだ付けされるように構成された第3および第4のパッドと、前記第1および前記第2の接点から離れて延びる第3および第4の接点とをそれぞれ含む、請求項2に記載のホルダ。
- 前記第1および第2の接点が凹部内に配置され、前記第3および第4の接点がシェルフ上に配置される、請求項3に記載のホルダ。
- 前記第1および第2の接点が垂直な接点であり、前記第3および第4の接点が水平な接点である、請求項4に記載のホルダ。
- 前記ベースが、リフロー工程時に耐変色性を保つ樹脂から形成される、請求項5に記載のホルダ。
- 前記第1および第2のパッドが前記開口に近接し、前記第1および第2の接点が前記外縁部に近接する、請求項1に記載のホルダ。
- 前記第1および第2の接点が垂直な接点である、請求項1に記載のホルダ。
- 前記第1および第2の接点が凹部内に配置される、請求項8に記載のホルダ。
- 前記ベースがリフロー工程時に耐変色性を保つ樹脂から形成される、請求項1に記載のホルダ。
- 発光ダイオード(LED)モジュールであって、
LEDエミッタを支持するプレートと、該プレートの第1の表面上に設けられた第1の表面の接点および第2の表面の接点とを有し、前記第1の表面の接点がアノードであり、前記第2の表面の接点がカソードであるLEDアレイと、
該LEDアレイに実装されたホルダであって、該ホルダが、前記LEDエミッタと位置合わせされる開口を含む絶縁性のベースを含み、該ベースが、第1のパッド、第2のパッド、第1の接点および第2の接点を支持し、前記第1の接点が前記第1のパッドに電気的に接続し、前記第2の接点が前記第2のパッドに電気的に接続するホルダと、を備え、
前記第1および第2のパッドが前記第1および第2の表面の接点にそれぞれはんだ付けされる発光ダイオード(LED)モジュール。 - 前記第1のパッドおよび前記第1の接点が第1の端子によって形成され、前記第2のパッドおよび第2の接点が第2の端子によって形成される、請求項11に記載のLEDモジュール。
- 前記第1および第2の端子が前記ベース内にインサート成形される、請求項12に記載のLEDモジュール。
- 前記ホルダが、前記ベース内にインサート成形された第3の端子および第4の端子をさらに備え、該第3および第4の端子が、第3および第4の表面の接点にそれぞれはんだ付けされる第3および第4のパッドをそれぞれ含み、第3および第4の接点が、前記第1および第2の接点の反対側に配置される、請求項13に記載のLEDモジュール。
- 前記ベースがリフロー工程時に耐変色性を保つ樹脂から形成される、請求項14に記載のLEDモジュール。
- 前記パッドおよび前記第2の接点の組は、前記ホルダ上に提供される第1および第2のめっきによって形成され、該第1および第2のめっきのそれぞれが、互いに電気的に隔てられ、前記パッドの一方を前記接点の組の一方へ連結する、請求項11に記載のLEDモジュール。
- 外縁部および開口を有するベースと、
該ベースに成形された第1および第2の端子であって、各端子が、表面の接点に対して押圧するように構成された少なくとも1つの翼部を含み、少なくとも1つの接点をさらに含む第1および第2の端子と、を備え、
前記翼部が前記開口内に配置され、前記接点が前記ホルダの外縁部に近接して配置されるホルダ。 - 各端子が反対方向に延びる2つの翼部を含む、請求項17に記載のホルダ。
- 前記第1および第2の端子の前記少なくとも1つの接点が前記ベース内の凹部内に配置されて、一体に形成したコネクタを形成する、請求項17に記載のホルダ。
- ヒートシンクと、
請求項9に記載のLEDモジュールと、
該LEDモジュールをヒートシンクに固定するように構成されたカバーと、を備えるLEDシステム。
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261583270P | 2012-01-05 | 2012-01-05 | |
US61/583,270 | 2012-01-05 | ||
US201261585325P | 2012-01-11 | 2012-01-11 | |
US61/585,325 | 2012-01-11 | ||
US201261587997P | 2012-01-18 | 2012-01-18 | |
US61/587,997 | 2012-01-18 | ||
US201261672084P | 2012-07-16 | 2012-07-16 | |
US61/672,084 | 2012-07-16 | ||
US201261732754P | 2012-12-03 | 2012-12-03 | |
US61/732,754 | 2012-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013157319A true JP2013157319A (ja) | 2013-08-15 |
JP5855589B2 JP5855589B2 (ja) | 2016-02-09 |
Family
ID=48718827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013000509A Expired - Fee Related JP5855589B2 (ja) | 2012-01-05 | 2013-01-07 | ホルダおよびホルダ使用のledモジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US9170002B2 (ja) |
JP (1) | JP5855589B2 (ja) |
CN (4) | CN203586115U (ja) |
TW (2) | TWM465596U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015118900A (ja) * | 2013-12-17 | 2015-06-25 | モレックス インコーポレイテドMolex Incorporated | カバーアセンブリ |
JP2017500701A (ja) * | 2014-01-10 | 2017-01-05 | モレックス エルエルシー | インサートおよびそれを使用するledホルダ組立体 |
JP2017117831A (ja) * | 2015-12-21 | 2017-06-29 | 日亜化学工業株式会社 | 発光装置および発光装置用給電コネクタ |
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US9170002B2 (en) * | 2012-01-05 | 2015-10-27 | Molex, Llc | Holder and LED module using same |
TWI592611B (zh) | 2013-01-10 | 2017-07-21 | Molex Inc | LED components |
US20160146444A1 (en) * | 2013-07-02 | 2016-05-26 | Molex Incorporated | Led holder system |
US8941129B1 (en) | 2013-07-19 | 2015-01-27 | Bridgelux, Inc. | Using an LED die to measure temperature inside silicone that encapsulates an LED array |
EP3030834A4 (en) * | 2013-08-09 | 2017-08-02 | Molex, LLC | Holder assembly |
CN105473930B (zh) | 2013-08-23 | 2019-03-19 | 莫列斯有限公司 | Led模块 |
TWM472152U (zh) * | 2013-09-05 | 2014-02-11 | Molex Taiwan Ltd | 安裝座與照明裝置 |
US9439299B2 (en) | 2014-03-29 | 2016-09-06 | Bridgelux, Inc. | Low-profile outdoor lighting module with light emitting diodes |
US9277618B2 (en) | 2014-06-27 | 2016-03-01 | Bridgelux, Inc. | Monolithic LED chip in an integrated control module with active circuitry |
EP3181987A1 (en) | 2015-12-15 | 2017-06-21 | TE Connectivity Nederland B.V. | Led socket for receiving a cob-led and base for such led socket |
TWI588402B (zh) * | 2016-02-01 | 2017-06-21 | 興訊科技股份有限公司 | 發光二極體光源模組 |
US10596388B2 (en) | 2016-09-21 | 2020-03-24 | Epistar Corporation | Therapeutic light-emitting module |
TR201614398A2 (tr) * | 2016-10-13 | 2017-01-23 | Ttaf Elektronik Sanayi Ve Ticaret Ltd Sirketi | Chip-on-board (cob) , die-on-board (dob) veya benzer led kümeleri̇ni̇n opti̇k yapi i̇le entegre edi̇ldi̇ği̇ su geçi̇rmez aydinlatma modülü |
CN111473306B (zh) * | 2020-05-26 | 2022-05-06 | 东莞市星耀电子有限公司 | 一种高效散热的led安装支架及其组装方法 |
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2013
- 2013-01-04 US US13/733,998 patent/US9170002B2/en not_active Expired - Fee Related
- 2013-01-05 CN CN201320789024.0U patent/CN203586115U/zh not_active Expired - Fee Related
- 2013-01-05 CN CN201610086284.XA patent/CN105698130B/zh not_active Expired - Fee Related
- 2013-01-05 CN CN201310002620.4A patent/CN103196107B/zh not_active Expired - Fee Related
- 2013-01-05 CN CN201320003206.0U patent/CN203533458U/zh not_active Expired - Fee Related
- 2013-01-07 TW TW102200277U patent/TWM465596U/zh unknown
- 2013-01-07 TW TW102100429A patent/TWI579501B/zh not_active IP Right Cessation
- 2013-01-07 JP JP2013000509A patent/JP5855589B2/ja not_active Expired - Fee Related
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JP2015118900A (ja) * | 2013-12-17 | 2015-06-25 | モレックス インコーポレイテドMolex Incorporated | カバーアセンブリ |
JP2017500701A (ja) * | 2014-01-10 | 2017-01-05 | モレックス エルエルシー | インサートおよびそれを使用するledホルダ組立体 |
JP2017117831A (ja) * | 2015-12-21 | 2017-06-29 | 日亜化学工業株式会社 | 発光装置および発光装置用給電コネクタ |
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TW201337157A (zh) | 2013-09-16 |
JP5855589B2 (ja) | 2016-02-09 |
CN105698130A (zh) | 2016-06-22 |
TWI579501B (zh) | 2017-04-21 |
CN203533458U (zh) | 2014-04-09 |
CN103196107B (zh) | 2016-01-13 |
TWM465596U (zh) | 2013-11-11 |
CN203586115U (zh) | 2014-05-07 |
CN103196107A (zh) | 2013-07-10 |
US20130176732A1 (en) | 2013-07-11 |
US9170002B2 (en) | 2015-10-27 |
CN105698130B (zh) | 2019-04-09 |
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