JP2013139055A - 分離型多ステージ位置決めシステム - Google Patents
分離型多ステージ位置決めシステム Download PDFInfo
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- JP2013139055A JP2013139055A JP2013008923A JP2013008923A JP2013139055A JP 2013139055 A JP2013139055 A JP 2013139055A JP 2013008923 A JP2013008923 A JP 2013008923A JP 2013008923 A JP2013008923 A JP 2013008923A JP 2013139055 A JP2013139055 A JP 2013139055A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
【解決手段】分割軸デザインでは、ステージ動作が、平行な別々の平面内にある直交する2つの軸に沿って、分離される。花崗岩又は他の石の厚板の形態、またはセラミック材又は鋳鉄の形態の寸法安定な基体12が、下部及び上部ステージの土台として使用される。硬い支持構造体は、レーザ加工システムに於ける、軸方向に調整可能な光学構成要素のより早くより正確な位置決めを可能とする。光学アセンブリが硬い空気軸受スリーブに収容され、その空気軸受スリーブが多ステージ位置決めシステムの試料ステージの上方にある支持構造体236、240に取り付けられる場合、振動及び熱安定性が向上する。
【選択図】図1
Description
(C) 2008 Electro Scientific Industries, Inc. 本特許文献の開示部分は、著作権保護の対象である資料を含んでいる。本著作権所有者は、特許商標庁の特許包袋または記録に現れるように何人が本特許文献または特許開示をファクシミリ再生することに対して異議はないが、そうではない場合、何であれ、37 CFR§1.71(d)に従って全ての著作権を留保する。
Claims (7)
- レーザビームがビーム軸を伝播し、レンズを通って、支持体上に搭載されたターゲット試料の加工面に入射し、前記レンズは、前記レーザビームの焦点領域を形成し、前記支持体は、動作可能に、多軸の位置決めシステムに接続され、その位置決めシステムは、前記レーザビームと前記ターゲット試料を互いに相対的に動かして、前記加工面上の選択位置に前記レーザビームを位置決める、位置決めシステムであって、
空気軸受アセンブリが、空気軸受ブッシュを備え、空気軸受ブッシュは、前記レンズを収容し、前記レンズに印加される動力に応じて、前記ビーム軸に沿ってレンズの移動を案内し、前記加工面に対して前記レーザビームの前記焦点領域を調整する手段を含む、位置決めシステム。 - 前記空気軸受ブッシュが、内表面を有し、前記レンズは、前記レンズの軸受表面を画定する外径を有し、前記レンズの前記軸受表面は、前記空気軸受の内レースとして機能し、前記空気軸受ブッシュの内表面は、前記空気軸受ブッシュの外レースとして機能する、請求項1に記載の位置決めシステム。
- レーザビームがビーム軸を伝播し、レンズを通って、支持体上に搭載されたターゲット試料の加工面に入射し、前記レンズは、前記レーザビームの焦点領域を形成し、前記支持体は、動作可能に、多軸の位置決めシステムに接続され、その位置決めシステムは、前記レーザビームと前記ターゲット試料を互いに相対的に動かして、前記加工面上の選択位置に前記レーザビームを位置決める、位置決めシステムであって、
空気軸受アセンブリが空気軸受ブッシュを備え、空気軸受ブッシュは、前記レンズを収容し、前記レンズに印加される動力に応じて、前記ビーム軸に沿ってレンズの移動を案内する手段と、
レンズフォーサが可動部材を備え、可動部材は、前記ビーム軸に沿って動くように案内され、且つ前記レンズに動作可能に接続されて、前記動力を与え、前記ビーム軸に沿って前記レンズを動かし、それによって前記加工面に対して前記レーザビームの前記焦点領域を調整する手段と、
を含む、位置決めシステム。 - 前記レンズフォーサが、前記可動部材の前記動きを制御するボイスコイルアクチュエータを含む、請求項3に記載の位置決めシステム。
- 前記多軸位置決めシステムとレンズフォーサが、第1の位置にあるガイド要素の重心を規定し、前記レンズを収容する前記空気軸受アセンブリは、前記第1の位置とほぼ同じ第2の位置に重心を有する、請求項3に記載の位置決めシステム。
- 前記レンズフォーサと前記レンズとのバッファとして機能し、前記レンズフォーサの前記可動部材の案内された動きを、前記レンズフォーサの前記可動部材によって前記レンズに与えた案内された動きから隔離する、隔離撓み手段をさらに含む、請求項3に記載の位置決めシステム。
- 前記隔離撓み手段は、前記ビーム軸に沿っては剛直であり、前記ビーム軸に直交する平面では可撓性がある、請求項6に記載の位置決めシステム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/676,945 US7603785B2 (en) | 2007-02-20 | 2007-02-20 | Air bearing assembly for guiding motion of optical components of a laser processing system |
US11/676,937 | 2007-02-20 | ||
US11/676,937 US7760331B2 (en) | 2007-02-20 | 2007-02-20 | Decoupled, multiple stage positioning system |
US11/676,945 | 2007-02-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009550155A Division JP5586963B2 (ja) | 2007-02-20 | 2008-02-15 | 分離型多ステージ位置決めシステム |
Publications (2)
Publication Number | Publication Date |
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JP2013139055A true JP2013139055A (ja) | 2013-07-18 |
JP5687294B2 JP5687294B2 (ja) | 2015-03-18 |
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JP2009550155A Expired - Fee Related JP5586963B2 (ja) | 2007-02-20 | 2008-02-15 | 分離型多ステージ位置決めシステム |
JP2013008923A Expired - Fee Related JP5687294B2 (ja) | 2007-02-20 | 2013-01-22 | 分離型多ステージ位置決めシステム |
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JP2009550155A Expired - Fee Related JP5586963B2 (ja) | 2007-02-20 | 2008-02-15 | 分離型多ステージ位置決めシステム |
Country Status (7)
Country | Link |
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US (1) | US7760331B2 (ja) |
JP (2) | JP5586963B2 (ja) |
KR (2) | KR101429133B1 (ja) |
CN (2) | CN102066038B (ja) |
DE (1) | DE112008000428T5 (ja) |
TW (2) | TWI471108B (ja) |
WO (1) | WO2008103611A2 (ja) |
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KR101429133B1 (ko) | 2014-08-12 |
KR20090127875A (ko) | 2009-12-14 |
CN101657892B (zh) | 2013-05-22 |
US7760331B2 (en) | 2010-07-20 |
CN101657892A (zh) | 2010-02-24 |
WO2008103611A3 (en) | 2011-02-24 |
TW201513956A (zh) | 2015-04-16 |
JP5687294B2 (ja) | 2015-03-18 |
KR101496951B1 (ko) | 2015-03-02 |
KR20140041945A (ko) | 2014-04-04 |
JP5586963B2 (ja) | 2014-09-10 |
CN102066038A (zh) | 2011-05-18 |
TW200847973A (en) | 2008-12-16 |
CN102066038B (zh) | 2013-09-25 |
TWI471108B (zh) | 2015-02-01 |
US20080196631A1 (en) | 2008-08-21 |
JP2010528451A (ja) | 2010-08-19 |
WO2008103611A2 (en) | 2008-08-28 |
DE112008000428T5 (de) | 2010-01-28 |
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