JP2013121059A - Microphone structure and electronic component - Google Patents

Microphone structure and electronic component Download PDF

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JP2013121059A
JP2013121059A JP2011267900A JP2011267900A JP2013121059A JP 2013121059 A JP2013121059 A JP 2013121059A JP 2011267900 A JP2011267900 A JP 2011267900A JP 2011267900 A JP2011267900 A JP 2011267900A JP 2013121059 A JP2013121059 A JP 2013121059A
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substrate
microphone
hole
microphone device
lid
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Keijiro Koike
圭二郎 小池
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Nikon Corp
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Nikon Corp
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Abstract

PROBLEM TO BE SOLVED: To inhibit fine holes and gaps, other than sound holes, from being formed at an area between a side wall of a lid and a substrate or the like by soldering performed when a microphone device is mounted on the substrate.SOLUTION: A microphone structure 1 comprises: a microphone device 3; a first substrate 2 to which the microphone device 3 is joined; and a fixing member 4 fixing the first substrate 2 to which the microphone device 3 is joined. The microphone device 3 has a hollow lid 32 including a bottom part 322 and a second substrate 31. The second substrate 31 has a sound hole 311 and a microphone element 312 located on the surface side, and the rear surface side of the second substrate 31 is joined to the first substrate 2 (a joining part 101 and a joining part 102). The lid 32 has an air hole 321, and an opening surface of the lid 32, which faces the bottom part 322, is placed in close contact with the surface side of the second substrate 31. The fixing member 4 closely contacts with the lid 32 and closes the air hole 321 of the microphone device 3 joined to the first substrate 2 with a protruding part 41 and surrounding areas of the protruding part 41.

Description

本発明はマイク構造と、そのマイク構造を備える電子機器に関する。   The present invention relates to a microphone structure and an electronic apparatus including the microphone structure.

特許文献１には、音孔を有する基板と蓋部とを有し、蓋部が基板の表面上に密接されるマイクデバイスについての記載がある。   Patent Document 1 describes a microphone device that includes a substrate having a sound hole and a lid, and the lid is in close contact with the surface of the substrate.

特開２０１０−２６８４１２号公報JP 2010-268212 A

マイクデバイスの表面に音孔以外の孔や隙間があると、それらの孔や隙間から伝達される音はマイクデバイスの特性に悪影響を与える。マイクデバイスを基板に実装するとき、はんだ付けが行われるが、はんだ付け時に加えられる熱により膨張した空気によって、蓋部の側壁と基板との間などに音孔以外の孔や隙間が形成されることがある。このように形成された孔や隙間は微小であり、製品検査時の目視検査が困難である。   If there are holes or gaps other than sound holes on the surface of the microphone device, the sound transmitted from the holes or gaps adversely affects the characteristics of the microphone device. When the microphone device is mounted on the board, soldering is performed, but holes or gaps other than sound holes are formed between the side wall of the lid and the board by the air expanded by the heat applied during soldering. Sometimes. The holes and gaps formed in this way are very small, and visual inspection during product inspection is difficult.

本発明の一実施の形態によるマイク構造は、マイクデバイスと、マイクデバイスが接合される第１の基板と、マイクデバイスが接合された第１の基板を固定する固定部材とを備えるマイク構造であって、マイクデバイスは、底部を備える中空状の蓋部と、第２の基板とを有し、第２の基板は、音孔を有し、表面側にマイク素子を有し、裏面側が第１の基板に接合され、蓋部は、貫通孔を有し、底部の対面に位置する開口面が第２の基板の表面側に密接し、固定部材は、蓋部に密接して貫通孔を塞ぐ塞孔部を有することを特徴とする。   A microphone structure according to an embodiment of the present invention is a microphone structure including a microphone device, a first substrate to which the microphone device is bonded, and a fixing member that fixes the first substrate to which the microphone device is bonded. The microphone device has a hollow lid portion having a bottom portion and a second substrate. The second substrate has a sound hole, has a microphone element on the front surface side, and the first side on the back surface side. The lid portion has a through hole, the opening surface located on the opposite side of the bottom portion is in close contact with the surface side of the second substrate, and the fixing member is in close contact with the lid portion to close the through hole. It has a closed hole part.

本発明によるマイク構造では、熱膨張した空気をマイクデバイスの蓋部に予め貫通孔より逃がすため、蓋部の側壁と基板との間などに微小な孔や隙間が形成されることを抑制できる。   In the microphone structure according to the present invention, since the thermally expanded air is escaped from the through hole in advance to the lid portion of the microphone device, it is possible to suppress the formation of minute holes or gaps between the side wall of the lid portion and the substrate.

本発明の一実施の形態によるマイク構造の断面図の一例である。It is an example of sectional drawing of the microphone structure by one embodiment of the present invention. 第２の基板の裏面側の平面図の一例である。It is an example of the top view of the back surface side of a 2nd board | substrate. 蓋部の底部外面の背面図の一例である。It is an example of the rear view of the bottom part outer surface of a cover part.

図１は、本発明の一実施の形態によるマイク構造の断面図の一例である。図１に例示されるマイク構造１は、カメラなどの電子機器に備えられ、マイクデバイス３と、電子機器の第１基板２および固定部材４とを備える。   FIG. 1 is an example of a cross-sectional view of a microphone structure according to an embodiment of the present invention. A microphone structure 1 illustrated in FIG. 1 is provided in an electronic device such as a camera, and includes a microphone device 3, a first substrate 2 of the electronic device, and a fixing member 4.

第１基板２は、マイクデバイス３を少なくとも含む各種素子がはんだ付けされたフレキシブル基板である。第１基板２は、音孔２１１を有し、配線パターンが形成されている。第１基板２の表面側とマイクデバイス３との間には、はんだによる接合部１０１および接合部１０２が存在し、マイクデバイス３を第１基板２の表面側に固定するとともに、マイクデバイス３と第１基板２とを電気的に接続する。図１では、接合部１０２を一つだけ図示したが、接合部１０２の形状や個数は図示したものに限定しない。   The first substrate 2 is a flexible substrate to which various elements including at least the microphone device 3 are soldered. The 1st board | substrate 2 has the sound hole 211, and the wiring pattern is formed. Between the surface side of the first substrate 2 and the microphone device 3, there are a bonding portion 101 and a bonding portion 102 made of solder, and the microphone device 3 is fixed to the surface side of the first substrate 2. The first substrate 2 is electrically connected. In FIG. 1, only one joint 102 is illustrated, but the shape and number of the joints 102 are not limited to those illustrated.

マイクデバイス３は、第２基板３１と蓋部３２とを備える。第２基板３１は音孔３１１を有し、第２基板３１の音孔３１１の中心位置と第１基板２の音孔２１１の中心位置とは略一致し、音孔３１１と音孔２１１とは重なっている。第２基板３１の両面には、グランドパターンなどの配線パターンが形成されている。第２基板３１の裏面側は、接合部１０１や接合部１０２などにより第１基板２の表面側に接合されており、第１基板２と第２基板３１とは電気的に接続されている。   The microphone device 3 includes a second substrate 31 and a lid portion 32. The second substrate 31 has a sound hole 311, and the center position of the sound hole 311 of the second substrate 31 substantially coincides with the center position of the sound hole 211 of the first substrate 2, and the sound hole 311 and the sound hole 211 are overlapping. A wiring pattern such as a ground pattern is formed on both surfaces of the second substrate 31. The back surface side of the second substrate 31 is bonded to the front surface side of the first substrate 2 by the bonding portion 101, the bonding portion 102, and the like, and the first substrate 2 and the second substrate 31 are electrically connected.

図２は、第２基板３１の裏面側を第１基板２の表面側から観察した平面図の一例である。図２では、接合部１０１が音孔３１１の周囲を隙間なく囲んでいる。接合部１０１は、図２と同様に第１基板２の音孔２１１の周囲も囲んでいる。   FIG. 2 is an example of a plan view of the back side of the second substrate 31 observed from the front side of the first substrate 2. In FIG. 2, the joint portion 101 surrounds the sound hole 311 without a gap. The joint portion 101 surrounds the periphery of the sound hole 211 of the first substrate 2 as in FIG.

図１の第２基板３１の表面側に形成された配線パターン上には、マイク素子３１２を少なくとも含む素子が実装されている。マイク素子３１２は、音孔３１１の上に実装されており、不図示の振動板を備えている。マイク素子３１２は、音孔３１１から伝導する音をその振動板で検出し、検出した振動を電気信号に変換し、その電気信号を配線パターンへ出力する。   On the wiring pattern formed on the surface side of the second substrate 31 in FIG. 1, an element including at least the microphone element 312 is mounted. The microphone element 312 is mounted on the sound hole 311 and includes a diaphragm (not shown). The microphone element 312 detects sound conducted from the sound hole 311 with its diaphragm, converts the detected vibration into an electrical signal, and outputs the electrical signal to the wiring pattern.

蓋部３２は、第２基板３１の表面側に実装されているマイク素子３１２などをカバーする。蓋部３２は、底部３２２と側壁３２３とを有し、内部が中空である中空状の形状をしている。たとえば、蓋部３２は、底部３２２の形状が長方形である中空状の直方体である。蓋部３２の底部３２２の対面は開口面であり、その開口面ははんだを用いた接合部３３により第２基板３１の表面側に隙間なく密接されている。側壁３２３は、第２基板３１と密接する開口面と、底部３２２との間に存在する。蓋部３２は、銅や、ニッケル、錫などの金属などの材質でできており、接合部３３を介して第２基板３１のグランドパターンに電気的に接続されており、電磁波からマイク素子３１２等を保護するシールドとしても利用できる。なお、蓋部３２の形状は、底面の対面に位置する開口面を備える中空状の円柱や多角柱であってもよい。   The lid portion 32 covers the microphone element 312 and the like mounted on the surface side of the second substrate 31. The lid portion 32 has a bottom portion 322 and a side wall 323, and has a hollow shape with a hollow inside. For example, the lid portion 32 is a hollow rectangular parallelepiped whose bottom portion 322 has a rectangular shape. The facing surface of the bottom portion 322 of the lid portion 32 is an opening surface, and the opening surface is in close contact with the front surface side of the second substrate 31 by a bonding portion 33 using solder. The side wall 323 exists between the opening surface in close contact with the second substrate 31 and the bottom 322. The lid 32 is made of a material such as copper, nickel, tin, or the like, and is electrically connected to the ground pattern of the second substrate 31 via the joint 33, and from the electromagnetic wave, the microphone element 312 and the like. It can also be used as a shield to protect. In addition, the shape of the cover part 32 may be a hollow cylinder or a polygonal column having an opening surface located opposite to the bottom surface.

蓋部３２の底部３２２には少なくとも一つ以上の空気孔３２１が設けられている。空気孔３２１は、蓋部３２の底部３２２を貫通している。蓋部３２には空気孔３２１以外の孔は無い。マイクデバイス３を第１基板２へはんだ付けするために、接合部１０１や接合部１０２のはんだを溶融させると、第２基板３１と蓋部３２とで囲われた空間に存在する空気は、はんだを溶融させるための熱に温められて膨張する。熱膨張した空気は、空気孔３２１を通過してマイクデバイス３の外部へ逃がされる。   At least one or more air holes 321 are provided in the bottom 322 of the lid portion 32. The air hole 321 passes through the bottom portion 322 of the lid portion 32. The lid portion 32 has no holes other than the air holes 321. In order to solder the microphone device 3 to the first substrate 2, when the solder of the joint portion 101 or the joint portion 102 is melted, the air present in the space surrounded by the second substrate 31 and the lid portion 32 is changed to solder. It expands by being heated by heat for melting it. The thermally expanded air passes through the air hole 321 and escapes to the outside of the microphone device 3.

従来のように蓋部３２に空気孔３２１がない場合、熱膨張した空気がマイクデバイス３の外部へ逃げることができない。この場合、マイクデバイス３を第１基板２へはんだ付けする際に溶融した接合部１０１とその熱によって溶融してしまう接合部３３などに微小な孔や隙間を形成して逃げようとする。この場合、接合部３３や接合部１０１などに形成した微小な孔や隙間から伝導する音（電子機器内部の動作音など）をマイク素子３１２が検出し、ノイズの原因となる。マイクデバイス３のように蓋部３２に空気孔３２１がある場合は、熱膨張した空気が接合部３３や接合部１０１などに与える影響は低減される。   When the lid portion 32 does not have the air hole 321 as in the conventional case, the thermally expanded air cannot escape to the outside of the microphone device 3. In this case, a minute hole or a gap is formed in the joining portion 101 melted when the microphone device 3 is soldered to the first substrate 2 and the joining portion 33 that is melted by the heat, so as to escape. In this case, the microphone element 312 detects a sound (such as an operation sound inside the electronic device) conducted from a minute hole or gap formed in the joint 33, the joint 101, or the like, which causes noise. When the lid 32 has the air hole 321 as in the microphone device 3, the influence of the thermally expanded air on the joint 33, the joint 101, and the like is reduced.

図３は、固定部材４側から底部３２２の外面を観察した平面図の一例である。図３に例示された底部３２２には、円形の空気孔３２１が設けられている。図３に示す空気孔３２１の形状はあくまで一例であって、円形に限らず長方形や楕円などであってもよい。また、空気孔３２１の大きさは、蓋部３２の強度に影響しない程度とする。   FIG. 3 is an example of a plan view in which the outer surface of the bottom portion 322 is observed from the fixing member 4 side. The bottom portion 322 illustrated in FIG. 3 is provided with a circular air hole 321. The shape of the air hole 321 shown in FIG. 3 is merely an example, and is not limited to a circle but may be a rectangle or an ellipse. The size of the air hole 321 is set so as not to affect the strength of the lid portion 32.

固定部材４は、突起部４１を有し、防振ゴムなどの緩衝部材で構成される。突起部４１は、蓋部３２の空気孔３２１に挿入される。固定部材４は、蓋部３２の空気孔３２１がある底部３２２に密接し、第１基板２へはんだ付けした後のマイクデバイス３の空気孔３２１を塞ぐ。これにより、空気孔３２１から伝導する音をマイク素子３１２が検出することを防止する。固定部材４の突起部４１の個数は、蓋部３２の空気孔３２１の個数と一致する。また、複数の突起部４１の位置は、それぞれ複数の空気孔３２１の位置に一致する。   The fixing member 4 has a protrusion 41 and is configured by a buffer member such as a vibration-proof rubber. The protruding portion 41 is inserted into the air hole 321 of the lid portion 32. The fixing member 4 is in close contact with the bottom portion 322 where the air holes 321 of the lid portion 32 are provided, and closes the air holes 321 of the microphone device 3 after being soldered to the first substrate 2. This prevents the microphone element 312 from detecting sound conducted from the air hole 321. The number of protrusions 41 of the fixing member 4 matches the number of air holes 321 of the lid portion 32. Further, the positions of the plurality of protrusions 41 coincide with the positions of the plurality of air holes 321 respectively.

マイクデバイス３を接合された第１基板２を電子機器へ装着するとき、たとえば電子機器に備わる固定部材４と、電子機器の外面５との間に挟みこむ。固定部材４は、電子機器中での位置が予め定められており、その固定部材４の突起部４１を空気孔３２１に挿入して嵌合させることにより、マイクデバイス３を備えた第１基板２の取り付け位置を適切に指定することができる。電子機器の外面５にも音孔５１１があり、空気孔３２１への固定部材４の突起部４１を挿入することにより、音孔５１１の中心位置が第１基板２の音孔２１１の中心位置と略一致するようにマイクデバイス３を備えた第１基板２の取り付け位置が指定される。なお、マイク素子３１２が音孔５１１を伝導した音だけを検出するようにするため、第１基板２の裏面は外面５と密着させる。なお、外面５と第１基板２とは、より密着させるために間にゴムなどを挟んでもよい。   When the first substrate 2 to which the microphone device 3 is bonded is attached to the electronic device, for example, the first substrate 2 is sandwiched between the fixing member 4 provided in the electronic device and the outer surface 5 of the electronic device. The position of the fixing member 4 in the electronic device is determined in advance, and the first substrate 2 provided with the microphone device 3 by inserting and fitting the protrusion 41 of the fixing member 4 into the air hole 321. The attachment position of can be designated appropriately. There is also a sound hole 511 on the outer surface 5 of the electronic device. By inserting the protrusion 41 of the fixing member 4 into the air hole 321, the center position of the sound hole 511 is changed to the center position of the sound hole 211 of the first substrate 2. The attachment position of the first substrate 2 provided with the microphone device 3 is designated so as to substantially match. Note that the back surface of the first substrate 2 is in close contact with the outer surface 5 so that the microphone element 312 detects only the sound conducted through the sound hole 511. In addition, rubber | gum etc. may be pinched | interposed between the outer surface 5 and the 1st board | substrate 2 in order to make it contact | adhere more.

以上で説明した実施の形態によれば、以下の作用効果が得られる。
マイク構造１は、マイクデバイス３と、マイクデバイス３がはんだ付けされる第１基板２と、マイクデバイス３がはんだ付けされた第１基板２を固定する固定部材４とを備える。マイクデバイス３は、第２基板３１と底部３２２を備える中空状の蓋部３２とを有する。第２基板３１は、音孔３１１を有し、表面側にマイク素子３１２を有し、裏面側が第１基板にはんだ付けされる（接合部１０１および接合部１０２）。蓋部３２は、空気孔３２１を有し、蓋部３２の底部３２２の対面に位置する開口面が第２基板３１の表面側に密接される。固定部材４は、蓋部３２に密接して突起部４１とその周辺とで空気孔３２１を塞ぐ。このようにマイクデバイス３の蓋部３２に予め空気孔３２１が設けられているため、マイクデバイス３を第１基板２へはんだ付けする際に、熱膨張されたマイクデバイス内の空気を外部へ逃がすことができる。熱膨張された空気により蓋部３２の側壁３２３と第２基板３１との間の接合部３３やマイクデバイス３と第１基板２との間の接合部１０１などに微小な孔や隙間が形成されることが抑制される。 According to the embodiment described above, the following operational effects can be obtained.
The microphone structure 1 includes a microphone device 3, a first substrate 2 to which the microphone device 3 is soldered, and a fixing member 4 that fixes the first substrate 2 to which the microphone device 3 is soldered. The microphone device 3 has a second substrate 31 and a hollow lid portion 32 having a bottom portion 322. The second substrate 31 has a sound hole 311, has a microphone element 312 on the front surface side, and is soldered to the first substrate on the back surface side (the joint portion 101 and the joint portion 102). The lid portion 32 has air holes 321, and an opening surface located on the opposite side of the bottom portion 322 of the lid portion 32 is in close contact with the surface side of the second substrate 31. The fixing member 4 is in close contact with the lid portion 32 and closes the air hole 321 with the protrusion 41 and the periphery thereof. As described above, since the air hole 321 is provided in the lid portion 32 of the microphone device 3 in advance, when the microphone device 3 is soldered to the first substrate 2, the air in the thermally expanded microphone device is released to the outside. be able to. By the thermally expanded air, minute holes or gaps are formed in the joint portion 33 between the side wall 323 of the lid portion 32 and the second substrate 31, the joint portion 101 between the microphone device 3 and the first substrate 2, or the like. Is suppressed.

以上で説明した実施形態は、以下のように変形して実施できる。
空気孔３２１は、蓋部３２の底部３２２にあるとものとしたが、側壁３２３にあるものとしてもよい。空気孔３２１が蓋部３２の側壁３２３にある場合は、固定部材４は複数の突起部にて蓋部３２を挟み込むとともに、当該突起部にて空気孔３２１を塞ぐようにすればよい。 The embodiment described above can be implemented with the following modifications.
Although the air hole 321 is assumed to be in the bottom part 322 of the lid part 32, it may be in the side wall 323. When the air hole 321 is in the side wall 323 of the lid portion 32, the fixing member 4 may sandwich the lid portion 32 with a plurality of protrusions and close the air hole 321 with the protrusions.

図１〜図３に例示した第１基板２や、第２基板３１、蓋部３２、音孔２１１、音孔３１１、音孔５１１、空気孔３２１、接合部１０１、接合部１０２の形状などは、あくまで一例であり、発明の特徴が損なわれない限り、本発明はこれらの内容に限定されない。また、接合部３３は、はんだによる接合としたが、接着剤の場合にも適用できる。固定部材４の突起部４１は存在しなくても、空気孔３２１を塞ぐ塞孔部が存在すれば、接合部３３や接合部１０１などに微小な孔や隙間が形成されることを抑制する効果が得られる。   The shape of the 1st board | substrate 2 illustrated in FIGS. 1-3, the 2nd board | substrate 31, the cover part 32, the sound hole 211, the sound hole 311, the sound hole 511, the air hole 321, the junction part 101, the junction part 102, etc. However, these are merely examples, and the present invention is not limited to these contents as long as the characteristics of the invention are not impaired. Moreover, although the junction part 33 was joined by solder, it is applicable also in the case of an adhesive agent. Even if the protrusion 41 of the fixing member 4 does not exist, the effect of suppressing the formation of minute holes or gaps in the joint 33, the joint 101, etc., if there is a closed hole that closes the air hole 321. Is obtained.

以上で説明した各実施の形態や各種の変形例はあくまで一例であり、発明の特徴が損なわれない限り、本発明はこれらの内容に限定されない。   Each embodiment and various modifications described above are merely examples, and the present invention is not limited to these contents as long as the features of the invention are not impaired.

１ マイク構造
２ 第１基板
３ マイクデバイス
４ 固定部材
３１ 第２基板
３２ 蓋部
３３，１０１，１０２ 接合部
４１ 突起部
２１１，３１１，５１１ 音孔
３１２ マイク素子
３２１ 空気孔 DESCRIPTION OF SYMBOLS 1 Microphone structure 2 1st board | substrate 3 Microphone device 4 Fixing member 31 2nd board | substrate 32 Lid part 33,101,102 Joint part 41 Projection part 211,311,511 Sound hole 312 Microphone element 321 Air hole

Claims (5)

マイクデバイスと、前記マイクデバイスが接合される第１の基板と、前記マイクデバイスが接合された前記第１の基板を固定する固定部材とを備えるマイク構造であって、
前記マイクデバイスは、底部を備える中空状の蓋部と、第２の基板とを有し、
前記第２の基板は、音孔を有し、表面側にマイク素子を有し、裏面側が前記第１の基板に接合され、
前記蓋部は、貫通孔を有し、前記底部の対面に位置する開口面が前記第２の基板の表面側に密接し、
前記固定部材は、前記蓋部に密接して前記貫通孔を塞ぐ塞孔部を有することを特徴とするマイク構造。 A microphone structure comprising: a microphone device; a first substrate to which the microphone device is bonded; and a fixing member that fixes the first substrate to which the microphone device is bonded;
The microphone device has a hollow lid portion having a bottom portion and a second substrate,
The second substrate has sound holes, a microphone element on the front surface side, and a back surface side bonded to the first substrate,
The lid portion has a through hole, and an opening surface located on the opposite side of the bottom portion is in close contact with the surface side of the second substrate,
The microphone structure according to claim 1, wherein the fixing member has a closed hole portion that closes the lid portion and closes the through hole. 請求項１に記載のマイク構造において、
前記貫通孔は、前記底部に設けられており、
前記塞孔部は、前記底部に密接して前記貫通孔を塞ぐことを特徴とするマイク構造。 The microphone structure according to claim 1,
The through hole is provided in the bottom,
The microphone structure according to claim 1, wherein the closing hole closes the through hole in close contact with the bottom. 請求項１または２に記載のマイク構造において、
前記塞孔部は、前記貫通孔に挿入する突起部を有することを特徴とするマイク構造。 The microphone structure according to claim 1 or 2,
2. The microphone structure according to claim 1, wherein the closing hole portion has a protrusion portion that is inserted into the through hole. 請求項１から３のいずれか一項に記載のマイク構造において、
前記蓋部は、前記第２の基板と密接した前記開口面を介して前記第２の基板と電気的に接続されることを特徴とするマイク構造。 The microphone structure according to any one of claims 1 to 3,
The microphone structure according to claim 1, wherein the lid portion is electrically connected to the second substrate through the opening surface in close contact with the second substrate. 請求項１から４のいずれか一項に記載のマイク構造を備える電子機器であって、
前記固定部材は、前記電子機器の一部であって、
前記マイクデバイスが接合された前記第１の基板の取り付け位置を、前記塞孔部により指定する位置指定手段を備えることを特徴とする電子機器。 An electronic device comprising the microphone structure according to any one of claims 1 to 4,
The fixing member is a part of the electronic device,
An electronic apparatus comprising: a position designating unit that designates an attachment position of the first substrate to which the microphone device is bonded by the obturator.
JP2011267900A 2011-12-07 2011-12-07 Microphone structure and electronic component Pending JP2013121059A (en)

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