TWI491337B - Composite hole structure - Google Patents
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- TWI491337B TWI491337B TW102117948A TW102117948A TWI491337B TW I491337 B TWI491337 B TW I491337B TW 102117948 A TW102117948 A TW 102117948A TW 102117948 A TW102117948 A TW 102117948A TW I491337 B TWI491337 B TW I491337B
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Description
本發明是有關於一種複合孔結構。The present invention is directed to a composite pore structure.
一般的電子產品之機身通常設置有開口，用以讓電子產品之功能元件(如麥克風或喇叭)與外界互通訊息(如聲音)。而目前的一般防水性電子產品通常會在機身開口處貼上防水膜，以避免水進入主機內。不過雖然水不會滲進主機內，卻可能會殘留在開口內，反而會造成訊息傳遞的阻礙。再加上一般的開口之尺寸會設計地較小，以防止異物戳入開口而破壞功能元件，如此一來，只要水殘留在開口中，就很難以外力將水甩出。The body of a general electronic product is usually provided with an opening for allowing functional components of the electronic product (such as a microphone or a speaker) to communicate with the outside world (such as sound). At present, general waterproof electronic products usually have a waterproof film attached to the opening of the body to prevent water from entering the main body. However, although the water will not penetrate into the host, it may remain in the opening, which may cause obstacles in message transmission. In addition, the size of the general opening is designed to be small to prevent foreign matter from penetrating into the opening to damage the functional element, so that as long as water remains in the opening, it is difficult to force the water out.
本發明之一態樣提供一種複合孔結構，應用於電子裝置。複合孔結構包含外層結構、功能元件、內層結構與疏水透氣膜層。外層結構具有排水孔。內層結構位於外層結構與功能元件之間，且固定於外層結構上。內層結構具有至少一功能孔，功能孔的尺寸小於排水孔的尺寸，且功 能孔於垂直方向與排水孔重疊。疏水透氣膜層置於外層結構與內層結構之間，用以間隔排水孔與功能孔。One aspect of the present invention provides a composite aperture structure for use in an electronic device. The composite pore structure comprises an outer layer structure, a functional element, an inner layer structure and a hydrophobic gas permeable membrane layer. The outer structure has drainage holes. The inner layer structure is located between the outer layer structure and the functional element and is fixed to the outer layer structure. The inner layer structure has at least one functional hole, and the size of the functional hole is smaller than the size of the drainage hole, and the work The energy hole overlaps the drain hole in the vertical direction. A hydrophobic gas permeable membrane layer is interposed between the outer layer structure and the inner layer structure for spacing the drainage holes and the functional holes.
在一或多個實施方式中，外層結構為殼體，且內層結構為壓板。In one or more embodiments, the outer layer structure is a shell and the inner layer structure is a pressure plate.
在一或多個實施方式中，複合孔結構更包含至少一密封膠，環繞內層結構且連接內層結構與外層結構。In one or more embodiments, the composite pore structure further comprises at least one sealant surrounding the inner layer structure and connecting the inner layer structure and the outer layer structure.
在一或多個實施方式中，外層結構為壓板，且內層結構為殼體。In one or more embodiments, the outer layer structure is a pressure plate and the inner layer structure is a housing.
在一或多個實施方式中，內層結構具有凹槽，外層結構位於凹槽中。In one or more embodiments, the inner layer structure has a groove and the outer layer structure is located in the groove.
在一或多個實施方式中，外層結構具有排水面。排水面環繞排水孔，且排水面與疏水透氣膜層之間相夾有一銳角。In one or more embodiments, the outer layer structure has a drainage surface. The drainage surface surrounds the drainage hole, and an acute angle is formed between the drainage surface and the hydrophobic gas permeable membrane layer.
在一或多個實施方式中，複合孔結構更包含背膠，置於內層結構與疏水透氣膜層之間。In one or more embodiments, the composite pore structure further comprises a backing, disposed between the inner layer structure and the hydrophobic gas permeable membrane layer.
在一或多個實施方式中，複合孔結構更包含背膠，置於外層結構與疏水透氣膜層之間In one or more embodiments, the composite pore structure further comprises a backing, disposed between the outer layer structure and the hydrophobic gas permeable membrane layer
在一或多個實施方式中，複合孔結構更包含背膠，置於內層結構與外層結構之間。In one or more embodiments, the composite pore structure further comprises a backing, disposed between the inner layer structure and the outer layer structure.
在一或多個實施方式中，功能孔的數量為複數個，且功能孔於外層結構上的垂直投影皆位於排水孔內。In one or more embodiments, the number of functional apertures is plural, and the vertical projections of the functional apertures on the outer structure are all located within the drainage aperture.
上述之複合孔結構能夠防止水滲入電子裝置的內部。而排水孔可改善水分殘留的問題。另一方面，因功能孔的尺寸小於排水孔的尺寸，因此功能孔亦能夠減少異物 戳入電子裝置的機會，以達到保護功能元件的目的。The above composite pore structure can prevent water from penetrating into the interior of the electronic device. The drain hole improves the problem of moisture retention. On the other hand, since the size of the function hole is smaller than the size of the drain hole, the function hole can also reduce foreign matter. The opportunity to poke into the electronic device to achieve the purpose of protecting the functional components.
100‧‧‧複合孔結構100‧‧‧Composite pore structure
110‧‧‧外層結構110‧‧‧ outer structure
112‧‧‧排水孔112‧‧‧Drainage holes
114‧‧‧排水面114‧‧‧Drainage surface
120‧‧‧功能元件120‧‧‧Functional components
130‧‧‧內層結構130‧‧‧ Inner structure
132‧‧‧功能孔132‧‧‧ function hole
134‧‧‧凹槽134‧‧‧ Groove
140‧‧‧疏水透氣膜層140‧‧‧Drainable gas permeable membrane
150、160、180‧‧‧背膠150, 160, 180‧‧‧ Back adhesive
170‧‧‧密封膠170‧‧‧Sealant
190‧‧‧導引件190‧‧‧Guide
192‧‧‧導引通道192‧‧‧ Guide channel
200‧‧‧電路板200‧‧‧ boards
2-2、4-4、6-6、8-8‧‧‧線段Lines 2-2, 4-4, 6-6, 8-8‧‧
θ‧‧‧角Θ‧‧‧ corner
第1圖繪示依照本發明第一實施方式之電子裝置的立體圖。1 is a perspective view of an electronic device in accordance with a first embodiment of the present invention.
第2圖繪示沿第1圖之線段2-2的剖面圖。Figure 2 is a cross-sectional view taken along line 2-2 of Figure 1.
第3圖繪示依照本發明第二實施方式之電子裝置的立體圖。3 is a perspective view of an electronic device in accordance with a second embodiment of the present invention.
第4圖其繪示沿第3圖之線段4-4的剖面圖。Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3.
第5圖繪示依照本發明第三實施方式之電子裝置的立體圖。Figure 5 is a perspective view of an electronic device in accordance with a third embodiment of the present invention.
第6圖其繪示沿第5圖之線段6-6的剖面圖。Figure 6 is a cross-sectional view taken along line 6-6 of Figure 5.
第7圖繪示依照本發明第四實施方式之電子裝置的立體圖。FIG. 7 is a perspective view of an electronic device according to a fourth embodiment of the present invention.
第8圖其繪示沿第7圖之線段8-8的剖面圖。Figure 8 is a cross-sectional view taken along line 8-8 of Figure 7.
以下將以圖式揭露本發明的複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
請參照第1圖，其繪示依照本發明第一實施方式之電子裝置的立體圖。電子裝置包含複合孔結構100。複合孔結構100用以讓電子裝置內之功能元件與外界互通訊息，同時亦可防止水進入電子裝置內部，並進一步達到排水目的。Please refer to FIG. 1 , which is a perspective view of an electronic device according to a first embodiment of the present invention. The electronic device includes a composite aperture structure 100. The composite hole structure 100 is used for allowing functional components in the electronic device to communicate with the outside world, and also prevents water from entering the interior of the electronic device and further achieving drainage purposes.
請參照第2圖，其繪示沿第1圖之線段2-2的剖面圖。如圖所示，複合孔結構100包含外層結構110、功能元件120、內層結構130與疏水透氣膜層140。外層結構110具有排水孔112，其中排水孔112例如為圓形孔。內層結構130位於外層結構110與功能元件120之間，且固定於外層結構110上。內層結構130具有至少一功能孔132，其中功能孔132例如為圓形孔。功能孔132的尺寸小於排水孔112的尺寸，且功能孔132於垂直方向與排水孔112重疊，其中垂直方向係定義為疏水透氣膜層140之法線方向。疏水透氣膜層140置於外層結構110與內層結構130之間，用以間隔排水孔112與功能孔132。其中疏水透氣膜層140例如可以是防水膜或具低表面能之膜層，且其材質例如可為膨体聚四氟乙烯(ePTFE)或其他可形成微孔隙之材料，以達到疏水的效果。Please refer to FIG. 2, which is a cross-sectional view taken along line 2-2 of FIG. 1. As shown, the composite aperture structure 100 includes an outer layer structure 110, a functional element 120, an inner layer structure 130, and a hydrophobic gas permeable membrane layer 140. The outer layer structure 110 has a drain hole 112, wherein the drain hole 112 is, for example, a circular hole. The inner layer structure 130 is located between the outer layer structure 110 and the functional element 120 and is fixed to the outer layer structure 110. The inner structure 130 has at least one functional aperture 132, wherein the functional aperture 132 is, for example, a circular aperture. The size of the functional aperture 132 is smaller than the size of the drainage aperture 112, and the functional aperture 132 overlaps the drainage aperture 112 in a vertical direction, wherein the vertical direction is defined as the normal direction of the hydrophobic gas permeable membrane layer 140. A hydrophobic gas permeable membrane layer 140 is disposed between the outer layer structure 110 and the inner layer structure 130 for spacing the drain holes 112 from the functional holes 132. The hydrophobic gas permeable membrane layer 140 may be, for example, a waterproof membrane or a membrane layer having a low surface energy, and the material thereof may be, for example, expanded polytetrafluoroethylene (ePTFE) or other microporous material to achieve a hydrophobic effect.
在本實施方式中，複合孔結構100之功能元件120可為麥克風，因疏水透氣膜層140具透氣性，外界的聲音可依序通過排水孔112、疏水透氣膜層140與功能孔132而到達麥克風，因此複合孔結構100可達成與外界互通訊息、的功效。然而因疏水透氣膜層140的疏水性，因此水無 法穿透疏水透氣膜層140而到達電子裝置的內部。再加上排水孔112的存在，使得殘留在疏水透氣膜層140上的水能夠沿著排水孔112的邊緣排出，以改善水分殘留的問題。另一方面，因功能孔132的尺寸小於排水孔112的尺寸，因此功能孔132亦能夠減少異物戳入電子裝置的機會，以達到保護麥克風的目的。In the present embodiment, the functional component 120 of the composite hole structure 100 can be a microphone. Since the hydrophobic gas permeable membrane layer 140 is gas permeable, external sound can be sequentially passed through the drainage hole 112, the hydrophobic gas permeable membrane layer 140 and the functional hole 132. The microphone, therefore, the composite hole structure 100 can achieve the effect of mutual communication with the outside world. However, due to the hydrophobicity of the hydrophobic gas permeable membrane layer 140, the water is not The method penetrates the hydrophobic gas permeable membrane layer 140 to reach the interior of the electronic device. In addition, the presence of the drain hole 112 allows water remaining on the hydrophobic gas permeable membrane layer 140 to be discharged along the edge of the drain hole 112 to improve the problem of moisture retention. On the other hand, since the size of the function hole 132 is smaller than the size of the drain hole 112, the function hole 132 can also reduce the chance of foreign matter being poked into the electronic device for the purpose of protecting the microphone.
在本實施方式中，外層結構110可為電子裝置之殼體，而內層結構130可為壓板。換言之，從電子裝置的外觀來看，僅能夠看到殼體、排水孔112與疏水透氣膜層140，而壓板則被殼體隱藏在電子裝置內部。如此的設計不但具有美觀的優點，且殼體亦能夠保護壓板，使得壓板不易受到外界的破壞。In the present embodiment, the outer layer structure 110 can be a housing of an electronic device, and the inner layer structure 130 can be a pressure plate. In other words, from the appearance of the electronic device, only the casing, the drain hole 112 and the hydrophobic gas permeable membrane layer 140 can be seen, and the pressure plate is hidden inside the electronic device by the casing. Such a design not only has the aesthetic advantage, but also the housing can protect the pressure plate, so that the pressure plate is not easily damaged by the outside.
在一或多個實施方式中，為了幫助排水，外層結構110可具有排水面114。排水面114環繞排水孔112，且排水面114與疏水透氣膜層140相夾有一銳角θ。排水面114可以減少排水孔112產生毛細現象的機會，因此可降低水殘留在排水孔112中的機率。而就算仍有部分的水殘留在排水孔112中，只要稍微將電子裝置傾斜，排水孔112中的水便能夠順著排水面114流出。In one or more embodiments, to aid drainage, the outer layer structure 110 can have a drainage surface 114. The drainage surface 114 surrounds the drainage hole 112, and the drainage surface 114 and the hydrophobic gas permeable membrane layer 140 are sandwiched by an acute angle θ. The drainage surface 114 can reduce the chance of the capillary hole 112 generating a capillary phenomenon, thereby reducing the probability of water remaining in the drainage hole 112. Even if a part of the water remains in the drain hole 112, the water in the drain hole 112 can flow out along the drain surface 114 as long as the electronic device is tilted slightly.
在一或多個實施方式中，複合孔結構100可包含背膠150與160。背膠150置於內層結構130與疏水透氣膜層140之間，而背膠160置於內層結構130與外層結構110之間。詳細而言，可選擇使用背膠150與160以將內層結構130與疏水透氣膜層140固定於外層結構110上。例如 可先將疏水透氣膜層140以背膠150固定於內層結構130上，接著再將已貼合疏水透氣膜層140之內層結構130以背膠160固定於外層結構110上，以完成複合孔結構100之製作。In one or more embodiments, the composite aperture structure 100 can include backings 150 and 160. The topping 150 is placed between the inner layer structure 130 and the hydrophobic gas permeable film layer 140, and the backing 160 is placed between the inner layer structure 130 and the outer layer structure 110. In detail, the backings 150 and 160 may be optionally used to secure the inner layer structure 130 and the hydrophobic gas permeable film layer 140 to the outer layer structure 110. E.g The hydrophobic gas permeable membrane layer 140 can be first fixed on the inner layer structure 130 with the backing 150, and then the inner layer structure 130 of the laminated hydrophobic gas permeable membrane layer 140 is fixed on the outer layer structure 110 with the adhesive 160 to complete the compounding. Fabrication of the pore structure 100.
雖然本實施方式之外層結構110、內層結構130與疏水透氣膜層140使用背膠150與160以固定其位置，然而在其他的實施方式中，亦可以不同的方式固定。舉例而言，疏水透氣膜層140亦可以熱熔方式固定於內層結構130上，而內層結構130也可以熱熔、超音波或點膠等方式固定於外層結構110上。換句話說，疏水透氣膜層140固定於內層結構130的方法，可與內層結構130固定於外層結構110之方法不同。舉例而言，疏水透氣膜層140可先以背膠150固定於內層結構130，內層結構130再以超音波方式固定於外層結構110上，然而本發明不以此為限。Although the outer layer structure 110, the inner layer structure 130, and the hydrophobic gas permeable film layer 140 of the present embodiment use the backings 150 and 160 to fix their positions, in other embodiments, they may be fixed in different manners. For example, the hydrophobic gas permeable membrane layer 140 can also be fixed to the inner layer structure 130 by means of hot melt, and the inner layer structure 130 can also be fixed to the outer layer structure 110 by means of hot melt, ultrasonic or dispensing. In other words, the method of fixing the hydrophobic gas permeable membrane layer 140 to the inner layer structure 130 may be different from the method of fixing the inner layer structure 130 to the outer layer structure 110. For example, the hydrophobic gas permeable membrane layer 140 may be first fixed to the inner layer structure 130 by the adhesive 150, and the inner layer structure 130 is ultrasonically fixed to the outer layer structure 110, but the invention is not limited thereto.
然而複合孔結構100之外層結構110、內層結構130與疏水透氣膜層140的組合方式不以上述之順序為限。在其他的實施方式中，疏水透氣膜層140可選擇先以背膠或熱熔方式固定於外層結構110上，接著內層結構130再以背膠、熱熔、超音波或點膠等方式固定於外層結構110上，亦可達到組合的目的。However, the combination of the outer layer structure 110, the inner layer structure 130 and the hydrophobic gas permeable membrane layer 140 of the composite pore structure 100 is not limited to the above order. In other embodiments, the hydrophobic gas permeable membrane layer 140 may be first fixed to the outer layer structure 110 by adhesive or hot melt, and then the inner layer structure 130 is fixed by adhesive, hot melt, ultrasonic or dispensing. On the outer structure 110, the purpose of the combination can also be achieved.
在一或多個實施方式中，為了更進一步達到防水的效果，複合孔結構100可更包含至少一密封膠170，環繞內層結構130且連接內層結構130與外層結構110。密封膠170可防止水從外層結構110與內層結構130之間的縫隙滲 入電子裝置的內部，亦可加強內層結構130於外層結構110的結構固定強度，以防止內層結構130自外層結構110脫落。In one or more embodiments, in order to further achieve the waterproof effect, the composite hole structure 100 may further include at least one sealant 170 surrounding the inner layer structure 130 and connecting the inner layer structure 130 and the outer layer structure 110. The sealant 170 prevents water from seeping from the gap between the outer layer structure 110 and the inner layer structure 130. Into the inside of the electronic device, the structural fixing strength of the inner layer structure 130 to the outer layer structure 110 can also be strengthened to prevent the inner layer structure 130 from falling off from the outer layer structure 110.
在一或多個實施方式中，電子裝置可更包含電路板200，與功能元件120電性連接。以第2圖而言，功能元件120例如可設置於電路板200上，且功能元件120置於電路板200與內層結構130之間，然而本發明不以上述之結構為限。In one or more embodiments, the electronic device may further include a circuit board 200 electrically connected to the functional component 120. In the second diagram, the functional component 120 can be disposed on the circuit board 200, for example, and the functional component 120 is disposed between the circuit board 200 and the inner layer structure 130. However, the present invention is not limited to the above structure.
另外，複合孔結構100可更包含導引件190，置於內層結構130與功能元件120之間。導引件190具有一導引通道192，於垂直方向與功能孔132相對齊，因此訊息能夠在導引通道192中傳遞，使得功能孔132與功能元件120之間的訊息傳遞更有效率。導引件190的材質例如可為橡膠，但本發明不以此為限。Additionally, the composite aperture structure 100 can further include a guide 190 disposed between the inner layer structure 130 and the functional component 120. The guiding member 190 has a guiding passage 192 which is aligned with the function hole 132 in the vertical direction, so that the message can be transmitted in the guiding passage 192, so that the information transmission between the function hole 132 and the functional element 120 is more efficient. The material of the guiding member 190 can be rubber, for example, but the invention is not limited thereto.
接著請同時參照第3圖與第4圖，其中第3圖繪示依照本發明第二實施方式之電子裝置的立體圖。第4圖其繪示沿第3圖之線段4-4的剖面圖。本實施方式與第一實施方式之不同處在於外層結構110與內層結構130的類型以及缺少密封膠170(如第2圖所繪示)。在本實施方式中，外層結構110可為壓板，而內層結構130可為殼體。換言之，從電子裝置的外觀來看，能夠看到壓板、排水孔112、殼體與疏水透氣膜層140。如此的設計不但方便製作，且若後續需進行維修，不需將電子裝置之殼體拆開即可維修，因此具有方便維修之優點。Next, please refer to FIG. 3 and FIG. 4 simultaneously, wherein FIG. 3 is a perspective view of the electronic device according to the second embodiment of the present invention. Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3. This embodiment differs from the first embodiment in the type of outer layer structure 110 and inner layer structure 130 and the lack of sealant 170 (as depicted in FIG. 2). In the present embodiment, the outer layer structure 110 can be a pressure plate and the inner layer structure 130 can be a housing. In other words, from the appearance of the electronic device, the platen, the drain hole 112, the casing, and the hydrophobic gas permeable membrane layer 140 can be seen. Such a design is not only convenient to manufacture, but if it needs to be repaired later, the housing of the electronic device can be repaired without being disassembled, so that it has the advantage of convenient maintenance.
在一或多個實施方式中，內層結構130(在本實施方式中為殼體)可具有一凹槽134，且外層結構110(在本實施方式中為壓板)位於凹槽134中。如圖所示，當壓板位於凹槽134中時，壓板的上表面可選擇與殼體的上表面位於同一虛擬平面上，如此不但兼具美觀，而且壓板也不容易被扳開而導致脫落。In one or more embodiments, the inner layer structure 130 (in the present embodiment, the housing) can have a recess 134 and the outer layer structure 110 (in the present embodiment, a pressure plate) is located in the recess 134. As shown, when the pressure plate is located in the recess 134, the upper surface of the pressure plate can be selected to be on the same virtual plane as the upper surface of the housing, so that not only is the appearance attractive, but also the pressure plate is not easily pulled apart to cause falling off.
在一或多個實施方式中，複合孔結構100可包含背膠160與180。背膠180置於外層結構110與疏水透氣膜層140之間，而背膠160置於內層結構130與外層結構110之間。詳細而言，可選擇使用背膠180與160以將外層結構110與疏水透氣膜層140固定於內層結構130上。例如可先將疏水透氣膜層140以背膠180固定於外層結構110上，接著再將已貼合疏水透氣膜層140之外層結構110以背膠160固定於內層結構130上，以完成複合孔結構100之製作。In one or more embodiments, the composite aperture structure 100 can include backings 160 and 180. The backing 180 is placed between the outer layer structure 110 and the hydrophobic gas permeable film layer 140, and the backing 160 is placed between the inner layer structure 130 and the outer layer structure 110. In detail, the backings 180 and 160 may be optionally used to secure the outer layer structure 110 and the hydrophobic gas permeable film layer 140 to the inner layer structure 130. For example, the hydrophobic gas permeable membrane layer 140 can be first fixed on the outer layer structure 110 with the backing 180, and then the outer layer structure 110 of the laminated hydrophobic gas permeable membrane layer 140 is fixed on the inner layer structure 130 with the adhesive 160 to complete the compounding. Fabrication of the pore structure 100.
雖然本實施方式之外層結構110、內層結構130與疏水透氣膜層140使用背膠160與180以固定其位置，然而在其他的實施方式中，亦可以不同的方式固定。舉例而言，疏水透氣膜層140亦可以熱熔方式固定於外層結構110上，而外層結構110也可以熱熔、超音波或點膠等方式固定於內層結構130上。換句話說，疏水透氣膜層140固定於外層結構110的方法，可與外層結構110固定於內層結構130之方法不同。舉例而言，疏水透氣膜層140可先以背膠180固定於外層結構110，外層結構110再以超音波方 式固定於內層結構130上，然而本發明不以此為限。Although the outer layer structure 110, the inner layer structure 130, and the hydrophobic gas permeable film layer 140 of the present embodiment use the backings 160 and 180 to fix their positions, in other embodiments, they may be fixed in different manners. For example, the hydrophobic gas permeable membrane layer 140 can also be fixed to the outer layer structure 110 by hot melt, and the outer layer structure 110 can also be fixed to the inner layer structure 130 by means of hot melt, ultrasonic or dispensing. In other words, the method of securing the hydrophobic gas permeable membrane layer 140 to the outer layer structure 110 can be different from the method of securing the outer layer structure 110 to the inner layer structure 130. For example, the hydrophobic gas permeable membrane layer 140 may be first fixed to the outer layer structure 110 with a backing 180, and the outer layer structure 110 may be ultrasonically The formula is fixed to the inner structure 130, but the invention is not limited thereto.
在其他的實施方式中，複合孔結構100之外層結構110、內層結構130與疏水透氣膜層140的組合方式不以上述之順序為限。疏水透氣膜層140可選擇先以背膠或熱熔方式固定於內層結構130上，接著外層結構110再以背膠、熱熔、超音波或點膠等方式固定於內層結構130上，亦可達到組合的目的。至於本實施方式之其他細節因與第一實施方式相同，因此便不再贅述。In other embodiments, the combination of the outer layer structure 110, the inner layer structure 130, and the hydrophobic gas permeable membrane layer 140 of the composite pore structure 100 is not limited to the above order. The hydrophobic gas permeable membrane layer 140 may be first fixed to the inner layer structure 130 by backing or hot melt, and then the outer layer structure 110 is fixed on the inner layer structure 130 by means of backing, hot melting, ultrasonic or dispensing. It can also achieve the purpose of the combination. Other details of the present embodiment are the same as those of the first embodiment, and thus will not be described again.
接著請同時參照第5圖與第6圖，其中第5圖繪示依照本發明第三實施方式之電子裝置的立體圖。第6圖其繪示沿第5圖之線段6-6的剖面圖。本實施方式與第一實施方式之不同處在於功能元件120的類型、功能孔132的數量以及缺少密封膠170(如第2圖所繪示)。在本實施方式中，功能元件120可為另一種收音孔一一收話元件。為了使收話品質更佳，功能孔132的數量可為複數個，而功能孔132可為長條形，且功能孔132於外層結構110上的垂直投影皆位於排水孔112內。因此外界的聲音可依序自排水孔112、疏水透氣膜層140與複數個功能孔132而到達收話元件。其中在本實施方式中，排水孔112可為橢圓形，然而本發明不以此為限。Next, please refer to FIG. 5 and FIG. 6 simultaneously, wherein FIG. 5 is a perspective view of the electronic device according to the third embodiment of the present invention. Figure 6 is a cross-sectional view taken along line 6-6 of Figure 5. The difference between this embodiment and the first embodiment lies in the type of functional element 120, the number of functional apertures 132, and the lack of sealant 170 (as depicted in FIG. 2). In the present embodiment, the functional component 120 can be another sound receiving hole and a receiving component. In order to improve the quality of the call, the number of the function holes 132 may be plural, and the function holes 132 may be elongated, and the vertical projections of the function holes 132 on the outer structure 110 are all located in the drain holes 112. Therefore, the external sound can be sequentially discharged from the drainage hole 112, the hydrophobic gas permeable membrane layer 140, and the plurality of functional holes 132 to the receiving element. In the present embodiment, the drain hole 112 may be elliptical, but the invention is not limited thereto.
在一或多個實施方式中，複合孔結構100可包含背膠150與180。背膠150置於內層結構130與疏水透氣膜層140之間，而背膠180置於外層結構110與疏水透氣膜層140之間。詳細而言，可選擇使用背膠150與180以將內層 結構130與疏水透氣膜層140固定於外層結構110上。例如可先將疏水透氣膜層140以背膠150固定於內層結構130上，接著再將已貼合內層結構130之疏水透氣膜層140以背膠180固定於外層結構110上，以完成複合孔結構100之製作。In one or more embodiments, the composite aperture structure 100 can include backings 150 and 180. The backing 150 is placed between the inner layer structure 130 and the hydrophobic gas permeable film layer 140, and the backing 180 is placed between the outer layer structure 110 and the hydrophobic gas permeable film layer 140. In detail, you can choose to use the adhesive 150 and 180 to the inner layer. Structure 130 and hydrophobic gas permeable membrane layer 140 are secured to outer layer structure 110. For example, the hydrophobic gas permeable membrane layer 140 can be first fixed on the inner layer structure 130 with the backing 150, and then the hydrophobic gas permeable membrane layer 140 of the inner layer structure 130 can be fixed on the outer layer structure 110 with the adhesive 180 to complete. Fabrication of composite pore structure 100.
雖然本實施方式之外層結構110、內層結構130與疏水透氣膜層140使用背膠150與180以固定其位置，然而在其他的實施方式中，亦可以不同的方式固定。舉例而言，疏水透氣膜層140亦可以熱熔方式固定於內層結構130與外層結構110。換句話說，疏水透氣膜層140固定於外層結構110的方法，可與疏水透氣膜層140固定於內層結構130之方法不同。舉例而言，疏水透氣膜層140可先以背膠150固定於內層結構130，疏水透氣膜層140再以熱熔方式固定於外層結構110上，然而本發明不以此為限。Although the outer layer structure 110, the inner layer structure 130, and the hydrophobic gas permeable film layer 140 of the present embodiment use the backings 150 and 180 to fix their positions, in other embodiments, they may be fixed in different manners. For example, the hydrophobic gas permeable membrane layer 140 can also be thermally bonded to the inner layer structure 130 and the outer layer structure 110. In other words, the method of fixing the hydrophobic gas permeable membrane layer 140 to the outer layer structure 110 may be different from the method of fixing the hydrophobic gas permeable membrane layer 140 to the inner layer structure 130. For example, the hydrophobic gas permeable membrane layer 140 may be first fixed to the inner layer structure 130 by the backing 150, and the hydrophobic gas permeable membrane layer 140 may be fixed to the outer layer structure 110 by heat fusion, but the invention is not limited thereto.
在其他的實施方式中，複合孔結構100之外層結構110、內層結構130與疏水透氣膜層140的組合方式不以上述之順序為限。疏水透氣膜層140可選擇先以背膠180固定於外層結構110上，接著內層結構130再以背膠150或熱熔方式固定於外層結構110上，亦可達到組合的目的。至於本實施方式之其他細節因與第一實施方式相同，因此便不再贅述。In other embodiments, the combination of the outer layer structure 110, the inner layer structure 130, and the hydrophobic gas permeable membrane layer 140 of the composite pore structure 100 is not limited to the above order. The hydrophobic gas permeable membrane layer 140 may be first fixed to the outer layer structure 110 by the adhesive 180, and then the inner layer structure 130 is fixed on the outer layer structure 110 by a backing 150 or hot melt, and the purpose of the combination may also be achieved. Other details of the present embodiment are the same as those of the first embodiment, and thus will not be described again.
接著請同時參照第7圖與第8圖，其中第7圖繪示依照本發明第四實施方式之電子裝置的立體圖。第8圖其繪示沿第7圖之線段8-8的剖面圖。本實施方式與第二實 施方式之不同處在於功能元件120的類型、功能孔132的數量以及缺少密封膠170(如第2圖所繪示)。在本實施方式中，功能元件120可為收話元件。為了使收話品質更佳，功能孔132的數量可為複數個，而功能孔132例如可為圓形孔，且功能孔132於外層結構110上的垂直投影皆位於排水孔112內。因此外界的聲音可依序自排水孔112、疏水透氣膜層140與複數個功能孔132而到達收話元件。其中在本實施方式中，排水孔112可為橢圓形，然而本發明不以此為限。至於本實施方式之其他細節因與第一實施方式相同，因此便不再贅述。Next, please refer to FIG. 7 and FIG. 8 simultaneously, wherein FIG. 7 is a perspective view of the electronic device according to the fourth embodiment of the present invention. Figure 8 is a cross-sectional view taken along line 8-8 of Figure 7. This embodiment and the second real The difference in the manner of operation is the type of functional element 120, the number of functional apertures 132, and the lack of sealant 170 (as depicted in Figure 2). In the present embodiment, the functional component 120 can be a receiving component. In order to improve the quality of the call, the number of the function holes 132 may be plural, and the function holes 132 may be, for example, circular holes, and the vertical projections of the function holes 132 on the outer layer structure 110 are all located in the drain holes 112. Therefore, the external sound can be sequentially discharged from the drainage hole 112, the hydrophobic gas permeable membrane layer 140, and the plurality of functional holes 132 to the receiving element. In the present embodiment, the drain hole 112 may be elliptical, but the invention is not limited thereto. Other details of the present embodiment are the same as those of the first embodiment, and thus will not be described again.
應注意的是，雖然上述各實施方式之功能元件120皆以收音元件(如麥克風或收話元件)為例，而所對應之功能孔132為收音孔。然而在其他的實施方式中，功能元件120亦可為出音元件(如喇叭)、溫度感測器或壓力感測器，而相對應之功能孔132則分別為出音孔、溫度感測孔與壓力感測孔，只要功能元件120之訊息可藉由功能孔132、疏水透氣膜層140與排水孔112傳遞，皆在本發明之範疇中。It should be noted that although the functional elements 120 of the above embodiments are all exemplified by a sound pickup element (such as a microphone or a receiving component), the corresponding function hole 132 is a sound receiving hole. In other embodiments, the functional component 120 can also be a sound emitting component (such as a speaker), a temperature sensor or a pressure sensor, and the corresponding function holes 132 are respectively a sound hole and a temperature sensing hole. As with the pressure sensing aperture, as long as the information of the functional component 120 can be transmitted through the functional aperture 132, the hydrophobic gas permeable membrane layer 140 and the drainage aperture 112, it is within the scope of the present invention.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
110‧‧‧外層結構110‧‧‧ outer structure
112‧‧‧排水孔112‧‧‧Drainage holes
114‧‧‧排水面114‧‧‧Drainage surface
120‧‧‧功能元件120‧‧‧Functional components
130‧‧‧內層結構130‧‧‧ Inner structure
132‧‧‧功能孔132‧‧‧ function hole
140‧‧‧疏水透氣膜層140‧‧‧Drainable gas permeable membrane
150、160‧‧‧背膠150, 160‧‧‧ Back adhesive
170‧‧‧密封膠170‧‧‧Sealant
190‧‧‧導引件190‧‧‧Guide
192‧‧‧導引通道192‧‧‧ Guide channel
200‧‧‧電路板200‧‧‧ boards
θ‧‧‧角Θ‧‧‧ corner
Claims (10)
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| TW102117948A TWI491337B (en) | 2013-05-21 | 2013-05-21 | Composite hole structure |
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| Application Number | Priority Date | Filing Date | Title |
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| TW102117948A TWI491337B (en) | 2013-05-21 | 2013-05-21 | Composite hole structure |
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| TWI491337B true TWI491337B (en) | 2015-07-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102239351A (en) * | 2008-11-06 | 2011-11-09 | 日本奥亚特克斯股份有限公司 | Vent plug |
| CN202773037U (en) * | 2012-09-07 | 2013-03-06 | 广东欧珀移动通信有限公司 | Waterproof electronic product |
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|---|---|---|---|---|
| CN102239351A (en) * | 2008-11-06 | 2011-11-09 | 日本奥亚特克斯股份有限公司 | Vent plug |
| CN202773037U (en) * | 2012-09-07 | 2013-03-06 | 广东欧珀移动通信有限公司 | Waterproof electronic product |
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