JP2013098464A - Reflow soldering apparatus - Google Patents

Reflow soldering apparatus Download PDF

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JP2013098464A
JP2013098464A JP2011242200A JP2011242200A JP2013098464A JP 2013098464 A JP2013098464 A JP 2013098464A JP 2011242200 A JP2011242200 A JP 2011242200A JP 2011242200 A JP2011242200 A JP 2011242200A JP 2013098464 A JP2013098464 A JP 2013098464A
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hot air
conveyor
air blowing
hot blast
substrate
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Hachiji Yokota
八治 横田
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YOKOTA TECHNICA KK
Yokota Technica Co Ltd
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YOKOTA TECHNICA KK
Yokota Technica Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus in which the time to blow hot blast to an electronic component mounted substrate which is moved by a conveyer, is prolonged.SOLUTION: In a reflow soldering apparatus, a substrate on which an electronic component is mounted is conveyed inside of a furnace including a hot blast circulation device, by a conveyer and the hot blast circulation device includes a plurality of slender hot blast blow-out ventilation paths for blowing hot blast to the substrate on the conveyer. The hot blast blow-out ventilation paths are disposed while being spaced apart from each other in a conveying direction of the conveyer so as to cross in the conveying direction of the conveyer, and hot blast is blown from the hot blast blow-out ventilation paths to the substrate on the conveyer. A plurality of hot blast blow-out holes 27 formed on hot blast blow-out faces of the hot blast blow-out ventilation paths are formed in a hole whose shape is slender in the conveying direction of the conveyer.

Description

本発明は、炉内を電子部品が搭載された基板をコンベヤで搬送しながら循環する熱風を使用して半田付けを行なうリフロー半田付け装置に関する。   The present invention relates to a reflow soldering apparatus for performing soldering using hot air circulating while conveying a substrate on which electronic components are mounted in a furnace by a conveyor.

リフロー半田付け装置は電子部品を搭載した基板をコンベヤで搬送しながら炉内で加熱して、クリーム半田を溶融させ、電子部品を基板上に半田付けする装置である。   The reflow soldering apparatus is an apparatus that heats a substrate on which electronic components are mounted in a furnace while being conveyed by a conveyor, melts cream solder, and solders the electronic components onto the substrate.

このリフロー半田付け装置には送風機とヒータを備えた熱風循環装置により熱風を炉内で循環させ、電子部品をリフロー半田付けするものがある（特許文献１参照）。このリフロー半田付け装置は複数の予備加熱室とリフロー半田付け室をコンベヤの搬送方向に沿って順に有しており、各予備加熱室とリフロー半田付け室にそれぞれ熱風循環装置が設けられている。熱風循環装置はコンベヤ上の基板に熱風を吹き付ける細長い熱風吹出通風路を複数有している。これらの熱風吹出通風路は送風機とコンベヤとの間にコンベヤの搬送方向に間隔を置いてコンベヤの搬送方向に交差するようにして配置され、送風機によってヒータを通って加熱された熱風が熱風吹出通風路に入り、熱風吹出通風路から熱風がコンベヤ上の基板に吹き付けられて、電子部品が基板に半田付けされる。このリフロー半田付け装置において、前記熱風吹出通風路の熱風吹出面に形成されている複数の熱風吹出孔は、特許文献１の図７に示されているように、熱風吹出通風路に沿って細長い長孔、すなわちコンベヤの搬送方向と交差する方向に細長い長孔に形成されている。   Among these reflow soldering apparatuses, there is a reflow soldering apparatus in which hot air is circulated in a furnace by a hot air circulation device having a blower and a heater to reflow solder the electronic component (see Patent Document 1). This reflow soldering apparatus has a plurality of preheating chambers and reflow soldering chambers in order along the conveying direction of the conveyor, and a hot air circulation device is provided in each of the preheating chambers and the reflow soldering chambers. The hot air circulation device has a plurality of elongated hot air blowing passages for blowing hot air onto the substrate on the conveyor. These hot air blowing air passages are arranged between the blower and the conveyor so as to intersect the conveying direction of the conveyor with an interval in the conveying direction of the conveyor, and the hot air heated by the blower through the heater is blown into the hot air. Hot air is blown onto the substrate on the conveyor from the hot air blowing air passage, and the electronic components are soldered to the substrate. In this reflow soldering apparatus, the plurality of hot air blowing holes formed in the hot air blowing surface of the hot air blowing air passage are elongated along the hot air blowing air passage as shown in FIG. The long hole, that is, a long and narrow hole is formed in a direction crossing the conveying direction of the conveyor.

特許第３５１５０５８号公報Japanese Patent No. 3515058

熱風吹出通風路の熱風吹出面に形成されている複数の熱風吹出孔がコンベヤの搬送方向と交差する方向に細長い長孔形状に形成されていると、熱風をプリント基板の熱風吹出通風路に面する部分にできるだけ均一に吹き付けられるようにできるが、コンベヤにより炉内を移動するプリント基板に熱風が吹き付けられる時間が短いものとなる。なお、全ての熱風吹出孔の総面積は熱風吹出孔から吹き出される熱風の風速等の関係により一定の値に決定されている。   When a plurality of hot air blowing holes formed in the hot air blowing surface of the hot air blowing air passage are formed in the shape of an elongated hole extending in a direction intersecting with the conveying direction of the conveyor, the hot air is directed to the hot air blowing air passage of the printed circuit board. However, the time for hot air to be blown to the printed circuit board moving in the furnace by the conveyor is shortened. In addition, the total area of all the hot air blowing holes is determined to be a constant value according to the relationship of the wind speed of the hot air blown from the hot air blowing holes.

本発明の目的は、コンベヤにより移動する電子部品搭載基板に熱風が吹き付けられる時間を長くするリフロー半田付け装置を提供することである。   The objective of this invention is providing the reflow soldering apparatus which lengthens the time when a hot air is sprayed on the electronic component mounting board | substrate which moves with a conveyor.

本発明は、電子部品が搭載された基板が熱風循環装置を有する炉内をコンベヤで搬送され、前記熱風循環装置はコンベヤ上の基板に熱風を吹き付ける細長い熱風吹出通風路を複数有し、これらの熱風吹出通風路はコンベヤの搬送方向に互いに間隔を置いてコンベヤの搬送方向に交差するようにして配置され、熱風が前記熱風吹出通風路からコンベヤ上の基板に吹き付けられるリフロー半田付け装置において、
前記熱風吹出通風路の熱風吹出面に形成されている複数の熱風吹出孔がコンベヤの搬送方向に細長い長孔に形成されていることを特徴とする。 In the present invention, a substrate on which electronic components are mounted is conveyed by a conveyor through a furnace having a hot air circulation device, and the hot air circulation device has a plurality of elongated hot air blowing air passages for blowing hot air onto the substrate on the conveyor. In the reflow soldering apparatus in which the hot air blowing air passages are arranged so as to cross the conveying direction of the conveyor at intervals in the conveying direction of the conveyor, and hot air is blown from the hot air blowing air passage to the substrate on the conveyor,
A plurality of hot air blowing holes formed in the hot air blowing surface of the hot air blowing air passage are formed as long and narrow holes in the conveying direction of the conveyor.

互いに隣り合う熱風吹出通風路において、一方の熱風吹出通風路の熱風吹出孔は、コンベヤの搬送方向から見て、他方の熱風吹出通風路の互いに隣り合う熱風吹出孔の間に配置されていることが好ましい。   In the hot air blowing air passages adjacent to each other, the hot air blowing holes of one hot air blowing air passage are arranged between the hot air blowing holes adjacent to each other in the other hot air blowing air passage as seen from the conveying direction of the conveyor. Is preferred.

本発明によれば、熱風吹出孔がコンベヤの搬送方向に細長い長孔に形成されているので、コンベヤの搬送方向に交差するようにして配置されている熱風吹出通風路を電子部品が搭載された基板が通過して行く際、熱風が基板に吹き付けられる時間が長くなり、電子部品が搭載された基板を充分に加熱できる。そして互いに隣り合う熱風吹出通風路において、一方の熱風吹出通風路の熱風吹出孔は、コンベヤの搬送方向から見て、他方の熱風吹出通風路の互いに隣り合う熱風吹出孔の間に配置されているように構成すれば、前記基板をより均一に加熱できる。   According to the present invention, since the hot air blowing hole is formed as a long and narrow hole in the conveying direction of the conveyor, the electronic component is mounted on the hot air blowing air passage arranged so as to intersect the conveying direction of the conveyor. When the substrate passes, the time during which hot air is blown onto the substrate becomes longer, and the substrate on which the electronic component is mounted can be sufficiently heated. And in the hot air blowing air passage adjacent to each other, the hot air blowing hole of one hot air blowing air passage is disposed between the hot air blowing holes adjacent to each other in the other hot air blowing air passage as seen from the conveying direction of the conveyor. If comprised in this way, the said board | substrate can be heated more uniformly.

本発明の一実施形態であるリフロー半田付け装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the reflow soldering apparatus which is one Embodiment of this invention. 搬送方向に直角に切った図１の要部縦断面図である。It is the principal part longitudinal cross-sectional view of FIG. 1 cut at right angles to the conveyance direction. 熱風循環装置の底面図である。It is a bottom view of a hot air circulation apparatus. ケーシングの底面図である。It is a bottom view of a casing. 通風路形成部材を示し、（ａ）は正面図、（ｂ）は底面図、（ｃ）は側面図である。The ventilation path formation member is shown, (a) is a front view, (b) is a bottom view, (c) is a side view.

以下、本発明の一実施形態を図面を参照しながら説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１において、リフロー半田付け装置は細長い炉１を有している。炉１内は電子部品及び半田の酸化を防止するために窒素ガスが供給されている。電子部品を搭載したプリント基板２は炉１内を移動するコンベヤ３によって炉１内を搬送される。   In FIG. 1, the reflow soldering apparatus has an elongated furnace 1. Nitrogen gas is supplied into the furnace 1 to prevent oxidation of electronic components and solder. A printed circuit board 2 on which electronic components are mounted is conveyed in the furnace 1 by a conveyor 3 that moves in the furnace 1.

炉１は仕切壁４で５個の室に仕切られており、３個の予備加熱室５と１個のリフロー半田付け室６と冷却室７とを搬送方向に沿って順に備えている。電子部品を搭載した基板２は炉１内をコンベヤ３で搬送されながら、予備加熱室５で徐々に加熱され、リフロー半田付け室６でクリーム半田が溶融されて半田付けされ、冷却室７で溶融半田が冷却固化される。   The furnace 1 is partitioned into five chambers by a partition wall 4, and includes three preheating chambers 5, one reflow soldering chamber 6, and a cooling chamber 7 in order along the transport direction. The substrate 2 on which electronic components are mounted is gradually heated in the preheating chamber 5 while being conveyed by the conveyor 3 in the furnace 1, the cream solder is melted and soldered in the reflow soldering chamber 6, and is melted in the cooling chamber 7. The solder is cooled and solidified.

炉１の予備加熱室５とリフロー半田付け室６には、コンベヤ３を挟んで上下に同じ構造の熱風循環装置Ａが設けられている。以下、上側の熱風循環装置Ａについて説明する。   In the preheating chamber 5 and the reflow soldering chamber 6 of the furnace 1, a hot air circulation device A having the same structure is provided above and below the conveyor 3. Hereinafter, the upper hot air circulation device A will be described.

図２において、炉１の各室５，６内の上端部にはそれぞれ送風機８が設けられており、炉１の外の上側に設置されたモータ９に接続している。送風機８は水平な仕切板を挟んだ上下に羽根が円周方向に間隔を置いて複数配置され、上面に吸入口１０、外周に吐出口１１を有し、下面に吸入口１２、外周に吐出口１３を有している。   In FIG. 2, a blower 8 is provided at each of the upper ends of the chambers 5 and 6 of the furnace 1, and is connected to a motor 9 installed on the upper side outside the furnace 1. The blower 8 has a plurality of blades arranged at intervals in the circumferential direction above and below a horizontal partition plate, and has a suction port 10 on the upper surface, a discharge port 11 on the outer periphery, a suction port 12 on the lower surface, and a discharge on the outer periphery. It has an outlet 13.

図２及び図４に示されているように、ケーシング１４は送風機収納部１５と導風部１６とからなっている。送風機収納部１５は送風機８を収納し、送風機８の吸入口１０，１２に対向する上下面にそれぞれ吸入口１７，１８を有している。導風部１６は送風機収納部１５の左右から左右に張り出している水平部１６ａと、その先端部が下方に湾曲して垂直に下方に延びている垂直延出部１６ｂとから構成されている。ケーシング１４は平面視で矩形であり、仕切壁４との間に殆ど隙間がないが、各室５，６の左右側面との間には空間部１９があり、また、上面よりも少し下側に間隔をあけて配置されているので各室５，６の上面との間に空間部２０が形成されている。ケーシング１４で囲まれた空間部２１にヒータ２２が配置されている。ヒータ２２の種類は問わないが、本実施形態ではシーズヒータが使用されている。   As shown in FIGS. 2 and 4, the casing 14 includes a blower housing portion 15 and an air guide portion 16. The blower housing 15 houses the blower 8 and has suction ports 17 and 18 on the upper and lower surfaces facing the suction ports 10 and 12 of the blower 8, respectively. The air guide portion 16 includes a horizontal portion 16a projecting from the left and right of the blower housing portion 15 to the left and right, and a vertical extending portion 16b whose front end portion curves downward and extends vertically downward. The casing 14 is rectangular in plan view, and there is almost no gap between it and the partition wall 4, but there is a space 19 between the left and right side surfaces of the chambers 5 and 6, and a little lower than the upper surface. The space 20 is formed between the upper surfaces of the chambers 5 and 6. A heater 22 is disposed in a space 21 surrounded by the casing 14. Although the kind of heater 22 is not ask | required, the sheathed heater is used in this embodiment.

図２〜図５に示すように、熱風吹出通風路２３を形成する通風路形成部材２４がケーシング１４の左右一対の導風部１６における垂直延出部１６ｂの間に接続配置されている。通風路形成部材２４は細長い箱状部材で、その内部が熱風吹出通風路２３を構成し、長手方向の両端部がケーシング１４の左右一対の導風部１６における垂直延出部１６ｂの対向する内面間に接続されている。通風路形成部材２４の長手方向の両端面には開口２５がそれぞれ形成されており、その開口２５が臨む導風部１６の垂直延出部１６ｂ壁面にも開口が形成されており、導風部１６と通風路形成部材２４はこれらの開口を通じて互いに連通している。   As shown in FIGS. 2 to 5, the ventilation path forming member 24 that forms the hot-air blowing ventilation path 23 is connected and disposed between the vertically extending portions 16 b of the pair of left and right ventilation sections 16 of the casing 14. The ventilation path forming member 24 is an elongated box-shaped member, the inside of which forms a hot air blowing ventilation path 23, and both longitudinal ends thereof are the inner surfaces of the pair of left and right ventilation sections 16 of the casing 14 facing the vertical extension 16 b. Connected between. Openings 25 are formed on both end surfaces in the longitudinal direction of the air passage forming member 24, and openings are also formed on the wall surfaces of the vertically extending portions 16b of the air guide portion 16 facing the openings 25. 16 and the ventilation path forming member 24 communicate with each other through these openings.

通風路形成部材２４の下部はＶ字形をした複数のノズル部２６が長手方向に連続して配置された構造を有している。これらのノズル部２６の底面にはそれぞれ熱風吹出孔２７が形成されている。熱風吹出孔２７は通風路形成部材２４の長手方向に対して直角方向に細長い長孔に形成されている。   The lower part of the ventilation path forming member 24 has a structure in which a plurality of V-shaped nozzle portions 26 are continuously arranged in the longitudinal direction. Hot air blowing holes 27 are formed in the bottom surfaces of these nozzle portions 26, respectively. The hot air blowing hole 27 is formed as an elongated hole that is elongated in a direction perpendicular to the longitudinal direction of the ventilation path forming member 24.

上記通風路形成部材２４はコンベヤ３の搬送方向に互いに間隔をおいて左右の導風部１６における垂直延出部１６ｂの間に複数設けられている。   A plurality of the air passage forming members 24 are provided between the vertical extending portions 16 b in the left and right air guide portions 16 at intervals in the transport direction of the conveyor 3.

このようにして、通風路形成部材２４が形成する熱風吹出通風路２３が送風機８とコンベヤ３との間にコンベヤ３の搬送方向に互いに間隔を置いてコンベヤ３の搬送方向に交差するようにして複数配置されている。熱風吹出通風路２３はその熱風吹出面にコンベヤ３の搬送方向に細長い長孔状の熱風吹出孔２７をコンベヤ３の搬送方向と直角方向に間隔をおいて複数有している。   In this way, the hot air blowing air passage 23 formed by the air passage forming member 24 intersects the conveying direction of the conveyor 3 with a space between the fan 8 and the conveyor 3 in the conveying direction of the conveyor 3. Several are arranged. The hot air blowing passage 23 has a plurality of elongated hot air blowing holes 27 elongated in the conveying direction of the conveyor 3 on the hot air blowing surface at intervals in the direction perpendicular to the conveying direction of the conveyor 3.

コンベヤ３の搬送方向に互いに間隔をおいて配置されている複数の熱風吹出通風路２３の互いに隣り合う熱風吹出通風路２３において、一方の熱風吹出通風路２３の熱風吹出孔２７は、コンベヤ３の搬送方向に沿って見ると、他方の熱風吹出通風路２３の熱風吹出孔２７とは左右方向にずらして配置され、他方の熱風吹出通風路２３の互いに隣り合う熱風吹出孔２７の間の中間位置に配置されている。   In the hot air blowing air passages 23 adjacent to each other in the plurality of hot air blowing air passages 23 arranged at intervals in the conveying direction of the conveyor 3, the hot air blowing holes 27 of one hot air blowing air passage 23 are formed on the conveyor 3. When viewed along the transport direction, the hot air outlet hole 27 of the other hot air outlet passage 23 is shifted in the left-right direction, and an intermediate position between the adjacent hot air outlet holes 27 of the other hot air outlet passage 23. Is arranged.

なお、ケーシング１４の導風部１６における垂直延出部１６ｂの底面にも熱風吹出孔２８がコンベヤ３の搬送方向に互いに間隔をおいて複数形成されている。   A plurality of hot air blowing holes 28 are also formed at intervals in the transport direction of the conveyor 3 on the bottom surface of the vertically extending portion 16 b of the air guiding portion 16 of the casing 14.

互いに隣り合う通風路形成部材２４の間は隙間２９を形成しており、電子部品を搭載したプリント基板２を加熱した後の熱風がこれらの隙間２９から流入して送風機８の下面の吸入口１２から吸入される。   A gap 29 is formed between the adjacent ventilation path forming members 24, and hot air after heating the printed circuit board 2 on which the electronic component is mounted flows from these gaps 29, and the inlet 12 on the lower surface of the blower 8. Inhaled from.

以上は、コンベヤ３の上側の熱風循環装置Ａについて説明したが、コンベヤ３の下側の熱風循環装置Ａも同じように構成されている。   The hot air circulation device A on the upper side of the conveyor 3 has been described above, but the hot air circulation device A on the lower side of the conveyor 3 is configured in the same manner.

冷却室７は上記熱風循環装置Ａからヒータ２２を除いた冷却風循環装置Ｂを有している。   The cooling chamber 7 has a cooling air circulation device B obtained by removing the heater 22 from the hot air circulation device A.

次に、本発明の作用を説明する。   Next, the operation of the present invention will be described.

電子部品を搭載したプリント基板２は、炉１の入口側でコンベヤ３に載せられ、コンベヤ３によって炉１内を搬送される。炉１の予備加熱室５とリフロー半田付け室６と冷却室７では、各室５，６，７内の送風機８がモータ９によって回転される。   The printed circuit board 2 on which electronic components are mounted is placed on the conveyor 3 on the entrance side of the furnace 1, and is conveyed through the furnace 1 by the conveyor 3. In the preheating chamber 5, the reflow soldering chamber 6 and the cooling chamber 7 of the furnace 1, the blower 8 in each chamber 5, 6, 7 is rotated by a motor 9.

以下、上側の熱風循環装置Ａを基に説明する。   Hereinafter, description will be made based on the hot air circulation device A on the upper side.

熱風は送風機８によりケーシング１４の左右の導風部１６を通って複数の熱風吹出通風路２３に入り、熱風吹出通風路２３のノズル部２６の熱風吹出孔２７からコンベヤ３上の電子部品を搭載したプリント基板２に吹き付けられる。また、ケーシング１４の導風部１６における垂直延出部１６ｂの熱風吹出孔２８からもコンベヤ３上の電子部品を搭載したプリント基板２に熱風が吹き付けられる。   The hot air enters the plurality of hot air blowing passages 23 through the right and left air guiding portions 16 of the casing 14 by the blower 8, and electronic components on the conveyor 3 are mounted from the hot air blowing holes 27 of the nozzle portions 26 of the hot air blowing passage 23. The printed circuit board 2 is sprayed. Also, hot air is blown from the hot air blowing holes 28 of the vertically extending portion 16 b in the air guiding portion 16 of the casing 14 to the printed circuit board 2 on which the electronic components on the conveyor 3 are mounted.

電子部品を搭載したプリント基板２に吹き付けられた熱風は、電子部品を搭載したプリント基板２を加熱した後、互いに隣り合う通風路形成部材２４の間の隙間２９からケーシング１４で囲まれた空間部２１に流入し、ヒータ２２により加熱され、送風機８の下面の吸入口１２に吸入されるとともに、ケーシング１４の外側の空間部１９，２０を通って、送風機８の上面の吸入口１０に吸入される。   The hot air blown to the printed circuit board 2 on which the electronic component is mounted heats the printed circuit board 2 on which the electronic component is mounted, and then is a space portion surrounded by the casing 14 from the gap 29 between the adjacent ventilation path forming members 24. 21, heated by the heater 22, sucked into the suction port 12 on the lower surface of the blower 8, and sucked into the suction port 10 on the upper surface of the blower 8 through the space portions 19 and 20 outside the casing 14. The

そして、送風機８によって熱風がケーシング１４の導風部１６を通って、熱風吹出通風路２３の熱風吹出孔２７及び導風部１６の熱風吹出孔２８から電子部品を搭載したプリント基板２に吹き付けられ、電子部品を搭載したプリント基板２が加熱される。   Then, the hot air is blown by the blower 8 through the air guide portion 16 of the casing 14 and from the hot air outlet hole 27 of the hot air outlet passage 23 and the hot air outlet hole 28 of the air guide portion 16 to the printed circuit board 2 on which electronic components are mounted. The printed circuit board 2 on which the electronic component is mounted is heated.

以上は、上側の熱風循環装置Ａを基に説明したが、下側の熱風循環装置Ａも同じように作用する。   The above description is based on the upper hot air circulation device A, but the lower hot air circulation device A operates in the same manner.

以上の通り、熱風吹出孔２７がコンベヤ３の搬送方向に細長い長孔に形成されているので、熱風吹出通風路２３を電子部品が搭載された基板２が通過して行く際、熱風が基板２に吹き付けられる時間が長くなり、電子部品が搭載されたプリント基板２を充分に加熱できる。   As described above, since the hot air blowing hole 27 is formed in a long and narrow hole in the conveying direction of the conveyor 3, when the substrate 2 on which electronic components are mounted passes through the hot air blowing passage 23, the hot air is blown to the substrate 2. As a result, the printed circuit board 2 on which the electronic components are mounted can be heated sufficiently.

また、互いに隣り合う熱風吹出通風路２３において、一方の熱風吹出通風路２３の熱風吹出孔２７は、コンベヤ３の搬送方向から見て、他方の熱風吹出通風路２３の熱風吹出孔２７とは左右方向にずらして配置され、他方の熱風吹出通風路２３の互いに隣り合う熱風吹出孔２７の間に配置されているので、電子部品が搭載されたプリント基板２をより均一に加熱できる。   Further, in the hot air blowing passages 23 adjacent to each other, the hot air blowing holes 27 of one hot air blowing passage 23 are left and right with respect to the hot air blowing holes 27 of the other hot air blowing passage 23 when viewed from the conveying direction of the conveyor 3. The printed board 2 on which the electronic components are mounted can be heated more uniformly because it is arranged so as to be shifted in the direction and disposed between the hot air blowing holes 27 adjacent to each other in the other hot air blowing passage 23.

上記のようにして、電子部品を搭載したプリント基板２は予備加熱室５で徐々に加熱され、リフロー半田付け室６でクリーム半田が溶融され、電子部品がプリント基板２上に半田付けされる。その後、電子部品を搭載したプリント基板２は冷却室７を通る間に冷却されて半田部が固化される。   As described above, the printed circuit board 2 on which the electronic component is mounted is gradually heated in the preheating chamber 5, the cream solder is melted in the reflow soldering chamber 6, and the electronic component is soldered on the printed circuit board 2. Thereafter, the printed circuit board 2 on which the electronic components are mounted is cooled while passing through the cooling chamber 7, and the solder portion is solidified.

上記実施形態では、循環する熱風のみで半田付けを行なうリフロー半田付け装置を示したが、本発明は熱風を使用することに加えて遠赤外線ヒータを併用して半田付けを行なう場合も含む。   In the above embodiment, a reflow soldering apparatus that performs soldering only with circulating hot air has been described, but the present invention includes a case where soldering is performed using a far infrared heater in addition to using hot air.

また、上記実施形態では、通風路形成部材はその下部に連続するＶ字形のノズル部を形成した例を示したが、これに限ることはなく、底面は平面としてその底面にコンベヤの搬送方向に長孔状の熱風吹出孔を複数形成するようにしてもよい。   Moreover, although the ventilation path formation member showed the example which formed the V-shaped nozzle part which continued in the lower part in the said embodiment, it is not restricted to this, A bottom face is made into a plane in the conveyance direction of a conveyor on the bottom face. A plurality of long hole-like hot air blowing holes may be formed.

１・・炉、２・・電子部品を搭載したプリント基板、３・・コンベヤ、４・・仕切壁、５・・予備加熱室、６・・リフロー半田付け室、７・・冷却室、Ａ・・熱風循環装置、Ｂ・・冷却風循環装置、８・・送風機、９・・モータ、１０・・吸入口、１１・・吐出口、１２・・吸入口、１３・・吐出口、１４・・ケーシング、１５・・送風機収納部、１６・・導風部、１６ａ・・水平部、１６ｂ・・垂直延出部、１７，１８・・吸入口、１９，２０，２１・・空間部、２２・・ヒータ、２３・・熱風吹出通風路、２４・・通風路形成部材、２５・・開口、２６・・ノズル部、２７，２８・・熱風吹出孔、２９・・隙間。   1 .... Furnace, 2 .... Printed circuit board with electronic parts, 3 .... Conveyor, 4 .... Partition wall, 5 .... Preheating room, 6 .... Reflow soldering room, 7 .... Cooling room, A. · Hot air circulation device, B · · Cooling air circulation device, 8 · · Blower, 9 · · Motor, 10 · · Suction port, 11 · · Discharge port, 12 · · Suction port, 13 · · Discharge port, · · · Casing, 15 ..Blower housing part, 16 .. Air guide part, 16 a ..Horizontal part, 16 b ..Vertical extension part, 17, 18 ..Suction port, 19, 20, 21 .. Space part, 22. · Heater, 23 ··· Hot air blowout passage, 24 ··· Ventilation passage forming member, 25 ·· Opening, 26 · · Nozzle portion, 27, 28 · · Hot air blowout hole, 29 ·· Clearance.

Claims (2)

電子部品が搭載された基板が熱風循環装置を有する炉内をコンベヤで搬送され、前記熱風循環装置はコンベヤ上の基板に熱風を吹き付ける細長い熱風吹出通風路を複数有し、これらの熱風吹出通風路はコンベヤの搬送方向に互いに間隔を置いてコンベヤの搬送方向に交差するようにして配置され、熱風が前記熱風吹出通風路からコンベヤ上の基板に吹き付けられるリフロー半田付け装置において、
前記熱風吹出通風路の熱風吹出面に形成されている複数の熱風吹出孔がコンベヤの搬送方向に細長い長孔に形成されていることを特徴とするリフロー半田付け装置。 A substrate on which electronic components are mounted is conveyed by a conveyor through a furnace having a hot air circulation device, and the hot air circulation device has a plurality of elongated hot air blowing air passages for blowing hot air onto the substrate on the conveyor, and these hot air blowing air passages. In the reflow soldering apparatus in which the hot air is blown from the hot air blowing air passage to the substrate on the conveyor, arranged so as to be spaced apart from each other in the conveying direction of the conveyor and intersecting the conveying direction of the conveyor,
A reflow soldering apparatus, wherein a plurality of hot air blowing holes formed in a hot air blowing surface of the hot air blowing air passage are formed as elongated holes elongated in a conveying direction of the conveyor. 互いに隣り合う熱風吹出通風路において、一方の熱風吹出通風路の熱風吹出孔は、コンベヤの搬送方向から見て、他方の熱風吹出通風路の互いに隣り合う熱風吹出孔の間に配置されていることを特徴とする請求項１記載のリフロー半田付け装置。   In the hot air blowing air passages adjacent to each other, the hot air blowing holes of one hot air blowing air passage are arranged between the hot air blowing holes adjacent to each other in the other hot air blowing air passage as seen from the conveying direction of the conveyor. The reflow soldering apparatus according to claim 1.
JP2011242200A 2011-11-04 2011-11-04 Reflow soldering apparatus Pending JP2013098464A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077607A (en) * 2013-10-16 2015-04-23 千住金属工業株式会社 Nozzle and solder device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077607A (en) * 2013-10-16 2015-04-23 千住金属工業株式会社 Nozzle and solder device
CN104582306A (en) * 2013-10-16 2015-04-29 千住金属工业株式会社 Nozzle and soldering device

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