JP2013084674A - Heat radiation structure of heat generation electronic device - Google Patents

Heat radiation structure of heat generation electronic device Download PDF

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JP2013084674A
JP2013084674A JP2011222050A JP2011222050A JP2013084674A JP 2013084674 A JP2013084674 A JP 2013084674A JP 2011222050 A JP2011222050 A JP 2011222050A JP 2011222050 A JP2011222050 A JP 2011222050A JP 2013084674 A JP2013084674 A JP 2013084674A
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heat
electronic device
generating electronic
heat dissipation
circuit board
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Yutaka Kogane
豊 小金
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Shindengen Electric Manufacturing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To efficiently radiate heat from the upper surface side of a heat generation electronic device facing a substrate in a heat radiation structure of the heat generation electronic device which includes a first heat radiation member, the heat generation electronic device which is mounted on a mounting surface of the first heat radiation member, and a substrate disposed above the mounting surface and the heat generation electronic device so as to be spaced away from the mounting surface and the heat generation electronic device.SOLUTION: In a heat radiation structure of a heat generation electronic device 2, a second heat radiation member 41 is fixed to an upper surface 21a of the heat generation electronic device 2 which faces a substrate 5. Further, the second heat radiation member 41 is mechanically connected with the substrate 5. Furthermore, the second heat radiation member 41 is composed of a body part 41 which makes a surface contact with the upper surface 21a of the heat generation electronic device 2 and connection protrusions 42 protruding from the body part 41 toward the substrate 5. The connection protrusions 42 are inserted into insertion holes for heat radiation 53 of the substrate 5.

Description

この発明は、発熱電子デバイスの放熱構造に関する。   The present invention relates to a heat dissipation structure for a heat generating electronic device.

従来、パワートランジスタのように通電により発熱する発熱電子デバイスから熱を逃がす放熱構造としては、発熱電子デバイスをヒートシンク等の放熱部材（第一放熱部材）上に搭載した構造がある。この放熱構造では、発熱電子デバイスの熱を発熱電子デバイスの下面からこれに当接する放熱部材に逃がすことができる。
また、発熱電子デバイスから熱を逃がす放熱構造には、例えば特許文献１のように、回路基板上に搭載された発熱電子デバイスの上面に、ヒートシンク等の放熱部材（第二放熱部材）を設けた構造もある。この放熱構造では、放熱部材が発熱電子デバイスの上方に延びる多数の放熱ピンを備えており、熱を放熱ピンから空気中に逃がすことが可能である。特に、この放熱構造では、多数の放熱ピンに空気を吹き付けることで、熱を効率よく逃がすことができる。
したがって、これら二つの放熱構造を組み合わせれば、発熱電子デバイスの上面及び下面の両方から熱を発熱電子デバイスから逃がすことが可能である。 2. Description of the Related Art Conventionally, as a heat dissipation structure for releasing heat from a heat generating electronic device that generates heat when energized, such as a power transistor, there is a structure in which a heat generating electronic device is mounted on a heat dissipation member (first heat dissipation member) such as a heat sink. In this heat dissipation structure, the heat of the heat generating electronic device can be released from the lower surface of the heat generating electronic device to the heat dissipation member in contact with the heat generating electronic device.
Moreover, in the heat dissipation structure that releases heat from the heat generating electronic device, for example, as in Patent Document 1, a heat dissipation member (second heat dissipation member) such as a heat sink is provided on the upper surface of the heat generating electronic device mounted on the circuit board. There is also a structure. In this heat dissipation structure, the heat dissipation member includes a number of heat dissipation pins extending above the heat generating electronic device, and heat can be released from the heat dissipation pins into the air. In particular, in this heat dissipation structure, heat can be efficiently released by blowing air to a large number of heat dissipation pins.
Therefore, when these two heat dissipation structures are combined, heat can be released from the heat generating electronic device from both the upper surface and the lower surface of the heat generating electronic device.

特開平９−３２１４６８号公報JP-A-9-32468

しかしながら、上記従来の第一及び第二放熱部材を発熱電子デバイスに設けたとしても、密閉されたケース内に配置される等して、第二放熱部材の放熱ピンに空気を吹き付けることができないことがある。この場合、発熱電子デバイス上に配した第二放熱部材から空気中に熱が放散されたとしても、発熱電子デバイスの直上に熱がこもり易くなり、その結果として、発熱電子デバイスの上面側からの放熱が不十分となる虞がある。
そして、発熱電子デバイスを第一放熱部材上に搭載する構造では、発熱電子デバイスに電気接続するための回路基板が、発熱電子デバイスの上方を覆うように配されることが多い。この場合には、発熱電子デバイスと回路基板との間の隙間において、特に熱がこもり易くなるため、発熱電子デバイスの上面側からの放熱がさらに不十分となる虞がある。 However, even if the conventional first and second heat dissipating members are provided in the heat generating electronic device, the air cannot be blown to the heat dissipating pins of the second heat dissipating member by being arranged in a sealed case. There is. In this case, even if heat is dissipated in the air from the second heat dissipating member disposed on the heat generating electronic device, the heat is likely to be stored directly on the heat generating electronic device, and as a result, from the upper surface side of the heat generating electronic device. There is a risk of insufficient heat dissipation.
In the structure in which the heat generating electronic device is mounted on the first heat radiating member, a circuit board for electrical connection to the heat generating electronic device is often arranged so as to cover the heat generating electronic device. In this case, in the gap between the heat generating electronic device and the circuit board, heat is particularly likely to be trapped, so there is a possibility that heat dissipation from the upper surface side of the heat generating electronic device will be further insufficient.

本発明は、上述した事情に鑑みたものであって、発熱電子デバイスの上面側からの放熱を効率よく行うことが可能な発熱電子デバイスの放熱構造を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a heat dissipation structure for a heat generating electronic device capable of efficiently performing heat dissipation from the upper surface side of the heat generating electronic device.

この課題を解決するために、本発明の発熱電子デバイスの放熱構造は、第一放熱部材と、当該第一放熱部材の搭載面に搭載される発熱電子デバイスと、前記搭載面及び前記発熱電子デバイスの上方に間隔をあけた位置に配される基板と、当該基板に対向する前記発熱電子デバイスの上面に固定される第二放熱部材と、を備え、当該第二放熱部材が、前記基板に機械的に接続されていることを特徴とする。
なお、基板の具体例としては、発熱電子デバイスに電気接続される回路基板や、筐体等の壁部等が挙げられる。また、上述した機械的な接続とは、第二放熱部材が基板に接触、当接あるいは固定されることを含んで意味している。 In order to solve this problem, a heat dissipation structure for a heat generating electronic device according to the present invention includes a first heat dissipating member, a heat generating electronic device mounted on a mounting surface of the first heat dissipating member, the mounting surface, and the heat generating electronic device. And a second heat dissipating member fixed to the upper surface of the heat generating electronic device facing the substrate, the second heat dissipating member being a machine on the substrate. It is characterized by being connected.
Specific examples of the substrate include a circuit board that is electrically connected to the heat generating electronic device, a wall portion of a housing, and the like. Further, the above-described mechanical connection means that the second heat radiating member is brought into contact with, contacted with, or fixed to the substrate.

上記放熱構造では、発熱電子デバイスにおいて生じた熱を、発熱電子デバイスの下面から第一放熱部材に逃がすことができると共に、発熱電子デバイスの上面から第二放熱部材に逃がすことができる。
さらに、第二放熱部材が基板に機械的に接続されていることで、発熱電子デバイスの熱を第二放熱部材から基板まで逃がすことができるため、例え発熱電子デバイスと基板との隙間に空気が流れなくても、発熱電子デバイスと基板との隙間に熱がこもってしまうことを防ぐことができる。言い換えれば、発熱電子デバイスの上面側からの放熱を効率よく行うことが可能となる。 In the heat dissipation structure, heat generated in the heat generating electronic device can be released from the lower surface of the heat generating electronic device to the first heat radiating member, and can be released from the upper surface of the heat generating electronic device to the second heat radiating member.
Furthermore, since the heat of the heat generating electronic device can be released from the second heat dissipating member to the substrate by mechanically connecting the second heat dissipating member to the substrate, for example, air is generated in the gap between the heat generating electronic device and the substrate. Even if it does not flow, it is possible to prevent heat from being trapped in the gap between the heat generating electronic device and the substrate. In other words, it is possible to efficiently dissipate heat from the upper surface side of the heat generating electronic device.

そして、前記発熱電子デバイスの放熱構造においては、前記第二放熱部材が、前記発熱電子デバイスの上面に面接触する本体部と、当該本体部から前記基板に向けて突出する接続突起とを備え、当該接続突起が、前記基板の厚さ方向に貫通して形成された放熱用挿通孔に挿通されているとよい。   And in the heat dissipation structure of the heat generating electronic device, the second heat dissipating member includes a main body portion that is in surface contact with the upper surface of the heat generating electronic device, and a connection protrusion that protrudes from the main body portion toward the substrate, The connection protrusion may be inserted into a heat dissipation insertion hole formed so as to penetrate in the thickness direction of the substrate.

この構成では、第二放熱部材を基板に対して容易に機械的に接続することが可能となる。特に、基板が発熱電子デバイスに電気接続される回路基板であり、また、発熱電子デバイスの端子を基板に差し込んだ上で、はんだ付けによって端子と基板とを接合することにより、発熱電子デバイスと基板とが電気接続される場合には、発熱電子デバイスの端子をはんだ付けする工程において、接続突起もはんだ付けによって同時に基板に接続することができる。したがって、基板に対する第二放熱部材の機械的な接続を効率よく行うことができる。   In this configuration, the second heat radiating member can be easily mechanically connected to the substrate. In particular, the circuit board is a circuit board in which the substrate is electrically connected to the heat generating electronic device, and the terminal of the heat generating electronic device is inserted into the substrate, and then the terminal and the substrate are joined by soldering, whereby the heat generating electronic device and the substrate are connected. Are electrically connected, the connection protrusions can be simultaneously connected to the substrate by soldering in the step of soldering the terminals of the heat generating electronic device. Therefore, the mechanical connection of the second heat radiating member to the substrate can be efficiently performed.

また、前記発熱電子デバイスの放熱構造においては、前記接続突起が、針状に形成されると共に互いに間隔をあけて複数配列されていると、さらによい。   Further, in the heat dissipation structure of the heat generating electronic device, it is further preferable that the connection protrusions are formed in a needle shape and are arranged in a plurality at intervals.

この構成では、接続突起が針状に形成されていることで、個々の接続突起の熱容量を小さく抑えることができるため、各接続突起を基板にはんだ付けで接合する際に、はんだの溶融に要する熱を小さくできる。したがって、複数の接続突起を基板に対して短時間で確実にはんだ付けすることが可能となる。
一方、接続突起が複数形成されていることで、複数の接続突起の合計の熱容量を大きく設定することができるため、発熱電子デバイスの熱を第二放熱部材から基板まで効率よく逃がすことができる。 In this configuration, since the connection protrusions are formed in a needle shape, the heat capacity of the individual connection protrusions can be kept small. Therefore, when connecting each connection protrusion to the substrate by soldering, it is necessary to melt the solder. Heat can be reduced. Therefore, it is possible to reliably solder the plurality of connection protrusions to the substrate in a short time.
On the other hand, since the plurality of connection protrusions are formed, the total heat capacity of the plurality of connection protrusions can be set large, so that the heat of the heat generating electronic device can be efficiently released from the second heat dissipation member to the substrate.

さらに、前記発熱電子デバイスの放熱構造においては、前記本体部が、前記第二放熱部材に対向する前記基板の下面に面接触していることが好ましい。
また、前記発熱電子デバイスの放熱構造においては、記本体部と、前記第二放熱部材に対向する前記基板の下面との隙間が、ゲル状部材によって埋められているとよい。 Furthermore, in the heat dissipation structure of the heat-generating electronic device, it is preferable that the main body is in surface contact with the lower surface of the substrate facing the second heat dissipation member.
Moreover, in the heat dissipation structure of the heat-generating electronic device, it is preferable that a gap between the main body portion and the lower surface of the substrate facing the second heat dissipation member is filled with a gel-like member.

これらの構成によれば、第二放熱部材の熱を基板に効率よく逃がすことが可能となる。
特に、ゲル状部材は第二放熱部材と比較して柔らかく変形可能であることから、本体部と回路基板との隙間の寸法公差が大きく設定されても、本体部と回路基板との隙間を確実に埋めることができる。したがって、汎用性の高い放熱構造を提供することができる。 According to these configurations, the heat of the second heat radiating member can be efficiently released to the substrate.
In particular, since the gel-like member is softer and deformable than the second heat dissipation member, the gap between the main body and the circuit board is surely secured even if the dimensional tolerance of the gap between the main body and the circuit board is set large. Can be buried. Therefore, a highly versatile heat dissipation structure can be provided.

さらに、前記発熱電子デバイスの放熱構造において、前記基板が、前記発熱電子デバイスに電気接続される回路基板である場合、当該回路基板には、前記第二放熱部材に接続される放熱用配線パターンが形成されていてもよい。   Further, in the heat dissipation structure of the heat generating electronic device, when the substrate is a circuit board electrically connected to the heat generating electronic device, the circuit board has a heat dissipation wiring pattern connected to the second heat dissipation member. It may be formed.

この構成では、第二放熱部材から回路基板に伝わる熱が、放熱用配線パターンに伝わり易くなるため、回路基板のうち放熱用配線パターンの形成領域を除く他の領域には伝わり難くなる。言い換えれば、回路基板において熱が伝わる領域を制限することが可能となる。したがって、例えば熱に弱い回路（熱に弱い電子部品を含むもの）が回路基板に設けられていても、このような回路が熱の影響を受けることを抑制することができる。   In this configuration, heat transmitted from the second heat radiating member to the circuit board is easily transmitted to the heat radiating wiring pattern, so that it is difficult to transmit to other areas of the circuit board excluding the region where the heat radiating wiring pattern is formed. In other words, it is possible to limit the region where heat is transmitted in the circuit board. Therefore, for example, even when a circuit that is vulnerable to heat (including electronic components that are vulnerable to heat) is provided on the circuit board, such a circuit can be prevented from being affected by heat.

また、前記発熱電子デバイスの放熱構造においては、前記第一放熱部材に、その搭載面から突出する伝熱用突起部が設けられ、当該伝熱用突起部の先端部が前記基板に機械的に接続されていると好ましい。   Further, in the heat dissipation structure of the heat generating electronic device, the first heat dissipation member is provided with a heat transfer protrusion protruding from the mounting surface, and the tip of the heat transfer protrusion is mechanically attached to the substrate. It is preferable that they are connected.

この構成では、第二放熱部材から基板に伝えられた熱を、第一放熱部材に逃がすことが可能となる。なお、第一放熱部材の熱容量は、第二放熱部材や基板の熱容量よりも容易に大きく設定することができるため、基板の熱を第一放熱部材に逃がすことは非常に有効である。   In this configuration, the heat transferred from the second heat radiating member to the substrate can be released to the first heat radiating member. Since the heat capacity of the first heat radiating member can be easily set larger than the heat capacity of the second heat radiating member or the substrate, it is very effective to release the heat of the substrate to the first heat radiating member.

さらに、前記発熱電子デバイスの放熱構造においては、前記第一放熱部材及び前記第二放熱部材が、前記基板及び前記伝熱用突起部を介して互いに電気接続されていてもよい。
この構成では、第一放熱部材及び第二放熱部材を同電位に設定することができる。したがって、例えば第一放熱部材を接地させるだけで、第二放熱部材も接地させることができき、発熱電子デバイスを含む回路の動作安定化を図ることができる。 Furthermore, in the heat dissipation structure of the heat generating electronic device, the first heat dissipation member and the second heat dissipation member may be electrically connected to each other via the substrate and the heat transfer protrusion.
In this configuration, the first heat radiating member and the second heat radiating member can be set to the same potential. Therefore, for example, only by grounding the first heat radiating member, the second heat radiating member can be grounded, and the operation of the circuit including the heat generating electronic device can be stabilized.

また、前記発熱電子デバイスの放熱構造においては、前記発熱電子デバイスが、固定手段によって前記第一放熱部材の搭載面に固定されると共に、前記第二放熱部材が、前記固定手段によって前記発熱電子デバイスの上面に固定されるとよい。   In the heat dissipation structure of the heat generating electronic device, the heat generating electronic device is fixed to the mounting surface of the first heat dissipation member by a fixing means, and the second heat dissipation member is fixed to the heat generating electronic device by the fixing means. It is good to fix to the upper surface of.

この構成では、同一の固定手段によって、発熱電子デバイスを第一放熱部材に固定すると同時に、第二放熱部材を発熱電子デバイスの上面に固定することができるため、放熱構造の組み立てを効率よく行うことができる。
また、発熱電子デバイスの上面から第二放熱部材に伝えられた熱を、基板だけではなく、固定手段から第一放熱部材に逃がすことも可能となる。言い換えれば、熱を第二放熱部材から基板に逃がす第一放熱ルートと、第二放熱部材から固定手段を介して第一放熱部材に逃がす第二放熱ルートの二つを確保できるため、発熱電子デバイスの上面側からの放熱をさらに効率よく行うことが可能となる。 In this configuration, the heat generating electronic device can be fixed to the first heat radiating member by the same fixing means, and at the same time, the second heat radiating member can be fixed to the upper surface of the heat generating electronic device. Can do.
In addition, it is possible to release the heat transmitted from the upper surface of the heat generating electronic device to the second heat radiating member not only from the substrate but also from the fixing means to the first heat radiating member. In other words, it is possible to secure two heat dissipation routes: a first heat dissipation route for releasing heat from the second heat dissipation member to the substrate and a second heat dissipation route for releasing heat from the second heat dissipation member to the first heat dissipation member via the fixing means. It is possible to further efficiently dissipate heat from the upper surface side.

さらに、前記発熱電子デバイスの放熱構造においては、前記第一放熱部材及び前記第二放熱部材が、前記固定手段を介して互いに電気接続されていてもよい。   Furthermore, in the heat dissipation structure of the heat generating electronic device, the first heat dissipation member and the second heat dissipation member may be electrically connected to each other via the fixing means.

この構成では、第一放熱部材及び第二放熱部材を同電位に設定することができる。したがって、例えば第一放熱部材を接地させるだけで、第二放熱部材も接地させることができ、発熱電子デバイスを含む回路の動作安定化を図ることができる。
そして、第一放熱部材及び第二放熱部材が固定手段を介して互いに電気接続されることに加え、前述したように、第一放熱部材及び第二放熱部材が回路基板及び伝熱用突起部を介して互いに電気接続される場合には、第一放熱部材、第二放熱部材及び基板が、第一放熱部材から第二放熱部材、基板を順番に経て再び第一放熱部材に戻るループ状の電気経路を画成することができる。 In this configuration, the first heat radiating member and the second heat radiating member can be set to the same potential. Therefore, for example, only by grounding the first heat radiating member, the second heat radiating member can also be grounded, and the operation of the circuit including the heat generating electronic device can be stabilized.
In addition to the first heat radiating member and the second heat radiating member being electrically connected to each other through the fixing means, as described above, the first heat radiating member and the second heat radiating member are connected to the circuit board and the heat transfer protrusion. The first heat dissipating member, the second heat dissipating member, and the substrate are connected to each other via the first heat dissipating member, the second heat dissipating member, and the substrate in order, and then returned to the first heat dissipating member again. A route can be defined.

また、前記発熱電子デバイスの放熱構造においては、前記基板の上面に、第三放熱部材が配されていてもよい。
この構成では、発熱電子デバイスの上面から第二放熱部材を介して基板に伝えられた熱を、さらに、第三放熱部材に逃がすことが可能となる。したがって、発熱電子デバイスの上面側からの放熱をさらに効率よく行うことができる。 In the heat dissipation structure of the heat generating electronic device, a third heat dissipation member may be disposed on the upper surface of the substrate.
In this configuration, the heat transferred from the upper surface of the heat generating electronic device to the substrate via the second heat radiating member can be further released to the third heat radiating member. Therefore, heat dissipation from the upper surface side of the heat generating electronic device can be performed more efficiently.

本発明によれば、発熱電子デバイスと基板との隙間に熱がこもることを防いで、発熱電子デバイスの上面側からの放熱を効率よく行うことができる。   According to the present invention, it is possible to prevent heat from being trapped in the gap between the heat generating electronic device and the substrate, and to efficiently dissipate heat from the upper surface side of the heat generating electronic device.

本発明の第一実施形態に係る発熱電子デバイスの放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the heat generating electronic device which concerns on 1st embodiment of this invention. 図１に示す発熱電子デバイス及び第二放熱部材をデバイス本体の上面側から見た状態を示す上面図である。It is the top view which shows the state which looked at the exothermic electronic device and 2nd heat radiating member shown in FIG. 1 from the upper surface side of the device main body. 本発明の第二実施形態に係る発熱電子デバイスの放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the heat generating electronic device which concerns on 2nd embodiment of this invention. 図３に示す発熱電子デバイスの放熱構造の変形例を示す側断面図である。It is a sectional side view which shows the modification of the thermal radiation structure of the heat-emitting electronic device shown in FIG. 本発明の第三実施形態に係る発熱電子デバイスの放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the heat generating electronic device which concerns on 3rd embodiment of this invention. 本発明の第四実施形態に係る発熱電子デバイスの放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the heat generating electronic device which concerns on 4th embodiment of this invention. 本発明の第五実施形態に係る発熱電子デバイスの放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the heat generating electronic device which concerns on 5th embodiment of this invention.

〔第一実施形態〕
以下、図１，２を参照して本発明の第一実施形態について説明する。
図１，２に示すように、この実施形態に係る発熱電子デバイスの放熱構造は、発熱電子デバイス２と、第一放熱部材３と、第二放熱部材４と、回路基板５とを備えて大略構成されている。
発熱電子デバイス２は、パワートランジスタをはじめとする半導体パッケージ等のように通電により発熱するものであり、デバイス本体２１、及び、デバイス本体２１から突出する電気接続用の複数（図示例では三つ）の外部端子２２を有して構成されている。 [First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the heat dissipation structure for a heat generating electronic device according to this embodiment includes a heat generating electronic device 2, a first heat dissipation member 3, a second heat dissipation member 4, and a circuit board 5. It is configured.
The heat generating electronic device 2 generates heat when energized like a semiconductor package including a power transistor, and the device main body 21 and a plurality of electrical connections (three in the illustrated example) protruding from the device main body 21. The external terminal 22 is configured.

本実施形態におけるデバイス本体２１は、平面視矩形の板状に形成されており、例えば通電により発熱する半導体素子（不図示）を樹脂内に埋設して構成されている。一方、複数の外部端子２２は、それぞれ銅材等の導電性材料を針状に形成してなり、それぞれデバイス本体２１の同一の側面２１ｃからデバイス本体２１の主面（上面２１ａあるいは下面２１ｂ）に沿う方向に突出して形成されている。また、各外部端子２２は、その突出方向の先端部２４が基端部２３に対して折り曲げられることで、略Ｌ字状に形成されている。これにより、各外部端子２２の先端部２４は、デバイス本体２１の上面２１ａよりも上方に突出するように、デバイス本体２１の板厚方向に延びている。   The device main body 21 in the present embodiment is formed in a rectangular plate shape in plan view, and is configured, for example, by embedding a semiconductor element (not shown) that generates heat when energized in a resin. On the other hand, each of the plurality of external terminals 22 is formed by forming a conductive material such as a copper material into a needle shape, and from the same side surface 21c of the device body 21 to the main surface (upper surface 21a or lower surface 21b) of the device body 21. It protrudes in the direction along. Each external terminal 22 is formed in a substantially L shape by bending the distal end portion 24 in the protruding direction with respect to the proximal end portion 23. Thereby, the front-end | tip part 24 of each external terminal 22 is extended in the plate | board thickness direction of the device main body 21 so that it may protrude above the upper surface 21a of the device main body 21. FIG.

第一放熱部材３は、アルミニウム等のように熱伝導性に優れた導電性材料を、例えば板状に形成して構成されている。前述した発熱電子デバイス２は、デバイス本体２１の下面２１ｂが第一放熱部材３の上面（搭載面）３ａに対向するように、第一放熱部材３の上面３ａに搭載されている。なお、図示はしていないが、発熱電子デバイス２（特に外部端子２２）と第一放熱部材３との電気的な絶縁を確実に図れるように、第一放熱部材３の上面３ａと発熱電子デバイス２との間には、例えば電気的な絶縁性を有する絶縁シートが配されていてもよい。   The first heat radiating member 3 is configured by forming a conductive material having excellent thermal conductivity such as aluminum in a plate shape, for example. The heat-generating electronic device 2 described above is mounted on the upper surface 3a of the first heat radiating member 3 so that the lower surface 21b of the device body 21 faces the upper surface (mounting surface) 3a of the first heat radiating member 3. Although not shown, the upper surface 3a of the first heat radiating member 3 and the heat generating electronic device can be reliably insulated from the heat generating electronic device 2 (especially the external terminal 22) and the first heat radiating member 3. Between the two, for example, an insulating sheet having an electrical insulating property may be disposed.

そして、発熱電子デバイス２は、搭載用ネジ（固定手段）６によって第一放熱部材３の上面３ａに固定されている。具体的に説明すれば、発熱電子デバイス２は、デバイス本体２１の板厚方向に貫通して形成された貫通孔（不図示）に搭載用ネジ６の軸部６２を挿通させた上で、第一放熱部材３の上面３ａに形成された雌ネジ孔３１に螺着させることで、第一放熱部材３の上面３ａに固定されている。   The heat generating electronic device 2 is fixed to the upper surface 3 a of the first heat radiating member 3 by mounting screws (fixing means) 6. More specifically, the heat generating electronic device 2 is configured such that the shaft 62 of the mounting screw 6 is inserted into a through hole (not shown) formed through the device body 21 in the plate thickness direction. The first heat radiating member 3 is fixed to the upper surface 3 a by being screwed into a female screw hole 31 formed in the upper surface 3 a of the heat radiating member 3.

また、第一放熱部材３には、その上面３ａから突出する筒状突起部（伝熱用突起部）３２（図示例では円筒状）が形成されている。そして、筒状突起部３２の先端面３２ａに、後述する回路基板５が載置されるようになっている。したがって、第一放熱部材３の上面３ａに対する回路基板５の高さ位置は、筒状突起部３２の突出高さによって設定されている。
本実施形態では、筒状突起部３２の先端面３２ａに載置された回路基板５が第一放熱部材３の上面３ａ及びデバイス本体２１の上方に間隔をあけて位置するように、筒状突起部３２の突出高さが設定されている。また、本実施形態では、筒状突起部３２の先端面３２ａが第一放熱部材３の上面３ａに平行しており、これによって、回路基板５の主面（上面５ａや下面５ｂ）が第一放熱部材３の上面３ａに対して平行している。 The first heat radiating member 3 is formed with a cylindrical protrusion (heat transfer protrusion) 32 (cylindrical in the illustrated example) protruding from the upper surface 3a. A circuit board 5 to be described later is placed on the distal end surface 32a of the cylindrical protrusion 32. Therefore, the height position of the circuit board 5 with respect to the upper surface 3 a of the first heat radiating member 3 is set by the protruding height of the cylindrical protrusion 32.
In the present embodiment, the cylindrical protrusion is arranged such that the circuit board 5 placed on the distal end surface 32 a of the cylindrical protrusion 32 is positioned above the upper surface 3 a of the first heat radiating member 3 and the device body 21 with a space therebetween. The protruding height of the portion 32 is set. Moreover, in this embodiment, the front end surface 32a of the cylindrical projection part 32 is parallel to the upper surface 3a of the 1st heat radiating member 3, Thereby, the main surface (the upper surface 5a and the lower surface 5b) of the circuit board 5 is 1st. The heat radiating member 3 is parallel to the upper surface 3a.

そして、筒状突起部３２には、その先端面３２ａから窪むように形成され、回路基板５を第一放熱部材３に固定するためのねじ（固定用ネジ７）を螺着させる雌ネジ孔３３が形成されている。
上述した筒状突起部３２は、図示例のように一つだけ形成されるのではなく、回路基板５を安定して支持できるように、互いに間隔をあけて複数形成されているとよい。 The cylindrical protrusion 32 has a female screw hole 33 formed so as to be recessed from the distal end surface 32 a and screwed with a screw (fixing screw 7) for fixing the circuit board 5 to the first heat radiating member 3. Is formed.
The above-described cylindrical protrusions 32 are not only formed as in the illustrated example, but a plurality of cylindrical protrusions 32 may be formed at intervals so as to stably support the circuit board 5.

第二放熱部材４は、第一放熱部材３と同様に、銅、アルミニウム等のように熱伝導性に優れた導電性材料からなり、デバイス本体２１の上面２１ａに固定されている。第二放熱部材４は、板状に形成されてデバイス本体２１の上面２１ａに面接触するように重ねて配される本体部４１と、本体部４１から回路基板５に向けて突出する複数の接続突起４２とを一体に形成して構成されている。   Similar to the first heat radiating member 3, the second heat radiating member 4 is made of a conductive material having excellent thermal conductivity such as copper, aluminum, and the like, and is fixed to the upper surface 21 a of the device body 21. The second heat dissipating member 4 is formed in a plate shape and is disposed so as to be in surface contact with the upper surface 21a of the device main body 21 and a plurality of connections protruding from the main body 41 toward the circuit board 5 The protrusion 42 is integrally formed.

本体部４１の板厚は、デバイス本体２１の上面２１ａと回路基板５の下面５ｂとの隙間寸法よりも小さくなるように設定されている。この本体部４１には、その板厚方向に貫通して、発熱電子デバイス２を第一放熱部材３に固定するための搭載用ネジ６の軸部６２を挿通させるネジ挿通孔（不図示）が形成されている。このネジ挿通孔の孔径は、搭載用ネジ６の軸部６２の外径よりも大きく、かつ、搭載用ネジ６の頭部６１の外径よりも小さい。これにより、本実施形態の第二放熱部材４は、搭載用ネジ６によってデバイス本体２１の上面２１ａに固定されている。言い換えれば、本実施形態では、同一の搭載用ネジ６によって、発熱電子デバイス２が第一放熱部材３の上面３ａに固定されると同時に、第二放熱部材４がデバイス本体２１の上面２１ａに固定されている。
また、本実施形態では、搭載用ネジ６が導電性を有している。このため、搭載用ネジ６によって発熱電子デバイス２及び第二放熱部材４が第一放熱部材３上に固定された状態では、第一放熱部材３と第二放熱部材４とが搭載用ネジ６を介して機械的に接続されると共に電気的にも接続されている。 The plate thickness of the main body 41 is set to be smaller than the gap dimension between the upper surface 21 a of the device main body 21 and the lower surface 5 b of the circuit board 5. The body portion 41 has a screw insertion hole (not shown) that penetrates in the thickness direction of the body portion 41 and allows the shaft portion 62 of the mounting screw 6 for fixing the heat generating electronic device 2 to the first heat radiating member 3 to be inserted. Is formed. The diameter of the screw insertion hole is larger than the outer diameter of the shaft portion 62 of the mounting screw 6 and smaller than the outer diameter of the head 61 of the mounting screw 6. Thereby, the second heat radiating member 4 of the present embodiment is fixed to the upper surface 21 a of the device body 21 by the mounting screws 6. In other words, in the present embodiment, the heat generating electronic device 2 is fixed to the upper surface 3a of the first heat radiating member 3 and the second heat radiating member 4 is fixed to the upper surface 21a of the device body 21 by the same mounting screw 6. Has been.
Moreover, in this embodiment, the mounting screw 6 has conductivity. Therefore, in a state where the heat generating electronic device 2 and the second heat radiating member 4 are fixed on the first heat radiating member 3 by the mounting screws 6, the first heat radiating member 3 and the second heat radiating member 4 attach the mounting screws 6. It is connected mechanically and electrically.

各接続突起４２は、例えば発熱電子デバイス２の外部端子２２と同様の針状に形成されている。そして、複数の接続突起４２は、本体部４１の上面４１ａにおいて、互いに間隔をあけて配列されている。ただし、接続突起４２は、本体部４１の上面４１ａのうち搭載用ネジ６の頭部６１が当接する領域には形成されていない。   Each connection protrusion 42 is formed in a needle shape similar to the external terminal 22 of the heat generating electronic device 2, for example. The plurality of connection protrusions 42 are arranged at intervals on the upper surface 41 a of the main body 41. However, the connection protrusion 42 is not formed in the region of the upper surface 41 a of the main body 41 where the head 61 of the mounting screw 6 abuts.

回路基板５は、その上面５ａや下面５ｂに、発熱電子デバイス２などと共に電気回路を構成するための電気配線パターン（不図示）を形成して大略構成されている。この電気配線パターンは例えば銅箔などからなる。また、回路基板５の上面５ａには、第二放熱部材４の接続突起４２に電気接続される放熱用配線パターン５１も形成されている。この放熱用配線パターン５１は、前述の電気配線パターンと同様に銅箔等によって形成されている。   The circuit board 5 is generally configured by forming an electric wiring pattern (not shown) for forming an electric circuit together with the heat generating electronic device 2 on the upper surface 5a and the lower surface 5b. This electrical wiring pattern is made of, for example, copper foil. Further, a heat radiation wiring pattern 51 that is electrically connected to the connection protrusion 42 of the second heat radiation member 4 is also formed on the upper surface 5 a of the circuit board 5. The heat radiation wiring pattern 51 is formed of a copper foil or the like in the same manner as the electric wiring pattern described above.

また、回路基板５には、その厚さ方向に貫通するネジ挿通孔（不図示）が形成されている。このネジ挿通孔は、第一放熱部材３の筒状突起部３２に螺着させる固定用ネジ７の軸部７２を挿通させるものであり、その孔径は、固定用ネジ７の軸部７２の外径よりも大きく、かつ、固定用ネジ７の頭部７１の外径や筒状突起部３２の外径よりも小さくなるように設定されている。
したがって、このネジ挿通孔に固定用ネジ７の軸部７２を挿通させた上で、筒状突起部３２の雌ネジ孔３３に螺着させることにより、回路基板５が、筒状突起部３２と固定用ネジ７の頭部７１との間に挟みこまれて、第一放熱部材３に固定されることになる。 The circuit board 5 is formed with a screw insertion hole (not shown) penetrating in the thickness direction. This screw insertion hole is for inserting the shaft portion 72 of the fixing screw 7 screwed into the cylindrical projection 32 of the first heat radiating member 3, and the hole diameter is outside the shaft portion 72 of the fixing screw 7. The outer diameter of the head 71 of the fixing screw 7 and the outer diameter of the cylindrical protrusion 32 are set to be larger than the diameter.
Therefore, after the shaft portion 72 of the fixing screw 7 is inserted into the screw insertion hole and screwed into the female screw hole 33 of the cylindrical projection 32, the circuit board 5 is connected to the cylindrical projection 32. It is sandwiched between the head 71 of the fixing screw 7 and fixed to the first heat radiating member 3.

ここで、回路基板５の上面５ａのうち固定用ネジ７の頭部７１が押し付けられる領域には、放熱用配線パターン５１が形成されている。このため、回路基板５を固定用ネジ７でネジ止めした状態では、固定用ネジ７と放熱用配線パターン５１とが機械的に接続されることになる。また、本実施形態では、固定用ネジ７が導電性材料によって形成されており、これによって、第一放熱部材３が筒状突起部３２及び固定用ネジ７を介して回路基板５の放熱用配線パターン５１に電気的に接続されている。   Here, a heat radiation wiring pattern 51 is formed in a region of the upper surface 5 a of the circuit board 5 where the head 71 of the fixing screw 7 is pressed. For this reason, in a state where the circuit board 5 is screwed with the fixing screw 7, the fixing screw 7 and the heat radiation wiring pattern 51 are mechanically connected. Further, in the present embodiment, the fixing screw 7 is formed of a conductive material, whereby the first heat radiating member 3 is connected to the circuit board 5 through the cylindrical protrusion 32 and the fixing screw 7. It is electrically connected to the pattern 51.

さらに、回路基板５には、その厚さ方向に貫通する接続用孔５２及び放熱用挿通孔５３が形成されている。
接続用孔５２は、前述したように回路基板５を第一放熱部材３に固定する際に、第一放熱部材３に固定された発熱電子デバイス２の外部端子２２の先端部２４を回路基板５の下面５ｂ側から上面５ａ側に挿通させるものである。そして、外部端子２２の先端部２４のうち回路基板５の上面５ａから突出した部分が、はんだ等の導電性接合剤によって回路基板５の上面５ａの電気配線パターン（不図示）に接合されている。これによって、発熱電子デバイス２が回路基板５に電気接続されている。 Further, the circuit board 5 is formed with a connection hole 52 and a heat radiation insertion hole 53 penetrating in the thickness direction.
When the circuit board 5 is fixed to the first heat radiating member 3 as described above, the connection hole 52 connects the tip 24 of the external terminal 22 of the heat generating electronic device 2 fixed to the first heat radiating member 3 to the circuit board 5. Is inserted from the lower surface 5b side to the upper surface 5a side. And the part which protruded from the upper surface 5a of the circuit board 5 among the front-end | tip parts 24 of the external terminal 22 is joined to the electrical wiring pattern (not shown) of the upper surface 5a of the circuit board 5 with conductive bonding agents, such as solder. . Thereby, the heat generating electronic device 2 is electrically connected to the circuit board 5.

放熱用挿通孔５３は、接続用孔５２の場合と同様に、回路基板５を第一放熱部材３に固定する際に、第二放熱部材４の接続突起４２を挿通させるものである。放熱用挿通孔５３は、複数の接続突起４２を個別に挿通させるように複数形成されている。そして、回路基板５の上面５ａから突出した接続突起４２は、はんだ等の導電性接合剤によって回路基板５の上面５ａに形成された放熱用配線パターン５１に接合されている。これにより、第二放熱部材４が放熱用配線パターン５１に対して機械的に接続されると共に電気的にも接続されている。
以上のことから、第一放熱部材３及び第二放熱部材４は、筒状突起部３２、固定用ネジ７及び回路基板５の放熱用配線パターン５１を介して、互いに機械的に接続されると共に電気的にも接続されている。 As in the case of the connection hole 52, the heat dissipation insertion hole 53 allows the connection protrusion 42 of the second heat dissipation member 4 to be inserted when the circuit board 5 is fixed to the first heat dissipation member 3. A plurality of heat dissipation insertion holes 53 are formed so that the plurality of connection protrusions 42 are individually inserted. The connection protrusions 42 protruding from the upper surface 5a of the circuit board 5 are bonded to a heat radiation wiring pattern 51 formed on the upper surface 5a of the circuit board 5 by a conductive bonding agent such as solder. Thereby, the second heat radiating member 4 is mechanically connected to the heat radiating wiring pattern 51 and also electrically connected thereto.
From the above, the first heat radiating member 3 and the second heat radiating member 4 are mechanically connected to each other via the cylindrical protrusion 32, the fixing screw 7 and the heat radiating wiring pattern 51 of the circuit board 5. It is also electrically connected.

次に、上述したように構成される放熱構造を組み立てる組立方法の一例について説明する。
本実施形態の放熱構造を組み立てる場合には、はじめに、発熱電子デバイス２を第一放熱部材３の上面３ａに載置し、デバイス本体２１の上面２１ａに第二放熱部材４を重ねて載置する。次いで、同一の搭載用ネジ６によって発熱電子デバイス２及び第二放熱部材４を第一放熱部材３にネジ止めする。これにより、発熱電子デバイス２及び第二放熱部材４が同時に第一放熱部材３の上面３ａに重ねて固定される。 Next, an example of an assembly method for assembling the heat dissipation structure configured as described above will be described.
When assembling the heat dissipation structure of this embodiment, first, the heat generating electronic device 2 is placed on the upper surface 3a of the first heat dissipation member 3, and the second heat dissipation member 4 is placed on the upper surface 21a of the device body 21 in an overlapping manner. . Next, the heat generating electronic device 2 and the second heat radiating member 4 are screwed to the first heat radiating member 3 with the same mounting screw 6. Thereby, the heat generating electronic device 2 and the second heat radiating member 4 are simultaneously overlapped and fixed on the upper surface 3 a of the first heat radiating member 3.

そして、発熱電子デバイス２の外部端子２２及び第二放熱部材４の接続突起４２を回路基板５に差し込んだ上で（回路基板５の接続用孔５２及び放熱用挿通孔５３にそれぞれ挿通させた上で）、回路基板５のネジ挿通孔（不図示）が筒状突起部３２の雌ネジ孔３３に重なるように回路基板５を筒状突起部３２の先端面３２ａに載置する。この状態においては、発熱電子デバイス２の外部端子２２及び第二放熱部材４の接続突起４２の先端が回路基板５の上面５ａから突出している。   Then, the external terminals 22 of the heat generating electronic device 2 and the connection protrusions 42 of the second heat radiation member 4 are inserted into the circuit board 5 (after being inserted into the connection holes 52 and the heat radiation insertion holes 53 of the circuit board 5 respectively). The circuit board 5 is placed on the distal end surface 32 a of the cylindrical protrusion 32 so that the screw insertion hole (not shown) of the circuit board 5 overlaps the female screw hole 33 of the cylindrical protrusion 32. In this state, the external terminals 22 of the heat generating electronic device 2 and the tips of the connection protrusions 42 of the second heat radiating member 4 protrude from the upper surface 5 a of the circuit board 5.

その後、例えば回路基板５の上面５ａ側においてはんだ付けを実施して、外部端子２２及び接続突起４２をそれぞれ回路基板５に接合する。これによって、外部端子２２が回路基板５の電気配線パターン（不図示）に電気接続されることになる。また、第二放熱部材４が、回路基板５に固定されると共に、回路基板５の放熱用配線パターン５１に電気接続されることになる。
最後に、固定用ネジ７により回路基板５を筒状突起部３２の先端面３２ａに固定することで、本実施形態の放熱構造の組み立てが完了する。なお、固定用ネジ７で回路基板５を固定することで、第二放熱部材４が、回路基板５の放熱用配線パターン５１、固定用ネジ７及び筒状突起部３２を介して第一放熱部材３に電気的に接続されることになる。 Thereafter, for example, soldering is performed on the upper surface 5 a side of the circuit board 5, and the external terminals 22 and the connection protrusions 42 are joined to the circuit board 5. As a result, the external terminals 22 are electrically connected to an electrical wiring pattern (not shown) of the circuit board 5. Further, the second heat radiation member 4 is fixed to the circuit board 5 and is electrically connected to the heat radiation wiring pattern 51 of the circuit board 5.
Finally, the circuit board 5 is fixed to the distal end surface 32a of the cylindrical protrusion 32 with the fixing screw 7, thereby completing the assembly of the heat dissipation structure of the present embodiment. In addition, by fixing the circuit board 5 with the fixing screw 7, the second heat radiating member 4 is connected to the first heat radiating member via the heat radiating wiring pattern 51 of the circuit board 5, the fixing screw 7 and the cylindrical protrusion 32. 3 is electrically connected.

そして、本実施形態の放熱構造において、発熱電子デバイス２が通電により発熱した場合には、発熱電子デバイス２の熱を発熱電子デバイス２の下面２１ｂから第一放熱部材３に逃がすことができると共に、発熱電子デバイス２の上面２１ａから第二放熱部材４にも逃がすことができる。なお、図１に示す第二放熱部材４では、本体部４１の板厚が、発熱電子デバイス２と回路基板５との隙間に位置する接続突起４２の長さ寸法よりも小さく設定されているが、例えば接続突起４２の長さ寸法よりも大きく設定すれば、第二放熱部材４の熱容量拡大を図って、発熱電子デバイス２の熱をより効率よく第二放熱部材４に逃がすことができる。   In the heat dissipation structure of the present embodiment, when the heat generating electronic device 2 generates heat by energization, the heat of the heat generating electronic device 2 can be released from the lower surface 21b of the heat generating electronic device 2 to the first heat radiating member 3, It can escape also from the upper surface 21a of the heat generating electronic device 2 to the second heat radiating member 4. In the second heat radiating member 4 shown in FIG. 1, the plate thickness of the main body 41 is set smaller than the length dimension of the connection protrusion 42 located in the gap between the heat generating electronic device 2 and the circuit board 5. For example, if it is set larger than the length dimension of the connection protrusion 42, the heat capacity of the second heat radiating member 4 can be increased, and the heat of the heat generating electronic device 2 can be released to the second heat radiating member 4 more efficiently.

さらに、第二放熱部材４が回路基板５に固定されていることで、発熱電子デバイス２の熱を第二放熱部材４から回路基板５まで逃がすことができる。したがって、例え発熱電子デバイス２と回路基板５との隙間に空気が流れなくても、発熱電子デバイス２と回路基板５との隙間に熱がこもってしまうことを防ぐことができる。言い換えれば、発熱電子デバイス２の上面２１ａ側からの放熱を効率よく行うことが可能となる。   Furthermore, since the second heat radiating member 4 is fixed to the circuit board 5, the heat of the heat generating electronic device 2 can be released from the second heat radiating member 4 to the circuit board 5. Therefore, even if air does not flow in the gap between the heat generating electronic device 2 and the circuit board 5, it is possible to prevent heat from being accumulated in the gap between the heat generating electronic device 2 and the circuit board 5. In other words, it is possible to efficiently dissipate heat from the upper surface 21a side of the heat generating electronic device 2.

また、本実施形態の放熱構造では、第二放熱部材４が回路基板５の放熱用配線パターン５１に接続されているため、第二放熱部材４から回路基板５に伝わる熱が、放熱用配線パターン５１に伝わり易くなるため、回路基板５のうち放熱用配線パターン５１の形成領域を除く他の領域には伝わり難くなる。言い換えれば、回路基板５において熱が伝わる領域を制限することが可能となる。したがって、例えば熱に弱い回路（熱に弱い電子部品などを含むもの）が回路基板５に設けられていても、このような回路が熱の影響を受けることを抑制することができる。   In the heat dissipation structure of the present embodiment, since the second heat dissipation member 4 is connected to the heat dissipation wiring pattern 51 of the circuit board 5, the heat transferred from the second heat dissipation member 4 to the circuit board 5 is the heat dissipation wiring pattern. 51, the circuit board 5 is less likely to be transmitted to other regions except the region where the heat radiation wiring pattern 51 is formed. In other words, it is possible to limit the region where heat is transmitted in the circuit board 5. Therefore, for example, even if a circuit that is vulnerable to heat (including electronic components that are vulnerable to heat) is provided on the circuit board 5, it is possible to suppress such a circuit from being affected by heat.

さらに、本実施形態の放熱構造では、第一放熱部材３が筒状突起部３２及び固定用ネジ７を介して回路基板５の放熱用配線パターン５１に機械的に接続されているため、第二放熱部材４から放熱用配線パターン５１に伝えられた熱を、第一放熱部材３に逃がすことが可能となる。なお、第一放熱部材３の熱容量は、第二放熱部材４や放熱用配線パターン５１の熱容量よりも容易に大きく設定することができるため、放熱用配線パターン５１の熱を第一放熱部材３に逃がすことは非常に有効である。   Furthermore, in the heat dissipation structure of the present embodiment, the first heat dissipation member 3 is mechanically connected to the heat dissipation wiring pattern 51 of the circuit board 5 via the cylindrical protrusion 32 and the fixing screw 7. The heat transferred from the heat dissipation member 4 to the heat dissipation wiring pattern 51 can be released to the first heat dissipation member 3. Since the heat capacity of the first heat radiating member 3 can be easily set larger than the heat capacity of the second heat radiating member 4 and the heat radiating wiring pattern 51, the heat of the heat radiating wiring pattern 51 is transferred to the first heat radiating member 3. It is very effective to escape.

また、本実施形態の放熱構造では、第二放熱部材４が搭載用ネジ６を介して第一放熱部材３に機械的に接続されているため、発熱電子デバイス２の上面２１ａから第二放熱部材４に伝えられた熱を、回路基板５だけではなく、搭載用ネジ６から第一放熱部材３に逃がすことも可能となる。言い換えれば、熱を第二放熱部材４から回路基板５に逃がす第一放熱ルートと、第二放熱部材４から搭載用ネジ６を介して第一放熱部材３に逃がす第二放熱ルートの二つを確保できるため、発熱電子デバイス２の上面２１ａ側からの放熱をさらに効率よく行うことが可能となる。   Further, in the heat dissipation structure of the present embodiment, the second heat dissipation member 4 is mechanically connected to the first heat dissipation member 3 via the mounting screws 6, so that the second heat dissipation member is exposed from the upper surface 21 a of the heat generating electronic device 2. The heat transmitted to 4 can be released not only from the circuit board 5 but also from the mounting screw 6 to the first heat radiating member 3. In other words, the first heat dissipation route for releasing heat from the second heat dissipation member 4 to the circuit board 5 and the second heat dissipation route for releasing heat from the second heat dissipation member 4 to the first heat dissipation member 3 via the mounting screws 6 are provided. Therefore, it is possible to more efficiently dissipate heat from the upper surface 21a side of the heat generating electronic device 2.

さらに、本実施形態の放熱構造では、第一放熱部材３及び第二放熱部材４が、回路基板５、固定用ネジ７及び筒状突起部３２を介して互いに電気接続され、また、搭載用ネジ６を介して互いに電気接続されているため、第一放熱部材３及び第二放熱部材４を同電位に設定することができる。したがって、例えば第一放熱部材３を接地させるだけで、第二放熱部材４も接地させることができ、発熱電子デバイス２及び回路基板５を含む回路の動作安定化を図ることができる。
また、本実施形態の放熱構造では、第一放熱部材３及び第二放熱部材４が上述のように電気接続されることで、第一放熱部材３から第二放熱部材４、回路基板５を順番に経て再び第一放熱部材３に戻るループ状の電気経路を画成することもできる。 Furthermore, in the heat dissipation structure of the present embodiment, the first heat dissipation member 3 and the second heat dissipation member 4 are electrically connected to each other via the circuit board 5, the fixing screw 7, and the cylindrical protrusion 32, and the mounting screw 6, the first heat radiating member 3 and the second heat radiating member 4 can be set to the same potential. Therefore, for example, the second heat radiating member 4 can be grounded only by grounding the first heat radiating member 3, and the operation of the circuit including the heat generating electronic device 2 and the circuit board 5 can be stabilized.
In the heat dissipation structure of the present embodiment, the first heat dissipation member 3 and the second heat dissipation member 4 are electrically connected as described above, so that the first heat dissipation member 3 to the second heat dissipation member 4 and the circuit board 5 are sequentially arranged. It is also possible to define a loop-shaped electric path that returns to the first heat radiating member 3 again after passing through.

さらに、本実施形態の放熱構造では、同一の搭載用ネジ６によって、発熱電子デバイス２を第一放熱部材３に固定すると同時に、第二放熱部材４が発熱電子デバイス２の上面２１ａに固定されるため、放熱構造の組み立てを効率よく行うことができる。
また、本実施形態の放熱構造では、第二放熱部材４の接続突起４２が回路基板５の放熱用挿通孔５３に挿通されるため、第二放熱部材４をはんだ付け等によって容易に回路基板５に対して機械的に接続することができる。特に、本実施形態では、発熱電子デバイス２の外部端子２２も接続突起４２と同様に回路基板５の接続用孔５２に挿通されるため、発熱電子デバイス２の外部端子２２をはんだ付けする工程において、接続突起４２もはんだ付けによって同時に回路基板５に接続することができる。したがって、回路基板５に対する第二放熱部材４の機械的な接続を効率よく行うことができる。 Furthermore, in the heat dissipation structure of the present embodiment, the second heat radiating member 4 is fixed to the upper surface 21 a of the heat generating electronic device 2 at the same time that the heat generating electronic device 2 is fixed to the first heat radiating member 3 with the same mounting screw 6. Therefore, the assembly of the heat dissipation structure can be performed efficiently.
Further, in the heat dissipation structure of the present embodiment, since the connection protrusion 42 of the second heat dissipation member 4 is inserted into the heat dissipation insertion hole 53 of the circuit board 5, the second heat dissipation member 4 can be easily soldered or the like. Can be mechanically connected. In particular, in the present embodiment, the external terminals 22 of the heat generating electronic device 2 are also inserted into the connection holes 52 of the circuit board 5 in the same manner as the connection protrusions 42. Therefore, in the step of soldering the external terminals 22 of the heat generating electronic device 2 The connection protrusions 42 can be simultaneously connected to the circuit board 5 by soldering. Therefore, the mechanical connection of the second heat radiating member 4 to the circuit board 5 can be performed efficiently.

さらに、本実施形態の放熱構造では、複数の接続突起４２がそれぞれ針状に形成されていることで、個々の接続突起４２の熱容量を小さく抑えることができるため、各接続突起４２をはんだ付けによって回路基板５に接合する際には、はんだの溶融に要する熱を小さくできる。したがって、複数の接続突起４２を回路基板５に対して短時間で確実にはんだ付けすることが可能となる。
一方、針状の接続突起４２が複数形成されていることで、複数の接続突起４２の合計の熱容量を大きく設定することができるため、発熱電子デバイス２の熱を第二放熱部材４から回路基板５まで効率よく逃がすことができる。 Furthermore, in the heat dissipation structure of the present embodiment, since the plurality of connection protrusions 42 are each formed in a needle shape, the heat capacity of each connection protrusion 42 can be kept small, so that each connection protrusion 42 is soldered. When joining to the circuit board 5, the heat required for melting the solder can be reduced. Therefore, the plurality of connection protrusions 42 can be reliably soldered to the circuit board 5 in a short time.
On the other hand, since the plurality of needle-like connection protrusions 42 are formed, the total heat capacity of the plurality of connection protrusions 42 can be set large, so that the heat of the heat generating electronic device 2 is transferred from the second heat dissipation member 4 to the circuit board. Efficiently escapes up to 5.

〔第二実施形態〕
次に、図３を参照して本発明の第二実施形態について説明する。
この実施形態では、第一実施形態の放熱構造と比較して、第二放熱部材の構成のみが異なっており、その他の構成については第一実施形態と同様である。本実施形態では、第一実施形態と同一の構成要素について同一符号を付す等して、その説明を省略する。 [Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
In this embodiment, compared with the heat dissipation structure of the first embodiment, only the configuration of the second heat dissipation member is different, and the other configurations are the same as those of the first embodiment. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施形態の第二放熱部材８は、第一実施形態のものと同様に、板状に形成されてデバイス本体２１の上面２１ａに面接触するように重ねて配される本体部８１と、本体部８１から回路基板５に向けて突出する複数の接続突起８２とを一体に形成して構成されている。また、本体部８１には、第一実施形態と同様に、搭載用ネジ６の軸部６２を挿通させるネジ挿通孔（不図示）が形成されている。すなわち、本実施形態においても、同一の搭載用ネジ６によって、発熱電子デバイス２が第一放熱部材３の上面３ａに固定されると同時に、第二放熱部材８がデバイス本体２１の上面２１ａに固定されている。   The second heat radiating member 8 of the present embodiment, like the first embodiment, is formed in a plate shape, and a main body portion 81 that is arranged so as to be in surface contact with the upper surface 21a of the device main body 21, and a main body A plurality of connection protrusions 82 protruding from the portion 81 toward the circuit board 5 are integrally formed. Further, similarly to the first embodiment, a screw insertion hole (not shown) through which the shaft portion 62 of the mounting screw 6 is inserted is formed in the main body portion 81. That is, also in the present embodiment, the heat generating electronic device 2 is fixed to the upper surface 3 a of the first heat radiating member 3 by the same mounting screw 6, and at the same time, the second heat radiating member 8 is fixed to the upper surface 21 a of the device body 21. Has been.

ただし、本実施形態の本体部８１の板厚は、第一実施形態のものよりも厚く設定され、本体部８１の上面８１ａが回路基板５の下面５ｂに面接触している。
また、本体部８１には、その上面８１ａから窪む収納凹部８３が形成され、前述したネジ挿通孔はこの収納凹部８３の底面に開口している。したがって、本実施形態の放熱構造では、搭載用ネジ６を第二放熱部材８のネジ挿通孔及びデバイス本体２１の貫通孔（不図示）に挿通させた上で第一放熱部材３の雌ネジ孔３１に螺着させることで、搭載用ネジ６の頭部６１が収納凹部８３に収容され、収納凹部８３の底面に当接する。この状態において、搭載用ネジ６の頭部６１は本体部８１の上面８１ａから突出していない。すなわち、本体部８１の収納凹部８３は、搭載用ネジ６の頭部６１が回路基板５に干渉（当接）することを防いでいる。 However, the plate thickness of the main body 81 of this embodiment is set to be thicker than that of the first embodiment, and the upper surface 81 a of the main body 81 is in surface contact with the lower surface 5 b of the circuit board 5.
The main body 81 is formed with a storage recess 83 that is recessed from the upper surface 81 a, and the screw insertion hole described above is open to the bottom surface of the storage recess 83. Therefore, in the heat dissipation structure of the present embodiment, the mounting screw 6 is inserted through the screw insertion hole of the second heat dissipation member 8 and the through hole (not shown) of the device body 21 and then the female screw hole of the first heat dissipation member 3. The head 61 of the mounting screw 6 is accommodated in the storage recess 83 by being screwed to 31, and comes into contact with the bottom surface of the storage recess 83. In this state, the head 61 of the mounting screw 6 does not protrude from the upper surface 81 a of the main body 81. That is, the housing recess 83 of the main body 81 prevents the head 61 of the mounting screw 6 from interfering (contacting) with the circuit board 5.

本実施形態の放熱構造によれば、第一実施形態と同様の効果を奏する。
また、第二放熱部材８の本体部８１が回路基板５の下面５ｂに面接触していることから、第一実施形態の構成と比較して、第二放熱部材８の熱を回路基板５にさらに効率よく逃がすことが可能となる。
さらに、第一実施形態のものと比較して、本体部８１の体積が大きくなるため、第二放熱部材８の熱容量拡大を図り、発熱電子デバイス２の熱を効率よく第二放熱部材８に逃がすことも可能となる。 According to the heat dissipation structure of the present embodiment, the same effects as in the first embodiment can be obtained.
In addition, since the main body 81 of the second heat radiating member 8 is in surface contact with the lower surface 5b of the circuit board 5, the heat of the second heat radiating member 8 is transferred to the circuit board 5 as compared with the configuration of the first embodiment. Furthermore, it becomes possible to escape efficiently.
Furthermore, since the volume of the main body 81 is larger than that of the first embodiment, the heat capacity of the second heat radiating member 8 is increased, and the heat of the heat generating electronic device 2 is efficiently released to the second heat radiating member 8. It is also possible.

なお、上記第二実施形態では、第二放熱部材８の本体部８１に収納凹部８３が形成されるとしたが、特に形成されていなくてもよい。
この場合には、例えば図４に示すように、回路基板５にも搭載用ネジ６の軸部６２を挿通させる孔を形成しておき、同一の搭載用ネジ６を、これら回路基板５の孔、第二放熱部材８のネジ挿通孔及びデバイス本体２１の貫通孔に挿通させてもよい。すなわち、同一の搭載用ネジ６によって、発熱電子デバイス２、第二放熱部材８及び回路基板５をまとめて第一放熱部材３上に重ねて固定してもよい。このように搭載用ネジ６を用いて回路基板５を第一放熱部材３に固定する場合、第一実施形態に記載の固定用ネジ７（図１参照）は無くても構わない。 In the second embodiment, the housing recess 83 is formed in the main body 81 of the second heat radiating member 8, but it may not be formed in particular.
In this case, for example, as shown in FIG. 4, a hole through which the shaft portion 62 of the mounting screw 6 is inserted is formed in the circuit board 5, and the same mounting screw 6 is inserted into the hole of the circuit board 5. The screw insertion hole of the second heat radiating member 8 and the through hole of the device main body 21 may be inserted. That is, the heat generating electronic device 2, the second heat radiating member 8, and the circuit board 5 may be collectively stacked and fixed on the first heat radiating member 3 with the same mounting screw 6. When the circuit board 5 is fixed to the first heat radiating member 3 using the mounting screws 6 as described above, the fixing screws 7 (see FIG. 1) described in the first embodiment may be omitted.

〔第三実施形態〕
次に、図５を参照して本発明の第三実施形態について説明する。
この実施形態では、第一、第二実施形態の放熱構造と比較して、第二放熱部材と回路基板との接続構造のみが異なっており、その他の構成については第一、第二実施形態と同様である。本実施形態では、第一、第二実施形態と同一の構成要素について同一符号を付す等して、その説明を省略する。 [Third embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG.
In this embodiment, compared to the heat dissipation structure of the first and second embodiments, only the connection structure between the second heat dissipation member and the circuit board is different, and other configurations are the same as those of the first and second embodiments. It is the same. In the present embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted.

本実施形態の第二放熱部材９は、第一，第二実施形態と同様の本体部９１及び複数の接続突起９２を備えて構成されている。本実施形態の本体部９１の板厚は、第一実施形態のものと同様に、デバイス本体２１の上面２１ａと回路基板５の下面５ｂとの隙間寸法よりも小さくなるように設定されている。また、本体部９１の上面９１ａと回路基板５の下面５ｂとの隙間は、本体部９１の板厚以下となるように設定されている。さらに、本体部９１の上面９１ａと回路基板５の下面５ｂとの隙間は、本体部９１の上面９１ａに当接する搭載用ネジ６の頭部６１の高さ寸法以上となるように設定されており、搭載用ネジ６の頭部６１が回路基板５に干渉（当接）することを防いでいる。
そして、本実施形態の放熱構造では、本体部９１の上面９１ａと回路基板５の下面５ｂとの隙間が、例えばシリコーンゲル等の材料からなるゲル状シート（ゲル状部材）１０によって埋められている。このゲル状シート１０は、熱伝導率の高い材料からなることが好ましい。 The second heat radiating member 9 of the present embodiment includes a main body 91 and a plurality of connection protrusions 92 similar to those of the first and second embodiments. The plate thickness of the main body 91 of the present embodiment is set to be smaller than the gap dimension between the upper surface 21a of the device main body 21 and the lower surface 5b of the circuit board 5 as in the first embodiment. Further, the gap between the upper surface 91 a of the main body 91 and the lower surface 5 b of the circuit board 5 is set to be equal to or less than the plate thickness of the main body 91. Further, the gap between the upper surface 91a of the main body 91 and the lower surface 5b of the circuit board 5 is set to be equal to or greater than the height dimension of the head 61 of the mounting screw 6 that contacts the upper surface 91a of the main body 91. The head 61 of the mounting screw 6 is prevented from interfering (contacting) with the circuit board 5.
In the heat dissipation structure of the present embodiment, the gap between the upper surface 91a of the main body 91 and the lower surface 5b of the circuit board 5 is filled with a gel-like sheet (gel-like member) 10 made of a material such as silicone gel. . The gel sheet 10 is preferably made of a material having high thermal conductivity.

本実施形態の放熱構造によれば、第一実施形態と同様の効果を奏する。
また、本体部９１と回路基板５との隙間がゲル状シート１０で埋められていることで、ゲル状シート１０が本体部９１の上面９１ａ及び回路基板５の下面５ｂの両方に面接触するため、本体部９１と回路基板５との間に隙間がある場合と比較して、第二放熱部材９の熱を回路基板５に効率よく逃がすことが可能となる。
さらに、ゲル状シート１０は、第二放熱部材９と比較して柔らかく変形可能であることから、本体部９１と回路基板５との隙間の寸法公差が大きく設定されても、本体部９１と回路基板５との隙間を確実に埋めることができる。したがって、汎用性の高い放熱構造を提供することが可能となる。 According to the heat dissipation structure of the present embodiment, the same effects as in the first embodiment can be obtained.
Further, since the gap between the main body portion 91 and the circuit board 5 is filled with the gel-like sheet 10, the gel-like sheet 10 is in surface contact with both the upper surface 91 a of the main body portion 91 and the lower surface 5 b of the circuit board 5. Compared with the case where there is a gap between the main body portion 91 and the circuit board 5, the heat of the second heat radiating member 9 can be efficiently released to the circuit board 5.
Furthermore, since the gel-like sheet 10 can be softly deformed as compared with the second heat radiating member 9, even if the dimensional tolerance of the gap between the main body 91 and the circuit board 5 is set large, the main body 91 and the circuit The gap with the substrate 5 can be filled reliably. Therefore, it is possible to provide a highly versatile heat dissipation structure.

なお、上記第三実施形態の構成は、前述した第二実施形態にも適用することも可能である。例えば、図３に示す第二実施形態の構成では、搭載用ネジ６の頭部６１を収容する収納凹部８３が形成され、これによって本体部４１の上面４１ａに凹凸が存在している。すなわち、収納凹部８３によって本体部４１の一部と回路基板５との間に隙間が生じている。そこで、例えば上記第三実施形態のゲル状シート１０を収納凹部８３に入れることで、本体部の上面４１ａの凹凸による上記隙間を埋めてもよい。
また、上記第三実施形態では、ゲル状シート１０としているが、少なくとも本体部９１と回路基板５との隙間を埋めるように、この隙間の形状や大きさ等に合わせて柔軟に変形可能なゲル状部材であればよい。すなわち、上記隙間を埋めるゲル状部材は、上記実施形態のようなシート状のもののほか、例えば、板状、ブロック状等の任意の形状に形成されてもよいし、ペースト状のものであってもよい。 The configuration of the third embodiment can also be applied to the second embodiment described above. For example, in the configuration of the second embodiment shown in FIG. 3, an accommodation recess 83 that accommodates the head 61 of the mounting screw 6 is formed, and thereby there is an unevenness on the upper surface 41 a of the main body 41. That is, a gap is generated between part of the main body 41 and the circuit board 5 by the storage recess 83. Therefore, for example, the gap due to the unevenness of the upper surface 41a of the main body portion may be filled by putting the gel-like sheet 10 of the third embodiment into the storage recess 83.
In the third embodiment, the gel sheet 10 is used. However, the gel can be flexibly deformed according to the shape and size of the gap so as to fill at least the gap between the main body 91 and the circuit board 5. Any shape member may be used. That is, the gel-like member that fills the gap may be formed in an arbitrary shape such as a plate shape or a block shape in addition to the sheet shape as in the above embodiment, or may be a paste shape. Also good.

〔第四実施形態〕
次に、図６を参照して本発明の第四実施形態について説明する。
この実施形態では、第一実施形態の放熱構造と比較して、第三放熱部材を新たに追加した点のみが異なっており、その他の構成については第一実施形態と同様である。本実施形態では、第一実施形態と同一の構成要素について同一符号を付す等して、その説明を省略する。 [Fourth embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG.
This embodiment is different from the heat dissipation structure of the first embodiment only in that a third heat dissipation member is newly added, and other configurations are the same as those of the first embodiment. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施形態の放熱構造は、第一実施形態と同様の発熱電子デバイス２、第一放熱部材３、第二放熱部材４及び回路基板５に加えて、第三放熱部材１１も備えて大略構成されている。
第三放熱部材１１は、第一放熱部材３と同様、アルミニウム等のように熱伝導性に優れた導電性材料からなり、例えばブロック状に形成されている。第三放熱部材１１は、回路基板５の上面５ａに面接触するように配されている。そして、第三放熱部材１１には、回路基板５の上面５ａに接触する第三放熱部材１１の接触面１１ｂから窪む窪み部１１１が形成されている。 The heat dissipation structure of the present embodiment is roughly configured to include the third heat dissipation member 11 in addition to the heat generating electronic device 2, the first heat dissipation member 3, the second heat dissipation member 4, and the circuit board 5 similar to those of the first embodiment. ing.
The third heat radiating member 11 is made of a conductive material having excellent thermal conductivity, such as aluminum, like the first heat radiating member 3, and is formed in a block shape, for example. The third heat radiating member 11 is disposed so as to be in surface contact with the upper surface 5 a of the circuit board 5. The third heat radiating member 11 is formed with a recess 111 that is recessed from the contact surface 11 b of the third heat radiating member 11 that contacts the upper surface 5 a of the circuit board 5.

この第三放熱部材１１を回路基板５の上面５ａに配した状態では、第三放熱部材１１が放熱用配線パターン５１に機械的及び電気的に接続されている。一方、回路基板５の上面５ａに形成された電気配線パターン、並びに、回路基板５の上面５ａ上に位置する発熱電子デバイス２の外部端子２２、第二放熱部材４の接続突起４２及び固定用ネジ７の頭部７１は、第三放熱部材１１の窪み部１１１の開口部分あるいは窪み部１１１内に位置して、第三放熱部材１１には接触せず、また、電気的に絶縁されている。
なお、図示例では、窪み部１１１が一つだけ形成されているが、例えば複数形成されてもよい。 In a state where the third heat radiating member 11 is disposed on the upper surface 5 a of the circuit board 5, the third heat radiating member 11 is mechanically and electrically connected to the heat radiating wiring pattern 51. On the other hand, the electrical wiring pattern formed on the upper surface 5a of the circuit board 5, the external terminals 22 of the heat generating electronic device 2 located on the upper surface 5a of the circuit board 5, the connection protrusions 42 of the second heat radiating member 4, and the fixing screws. 7 head 71 is located in the opening part of the hollow part 111 of the 3rd heat radiating member 11, or the hollow part 111, does not contact the 3rd heat radiating member 11, and is electrically insulated.
In the illustrated example, only one recess 111 is formed, but a plurality of recesses 111 may be formed, for example.

本実施形態の放熱構造によれば、第一実施形態と同様の効果を奏する。
また、第二放熱部材４から回路基板５に伝えられた熱を、さらに、第三放熱部材１１にも逃がすことが可能となる。特に、本実施形態では、第三放熱部材１１が熱伝導率の高い放熱用配線パターン５１に接続されているため、回路基板５の熱を第三放熱部材１１に効率よく伝えることができ、発熱電子デバイス２の上面２１ａ側からの放熱をさらに効率よく行うことができる。
上述した第四実施形態の構成は、前述した第二、第三実施形態にも適用することが可能である。 According to the heat dissipation structure of the present embodiment, the same effects as in the first embodiment can be obtained.
Further, the heat transferred from the second heat radiating member 4 to the circuit board 5 can be further released to the third heat radiating member 11. In particular, in the present embodiment, since the third heat radiating member 11 is connected to the heat radiation wiring pattern 51 having a high thermal conductivity, the heat of the circuit board 5 can be efficiently transmitted to the third heat radiating member 11, and the heat generation Heat dissipation from the upper surface 21a side of the electronic device 2 can be performed more efficiently.
The configuration of the fourth embodiment described above can also be applied to the second and third embodiments described above.

〔第五実施形態〕
次に、図７を参照して本発明の第五実施形態について説明する。
この実施形態では、第一実施形態の放熱構造と比較して、第一放熱部材に対する発熱電子デバイス及び第二放熱部材の固定手法のみが異なっており、その他の構成については第一実施形態と同様である。本実施形態では、第一実施形態と同一の構成要素について同一符号を付す等して、その説明を省略する。 [Fifth embodiment]
Next, a fifth embodiment of the present invention will be described with reference to FIG.
In this embodiment, compared with the heat dissipation structure of the first embodiment, only the fixing method of the heat generating electronic device and the second heat dissipation member to the first heat dissipation member is different, and the other configurations are the same as in the first embodiment. It is. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施形態の放熱構造では、図７に示すように、同一の付勢部材（固定手段）１３によって、発熱電子デバイス２が第一放熱部材３の上面３ａに固定されると同時に、第二放熱部材４が発熱電子デバイス２（デバイス本体２１）の上面２１ａに固定されている。
付勢部材１３は、ステンレス、銅材等のように導電性を有すると共に弾性変形可能な板材に、打ち抜き加工や屈曲加工を施す等して形成されるものである。この付勢部材１３は、第一放熱部材３の上面３ａに固定される平板状の一端部１３１と、第二放熱部材４の本体部４１の上面４１ａに配される平板状の他端部１３２と、一端部１３１と他端部１３２との間に形成される弾性変形部１３３とを備えている。 In the heat dissipation structure of the present embodiment, as shown in FIG. 7, the heat generating electronic device 2 is fixed to the upper surface 3 a of the first heat dissipation member 3 by the same biasing member (fixing means) 13, and at the same time, the second heat dissipation. The member 4 is fixed to the upper surface 21a of the heat generating electronic device 2 (device main body 21).
The urging member 13 is formed by punching or bending a plate material that is conductive and elastically deformed, such as stainless steel or copper material. The urging member 13 includes a flat plate-like one end 131 fixed to the upper surface 3 a of the first heat radiating member 3 and a flat plate-like other end 132 arranged on the upper surface 41 a of the main body 41 of the second heat radiating member 4. And an elastic deformation portion 133 formed between the one end portion 131 and the other end portion 132.

一端部１３１は、取付用ネジ１４を一端部１３１の厚さ方向に貫通する挿通孔（不図示）に挿通させた上で、第一放熱部材３の上面３ａに形成された雌ネジ孔３５に螺着させることで第一放熱部材３の上面３ａに固定されている。弾性変形部１３３は、一端部１３１及び他端部１３２に対して第一放熱部材３の上面３ａ及び第二放熱部材４の本体部４１の上面４１ａよりも上方に膨らむように断面略Ｕ字状に形成されている。
このように構成される付勢部材１３の一端部１３１を第一放熱部材３に固定すると共に、他端部１３２を本体部４１の上面４１ａに配した状態では、弾性変形部１３３に弾性変形が生じ、これに伴う弾性力によって他端部１３２が本体部４１の上面４１ａに押し付けられている。すなわち、第一放熱部材３上に重ねて配された発熱電子デバイス２及び第二放熱部材４は、この付勢部材１３の弾性力によって第一放熱部材３に固定されている。 The one end 131 is inserted into a female screw hole 35 formed in the upper surface 3a of the first heat radiating member 3 after inserting the mounting screw 14 through an insertion hole (not shown) penetrating in the thickness direction of the one end 131. The first heat radiating member 3 is fixed to the upper surface 3a by screwing. The elastic deformation portion 133 is substantially U-shaped in cross section so as to bulge upward from the upper surface 3a of the first heat radiating member 3 and the upper surface 41a of the main body portion 41 of the second heat radiating member 4 with respect to the one end portion 131 and the other end portion 132. Is formed.
In the state where the one end 131 of the biasing member 13 configured as described above is fixed to the first heat radiating member 3 and the other end 132 is disposed on the upper surface 41a of the main body 41, the elastic deformation portion 133 is elastically deformed. The other end 132 is pressed against the upper surface 41a of the main body 41 by the generated elastic force. That is, the heat generating electronic device 2 and the second heat radiating member 4 that are arranged on the first heat radiating member 3 are fixed to the first heat radiating member 3 by the elastic force of the biasing member 13.

本実施形態の放熱構造によれば、第一実施形態と同様の効果を奏する。
特に、同一の付勢部材１３によって、発熱電子デバイス２が第一放熱部材３の上面３ａに固定されると同時に、第二放熱部材４が発熱電子デバイス２の上面２１ａに固定されるため、放熱構造の組み立てを効率よく行うことができる。
また、第二放熱部材４が付勢部材１３を介して第一放熱部材３に機械的に接続されているため、発熱電子デバイス２の上面２１ａから第二放熱部材４に伝えられた熱を、付勢部材１３から第一放熱部材３に逃がすことができる。 According to the heat dissipation structure of the present embodiment, the same effects as in the first embodiment can be obtained.
In particular, since the heat generating electronic device 2 is fixed to the upper surface 3a of the first heat radiating member 3 by the same urging member 13, the second heat radiating member 4 is fixed to the upper surface 21a of the heat generating electronic device 2, so Assembling of the structure can be performed efficiently.
Further, since the second heat radiating member 4 is mechanically connected to the first heat radiating member 3 through the biasing member 13, the heat transmitted from the upper surface 21a of the heat generating electronic device 2 to the second heat radiating member 4 is The urging member 13 can escape to the first heat radiating member 3.

さらに、本実施形態の放熱構造では、付勢部材１３が導電性を有していることで、第一放熱部材３及び第二放熱部材４が付勢部材１３を介して互いに電気接続されるため、例えば第一放熱部材３を接地させるだけで、第二放熱部材４も接地させることができ、発熱電子デバイス２及び回路基板５を含む回路の動作安定化を図ることができる。
また、付勢部材１３は、第一実施形態の搭載用ネジ６のようにデバイス本体２１内部に挿通されないため、デバイス本体２１内にある発熱電子デバイス２の回路が第一放熱部材３や第二放熱部材４に短絡することを容易に防止できる。 Furthermore, in the heat dissipation structure of the present embodiment, since the biasing member 13 has conductivity, the first heat dissipation member 3 and the second heat dissipation member 4 are electrically connected to each other via the biasing member 13. For example, the second heat radiating member 4 can be grounded only by grounding the first heat radiating member 3, and the operation of the circuit including the heat generating electronic device 2 and the circuit board 5 can be stabilized.
Further, since the biasing member 13 is not inserted into the device main body 21 like the mounting screw 6 of the first embodiment, the circuit of the heat generating electronic device 2 in the device main body 21 is connected to the first heat radiating member 3 or the second heat radiating member 3. Short circuit to the heat radiating member 4 can be easily prevented.

なお、付勢部材１３の弾性変形部１３３は、上記第五実施形態のような断面略Ｕ字状に形成されることに限らず、少なくとも一端部１３１が第一放熱部材３に固定され、他端部１３２が本体部４１の上面４１ａに配された状態で、第二放熱部材４を発熱電子デバイス２の上面２１ａに押し付ける付勢力が生じるように形成されていれば、任意の形状に形成されていてよい。
また、付勢部材１３は、上記第五実施形態のように第一放熱部材３と第二放熱部材４との間に介在するように配されることに限らず、少なくとも第二放熱部材４を発熱電子デバイス２の上面２１ａに押し付ける付勢力が生じるように配されていればよい。したがって、付勢部材１３は、例えば第二放熱部材４の本体部４１の上面４１ａと回路基板５の下面５ｂとの間に配されてもよい。このように配される付勢部材１３の形状は、コイルばねや板ばね等、任意の形状を呈していてよい。
上述した第五実施形態の構成は、前述した第二〜四実施形態にも適用することが可能である。 The elastic deformation portion 133 of the urging member 13 is not limited to being formed in a substantially U-shaped cross section as in the fifth embodiment, and at least one end portion 131 is fixed to the first heat radiating member 3. If the end 132 is arranged on the upper surface 41a of the main body 41 and is formed so as to generate a biasing force that presses the second heat radiating member 4 against the upper surface 21a of the heat-generating electronic device 2, it can be formed in an arbitrary shape. It may be.
Further, the urging member 13 is not limited to be interposed between the first heat radiating member 3 and the second heat radiating member 4 as in the fifth embodiment, but at least the second heat radiating member 4 is provided. What is necessary is just to distribute | arrange so that the urging | biasing force pressed against the upper surface 21a of the heat-generating electronic device 2 may arise. Therefore, the urging member 13 may be disposed, for example, between the upper surface 41 a of the main body 41 of the second heat radiating member 4 and the lower surface 5 b of the circuit board 5. The shape of the biasing member 13 arranged in this way may be an arbitrary shape such as a coil spring or a leaf spring.
The configuration of the fifth embodiment described above can be applied to the second to fourth embodiments described above.

以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることができる。
例えば、上述した全ての実施形態では、第二放熱部材４，８，９の複数の接続突起４２が、回路基板５の複数の放熱用挿通孔５３に個別に挿通されるとしたが、例えば複数の接続突起４２，８２，９２を同一の放熱用挿通孔５３に挿通させてもよい。また、接続突起４２，８２，９２は、複数形成されることに限らず、例えば一つだけ形成されてもよい。 Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, in all the embodiments described above, the plurality of connection protrusions 42 of the second heat radiation members 4, 8, 9 are individually inserted into the plurality of heat radiation insertion holes 53 of the circuit board 5. The connection protrusions 42, 82, and 92 may be inserted into the same heat radiation insertion hole 53. Further, the connection protrusions 42, 82, and 92 are not limited to being formed in plural, but may be formed, for example, only one.

また、回路基板５に形成される放熱用配線パターン５１の厚みは、電気配線パターンと同様の厚みに設定されることに限らず、例えば電気配線パターンよりも厚く設定されてもよい。このように放熱配線パターン５１の厚みを増やせば、放熱用配線パターン５１の熱容量を高めて、第二放熱部材４，８，９の熱を回路基板５側に逃がしやすくなる。   The thickness of the heat radiation wiring pattern 51 formed on the circuit board 5 is not limited to the same thickness as the electric wiring pattern, and may be set to be thicker than the electric wiring pattern, for example. If the thickness of the heat radiation wiring pattern 51 is increased in this way, the heat capacity of the heat radiation wiring pattern 51 is increased, and the heat of the second heat radiation members 4, 8, 9 is easily released to the circuit board 5 side.

さらに、放熱用配線パターン５１は、回路基板５の上面５ａに形成されるとしたが、例えば回路基板５の下面５ｂに形成されていてもよい。この場合、放熱用配線パターン５１を筒状突起部３２の先端面３２ａに直接接触させることができる。したがって、固定用ネジ７は特に導電性を有していなくてもよい。また、第二、第三実施形態の構成（図３〜５参照）では、放熱用配線パターン５１を第二放熱部材８の本体部８１やゲル状シート１０に直接接触させることができる。したがって、第二、第三実施形態の第二放熱部材８，９は接続突起８２，９２を有して構成されることに限らず、例えば本体部８１，９１のみによって構成されてもよい。   Further, although the heat radiation wiring pattern 51 is formed on the upper surface 5a of the circuit board 5, it may be formed on the lower surface 5b of the circuit board 5, for example. In this case, the heat radiation wiring pattern 51 can be brought into direct contact with the distal end surface 32 a of the cylindrical protrusion 32. Therefore, the fixing screw 7 does not have to be particularly conductive. In the configurations of the second and third embodiments (see FIGS. 3 to 5), the heat radiation wiring pattern 51 can be brought into direct contact with the main body portion 81 and the gel sheet 10 of the second heat radiation member 8. Therefore, the second heat radiating members 8 and 9 of the second and third embodiments are not limited to being configured to include the connection protrusions 82 and 92 but may be configured only by the main body portions 81 and 91, for example.

また、回路基板５は、その上面５ａや下面５ｂに電気配線パターンを形成したものに限らず、例えば内部に電気配線パターンを形成した多層配線基板であってもよい。この場合には、放熱用配線パターン５１も、電気配線パターンと同様に回路基板５の上面５ａや下面５ｂあるいは内部の少なくともいずれか一つに形成されていてもよい。回路基板５が多層配線基板であれば、複数の放熱用配線パターン５１を回路基板５の厚さ方向に重ねて配置することも可能となるため、放熱用配線パターン５１の面積を容易に増やすことができ、放熱用配線パターン５１の熱容量の増加を容易に図ることができる。また、回路基板５の上面５ａや下面５ｂのみに放熱用配線パターン５１を形成する場合と比較して、回路基板５における放熱用配線パターン５１の占有面積を小さく抑えることも可能となる。   Further, the circuit board 5 is not limited to the one in which the electric wiring pattern is formed on the upper surface 5a and the lower surface 5b, and may be a multilayer wiring board in which the electric wiring pattern is formed, for example. In this case, the heat radiation wiring pattern 51 may also be formed on at least one of the upper surface 5a, the lower surface 5b, or the inside of the circuit board 5 similarly to the electric wiring pattern. If the circuit board 5 is a multilayer wiring board, a plurality of heat radiation wiring patterns 51 can be arranged in the thickness direction of the circuit board 5, so that the area of the heat radiation wiring pattern 51 can be easily increased. Thus, the heat capacity of the heat radiation wiring pattern 51 can be easily increased. In addition, as compared with the case where the heat radiation wiring pattern 51 is formed only on the upper surface 5a and the lower surface 5b of the circuit board 5, the occupation area of the heat radiation wiring pattern 51 on the circuit board 5 can be reduced.

さらに、上述した全ての実施形態の放熱構造では、第一放熱部材３から第二放熱部材４，８，９、回路基板５を順番に経て再び第一放熱部材３に戻るループ状の電気経路が画成されているが、第一放熱部材３及び第二放熱部材４，８，９を同電位に設定することのみ考慮すれば、例えば、第一放熱部材３及び第二放熱部材４，８，９は、例えば搭載用ネジ６のみによって電気接続されてもよいし、例えば、回路基板５、固定用ネジ７及び筒状突起部３２のみによって電気接続されてもよい。   Furthermore, in the heat dissipation structures of all the embodiments described above, there is a loop-shaped electrical path that returns from the first heat dissipation member 3 to the first heat dissipation member 3 again in order through the second heat dissipation members 4, 8, 9 and the circuit board 5. However, if only the first heat radiating member 3 and the second heat radiating members 4, 8, 9 are set to the same potential, for example, the first heat radiating member 3 and the second heat radiating members 4, 8, For example, 9 may be electrically connected only by the mounting screw 6, or may be electrically connected only by the circuit board 5, the fixing screw 7, and the cylindrical protrusion 32, for example.

また、第一放熱部材３及び第二放熱部材４，８，９は、例えば、互いに電気的に接続されず、第二放熱部材４，８，９から第一放熱部材３に熱を逃がすことができるように、互いに機械的に接続されるだけでもよい。したがって、例えば搭載用ネジ６や付勢部材１３、固定用ネジ７は、特に導電性を有していなくてもよい。また、回路基板５には放熱用配線パターン５１が形成されていなくても構わない。   In addition, the first heat radiating member 3 and the second heat radiating members 4, 8, 9 are not electrically connected to each other, for example, and heat can be released from the second heat radiating members 4, 8, 9 to the first heat radiating member 3. It may only be mechanically connected to each other as possible. Therefore, for example, the mounting screw 6, the biasing member 13, and the fixing screw 7 do not have to be particularly conductive. The circuit board 5 may not have the heat radiation wiring pattern 51 formed thereon.

さらに、上述した全ての実施形態の放熱構造では、発熱電子デバイス２から伝えられた熱を第二放熱部材４，８，９から第一放熱部材３に逃がすように構成されているが、少なくとも第二放熱部材４，８，９から回路基板５に逃がすことができるように、第二放熱部材４，８，９と回路基板５とが機械的に接続されていればよい。   Furthermore, in the heat dissipation structure of all the embodiments described above, the heat transferred from the heat generating electronic device 2 is configured to escape from the second heat dissipation members 4, 8, 9 to the first heat dissipation member 3. The second heat radiating members 4, 8, 9 and the circuit board 5 may be mechanically connected so that the two heat radiating members 4, 8, 9 can escape to the circuit board 5.

また、全ての実施形態では、筒状突起部３２の先端部が固定用ネジ７によって回路基板５に固定されているが、第二放熱部材４，８，９から回路基板５に伝えられた熱を第一放熱部材３に逃がすことのみを考慮すれば、少なくとも第一放熱部材３にその上面３ａから突出する伝熱用突起部を設け、この伝熱用突起部の先端部が回路基板５に機械的に接続されていればよい。なお、この機械的な接続には、前述した固定用ネジ７による固定の他、接触や当接、あるいは、接着剤による固定なども含まれている。   In all the embodiments, the tip of the cylindrical protrusion 32 is fixed to the circuit board 5 by the fixing screw 7, but the heat transferred from the second heat radiating members 4, 8, 9 to the circuit board 5. If only the first heat radiating member 3 is taken into consideration, at least the first heat radiating member 3 is provided with a heat transfer protrusion protruding from the upper surface 3a, and the tip of the heat transfer protrusion is formed on the circuit board 5. It only needs to be mechanically connected. Note that this mechanical connection includes not only fixing by the fixing screw 7 described above but also contact, contact, or fixing by an adhesive.

さらに、第二放熱部材４，８，９は、搭載用ネジ６や付勢部材１３によって発熱電子デバイス２の上面２１ａに固定されるとしたが、例えば、接着剤によって固定されてもよい。ただし、この場合には熱伝導性の高い接着剤を用いることがより好ましい。この場合、発熱電子デバイス２は、搭載用ネジ６によって第一放熱部材３に固定されてもよいが、例えば第二放熱部材４，８，９の場合と同様に、接着剤によって第一放熱部材３に固定されてもよい。   Further, the second heat radiating members 4, 8, and 9 are fixed to the upper surface 21 a of the heat generating electronic device 2 by the mounting screws 6 and the biasing member 13, but may be fixed by, for example, an adhesive. However, in this case, it is more preferable to use an adhesive having high thermal conductivity. In this case, the heat generating electronic device 2 may be fixed to the first heat radiating member 3 by the mounting screws 6. For example, as in the case of the second heat radiating members 4, 8, 9, the first heat radiating member is formed by an adhesive. 3 may be fixed.

また、第二放熱部材４，８，９上には、電気配線パターンを有する回路基板５が配されることに限らず、少なくとも第二放熱部材４，８，９に機械的に接続されて第二放熱部材４，８，９の熱を受け取ることが可能な基板が配されていればよい。なお、基板は、導電性材料及び非導電性材料のいずれによって構成されていてもよく、例えば筐体を構成するものであってもよい。この場合、発熱電子デバイス２は例えば別の位置に配された回路基板等に電気接続されればよい。   Further, the circuit board 5 having the electric wiring pattern is not limited to be disposed on the second heat radiating members 4, 8, 9, and is mechanically connected to at least the second heat radiating members 4, 8, 9. The board | substrate which can receive the heat | fever of the two heat radiating members 4,8,9 should just be distribute | arranged. In addition, the board | substrate may be comprised with any of an electroconductive material and a nonelectroconductive material, for example, may comprise a housing | casing. In this case, the heat generating electronic device 2 may be electrically connected to, for example, a circuit board disposed at another position.

また、発熱電子デバイス２は、第一放熱部材３の平坦な上面３ａに搭載されることに限らず、例えば第一放熱部材３の上面３ａから窪む凹部の底面（搭載面）に搭載されてもよい。言い換えれば、発熱電子デバイス２は第一放熱部材３の凹部内に収容されてもよい。
この場合には、回路基板５を第一放熱部材３の上面３ａに直接配して、第一放熱部材３に対して機械的に接続しても、回路基板５と凹部の底面や発熱電子デバイス２の上面２１ａとの間に隙間を画成することができる。したがって、第一放熱部材３に上述した実施形態のように伝熱用突起（筒状突起部３２）が形成されていなくても、発熱電子デバイス２の上面２ａと回路基板５との間に第二放熱部材４，８，９を配することは十分に可能である。
さらに、本発明の放熱構造を構成する発熱電子デバイス２は、半導体素子を樹脂で封止したものに限らず、少なくとも通電によって発熱するものであればよい。 Further, the heat generating electronic device 2 is not limited to be mounted on the flat upper surface 3a of the first heat radiating member 3, and is mounted on the bottom surface (mounting surface) of a recess recessed from the upper surface 3a of the first heat radiating member 3, for example. Also good. In other words, the heat generating electronic device 2 may be accommodated in the recess of the first heat radiating member 3.
In this case, even if the circuit board 5 is directly arranged on the upper surface 3a of the first heat radiating member 3 and mechanically connected to the first heat radiating member 3, the circuit board 5 and the bottom surface of the recess or the heat generating electronic device A gap can be defined between the two upper surfaces 21a. Therefore, even if the first heat dissipating member 3 is not formed with the heat transfer protrusion (cylindrical protrusion 32) as in the above-described embodiment, the first heat dissipating member 3 is not It is possible to arrange the two heat dissipating members 4, 8, and 9 sufficiently.
Furthermore, the heat generating electronic device 2 constituting the heat dissipation structure of the present invention is not limited to a semiconductor element sealed with a resin, and may be any one that generates heat at least by energization.

２ 発熱電子デバイス
２１ デバイス本体
２１ａ 上面
２１ｂ 下面
２１ｃ 側面
２２ 外部端子
３ 第一放熱部材
３ａ 上面（搭載面）
３２ 筒状突起部（伝熱用突起部）
４，８，９ 第二放熱部材
４１，８１，９１ 本体部
４２，８２，９２ 接続突起
５ 回路基板
５ａ 上面
５ｂ 下面
５１ 放熱用配線パターン
５３ 放熱用挿通孔
６ 搭載用ネジ（固定手段）
１０ ゲル状シート（ゲル状部材）
１１ 第三放熱部材
１３ 付勢部材（固定手段） 2 Heat-generating electronic device 21 Device body 21a Upper surface 21b Lower surface 21c Side surface 22 External terminal 3 First heat radiation member 3a Upper surface (mounting surface)
32 Cylindrical protrusion (heat transfer protrusion)
4, 8, 9 Second heat radiating member 41, 81, 91 Main body 42, 82, 92 Connection protrusion 5 Circuit board 5a Upper surface 5b Lower surface 51 Heat radiation wiring pattern 53 Heat radiation insertion hole 6 Mounting screw (fixing means)
10 Gel-like sheet (gel-like member)
11 Third heat dissipation member 13 Biasing member (fixing means)

Claims (11)

第一放熱部材と、当該第一放熱部材の搭載面に搭載される発熱電子デバイスと、前記搭載面及び前記発熱電子デバイスの上方に間隔をあけた位置に配される基板と、当該基板に対向する前記発熱電子デバイスの上面に固定される第二放熱部材と、を備え、
当該第二放熱部材が、前記基板に機械的に接続されていることを特徴とする発熱電子デバイスの放熱構造。 A first heat dissipating member, a heat generating electronic device mounted on the mounting surface of the first heat dissipating member, a substrate disposed at a position spaced above the mounting surface and the heat generating electronic device, and facing the substrate A second heat dissipating member fixed to the upper surface of the heat generating electronic device,
A heat dissipation structure for a heat generating electronic device, wherein the second heat dissipation member is mechanically connected to the substrate. 前記第二放熱部材が、前記発熱電子デバイスの上面に面接触する本体部と、当該本体部から前記基板に向けて突出する接続突起とを備え、
当該接続突起が、前記基板の厚さ方向に貫通して形成された放熱用挿通孔に挿通されていることを特徴とする請求項１に記載の発熱電子デバイスの放熱構造。 The second heat radiating member includes a main body part in surface contact with the upper surface of the heat generating electronic device, and a connection protrusion protruding from the main body part toward the substrate,
The heat dissipation structure for a heat generating electronic device according to claim 1, wherein the connection protrusion is inserted through a heat dissipation insertion hole formed so as to penetrate in the thickness direction of the substrate. 前記接続突起が、針状に形成されると共に互いに間隔をあけて複数配列されていることを特徴とする請求項２に記載の発熱電子デバイスの放熱構造。   3. The heat dissipation structure for a heat generating electronic device according to claim 2, wherein a plurality of the connection protrusions are formed in a needle shape and are spaced apart from each other. 前記本体部が、前記第二放熱部材に対向する前記基板の下面に面接触していることを特徴とする請求項２又は請求項３に記載の発熱電子デバイスの放熱構造。   4. The heat dissipation structure for a heat generating electronic device according to claim 2, wherein the main body is in surface contact with a lower surface of the substrate facing the second heat dissipation member. 5. 前記本体部と、前記第二放熱部材に対向する前記基板の下面との隙間が、ゲル状部材によって埋められていることを特徴とする請求項２から請求項４のいずれか１項に記載の発熱電子デバイスの放熱構造。   5. The gap according to claim 2, wherein a gap between the main body portion and the lower surface of the substrate facing the second heat radiating member is filled with a gel-like member. Heat dissipation structure for heat-generating electronic devices. 前記基板が、前記発熱電子デバイスに電気接続される回路基板であり、
当該回路基板に、前記第二放熱部材に接続される放熱用配線パターンが形成されていることを特徴とする請求項１から請求項５のいずれか１項に記載の発熱電子デバイスの放熱構造。 The circuit board is a circuit board electrically connected to the heat generating electronic device;
The heat dissipation structure for a heat-generating electronic device according to any one of claims 1 to 5, wherein a heat dissipation wiring pattern connected to the second heat dissipation member is formed on the circuit board. 前記第一放熱部材に、その搭載面から突出する伝熱用突起部が設けられ、
当該伝熱用突起部の先端部が前記基板に機械的に接続されていることを特徴とする請求項１から請求項６のいずれか１項に記載の発熱電子デバイスの放熱構造。 The first heat radiating member is provided with a heat transfer protrusion protruding from the mounting surface,
7. The heat dissipation structure for a heat generating electronic device according to claim 1, wherein a tip end portion of the heat transfer protrusion is mechanically connected to the substrate. 前記第一放熱部材及び前記第二放熱部材が、前記基板及び前記伝熱用突起部を介して互いに電気接続されていることを特徴とする請求項７に記載の発熱電子デバイスの放熱構造。   The heat dissipation structure for a heat-generating electronic device according to claim 7, wherein the first heat dissipation member and the second heat dissipation member are electrically connected to each other via the substrate and the heat transfer protrusion. 前記発熱電子デバイスが、固定手段によって前記第一放熱部材の搭載面に固定されると共に、
前記第二放熱部材が、前記固定手段によって前記発熱電子デバイスの上面に固定されることを特徴とする請求項１から請求項８のいずれか１項に記載の発熱電子デバイスの放熱構造。 The heat generating electronic device is fixed to the mounting surface of the first heat radiating member by fixing means,
The heat dissipation structure for a heat generating electronic device according to any one of claims 1 to 8, wherein the second heat dissipation member is fixed to an upper surface of the heat generating electronic device by the fixing means. 前記第一放熱部材及び前記第二放熱部材が、前記固定手段を介して互いに電気接続されていることを特徴とする請求項９に記載の発熱電子デバイスの放熱構造。   The heat dissipation structure for a heat-generating electronic device according to claim 9, wherein the first heat dissipation member and the second heat dissipation member are electrically connected to each other via the fixing means. 前記基板の上面に、第三放熱部材が配されていることを特徴とする請求項１から請求項１０のいずれか１項に記載の発熱電子デバイスの放熱構造。
The heat dissipation structure for a heat-generating electronic device according to any one of claims 1 to 10, wherein a third heat dissipation member is disposed on the upper surface of the substrate.
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