JP2013078701A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
JP2013078701A
JP2013078701A JP2010029139A JP2010029139A JP2013078701A JP 2013078701 A JP2013078701 A JP 2013078701A JP 2010029139 A JP2010029139 A JP 2010029139A JP 2010029139 A JP2010029139 A JP 2010029139A JP 2013078701 A JP2013078701 A JP 2013078701A
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Prior art keywords
substrate
air
air cleaning
processing apparatus
cleaning
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Kazuyuki Yamazaki
和幸 山崎
Takahiro Fukuta
考紘 福田
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Sharp Corp
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Sharp Corp
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Priority to JP2010029139A priority Critical patent/JP2013078701A/en
Priority to PCT/JP2010/072366 priority patent/WO2011099222A1/en
Publication of JP2013078701A publication Critical patent/JP2013078701A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/14—Drying solid materials or objects by processes not involving the application of heat by applying pressure, e.g. wringing; by brushing; by wiping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Molecular Biology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning In General (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent a substrate from being damaged due to contact with an air cleaning part.SOLUTION: In the substrate processing apparatus, an upper air cleaning part 5 is disposed above a cleaning region 4 formed in the course of a conveying path and cleans a substrate 2 by jetting air in an curtain form onto the upper surface of the substrate 2 while sucking up the jetted air. A lower air cleaning part is disposed in position opposite to the upper air cleaning part 5 under the conveying path and cleans the substrate 2 by jetting air in a curtain form onto the lower surface of the substrate 2 while sucking up the jetted air. The upper air cleaning part 5 and the lower air cleaning part jet air in a curtain form in a manner that the curtains cross on the substrate 2 in relation to the direction in which the edge side 3 extends. Substrate guide parts 13 are arranged in the cleaning region 4, and therefore the contact of the substrate 2 with the lower air cleaning part due to the suction of air by the lower air cleaning part is prevented by the support of the lower surface of the substrate 2 by the substrate guide parts 13.

Description

本発明は、基板処理装置に関し、特に、基板をエアー洗浄する基板処理装置に関する。   The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus for air-cleaning a substrate.

液晶表示装置に用いられる基板を処理する装置においては、基板の洗浄処理部が備えられている。洗浄処理部を含む基板処理装置を開示した先行文献として、特許文献１および２がある。特許文献１および２に開示された基板処理装置には、洗浄処理した基板を乾燥処理するために基板の上方および下方にエアーナイフが配置されている。基板は、搬送ローラなどの搬送手段で搬送されながら、洗浄液による洗浄処理およびエアーナイフによる乾燥処理を順次連続的に行なわれている。   An apparatus for processing a substrate used in a liquid crystal display device includes a substrate cleaning processing unit. Patent Documents 1 and 2 are prior art documents disclosing a substrate processing apparatus including a cleaning processing unit. In the substrate processing apparatuses disclosed in Patent Documents 1 and 2, air knives are disposed above and below the substrate in order to dry the cleaned substrate. The substrate is sequentially and successively subjected to a cleaning process using a cleaning liquid and a drying process using an air knife while being transferred by a transfer unit such as a transfer roller.

特開２００１−３１４８２７号公報JP 2001-314827 A 特開２００１−２８４３１０号公報JP 2001-284310 A

特許文献１および２に記載された基板処理装置においては、基板を搬送手段により搬送しながらエアーナイフによる乾燥処理を行なっている。エアーナイフは、加圧空気を基板に噴き付けるため、基板は上下のエアーナイフの間を通過する際に搬送ローラ上においてバタつきながら搬送される。   In the substrate processing apparatuses described in Patent Documents 1 and 2, a drying process using an air knife is performed while the substrate is transported by a transport unit. Since the air knife sprays pressurized air onto the substrate, the substrate is transported while fluttering on the transport roller when passing between the upper and lower air knives.

基板処理装置には、基板上の微細な埃などを取り除くために、基板にエアーを噴き付けつつ、その噴き付けたエアーを吸入するエアー洗浄部を備えたものがある。エアー洗浄部はエアーナイフと同様に、基板が搬送される搬送路の上方および下方に配置される。   Some substrate processing apparatuses include an air cleaning unit that sucks the blown air while blowing air onto the substrate in order to remove fine dust and the like on the substrate. Similar to the air knife, the air cleaning unit is disposed above and below the conveyance path through which the substrate is conveyed.

上下のエアー洗浄部の間においては、上方および下方からエアーの噴き付けとエアーの吸入とが行なわれるため、上記のエアーナイフ間より激しい乱流が発生する。そのため、エアー洗浄部の間を搬送される基板は、搬送ローラ上において激しいバタつきを生じる。また、エアー洗浄部のエアー噴き付け部は、基板表面に近接して配置されるため、基板搬送方向においてエアー洗浄部が配置されている位置には、搬送ローラを設けることができない。そのため、搬送方向における基板の先端が、エアー洗浄部を挟んで配置された搬送ローラ間において、基板の自重および基板の上記バタつきにより下方に沈み込み、基板の下方に配置されたエアー洗浄部に接触することがある。この場合、基板にキズまたは割れなどの損傷が発生する。   Between the upper and lower air cleaning units, air is blown in and air is sucked in from above and below, so that a more intense turbulence occurs between the air knives. For this reason, the substrate transported between the air cleaning units is severely fluttered on the transport roller. Further, since the air spraying part of the air cleaning part is disposed close to the substrate surface, a transport roller cannot be provided at a position where the air cleaning part is disposed in the substrate transport direction. Therefore, the front end of the substrate in the transport direction sinks downward due to the weight of the substrate and the above-mentioned fluttering of the substrate between the transport rollers disposed across the air cleaning unit, and enters the air cleaning unit disposed below the substrate. May come into contact. In this case, damage such as scratches or cracks occurs in the substrate.

本発明は上記の問題点に鑑みてなされたものであって、基板を搬送しつつエアー洗浄する基板処理装置において、基板がエアー洗浄部に接触することにより損傷を受けることを防止可能な基板処理装置を提供することを目的とする。   The present invention has been made in view of the above-described problems, and in a substrate processing apparatus that performs air cleaning while transporting a substrate, the substrate processing capable of preventing the substrate from being damaged by contacting the air cleaning unit. An object is to provide an apparatus.

本発明に係る基板処理装置は、直線状の端辺を有する基板が搬送される搬送路より上方および下方から基板をエアー洗浄する装置である。基板処理装置は、上側エアー洗浄部と下側エアー洗浄部と第１搬送手段と第２搬送手段とを備えている。上側エアー洗浄部は、搬送路の途中に設けられた洗浄領域の上方に配置され、基板の上面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを吸入することにより基板を洗浄する。下側エアー洗浄部は、搬送路の下方において上側エアー洗浄部と対向する位置に配置され、基板の下面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを吸入することにより基板を洗浄する。第１搬送手段は、基板の下面を支持して、基板面内において上記端辺が伸びる方向と直交する方向に基板を搬送することにより、基板を端辺側から洗浄領域に搬入する。第２搬送手段は、基板の下面を支持して基板を洗浄領域から搬出する。上側エアー洗浄部および下側エアー洗浄部は、上記端辺が伸びる方向に対して基板上において交差するようにカーテン状にエアーを噴き付ける。洗浄領域には基板案内部が配置され、下側エアー洗浄部によるエアーの吸入によって基板が下側エアー洗浄部に接触することを、基板案内部が基板の下面を支持することによって防止する。   The substrate processing apparatus according to the present invention is an apparatus for air-cleaning a substrate from above and below a conveyance path on which a substrate having a straight edge is conveyed. The substrate processing apparatus includes an upper air cleaning unit, a lower air cleaning unit, a first transfer unit, and a second transfer unit. The upper air cleaning unit is disposed above a cleaning region provided in the middle of the conveyance path, and cleans the substrate by inhaling the sprayed air while spraying air in the form of a curtain on the upper surface of the substrate. The lower air cleaning unit is disposed at a position facing the upper air cleaning unit below the conveyance path, and cleans the substrate by inhaling the sprayed air while spraying air on the lower surface of the substrate in a curtain shape. . The first transport unit supports the lower surface of the substrate and transports the substrate in a direction orthogonal to the direction in which the end side extends in the substrate surface, thereby transporting the substrate from the end side to the cleaning region. The second transport means supports the lower surface of the substrate and carries the substrate out of the cleaning area. The upper air cleaning unit and the lower air cleaning unit spray air in a curtain shape so as to intersect on the substrate with respect to the direction in which the end side extends. A substrate guide portion is disposed in the cleaning region, and the substrate guide portion prevents the substrate from coming into contact with the lower air cleaning portion by suction of air by the lower air cleaning portion by supporting the lower surface of the substrate.

本発明によれば、洗浄領域に基板案内部を設けて基板の下面を支持することによって、洗浄領域を通過する基板の先端が下側エアー洗浄部に接触することを防止して、基板を損傷することなく洗浄することができる基板処理装置を提供することができる。   According to the present invention, the substrate guide is provided in the cleaning region to support the lower surface of the substrate, thereby preventing the tip of the substrate passing through the cleaning region from contacting the lower air cleaning unit and damaging the substrate. It is possible to provide a substrate processing apparatus that can perform cleaning without the need for cleaning.

本発明の実施形態１に係る基板処理装置の構成を模式的に示す平面図である。It is a top view which shows typically the structure of the substrate processing apparatus which concerns on Embodiment 1 of this invention. 図１の基板処理装置をＩＩ−ＩＩ線矢印方向から見た断面図である。It is sectional drawing which looked at the substrate processing apparatus of FIG. 1 from the II-II line arrow direction. 同実施形態に係る上側エアー洗浄部の構造を模式的に示す斜視図である。It is a perspective view which shows typically the structure of the upper air washing | cleaning part which concerns on the same embodiment. 同実施形態に係る下側エアー洗浄部の構造を模式的に示す斜視図である。It is a perspective view which shows typically the structure of the lower side air cleaning part which concerns on the same embodiment. 図４の下側エアー洗浄部を矢印Ｖ方向から見た側面図である。It is the side view which looked at the lower air washing | cleaning part of FIG. 4 from the arrow V direction. 同実施形態に係る基板処理装置において、洗浄領域に搬入される基板を模式的に示す斜視図である。In the substrate processing apparatus concerning the embodiment, it is a perspective view which shows typically the board | substrate carried in to a washing | cleaning area | region. 図６の基板案内部を矢印ＶＩＩ方向から見た側面図である。It is the side view which looked at the board | substrate guide part of FIG. 6 from the arrow VII direction. 本発明の実施形態２に係る基板処理装置の構成を模式的に示す平面図である。It is a top view which shows typically the structure of the substrate processing apparatus which concerns on Embodiment 2 of this invention. 図８の基板処理装置をＩＸ−ＩＸ線矢印方向から見た断面図である。It is sectional drawing which looked at the substrate processing apparatus of FIG. 8 from the IX-IX line arrow direction. 図８の搬送手段および基板案内部を矢印Ｘ方向側から見た状態を模式的に示す側面図である。It is a side view which shows typically the state which looked at the conveyance means and board | substrate guide part of FIG. 8 from the arrow X direction side.

以下、本発明の実施形態１に係る基板処理装置について図面を参照しながら説明する。
実施形態１
図１は、本発明の実施形態１に係る基板処理装置の構成を模式的に示す平面図である。図２は、図１の基板処理装置をＩＩ−ＩＩ線矢印方向から見た断面図である。図１に示すように、本実施形態に係る基板処理装置１は、直線状の端辺３を有する基板２をエアー洗浄する基板処理装置である。直線状の端辺３とは、基板２の辺の内、直線状に伸びる辺のことをいう。本実施形態においては、基板２は矩形状であるが、少なくとも直線状の端辺３を有する基板であればよい。基板２は、たとえば、ＴＦＴ(Thin Film Transistor)またはカラーフィルタなどが上面に形成されたガラス基板である。 Hereinafter, a substrate processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.
Embodiment 1
FIG. 1 is a plan view schematically showing the configuration of a substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of the substrate processing apparatus of FIG. 1 as viewed from the direction of arrows II-II. As shown in FIG. 1, a substrate processing apparatus 1 according to the present embodiment is a substrate processing apparatus that performs air cleaning on a substrate 2 having a straight edge 3. The straight end 3 is a side extending in a straight line among the sides of the substrate 2. In the present embodiment, the substrate 2 has a rectangular shape, but may be any substrate that has at least a straight end 3. The substrate 2 is a glass substrate on which, for example, a TFT (Thin Film Transistor) or a color filter is formed on the upper surface.

基板２は、基板２の下面を第１搬送ローラ７に支持されて、矢印６で示す方向に搬送される。第１搬送ローラ７は、第１搬送軸８に所定の間隔を置いて取付けられている。第１搬送軸８は、基板２の搬送方向に所定の間隔を置いて配置されている。すべての第１搬送軸８は、図示しない駆動源と接続されている。駆動源から供給される駆動力により第１搬送軸８が回転させられることにより、第１搬送ローラ７が回転して基板２を矢印６の方向に搬送している。第１搬送ローラ７としては、樹脂製の搬送ローラを用いた。第１搬送軸８としては、金属製の軸を用いた。第１搬送手段９は、第１搬送ローラ７および第１搬送軸８を含む。   The substrate 2 is conveyed in the direction indicated by the arrow 6 with the lower surface of the substrate 2 supported by the first conveying roller 7. The first transport roller 7 is attached to the first transport shaft 8 at a predetermined interval. The first transport shaft 8 is arranged at a predetermined interval in the transport direction of the substrate 2. All the first transport shafts 8 are connected to a drive source (not shown). When the first transport shaft 8 is rotated by the driving force supplied from the drive source, the first transport roller 7 rotates and transports the substrate 2 in the direction of the arrow 6. As the first transport roller 7, a resin transport roller was used. A metal shaft was used as the first transport shaft 8. The first transport unit 9 includes a first transport roller 7 and a first transport shaft 8.

基板２の搬送方向において、第１搬送手段９の下流に洗浄領域４が設けられている。上記のように基板２は直線状の端辺３を有しており、第１搬送手段９は、基板２の面内において端辺３が伸びる方向と直交する方向に基板２を搬送することにより、基板２を端辺３側から洗浄領域４に搬入している。   A cleaning region 4 is provided downstream of the first transfer means 9 in the transfer direction of the substrate 2. As described above, the substrate 2 has the straight edge 3, and the first transport means 9 transports the substrate 2 in a direction orthogonal to the direction in which the edge 3 extends in the plane of the substrate 2. The substrate 2 is carried into the cleaning region 4 from the end 3 side.

基板２の搬送方向において、洗浄領域４の下流に第２搬送手段１２が設けられている。基板２は、基板２の下面を第２搬送ローラ１０に支持されて、矢印６で示す方向に搬送される。第２搬送ローラ１０は、第２搬送軸１１に所定の間隔を置いて取付けられている。第２搬送軸１１は、基板２の搬送方向に所定の間隔を置いて配置されている。第２搬送軸１１は、図示しない駆動源と接続されている。駆動源から供給される駆動力により第２搬送軸１１が回転させられることにより、第２搬送ローラ１０が回転して基板２を矢印６の方向に搬送している。第２搬送ローラ１０としては、樹脂製の搬送ローラを用いた。第２搬送軸１１としては、金属製の軸を用いた。第２搬送手段１２は、第２搬送ローラ１０および第２搬送軸１１を含む。第２搬送手段１２は、基板２を洗浄領域４から搬出する。   Second transport means 12 is provided downstream of the cleaning region 4 in the transport direction of the substrate 2. The substrate 2 is conveyed in the direction indicated by the arrow 6 with the lower surface of the substrate 2 supported by the second conveyance roller 10. The second transport roller 10 is attached to the second transport shaft 11 at a predetermined interval. The second transport shaft 11 is arranged at a predetermined interval in the transport direction of the substrate 2. The second transport shaft 11 is connected to a drive source (not shown). When the second transport shaft 11 is rotated by the driving force supplied from the drive source, the second transport roller 10 rotates and transports the substrate 2 in the direction of the arrow 6. As the second conveyance roller 10, a resin conveyance roller was used. A metal shaft was used as the second transport shaft 11. The second transport unit 12 includes a second transport roller 10 and a second transport shaft 11. The second transport unit 12 carries the substrate 2 out of the cleaning area 4.

図２に示すように、第１搬送手段９および第２搬送手段１２により基板２が搬送される搬送路１４が形成される。洗浄領域４は、搬送路１４の途中に設けられている。洗浄領域４の上方には、上側エアー洗浄部５が配置されている。上側エアー洗浄部５は、矢印１６で示すように基板２の上面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを矢印１７で示すように吸入することにより基板２を洗浄している。   As shown in FIG. 2, a transport path 14 through which the substrate 2 is transported is formed by the first transport unit 9 and the second transport unit 12. The cleaning region 4 is provided in the middle of the conveyance path 14. An upper air cleaning unit 5 is disposed above the cleaning region 4. The upper air cleaning unit 5 cleans the substrate 2 by inhaling the sprayed air as indicated by an arrow 17 while spraying air on the upper surface of the substrate 2 as indicated by an arrow 16 in the form of a curtain.

言い換えると、洗浄される基板２は、基板２の搬送方向の先端側から、基板２の上面を上側エアー洗浄部５によって吸入された後、上側エアー洗浄部５からエアーを噴き付けられ、さらにその後、上側エアー洗浄部５によって吸入される。このようにして、基板２の上面に付着していた微細な埃などが除去される。   In other words, the substrate 2 to be cleaned is inhaled by the upper air cleaning unit 5 from the front end side in the transport direction of the substrate 2, and then air is sprayed from the upper air cleaning unit 5, and thereafter Inhaled by the upper air cleaning unit 5. In this way, fine dust or the like adhering to the upper surface of the substrate 2 is removed.

一方、洗浄領域４の下方には、下側エアー洗浄部１５が配置されている。下側エアー洗浄部１５は、上側エアー洗浄部５と対向する位置に配置されている。下側エアー洗浄部１５は、矢印１８で示すように基板２の下面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを矢印１９で示すように吸入することにより基板２を洗浄している。   On the other hand, a lower air cleaning unit 15 is disposed below the cleaning region 4. The lower air cleaning unit 15 is disposed at a position facing the upper air cleaning unit 5. The lower air cleaning unit 15 cleans the substrate 2 by inhaling the sprayed air as indicated by an arrow 19 while spraying air in a curtain shape on the lower surface of the substrate 2 as indicated by an arrow 18. .

言い換えると、洗浄される基板２は、基板２の搬送方向の先端側から、基板２の下面を下側エアー洗浄部１５によって吸入された後、下側エアー洗浄部１５からエアーを噴き付けられ、さらにその後、下側エアー洗浄部１５によって吸入される。このようにして、基板２の下面に付着していた微細な埃などが除去される。   In other words, the substrate 2 to be cleaned is blown from the lower air cleaning unit 15 after the lower surface of the substrate 2 is sucked by the lower air cleaning unit 15 from the front end side in the transport direction of the substrate 2, Thereafter, the air is sucked by the lower air cleaning unit 15. In this way, fine dust attached to the lower surface of the substrate 2 is removed.

上側エアー洗浄部５および下側エアー洗浄部１５は、効率的に基板２を洗浄するために基板２の表面に近接して配置されている。そのため洗浄領域４には、第１搬送ローラ７および第２搬送ローラ１０を配置することができない。なお、上側エアー洗浄部５に基板２が接触しないようにするために、上側エアー洗浄部５と基板２の上面との距離が、下側エアー洗浄部１５と基板２の下面との距離より長くなるようにしている。   The upper air cleaning unit 5 and the lower air cleaning unit 15 are disposed close to the surface of the substrate 2 in order to efficiently clean the substrate 2. Therefore, the first conveyance roller 7 and the second conveyance roller 10 cannot be arranged in the cleaning region 4. In order to prevent the substrate 2 from coming into contact with the upper air cleaning unit 5, the distance between the upper air cleaning unit 5 and the upper surface of the substrate 2 is longer than the distance between the lower air cleaning unit 15 and the lower surface of the substrate 2. It is trying to become.

図１においては、上側エアー洗浄部５および下側エアー洗浄部１５が基板２上に噴き付けるエアーの位置を二点鎖線２６で示している。また、基板２の端辺３が伸びる方向を二点鎖線２７で示している。二点鎖線２６と二点鎖線２７とのなす角２８をθとすると、本実施形態においてはθ＝３°としたが、３°≦θ≦４５°であることが好ましい。   In FIG. 1, the position of the air sprayed onto the substrate 2 by the upper air cleaning unit 5 and the lower air cleaning unit 15 is indicated by a two-dot chain line 26. The direction in which the edge 3 of the substrate 2 extends is indicated by a two-dot chain line 27. Assuming that the angle 28 formed by the two-dot chain line 26 and the two-dot chain line 27 is θ, θ = 3 ° in the present embodiment, but 3 ° ≦ θ ≦ 45 ° is preferable.

このように、上側エアー洗浄部５および下側エアー洗浄部１５は、基板２の端辺３が伸びる方向に対して基板２上において交差するようにカーテン状にエアーを噴き付けている。   As described above, the upper air cleaning unit 5 and the lower air cleaning unit 15 spray air in a curtain shape so as to intersect on the substrate 2 with respect to the direction in which the end 3 of the substrate 2 extends.

図１に示すように、基板２の端辺３において、図の上端側をＵ側、下端側をＤ側とする。このＵ側とＤ側とは、逆になってもよい。角２８であるθを３°とした場合、基板２は、端辺３のＤ側の周辺から洗浄領域４に搬入される。このようにすることにより、上側エアー洗浄部５および下側エアー洗浄部１５の間の乱流が洗浄領域４に搬入された直後の基板２に作用する面積を小さくすることができるため、基板２が洗浄領域４内に搬入された際の基板２のバタつきを抑制することができる。   As shown in FIG. 1, in the edge 3 of the board | substrate 2, let the upper end side of a figure be a U side and let a lower end side be a D side. The U side and the D side may be reversed. When θ which is the angle 28 is 3 °, the substrate 2 is carried into the cleaning region 4 from the periphery on the D side of the edge 3. By doing in this way, since the area which acts on the board | substrate 2 immediately after the turbulent flow between the upper side air washing | cleaning part 5 and the lower side air washing | cleaning part 15 was carried in into the washing | cleaning area | region 4 can be made small, board | substrate 2 Can be prevented from fluttering of the substrate 2 when it is carried into the cleaning region 4.

角２８であるθを０°とした場合、基板２は、端辺３のＵ側からＤ側までの端部全体が同時に洗浄領域４に搬入される。この場合、上側エアー洗浄部５および下側エアー洗浄部１５の間の乱流が洗浄領域４に搬入された直後の基板２に作用する面積が大きいため、基板２が洗浄領域４内に搬入された際の基板２のバタつきが大きくなる。   When θ which is the angle 28 is set to 0 °, the entire end portion of the substrate 2 from the U side to the D side of the end side 3 is simultaneously carried into the cleaning region 4. In this case, since the area where the turbulent flow between the upper air cleaning unit 5 and the lower air cleaning unit 15 acts on the substrate 2 immediately after being transferred into the cleaning region 4 is large, the substrate 2 is transferred into the cleaning region 4. The fluttering of the substrate 2 at the time becomes large.

そのため、本実施形態においてはθ＝３°としたが、３°＜θ≦４５°としても基板２のバタつきを抑制することができる。しかし、上記の範囲内においてθが大きくなると、上側エアー洗浄部５および下側エアー洗浄部１５が長くなるため、基板処理装置１の装置コストが高くなる。装置コストの増加を抑制しつつ、基板２のバタつきを抑えるためには、θ＝３°であることが特に好ましい。   Therefore, in this embodiment, θ = 3 °. However, even if 3 ° <θ ≦ 45 °, the flutter of the substrate 2 can be suppressed. However, if θ is increased within the above range, the upper air cleaning unit 5 and the lower air cleaning unit 15 become longer, so that the apparatus cost of the substrate processing apparatus 1 increases. In order to suppress the flutter of the substrate 2 while suppressing an increase in apparatus cost, it is particularly preferable that θ = 3 °.

図１，２に示すように、洗浄領域４には、基板２を下面から支持する基板案内部１３が設けられている。本実施形態においては、基板案内部１３は複数のフリーローラから構成されている。このため、フリーローラが基板２の下面を支持した状態で基板２が搬送される際にはフリーローラが転がるため、基板２に付加される搬送抵抗を低く抑えることができる。フリーローラは、洗浄領域に均等に配置されていることが好ましく、たとえば、千鳥状に配置されていてもよい。   As shown in FIGS. 1 and 2, the cleaning region 4 is provided with a substrate guide portion 13 that supports the substrate 2 from the lower surface. In this embodiment, the board | substrate guide part 13 is comprised from the some free roller. For this reason, when the substrate 2 is transported with the free roller supporting the lower surface of the substrate 2, the free roller rolls, so that the transport resistance applied to the substrate 2 can be kept low. The free rollers are preferably arranged evenly in the cleaning area, and may be arranged in a staggered manner, for example.

基板２を支持する際に基板２と接触する基板案内部１３の上端の高さは、第１搬送ローラ７の上端の高さより低く、下側エアー洗浄部１５の上端の高さより高くなるように設定されている。フリーローラは、フリーローラの軸部が図示しない取付部と接続されることにより設置され、その取付け高さが調節可能にされている。   The height of the upper end of the substrate guide 13 that contacts the substrate 2 when supporting the substrate 2 is lower than the height of the upper end of the first transport roller 7 and higher than the height of the upper end of the lower air cleaning unit 15. Is set. The free roller is installed by connecting the shaft portion of the free roller to a mounting portion (not shown), and its mounting height can be adjusted.

基板案内部１３が第１搬送手段９から洗浄領域４に搬入された基板２の下面を支持することにより、基板２の端辺３のＤ側が下側エアー洗浄部１５に接触することを防止することができる。具体的には、上側エアー洗浄部５および下側エアー洗浄部１５の間の乱流による基板２のバタつきと基板２の自重とによって、洗浄領域４に搬入された基板２は下側エアー洗浄部１５に引き寄せられる。このとき、基板２の下面を基板案内部１３が支持しているため、基板２は下側エアー洗浄部１５に接触することなく、第２搬送手段１２によって洗浄領域４から搬出される。   The substrate guide unit 13 supports the lower surface of the substrate 2 carried into the cleaning region 4 from the first transport unit 9, thereby preventing the D side of the edge 3 of the substrate 2 from contacting the lower air cleaning unit 15. be able to. Specifically, the substrate 2 carried into the cleaning region 4 is subjected to the lower air cleaning due to the fluttering of the substrate 2 due to the turbulent flow between the upper air cleaning unit 5 and the lower air cleaning unit 15 and the dead weight of the substrate 2. It is attracted to the part 15. At this time, since the substrate guide unit 13 supports the lower surface of the substrate 2, the substrate 2 is unloaded from the cleaning region 4 by the second transport unit 12 without contacting the lower air cleaning unit 15.

図３は、本実施形態に係る上側エアー洗浄部の構造を模式的に示す斜視図である。図４は、本実施形態に係る下側エアー洗浄部の構造を模式的に示す斜視図である。図３に示すように、上側エアー洗浄部５の下面には、エアーをカーテン状に噴き付ける噴き付け部２０が上側エアー洗浄部５の長手方向に延在するように設けられている。   FIG. 3 is a perspective view schematically showing the structure of the upper air cleaning unit according to the present embodiment. FIG. 4 is a perspective view schematically showing the structure of the lower air cleaning unit according to the present embodiment. As shown in FIG. 3, a spraying unit 20 that sprays air in a curtain shape is provided on the lower surface of the upper air cleaning unit 5 so as to extend in the longitudinal direction of the upper air cleaning unit 5.

上側エアー洗浄部５の下面を平面的に見て、中央部に噴き付け部２０が配置され、噴き付け部２０を挟むように噴き付け部２０の両側に、噴き付け部２０から噴き付けたエアーを吸入する吸入部２１ａおよび吸入部２１ｂが設けられている。   When the lower surface of the upper air cleaning unit 5 is viewed in plan, the spraying part 20 is arranged in the center, and the air sprayed from the spraying part 20 on both sides of the spraying part 20 so as to sandwich the spraying part 20 A suction part 21a and a suction part 21b are provided.

図４に示すように、下側エアー洗浄部１５の上面には、エアーをカーテン状に噴き付ける噴き付け部２２が下側エアー洗浄部１５の長手方向に延在するように設けられている。下側エアー洗浄部１５の上面を平面的に見て、中央部に噴き付け部２２が配置され、噴き付け部２２を挟むように噴き付け部２２の両側に、噴き付け部２２から噴き付けられたエアーを吸入する吸入部２３ａおよび吸入部２３ｂが設けられている。   As shown in FIG. 4, on the upper surface of the lower air cleaning unit 15, a spraying unit 22 that sprays air in a curtain shape is provided so as to extend in the longitudinal direction of the lower air cleaning unit 15. When the upper surface of the lower air cleaning unit 15 is viewed in plan, the spraying part 22 is arranged in the center, and is sprayed from the spraying part 22 on both sides of the spraying part 22 so as to sandwich the spraying part 22. A suction part 23a and a suction part 23b for sucking air are provided.

本実施形態にいては、吸入部２３ａが配置されている領域に、基板案内部２５ａが配置されている。また、吸入部２３ｂが配置されている領域に、基板案内部２５ｂが配置されている。基板案内部２５ａ，２５ｂは、基板案内部１３と同様にフリーローラで構成されている。   In this embodiment, the board | substrate guide part 25a is arrange | positioned in the area | region where the suction | inhalation part 23a is arrange | positioned. Further, the substrate guide portion 25b is disposed in the region where the suction portion 23b is disposed. Substrate guide portions 25a and 25b are constituted by free rollers as with the substrate guide portion 13.

基板案内部２５ａは、下側エアー洗浄部１５の上面に形成された開口部２４ａからフリーローラの一部が突出するように設けられている。基板案内部２５ｂは、下側エアー洗浄部１５の上面に形成された開口部２４ｂからフリーローラの一部が突出するように設けられている。基板案内部２５ａ，２５ｂの基板支持高さは、基板案内部１３の基板支持高さに対応して調節される。   The substrate guide 25a is provided such that a part of the free roller protrudes from an opening 24a formed on the upper surface of the lower air cleaning unit 15. The substrate guide portion 25b is provided so that a part of the free roller protrudes from an opening 24b formed on the upper surface of the lower air cleaning portion 15. The substrate support height of the substrate guide portions 25a and 25b is adjusted in accordance with the substrate support height of the substrate guide portion 13.

図５は、図４の下側エアー洗浄部を矢印Ｖ方向から見た側面図である。図５に示すように、下側エアー洗浄部１５は、噴き付け部２２から矢印１８で示す方向にエアーが噴き付けられ、吸入部２３ａおよび吸入部２３ｂから矢印１９に示す方向にエアーを吸入している。   FIG. 5 is a side view of the lower air cleaning unit in FIG. As shown in FIG. 5, the lower air cleaning unit 15 blows air in the direction indicated by the arrow 18 from the blowing unit 22 and sucks air in the direction indicated by the arrow 19 from the suction unit 23 a and the suction unit 23 b. ing.

基板２が下側エアー洗浄部１５の上方を通過する際、基板２は、エアーが吸入されている吸入部２３ａの領域に配置された基板案内部２５ａ、および、エアーが吸入されている吸入部２３ｂの領域に配置された基板案内部２５ｂによって下面を支持されている。この結果、基板２は下側エアー洗浄部１５に接触することなく、洗浄領域４を安定して通過することができる。本実施形態においては、基板案内部２５ａ，２５ｂを設けたが、基板案内部１３が設けられていればよく、基板案内部２５ａ，２５ｂは必ずしも設けなくてもよい。   When the substrate 2 passes above the lower air cleaning unit 15, the substrate 2 includes a substrate guide unit 25 a disposed in the area of the suction unit 23 a through which air is sucked and a suction unit through which air is sucked. The lower surface is supported by the substrate guide portion 25b disposed in the region 23b. As a result, the substrate 2 can stably pass through the cleaning region 4 without contacting the lower air cleaning unit 15. In the present embodiment, the substrate guides 25a and 25b are provided. However, the substrate guides 13 may be provided, and the substrate guides 25a and 25b are not necessarily provided.

図６は、本実施形態に係る基板処理装置において、洗浄領域に搬入される基板を模式的に示す斜視図である。図６においては、簡単のため、基板２と下側エアー洗浄部１５と一部の基板案内部についてのみ図示し、その他の構成については図示していない。図７は、図６の基板案内部を矢印ＶＩＩ方向から見た側面図である。   FIG. 6 is a perspective view schematically showing a substrate carried into the cleaning region in the substrate processing apparatus according to the present embodiment. In FIG. 6, for simplicity, only the substrate 2, the lower air cleaning unit 15, and some substrate guide units are illustrated, and other configurations are not illustrated. FIG. 7 is a side view of the substrate guide portion of FIG. 6 as viewed from the direction of arrow VII.

図６に示すように、洗浄領域４の内、図示しない第１搬送手段９に隣接している領域を隣接領域２９とする。図６においては、洗浄領域４に配置された基板案内部１３の内、隣接領域２９に配置された基板案内部１３Ａ〜１３Ｅのみ表示している。また、説明の便宜上、隣接領域２９に５つの基板案内部１３Ａ〜１３Ｅを図示したが、隣接領域２９に配置される基板案内部１３の数はこれに限られない。   As shown in FIG. 6, an area adjacent to the first transport means 9 (not shown) in the cleaning area 4 is defined as an adjacent area 29. In FIG. 6, only the substrate guide portions 13 </ b> A to 13 </ b> E disposed in the adjacent region 29 among the substrate guide portions 13 disposed in the cleaning region 4 are displayed. For convenience of explanation, the five substrate guide portions 13A to 13E are illustrated in the adjacent region 29, but the number of substrate guide portions 13 disposed in the adjacent region 29 is not limited thereto.

第１搬送手段９により矢印６方向に搬送された基板２は、端辺３を先頭にして洗浄領域４に搬入される。このとき、基板２の端辺３側は、第１搬送手段９の搬送方向の最も下流側に配置された図示しない第１搬送ローラ７から隣接領域２９に配置された基板案内部１３Ａ〜Ｅに乗り移ることになる。   The substrate 2 transported in the direction of the arrow 6 by the first transport means 9 is transported into the cleaning region 4 with the edge 3 as the head. At this time, the edge 3 side of the substrate 2 extends from the first conveyance roller 7 (not shown) arranged on the most downstream side in the conveyance direction of the first conveyance means 9 to the substrate guide portions 13A to 13E arranged in the adjacent region 29. I will change.

図６に示すように、隣接領域２９の近傍には、下側エアー洗浄部１５の吸入部２３ｂがある。基板２の端辺３周辺が搬送方向下流側の第１搬送ローラ７から離れるほど、基板２の自重と吸入部２３ｂのエアーの吸込みにより、基板２の端辺３側は矢印１９に示すように下方に引き寄せられる。   As shown in FIG. 6, there is a suction portion 23 b of the lower air cleaning portion 15 in the vicinity of the adjacent region 29. As the periphery of the edge 3 of the substrate 2 is further away from the first conveyance roller 7 on the downstream side in the conveyance direction, the edge 3 side of the substrate 2 is indicated by an arrow 19 due to the weight of the substrate 2 and the suction of air in the suction portion 23b. It is drawn down.

特に、吸入部２３ｂの最も近くに位置する基板２の端辺３のＤ側は、大きな引き寄せ力を受ける。そのため、基板２の端辺３において、基板２の高さがＵ側からＤ側に向けて低くなるように、基板２は傾いた状態で基板案内部１３Ａ〜１３Ｅに乗り移る。このため、基板案内部１３Ａ〜１３Ｅの基板２の支持高さを上記の基板２の傾きに対応させることが好ましい。   In particular, the D side of the edge 3 of the substrate 2 located closest to the suction part 23b receives a large pulling force. Therefore, at the edge 3 of the substrate 2, the substrate 2 is transferred to the substrate guides 13 </ b> A to 13 </ b> E in an inclined state so that the height of the substrate 2 decreases from the U side toward the D side. For this reason, it is preferable to make the support height of the board | substrate 2 of board | substrate guide part 13A-13E respond | correspond to the inclination of said board | substrate 2. FIG.

図７に示すように、基板案内部１３Ａの上端の位置である基板支持高さｈAより基板案内部１３Ｂの上端の位置である基板支持高さｈBが高くなるようにする。基板案内部１３Ｂの基板支持高さｈBより基板案内部１３Ｃの上端の位置である基板支持高さｈCが高くなるようにする。基板案内部１３Ｃの基板支持高さｈCより基板案内部１３Ｄの上端の位置である基板支持高さｈDが高くなるようにする。基板案内部１３Ｄの基板支持高さｈDより基板案内部１３Ｅの上端の位置である基板支持高さｈEが高くなるようにする。 As shown in FIG. 7, the substrate support height h B that is the position of the upper end of the substrate guide portion 13B is made higher than the substrate support height h A that is the position of the upper end of the substrate guide portion 13A. The substrate support height h C that is the position of the upper end of the substrate guide portion 13C is made higher than the substrate support height h B of the substrate guide portion 13B. The substrate support height h D which is the position of the upper end of the substrate guide portion 13D is made higher than the substrate support height h C of the substrate guide portion 13C. The substrate support height h E that is the position of the upper end of the substrate guide portion 13E is made higher than the substrate support height h D of the substrate guide portion 13D.

基板案内部１３Ａ〜１３Ｅの基板２の支持高さを上記のようにすることにより、基板２の端辺３のＤ側が基板案内部１３Ａに衝突することによって基板２にキズまたは割れなどの損傷が発生することを防止することができる。また、基板２の端辺３のＵ側の下面と基板案内部１３Ｅの上端との間に隙間が発生することを防止して、基板案内部１３Ａ〜１３Ｅの全てによって基板２を支持することができる。   By making the support height of the substrate 2 of the substrate guides 13A to 13E as described above, the D side of the edge 3 of the substrate 2 collides with the substrate guide 13A, thereby causing damage such as scratches or cracks to the substrate 2. Occurrence can be prevented. Further, it is possible to prevent a gap from being generated between the lower surface on the U side of the edge 3 of the substrate 2 and the upper end of the substrate guide portion 13E, and to support the substrate 2 by all of the substrate guide portions 13A to 13E. it can.

このように、洗浄領域４における第１搬送手段９との隣接領域２９に位置する部分の基板案内部１３Ａ〜１３Ｅは、下側エアー洗浄部１５の近くに位置する部分の方が遠くに位置する部分より基板の支持高さが低くなるように設定されている。   As described above, the portions of the substrate guide portions 13A to 13E located in the region 29 adjacent to the first transport unit 9 in the cleaning region 4 are located farther from the portion located near the lower air cleaning unit 15. The support height of the substrate is set to be lower than the portion.

本実施形態の基板処理装置１によれば、洗浄領域４に基板案内部１３を設けて基板２の下面を支持することによって、洗浄領域４を通過する基板２が下側エアー洗浄部１５に接触することを防止して、基板２に損傷を発生することなく基板２を洗浄することができる。   According to the substrate processing apparatus 1 of the present embodiment, the substrate 2 passing through the cleaning region 4 contacts the lower air cleaning unit 15 by providing the substrate guide unit 13 in the cleaning region 4 and supporting the lower surface of the substrate 2. The substrate 2 can be cleaned without causing damage to the substrate 2.

以下、本発明の実施形態２に係る基板処理装置について図面を参照して説明する。
実施形態２
図８は、本発明の実施形態２に係る基板処理装置の構成を模式的に示す平面図である。図９は、図８の基板処理装置をＩＸ−ＩＸ線矢印方向から見た断面図である。本発明の実施形態２に係る基板処理装置３０は、基板２の搬送路１４の途中に連続して２つの上側エアー洗浄部３２，３５および下側エアー洗浄部３７，３８が設けられている。 A substrate processing apparatus according to Embodiment 2 of the present invention will be described below with reference to the drawings.
Embodiment 2
FIG. 8 is a plan view schematically showing the configuration of the substrate processing apparatus according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view of the substrate processing apparatus of FIG. 8 as viewed from the direction of arrows IX-IX. In the substrate processing apparatus 30 according to the second embodiment of the present invention, two upper air cleaning units 32 and 35 and lower air cleaning units 37 and 38 are provided in the middle of the conveyance path 14 of the substrate 2.

図８，９に示すように、上側エアー洗浄部および下側エアー洗浄部を基板２の搬送路１４の途中に２つずつ配置することにより、基板２の洗浄速度を落とすことなく高い除去率で基板２を洗浄することができる。本実施形態においては、上側エアー洗浄部および下側エアー洗浄部を２つずつ配置したが、複数であればよく、それぞれ３つ以上配置してもよい。上側エアー洗浄部および下側エアー洗浄部を複数配置している以外の構成については、実施形態１と同様であるため、その他の構成については説明を繰り返さない。   As shown in FIGS. 8 and 9, by arranging two upper air cleaning units and two lower air cleaning units in the middle of the conveyance path 14 of the substrate 2, a high removal rate can be achieved without reducing the cleaning speed of the substrate 2. The substrate 2 can be cleaned. In the present embodiment, two upper air cleaning units and two lower air cleaning units are disposed. However, a plurality of upper air cleaning units and three or more lower air cleaning units may be disposed. Since the configuration other than the arrangement of the plurality of upper air cleaning units and the lower air cleaning unit is the same as that of the first embodiment, the description of the other configurations will not be repeated.

基板２の搬送方向の上流側に位置する洗浄領域３１には、基板案内部３３が配置されている。基板２の搬送方向の下流側に位置する洗浄領域３４には、基板案内部３６が配置されている。基板２は、第１搬送手段９により矢印６方向に搬入されて、洗浄領域３１から洗浄領域３４を通過して第２搬送手段１２よって搬出される。   A substrate guide 33 is disposed in the cleaning region 31 located on the upstream side in the transport direction of the substrate 2. A substrate guide portion 36 is disposed in the cleaning region 34 located on the downstream side in the transport direction of the substrate 2. The substrate 2 is loaded in the direction of the arrow 6 by the first transport unit 9, passes through the cleaning region 34 from the cleaning region 31, and is unloaded by the second transport unit 12.

図１０は、図８の搬送手段および基板案内部を矢印Ｘ方向側から見た状態を模式的に示す側面図である。図１０に示すように、第１搬送ローラ７の上端の位置である第１搬送手段９の基板支持高さｈIが基板案内部３３の上端の位置である基板支持高さｈSより高くなるようにする。基板案内部３３の基板支持高さｈSが基板案内部３６の上端の位置である基板支持高さｈTより高くなるようにする。基板案内部３６の基板支持高さｈTが第２搬送ローラ１０の上端の位置である基板支持高さｈOより高くなるようにする。 FIG. 10 is a side view schematically showing a state in which the conveying means and the substrate guide part of FIG. 8 are viewed from the arrow X direction side. As shown in FIG. 10, the substrate support height h I of the first transport means 9 that is the position of the upper end of the first transport roller 7 is higher than the substrate support height h S that is the position of the upper end of the substrate guide 33. Like that. The substrate support height h S of the substrate guide portion 33 is set to be higher than the substrate support height h T which is the position of the upper end of the substrate guide portion 36. The substrate support height h T of the substrate guide 36 is set to be higher than the substrate support height h O that is the position of the upper end of the second transport roller 10.

上記のように基板支持高さを調節することにより、基板２が第１搬送ローラ７から基板案内部３３に乗り移る際に、基板２の端辺３が基板案内部３３に衝突することを防止することができる。同様に、基板２が基板案内部３３から基板案内部３６に乗り移る際に、基板２の端辺３が基板案内部３６に衝突することを防止することができる。また、基板２が基板案内部３６から第２搬送ローラ１０に乗り移る際に、基板２の端辺３が第２搬送ローラ１０に衝突することを防止することができる。この結果、基板２が搬送途中にキズまたは割れなどの損傷を受けることを防止することができる。   By adjusting the substrate support height as described above, the edge 3 of the substrate 2 is prevented from colliding with the substrate guide 33 when the substrate 2 is transferred from the first transport roller 7 to the substrate guide 33. be able to. Similarly, it is possible to prevent the edge 3 of the substrate 2 from colliding with the substrate guide portion 36 when the substrate 2 is transferred from the substrate guide portion 33 to the substrate guide portion 36. Further, it is possible to prevent the edge 3 of the substrate 2 from colliding with the second transport roller 10 when the substrate 2 is transferred from the substrate guide part 36 to the second transport roller 10. As a result, it is possible to prevent the substrate 2 from being damaged such as scratches or cracks during the conveyance.

なお、今回開示した上記実施形態はすべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。   In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

１，３０ 基板処理装置、２ 基板、３ 端辺、４，３１，３４ 洗浄領域、５，３２，３５ 上側エアー洗浄部、７ 第１搬送ローラ、８ 第１搬送軸、９ 第１搬送手段、１０ 第２搬送ローラ、１１ 第２搬送軸、１２ 第２搬送手段、１３，１３Ａ，１３Ｂ，１３Ｃ，１３Ｄ，１３Ｅ，２５ａ，２５ｂ，３３，３６ 基板案内部、１４ 搬送路、１５，３７，３８ 下側エアー洗浄部、２０，２２ 噴き付け部、２１ａ，２１ｂ，２３ａ，２３ｂ 吸入部、２４ａ，２４ｂ 開口部、２９ 隣接領域。   DESCRIPTION OF SYMBOLS 1,30 Substrate processing apparatus, 2 Substrate, 3 Edges, 4, 31, 34 Cleaning area, 5, 32, 35 Upper air cleaning section, 7 First transport roller, 8 First transport shaft, 9 First transport means, 10 Second transport roller, 11 Second transport shaft, 12 Second transport means, 13, 13A, 13B, 13C, 13D, 13E, 25a, 25b, 33, 36 Substrate guide part, 14 Transport path, 15, 37, 38 Lower air cleaning section, 20, 22 spraying section, 21a, 21b, 23a, 23b suction section, 24a, 24b opening section, 29 adjacent area.

Claims (7)

直線状の端辺を有する基板が搬送される搬送路より上方および下方から前記基板をエアー洗浄する基板処理装置であって、
前記搬送路の途中に設けられた洗浄領域の上方に配置され、前記基板の上面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを吸入することにより前記基板を洗浄する上側エアー洗浄部と、
前記搬送路の下方において前記上側エアー洗浄部と対向する位置に配置され、前記基板の下面にカーテン状にエアーを噴き付けつつ、噴き付けたエアーを吸入することにより前記基板を洗浄する下側エアー洗浄部と、
前記基板の下面を支持して、前記基板面内において前記端辺が伸びる方向と直交する方向に前記基板を搬送することにより、前記基板を前記端辺側から前記洗浄領域に搬入する第１搬送手段と、
前記基板の下面を支持して前記基板を前記洗浄領域から搬出する第２搬送手段と、
を備え、
前記上側エアー洗浄部および前記下側エアー洗浄部は、前記端辺が伸びる方向に対して前記基板上において交差するようにカーテン状にエアーを噴き付け、
前記洗浄領域には基板案内部が配置され、前記下側エアー洗浄部によるエアーの吸入によって前記基板が前記下側エアー洗浄部に接触することを、前記基板案内部が前記基板の下面を支持することによって防止する、基板処理装置。 A substrate processing apparatus for air-cleaning the substrate from above and below a conveyance path through which a substrate having a straight edge is conveyed,
An upper air cleaning unit disposed above a cleaning region provided in the middle of the transport path, and cleaning the substrate by inhaling the sprayed air while spraying air on the upper surface of the substrate in a curtain shape; ,
Lower air, which is disposed below the transport path at a position facing the upper air cleaning unit and cleans the substrate by inhaling the sprayed air while spraying air onto the lower surface of the substrate. A cleaning section;
A first transport that supports the lower surface of the substrate and transports the substrate into the cleaning region from the edge side by transporting the substrate in a direction orthogonal to the direction in which the edge extends in the substrate surface. Means,
Second transport means for supporting the lower surface of the substrate and carrying the substrate out of the cleaning region;
With
The upper air cleaning unit and the lower air cleaning unit spray air in a curtain shape so as to intersect on the substrate with respect to the direction in which the end extends.
A substrate guide unit is disposed in the cleaning region, and the substrate guide unit supports the lower surface of the substrate when the substrate comes into contact with the lower air cleaning unit by inhaling air by the lower air cleaning unit. The substrate processing apparatus which prevents by this. 前記上側エアー洗浄部および前記下側エアー洗浄部は、前記端辺が伸びる方向に対して前記基板上において３°以上４５°以下の角度で交差するようにカーテン状にエアーを噴き付ける、請求項１に記載の基板処理装置。   The upper air cleaning unit and the lower air cleaning unit spray air in a curtain shape so as to intersect at an angle of 3 ° to 45 ° on the substrate with respect to a direction in which the end side extends. 2. The substrate processing apparatus according to 1. 前記洗浄領域における前記第１搬送手段との隣接領域に位置する部分の前記基板案内部は、前記下側エアー洗浄部の近くに位置する部分の方が遠くに位置する部分より前記基板の支持高さが低い、請求項１または２に記載の基板処理装置。   The portion of the substrate guide in the region adjacent to the first transport means in the cleaning region is higher in the support height of the substrate than the portion in the vicinity of the lower air cleaning portion. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is low. 前記下側エアー洗浄部には、カーテン状にエアーを噴き付ける噴き付け部、および、噴き付けたエアーを吸入する吸入部が設けられ、
前記噴き付け部は、平面的に見て、前記下側エアー洗浄部の中央部に配置され、
前記吸入部は、平面的に見て、前記噴き付け部を挟むように前記噴き付け部の両側に配置され、
前記基板案内部の一部は、前記吸入部が配置されている領域に配置されている、請求項１から３のいずれかに記載の基板処理装置。 The lower air cleaning part is provided with a spraying part for spraying air in a curtain shape, and a suction part for sucking the sprayed air,
The spraying part is disposed in the center of the lower air cleaning part as seen in a plan view,
The suction part is arranged on both sides of the spraying part so as to sandwich the spraying part when seen in a plan view,
4. The substrate processing apparatus according to claim 1, wherein a part of the substrate guide portion is disposed in a region where the suction portion is disposed. 5. 前記上側エアー洗浄部および前記下側エアー洗浄部が、前記基板の前記搬送路の途中に連続して複数配置されている、請求項１から４のいずれかに記載の基板処理装置。   5. The substrate processing apparatus according to claim 1, wherein a plurality of the upper air cleaning unit and the lower air cleaning unit are continuously arranged in the middle of the transport path of the substrate. 前記基板の搬送方向の上流側に位置する前記洗浄領域に配置されている前記基板案内部の前記基板の支持高さは、前記搬送方向の下流側に位置する前記洗浄領域に配置されている前記基板案内部の前記基板の支持高さより高い、請求項５に記載の基板処理装置。   The support height of the substrate of the substrate guide portion disposed in the cleaning region located upstream in the transport direction of the substrate is disposed in the cleaning region located downstream in the transport direction. The substrate processing apparatus according to claim 5, wherein the substrate guide is higher than a support height of the substrate. 前記基板案内部が複数のフリーローラから構成されている、請求項１から６のいずれかに記載の基板処理装置。   The substrate processing apparatus according to claim 1, wherein the substrate guide unit is configured by a plurality of free rollers.
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