JP2013042359A - Imaging apparatus - Google Patents

Imaging apparatus Download PDF

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JP2013042359A
JP2013042359A JP2011177840A JP2011177840A JP2013042359A JP 2013042359 A JP2013042359 A JP 2013042359A JP 2011177840 A JP2011177840 A JP 2011177840A JP 2011177840 A JP2011177840 A JP 2011177840A JP 2013042359 A JP2013042359 A JP 2013042359A
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substrate
case
shield case
connector
imaging apparatus
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JP5821394B2 (en
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Kohei Shimizu
広平 清水
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Ricoh Co Ltd
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Ricoh Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To solve a problem that electronic components cannot be disposed near a housing of a substrate because the electronic components provided on the substrate may contact with the housing due to vibrations or the like and cause a short circuit in an imaging apparatus.SOLUTION: An imaging apparatus A includes: a holding member 21 holding a photographic optical system 1; a first substrate 41 which is joined to the holding member 21 and is provided with an image pickup device 411 optically converting an image formed by the photographic optical system and a first connector 412 for connection; a second substrate 42 provided with a second connector 422 connecting with the first connector 412 and electronic components 42e; and a shield case 5 which is fixed to the holding member 21 enclosing around the first substrate 41 and the second substrate 42. The second substrate 42 has a joining part 42a joined to the shield case 5, and at least an electronic component 42f which is located near the joining part 42a of the shield case 5, from among the electronic components 42e provided on the second substrate 42, is covered by a non conductive material.

Description

本発明は、車載カメラ、デジタルカメラ及びデジタルビデオカメラ等に用いられる撮像装置に関する。   The present invention relates to an imaging apparatus used for an in-vehicle camera, a digital camera, a digital video camera, and the like.

従来から、撮影用のレンズと、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅ）やＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ Ｍｅｔａｌ Ｏｘｉｄｅ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ）等の撮像素子とで構成された撮像装置が知られている。   2. Description of the Related Art Conventionally, there has been known an image pickup apparatus including a photographing lens and an image pickup element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

この様な撮像装置は、デジタルカメラやデジタルビデオカメラ、あるいは自動車の車体の外部や車室内に取り付けられる車載カメラ、屋外の監視カメラ等に用いられている。   Such an imaging apparatus is used for a digital camera, a digital video camera, an in-vehicle camera attached to the outside of a car body or in a vehicle interior, an outdoor surveillance camera, and the like.

車載カメラや監視カメラとして用いられる撮像装置では、多くの場合、電磁波対策のために撮像素子や電子部品が設けられた基板を囲う様にシールドケースを設けて構成される。   In many cases, an imaging apparatus used as an in-vehicle camera or a surveillance camera is configured by providing a shield case so as to surround a substrate on which an imaging element and electronic components are provided for electromagnetic wave countermeasures.

例えば特許文献１では、外装を構成する筐体と、前記筐体の前部に組み込まれ撮影光学系を構成するレンズと、前記筐体の内部に設けられた前記撮影光学系によって導かれた被写体像を撮像する撮像素子と、前記筐体の内部に配設され前記撮像素子が搭載されたプリント配線基板とを含んで構成される撮像装置であって、前記プリント配線基板は、前記筐体に設けられた支持壁に接着剤で取着されている。   For example, in Patent Document 1, a casing that constitutes an exterior, a lens that is incorporated in a front portion of the casing and constitutes a photographing optical system, and a subject guided by the photographing optical system provided inside the casing. An image pickup apparatus configured to include an image pickup device that picks up an image and a printed wiring board that is disposed inside the housing and has the image pickup device mounted thereon, wherein the printed wiring board is attached to the housing. It is attached to the provided support wall with an adhesive.

この様な構成によれば、撮像素子が搭載されたプリント配線基板を支持壁に接着剤で取着するため、レンズに対する撮像素子の位置決めの自由度を大きく確保できるといった効果が得られる。   According to such a configuration, since the printed wiring board on which the image sensor is mounted is attached to the support wall with an adhesive, an effect that a large degree of freedom in positioning the image sensor with respect to the lens can be obtained.

近年、特に車載カメラや監視カメラとして用いられる撮像装置では、小型化及び高機能化が求められており、基板上に電子部品を設ける範囲を拡大して電子部品を数多く実装する必要がある。   In recent years, imaging devices used as in-vehicle cameras and surveillance cameras in particular have been required to be downsized and highly functional, and it is necessary to increase the range in which electronic components are provided on a substrate and to mount many electronic components.

しかしながら、特許文献１に係る撮像装置の構成では、振動等により基板上に設けられた電子部品が筐体に接触してショートする場合があり、基板の筐体近傍には電子部品を配置することが出来ないという問題がある。   However, in the configuration of the imaging device according to Patent Document 1, there is a case where an electronic component provided on the substrate comes into contact with the housing due to vibration or the like and short-circuits, and the electronic component is disposed near the housing of the substrate. There is a problem that cannot be done.

そこで本発明は、上記課題に鑑み、撮影光学系を保持する保持部材と、前記保持部材に接合し、前記撮影光学系により結像される像を光学変換する撮像素子及び接続用の第１コネクタが設けられた第１基板と、前記第１コネクタに接続する第２コネクタ及び電子部品が設けられた第２基板と、前記第１基板及び前記第２基板の周囲を囲んで前記保持部材に固定されるシールドケースと、を有する撮像装置であって、前記第２基板は、前記シールドケースと接合する接合部を有し、前記第２基板に設けられた前記電子部品のうち、少なくとも前記シールドケースの前記接合部近傍の前記電子部品は、非導電性材料により被覆されていることを特徴とする。   Therefore, in view of the above problems, the present invention provides a holding member that holds an imaging optical system, an imaging element that is bonded to the holding member and optically converts an image formed by the imaging optical system, and a first connector for connection. A first board provided with a second connector connected to the first connector, a second board provided with electronic components, and surrounding the first board and the second board to be fixed to the holding member The second substrate has a joint for joining to the shield case, and at least the shield case among the electronic components provided on the second substrate. The electronic component in the vicinity of the joint is coated with a non-conductive material.

本発明の実施形態によれば、基板上に設けられた電子部品のうち、基板とシールドケースとの接合部近傍の電子部品が非導電性材料により被覆されているため、振動等により電子部品がシールドケースに接触してもショート等により部品が破損することがない。   According to the embodiment of the present invention, among the electronic components provided on the substrate, the electronic component in the vicinity of the joint between the substrate and the shield case is covered with the non-conductive material. Even if it comes into contact with the shield case, the parts will not be damaged by a short circuit.

したがって、基板上に電子部品を数多く実装できるため、撮像装置の小型化及び高機能化を実現することができる。   Therefore, since a large number of electronic components can be mounted on the substrate, it is possible to reduce the size and increase the functionality of the imaging apparatus.

実施形態に係る撮像装置の外観を示す斜視図The perspective view which shows the external appearance of the imaging device which concerns on embodiment 実施形態に係る撮像装置を接続コードの後方から見た斜視図The perspective view which looked at the imaging device concerning an embodiment from the back of a connection cord 実施形態に係る撮像装置から後側ケース及び接続コードを取り外した状態の斜視図The perspective view of the state which removed the rear side case and the connection cord from the imaging device which concerns on embodiment 実施形態に係る撮像装置から後側ケース及び接続コードを取り外した状態の断面図Sectional drawing of the state which removed the rear side case and the connection cord from the imaging device which concerns on embodiment 実施形態に係る撮像装置の前側ケースに第１基板を固定したものを斜め後方から見た斜視図The perspective view which looked at what fixed the 1st substrate to the front case of the imaging device concerning an embodiment from the slanting back. 実施形態に係る撮像装置の前側ケースを斜め後方から見た斜視図The perspective view which looked at the front case of the imaging device concerning an embodiment from the slanting back 実施形態に係る撮像装置の後側ケースの内側の構造を示す斜視図The perspective view which shows the structure inside the rear side case of the imaging device which concerns on embodiment 実施形態に係る撮像装置の第１基板及び第２基板を示す分解斜視図1 is an exploded perspective view showing a first substrate and a second substrate of an imaging apparatus according to an embodiment. 実施形態に係る撮像装置のシールドケースの斜視図The perspective view of the shield case of the imaging device which concerns on embodiment 実施形態に係る撮像装置のシールドケースの分解斜視図1 is an exploded perspective view of a shield case of an imaging apparatus according to an embodiment. 実施形態に係る撮像装置の接合用凸部と接合用開口部との接合前の状態を示す要部斜視図The principal part perspective view which shows the state before joining of the convex part for joining and the opening part for joining of the imaging device which concerns on embodiment 実施形態に係る撮像装置の第２基板の電子部品の実装範囲を説明する図2A and 2B are diagrams for explaining a mounting range of electronic components on a second substrate of the imaging apparatus according to the embodiment. 実施形態に係る撮像装置の接合用凸部と接合用開口部との接合後の状態を示す要部斜視図The principal part perspective view which shows the state after joining of the convex part for joining and the opening part for joining of the imaging device which concerns on embodiment

以下、本発明の好適な実施の形態（以下「実施形態」という）について、図面を用いて詳細に説明する。
＜撮像装置の構成＞
図１は、本発明の実施形態に係る撮像装置Ａの外観構成図である。図示した様に、撮像装置Ａは撮影光学系１と、アウタケース２と、接続コード３とを有する。 DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the drawings.
<Configuration of imaging device>
FIG. 1 is an external configuration diagram of an imaging apparatus A according to an embodiment of the present invention. As illustrated, the imaging apparatus A includes a photographing optical system 1, an outer case 2, and a connection cord 3.

アウタケース２は、撮影光学系１を収容して保持する前側ケース（保持部材）２１と、後述する第１基板４１及び第２基板４２を収容する後側ケース２２とに前後方向に分割されている。なお、図中に示す矢印ＦＲは撮像装置Ａによる撮像方向であり、矢印ＲＲはその反対方向である。また、矢印ＦＲ方向を前方、矢印ＲＲ方向を後方と称する。   The outer case 2 is divided in the front-rear direction into a front case (holding member) 21 that houses and holds the photographing optical system 1 and a rear case 22 that houses a first substrate 41 and a second substrate 42 described later. Yes. In addition, the arrow FR shown in the figure is the imaging direction by the imaging apparatus A, and the arrow RR is the opposite direction. The arrow FR direction is referred to as the front, and the arrow RR direction is referred to as the rear.

本実施形態に係る撮像装置Ａは、例えば、車両後部のバンパやナンバプレート周辺等に設置されて、車両後方の斜め下方を撮像する様に取り付けられる車載カメラとして用いられる。この撮像装置Ａの撮像画像は、撮像フレーム毎に図外の車載コンピュータに送信され、車室内に設置された図外の液晶ディスプレイ装置等に表示される。   The imaging apparatus A according to the present embodiment is installed as, for example, an in-vehicle camera that is installed around a bumper or a number plate around the rear of the vehicle and is attached so as to capture an obliquely lower part behind the vehicle. The captured image of the imaging device A is transmitted to an in-vehicle computer (not shown) for each imaging frame, and displayed on a liquid crystal display device (not shown) installed in the vehicle interior.

なお、車載カメラの使用例としてはこれに限らず、車両前方を撮像して障害物検知等に使用することもできる。また、本発明は車載カメラに限定されるものではなく、デジタルカメラやビデオカメラ、監視カメラ等にも適用可能である。   Note that the usage example of the in-vehicle camera is not limited to this, and the front of the vehicle can be imaged and used for obstacle detection or the like. Further, the present invention is not limited to a vehicle-mounted camera, but can be applied to a digital camera, a video camera, a surveillance camera, and the like.

図２に、撮像装置Ａを接続コード３の後方から見た図を示す。図示した様に、撮像装置Ａの後側ケース２２の後面２２ａには、撮像装置Ａを図外の車体にネジ留めするのに使用するネジ穴２２ｂ，２２ｃと、接続コード３を後側ケース２２にネジ留めするのに使用するネジ穴２２ｄ，２２ｅとが形成されている。   FIG. 2 shows a view of the imaging apparatus A as viewed from the rear of the connection cord 3. As shown in the figure, the rear surface 22a of the rear case 22 of the image pickup apparatus A has screw holes 22b and 22c used for screwing the image pickup apparatus A to the vehicle body outside the figure, and the connection cord 3 is connected to the rear case 22 Screw holes 22d and 22e used for screwing are formed.

図３は、撮像装置Ａから後側ケース２２及び接続コード３を取り外した状態を示す図であり、図４はその断面図である。   FIG. 3 is a diagram illustrating a state where the rear case 22 and the connection cord 3 are removed from the imaging apparatus A, and FIG. 4 is a cross-sectional view thereof.

前側ケース２１は、例えば樹脂によって形成された部材であり、図４に示す様に、撮影光学系１を保持している。この撮影光学系１は、本実施形態では６枚のレンズ１１〜１６で構成されている。また、前側ケース２１の後側には、第１基板４１が接合されている。   The front case 21 is a member formed of resin, for example, and holds the photographing optical system 1 as shown in FIG. The photographing optical system 1 is composed of six lenses 11 to 16 in this embodiment. A first substrate 41 is bonded to the rear side of the front case 21.

第１基板４１には、前面側にイメージセンサ４１１が保持されている。イメージセンサ４１１は、ＣＣＤやＣＭＯＳ等の固体撮像素子であり、撮影光学系１によって結像される像を光電変換し、画像信号として外部（例えば、車載コンピュータ）に出力する。   An image sensor 411 is held on the front side of the first substrate 41. The image sensor 411 is a solid-state imaging device such as a CCD or a CMOS, photoelectrically converts an image formed by the photographing optical system 1, and outputs the image signal to the outside (for example, an in-vehicle computer).

図５は、図３に示した前側ケース２１に第１基板４１を固定したものを斜め後方から見た斜視図である。   FIG. 5 is a perspective view of the first case 41 fixed to the front case 21 shown in FIG.

図示した様に、第１基板４１は略矩形に形成されており、その対角に位置する二箇所の隅部に、凹状に形成された略円弧状の凹部４１ａ，４１ｂが形成されている。また、第１基板４１は、後面側にコンデンサや抵抗等の電子部品４１ｅが実装されると共に、後述する第２基板４２に接続するための第１コネクタ４１２が設けられている。   As shown in the figure, the first substrate 41 is formed in a substantially rectangular shape, and concave portions 41a and 41b that are formed in a concave shape are formed in two corners located at opposite corners. The first substrate 41 is provided with a first connector 412 for mounting an electronic component 41e such as a capacitor and a resistor on the rear surface side, and for connecting to a second substrate 42 described later.

また、前側ケース２１には凹部４１ａ，４１ｂに対応して、同様に凹部２１ａ，２１ｂが形成されており、凹部４１ａと凹部２１ａ、凹部４１ｂと凹部２１ｂでそれぞれ形成する円筒側面状の空間は、前側ケース２１と後側ケース２２とを、図示しない２本のネジで留める際にネジが貫通するための空間として用いられる。   Similarly, the front case 21 is formed with recesses 21a and 21b corresponding to the recesses 41a and 41b. The cylindrical side spaces formed by the recesses 41a and 21a and the recesses 41b and 21b are respectively When the front case 21 and the rear case 22 are fastened with two screws (not shown), they are used as spaces for the screws to pass through.

次に、第１基板４１を前側ケース２１に固定する構成について説明する。   Next, a configuration for fixing the first substrate 41 to the front case 21 will be described.

図６は、前側ケース２１を斜め後方から見た斜視図である。図示した様に、前側ケース２１には、外周を囲む略四角形筒状の外周壁２１１と、この外周壁２１１との間に略四角形の挿入溝２１６を形成して立設された４枚の支持壁２１２ａ，２１２ｂ、２１２ｃ、２１２ｄと、これらの支持壁２１２ａ，２１２ｂ，２１２ｃ，２１２ｄの内側に配置された略円筒状の鏡筒部２１３とが一体に設けられている。   FIG. 6 is a perspective view of the front case 21 as viewed obliquely from the rear. As shown in the figure, the front case 21 is provided with four support members that are erected by forming a substantially rectangular cylindrical outer peripheral wall 211 that surrounds the outer periphery and a substantially rectangular insertion groove 216 formed between the outer peripheral wall 211. The walls 212a, 212b, 212c, and 212d are integrally provided with a substantially cylindrical lens barrel portion 213 disposed inside these support walls 212a, 212b, 212c, and 212d.

また、支持壁２１２ａと支持壁２１２ｂとの間のコーナー部及び支持壁２１２ｃと支持壁２１２ｄとの間のコーナー部には、詳細な図示は省略するが、それぞれ縦溝２１４が形成されている。各支持壁２１２ａ，２１２ｂ，２１２ｃ，２１２ｄは、撮影光学系１の光軸と直交する平面状に延在された後端面２１５を備えている。   Further, although not shown in detail in the corner portion between the support wall 212a and the support wall 212b and the corner portion between the support wall 212c and the support wall 212d, vertical grooves 214 are respectively formed. Each of the support walls 212a, 212b, 212c, and 212d includes a rear end surface 215 that extends in a plane perpendicular to the optical axis of the photographing optical system 1.

第１基板４１は、撮影光学系１によって導かれた被写体像が、イメージセンサ４１１の撮像面の中央に結像される様に撮影光学系１の光軸方向及び光軸と直交する方向に位置調整された状態で、後端面２１５に固定されている。この第１基板４１の前側ケース２１に対する固定は、接着剤による接合でなされると共に、部分的に固定用部材２３を介して接合されている（図３、図４参照）。なお、ネジ留め等を行わずに接着剤を用いるのは、サイズや重量を増加させないためである。   The first substrate 41 is positioned in the optical axis direction of the photographic optical system 1 and in a direction perpendicular to the optical axis so that the subject image guided by the photographic optical system 1 is imaged at the center of the imaging surface of the image sensor 411. In the adjusted state, it is fixed to the rear end face 215. The first substrate 41 is fixed to the front case 21 by bonding with an adhesive and partially bonded through a fixing member 23 (see FIGS. 3 and 4). The reason why the adhesive is used without screwing or the like is that the size and weight are not increased.

また、固定用部材２３は、紫外線を透過する材質によって略Ｌ次断面形状に形成されており、前側ケース２１の支持壁２１２ｂ、２１２ｄに形成された凹部２１２ｅに収まる様に接着される。   Further, the fixing member 23 is formed in a substantially L-order cross-sectional shape by a material that transmits ultraviolet rays, and is bonded so as to fit in the recesses 212 e formed in the support walls 212 b and 212 d of the front case 21.

さらに、固定用部材２３と第１基板４１及び前側ケース２１との接着には、紫外線硬化型接着剤が用いられ、それ以外の第１基板４１の接続には、熱硬化型接着剤が用いられている。   Further, an ultraviolet curable adhesive is used to bond the fixing member 23 to the first substrate 41 and the front case 21, and a thermosetting adhesive is used to connect the other first substrates 41. ing.

次に、撮像装置Ａの後側部分の構成について説明する。   Next, the configuration of the rear portion of the imaging apparatus A will be described.

図７は、本実施形態に係る撮像装置Ａの後側ケース２２の内側の構造を示す斜視図である。   FIG. 7 is a perspective view showing a structure inside the rear case 22 of the imaging apparatus A according to the present embodiment.

後側ケース２２の内側には、シールドケース５が設けられている。このシールドケース５は、電磁波を遮蔽するもので、金属製の筐体あるいは樹脂製の筐体の内部を金属膜で覆ったものが用いられている。   A shield case 5 is provided inside the rear case 22. The shield case 5 shields electromagnetic waves, and a metal casing or a resin casing covered with a metal film is used.

シールドケース５の内側には、第１基板４１及び第２基板４２が設けられている。   A first substrate 41 and a second substrate 42 are provided inside the shield case 5.

図８に、第１基板と第２基板の分解斜視図を示す。   FIG. 8 is an exploded perspective view of the first substrate and the second substrate.

図８に示した様に、第２基板４２は、その前面側に第２コネクタ４２２が設けられており、この第２コネクタ４２２を第１基板４１の第１コネクタ４１２に接続させることで、両者が電気的に接続されている。なお、第２基板４２の後面側には、複数の電子部品４２ｅが設けられている。第２基板４２はシールドケース５に接合され、シールドケース５は前側ケース２１に組み付けられて接合される。
＜第２基板とシールドケースとの接合構造＞
次に、第２基板４２のシールドケース５に対する接合構造を説明するにあたり、まずシールドケース５について説明する。 As shown in FIG. 8, the second substrate 42 is provided with a second connector 422 on the front side thereof, and the second connector 422 is connected to the first connector 412 of the first substrate 41, so that both Are electrically connected. Note that a plurality of electronic components 42 e are provided on the rear surface side of the second substrate 42. The second substrate 42 is joined to the shield case 5, and the shield case 5 is assembled and joined to the front case 21.
<Junction structure between second substrate and shield case>
Next, in describing the bonding structure of the second substrate 42 to the shield case 5, the shield case 5 will be described first.

図９はシールドケース５の斜視図であり、図１０はシールドケース５の分解斜視図である。   FIG. 9 is a perspective view of the shield case 5, and FIG. 10 is an exploded perspective view of the shield case 5.

図９，１０に示す様に、シールドケース５は、ケース底面部５１、ケース筒部５２、ケース上面部５３を備えている。   As shown in FIGS. 9 and 10, the shield case 5 includes a case bottom surface portion 51, a case tube portion 52, and a case top surface portion 53.

ケース筒部５２は、図示した様に概略直方体の筒状に形成されている。そして、このケース筒部５２の前側端部に四角枠状のケース底面部５１が装着され、一方、ケース筒部５２の後側端部に四角枠状のケース上面部５３が装着される。   The case cylinder 52 is formed in a substantially rectangular parallelepiped cylinder as shown. A square frame-like case bottom surface portion 51 is attached to the front end portion of the case cylinder portion 52, while a square frame-like case upper surface portion 53 is attached to the rear end portion of the case cylinder portion 52.

なお、ケース筒部５２は、１枚の略長方形の薄板を、４箇所の角部５２ｂ，５２ｃ，５２ｄ，５２ｅで折り曲げ、その両端を角部５２ｂに隣り合う位置に設けられた接合部５２ｇで接合させて、４枚の側壁５２１，５２２，５２３，５２４を備えた略四角形の筒状に形成されている。   The case cylinder 52 is formed by bending one sheet of a substantially rectangular thin plate at four corners 52b, 52c, 52d, and 52e, and joining portions 52g provided at positions adjacent to the corner 52b. It is made to join and it is formed in the substantially square cylinder shape provided with the four side walls 521,522,523,524.

このシールドケース５は、前側ケース２１の外周壁２１１と支持壁２１２ａ〜２１２ｄとの間に形成された挿入溝２１６に、ケース筒部５２を差し込んだ状態で、前側ケース２１に接着等で固定される。   The shield case 5 is fixed to the front case 21 with an adhesive or the like in a state where the case tube portion 52 is inserted into an insertion groove 216 formed between the outer peripheral wall 211 of the front case 21 and the support walls 212a to 212d. The

第２基板４２は、シールドケース５のケース筒部５２の内側に、第２基板４２の外周とケース筒部５２とが直接接することなく、両者の間に後述する空間ＳＰ１及び隙間ＳＰ２を介在させた状態で、接合部材６を介してケース筒部５２に接合されている。以下で、この接合構造の詳細について説明する。   In the second substrate 42, the outer periphery of the second substrate 42 and the case cylinder 52 are not in direct contact with the inside of the case cylinder 52 of the shield case 5, and a space SP1 and a gap SP2 described later are interposed therebetween. In this state, it is joined to the case tube portion 52 via the joining member 6. The details of this joining structure will be described below.

図８に示した様に、第２基板４２の外周の４辺の少なくとも1カ所には、接合用凸部４２ａが第２基板４２の外周方向に突出して形成されている。本実施形態では、接合用凸部４２ａは、第２基板４２の３辺に形成されている（図８にはそのうちの２つが表れている）が、４辺の全てに形成するのが望ましい。   As shown in FIG. 8, at least one of the four sides of the outer periphery of the second substrate 42 is formed with a protruding projection 42 a protruding in the outer peripheral direction of the second substrate 42. In the present embodiment, the bonding convex portions 42a are formed on three sides of the second substrate 42 (two of them appear in FIG. 8), but are desirably formed on all four sides.

図１１に、第２基板４２の接合用凸部４２ａとケース筒部５２の接合用開口部５２ａとの接合前の状態を示す。   FIG. 11 shows a state before joining between the joining convex portion 42 a of the second substrate 42 and the joining opening 52 a of the case tube portion 52.

ケース筒部５２は、その内周が、第２基板４２の外周よりも大きな寸法に形成され、ケース筒部５２の内周と第２基板４２の外周との間に空間ＳＰ１が形成されている。そして、ケース筒部５２の四角筒状のケース筒部５２を形成する４枚の側壁５２１〜５２４のうちの側壁５２４を除く側壁５２１〜５２３において、第２基板４２を第１基板４１に接続させた時に、第２基板４２の接合用凸部４２ａの基板外周方向に対向する位置に、四角形の接合用開口部５２ａが開口されている。   The case cylinder portion 52 has an inner circumference that is larger than the outer circumference of the second substrate 42, and a space SP <b> 1 is formed between the inner circumference of the case cylinder portion 52 and the outer circumference of the second substrate 42. . Then, the second substrate 42 is connected to the first substrate 41 on the side walls 521 to 523 excluding the side wall 524 among the four side walls 521 to 524 that form the square cylindrical case tube portion 52 of the case tube portion 52. At this time, a rectangular bonding opening 52a is opened at a position facing the outer peripheral direction of the bonding convex portion 42a of the second substrate 42.

ケース筒部５２の側壁５２１〜５２３に形成される接合用開口部５２ａは、前後方向寸法が第２基板４２の厚さ寸法よりも大きな寸法に形成されていると共に、前後方向に直交する矢印ＳＤで示す幅方向の寸法が、接合用凸部４２ａの幅寸法よりも大きな寸法に形成されている。すなわち、第２基板４２を第１基板４１に接続させ、且つ、シールドケース５を前側ケース２１に固定した状態では、図１１に示した様に、接合用凸部４２ａは、接合用開口部５２ａからケース筒部５２の外側に僅かに突出すると共に、接合用凸部４２ａと接合用開口部５２ａとの間には、前後方向及び幅方向に隙間ＳＰ２が存在する様に形成されている。   The bonding opening 52a formed on the side walls 521 to 523 of the case cylinder 52 is formed with a dimension in the front-rear direction larger than the thickness dimension of the second substrate 42, and an arrow SD orthogonal to the front-rear direction. The dimension of the width direction shown by is formed in a dimension larger than the width dimension of the convex part 42a for joining. That is, in the state where the second substrate 42 is connected to the first substrate 41 and the shield case 5 is fixed to the front case 21, as shown in FIG. 11, the bonding convex portion 42a has the bonding opening 52a. Is formed so that a gap SP2 exists in the front-rear direction and the width direction between the projection 42a for bonding and the opening 52a for bonding.

前述したケース筒部５２の内周と第２基板４２の外周との寸法差（空間ＳＰ１の寸法）、および接合用開口部５２ａと接合用凸部４２ａとの寸法差（隙間ＳＰ２の寸法）は、第２基板４２が予め設定された可能範囲で移動しても、相互に接触して干渉することが無い寸法に設けられている。   The dimensional difference between the inner periphery of the case cylinder 52 and the outer periphery of the second substrate 42 (the dimension of the space SP1) and the dimensional difference between the bonding opening 52a and the bonding convex portion 42a (the dimension of the gap SP2) are as follows. Even if the second substrate 42 moves within a preset possible range, the second substrate 42 is provided in such a size that it does not contact and interfere with each other.

すなわち、第１基板４１は、前側ケース２１の撮影光学系１に対して良好な結像が得られる様に位置調整されるものであり、その可動範囲が予め設定されている。したがって、第１基板４１に両コネクタ４１２，４２２を介して接続される第２基板４２も、第１基板４１に応じて可動範囲が設定される。   That is, the position of the first substrate 41 is adjusted so that a good image can be obtained with respect to the photographing optical system 1 of the front case 21, and the movable range thereof is set in advance. Accordingly, the movable range of the second substrate 42 connected to the first substrate 41 via both connectors 412 and 422 is set according to the first substrate 41.

そのため、第１基板４１が設定された可動範囲内で前側ケース２１に対して相対移動するのに伴って、第２基板４２が設定された可動範囲内で移動しても前側ケース２１に固定されたシールドケース５のケース筒部５２と干渉することが無いように、上述の寸法差（空間ＳＰ１及びＳＰ２）が設定されている。   Therefore, as the first substrate 41 moves relative to the front case 21 within the set movable range, the second substrate 42 is fixed to the front case 21 even if it moves within the set movable range. The above dimensional difference (spaces SP1 and SP2) is set so as not to interfere with the case cylinder 52 of the shield case 5.

なお、本実施形態では、第２基板４２の４辺の寸法が２０×２０（ｍｍ）、厚みが１（ｍｍ）、接合用凸部４２ａの幅が３（ｍｍ）であり、接合用開口部５２ａの幅を５×５（ｍｍ）に形成しているが、この大きさは、前述した可動範囲や第２基板４２、シールドケース５等の寸法精度、実装精度等を考慮して適宜設定することができる。   In the present embodiment, the dimensions of the four sides of the second substrate 42 are 20 × 20 (mm), the thickness is 1 (mm), the width of the bonding convex portion 42a is 3 (mm), and the bonding opening The width of 52a is formed to be 5 × 5 (mm), but this size is appropriately set in consideration of the above-mentioned movable range, the dimensional accuracy of the second substrate 42, the shield case 5, etc., the mounting accuracy, and the like. be able to.

図１２に、第２基板４２の電子部品４２ｅ，４２ｆの実装範囲を説明する図を示す。   FIG. 12 is a diagram for explaining the mounting range of the electronic components 42e and 42f on the second substrate 42.

第２基板４２は、第１基板４１のコネクタ４１２とコネクタ４２２を介して接続されており、第１基板の可動範囲内で第１基板４１と共に位置が変動し得る。   The second substrate 42 is connected to the connector 412 of the first substrate 41 via the connector 422, and the position of the second substrate 42 can vary with the first substrate 41 within the movable range of the first substrate.

そのため、第２基板４２とシールドケース５との間には空間ＳＰ１及びＳＰ２が設けられているが、振動等により第２基板４２の位置が変動した場合に、第２基板４２とシールドケース５又は第２基板４２上の電子部品４２ｅとシールドケース５とが接触することがある。   Therefore, spaces SP1 and SP2 are provided between the second substrate 42 and the shield case 5, but when the position of the second substrate 42 is fluctuated due to vibration or the like, the second substrate 42 and the shield case 5 or The electronic component 42e on the second substrate 42 and the shield case 5 may come into contact with each other.

したがって、第２基板４２のシールドケース５近傍又は接合用凸部４２ａ上に配置された電子部品４２ｅがシールドケース５に接触してショートするおそれがあるため、第２基板４２の端部には電子部品４２ｅを配設することができなかった。   Accordingly, there is a possibility that the electronic component 42e disposed in the vicinity of the shield case 5 of the second substrate 42 or on the bonding convex portion 42a may come into contact with the shield case 5 to cause a short circuit. The part 42e could not be disposed.

しかしながら、本実施形態に係る撮像装置Ａでは、第２基板４２に設けられた電子部品４２ｅのうち、少なくとも接合用凸部４２ａ近傍の電子部品４２ｆを非導電性材料で被覆している。そのため、第２基板４２の端部、特にシールドケース５に接合される接合用凸部４２ａ上に電子部品４２ｆを配設することが可能になり、振動等により電子部品４２ｆがシールドケース５と接触した場合であっても、ショートして部品が破損することを回避することができる。   However, in the imaging apparatus A according to the present embodiment, among the electronic components 42e provided on the second substrate 42, at least the electronic component 42f in the vicinity of the bonding convex portion 42a is covered with a nonconductive material. Therefore, it is possible to dispose the electronic component 42f on the end portion of the second substrate 42, particularly on the bonding convex portion 42a bonded to the shield case 5, and the electronic component 42f contacts the shield case 5 due to vibration or the like. Even in such a case, it is possible to avoid damage due to a short circuit.

接合用凸部４２ａ近傍の電子部品４２ｆには、予め非導電性材料により被覆することもできるが、後述する第２基板４２とシールドケース５との接合時に非導電性の接合部材により被覆することも可能である。第２基板４２とシールドケース５との接合時に電子部品４２ｆを被覆することにより、電子部品４２ｆを予め被覆する工程を省くことができるため好適である。   The electronic component 42f in the vicinity of the bonding convex portion 42a can be covered with a non-conductive material in advance, but is covered with a non-conductive bonding member at the time of bonding the second substrate 42 and the shield case 5 described later. Is also possible. Covering the electronic component 42f at the time of joining the second substrate 42 and the shield case 5 is preferable because the step of previously covering the electronic component 42f can be omitted.

なお、非導電性材料を第２基板４２の回路パターンを保護するためにコーティングしても良く、シールドケース５の接合用開口部５２ａ周辺にコーティングしても良い。シールドケース５の第２基板４２と接合されるフランジ５２ｆや、接合用開口部５２ａの周辺部を非導電性材料で被覆しておくことにより、第２基板４２上の電子部品４２ｆと接触することによりショートして破損するのをより確実に防止することができる。   A non-conductive material may be coated to protect the circuit pattern of the second substrate 42, or may be coated around the bonding opening 52 a of the shield case 5. The flange 52f to be bonded to the second substrate 42 of the shield case 5 and the peripheral portion of the bonding opening 52a are covered with a non-conductive material, thereby contacting the electronic component 42f on the second substrate 42. Therefore, it is possible to more reliably prevent a short circuit and damage.

この様に、少なくとも第２基板４２の接合用凸部４２ａ近傍の電子部品４２ｆに非導電性材料を被覆することにより、電子部品を実装できる範囲を拡大することができるため、より多くの電子部品を実装できる。したがって、撮像装置Ａの小型化及び高機能化を実現することが可能になる。   As described above, by covering at least the electronic component 42f in the vicinity of the bonding convex portion 42a of the second substrate 42 with the nonconductive material, the range in which the electronic component can be mounted can be expanded, so that more electronic components can be mounted. Can be implemented. Therefore, it is possible to realize downsizing and high functionality of the imaging apparatus A.

図１３に、第２基板４２の接合用凸部４２ａとケース筒部５２の接合用開口部５２ａとの接合後の状態を示す。   FIG. 13 shows a state after the joining convex portion 42 a of the second substrate 42 and the joining opening 52 a of the case tube portion 52 are joined.

第２基板４２とケース筒部５２との接合は、図１３に示す接合部材６によって、第２基板４２の接合用凸部４２ａと、接合用開口部５２ａの前縁部に形成したフランジ５２ｆとを接合させることでなされている。   The second substrate 42 and the case cylinder 52 are joined by the joining member 6 shown in FIG. 13 with a joining convex portion 42a of the second substrate 42 and a flange 52f formed on the front edge of the joining opening 52a. It is made by joining.

接合部材６には、非導電性材料を用いており、例えば、エポキシ、シリコーン、アクリル等の樹脂からなる接着剤や溶剤系の接着材等を用いることができる。また、これらの中でも、紫外線硬化型や常温硬化型の接着剤が好ましい。さらに、第１基板４１と接続する第２基板の第２コネクタ４２２等への負荷を軽減するためにも、硬化後に軟らかい材料であることが好ましい。   A non-conductive material is used for the bonding member 6, and for example, an adhesive made of a resin such as epoxy, silicone, acrylic, or a solvent-based adhesive can be used. Of these, UV curable adhesives and room temperature curable adhesives are preferable. Furthermore, in order to reduce the load on the second connector 422 of the second substrate connected to the first substrate 41, it is preferable that the material is soft after curing.

接合部材６として非導電性材料を用いることで、接合時に接合部材６が第１基板４１や第２基板４２上やシールドケース５の内部に広がってしまった場合でも、電気を通すことがなく、ショートするおそれがない。
＜撮像装置の組み付け＞
次に、撮像装置Ａの組み付け作業の手順について説明する。 By using a non-conductive material as the bonding member 6, even when the bonding member 6 spreads on the first substrate 41 or the second substrate 42 or inside the shield case 5 at the time of bonding, electricity is not passed. There is no risk of short circuit.
<Assembly of imaging device>
Next, the procedure for assembling the imaging apparatus A will be described.

まず、撮影光学系１を保持させた前側ケース２１に、第１基板４１を固定する。次に、図示しない治具で支持した状態で撮像を行い、撮影光学系１によって導かれた被写体像が、イメージセンサ４１１の撮像面の中央に結像される様に撮影光学系１の光軸方向及び光軸と直交する方向に治具で第１基板４１の位置調整を行う。位置調整終了後に、接着剤により第１基板４１と前側ケース２１とを接合する。   First, the first substrate 41 is fixed to the front case 21 that holds the photographing optical system 1. Next, the optical axis of the photographic optical system 1 is picked up so that the subject image guided by the photographic optical system 1 is imaged in the center of the imaging surface of the image sensor 411 while being supported by a jig (not shown). The position of the first substrate 41 is adjusted with a jig in a direction perpendicular to the direction and the optical axis. After the position adjustment is completed, the first substrate 41 and the front case 21 are bonded with an adhesive.

続いて、第２基板４２の接合用凸部４２ａを接合用開口部５２ａ内に挿入し、第２基板４２の外周をシールドケース５の内周に対して離間させて余裕を持たせた状態のケース筒部５２を、第１基板４１を固定した前側ケース２１に対して後方から装着させる。   Subsequently, the bonding convex portion 42a of the second substrate 42 is inserted into the bonding opening 52a, and the outer periphery of the second substrate 42 is separated from the inner periphery of the shield case 5 with a margin. The case cylinder 52 is attached to the front case 21 to which the first substrate 41 is fixed from behind.

この状態で第２基板４２の第２コネクタ４２２を、第１基板４１の第１コネクタ４１２に接続させることで、第２基板４２を第１基板４１で支持する。   In this state, by connecting the second connector 422 of the second substrate 42 to the first connector 412 of the first substrate 41, the second substrate 42 is supported by the first substrate 41.

シールドケース５は、ケース筒部５２の前端部を、前側ケース２１の挿入溝２１６に挿入して位置決めした後、接着剤により接合する。   The shield case 5 is joined by an adhesive after the front end portion of the case tube portion 52 is inserted into the insertion groove 216 of the front case 21 and positioned.

この時点で、シールドケース５のケース筒部５２と第２基板４２との間には寸法差に基づいて十分な空間ＳＰ１が確保されており、接合用凸部４２ａと接合用開口部５２ａとの間には隙間ＳＰ２が確保されている。このため、シールドケース５を前側ケース２１に対して位置決めする一方で、第１基板４１の可動範囲内で第２基板４２が動いても、第２基板４２とケース筒部５２とは干渉することが無く、第１コネクタ４１２と第２コネクタ４２２との間に負荷を与えることなく接続できる。   At this time, a sufficient space SP1 is secured between the case tube portion 52 of the shield case 5 and the second substrate 42 based on the dimensional difference, and the bonding convex portion 42a and the bonding opening 52a are separated from each other. A gap SP2 is secured between them. For this reason, while the shield case 5 is positioned with respect to the front case 21, even if the second substrate 42 moves within the movable range of the first substrate 41, the second substrate 42 and the case tube portion 52 interfere with each other. The first connector 412 and the second connector 422 can be connected without applying a load.

次に、第２基板４２の接合用凸部４２ａと、接合用開口部５２ａのフランジ５２ｆとを、接合部材６によりケース筒部５２の外側から接合する。   Next, the bonding convex portion 42 a of the second substrate 42 and the flange 52 f of the bonding opening 52 a are bonded from the outside of the case tube portion 52 by the bonding member 6.

この時、上述した様に非導電性材料である接合部材６によりケース筒部５２と第２基板４２を接合すると共に、第２基板４２の接合用凸部４２ａ近傍の電子部品４２ｆを同時に被覆することもできる。電子部品４２ｆ等を予め非導電性材料で被覆しておくことも可能であるが、第２基板４２とケース筒部５２との接合時に併せて電子部品４２ｆの被覆を行うことで、電子部品４２ｆの被覆工程を省き、製造工程を簡略化できる。また、電子部品４２ｆを被覆する非導電性材料と、シールドケース５と第２基板４２との非導電性の接合部材を同一材料とすることで、異なる種類の材料を用いる必要がなくなるため、製造コストを下げることが可能である。   At this time, as described above, the case cylindrical portion 52 and the second substrate 42 are bonded together by the bonding member 6 that is a non-conductive material, and the electronic component 42f near the bonding convex portion 42a of the second substrate 42 is simultaneously covered. You can also. Although it is possible to coat the electronic component 42f and the like with a non-conductive material in advance, the electronic component 42f is covered by covering the electronic component 42f at the time of joining the second substrate 42 and the case tube portion 52. Thus, the manufacturing process can be simplified. In addition, since the non-conductive material covering the electronic component 42f and the non-conductive joining member of the shield case 5 and the second substrate 42 are made of the same material, it is not necessary to use different types of materials. Costs can be reduced.

第２基板４２とケース筒部５２との接続後に、シールドケース５を後側ケース２２で覆い、さらに、前側ケース２１と後側ケース２２とを接合し、接続コード３を第２基板４２に接続することで、撮像装置Ａの組み付けが完了する。
＜まとめ＞
以上説明した様に、本実施形態に係る撮像装置Ａは、第２基板４２に設けられた電子部品４２ｅのうち、少なくとも接合用凸部４２ａ近傍の電子部品４２ｆが非導電性材料で被覆されている。したがって、振動等により第２基板４２の位置が変動し、例えば接合用凸部４２ａ近傍の電子部品４２ｆがシールドケース５と接触した場合であっても電子部品４２ｆがショートして破損することがない。 After the connection between the second substrate 42 and the case cylinder 52, the shield case 5 is covered with the rear case 22, the front case 21 and the rear case 22 are joined, and the connection cord 3 is connected to the second substrate 42. This completes the assembly of the imaging device A.
<Summary>
As described above, in the imaging apparatus A according to this embodiment, among the electronic components 42e provided on the second substrate 42, at least the electronic component 42f in the vicinity of the bonding convex portion 42a is coated with the nonconductive material. Yes. Accordingly, the position of the second substrate 42 fluctuates due to vibration or the like, and even when the electronic component 42f in the vicinity of the bonding convex portion 42a is in contact with the shield case 5, the electronic component 42f is not short-circuited and damaged. .

そのため、第２基板４２に電子部品を配設できる範囲を拡大することができ、より多くの電子部品の実装が可能になるため、撮像装置Ａの小型化及び高機能化に大きく貢献することができる。   Therefore, the range in which electronic components can be disposed on the second substrate 42 can be expanded, and more electronic components can be mounted. This greatly contributes to downsizing and high functionality of the imaging device A. it can.

なお、上記実施形態に挙げた構成等に、その他の要素との組み合わせなど、ここで示した構成に本発明が限定されるものではない。これらの点に関しては、本発明の趣旨を逸脱しない範囲で変更することが可能であり、その応用形態に応じて適切に定めることができる。   It should be noted that the present invention is not limited to the configuration shown here, such as a combination with other elements in the configuration described in the above embodiment. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form.

１ 撮影光学系
５ シールドケース
６ 非導電性材料
２１ 保持部材
４１ 第１基板
４２ 第２基板
４２ａ 接合用凸部（接合部）
４２ｅ，４２ｆ 電子部品
４１１ イメージセンサ（撮像素子）
４１２ 第１コネクタ
４２２ 第２コネクタ
Ａ 撮像装置 DESCRIPTION OF SYMBOLS 1 Imaging | photography optical system 5 Shield case 6 Nonelectroconductive material 21 Holding member 41 1st board | substrate 42 2nd board | substrate 42a Bonding convex part (joining part)
42e, 42f Electronic component 411 Image sensor (imaging device)
412 1st connector 422 2nd connector A Imaging device

特開２００８−３３０１０号公報JP 2008-33010 A

Claims (4)

撮影光学系を保持する保持部材と、
前記保持部材に接合し、前記撮影光学系により結像される像を光学変換する撮像素子及び接続用の第１コネクタが設けられた第１基板と、
前記第１コネクタに接続する第２コネクタ及び電子部品が設けられた第２基板と、
前記第１基板及び前記第２基板の周囲を囲んで前記保持部材に固定されるシールドケースと、
を有する撮像装置であって、
前記第２基板は、前記シールドケースと接合する接合部を有し、
前記第２基板に設けられた前記電子部品のうち、少なくとも前記接合部近傍の前記電子部品は、非導電性材料により被覆されている
ことを特徴とする撮像装置。 A holding member for holding the photographing optical system;
A first substrate provided with an image pickup element bonded to the holding member and optically converting an image formed by the photographing optical system and a first connector for connection;
A second board provided with a second connector and an electronic component connected to the first connector;
A shield case that is fixed to the holding member so as to surround the first substrate and the second substrate;
An imaging device having
The second substrate has a joint portion that joins the shield case,
Of the electronic components provided on the second substrate, at least the electronic component in the vicinity of the joint is covered with a non-conductive material. 前記シールドケースの前記第２基板との接合部及び前記シールドケースの前記接合部の周辺部が、非導電性材料により被覆されている
ことを特徴とする請求項１に記載の撮像装置。 The imaging apparatus according to claim 1, wherein a joint portion of the shield case with the second substrate and a peripheral portion of the joint portion of the shield case are covered with a nonconductive material. 前記シールドケースと前記第２基板とが、非導電性材料により接合されている
ことを特徴とする請求項１又は２に記載の撮像装置。 The imaging apparatus according to claim 1, wherein the shield case and the second substrate are joined by a non-conductive material. 前記電子部品を被覆する前記非導電性材料と、前記シールドケースの前記接合部及び前記周辺部を被覆する前記非導電性材料と、前記シールドケースと前記第２基板とを接合する前記非導電性材料とが、同一の材料である
ことを特徴とする請求項３に記載の撮像装置。 The non-conductive material that covers the electronic component, the non-conductive material that covers the joint portion and the peripheral portion of the shield case, and the non-conductive material that joins the shield case and the second substrate. The imaging apparatus according to claim 3, wherein the material is the same material.
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