JP2013004549A - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP2013004549A JP2013004549A JP2011130821A JP2011130821A JP2013004549A JP 2013004549 A JP2013004549 A JP 2013004549A JP 2011130821 A JP2011130821 A JP 2011130821A JP 2011130821 A JP2011130821 A JP 2011130821A JP 2013004549 A JP2013004549 A JP 2013004549A
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- ceramic
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- 239000000919 ceramic Substances 0.000 claims abstract description 118
- 239000002923 metal particle Substances 0.000 claims abstract description 76
- 239000002245 particle Substances 0.000 claims abstract description 58
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 42
- 239000004020 conductor Substances 0.000 abstract description 39
- 238000003475 lamination Methods 0.000 abstract description 12
- 238000000280 densification Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 268
- 239000000843 powder Substances 0.000 description 49
- 238000010304 firing Methods 0.000 description 21
- 230000032798 delamination Effects 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 14
- 239000002344 surface layer Substances 0.000 description 13
- 238000009413 insulation Methods 0.000 description 12
- 229910002113 barium titanate Inorganic materials 0.000 description 10
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 10
- 230000003197 catalytic effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000002003 electrode paste Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000004438 BET method Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】セラミックコンデンサ101は、複数のセラミック誘電体層105及び複数の内部電極層141,142を積層してなる電極積層部107と、電極積層部107の外面を覆うように設けられたカバー層部108と、電極積層部107の積層途中となる位置に設けられた中間層部109と、電極積層部107の積層方向に延びて複数の内部電極層141,142に接続された複数のコンデンサ内ビア導体131,132とを備える。中間層部109は、自身の厚さの1/10以下の粒径を持つ金属粒子154がセラミック粒子に対して1体積%以上30体積%以下の割合で混合された材料により形成されている。
【選択図】図1
Description
105…セラミック絶縁層としてのセラミック誘電体層
107…電極積層部
108…カバー層部
109…中間層部
131…ビア電極としての電源用コンデンサ内ビア導体
132…ビア電極としてのグランド用コンデンサ内ビア導体
141…内部電極層としての電源用内部電極層
142…内部電極層としてのグランド用内部電極層
150…カバー層部を構成するセラミック絶縁層
152…中間層部を構成する厚肉のセラミック絶縁層
154…金属粒子
Claims (5)
- 複数のセラミック絶縁層及び複数の内部電極層を積層してなる電極積層部と、
前記電極積層部の積層方向の外面を覆うように設けられたセラミック絶縁層からなるカバー層部と、
前記電極積層部の積層途中となる位置に設けられ、前記電極積層部を構成するセラミック絶縁層よりも厚肉のセラミック絶縁層からなる中間層部と、
前記電極積層部の積層方向に延びて前記複数の内部電極層に接続された複数のビア電極とを備えた電子部品であって、
前記中間層部は、自身の厚さの1/10以下の粒径を持つ金属粒子がセラミック粒子に対して1体積%以上30体積%以下の割合で混合された材料により形成されている
ことを特徴とする電子部品。 - 前記金属粒子は、ニッケル、コバルト及び白金族から選択される少なくとも1種類の金属または2種類以上の合金の粒子からなることを特徴とする請求項1に記載の電子部品。
- 前記中間層部を構成する厚肉のセラミック絶縁層は、前記電極積層部を構成するセラミック絶縁層の20倍以下の厚みを有することを特徴とする請求項1または2に記載の電子部品。
- 前記中間層部は、前記電極積層部の積層方向における中央部位に位置することを特徴とする請求項1乃至3のいずれか1項に記載の電子部品。
- 前記電子部品は、前記セラミック絶縁層が誘電体層として機能するセラミックコンデンサであることを特徴とする請求項1乃至4のいずれか1項に記載の電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011130821A JP5718167B2 (ja) | 2011-06-13 | 2011-06-13 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011130821A JP5718167B2 (ja) | 2011-06-13 | 2011-06-13 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013004549A true JP2013004549A (ja) | 2013-01-07 |
JP5718167B2 JP5718167B2 (ja) | 2015-05-13 |
Family
ID=47672856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011130821A Expired - Fee Related JP5718167B2 (ja) | 2011-06-13 | 2011-06-13 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5718167B2 (ja) |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990915A (ja) * | 1982-11-16 | 1984-05-25 | ティーディーケイ株式会社 | 積層部品 |
JPS60253208A (ja) * | 1984-05-29 | 1985-12-13 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPS61131519A (ja) * | 1984-11-30 | 1986-06-19 | 日本電気株式会社 | 積層コンデンサ |
JPS6197823U (ja) * | 1984-12-03 | 1986-06-23 | ||
JPS6216142A (ja) * | 1985-07-12 | 1987-01-24 | 株式会社村田製作所 | セラミツク積層体 |
JPS6249228U (ja) * | 1985-09-12 | 1987-03-26 | ||
JPH0396204A (ja) * | 1989-09-08 | 1991-04-22 | Murata Mfg Co Ltd | コンデンサ |
JPH03151613A (ja) * | 1989-11-08 | 1991-06-27 | Matsushita Electric Ind Co Ltd | 積層セラミックコンデンサ |
JPH0383928U (ja) * | 1989-12-14 | 1991-08-26 | ||
JPH03220711A (ja) * | 1990-01-26 | 1991-09-27 | Nec Corp | 積層セラミックコンデンサ |
JPH06151234A (ja) * | 1992-10-31 | 1994-05-31 | Taiyo Yuden Co Ltd | 積層電子部品及びその製造方法 |
JPH07263272A (ja) * | 1994-03-17 | 1995-10-13 | Taiyo Yuden Co Ltd | 積層電子部品の製造方法 |
JP2001230146A (ja) * | 2000-02-16 | 2001-08-24 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサとその製造方法 |
JP2006351639A (ja) * | 2005-06-13 | 2006-12-28 | Tdk Corp | 積層型電子部品及び積層セラミックコンデンサ |
WO2007007518A1 (ja) * | 2005-07-08 | 2007-01-18 | Murata Manufacturing Co., Ltd. | 導電性粉末、導電性ペースト、および積層型セラミック電子部品の製造方法 |
JP2007053287A (ja) * | 2005-08-19 | 2007-03-01 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JP4252277B2 (ja) * | 2002-10-08 | 2009-04-08 | 日本特殊陶業株式会社 | 積層電子部品とその製造方法 |
JP2010183023A (ja) * | 2009-02-09 | 2010-08-19 | Ngk Spark Plug Co Ltd | 積層コンデンサ |
-
2011
- 2011-06-13 JP JP2011130821A patent/JP5718167B2/ja not_active Expired - Fee Related
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990915A (ja) * | 1982-11-16 | 1984-05-25 | ティーディーケイ株式会社 | 積層部品 |
JPS60253208A (ja) * | 1984-05-29 | 1985-12-13 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPS61131519A (ja) * | 1984-11-30 | 1986-06-19 | 日本電気株式会社 | 積層コンデンサ |
JPS6197823U (ja) * | 1984-12-03 | 1986-06-23 | ||
JPS6216142A (ja) * | 1985-07-12 | 1987-01-24 | 株式会社村田製作所 | セラミツク積層体 |
JPS6249228U (ja) * | 1985-09-12 | 1987-03-26 | ||
JPH0396204A (ja) * | 1989-09-08 | 1991-04-22 | Murata Mfg Co Ltd | コンデンサ |
JPH03151613A (ja) * | 1989-11-08 | 1991-06-27 | Matsushita Electric Ind Co Ltd | 積層セラミックコンデンサ |
JPH0383928U (ja) * | 1989-12-14 | 1991-08-26 | ||
JPH03220711A (ja) * | 1990-01-26 | 1991-09-27 | Nec Corp | 積層セラミックコンデンサ |
JPH06151234A (ja) * | 1992-10-31 | 1994-05-31 | Taiyo Yuden Co Ltd | 積層電子部品及びその製造方法 |
JPH07263272A (ja) * | 1994-03-17 | 1995-10-13 | Taiyo Yuden Co Ltd | 積層電子部品の製造方法 |
JP2001230146A (ja) * | 2000-02-16 | 2001-08-24 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサとその製造方法 |
JP4252277B2 (ja) * | 2002-10-08 | 2009-04-08 | 日本特殊陶業株式会社 | 積層電子部品とその製造方法 |
JP2006351639A (ja) * | 2005-06-13 | 2006-12-28 | Tdk Corp | 積層型電子部品及び積層セラミックコンデンサ |
WO2007007518A1 (ja) * | 2005-07-08 | 2007-01-18 | Murata Manufacturing Co., Ltd. | 導電性粉末、導電性ペースト、および積層型セラミック電子部品の製造方法 |
JP2007053287A (ja) * | 2005-08-19 | 2007-03-01 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JP2010183023A (ja) * | 2009-02-09 | 2010-08-19 | Ngk Spark Plug Co Ltd | 積層コンデンサ |
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