JP2013001875A5 - - Google Patents
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- JP2013001875A5 JP2013001875A5 JP2011136689A JP2011136689A JP2013001875A5 JP 2013001875 A5 JP2013001875 A5 JP 2013001875A5 JP 2011136689 A JP2011136689 A JP 2011136689A JP 2011136689 A JP2011136689 A JP 2011136689A JP 2013001875 A5 JP2013001875 A5 JP 2013001875A5
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- JP
- Japan
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Description
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011136689A JP2013001875A (en) | 2011-06-20 | 2011-06-20 | Masterbatch type hardener composition, one-part epoxy resin composition and molded article using the same, and method for producing the masterbatch type hardener composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011136689A JP2013001875A (en) | 2011-06-20 | 2011-06-20 | Masterbatch type hardener composition, one-part epoxy resin composition and molded article using the same, and method for producing the masterbatch type hardener composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013001875A JP2013001875A (en) | 2013-01-07 |
| JP2013001875A5 true JP2013001875A5 (en) | 2014-04-24 |
Family
ID=47670773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011136689A Pending JP2013001875A (en) | 2011-06-20 | 2011-06-20 | Masterbatch type hardener composition, one-part epoxy resin composition and molded article using the same, and method for producing the masterbatch type hardener composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013001875A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6505428B2 (en) * | 2014-12-05 | 2019-04-24 | 旭化成株式会社 | Microcapsule type amine curing agent, curable resin composition, fine chemicals and composition |
| CN114752039A (en) * | 2017-03-17 | 2022-07-15 | 旭化成株式会社 | Thermosetting resin composition |
| JP7182772B2 (en) * | 2018-07-26 | 2022-12-05 | ペルノックス株式会社 | Curable resin composition, cured product, method for producing same, and article |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03139517A (en) * | 1989-10-25 | 1991-06-13 | Ajinomoto Co Inc | One-pack epoxy rein composition |
| JPH093164A (en) * | 1995-06-15 | 1997-01-07 | Nitto Denko Corp | Micro-capsule type hardener or hardening accelerator and epoxy resin composition containing the same |
| WO2004037885A1 (en) * | 2002-10-25 | 2004-05-06 | Asahi Kasei Chemicals Corporation | Capsule type hardener and composition |
| CA2561414A1 (en) * | 2004-03-31 | 2005-10-13 | Asahi Kasei Chemicals Corporation | Hardener for epoxy resin and epoxy resin composition |
| JP4567377B2 (en) * | 2004-06-04 | 2010-10-20 | 旭化成イーマテリアルズ株式会社 | Latent curing agent and composition |
| CN101128502B (en) * | 2005-02-23 | 2010-12-01 | 旭化成电子材料株式会社 | Latent hardener for epoxy resin and epoxy resin composition |
| JP2007204669A (en) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | Curing agent for epoxy resin, having specific small particle diameter particle size distribution and epoxy resin composition |
| JP5763527B2 (en) * | 2009-04-24 | 2015-08-12 | 旭化成イーマテリアルズ株式会社 | Imidazole compound-containing microencapsulated composition, curable composition using the same, and masterbatch type curing agent |
| JP2011086667A (en) * | 2009-10-13 | 2011-04-28 | Asahi Kasei E-Materials Corp | Die bonding paste and semiconductor device |
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2011
- 2011-06-20 JP JP2011136689A patent/JP2013001875A/en active Pending