JP2012208360A5 - - Google Patents
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- JP2012208360A5 JP2012208360A5 JP2011074648A JP2011074648A JP2012208360A5 JP 2012208360 A5 JP2012208360 A5 JP 2012208360A5 JP 2011074648 A JP2011074648 A JP 2011074648A JP 2011074648 A JP2011074648 A JP 2011074648A JP 2012208360 A5 JP2012208360 A5 JP 2012208360A5
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Description
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011074648A JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011074648A JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012208360A JP2012208360A (en) | 2012-10-25 |
JP2012208360A5 true JP2012208360A5 (en) | 2014-04-03 |
JP5742376B2 JP5742376B2 (en) | 2015-07-01 |
Family
ID=47188143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011074648A Active JP5742376B2 (en) | 2011-03-30 | 2011-03-30 | Positive photosensitive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5742376B2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2902846B1 (en) * | 2012-09-24 | 2019-11-20 | Toray Industries, Inc. | Positive photosensitive resin composition |
US9454078B2 (en) | 2012-09-25 | 2016-09-27 | Toray Industries, Inc. | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
JP6358095B2 (en) * | 2013-01-09 | 2018-07-18 | Jsr株式会社 | Photosensitive composition, polymer, resin film, method for producing the same, and electronic component |
KR101720717B1 (en) * | 2014-04-10 | 2017-03-28 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin film, and display device using the same |
CN107407879B (en) * | 2015-03-27 | 2020-10-16 | 东丽株式会社 | Photosensitive resin composition, photosensitive sheet, semiconductor device, and method for manufacturing semiconductor device |
WO2017043375A1 (en) * | 2015-09-08 | 2017-03-16 | 東レ株式会社 | Photosensitive resin composition, photosensitive sheet, semiconductor device, and method for manufacturing semiconductor device |
US10545406B2 (en) | 2015-09-28 | 2020-01-28 | Toray Industries, Inc. | Cured film formed by curing photosensitive resin composition and method for manufacturing same |
JPWO2017073481A1 (en) * | 2015-10-28 | 2018-08-16 | 東レ株式会社 | Positive photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film, semiconductor protective film, method for manufacturing semiconductor device, semiconductor electronic component, and semiconductor device |
JP6982786B2 (en) * | 2016-03-28 | 2021-12-17 | 東レ株式会社 | Photosensitive film |
KR102277707B1 (en) * | 2016-04-25 | 2021-07-16 | 도레이 카부시키가이샤 | resin composition |
KR20220042060A (en) | 2019-08-01 | 2022-04-04 | 도레이 카부시키가이샤 | Photosensitive resin composition, photosensitive sheet, cured film, manufacturing method of cured film, interlayer insulating film and electronic component |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4957884B2 (en) * | 2005-03-24 | 2012-06-20 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device |
JP4655757B2 (en) * | 2005-05-19 | 2011-03-23 | 住友電気工業株式会社 | Positive photosensitive adhesive |
KR20110073513A (en) * | 2008-10-20 | 2011-06-29 | 닛뽄 가야쿠 가부시키가이샤 | Polyamide resin and composition thereof |
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2011
- 2011-03-30 JP JP2011074648A patent/JP5742376B2/en active Active