JP2012508473A - 太陽光電池 - Google Patents
太陽光電池 Download PDFInfo
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- JP2012508473A JP2012508473A JP2011543814A JP2011543814A JP2012508473A JP 2012508473 A JP2012508473 A JP 2012508473A JP 2011543814 A JP2011543814 A JP 2011543814A JP 2011543814 A JP2011543814 A JP 2011543814A JP 2012508473 A JP2012508473 A JP 2012508473A
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- 238000000034 method Methods 0.000 claims abstract description 50
- 238000002161 passivation Methods 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000009792 diffusion process Methods 0.000 claims description 19
- 239000002019 doping agent Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000005215 recombination Methods 0.000 claims description 6
- 230000006798 recombination Effects 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 4
- 230000009849 deactivation Effects 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010561 standard procedure Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 241000132007 Bahia Species 0.000 description 1
- 229930194845 Bahia Natural products 0.000 description 1
- 235000017858 Laurus nobilis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
【選択図】図3
Description
前面と背面とを有する半導体ウェーハから集光型太陽光電池を作る方法であって、
(a) 当該ウェーハの背面にドープして、当該ウェーハの背面に第一のドープ領域を作り、
(b) 前面および背面に不活性化層を付着させ、
(c) 当該不活性化層を貫通するように、背面に深溝を作り、
(d) 当該背面にドープして、当該深溝内に第二のドープ領域を作り、当該第二のドープ領域は当該第一のドープ領域とは反対符号にドープし、
(e) 背面不活性化層を貫通して当該第一のドープ領域に達する開口を作り、
(f) 第一および第二のドープ領域に電気的に接続するために、当該背面上に電気接点を作る、
各ステップからなることを特徴とする方法、
が提供される。
(i) 無電解ニッケル付着、および/または
(ii) 無電解ニッケル焼結、および/または
(iii) 無電解銅付着、および/または
(iv) 銅表面の銀不活性化、
のうち一つ以上のステップからなることができる。
集光型太陽光電池であって、
- 前面および背面を有する半導体ウェーハ、
- 当該前面および背面上に付着させられた不活性化層、
- ウェーハの背面の第一のドープ領域、
- 背面からの開口内に作られ、当該第一のドープ領域と接触しているpタイプ電気接点、
- 背面からウェーハ内に延びる深溝内に作られるnタイプ電気接点、
- 当該深溝を作ったあと、当該nタイプ電気接点の付着に先立って、当該溝内からドープされた第二のドープ領域であって、当該nタイプ電気接点と電気的に接続する第二のドープ領域、
からなることを特徴とする集光型太陽光電池、
が提供される。
11 前面
12 背面
13 ピラミッド構造の配列
14 反射防止被膜
15 溝
17 n+型のドープ領域
19 ニッケル層
23 浅いn型層
24 p型層
25 半導体ウェーハ
26 前面
27 背面
28 ピラミッド構造
29 p++ドープ領域
30 不活性化層
31 深いレーザー溝
32 n++の第二のドープ領域
33 バイア
34 めっき
35 切れ目
37 n型接点
38 p型接点
40 p型接点
Claims (33)
- 前面と背面とを有する半導体ウェーハから集光型太陽光電池を作る方法であって、
(a) 当該ウェーハの背面にドープして、当該ウェーハの背面に第一のドープ領域を作り、
(b) 前面および背面に不活性化層を付着させ、
(c) 当該不活性化層を貫通するように、背面に深溝を作り、
(d) 当該背面にドープして、当該深溝内に第二のドープ領域を作り、当該第二のドープ領域は当該第一のドープ領域とは反対符号にドープし、
(e) 背面不活性化層を貫通して当該第一のドープ領域に達する開口を作り、
(f) 第一および第二のドープ領域に電気的に接続するために、当該背面上に電気接点を作る、
各ステップからなることを特徴とする方法。 - 第一および第二のドープ領域の電気接点が、背面のけがきによって電気的に絶縁されることを特徴とする請求項1に記載の方法。
- ステップ(f)で当該電気接点が無電解めっきによって作られることを特徴とする請求項1または2に記載の方法。
- 当該無電解めっきが、
(i) 無電解ニッケル付着、
(ii) 無電解ニッケル焼結、
(iii) 無電解銅付着、
(iv) 銅表面の銀不活性化、
のうち一つ以上のステップからなることを特徴とする請求項3に記載の方法。 - ステップ(a)における背面のドーピングが、ドーパント供給源物質を塗布して加熱することによって行われることを特徴とする請求項1から4の中のいずれか一つに記載の方法。
- 当該ウェーハが約1000℃に加熱されることを特徴とする請求項5に記載の方法。
- 加熱がベルト炉によって行われることを特徴とする請求項5または6に記載の方法。
- 加熱が石英管炉内で実施されることを特徴とする請求項5または6に記載の方法。
- 加熱が、100Ω/squareとなる拡散を生じるのに必要な時間だけ保たれることを特徴とする請求項5から8の中のいずれか一つに記載の方法。
- ステップ(b)で付着させられる不活性化層が500 cm/sよりも小の前面および背面再結合速度を与えることを特徴とする請求項1から9の中のいずれか一つに記載の方法。
- ステップ(c)における溝が、パルスレーザー、ウォータージェット、レーザーマイクロジェット、またはダイヤモンドけがきによって作られることを特徴とする請求項1から10の中のいずれか一つに記載の方法。
- ステップ(c)における深溝が、ウェーハの上面から1拡散距離以内の深さに作られることを特徴とする請求項1から11の中のいずれか一つに記載の方法。
- 複数の溝が背面に作られることを特徴とする請求項1から12の中のいずれか一つに記載の方法。
- 当該溝が、相互に2拡散距離よりも小の間隔だけ離れて等間隔配置されていることを特徴とする請求項13に記載の方法。
- ステップ(d)において、ドーパントの溝内への拡散が、10Ω/sqよりも小のシート抵抗を与えるのに十分な接合深さまでなされることを特徴とする請求項1から14の中のいずれか一つに記載の方法。
- ステップ(e)において、当該開口が、パルスレーザー、ウォータージェット、レーザーマイクロジェットまたはダイヤモンドけがきによって、背面不活性化層を貫通するように作られることを特徴とする請求項1から15の中のいずれか一つに記載の方法。
- ステップ(e)において、当該開口が、不活性化層のスクリーン印刷エッチングによって、背面を貫通するように作られることを特徴とする請求項1から15の中のいずれか一つに記載の方法。
- 複数の細長い開口が、当該溝の間に背面を貫通するように作られることを特徴とする請求項1から17の中のいずれか一つに記載の方法。
- 当該第一のドープ領域が、当該ウェーハと同じドーピングタイプであることを特徴とする請求項1から18の中のいずれか一つに記載の方法。
- 当該第一のドープ領域がp+タイプドープ領域であることを特徴とする請求項1から19の中のいずれか一つに記載の方法。
- 複数の太陽電池が一つのウェーハ上に作られることを特徴とする請求項1から20の中のいずれか一つに記載の方法。
- ステップ(f)のあと、ウェーハがけがきされ、へき開されて、当該ウェーハから複数の独立太陽電池が作られることを特徴とする請求項21に記載の方法。
- 集光型太陽光電池であって、
- 前面および背面を有する半導体ウェーハ、
- 当該前面および背面上に付着させられた不活性化層、
- ウェーハの背面の第一のドープ領域、
- 背面からの開口内に作られ、当該第一のドープ領域と接触しているpタイプ電気接点、
- 背面からウェーハ内に延びる深溝内に作られるnタイプ電気接点、
- 当該深溝を作ったあと、当該nタイプ電気接点の付着に先立って、当該溝内からドープされた第二のドープ領域であって、当該nタイプ電気接点と電気的に接続する第二のドープ領域、
からなることを特徴とする集光型太陽光電池。 - 当該不活性化層が酸化ケイ素薄膜からなることを特徴とする請求項23に記載の集光型太陽光電池。
- 酸化ケイ素不活性化層の深さが10 nmであることを特徴とする請求項24に記載の集光型太陽光電池。
- 当該不活性化層がさらにLPCVD窒化ケイ素薄膜を有することを特徴とする請求項24または25に記載の集光型太陽光電池。
- LPCVD窒化ケイ素不活性化層の深さが80 nmであることを特徴とする請求項26に記載の集光型太陽光電池。
- 不活性化層が交互に非晶質炭化ケイ素と酸化ケイ素から成る層であることを特徴とする請求項23に記載の集光型太陽光電池。
- 当該不活性化層がPECVD反応器内で低温付着させられることを特徴とする請求項28に記載の集光型太陽光電池。
- 当該第一のドープ領域がp+タイプドープ領域であることを特徴とする請求項23から29の中のいずれか一つに記載の集光型太陽光電池。
- ドーパント供給源物質がホウ素であることを特徴とする請求項30に記載の集光型太陽光電池。
- 当該第二のドープ領域がn+タイプドープ領域であることを特徴とする請求項23から31の中のいずれか一つに記載の集光型太陽光電池。
- ドーパント供給源物質がリンであることを特徴とする請求項32に記載の集光型太陽光電池。
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