JP2012190744A - 蛍光灯型led灯具 - Google Patents
蛍光灯型led灯具 Download PDFInfo
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- JP2012190744A JP2012190744A JP2011055305A JP2011055305A JP2012190744A JP 2012190744 A JP2012190744 A JP 2012190744A JP 2011055305 A JP2011055305 A JP 2011055305A JP 2011055305 A JP2011055305 A JP 2011055305A JP 2012190744 A JP2012190744 A JP 2012190744A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
- F21V3/0615—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass the material diffusing light, e.g. translucent glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L33/504—Elements with two or more wavelength conversion materials
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Abstract
【解決手段】 長尺の灯具ボディ2に光源基板5と透光カバー4を取り付ける。光源基板5上に長尺のLEDパッケージ6を灯具ボディ2の長手方向に延びるように装着する。LEDパッケージ6は、可視光を発生する複数のLEDチップ18と、LEDチップ18を連続的に封止する光透過性の封止部材19とを備える。LEDチップ18を光源基板5に実装し、封止部材19を光源基板5のチップ実装面から盛り上がる断面半円形に成形する。LEDパッケージ6は、LEDチップ18の発光を封止部材19の表面全体から灯具ボディ2の側方域を含む広角に放射する。
【選択図】 図1
Description
一般式 (Ca1−x−y Srx Rey)7(SiO3)7X2
(ReはEu2+を必須とする希土類元素およびMn2+、XはCeを必須とするハロゲン元素である。)
(1)一般式 M1 a(M2O4)bXc:Red
(M1は、Ca,Sr,Baのうち1種以上を必須とし、一部をMg,Zn,Cd,K,Ag,Tlからなる群の元素に置き換えることができる。M2は、Pを必須とし、一部をV,Si,As,Mn,Co,Cr,Mo,W,Bからなる群の元素に置き換えることができる。
Xは少なくとも1種のハロゲン元素、ReはEu2+を必須とする少なくとも1種の希土類元素またはMnを示す。aは4.2≦a≦5.8、bは2.5≦b≦3.5、cは0.8<c<1.4、dは0.01<d<0.1の範囲である。)
(2)一般式 M1 1−aMgAl10O17:Eu2+ a
(M1は、Ca,Sr,Ba,Znからなる群より選ばれる少なくとも1種の元素、aは0.001≦a≦0.5の範囲である。)
(3)一般式 M1 1−aMgSi2O8:Eu2+ a
(M1は、Ca,Sr,Ba,Znからなる群より選ばれる少なくとも1種の元素、aは0.001≦a≦0.8の範囲である。)
(4)一般式 M1 2−a(B5O9)X:Rea
(M1は、Ca,Sr,Ba,Znからなる群より選ばれる少なくとも1種の元素、Xは少なくとも1種のハロゲン元素、aは0.001≦a≦0.5の範囲である。)
(a)LEDパッケージ6を長尺に形成し、帯状の封止部材19で複数のLEDチップ18を連続的に封止したので、チップ18のツブツブ感をなくし、LEDパッケージ6を蛍光管のように連続的に発光させることができる。
(b)封止部材19を光源基板5のチップ実装面5aから盛り上がる形状に成形したので、LEDチップ18の発光を広角に分配し、灯具ボディ2の側方域への配光量を増やし、図4に示すように、放射角度90°地点の相対照度を0.4とすることができ、既存蛍光管とほぼ同等の配光パターンが得られる。
(c)また、灯具ボディ2の両肩部に導光部13を斜状に形成することで、LEDパッケージ6の放射光の一部を灯具取付面12側に導くことも可能となる。
(e)また、上記波長域の蛍光体24,25は、黄色発光の第2蛍光体25が第1蛍光体24の青色光をほとんど吸収しないため、封止部材19を盛り上がり形状とした場合でも、多重励起(カスケード励起)による発光色の変動を抑制できるという利点もある。
(f)透光カバー4は、内面に光拡散層8が設けられているので、LEDパッケージ6の発光を効率よく透過して、LED灯具1の周囲へ均一に拡散できる。
(1)図5に示すように、幅広の灯具ボディ32に光源基板5とLEDパッケージ6を2列または3列に並べ、広域照明用の蛍光灯型LED灯具31を構成すること。
(2)図6に示すように、封止部材35を断面四角形の帯形に成形し、LEDパッケージ36を全体として角柱形に形成すること。
(3)その他、封止部材を断面三角形、台形、多角形など、各種の盛り上がり形状で成形すること。
2,32 灯具ボディ
4 透光カバー
5 光源基板
5a チップ実装面
6,36 LEDパッケージ
8 光拡散層
15 給電ユニット
18 LEDチップ
19,35 封止部材
24,25 蛍光体
Claims (5)
- 長尺の灯具ボディに光源基板と透光カバーを取り付け、光源基板上に長尺のLEDパッケージを灯具ボディの長手方向に延びるように装着し、LEDパッケージが可視光を発生する複数のLEDチップと、各LEDチップを封止する光透過性の封止部材とを備え、LEDチップを前記光源基板に実装し、封止部材を光源基板のチップ実装面から盛り上がるように成形し、前記LEDパッケージがLEDチップの発光を封止部材の表面全体から灯具ボディの側方域を含む広角に放射することを特徴とする蛍光灯型LED灯具。
- 前記封止部材が複数のLEDチップを連続的に封止する帯状に成形されている請求項1記載の蛍光灯型LED灯具。
- 前記LEDチップが紫外または近紫外可視光を発生し、前記封止部材が光透過性材料中にLEDチップの発光を白色可視光に波長変換する複数種の蛍光体を含む請求項1または2記載の蛍光灯型LED灯具。
- 前記灯具ボディにLEDパッケージの放射光の一部を灯具取付面側に導く導光部を形成した請求項1、2または3記載の蛍光灯型LED灯具。
- 前記透光カバーの内面に光拡散層を塗装した請求項1〜4の何れか一項に記載の蛍光灯型LED灯具。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011055305A JP2012190744A (ja) | 2011-03-14 | 2011-03-14 | 蛍光灯型led灯具 |
US13/419,861 US8746907B2 (en) | 2011-03-14 | 2012-03-14 | Fluorescent tube type LED lamp |
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Application Number | Priority Date | Filing Date | Title |
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JP2011055305A JP2012190744A (ja) | 2011-03-14 | 2011-03-14 | 蛍光灯型led灯具 |
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JP2012190744A true JP2012190744A (ja) | 2012-10-04 |
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JP2011055305A Pending JP2012190744A (ja) | 2011-03-14 | 2011-03-14 | 蛍光灯型led灯具 |
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US (1) | US8746907B2 (ja) |
JP (1) | JP2012190744A (ja) |
Cited By (2)
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JP2014186966A (ja) * | 2013-03-25 | 2014-10-02 | Panasonic Corp | 照明器具 |
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2011
- 2011-03-14 JP JP2011055305A patent/JP2012190744A/ja active Pending
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2012
- 2012-03-14 US US13/419,861 patent/US8746907B2/en not_active Expired - Fee Related
Patent Citations (10)
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JP2002299697A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | Led光源デバイス及び照明器具 |
JP2003110150A (ja) * | 2001-10-01 | 2003-04-11 | Matsushita Electric Ind Co Ltd | 半導体発光素子とこれを用いた発光装置 |
JP2008047851A (ja) * | 2006-07-18 | 2008-02-28 | Nichia Chem Ind Ltd | 線状発光装置およびそれを用いた面状発光装置 |
JP2009038348A (ja) * | 2007-07-12 | 2009-02-19 | Koito Mfg Co Ltd | 発光装置 |
JP3142719U (ja) * | 2008-03-13 | 2008-06-26 | 秀信 堀之内 | 蛍光灯型のled灯 |
JP2010067939A (ja) * | 2008-08-12 | 2010-03-25 | Heiji Niiyama | 発光装置 |
JP2011014316A (ja) * | 2009-06-30 | 2011-01-20 | Sharp Corp | 照明装置 |
JP2011032340A (ja) * | 2009-07-31 | 2011-02-17 | Koito Mfg Co Ltd | 蛍光体および発光装置 |
JP2011151059A (ja) * | 2010-01-19 | 2011-08-04 | Heiji Niiyama | 発光装置 |
JP2012142167A (ja) * | 2010-12-28 | 2012-07-26 | Panasonic Corp | ランプ及び照明装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014077631A1 (ko) * | 2012-11-19 | 2014-05-22 | 서울반도체 주식회사 | Led 조명장치 |
JP2014186966A (ja) * | 2013-03-25 | 2014-10-02 | Panasonic Corp | 照明器具 |
Also Published As
Publication number | Publication date |
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US8746907B2 (en) | 2014-06-10 |
US20120236533A1 (en) | 2012-09-20 |
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