JP2012049158A - Method and apparatus of manufacturing circuit board for circuit formation - Google Patents

Method and apparatus of manufacturing circuit board for circuit formation Download PDF

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JP2012049158A
JP2012049158A JP2010186815A JP2010186815A JP2012049158A JP 2012049158 A JP2012049158 A JP 2012049158A JP 2010186815 A JP2010186815 A JP 2010186815A JP 2010186815 A JP2010186815 A JP 2010186815A JP 2012049158 A JP2012049158 A JP 2012049158A
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circuit
peeling
release film
prepreg sheet
conductive paste
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Norihiro Hirakawa
典宏 平川
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Panasonic Corp
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  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a method of manufacturing a circuit board for circuit formation including a step for peeling a mold releasing film provided on both sides of a prepreg sheet after filling a through hole with conductive paste that a part of conductive paste is scattered to the prepreg sheet by static electricity generated in the prepreg sheet when the mold releasing film is peeled and attracted thereto electrostatically thus causing short circuit of circuit wiring or deterioration of insulation resistance between wires.SOLUTION: In the step for peeling a mold releasing film 2 provided on both sides of a prepreg sheet 1, electrostatic attraction of a conductive paste 4 to the prepreg sheet 1 is prevented by means 6 for irradiating the prepreg sheet 1 with UV-rays when the film is peeled thus obtaining a circuit board for circuit formation which ensures high quality and high reliability by eliminating short circuit of the wiring circuit and deterioration of insulation resistance.

Description

本発明は、回路形成基板の製造方法とその製造装置に関するものである。   The present invention relates to a method for manufacturing a circuit-formed substrate and a manufacturing apparatus therefor.

近年の電子機器の小型化・高密度化に伴って、電子部品を搭載する回路形成基板も従来の片面基板から両面、多層基板の採用が進み、より多くの回路を基板上に集積可能な高密度回路形成基板の開発が行われている。   As electronic devices have become smaller and higher in density in recent years, the adoption of double-sided and multi-layer boards for circuit-forming boards on which electronic components are mounted has increased from the conventional single-sided board, and more circuits can be integrated on the board. A density circuit forming substrate is being developed.

回路形成基板では、高密度化を妨げる要因となっていたメッキスルーホールに代わって、導電ペーストによるインナービアホール接続による回路基板の製造方法が提案されている。   In the circuit forming substrate, a method of manufacturing a circuit substrate by connecting an inner via hole with a conductive paste has been proposed in place of the plated through hole which has been a factor preventing high density.

この回路形成基板の製造方法は、両面に離型性を有する高分子フィルム（以下離型性フィルムと称する）を備えたプリプレグシートに貫通孔をあけ、その穴に導電ペーストを充填し、離型性フィルムを剥離した後、プリプレグシートの両面に金属箔を張り付けて加熱圧接することで基板の両面を電気接続し、さらに金属箔をエッチングによってパターニングして回路形成するものである。   In this method of manufacturing a circuit-formed substrate, a through-hole is formed in a prepreg sheet provided with a polymer film having releasability on both sides (hereinafter referred to as a releasable film), and the hole is filled with a conductive paste. After peeling off the conductive film, a metal foil is attached to both sides of the prepreg sheet and heated and pressed to electrically connect both sides of the substrate, and the metal foil is patterned by etching to form a circuit.

以下従来の回路形成基板の製造方法について図面を参照しながら説明する。   Hereinafter, a conventional method for manufacturing a circuit-formed substrate will be described with reference to the drawings.

図３（ａ）〜（ｆ）は従来の回路形成基板の製造工程を示す工程断面図である。   3 (a) to 3 (f) are process cross-sectional views illustrating the manufacturing process of a conventional circuit forming substrate.

まず、図３（ａ）に示すように、厚さ約２０μｍのＰＥＴ（ポリエチレンテレフタレート）等の高分子フィルムの片面に、シリコーン系の離型層を形成した離型性フィルム２２を両面に備えた、厚さｔ1ｍｍのプリプレグシート２１が準備される。プリプレグシート２１としては、例えばガラス繊維の織布に熱硬化性エポキシ樹脂を含浸させた複合材が用いられる。 First, as shown in FIG. 3A, a release film 22 having a silicone release layer formed on one side of a polymer film such as PET (polyethylene terephthalate) having a thickness of about 20 μm was provided on both sides. A prepreg sheet 21 having a thickness of t 1 mm is prepared. As the prepreg sheet 21, for example, a composite material in which a woven fabric of glass fiber is impregnated with a thermosetting epoxy resin is used.

次に図３（ｂ）に示すように、プリプレグシート２１の所定の位置に、レーザなどのエネルギービームを利用して貫通孔２３が形成される。   Next, as shown in FIG. 3B, a through hole 23 is formed at a predetermined position of the prepreg sheet 21 using an energy beam such as a laser.

次に図３（ｃ）に示すように、プリプレグシート２１を印刷機（図示せず）のテーブル上に配置し、導電ペースト２４が離型性フィルム２２の上から印刷され、貫通孔２３に充填される。この時、上面の離型性フィルム２２は印刷マスクとプリプレグシート２１の汚染防止の役割を果たしている。   Next, as shown in FIG. 3 (c), the prepreg sheet 21 is placed on the table of a printing machine (not shown), and the conductive paste 24 is printed from above the releasable film 22 to fill the through holes 23. Is done. At this time, the release film 22 on the upper surface plays a role of preventing contamination of the printing mask and the prepreg sheet 21.

次に図３（ｄ）に示すように、プリプレグシート２１の両面の離型性フィルム２２が剥離される。そして、図３（ｅ）に示すようにプリプレグシート２１の両面に銅箔などの金属箔２５を張り付け、この状態で加熱加圧することにより、図３（ｆ）に示すようにプリプレグシート２１と金属箔２５とが接着されると同時に、プリプレグシート２１が厚さｔ2ｍｍまで圧縮（ｔ1＞ｔ2）して両面の金属箔２５が導電ペースト２４によって電気的に接続される。この時、プリプレグシート２１の一構成成分であるエポキシ樹脂および導電ペースト２４は硬化する。 Next, as shown in FIG.3 (d), the release film 22 of both surfaces of the prepreg sheet 21 is peeled. Then, a metal foil 25 such as a copper foil is attached to both surfaces of the prepreg sheet 21 as shown in FIG. 3 (e), and heat and pressure are applied in this state, whereby the prepreg sheet 21 and the metal are shown in FIG. 3 (f). At the same time as the foil 25 is bonded, the prepreg sheet 21 is compressed to a thickness t 2 mm (t 1 > t 2 ), and the metal foils 25 on both sides are electrically connected by the conductive paste 24. At this time, the epoxy resin and the conductive paste 24 which are one component of the prepreg sheet 21 are cured.

その後、両面の金属箔２５を選択的にエッチングして回路パターン（図示せず）を形成することで両面の回路基板が得られる。   Then, the double-sided circuit board is obtained by selectively etching the double-sided metal foils 25 to form a circuit pattern (not shown).

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。   As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

特開平６−２６８３４５号公報JP-A-6-268345

しかしながら、上記従来の構成では以下の課題があった。   However, the above conventional configuration has the following problems.

レーザ等によりプリプレグシート２１に貫通孔２３をあけると、図３（ｂ）に示すように両面の離型性フィルム２２にも同時に貫通孔２３が形成される。   When the through-hole 23 is formed in the prepreg sheet 21 by a laser or the like, the through-hole 23 is simultaneously formed in the release films 22 on both sides as shown in FIG.

しかし、図４に示すように導電ペースト２４充填後に離型性フィルム２２を剥離すると、離型性フィルム２２にも形成された貫通孔２３内壁面に、わずかながら導電ペースト２４が付着する。そして、離型性フィルム２２剥離時にプリプレグシート２１に発生した静電気により、導電ペースト２４の一部がプリプレグシート２１に飛散して静電吸着する。   However, as shown in FIG. 4, when the release film 22 is peeled after the conductive paste 24 is filled, the conductive paste 24 slightly adheres to the inner wall surface of the through hole 23 also formed in the release film 22. Then, due to static electricity generated on the prepreg sheet 21 when the release film 22 is peeled off, a part of the conductive paste 24 is scattered on the prepreg sheet 21 and electrostatically adsorbed.

特に充填面と反対の面においては、スキージによりペーストが掻き取られる充填面に比べて、離型性フィルム２２に形成された貫通孔２３内壁面に付着する導電ペースト２４の量が多くなるため、この現象は顕著になる。   Especially on the surface opposite to the filling surface, the amount of the conductive paste 24 adhering to the inner wall surface of the through hole 23 formed in the release film 22 is larger than the filling surface where the paste is scraped off by the squeegee. This phenomenon becomes remarkable.

そして、この吸着した導電ペースト２４が回路形成工程においても残っており、これが原因で回路配線のショートあるいは配線間絶縁抵抗の劣化が起こるという課題があった。   Then, the adsorbed conductive paste 24 remains in the circuit forming process, which causes a problem that a short circuit of the circuit wiring or a deterioration of the insulation resistance between the wirings occurs.

この課題は、配線パターンが高密度になるほど顕著になってくる。   This problem becomes more prominent as the wiring pattern has a higher density.

また、貫通孔２３に充填された導電ペースト２４については、熱プレス工程を経るまでは未硬化であるため、熱プレスにともなうプリプレグシート２１の樹脂の流動により、導電ペースト２４が押し流され、これが異電位間の回路を跨ぐことが原因で回路配線のショートあるいは配線間絶縁抵抗の劣化が起こるという課題があった。   Further, since the conductive paste 24 filled in the through holes 23 is uncured until it undergoes a hot press process, the conductive paste 24 is pushed away by the flow of the resin of the prepreg sheet 21 due to the hot press, and this is different. There has been a problem that circuit wiring is short-circuited or insulation resistance between wirings is deteriorated due to straddling the circuit between potentials.

本発明は、剥離工程の導電ペースト飛散および、熱プレス成型時のプリプレグシートの樹脂の流動による導電ペーストの流れによる、配線回路のショートおよび絶縁信頼性の低下を防止するもので、歩留まりの向上を図り、高品質で高信頼性の回路基板を実現するための回路形成基板の製造方法とその製造装置を提供することを目的とする。   The present invention prevents the short circuit of the wiring circuit and the deterioration of the insulation reliability due to the conductive paste scattering in the peeling process and the flow of the conductive paste due to the resin flow of the prepreg sheet during hot press molding, thereby improving the yield. An object of the present invention is to provide a circuit forming substrate manufacturing method and a manufacturing apparatus for realizing a high quality and highly reliable circuit substrate.

上記目的を達成するために本発明の回路形成基板の製造方法は、離型性フィルムを両面に備えたプリプレグシートに貫通孔をあける工程と、前記貫通孔に導電ペーストを充填する工程と、前記離型性フィルムを剥離する工程と、前記プリプレグシートの両面に金属箔を加熱圧接する工程と、エッチングにより回路形成する工程とを備え、前記離型性フィルムを剥離する工程は、充填された前記導電ペーストを少なくとも剥離前に紫外線照射することを含むことを特徴とするものである。   In order to achieve the above object, a method for producing a circuit-formed substrate of the present invention includes a step of forming a through hole in a prepreg sheet having a release film on both sides, a step of filling the through hole with a conductive paste, A step of peeling the releasable film, a step of heat-pressing a metal foil on both surfaces of the prepreg sheet, and a step of forming a circuit by etching, the step of peeling the releasable film filled The method includes at least irradiating the conductive paste with ultraviolet rays before peeling.

この発明によれば、導電ペースト飛散・流動による配線回路のショートや絶縁信頼性の低下を防止し、高品質で信頼性の高い回路形成基板を提供することができるものである。   According to the present invention, it is possible to provide a high-quality and highly reliable circuit formation substrate by preventing a short circuit of the wiring circuit and a decrease in insulation reliability due to scattering and flow of the conductive paste.

以上のように本発明によれば、離型性フィルム剥離工程において紫外線照射を行い導電ペーストの硬化を促進することにより、導電ペースト飛散・流動による配線回路のショートや絶縁信頼性の低下を防止するもので、歩留まりの向上を図り、高品質で高信頼性の回路形成基板を実現できるという有利な効果が得られる。   As described above, according to the present invention, ultraviolet rays are irradiated in the release film peeling process to accelerate the curing of the conductive paste, thereby preventing a short circuit of the wiring circuit and a decrease in insulation reliability due to scattering and flow of the conductive paste. Therefore, the advantageous effects of improving the yield and realizing a high-quality and highly reliable circuit-formed substrate can be obtained.

本発明の第１の実施の形態における回路形成基板の製造方法の工程断面図Sectional drawing of process of the manufacturing method of the circuit formation board | substrate in the 1st Embodiment of this invention 本発明の第２の実施の形態における剥離工程の断面図Sectional drawing of the peeling process in the 2nd Embodiment of this invention 従来の回路形成基板の製造方法の工程断面図Cross-sectional view of a process for manufacturing a conventional circuit-formed substrate 従来の回路形成基板の製造方法における課題を示す断面図Sectional drawing which shows the subject in the manufacturing method of the conventional circuit formation board | substrate

以下、本発明の実施の形態について、図１、図２を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

（実施の形態１）
図１は、本発明の第１の実施の形態における回路形成基板の製造方法を示す工程断面図である。工程は、穴加工工程（ｂ）、導電ペースト充填工程（ｃ）、離型性フィルム剥離工程（ｄ）、加熱加圧工程（ｅ，ｆ）および回路形成工程の順序で構成される。 (Embodiment 1)
FIG. 1 is a process cross-sectional view illustrating a method for manufacturing a circuit-formed substrate in the first embodiment of the present invention. A process is comprised in order of a hole processing process (b), an electrically conductive paste filling process (c), a mold release film peeling process (d), a heating-pressing process (e, f), and a circuit formation process.

プリプレグシート１は、熱硬化性樹脂（例えばエポキシ樹脂）とガラス繊維織布の複合材料となっている。熱硬化性樹脂は完全に硬化したものではなく、未硬化分を含むいわゆるＢステージ状態である。   The prepreg sheet 1 is a composite material of a thermosetting resin (for example, epoxy resin) and a glass fiber woven fabric. The thermosetting resin is not completely cured but is in a so-called B-stage state including an uncured portion.

また、２は、厚さ約１０〜３０μｍのＰＥＴ（ポリエチレンテレフタレート）等の高分子フィルムに、膜厚が０．０１〜１μｍ程度のシリコーン系、エポキシ系または熱可塑樹脂系の離型層を片面に形成した離型性フィルムであり、プリプレグシート１の両面には、この離型層面が接するような構成で接着されている。   2 is a single side of a silicone, epoxy or thermoplastic release layer having a thickness of about 0.01 to 1 μm on a polymer film such as PET (polyethylene terephthalate) having a thickness of about 10 to 30 μm. The release film is formed on the both sides of the prepreg sheet 1 and bonded to the both sides of the release layer surface.

厚さ約２０〜１５０μｍのプリプレグシート１は、レーザ加工機により炭酸ガスレーザビームなどのエネルギービームをプリプレグシート１上に照射して、穴径が約５０〜２００μｍの貫通孔３を形成する。   The prepreg sheet 1 having a thickness of about 20 to 150 μm is irradiated with an energy beam such as a carbon dioxide laser beam on the prepreg sheet 1 by a laser processing machine to form a through hole 3 having a hole diameter of about 50 to 200 μm.

更に、図１（ｃ）に示すように導電性粒子とエポキシ系樹脂を主体とし、さらに感光性樹脂を含有する導電ペースト４を印刷法等により貫通孔３に充填した後（充填面を上面、その反対面を下面とする）、図１（ｄ）に示すように上下面の離型性フィルム２を剥離する。   Further, as shown in FIG. 1 (c), after filling the through holes 3 with a conductive paste 4 mainly composed of conductive particles and an epoxy resin and further containing a photosensitive resin (printing surface is the upper surface, The release film 2 on the upper and lower surfaces is peeled off as shown in FIG. 1 (d).

そして、図１（ｅ）に示すように金属箔５をプリプレグシート１の両面に重ね合わせて加熱加圧することにより、図１（ｆ）に示すようにプリプレグシート１は厚み方向に圧縮成形され、導電ペースト４によってプリプレグシート１の両面に重ね合わせた金属箔５は電気的に接合される。最後に、両面の金属箔５を選択的にエッチングして回路パターンを形成することで両面の回路形成基板が得られる（図示せず）。   And as shown in FIG.1 (e), the metal foil 5 is piled up on both surfaces of the prepreg sheet 1, and it heat-presses, and as shown in FIG.1 (f), the prepreg sheet 1 is compression-molded in the thickness direction, The metal foil 5 superimposed on both surfaces of the prepreg sheet 1 by the conductive paste 4 is electrically joined. Finally, the double-sided metal foil 5 is selectively etched to form a circuit pattern, thereby obtaining a double-sided circuit-formed substrate (not shown).

それでは本実施の形態における特徴部分について説明する。   Then, the characteristic part in this Embodiment is demonstrated.

剥離工程における紫外線照射は、離型性フィルム剥離装置内に設けた紫外線照射する手段６としての紫外線照射装置によって行われる。具体的には、図１（ｄ）に示すように剥離直前のプリプレグシート１近傍に片面もしくは両面に配した紫外線照射装置により、充填された導電ペースト４を紫外線照射する。   The ultraviolet irradiation in the peeling step is performed by an ultraviolet irradiation device as a means 6 for ultraviolet irradiation provided in the releasable film peeling device. Specifically, as shown in FIG. 1D, the filled conductive paste 4 is irradiated with ultraviolet rays by an ultraviolet irradiation device disposed on one or both sides in the vicinity of the prepreg sheet 1 immediately before peeling.

これにより、導電ペーストを瞬間的、部分的に硬化し、導電ペーストの表面部分を硬化あるいは導電ペースト粘度を増大させることにより導電ペーストの強度を一時的に向上させ、離型性フィルム２の貫通孔３内壁に付着した導電ペースト４は剥ぎ取られることなく残存させることができるとともに、熱プレス時のプリプレグシート１の樹脂流動による貫通孔３に充填した導電ペースト４の流れについても抑制することができる。   Thereby, the conductive paste is instantaneously and partially cured, and the strength of the conductive paste is temporarily improved by curing the surface portion of the conductive paste or increasing the viscosity of the conductive paste. 3 The conductive paste 4 attached to the inner wall can remain without being peeled off, and the flow of the conductive paste 4 filled in the through-holes 3 due to the resin flow of the prepreg sheet 1 during hot pressing can also be suppressed. .

また、紫外線照射により硬化促進されるのは、貫通孔３に充填された導電ペースト４の表面近傍であるため、導電ペースト４の圧縮による金属粒子同士による接合への影響は及ぼさない。   In addition, since the curing is accelerated by the irradiation of ultraviolet rays in the vicinity of the surface of the conductive paste 4 filled in the through holes 3, the compression of the conductive paste 4 does not affect the bonding between the metal particles.

なお、剥離時には紫外線照射装置を固定してプリプレグシート１を図１（ｄ）の矢印方向へ移動させながら、あるいはプリプレグシート１を固定して紫外線照射装置を前記矢印とは逆方向へ移動させながら離型性フィルム２を剥離することにより、紫外線照射装置が常に剥離直前のプリプレグシート１表面近傍に配され、効率的に導電ペーストを瞬間的に硬化することができる。   At the time of peeling, the ultraviolet irradiation device is fixed and the prepreg sheet 1 is moved in the direction of the arrow in FIG. 1D, or the prepreg sheet 1 is fixed and the ultraviolet irradiation device is moved in the direction opposite to the arrow. By peeling off the releasable film 2, the ultraviolet irradiation device is always arranged in the vicinity of the surface of the prepreg sheet 1 immediately before peeling, and the conductive paste can be efficiently cured instantaneously.

また、離型性フィルム２を剥離する直前に図１（ｄ）に示す押圧ローラー７で硬化後の露出した導電ペースト４の表面と離型性フィルム２とを押圧することによって、導電ペースト４の表面の硬化部分と離型性フィルム２との接触している部分を事前に切り離すことができ、離型性フィルム２の剥離を円滑に行うことができる。   Further, immediately before the release film 2 is peeled off, the exposed surface of the conductive paste 4 after curing and the release film 2 are pressed by the pressing roller 7 shown in FIG. The part which the hardened | cured part of the surface and the releasable film 2 are contacting can be cut away previously, and peeling of the releasable film 2 can be performed smoothly.

また、離型性フィルム２を剥離した直後に導電ペーストを紫外線照射することにより（図示せず）、貫通孔３に充填された導電ペースト４の表面硬化を促進できるため、熱プレスによる成型時のプリプレグの樹脂流動による導電ペースト４の流れを抑制することができる。   Moreover, since the surface hardening of the conductive paste 4 filled in the through holes 3 can be accelerated by irradiating the conductive paste with ultraviolet rays (not shown) immediately after the release film 2 is peeled off, The flow of the conductive paste 4 due to the resin flow of the prepreg can be suppressed.

（実施の形態２）
工程は、基本的に離型性フィルム剥離工程以外は実施の形態１と同じ構成なので、詳細な説明は省略する。 (Embodiment 2)
Since the process is basically the same as that of the first embodiment except for the release film peeling process, detailed description is omitted.

それでは本実施の形態における特徴部分について説明する。   Then, the characteristic part in this Embodiment is demonstrated.

剥離工程における紫外線照射する手段６は、離型性フィルム剥離装置内に設けた紫外線照射装置などによって行われる。具体的には、図２（ａ）に示すように離型性フィルム２の剥離直前近傍に紫外線照射する手段６を設置する。紫外線照射する手段６の紫外線量は、導電ペースト４の表面が瞬間的に指触乾燥するような条件で行う。   The means 6 for irradiating with ultraviolet rays in the peeling step is performed by an ultraviolet irradiating device or the like provided in the releasable film peeling device. Specifically, as shown in FIG. 2A, a means 6 for irradiating ultraviolet rays is installed in the vicinity immediately before the release film 2 is peeled off. The amount of ultraviolet rays of the means 6 for irradiating with ultraviolet rays is determined under the condition that the surface of the conductive paste 4 is instantaneously touch-dried.

これにより、離型性フィルム２の貫通孔３内壁に付着した導電ペースト４は、紫外線照射する手段６に瞬間的に硬化され、プリプレグシート１に静電吸着することはない。   Thereby, the conductive paste 4 attached to the inner wall of the through-hole 3 of the release film 2 is instantaneously cured by the means 6 for irradiating with ultraviolet rays and is not electrostatically adsorbed to the prepreg sheet 1.

また、貫通孔３に充填された導電ペースト４の表面硬化が促進されているため、熱プレスによる成型時のプリプレグの樹脂流動による導電ペースト４の流れを抑制することができる。   Moreover, since the surface hardening of the electrically conductive paste 4 with which the through-hole 3 was filled is accelerated | stimulated, the flow of the electrically conductive paste 4 by the resin flow of the prepreg at the time of shaping | molding by a hot press can be suppressed.

ここで、図２（ａ）に示すように紫外線照射する手段６が対向する場合、一方の離型性フィルム２に付着した導電ペースト４が、上下両方の紫外線照射する手段６によって過度に紫外線照射される可能性がある。   Here, as shown in FIG. 2A, when the means 6 for irradiating ultraviolet rays face each other, the conductive paste 4 attached to one release film 2 is excessively irradiated with ultraviolet rays by the means 6 for irradiating both upper and lower ultraviolet rays. There is a possibility that.

そこで、図２（ｂ）に示すように紫外線照射する手段６をお互いずらして配置して、一方の面を剥離開始した後に少し遅れてもう一方の面を剥離開始する。または大きくずらして片面ずつ全面剥離を行う。   Therefore, as shown in FIG. 2B, the means 6 for irradiating ultraviolet rays are arranged so as to be shifted from each other, and after one surface is started to be peeled off, the other surface is started to peel off a little later. Alternatively, the entire surface is peeled one by one with a large shift.

なお、図２（ａ）において片側の紫外線照射する手段６のみを用いて片面を全面剥離した後、プリプレグシート１を反転させ再度同じ紫外線照射する手段６を用いてもう一方の面を全面剥離することによっても同じ効果が得られる。   In FIG. 2A, the entire surface is peeled off using only means 6 for irradiating ultraviolet rays on one side, and then the other surface is peeled off using the means 6 for inverting the prepreg sheet 1 again and irradiating the same ultraviolet rays. The same effect can be obtained.

なお、以上の実施の形態では穴加工方法として炭酸ガスレーザを用いて説明したが、その他の気体レーザおよびＹＡＧレーザ等の固体レーザ、エキシマレーザ、あるいはレーザ以外のエネルギービームの使用、そしてエネルギービーム以外にドリル加工、プラズマエッチング、パンチングも可能である。   In the above embodiment, a carbon dioxide laser is used as the hole drilling method. However, other gas lasers and solid lasers such as YAG lasers, excimer lasers, use of energy beams other than lasers, and in addition to energy beams Drilling, plasma etching and punching are also possible.

また、両面回路形成基板について説明したが、工程を繰り返すことにより多層回路形成基板が得られることは言うまでもない。更に、高分子フィルムにはＰＥＴ以外に、ＰＩ（ポリイミド）、ＰＥＮ（ポリエチレンナフタレート）、ＰＰＳ（ポリフェニレンサルファイト）、ＰＰ（ポリプロピレン）、ＰＰＯ（ポリフェニレンオキサイド）等を用いても良い。   Moreover, although the double-sided circuit formation substrate has been described, it goes without saying that a multilayer circuit formation substrate can be obtained by repeating the steps. In addition to PET, PI (polyimide), PEN (polyethylene naphthalate), PPS (polyphenylene sulfite), PP (polypropylene), PPO (polyphenylene oxide), or the like may be used for the polymer film.

また、織布の代わりに不織布を使用すること、および織布あるいは不織布を構成する繊維としてガラス以外の無機繊維材料あるいはアラミド等の有機繊維材料などを使用すること、熱硬化性樹脂に代えて熱可塑性樹脂を用いることも可能である。   Also, use non-woven fabric in place of woven fabric, use inorganic fiber material other than glass or organic fiber material such as aramid as the fiber constituting the woven fabric or non-woven fabric, heat instead of thermosetting resin It is also possible to use a plastic resin.

本発明は、上記した実施の形態に限定されるものではない。   The present invention is not limited to the embodiment described above.

以上のように本発明によれば、離型性フィルム剥離工程において導電ペーストを紫外線照射することにより、導電ペースト飛散・流動による配線回路のショートや絶縁信頼性の低下を防止するもので、歩留まりの向上を図り、高品質で高信頼性の回路形成基板を実現できるという有利な効果が得られる。   As described above, according to the present invention, by irradiating the conductive paste with ultraviolet rays in the release film peeling step, it is possible to prevent a short circuit of the wiring circuit and a decrease in insulation reliability due to scattering and flow of the conductive paste. It is possible to obtain an advantageous effect that improvement and realization of a high-quality and high-reliability circuit forming substrate can be achieved.

特に、高密度配線回路基板においては有効な手段となり、本発明の産業上の利用可能性は大といえる。   In particular, it is an effective means in a high-density printed circuit board, and the industrial applicability of the present invention can be said to be great.

１ プリプレグシート
２ 離型性フィルム
３ 貫通孔
４ 導電ペースト
５ 金属箔
６ 紫外線照射する手段
７ 押圧ローラー DESCRIPTION OF SYMBOLS 1 Prepreg sheet 2 Release film 3 Through-hole 4 Conductive paste 5 Metal foil 6 Means to irradiate with ultraviolet rays 7 Press roller

Claims (7)

離型性フィルムを両面に備えたプリプレグシートに貫通孔をあける工程と、前記貫通孔に導電ペーストを充填する工程と、前記離型性フィルムを剥離する工程と、前記プリプレグシートの両面に金属箔を加熱圧接する工程と、エッチングにより回路形成する工程とを備え、前記離型性フィルムを剥離する工程は、充填された前記導電ペーストを少なくとも剥離前に紫外線照射することを含むことを特徴とする回路形成基板の製造方法。 A step of opening a through hole in a prepreg sheet having a release film on both sides, a step of filling the through hole with a conductive paste, a step of peeling off the release film, and a metal foil on both sides of the prepreg sheet A step of forming a circuit by etching, and the step of peeling off the release film includes irradiating the filled conductive paste with ultraviolet rays at least before peeling. A method for manufacturing a circuit-formed substrate. 前記離型性フィルムを剥離する工程は、前記離型性フィルムを剥離した直後に前記導電ペーストを紫外線照射することを含むことを特徴とする請求項１に記載の回路形成基板の製造方法。 The method of manufacturing a circuit forming substrate according to claim 1, wherein the step of peeling the release film includes irradiating the conductive paste with ultraviolet rays immediately after peeling the release film. 離型性フィルムを剥離する工程は、両面のプリプレグシートの剥離部近傍に紫外線照射を行う手段を配設して紫外線照射を行うことを特徴とする請求項１に記載の回路形成基板の製造方法。 The method for producing a circuit forming substrate according to claim 1, wherein the step of peeling the release film is performed by irradiating the ultraviolet rays by arranging means for irradiating ultraviolet rays in the vicinity of the peeling portions of the prepreg sheets on both sides. . 紫外線照射を行う手段の紫外線量は、導電ペーストの表面が瞬間的に指触乾燥するような条件で行うことを特徴とする請求項１に記載の回路形成基板の製造方法。 2. The method of manufacturing a circuit forming substrate according to claim 1, wherein the amount of ultraviolet rays of the means for irradiating with ultraviolet rays is determined under such a condition that the surface of the conductive paste is instantaneously touch-dried. 片側の離型性フィルムを紫外線照射しながら剥離開始した後に、遅れてもう一方の離型性フィルムを紫外線照射しながら剥離開始することを特徴とする請求項３に記載の回路形成基板の製造方法。 4. The method for producing a circuit forming substrate according to claim 3, wherein after the release film on one side is started to be peeled while being irradiated with ultraviolet rays, the release film is started to be peeled off while the other release film is irradiated with ultraviolet rays. . 離型性フィルムを両面に備えたプリプレグシートの前記離型性フィルムを剥離する手段と、剥離時に離型性フィルムと前記プリプレグシートを紫外線照射する手段とを備えたことを特徴とする回路形成基板の製造装置。 A circuit-forming board comprising: means for peeling the release film of a prepreg sheet provided with a release film on both sides; and means for irradiating the release film and the prepreg sheet with ultraviolet rays at the time of peeling. Manufacturing equipment. 紫外線照射する手段は、前記プリプレグシートから離型性フィルムを剥離する剥離部近傍に設けられていることを特徴とする請求項６に記載の回路形成基板の製造装置。 The circuit forming substrate manufacturing apparatus according to claim 6, wherein the ultraviolet irradiation means is provided in the vicinity of a peeling portion for peeling the release film from the prepreg sheet.
JP2010186815A 2010-08-24 2010-08-24 Method and apparatus of manufacturing circuit board for circuit formation Pending JP2012049158A (en)

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