JP2012004525A - ハイブリッド型放熱基板及びその製造方法 - Google Patents
ハイブリッド型放熱基板及びその製造方法 Download PDFInfo
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- JP2012004525A JP2012004525A JP2010207686A JP2010207686A JP2012004525A JP 2012004525 A JP2012004525 A JP 2012004525A JP 2010207686 A JP2010207686 A JP 2010207686A JP 2010207686 A JP2010207686 A JP 2010207686A JP 2012004525 A JP2012004525 A JP 2012004525A
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- layer
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- oxide insulating
- metal core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明は、金属コア層110、金属コア層110と一体の形状を有するように金属コア層110の厚さ方向に形成された酸化絶縁コア層120、金属コア層110の一面または両面に形成された酸化絶縁膜層130、及び酸化絶縁コア層120に形成された第1回路パターン140−1及び酸化絶縁膜層130に形成された第2回路パターン140−2で構成された回路層140を含むハイブリッド型放熱基板100及びその製造方法に関する。
【選択図】図1
Description
110 金属コア層(金属コア部材)
115 貫通ホール
120 酸化絶縁コア層
130 酸化絶縁膜層
135 絶縁内膜
140 回路層
140−1 第1回路パターン
140−2 第2回路パターン
145 ビア
150 保護層
155 開口部
Claims (12)
- 金属コア層;
前記金属コア層と一体の形状を有するように前記金属コア層の厚さ方向に形成された酸化絶縁コア層;
前記金属コア層の一面または両面に形成された酸化絶縁膜層;及び
前記酸化絶縁コア層に形成された第1回路パターン及び前記酸化絶縁膜層に形成された第2回路パターンで構成された回路層;
を含むハイブリッド型放熱基板。 - 前記酸化絶縁コア層の一側面または隣接した二つの側面が、外部に露出されたことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 前記回路層に形成された保護層をさらに含むことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 前記第1回路パターンに熱脆弱素子が実装され、前記第2回路パターンに発熱素子が実装されたことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 前記金属コア層が、アルミニウムで構成され、前記酸化絶縁コア層及び前記酸化絶縁膜層が、アルミナで構成されたことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 前記第2回路パターンが、前記金属コア層の両面に形成され、ビアを介して連結されたことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 前記酸化絶縁コア層が、前記金属コア層の両面に形成されたことを特徴とする請求項1に記載のハイブリッド型放熱基板。
- 金属コア部材を提供する段階;
前記金属コア部材を厚さ方向に体積アノダイズして酸化絶縁コア層を形成する段階;
前記金属コア部材の一面または両面に表面アノダイズして酸化絶縁膜層を形成する段階;及び
前記酸化絶縁コア層に位置する第1回路パターン及び前記酸化絶縁膜層に位置する第2回路パターンで構成された回路層を形成する段階;
を含むハイブリッド型放熱基板の製造方法。 - 前記回路層を形成する段階の後に、
前記回路層をカバーする保護層を形成する段階をさらに含むことを特徴とする請求項8に記載のハイブリッド型放熱基板の製造方法。 - 前記保護層を形成する段階の後に、
前記酸化絶縁コア層に形成された前記第1回路パターンに熱脆弱素子を実装する段階;及び
前記酸化絶縁膜層に形成された前記第2回路パターンに発熱素子を実装する段階;
をさらに含むことを特徴とする請求項9に記載のハイブリッド型放熱基板の製造方法。 - 前記金属コア部材の両面に形成された前記回路層を連結するビアを形成する段階をさらに含むことを特徴とする請求項8に記載のハイブリッド型放熱基板の製造方法。
- 前記ビアを形成する段階が、
前記酸化絶縁コア層を形成する段階の後に前記金属コア部材を貫通する貫通ホールを形成し、前記酸化絶縁膜層を形成する段階で前記貫通ホールの内壁に絶縁内膜を形成し、前記回路層を形成する段階で前記絶縁内膜の内壁にメッキ層を形成して遂行されることを特徴とする請求項11に記載のハイブリッド型放熱基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100056616A KR101095202B1 (ko) | 2010-06-15 | 2010-06-15 | 하이브리드형 방열기판 및 그 제조방법 |
KR10-2010-0056616 | 2010-06-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012004525A true JP2012004525A (ja) | 2012-01-05 |
JP5634185B2 JP5634185B2 (ja) | 2014-12-03 |
Family
ID=45095306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010207686A Expired - Fee Related JP5634185B2 (ja) | 2010-06-15 | 2010-09-16 | ハイブリッド型放熱基板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20110303440A1 (ja) |
JP (1) | JP5634185B2 (ja) |
KR (1) | KR101095202B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101322623B1 (ko) * | 2012-01-18 | 2013-10-29 | 한국생산기술연구원 | 매립홈이 형성된 알루미늄 방열층을 포함하는 양극산화알루미늄 및 그 제조방법 |
WO2016009830A1 (ja) * | 2014-07-15 | 2016-01-21 | シーシーエス株式会社 | 配線基板及びこれを用いた光照射装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101237668B1 (ko) | 2011-08-10 | 2013-02-26 | 삼성전기주식회사 | 반도체 패키지 기판 |
KR20130079118A (ko) * | 2011-12-22 | 2013-07-10 | 삼성테크윈 주식회사 | 다층 회로 기판 제조방법 및 그 제조방법에 의해 제조된 다층 회로 기판 |
US9532466B2 (en) | 2011-12-22 | 2016-12-27 | Haesung Ds Co., Ltd. | Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method |
US9536798B2 (en) * | 2012-02-22 | 2017-01-03 | Cyntec Co., Ltd. | Package structure and the method to fabricate thereof |
US20150118391A1 (en) * | 2013-10-24 | 2015-04-30 | Rogers Corporation | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
JP6169960B2 (ja) * | 2013-12-04 | 2017-07-26 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
KR102215820B1 (ko) * | 2019-12-26 | 2021-02-16 | 주식회사 반디 | 조명기기용 광원모듈 및 그 제조방법 |
AT17081U1 (de) * | 2020-04-14 | 2021-05-15 | Zkw Group Gmbh | Verfahren zur Herstellung einer Isolationsschicht auf einer IMS-Leiterplatte |
KR102657028B1 (ko) * | 2023-08-23 | 2024-04-12 | (주)일렉팜 | Led조명에 적용되는 고방열, 고기능성, 고집적 방열기판 |
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JPH10335866A (ja) * | 1997-05-27 | 1998-12-18 | Fujitsu Ten Ltd | 回路基板の放熱構造 |
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-
2010
- 2010-06-15 KR KR1020100056616A patent/KR101095202B1/ko active IP Right Grant
- 2010-09-16 JP JP2010207686A patent/JP5634185B2/ja not_active Expired - Fee Related
- 2010-10-07 US US12/900,226 patent/US20110303440A1/en not_active Abandoned
-
2013
- 2013-12-18 US US14/133,157 patent/US9107313B2/en active Active
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JPS5145763A (en) * | 1974-10-18 | 1976-04-19 | Hitachi Ltd | Zetsuenso ojusuru aishikairoyokinzokukiban |
JPH0369185A (ja) * | 1989-08-08 | 1991-03-25 | Nec Corp | 混成集積回路 |
JPH10335866A (ja) * | 1997-05-27 | 1998-12-18 | Fujitsu Ten Ltd | 回路基板の放熱構造 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101322623B1 (ko) * | 2012-01-18 | 2013-10-29 | 한국생산기술연구원 | 매립홈이 형성된 알루미늄 방열층을 포함하는 양극산화알루미늄 및 그 제조방법 |
WO2016009830A1 (ja) * | 2014-07-15 | 2016-01-21 | シーシーエス株式会社 | 配線基板及びこれを用いた光照射装置 |
JPWO2016009830A1 (ja) * | 2014-07-15 | 2017-04-27 | シーシーエス株式会社 | 配線基板及びこれを用いた光照射装置 |
Also Published As
Publication number | Publication date |
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US20140096380A1 (en) | 2014-04-10 |
JP5634185B2 (ja) | 2014-12-03 |
US9107313B2 (en) | 2015-08-11 |
KR101095202B1 (ko) | 2011-12-16 |
US20110303440A1 (en) | 2011-12-15 |
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