JP2011162430A - セラミックス成形用水溶性バインダー及びこれを用いたセラミックス成形用組成物 - Google Patents
セラミックス成形用水溶性バインダー及びこれを用いたセラミックス成形用組成物 Download PDFInfo
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Abstract
【効果】本発明のセラミックス成形用水溶性バインダーによれば、乾燥時の保形性に優れた良好なセラミックス成形体を得ることができる。
【選択図】なし
Description
請求項1:
ヒドロキシプロピルメチルセルロースのメトキシル基置換度が28〜30質量%であり、ヒドロキシプロピル基置換度が5〜7質量%である水溶性ヒドロキシプロピルメチルセルロースからなるセラミックス成形用水溶性バインダーであって、水溶液の離水率が30質量%以上であり、かつ坏土熱ゲル強度が0.5kgf以上であることを特徴とするセラミックス成形用水溶性バインダー。
請求項2:
JIS K2283−1993に規定されるウベローデ粘度計を用いた2質量%水溶液の20℃の粘度が、10,000mPa・s以上の水溶性ヒドロキシプロピルメチルセルロースを用いることを特徴とする請求項1記載のセラミックス成形用水溶性バインダー。
請求項3:
請求項1又は2記載のセラミックス成形用水溶性バインダー及びセラミックス材料を含むセラミックス成形用組成物。
請求項4:
更に、銅、ニッケル、鉄、クロム、アルミニウム、金属ケイ素、ランタニド金属、アルカリ土類金属及びこれらの金属の合金から選ばれる無機質材料を含有する請求項3記載のセラミックス成形用組成物。
本発明のセラミックス成形用水溶性バインダーに用いるヒドロキシプロピルメチルセルロースとしては、メトキシル基置換度が28〜30質量%であり、ヒドロキシプロピル基置換度が5〜7質量%であるヒドロキシプロピルメチルセルロースが、離水率が高く、かつ坏土熱ゲル強度も高く好適である。
上記置換度はJ.G.Gobler,E.P.Samsel,and G.H.Beaber,Talanta,9,474(1962)に記載されているZeisel−GCによる手法に準じて測定できる。
本発明のセラミックス成形用組成物は、上記水溶性ヒドロキシプロピルメチルセルロースからなるセラミックス成形用水溶性バインダー及びセラミックス材料を含むものである。
平均粒径33μmの炭化ケイ素を80質量部、平均粒径5μmの金属ケイ素を20質量部の計100質量部に対して、表1に示すセルロースエーテルを外配で8質量部添加して混合した。その後、更に水を26質量部、ラウリン酸カリウムの30質量%水溶液を2.5質量部添加し、川田製作所製のスーパーミキサーにて1,000rpmの撹拌羽により混合した。更に、井上製作所製の小型3本ロールミルにて、品温度を15℃にして混合した後、宮崎鉄工製のハニカム押出成形用小型押出成形機を用いて、壁厚み0.5mm、壁間2.5mm、直径20mmのハニカムダイスにより押出ハニカム成形を行った。
得られた押出ハニカム成形体を100℃にて16時間乾燥して、その際の乾燥変形を観察した。
×:変形及びクラックあり
Claims (4)
- ヒドロキシプロピルメチルセルロースのメトキシル基置換度が28〜30質量%であり、ヒドロキシプロピル基置換度が5〜7質量%である水溶性ヒドロキシプロピルメチルセルロースからなるセラミックス成形用水溶性バインダーであって、水溶液の離水率が30質量%以上であり、かつ坏土熱ゲル強度が0.5kgf以上であることを特徴とするセラミックス成形用水溶性バインダー。
- JIS K2283−1993に規定されるウベローデ粘度計を用いた2質量%水溶液の20℃の粘度が、10,000mPa・s以上の水溶性ヒドロキシプロピルメチルセルロースを用いることを特徴とする請求項1記載のセラミックス成形用水溶性バインダー。
- 請求項1又は2記載のセラミックス成形用水溶性バインダー及びセラミックス材料を含むセラミックス成形用組成物。
- 更に、銅、ニッケル、鉄、クロム、アルミニウム、金属ケイ素、ランタニド金属、アルカリ土類金属及びこれらの金属の合金から選ばれる無機質材料を含有する請求項3記載のセラミックス成形用組成物。
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JP2011001855A JP2011162430A (ja) | 2010-01-14 | 2011-01-07 | セラミックス成形用水溶性バインダー及びこれを用いたセラミックス成形用組成物 |
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JP2017507100A (ja) * | 2014-01-16 | 2017-03-16 | ダウ グローバル テクノロジーズ エルエルシー | ヒドロキシプロピルメチルセルロースを含む熱成形可能なセラミック組成物 |
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- 2011-01-10 EP EP11150509.5A patent/EP2345627B1/en active Active
- 2011-01-10 PL PL11150509T patent/PL2345627T3/pl unknown
- 2011-01-11 US US13/004,275 patent/US8728224B2/en active Active
- 2011-01-14 CN CN2011100073831A patent/CN102180678A/zh active Pending
Patent Citations (2)
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JP2002037923A (ja) * | 2000-07-31 | 2002-02-06 | Shin Etsu Chem Co Ltd | 水溶性バインダー |
JP2002047069A (ja) * | 2000-07-31 | 2002-02-12 | Ngk Insulators Ltd | ハニカム構造体の製造方法 |
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JP2017507100A (ja) * | 2014-01-16 | 2017-03-16 | ダウ グローバル テクノロジーズ エルエルシー | ヒドロキシプロピルメチルセルロースを含む熱成形可能なセラミック組成物 |
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EP2345627A2 (en) | 2011-07-20 |
EP2345627A3 (en) | 2013-05-29 |
EP2345627B1 (en) | 2014-08-06 |
PL2345627T3 (pl) | 2015-02-27 |
US20110172079A1 (en) | 2011-07-14 |
CN102180678A (zh) | 2011-09-14 |
US8728224B2 (en) | 2014-05-20 |
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