JP2011144270A5 - - Google Patents

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JP2011144270A5
JP2011144270A5 JP2010006379A JP2010006379A JP2011144270A5 JP 2011144270 A5 JP2011144270 A5 JP 2011144270A5 JP 2010006379 A JP2010006379 A JP 2010006379A JP 2010006379 A JP2010006379 A JP 2010006379A JP 2011144270 A5 JP2011144270 A5 JP 2011144270A5
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conductive
film
resin
resin composition
carbon black
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JP2010006379A
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JP2011144270A (en
JP5267468B2 (en
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Claims (10)

熱可塑性樹脂（Ａ）(ただし、ポリエチレンを除く)と、カーボンブラック（Ｂ）と、樹脂（Ｃ）とを含む導電性樹脂組成物であって、
樹脂（Ｃ）のガラス転移温度が熱可塑性樹脂（Ａ）のガラス転移温度よりも低く、
カーボンブラック（Ｂ）と樹脂（Ｃ）との界面自由エネルギーが、カーボンブラック（Ｂ）と熱可塑性樹脂（Ａ）との界面自由エネルギーよりも低く、
カーボンブラック（Ｂ）と樹脂（Ｃ）との界面自由エネルギーが、０〜５０ｍＮ／ｍであることを特徴とする導電性樹脂組成物。 A conductive resin composition comprising a thermoplastic resin (A) (excluding polyethylene) , carbon black (B), and resin (C),
The glass transition temperature of the resin (C) is lower than the glass transition temperature of the thermoplastic resin (A),
The interface free energy between the carbon black (B) and the resin (C) is lower than the interface free energy between the carbon black (B) and the thermoplastic resin (A),
A conductive resin composition, wherein an interface free energy between carbon black (B) and resin (C) is 0 to 50 mN / m. カーボンブラック（Ｂ）のＤＢＰ吸油量が３０〜７５０ｍｌ／１００ｇであることを特徴とする請求項１記載の導電性樹脂組成物。   The conductive resin composition according to claim 1, wherein the carbon black (B) has a DBP oil absorption of 30 to 750 ml / 100 g. 樹脂（Ｃ）が、熱可塑性エラストマーまたはポリエチレンであることを特徴とする請求項１又は２記載の導電性樹脂組成物。   The conductive resin composition according to claim 1 or 2, wherein the resin (C) is a thermoplastic elastomer or polyethylene. 請求項１〜３いずれか記載の導電性樹脂組成物を含むことを特徴とする導電性マスターバッチ。   A conductive masterbatch comprising the conductive resin composition according to claim 1. 請求項１〜３いずれか記載の導電性樹脂組成物を用いて形成され、かつ延伸されてなる導電性フィルム。   The electroconductive film formed using the conductive resin composition in any one of Claims 1-3, and being extended | stretched. 請求項１〜３いずれか記載の導電性樹脂組成物を含む組成物を溶融混練する工程（１）、次に、フィルムを形成する工程（２）、更に、前記フィルムを延伸する工程（３）を含むことを特徴とする導電性フィルムの製造方法。 A step (1) of melt-kneading the composition containing the conductive resin composition according to any one of claims 1 to 3, a step (2) of forming a film, and a step (3) of further stretching the film The manufacturing method of the electroconductive film characterized by including. 前記工程（３）において、フィルムを二軸延伸することを特徴とする請求項６記載の導電性フィルムの製造方法。   The method for producing a conductive film according to claim 6, wherein in the step (3), the film is biaxially stretched. 前記工程（３）において、フィルムの延伸倍率が面積比で１．５〜２５倍であることを特徴とする請求項６又は７記載の導電性フィルムの製造方法。   In the said process (3), the draw ratio of a film is 1.5-25 times by area ratio, The manufacturing method of the conductive film of Claim 6 or 7 characterized by the above-mentioned. 請求項６〜８いずれか記載の製造方法で得られた導電性フィルム。   The electroconductive film obtained with the manufacturing method in any one of Claims 6-8. 請求項５又は９記載の導電性フィルムの表面抵抗率が、１×１０7Ω／以下であることを特徴とする導電性フィルム。

The surface resistivity of the conductive film according to claim 5 or 9 is 1 × 10 7 Ω / or less.

JP2010006379A 2010-01-15 2010-01-15 Conductive resin composition and method for producing conductive film Active JP5267468B2 (en)

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JP2010006379A JP5267468B2 (en) 2010-01-15 2010-01-15 Conductive resin composition and method for producing conductive film

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JP2010006379A JP5267468B2 (en) 2010-01-15 2010-01-15 Conductive resin composition and method for producing conductive film

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JP2011144270A JP2011144270A (en) 2011-07-28
JP2011144270A5 true JP2011144270A5 (en) 2012-10-25
JP5267468B2 JP5267468B2 (en) 2013-08-21

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991022B2 (en) 2014-03-18 2018-06-05 Hitachi Metals, Ltd. Electroconductive resin composition and pressure sensor
CN106030267A (en) * 2014-12-24 2016-10-12 日本梅克特隆株式会社 Pressure-sensitive element and pressure sensor
CN107708960B (en) * 2015-06-19 2020-08-04 Ehc加拿大股份公司 Method and apparatus for extruding thermoplastic handrail
JP7323947B2 (en) * 2021-06-11 2023-08-09 聚紡股▲ふん▼有限公司 Functional cloth and its manufacturing method
JP2023178587A (en) * 2022-06-06 2023-12-18 グンゼ株式会社 Method for producing conductive film and conductive film

Family Cites Families (9)

* Cited by examiner, † Cited by third party
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JPH0482194A (en) * 1990-07-24 1992-03-16 Lion Corp Electromagnetic wave exothermic body
JP2001288310A (en) * 2000-04-06 2001-10-16 Toyo Ink Mfg Co Ltd Electroconductive resin composition and its molding
JP2006160834A (en) * 2004-12-03 2006-06-22 Daicel Polymer Ltd Electrically-conductive resin composition
JP4863740B2 (en) * 2005-11-01 2012-01-25 株式会社ブリヂストン Conductive endless belt
JP4863739B2 (en) * 2005-11-01 2012-01-25 株式会社ブリヂストン Conductive endless belt
JP2006321564A (en) * 2006-06-21 2006-11-30 Denki Kagaku Kogyo Kk Thermoplastic resin sheet
JP5082464B2 (en) * 2007-01-25 2012-11-28 三菱化学株式会社 Endless belt for image forming apparatus and image forming apparatus
JP5214171B2 (en) * 2007-05-23 2013-06-19 株式会社クレハ Semiconductive polyvinylidene fluoride resin composition, semiconductive resin molded product, and charge control member
JP2009025787A (en) * 2007-06-19 2009-02-05 Bridgestone Corp Conductive endless belt

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