JP2011100927A - 接着剤組成物 - Google Patents
接着剤組成物 Download PDFInfo
- Publication number
- JP2011100927A JP2011100927A JP2009256187A JP2009256187A JP2011100927A JP 2011100927 A JP2011100927 A JP 2011100927A JP 2009256187 A JP2009256187 A JP 2009256187A JP 2009256187 A JP2009256187 A JP 2009256187A JP 2011100927 A JP2011100927 A JP 2011100927A
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- Prior art keywords
- mass
- acrylic resin
- parts
- adhesive composition
- epoxy compound
- Prior art date
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- C—CHEMISTRY; METALLURGY
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/24—Di-epoxy compounds carbocyclic
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- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
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Abstract
【解決手段】回路基板にチップ部品をフリップチップ実装するための接着剤組成物は、脂環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂とを含有している。脂環式酸無水物系硬化剤の含有量は、脂環式エポキシ化合物100質量部に対し80〜120質量部であり、アクリル樹脂の含有量は、脂肪環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂との合計100質量部中に5〜50質量部である。アクリル樹脂は、アルキル(メタ)アクリレートと、アルキル(メタ)アクリレート100質量部に対し2〜100質量部のグリシジルメタクリレートとを共重合させた吸水率1.2%以下の樹脂である。
【選択図】なし
Description
脂環式酸無水物系硬化剤の含有量が、脂環式エポキシ化合物100質量部に対し80〜120質量部であり、該アクリル樹脂の含有量が、脂肪環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂との合計100質量部中に5〜50質量部であり、
該アクリル樹脂が、アルキル(メタ)アクリレートと、アルキル(メタ)アクリレート100質量部に対し2〜100質量部のグリシジルメタクリレートとを共重合させた吸水率1.2%以下の樹脂であることを特徴とする接着剤組成物を提供する。
攪拌機、冷却管を備えた四つ口フラスコに、エチルアクリレート(EA)50g、ブチルアクリレート(BA)50g、グリシジルメタクリレート(GMA)10g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂Aを得た。得られたアクリル樹脂A(EA50:BA50:GMA10)の重量平均分子量は80000であり、ガラス転移温度は−56℃であった。また、吸水率は1.0%であった。
攪拌機、冷却管を備えた四つ口フラスコに、ブチルアクリレート(BA)70g、グリシジルメタクリレート(GMA)30g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂Bを得た。得られたアクリル樹脂B(BA70:GMA30)の重量平均分子量は110000であり、ガラス転移温度は−34℃であった。また、吸水率は0.5%であった。
攪拌機、冷却管を備えた四つ口フラスコに、2−エチルヘキシルアクリレート(2−EHA)70g、グリシジルメタクリレート(GMA)30g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂Cを得た。得られたアクリル樹脂C(2-EHA70:GMA30)の重量平均分子量は110000であり、ガラス転移温度は−33℃であった。また、吸水率は0.5%であった。
攪拌機、冷却管を備えた四つ口フラスコに、ブチルアクリレート(BA)30g、ブチルメタクリレート(BMA)50g、グリシジルメタクリレート(GMA)20g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂Dを得た。得られたアクリル樹脂D(BA30:BMA50:GMA20)の重量平均分子量は80000であり、ガラス転移温度は−4.2℃であった。また、吸水率は0.5%であった。
攪拌機、冷却管を備えた四つ口フラスコに、エチルアクリレート(EA)100g、アクリル酸10g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂aを得た。得られたアクリル樹脂a(EA100:Aac10)の重量平均分子量は95000であり、ガラス転移温度は−33℃であった。また、吸水率は1.5%であった。
攪拌機、冷却管を備えた四つ口フラスコに、メチルアクリレート(MA)70g、グリシジルメタクリレート(GMA)30g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂bを得た。得られたアクリル樹脂b(MA70:GMA30)の重量平均分子量は110000であり、ガラス転移温度は17℃であった。また、吸水率は1.7%であった。
攪拌機、冷却管を備えた四つ口フラスコに、エチルアクリレート70g、グリシジルメタクリレート(GMA)30g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂cを得た。得られたアクリル樹脂c(EA70:GMA30)の重量平均分子量は100000であり、ガラス転移温度は−6℃であった。また、吸水率は1.5%であった。
攪拌機、冷却管を備えた四つ口フラスコに、エチルアクリレート(EA)70g、グリシジルメタクリレート(GMA)25g、ヒドロキシエチルメタクリレレート5g、アゾビスブチロニトリル0.2g、酢酸エチル300g、及びアセトン5gを仕込み、撹拌しながら70℃で8時間重合反応させた。沈殿した粒子を濾取し、エタノールで洗浄し乾燥することによりアクリル樹脂dを得た。得られたアクリル樹脂d(EA70:GMA25:HEMA5)の重量平均分子量は120000であり、ガラス転移温度は−5℃であった。また、吸水率は1.5%であった。
表1に示す配合の成分を遊星型撹拌器で均一に混合することにより接着剤組成物を調製した。
実施例1〜4及び比較例1〜8で得られたペースト状の接着剤組成物について、以下に説明する様に、接着力、光学特性(フィルム外観、色差)、耐腐食性を評価した。
Cu配線部分にAuフラッシュメッキが施されたガラスエポキシ回路基板に、ペースト状の接着剤組成物を25μm厚となるように塗布し、その上に1.5mm角のICチップを載置し、フリップチップボンダーを使用し200℃で60秒間加熱することにより熱圧着して接続構造体を得た。得られた直後(初期)、リフロー後(260℃)、150℃で100時間放置後の接続構造体のICチップについて、ダイシェアーテスター(RTR−1100、レスカ社)を用いて接着強度(N/Chip)を測定した。得られた結果を表1に示す。本接着力試験の条件を前提にした場合には、実用上、接着力は5N/chip以上であることが望ましい。
接着剤組成物を熱プレス機で加熱加圧して硬化させ、75μm厚のフィルムを作成し、試料とした。得られた試料のフィルム外観を目視観察した。その後、ピーク温度260℃の鉛フリーハンダ対応リフロー炉を通し、JIS K7105に従って色差(ΔE*ab)を求めた。その後、熱エージング試験(150℃オーブン中に300時間投入)及び光エージング試験(30W/m2、380nmピーク波長光源、60℃、100時間(フェードメーター、スガ試験器(株)))を行い、試験前後の色差(ΔE*ab)を求めた。得られた結果を表1に示す。
銅パターンにAgメッキが施されたAgメッキ配線を有する2cm四方のガラスエポキシ基板の表面に、0.05gの接着剤組成物を塗布し、150℃のオーブンに1時間投入し、接着剤組成物を硬化させた。配線の端部の配線パッドに無鉛ハンダで配線を接続した。これを、85℃、85%RHの恒温恒湿チャンバーに投入し、50時間、電極間に20Vを印加し、その後、Agメッキ部分を目視観察し、以下の評価基準に従って接着剤組成物の耐腐食性を評価した。得られた結果を表1に示す。
A: Agメッキ配線の外観に変化が認められない場合
B: Agメッキ配線の外観に茶変色が認められる場合
C: Agメッキ配線にAgマイグレーションが発生した場合
Claims (8)
- 回路基板にチップ部品をフリップチップ実装するための接着剤組成物であって、脂環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂とを含有し、
脂環式酸無水物系硬化剤の含有量が、脂環式エポキシ化合物100質量部に対し80〜120質量部であり、該アクリル樹脂の含有量が、脂肪環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂との合計100質量部中に5〜50質量部であり、
該アクリル樹脂が、アルキル(メタ)アクリレートと、アルキル(メタ)アクリレート100質量部に対し2〜100質量部のグリシジルメタクリレートとを共重合させた吸水率1.2%以下の樹脂であることを特徴とする接着剤組成物。 - 該アクリル樹脂の重量平均分子量が5000〜200000であり且つガラス転移温度が50℃以下である請求項1又は2記載の接着剤組成物。
- 脂環式エポキシ化合物が、グリシジルヘキサヒドロビスフェノールA又は3,4−エポキシシクロヘキセニルメチル−3′,4′−エポキシシクロヘキセンカルボキシレートであり、脂環式酸無水物系硬化剤が、メチルヘキサヒドロフタル酸無水物である請求項1又は2記載の接着剤組成物。
- 該アルキル(メタ)アクリレートが、エチルアクリレート、ブチルアクリレート又は2−エチルヘキシルアクリレートである請求項1〜3のいずれかに記載の接着剤組成物。
- 脂肪環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂との合計100質量部に対し、0.01〜10質量部の熱酸化防止剤と、0.01〜10質量部の金属不活性剤と、0.01〜10質量部の紫外線吸収剤とを含有する請求項1〜4のいずれかに記載の接着剤組成物。
- 更に硬化促進剤として2−メチル−4−エチルイミダゾールを、脂肪環式エポキシ化合物と脂環式酸無水物系硬化剤とアクリル樹脂との合計100質量部に対し、0.01〜10質量部含有する請求項1〜5のいずれかに記載の接着剤組成物。
- 回路基板にチップ部品が請求項1〜6のいずれかに記載の接着剤組成物を用いてフリップチップ実装された接続構造体。
- チップ部品が、LED素子である請求項7記載の接続構造体。
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2009
- 2009-11-09 JP JP2009256187A patent/JP2011100927A/ja active Pending
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2010
- 2010-09-09 CN CN201080050472.8A patent/CN102598236B/zh not_active Expired - Fee Related
- 2010-09-09 WO PCT/JP2010/065474 patent/WO2011055588A1/ja active Application Filing
- 2010-09-09 US US13/496,367 patent/US20120168814A1/en not_active Abandoned
- 2010-09-09 KR KR1020117017758A patent/KR20120088530A/ko not_active Application Discontinuation
- 2010-09-09 EP EP10828148.6A patent/EP2500932B1/en active Active
- 2010-10-06 TW TW099133972A patent/TWI598372B/zh active
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Cited By (13)
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JPWO2011086680A1 (ja) * | 2010-01-15 | 2013-05-16 | デクセリアルズ株式会社 | 異方性導電接着剤 |
US8790547B2 (en) | 2010-01-15 | 2014-07-29 | Dexerials Corporation | Anisotropic conductive adhesive |
JP2011173951A (ja) * | 2010-02-23 | 2011-09-08 | Dic Corp | エポキシ樹脂組成物、その硬化物、光半導体封止用樹脂組成物、及び光半導体装置 |
WO2013153803A1 (ja) | 2012-04-10 | 2013-10-17 | 住友ベークライト株式会社 | 半導体装置、ダイアタッチ材料および半導体装置の製造方法 |
CN104221171A (zh) * | 2012-04-10 | 2014-12-17 | 住友电木株式会社 | 半导体装置、芯片粘合材料和半导体装置的制造方法 |
JP2017519849A (ja) * | 2014-04-24 | 2017-07-20 | スリーエム イノベイティブ プロパティズ カンパニー | 開裂型架橋剤を含む組成物及び方法 |
WO2019013333A1 (ja) * | 2017-07-14 | 2019-01-17 | 日立化成株式会社 | 導電性接着剤組成物及びこれを用いた接続構造体 |
JPWO2019013333A1 (ja) * | 2017-07-14 | 2020-07-27 | 日立化成株式会社 | 導電性接着剤組成物及びこれを用いた接続構造体 |
JP7212831B2 (ja) | 2017-07-14 | 2023-01-26 | 株式会社レゾナック | 導電性接着剤組成物及びこれを用いた接続構造体 |
WO2020162412A1 (ja) * | 2019-02-06 | 2020-08-13 | 日立化成株式会社 | フィルム状接着剤、接着シート、及び半導体装置 |
JP2020126982A (ja) * | 2019-02-06 | 2020-08-20 | 日立化成株式会社 | フィルム状接着剤及び接着シート |
JP2021008561A (ja) * | 2019-07-01 | 2021-01-28 | 東レ株式会社 | 電子機器用接着剤組成物 |
JP7298342B2 (ja) | 2019-07-01 | 2023-06-27 | 東レ株式会社 | 電子機器用接着剤組成物 |
Also Published As
Publication number | Publication date |
---|---|
EP2500932A4 (en) | 2015-10-28 |
EP2500932B1 (en) | 2016-11-09 |
CN102598236B (zh) | 2016-01-27 |
EP2500932A1 (en) | 2012-09-19 |
TW201130873A (en) | 2011-09-16 |
US20120168814A1 (en) | 2012-07-05 |
WO2011055588A1 (ja) | 2011-05-12 |
CN102598236A (zh) | 2012-07-18 |
KR20120088530A (ko) | 2012-08-08 |
TWI598372B (zh) | 2017-09-11 |
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