JP2011091187A - Electronic device - Google Patents

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JP2011091187A
JP2011091187A JP2009243047A JP2009243047A JP2011091187A JP 2011091187 A JP2011091187 A JP 2011091187A JP 2009243047 A JP2009243047 A JP 2009243047A JP 2009243047 A JP2009243047 A JP 2009243047A JP 2011091187 A JP2011091187 A JP 2011091187A
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frame member
light receiving
electronic device
curvature
radius
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Shunichi Matsuno
俊一 松野
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve an yield of an element without impairing a degree of freedom of a layout of the element as a whole. <P>SOLUTION: An electronic device has a light receiving element 101 having a light receiving section 101b comprising rectangles, and a frame member 102 which surrounds the light receiving section 101b on the light receiving element 101 to form an opening for exposing the light receiving section 101b. The inner periphery of the frame member 102 is a curve in a plan view. The curvature radius of the inner periphery of the frame member 102 opposed to the long side of the light receiving section 101b is larger than the curvature radius of the inner periphery of the frame member 102 opposed to the short side of the light receiving section 101b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、電子装置に関する。   The present invention relates to an electronic device.

受光素子を有する電子装置としては、例えば特許文献１、２に記載のものがある。図１２は、特許文献１に記載された固体撮像装置を示す断面図である。図１２に示すように、特許文献１における固体撮像装置は、固体撮像素子チップ８１と、固体撮像素子チップ８１上に接着剤８５により接着された受光部（図示なし）のみに穴空き部８３を有するエボキシ系樹脂シート８４と、エボキシ系樹脂シート８４上に接着剤８５により接着された平板部となる透明部材８６と、を備えている。固体撮像素子チップ８１は、パッケージ又は基板８１０にダイボンドされ、ボンディングワイヤ８１１を用いて固体撮像素子チップ８１のパッド部８１ａとパッケージ又は基板８１０との所定の接続を行って実装され、気密封止部以外のボンディングワイヤ接続部を含む周辺部を、封止樹脂８１２により樹脂封止されている。また、透明部材８６は、受光部の保護膜として機能している。   Examples of electronic devices having a light receiving element include those described in Patent Documents 1 and 2. FIG. 12 is a cross-sectional view showing the solid-state imaging device described in Patent Document 1. As shown in FIG. 12, the solid-state imaging device disclosed in Patent Document 1 includes a solid-state imaging device chip 81 and a perforated portion 83 only in a light receiving unit (not shown) bonded to the solid-state imaging device chip 81 with an adhesive 85. And an epoxy resin sheet 84 and a transparent member 86 serving as a flat plate bonded on the epoxy resin sheet 84 with an adhesive 85. The solid-state image pickup device chip 81 is die-bonded to a package or substrate 810, and is mounted by making a predetermined connection between the pad portion 81a of the solid-state image pickup device chip 81 and the package or substrate 810 using a bonding wire 811. The peripheral part including the bonding wire connecting part other than the above is sealed with a sealing resin 812. The transparent member 86 functions as a protective film for the light receiving part.

図１３は、特許文献２に記載された電子装置を示す。図１３（ａ）は、特許文献２における電子装置を示す斜視図である。図１３（ｂ）は、図１３（ａ）中のＩ−'Ｉで切断した電子装置を示す断面図である。特許文献１の電子装置とは異なり、特許文献２の電子装置は、受光素子９０１上に形成された枠材９０２の上面と、封止樹脂層９０６の上面と、が同一平面をなす構造を有している。これにより、枠材９０２の上面と、封止樹脂層９０６の上面とを覆う保護テープ（図示せず）の接着および除去を容易にでき、受光部９０１ｂの汚染が低減できると記載されている。また、電子装置の使用時には、露出した受光部９０１ｂの光路上にある保護テープを容易に排除できるので、光信号の減衰を防止できると記載されている。   FIG. 13 shows an electronic device described in Patent Document 2. FIG. 13A is a perspective view showing an electronic device in Patent Document 2. FIG. FIG. 13B is a cross-sectional view showing the electronic device cut along I-′I in FIG. Unlike the electronic device of Patent Document 1, the electronic device of Patent Document 2 has a structure in which the upper surface of the frame member 902 formed on the light receiving element 901 and the upper surface of the sealing resin layer 906 are in the same plane. is doing. This describes that adhesion and removal of a protective tape (not shown) covering the upper surface of the frame member 902 and the upper surface of the sealing resin layer 906 can be facilitated and contamination of the light receiving portion 901b can be reduced. Further, it is described that when the electronic device is used, the protective tape on the optical path of the exposed light receiving portion 901b can be easily removed, so that attenuation of the optical signal can be prevented.

特開２００１−２５７３３４号公報JP 2001-257334 A 特開２００９−５４９７９号公報JP 2009-54979 A

しかしながら、上記文献記載の技術によれば、エポキシ系樹脂シート等の枠材は、封止樹脂の流入圧力により変形してしまうという問題がある。そのため、所望の枠材の形状を維持できず、受光部によって覆われてしまう。これにより、素子の歩留まりが低下する。   However, according to the technique described in the above document, there is a problem that the frame material such as the epoxy resin sheet is deformed by the inflow pressure of the sealing resin. Therefore, the desired shape of the frame material cannot be maintained and is covered by the light receiving unit. Thereby, the yield of an element falls.

また、素子を小型化させるため、枠材の形状及び配置は、受光部の形状やパッドの配置等により一定の制限を受ける。したがって、かかる制限の下、枠材の変形を少なくする必要がある。   Further, in order to reduce the size of the element, the shape and arrangement of the frame member are subject to certain restrictions depending on the shape of the light receiving portion, the arrangement of the pads, and the like. Therefore, it is necessary to reduce the deformation of the frame material under such restrictions.

本発明によれば、
第一の辺と、前記第一の辺の一端と隣接し、前記第一の辺よりも長い第二の辺とを含む多角形状をなす機能部を有する素子と、
前記素子上で前記機能部を囲み、前記機能部を露出させる開口を形成する枠材と、
を有し、
平面視において前記枠材の内周は曲線となっており、
前記第二の辺に対向する前記枠材の内周の曲率半径が前記第一の辺に対向する前記枠材の内周の曲率半径よりも大きい、電子装置
が提供される。 According to the present invention,
An element having a functional part having a polygonal shape including a first side and a second side that is adjacent to one end of the first side and is longer than the first side;
A frame material that surrounds the functional portion on the element and forms an opening that exposes the functional portion;
Have
In plan view, the inner circumference of the frame material is a curve,
An electronic device is provided in which the radius of curvature of the inner periphery of the frame member facing the second side is larger than the radius of curvature of the inner periphery of the frame member facing the first side.

この発明によれば、平面視において枠材の内周は曲線となっている。これにより、封止樹脂の流入圧力を分散しやすくなり、局所に集中する応力を低減することができる。また、機能部の長い辺（第二の辺）に対向する枠材の内周の曲率半径は、機能部の短い辺（第一の辺）に対向する枠材の内周の曲率半径よりも大きい。これにより、封止樹脂の流入により機能部の各辺の中心に対向する位置で集中する応力を、辺の長さに応じて緩和することができる。さらに、枠材の内周の形状で封入圧力に対する応力緩和を制御できるため、枠材の外周にあるパッドの配置に影響されず、かつ、機能部の形状も多角形状という範囲内で自由に設計することができる。したがって、素子全体のレイアウトの自由度を損ねることなく、枠材の変形を小さくして、素子の歩留まりを向上させることが可能になる。   According to this invention, the inner periphery of the frame member is a curve in plan view. Thereby, the inflow pressure of the sealing resin can be easily dispersed, and the stress concentrated locally can be reduced. Further, the radius of curvature of the inner periphery of the frame member facing the long side (second side) of the functional part is larger than the radius of curvature of the inner periphery of the frame member facing the short side (first side) of the functional part. large. Thereby, the stress which concentrates in the position which opposes the center of each side of a function part by inflow of sealing resin can be relieve | moderated according to the length of a side. Furthermore, since the stress relaxation against the sealing pressure can be controlled by the shape of the inner periphery of the frame material, it is not affected by the arrangement of the pads on the outer periphery of the frame material, and the shape of the functional part can be designed freely within the range of polygonal shape. can do. Therefore, it is possible to reduce the deformation of the frame material and improve the yield of the elements without impairing the layout freedom of the entire element.

本発明によれば、素子全体のレイアウトの自由度を損ねることなく、素子の歩留まりを向上させることができる。   According to the present invention, the yield of elements can be improved without impairing the flexibility of layout of the entire element.

実施の形態に係る電子装置を示す平面図である。It is a top view which shows the electronic device which concerns on embodiment. 実施の形態に係る電子装置を示す斜視図である。It is a perspective view which shows the electronic device which concerns on embodiment. 実施の形態に係る電子装置の製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the electronic device which concerns on embodiment. 実施の形態に係る電子装置の製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the electronic device which concerns on embodiment. 実施の形態に係る電子装置の製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the electronic device which concerns on embodiment. 実施の形態に係る電子装置の製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the electronic device which concerns on embodiment. 変形例に係る電子装置を示す平面図である。It is a top view which shows the electronic device which concerns on a modification. 実施例の結果を示すグラフである。It is a graph which shows the result of an Example. 従来の電子装置を示す平面図である。It is a top view which shows the conventional electronic device. 従来の電子装置を示す平面図である。It is a top view which shows the conventional electronic device. 従来の電子装置を示す平面図である。It is a top view which shows the conventional electronic device. 従来の電子装置を示す断面図である。It is sectional drawing which shows the conventional electronic device. 従来の電子装置を示す図である。（ａ）は、従来の電子装置を示す斜視図である。（ｂ）は、（ａ）のＩ−'Ｉ断面図である。It is a figure which shows the conventional electronic device. (A) is a perspective view which shows the conventional electronic device. (B) is I-'I sectional drawing of (a).

以下、本発明の実施の形態について、図面を用いて説明する。尚、すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, similar constituent elements are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

図１は、本実施形態の電子装置１０８を示す図である。図１（ａ）は、本実施形態の電子装置１０８の平面図である。この電子装置１０８は、長方形からなる受光部１０１ｂ（機能部）を有する受光素子１０１と、受光素子１０１上で受光部１０１ｂを囲み、受光部１０１ｂを露出させる開口を形成する枠材１０２と、を有する。平面視において枠材１０２の内周は曲線となっている。受光部１０１ｂの長辺（第二の辺）に対向する枠材１０２の内周の曲率半径が受光部１０１ｂの短辺（第一の辺）に対向する枠材１０２の内周の曲率半径よりも大きい。   FIG. 1 is a diagram illustrating an electronic device 108 according to the present embodiment. FIG. 1A is a plan view of the electronic device 108 of the present embodiment. The electronic device 108 includes a light receiving element 101 having a rectangular light receiving part 101b (functional part), and a frame member 102 that surrounds the light receiving part 101b on the light receiving element 101 and forms an opening exposing the light receiving part 101b. Have. The inner periphery of the frame member 102 is a curve in plan view. The radius of curvature of the inner periphery of the frame member 102 facing the long side (second side) of the light receiving unit 101b is larger than the radius of curvature of the inner periphery of the frame member 102 facing the short side (first side) of the light receiving unit 101b. Is also big.

図２（ａ）、（ｂ）は、本実施形態の電子装置１０８の斜視図である。受光素子１０１は、金属細線１０５を介してリードフレーム１０４と電気的に接続されている。図２（ｂ）で示すように、枠材１０２の周囲は、封止樹脂層１０６（樹脂層）で埋められる。図１及び図２（ａ）では、本実施形態の説明を容易にするため、封止樹脂層１０６は省略している。枠材１０２の上面と、封止樹脂層１０６の上面とがなす平面は、保護膜（図示せず）で覆われている。   2A and 2B are perspective views of the electronic device 108 of the present embodiment. The light receiving element 101 is electrically connected to the lead frame 104 through a thin metal wire 105. As shown in FIG. 2B, the periphery of the frame member 102 is filled with a sealing resin layer 106 (resin layer). In FIG. 1 and FIG. 2A, the sealing resin layer 106 is omitted for easy explanation of the present embodiment. A plane formed by the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 is covered with a protective film (not shown).

枠材１０２は、光、及び、熱により硬化可能な樹脂を硬化させたものである。光、及び、熱により硬化可能な樹脂とは、アクリル系樹脂などの光反応性樹脂と、エポキシ樹脂などの熱硬化性樹脂とを含む樹脂である。   The frame member 102 is obtained by curing a resin that can be cured by light and heat. The resin curable by light and heat is a resin containing a photoreactive resin such as an acrylic resin and a thermosetting resin such as an epoxy resin.

枠材１０２の弾性率は、２０℃で１ＧＰａ以上６ＧＰａ以下、かつ２００℃で１０ＭＰａ以上３ＧＰａ以下が好ましい。２０℃で１ＧＰａ以上６ＧＰａ以下とすることにより、受光部１０１ｂを保護する枠材１０２として機能できる。また、２００℃で１０ＭＰａ以上３ＧＰａ以下とすることにより、後述の製造過程における封止用金型１１１ａ、１１１ｂによる圧接時（図５（ａ））に、枠材１０２がわずかに弾性変形して緩衝材として機能する。これにより、受光部１０１ｂを外圧から保護できる。なお、枠材１０２の弾性率とは、枠材を構成する樹脂が光および熱により完全に硬化した状態の弾性率をいう。   The elastic modulus of the frame member 102 is preferably 1 GPa to 6 GPa at 20 ° C. and 10 MPa to 3 GPa at 200 ° C. By setting it to 1 GPa or more and 6 GPa or less at 20 ° C., it can function as a frame member 102 that protects the light receiving portion 101b. Further, by setting the pressure at 200 ° C. to 10 MPa or more and 3 GPa or less, the frame material 102 is slightly elastically deformed and buffered at the time of pressure contact with the sealing molds 111a and 111b in the manufacturing process described later (FIG. 5A). Functions as a material. Thereby, the light-receiving part 101b can be protected from external pressure. The elastic modulus of the frame member 102 refers to an elastic modulus in a state where the resin constituting the frame member is completely cured by light and heat.

枠材１０２は、受光部１０１ｂをなす辺の長さに応じて内周の曲率半径を設計する。すなわち、前述のように、受光部１０１ｂの長辺に対向する枠材１０２の内周の曲率半径は、受光部１０１ｂの短辺に対向する枠材１０２の内周の曲率半径よりも大きくする。こうすることで、枠材１０２の内周は、受光部１０１ｂのコーナーに対向する位置を支点としたアーチ形状となる。このアーチ形状は、各辺の中心で線対称であるため、枠材１０２と受光部１０１ｂとの間の距離が各辺の中心で最大となる。このとき、各辺の曲率半径は、対向する受光部１０１ｂの辺の中央における幅の０．１８倍以上とすると望ましい。   The frame member 102 designs the radius of curvature of the inner periphery according to the length of the side forming the light receiving portion 101b. That is, as described above, the radius of curvature of the inner periphery of the frame member 102 facing the long side of the light receiving unit 101b is made larger than the radius of curvature of the inner periphery of the frame member 102 facing the short side of the light receiving unit 101b. By doing so, the inner periphery of the frame member 102 has an arch shape with the position facing the corner of the light receiving unit 101b as a fulcrum. Since this arch shape is line symmetric at the center of each side, the distance between the frame member 102 and the light receiving portion 101b is maximized at the center of each side. At this time, it is desirable that the radius of curvature of each side is 0.18 times or more the width at the center of the side of the opposing light receiving unit 101b.

また、図１（ａ）で示すように、受光部１０１ｂの長辺に対向する枠材１０２の外周の曲率半径は、短辺に対向する枠材１０２の外周の曲率半径よりも大きくしてもよい。枠材１０２の外周もまた、受光部１０１ｂのコーナーに対向する位置を支点としたアーチ形状となるようにする。このアーチ形状も、各辺の中心で線対称である。この場合、受光部１０１の各辺の中心に対向する枠材１０２の幅が、受光部１０１０のコーナーに対向する枠材１０２の幅の１．２倍以上にするとよい。ただし、枠材１０２の外周の曲率半径は、枠材１０２が受光素子１０１内に収まるように設計する。   Further, as shown in FIG. 1A, the radius of curvature of the outer periphery of the frame member 102 facing the long side of the light receiving portion 101b may be larger than the radius of curvature of the outer periphery of the frame member 102 facing the short side. Good. The outer periphery of the frame member 102 also has an arch shape with a position facing the corner of the light receiving unit 101b as a fulcrum. This arch shape is also line symmetric at the center of each side. In this case, the width of the frame member 102 that faces the center of each side of the light receiving unit 101 may be 1.2 times or more the width of the frame member 102 that faces the corner of the light receiving unit 1010. However, the curvature radius of the outer periphery of the frame member 102 is designed so that the frame member 102 can be accommodated in the light receiving element 101.

また、受光素子１０１上にはボンディングパッド１１２が配置される。そのため、外周の曲率半径は、ボンディングパッド１１２のレイアウトの妨げにならない範囲で大きくする。したがって、受光部１０１ｂの短辺に対向する枠材１０２の内周の曲率半径と、この内周を構成する枠材１０２の外周の曲率半径とを互いに異なるようにしてもよい。同様に、長辺に対向する枠材１０２の内周の曲率半径と、この内周を構成する枠材１０２の外周の曲率半径とを互いに異ならせてもよい。   A bonding pad 112 is disposed on the light receiving element 101. Therefore, the radius of curvature of the outer periphery is increased within a range that does not hinder the layout of the bonding pad 112. Therefore, the radius of curvature of the inner periphery of the frame member 102 facing the short side of the light receiving unit 101b may be different from the radius of curvature of the outer periphery of the frame member 102 constituting the inner periphery. Similarly, the radius of curvature of the inner periphery of the frame member 102 facing the long side may be different from the radius of curvature of the outer periphery of the frame member 102 constituting the inner periphery.

たとえば、図１（ａ）では、受光部１０１ｂの長辺に対向する枠材１０２の内周の曲率半径が、この内周を構成する枠材１０２の外周の曲率半径よりも大きくなっている。こうすることで、受光素子１０１上にボンディングパッド１１２を配置できるスペースを確保することができる。また、図１（ａ）では、受光部１０１ｂの短辺に対向する枠材１０２の内周の曲率半径は、この内周を構成する枠材１０２の外周の曲率半径よりも大きくなっている。こうすることで、枠材１０２が受光素子１０１からはみ出てしまうのを防ぐことができる。また、この例では、受光素子１０１の短辺の中心に対向する位置における枠材１０２の幅は、長辺の中心に対向する位置における枠材１０２の幅よりも大きくなっている。こうすることで、受光素子１０１の長手方向にボンディングパッド１１２を配列させることができる。   For example, in FIG. 1A, the radius of curvature of the inner periphery of the frame member 102 facing the long side of the light receiving portion 101b is larger than the radius of curvature of the outer periphery of the frame member 102 constituting the inner periphery. By doing so, a space in which the bonding pad 112 can be arranged on the light receiving element 101 can be secured. In FIG. 1A, the radius of curvature of the inner periphery of the frame member 102 facing the short side of the light receiving portion 101b is larger than the radius of curvature of the outer periphery of the frame member 102 constituting the inner periphery. By doing so, it is possible to prevent the frame member 102 from protruding from the light receiving element 101. In this example, the width of the frame member 102 at the position facing the center of the short side of the light receiving element 101 is larger than the width of the frame member 102 at the position facing the center of the long side. By doing so, the bonding pads 112 can be arranged in the longitudinal direction of the light receiving element 101.

封止樹脂層１０６には、一般的な封止樹脂を用いることができ、具体的には、エポキシ樹脂を主成分に、シリカ充填材等を加えた熱硬化性樹脂とする。   A general sealing resin can be used for the sealing resin layer 106. Specifically, a thermosetting resin in which an epoxy resin is a main component and a silica filler or the like is added is used.

つづいて、図３乃至図６を参照しつつ、本実施形態の電子装置の製造方法について説明する。図３乃至図６は、本実施形態の電子装置の製造工程を示す断面図である。   Next, a method for manufacturing the electronic device of this embodiment will be described with reference to FIGS. 3 to 6 are cross-sectional views showing the manufacturing process of the electronic device of this embodiment.

まず、図３（ａ）に示すように、ウエハ１０１ａを準備する。このウエハ１０１ａは複数の受光素子１０１が形成され、夫々の受光素子１０１の表面には受光部１０１ｂが露出している。なお、図３（ａ）では、ウエハ１０１ａに配置された受光素子１０１のうち、２つのみを示しており、２つの受光部１０１ｂが露出している。   First, as shown in FIG. 3A, a wafer 101a is prepared. A plurality of light receiving elements 101 are formed on the wafer 101a, and a light receiving portion 101b is exposed on the surface of each light receiving element 101. In FIG. 3A, only two of the light receiving elements 101 arranged on the wafer 101a are shown, and the two light receiving portions 101b are exposed.

次に、図３（ｂ）に示すように、ウエハ１０１ａ上に、樹脂膜１０２ａを形成する。ここでは、樹脂膜１０２ａは、均一な厚みを持つフィルムである。これにより、ウエハ１０１ａ全体に均一なかつ０．０５ｍｍ以上の膜厚の樹脂膜１０２ａを形成し、樹脂膜１０２ａによりウエハ１０１ａ全体を被覆する。たとえば、樹脂膜１０２ａの厚さを０．０８ｍｍとしたとき、高さが０．０８ｍｍの枠材１０２が得られる。   Next, as shown in FIG. 3B, a resin film 102a is formed on the wafer 101a. Here, the resin film 102a is a film having a uniform thickness. As a result, a uniform resin film 102a having a thickness of 0.05 mm or more is formed on the entire wafer 101a, and the entire wafer 101a is covered with the resin film 102a. For example, when the thickness of the resin film 102a is 0.08 mm, the frame member 102 having a height of 0.08 mm is obtained.

続いて、図３（ｃ）に示すように、受光部１０１ｂが露光用マスク１０３の上面に形成された筒状部の内径に収まるように位置合せをして、露光を行い、枠材１０２を形成するように樹脂膜１０２ａをパターニングする。露光用マスク１０３は、図１（ａ）に示すような形状が形成されるように設計されている。   Subsequently, as shown in FIG. 3C, alignment is performed so that the light receiving portion 101b is within the inner diameter of the cylindrical portion formed on the upper surface of the exposure mask 103, exposure is performed, and the frame member 102 is removed. The resin film 102a is patterned so as to be formed. The exposure mask 103 is designed so as to form a shape as shown in FIG.

さらに、図３（ｄ）に示すように、現像処理を行い、枠材１０２以外の樹脂膜１０２ａを除去し、受光部１０１ｂをそれぞれ囲むように立設した枠材１０２が形成される。こうすることで、受光部１０１ｂに対する封止樹脂層１０６の接触を完全に排除し、封止樹脂層１０６が枠材１０２の内部に残留するのを防止できる。なお、この現像処理後の時点では、枠材１０２は完全に硬化していないため、枠材１０２とウエハ１０１ａ、すなわち枠材１０２と受光素子１０１とは、弱い接合力で接着しているが、強固に接着はしていない。   Further, as shown in FIG. 3D, development processing is performed, the resin film 102a other than the frame material 102 is removed, and the frame material 102 erected so as to surround the light receiving portion 101b is formed. By doing so, the contact of the sealing resin layer 106 with the light receiving portion 101 b can be completely eliminated, and the sealing resin layer 106 can be prevented from remaining inside the frame member 102. Since the frame member 102 is not completely cured at the time after the development processing, the frame member 102 and the wafer 101a, that is, the frame member 102 and the light receiving element 101 are bonded with a weak bonding force. It is not firmly bonded.

つづいて、枠材１０２が形成されたウエハ１０１ａを熱処理し、枠材１０２を完全硬化させ、枠材１０２とウエハ１０１ａ、すなわち枠材１０２と受光素子１０１の間を強固に接着させる。この熱処理による枠材１０２の形状的な変化は無いため、枠材１０２の形状は図３（ｄ）に示された枠材１０２の形状と同様である。   Subsequently, the wafer 101a on which the frame member 102 is formed is heat-treated to completely cure the frame member 102, and the frame member 102 and the wafer 101a, that is, the frame member 102 and the light receiving element 101 are firmly bonded. Since there is no change in the shape of the frame member 102 due to this heat treatment, the shape of the frame member 102 is the same as the shape of the frame member 102 shown in FIG.

次いで、図４（ａ）に示すように、ウエハ１０１ａから個々の受光素子１０１を切り出して、枠材１０２を有する受光素子１０１を得る。こうすることで、図１（ａ）に示すような形状からなる枠材１０２が形成される。また、図２（ａ）に示すように、受光部１０１ｂの上方は枠材１０２の内側の空洞部となっているため、受光部１０１ｂは受光素子１０１の表面に露出している。ここで、枠材１０２の弾性率は、２０℃で約２．４ＧＰａ、２００℃で約１５ＭＰａに調整されている。枠材１０２の弾性率は、光および熱で硬化可能な樹脂の種類や硬化剤など含有物の組成比の変更、または硬化光量や硬化温度などの製造条件を適宜設定すること等により、適宜調整できる。   Next, as shown in FIG. 4A, individual light receiving elements 101 are cut out from the wafer 101 a to obtain the light receiving elements 101 having the frame material 102. By doing so, a frame member 102 having a shape as shown in FIG. 1A is formed. Further, as shown in FIG. 2A, the light receiving portion 101 b is exposed on the surface of the light receiving element 101 because the upper portion of the light receiving portion 101 b is a hollow portion inside the frame member 102. Here, the elastic modulus of the frame member 102 is adjusted to about 2.4 GPa at 20 ° C. and about 15 MPa at 200 ° C. The elastic modulus of the frame member 102 is appropriately adjusted by changing the composition ratio of the content such as the type of resin curable with light and heat and the curing agent, or appropriately setting the production conditions such as the amount of curing light and the curing temperature. it can.

次いで、図４（ｂ）に示すように、受光素子１０１をリードフレーム１０４上の所定の位置に接着剤を介して接着させる。続いて、図４（ｃ）に示すように、受光素子１０１とリードフレーム１０４のそれぞれの所定の位置を、金属細線１０５を介して、電気的に接続させる。   Next, as shown in FIG. 4B, the light receiving element 101 is bonded to a predetermined position on the lead frame 104 with an adhesive. Subsequently, as shown in FIG. 4C, predetermined positions of the light receiving element 101 and the lead frame 104 are electrically connected through the fine metal wire 105.

次いで、図５（ａ）に示すように、平坦な面を成型面とする封止用金型１１１ａ，１１１ｂを用意し、図４（ｂ）に示されたリードフレーム１０４上の受光素子１０１を、封止用金型１１１ａ，１１１ｂの所定の位置に固定する。続いて、枠材１０２の上面に封止用金型１１１ａの成型面を、リードフレーム１０４の下面に封止用金型１１１ｂの成型面を、それぞれ圧接する。すなわち、枠材１０２の上面と封止用金型１１１ａの成型面とのすき間、およびリードフレーム１０４の下面と封止用金型１１１ｂの成型面とのすき間を最小限におさえ、両者をそれぞれ密着する。   Next, as shown in FIG. 5A, sealing molds 111a and 111b having a flat surface as a molding surface are prepared, and the light receiving element 101 on the lead frame 104 shown in FIG. Then, the sealing molds 111a and 111b are fixed at predetermined positions. Subsequently, the molding surface of the sealing mold 111 a is pressed against the upper surface of the frame member 102, and the molding surface of the sealing mold 111 b is pressed against the lower surface of the lead frame 104. That is, the gap between the upper surface of the frame member 102 and the molding surface of the sealing mold 111a and the gap between the lower surface of the lead frame 104 and the molding surface of the sealing mold 111b are minimized, and the two are in close contact with each other. To do.

次いで、圧接された状態のまま、熱によって溶融した封止樹脂を注入する。封止樹脂は、封止用金型１１１ａ，１１１ｂのそれぞれの成型面に囲まれた空隙部分のうち、枠材１０２に囲まれた空間を除く空隙部分に注入される。この時の注入圧力は、高い方が好ましいが、枠材１０２の耐力があるため、枠材１０２の弾性率に応じて上限を設定することができる。たとえば、枠材１０２の弾性率が２０℃で１ＧＰａ〜６ＧＰａ、かつ２００℃で１０ＭＰａ〜３ＧＰａである場合、封入樹脂の圧力は、６０ｋｇ／ｃｍ２〜１２０ｋｇ／ｃｍ２とすると好ましい。この時、受光部１０１ｂの上方には、枠材１０２と封止用金型１１１ａとで囲まれた閉空間が形成されている。さらに、封止用金型１１１ａの成型面と枠材１０２の上面と間は挟圧による外力で強固に密着され、かつ受光素子１０１と枠材１０２の間は前述の通り強く接着されている。枠材１０２は、２０℃で１ＧＰａ以上６ＧＰａ以下、かつ２００℃で１０ＭＰａ以上３ＧＰａ以下の弾性率であれば、封止用金型による挟圧により枠材１０２自身が弾性変形し、この挟圧による外力を吸収して受光素子１０１を保護することが出来る。こうすることで、枠材１０２の周囲を埋める封止樹脂層１０６を形成する。 Next, the sealing resin melted by heat is injected while keeping the pressure contact state. The sealing resin is injected into a void portion excluding the space surrounded by the frame member 102 among the void portions surrounded by the molding surfaces of the sealing molds 111a and 111b. The injection pressure at this time is preferably high, but the upper limit can be set according to the elastic modulus of the frame member 102 because the frame member 102 has the yield strength. For example, if the elastic modulus of the frame member 102 is 10MPa~3GPa in 1GPa～6GPa, and 200 ° C. at 20 ° C., a pressure of the encapsulating resin, when 60kg / cm 2 ~120kg / cm 2 preferably. At this time, a closed space surrounded by the frame member 102 and the sealing mold 111a is formed above the light receiving portion 101b. Further, the molding surface of the sealing mold 111a and the upper surface of the frame member 102 are firmly adhered to each other by an external force caused by clamping pressure, and the light receiving element 101 and the frame member 102 are strongly adhered as described above. If the elastic modulus of the frame material 102 is 1 GPa or more and 6 GPa or less at 20 ° C. and 10 MPa or more and 3 GPa or less at 200 ° C., the frame material 102 itself is elastically deformed by the clamping pressure by the sealing mold, and this clamping pressure causes The light receiving element 101 can be protected by absorbing external force. By doing so, the sealing resin layer 106 filling the periphery of the frame member 102 is formed.

次いで、封止用金型１１１ａ，１１１ｂを取り外して、図５（ｂ）に示すような枠材１０２の上面と封止樹脂層１０６の上面とが同じ高さに形成された受光素子１０１を得る。すなわち、リードフレーム１０４上の複数の受光素子１０１が一括して封止される。   Next, the sealing molds 111a and 111b are removed to obtain the light receiving element 101 in which the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 are formed at the same height as shown in FIG. . That is, the plurality of light receiving elements 101 on the lead frame 104 are collectively sealed.

次いで、図６（ａ）に示すように、枠材１０２の上面および封止樹脂層１０６の上面を覆う保護テープ１０７を形成する。保護テープ１０７は、受光部１０１ｂを保護する機能を有する。保護テープ１０７としては、特に限定されないが、リフロー温度以上の耐熱性のある剥離可能な樹脂を用いることができる。   Next, as shown in FIG. 6A, a protective tape 107 that covers the upper surface of the frame member 102 and the upper surface of the sealing resin layer 106 is formed. The protective tape 107 has a function of protecting the light receiving unit 101b. The protective tape 107 is not particularly limited, but a peelable resin having a heat resistance equal to or higher than the reflow temperature can be used.

続いて、図６（ｂ）に示すように、受光素子１０１ごとに分割し、所望の形状の電子装置１０８を得る。   Subsequently, as shown in FIG. 6B, the light receiving element 101 is divided to obtain the electronic device 108 having a desired shape.

続いて、電子装置１０８は、必要な電気回路が形成された実装基板１０９上に半田１１０リフロー工法で接続される。その後、保護テープ１０７が除去され、図６（ｃ）に示すように、実装された電子装置が得られる。   Subsequently, the electronic device 108 is connected to the mounting substrate 109 on which a necessary electric circuit is formed by a solder 110 reflow method. Thereafter, the protective tape 107 is removed, and the mounted electronic device is obtained as shown in FIG.

なお、この明細書でいう電子装置とは、半導体基板やガラス基板の表面に、受動素子または能動素子の一方または両方が形成されたものをいう。この電子装置として、たとえば、ＤＶＤ（Ｄｉｇｉｔａｌ Ｖｅｒｓａｔｉｌｅ Ｄｉｓｃ）ドライブなどが挙げられる。   Note that the electronic device in this specification refers to an electronic device in which one or both of a passive element and an active element are formed on the surface of a semiconductor substrate or a glass substrate. Examples of the electronic device include a DVD (Digital Versatile Disc) drive.

つづいて、本実施形態の効果について説明する。本実施形態の電気装置によれば、平面視において枠材１０２の内周は曲線となっている。これにより、封止樹脂の流入圧力を分散しやすくなり、局所に集中する応力を低減することができる。また、受光部１０１ｂの長辺に対向する枠材１０２の内周の曲率半径は、受光部１０１ｂの短辺に対向する枠材１０２の内周の曲率半径よりも大きい。これにより、封止樹脂の流入により受光部１０１ｂの各辺の中心に対向する位置で集中する応力を、辺の長さに応じて緩和することができる。また、枠材１０２の内周の形状で封入圧力に対する応力緩和を制御できるため、枠材１０２の外周にあるボンディングパッド１１２の配置に影響されず、かつ、枠材１０２の形状を受光部１０１と枠材１０２との間の領域に対応させて設計することができる。したがって、受光素子１０１全体のレイアウトの自由度を損ねることなく、枠材１０２の変形を小さくして、素子の歩留まりを向上させることが可能になる。   Next, the effect of this embodiment will be described. According to the electric device of the present embodiment, the inner periphery of the frame member 102 is a curve in plan view. Thereby, the inflow pressure of the sealing resin can be easily dispersed, and the stress concentrated locally can be reduced. Further, the radius of curvature of the inner periphery of the frame member 102 facing the long side of the light receiving unit 101b is larger than the radius of curvature of the inner periphery of the frame member 102 facing the short side of the light receiving unit 101b. Thereby, the stress which concentrates in the position which opposes the center of each side of the light-receiving part 101b by inflow of sealing resin can be relieve | moderated according to the length of a side. Further, since the stress relaxation with respect to the sealing pressure can be controlled by the shape of the inner periphery of the frame member 102, the shape of the frame member 102 is not affected by the arrangement of the bonding pads 112 on the outer periphery of the frame member 102 and the light receiving unit 101. It can be designed corresponding to the area between the frame material 102. Therefore, it is possible to reduce the deformation of the frame member 102 and improve the yield of the element without impairing the degree of freedom of the layout of the entire light receiving element 101.

枠材１０２は、受光部１０１ｂを露出させると共に、封止樹脂層１０６に対する枠材として機能する。そのため、封止樹脂の流入圧力に十分耐える強度が必要になる。従来、長方形の受光部を囲む枠材としては、たとえば、図９（ａ）、図１０（ａ）の形状が考えられる。このような形状からなる枠材の場合、封入樹脂の流入圧力を受けることで、曲率が小さい部分に応力が集中し、大きな変形が発生する。たとえば、図９（ａ）で示す枠材５０２の例では、封止樹脂の注入前の形状Ｉが封止樹脂の注入後には、形状ＩＩとなる。この変形は、長辺の中心に対向する位置で最大となり、その変形量は、内周形状の変形量Ｘで示される（図９（ｂ））。また、図１０（ａ）で示す枠材６０２の例では、封止樹脂の注入前の形状Ｉが封止樹脂の注入後には、形状ＩＩとなる。この変形もまた、長辺の中心に対向する位置で最大となり、その変形量は、Ｘで示される（図１０（ｂ））。このような変形により、枠材１０２を設計どおりの形状に作製することができなくなる。封入圧力の増大により、枠材の変形量Ｘは増大し、変形が顕著になると、受光部１０１ｂを露出できなくなるなど不具合が発生する。   The frame member 102 functions as a frame member for the sealing resin layer 106 while exposing the light receiving portion 101b. Therefore, the strength that can sufficiently withstand the inflow pressure of the sealing resin is required. Conventionally, as a frame member surrounding a rectangular light receiving portion, for example, the shapes shown in FIGS. 9A and 10A are conceivable. In the case of a frame material having such a shape, stress is concentrated on a portion having a small curvature due to the inflow pressure of the encapsulating resin, and large deformation occurs. For example, in the example of the frame member 502 shown in FIG. 9A, the shape I before the sealing resin is injected becomes the shape II after the sealing resin is injected. This deformation becomes maximum at a position facing the center of the long side, and the deformation amount is indicated by the deformation amount X of the inner peripheral shape (FIG. 9B). In the example of the frame member 602 shown in FIG. 10A, the shape I before the sealing resin is injected becomes the shape II after the sealing resin is injected. This deformation is also maximized at a position facing the center of the long side, and the amount of deformation is indicated by X (FIG. 10B). Due to such deformation, the frame member 102 cannot be produced in the shape as designed. Due to the increase in the sealing pressure, the deformation amount X of the frame material increases, and if the deformation becomes significant, problems such as the inability to expose the light receiving portion 101b occur.

一方、本実施形態の電子装置では、枠材１０２の内周を受光部１０１ｂのコーナーに対向する位置を支点とし、受光部１０１ｂの辺中心に対向する位置で線対称となる、外側に凸のアーチ形状とする。こうすることで、枠材の内側に発生する応力は圧縮方向となり、受光部１０１ｂの辺中心に対向する位置で最大となる変形モーメントに抗することができる。したがって、変形を大きく抑制して、より強固に枠材の内側の形状を保つことができる。また、本実施形態の電子装置では、枠材１０２の外周も、受光部１０１ｂのコーナーに対向する位置を支点とし、受光部１０１ｂの辺中心に対向する位置で線対称となる、外側に凸のアーチ形状とする。したがって、封入樹脂による封入圧力によって生じる、枠材１０２への応力集中をさらに抑制し、耐久性を向上させて、枠材１０２の変形を最小限に抑制することができる。本実施形態の例では、図１（ｂ）で示すように、封止樹脂の注入前の形状Ｉと封止樹脂の注入後の形状ＩＩとの間で変形がほとんど生じない。具体的には、本実施形態の方法では、内周形状の変形量Ｘを２分の１以下にすることができる。   On the other hand, in the electronic device according to the present embodiment, the inner periphery of the frame member 102 is a fulcrum at a position facing the corner of the light receiving unit 101b, and is line-symmetrical at a position facing the side center of the light receiving unit 101b. The arch shape. By doing so, the stress generated inside the frame member is in the compression direction, and can resist the deformation moment that becomes maximum at a position facing the side center of the light receiving portion 101b. Therefore, deformation can be largely suppressed and the inner shape of the frame material can be maintained more firmly. Further, in the electronic device of the present embodiment, the outer periphery of the frame member 102 is also symmetric with respect to the corner of the light receiving unit 101b, and is symmetric with respect to the center of the side of the light receiving unit 101b. The arch shape. Therefore, it is possible to further suppress the stress concentration on the frame member 102 caused by the sealing pressure by the encapsulating resin, improve the durability, and suppress the deformation of the frame member 102 to the minimum. In the example of this embodiment, as shown in FIG. 1B, there is almost no deformation between the shape I before injection of the sealing resin and the shape II after injection of the sealing resin. Specifically, in the method of the present embodiment, the deformation amount X of the inner peripheral shape can be reduced to half or less.

以上、図面を参照して本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。   As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

たとえば、本実施形態では、対称の枠材を形成する例を挙げて説明した。しかしながら、枠材は、たとえば、図７で示すように非対称の枠材２０２としてもよい。この例では、受光素子２０１が図１の受光素子１０１に対応し、枠材２０２が図１の枠材１０２に対応し、受光部２０１ｂが図１の受光部１０１ｂに対応する。図１及び図７の例で異なる点は、枠材の形状のみである。このように枠材２０２を非対称とすることで、受光素子２０１の左右方向を識別することが可能になる。   For example, in this embodiment, the example which forms a symmetrical frame material was given and demonstrated. However, the frame material may be, for example, an asymmetric frame material 202 as shown in FIG. In this example, the light receiving element 201 corresponds to the light receiving element 101 in FIG. 1, the frame member 202 corresponds to the frame member 102 in FIG. 1, and the light receiving unit 201b corresponds to the light receiving unit 101b in FIG. The only difference between the examples of FIGS. 1 and 7 is the shape of the frame material. By making the frame member 202 asymmetric in this way, the left-right direction of the light receiving element 201 can be identified.

従来技術において、受光素子２０１上に長方形の受光部２０１ｂを囲む枠材７０２を形成し、左右方向の識別を可能とする場合、図１１（ａ）に示す構成が考えられる。しかしながら、図１１（ａ）に示す枠材７０２の場合、封入樹脂の流入圧力を受けることで、曲率が小さい部分に応力が集中し、大きな変形が発生する。たとえば、図１１（ａ）で示す例では、封止樹脂の注入前の形状Ｉが封止樹脂の注入後には、形状ＩＩとなる。この変形は、長辺の中心に対向する位置で最大となり、その変形量は、内周形状の変形量Ｘで示される（図１１（ｂ））。   In the prior art, when a frame member 702 surrounding the light receiving portion 201b having a rectangular shape is formed on the light receiving element 201 to enable identification in the left-right direction, a configuration shown in FIG. However, in the case of the frame member 702 shown in FIG. 11A, stress is concentrated on a portion having a small curvature due to the inflow pressure of the encapsulating resin, and large deformation occurs. For example, in the example shown in FIG. 11A, the shape I before injection of the sealing resin becomes the shape II after injection of the sealing resin. This deformation becomes maximum at a position facing the center of the long side, and the deformation amount is indicated by the deformation amount X of the inner peripheral shape (FIG. 11B).

一方、図７の例における電子装置では、枠材２０２の内周及び外周を受光部２０１ｂのコーナーに対向する位置を支点とした外側に凸となっているアーチ形状とする。また、枠材２０２の内周のアーチ形状の曲率半径は、対向する受光部２０１の辺の長さに応じて変化させる。また、図７の例では、受光部２０１の各辺の中央に対向する枠材２０２の幅が、受光部２０１のコーナーに対向する枠材２０２の幅に対して、最大２．５倍となる例を示している。こうすることで、封入樹脂による封入圧力によって生じる、枠材２０２への応力集中を抑制し、耐久性を向上させることができる。この例では、図７（ｂ）で示すように、封止樹脂の注入前の形状Ｉと封止樹脂の注入後の形状ＩＩとの間で変形量Ｘが図１１（ｂ）と比べて顕著に低減されている。   On the other hand, in the electronic device in the example of FIG. 7, the inner periphery and the outer periphery of the frame member 202 have an arch shape that protrudes outward with a position facing the corner of the light receiving unit 201 b as a fulcrum. In addition, the radius of curvature of the arch shape on the inner periphery of the frame member 202 is changed according to the length of the side of the opposing light receiving unit 201. In the example of FIG. 7, the width of the frame member 202 facing the center of each side of the light receiving unit 201 is 2.5 times the maximum of the width of the frame member 202 facing the corner of the light receiving unit 201. An example is shown. By doing so, it is possible to suppress the stress concentration on the frame member 202 caused by the sealing pressure by the sealing resin and improve the durability. In this example, as shown in FIG. 7 (b), the deformation amount X between the shape I before injection of the sealing resin and the shape II after injection of the sealing resin is significant compared to FIG. 11 (b). Has been reduced.

また、上記の実施の形態では、受光部として長方形を例に挙げて説明した。しかしながら、受光部は、辺の長さが異なる２辺を含む多角形状から構成されていればよい。なお、素子の小型化という観点からは、長方形が好ましい。   In the above-described embodiment, the rectangular shape is taken as an example of the light receiving unit. However, the light-receiving part should just be comprised from the polygonal shape containing 2 sides from which the length of a side differs. From the viewpoint of miniaturization of the element, a rectangular shape is preferable.

また、上記の実施の形態では、受光素子を例に挙げて説明した。しかしながら、受光素子に換えて、デジタルビデオカメラ、デジタルスチールカメラ等に用いる撮像素子、各種のＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍｓ）、および電気振動を利用する電気音響フィルター等としてもよい。   In the above embodiment, the light receiving element has been described as an example. However, in place of the light receiving element, an imaging element used for a digital video camera, a digital still camera, or the like, various MEMS (Micro Electro Mechanical Systems), an electroacoustic filter using electric vibration, or the like may be used.

図８に、図５（ａ）における、封入樹脂による封入圧力と封入圧力による枠材の変形量Ｘとの関係を示す。実施例１は、図１（ａ）の構造を用い、図１（ｂ）のＸを封止圧力に対応させてプロットしたものである。また、実施例２は、図７（ａ）の構造を用い、図７（ｂ）のＸを封止圧力に対応させてプロットしたものである。また、比較例は、図９（ａ）の構造を用い、図９（ｂ）のＸを封止圧力に対応させてプロットしたものである。この例では、枠材１０２、２０２、５０２としてアクリル系樹脂などの光反応性樹脂及びエポキシ樹脂などの熱硬化性樹脂からなる樹脂を用いた。また、封止樹脂層１０４には、エポキシ樹脂を主成分に、シリカ充填材等を加えた熱硬化性成形材料からなる樹脂を用いた。実施例１、２及び比較例における各枠材の弾性率は、２０℃で２．４ＧＰａ、２００℃で１５ＭＰａに調整されている。なお、この弾性率は、弾性率測定装置（製造元：日本テクノプラス（株））を用いて周波数６００Ｈｚにより測定した。封入圧力の増大により、枠材の変形量Ｘは増大するが、実施例１及び実施例２の構造を採用することで、変形量Ｘが１／２以下に低減した。   FIG. 8 shows the relationship between the sealing pressure due to the sealing resin and the deformation amount X of the frame material due to the sealing pressure in FIG. In Example 1, the structure of FIG. 1A is used, and X in FIG. 1B is plotted corresponding to the sealing pressure. In Example 2, the structure of FIG. 7A is used, and X in FIG. 7B is plotted corresponding to the sealing pressure. In the comparative example, the structure of FIG. 9A is used and X in FIG. 9B is plotted corresponding to the sealing pressure. In this example, a resin made of a photoreactive resin such as an acrylic resin and a thermosetting resin such as an epoxy resin is used as the frame members 102, 202, and 502. For the sealing resin layer 104, a resin made of a thermosetting molding material containing an epoxy resin as a main component and a silica filler or the like is used. The elastic modulus of each frame material in Examples 1 and 2 and the comparative example is adjusted to 2.4 GPa at 20 ° C. and 15 MPa at 200 ° C. This elastic modulus was measured at a frequency of 600 Hz using an elastic modulus measuring apparatus (manufacturer: Nippon Techno Plus Co., Ltd.). Although the deformation amount X of the frame material increases with the increase in the sealing pressure, the deformation amount X is reduced to ½ or less by employing the structures of the first and second embodiments.

１０１ 受光素子
１０１ｂ 受光部
１０１ａ ウエハ
１０１ｂ 枠材
１０２ 枠材
１０２ａ 樹脂膜
１０３ 露光用マスク
１０４ リードフレーム
１０５ 金属細線
１０６ 封止樹脂層
１０７ 保護テープ
１０８ 電子装置
１０９ 実装基板
１１０ 半田
１１１ａ 封止用金型
１１１ｂ 封止用金型
１１２ ボンディングパッド
２０１ 受光素子
２０１ｂ 受光部
２０２ 枠材
５０２ 枠材
６０２ 枠材
７０２ 枠材 DESCRIPTION OF SYMBOLS 101 Light receiving element 101b Light receiving part 101a Wafer 101b Frame material 102 Frame material 102a Resin film 103 Exposure mask 104 Lead frame 105 Metal fine wire 106 Sealing resin layer 107 Protective tape 108 Electronic device 109 Mounting substrate 110 Solder 111a Sealing die 111b Sealing mold 112 Bonding pad 201 Light receiving element 201b Light receiving portion 202 Frame material 502 Frame material 602 Frame material 702 Frame material

Claims (7)

第一の辺と、前記第一の辺の一端と隣接し、前記第一の辺よりも長い第二の辺とを含む多角形状をなす機能部を有する素子と、
前記素子上で前記機能部を囲み、前記機能部を露出させる開口を形成する枠材と、
を有し、
平面視において前記枠材の内周は曲線となっており、
前記第二の辺に対向する前記枠材の内周の曲率半径が前記第一の辺に対向する前記枠材の内周の曲率半径よりも大きい、電子装置。 An element having a functional part having a polygonal shape including a first side and a second side that is adjacent to one end of the first side and is longer than the first side;
A frame material that surrounds the functional portion on the element and forms an opening that exposes the functional portion;
Have
In plan view, the inner circumference of the frame material is a curve,
An electronic device, wherein a radius of curvature of an inner periphery of the frame member facing the second side is larger than a radius of curvature of an inner periphery of the frame member facing the first side. 前記第二の辺に対向する前記枠材の外周の曲率半径が前記第一の辺に対向する前記枠材の外周の曲率半径よりも大きい、請求項１に記載の電子装置。   2. The electronic device according to claim 1, wherein a radius of curvature of an outer periphery of the frame member facing the second side is larger than a radius of curvature of an outer periphery of the frame member facing the first side. 前記第一の辺に対向する前記枠材の内周の曲率半径が、前記第一の辺に対向する前記枠材の外周の曲率半径よりも大きく、かつ、前記第二の辺に対向する前記枠材の内周の曲率半径が、前記第二の辺に対向する前記枠材の外周の曲率半径よりも大きい、請求項２に記載の電子装置。   The radius of curvature of the inner periphery of the frame member facing the first side is greater than the radius of curvature of the outer periphery of the frame member facing the first side, and the surface of the frame member faces the second side. The electronic device according to claim 2, wherein a curvature radius of an inner periphery of the frame member is larger than a curvature radius of an outer periphery of the frame member facing the second side. 前記第二の辺の中心に対向する位置における前記枠材の幅が前記第一の辺の中心に対向する位置における前記枠材の幅よりも大きい、請求項１乃至３いずれかに記載の電子装置。   The electron according to any one of claims 1 to 3, wherein a width of the frame member at a position facing the center of the second side is larger than a width of the frame member at a position facing the center of the first side. apparatus. 前記多角形状が矩形である、請求項１乃至４いずれかに記載の電子装置。   The electronic device according to claim 1, wherein the polygonal shape is a rectangle. 前記機能部が受光部である、請求項１乃至５いずれかに記載の電子装置。   The electronic device according to claim 1, wherein the functional unit is a light receiving unit. 前記枠材の周囲を埋める樹脂層をさらに備える、請求項１乃至６いずれかに記載の電子装置。   The electronic device according to claim 1, further comprising a resin layer that fills the periphery of the frame member.
JP2009243047A 2009-10-22 2009-10-22 Electronic device Pending JP2011091187A (en)

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