JP2011091113A - Method for manufacturing electronic component mounting substrate and electronic component mounting substrate - Google Patents

Method for manufacturing electronic component mounting substrate and electronic component mounting substrate Download PDF

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JP2011091113A
JP2011091113A JP2009241824A JP2009241824A JP2011091113A JP 2011091113 A JP2011091113 A JP 2011091113A JP 2009241824 A JP2009241824 A JP 2009241824A JP 2009241824 A JP2009241824 A JP 2009241824A JP 2011091113 A JP2011091113 A JP 2011091113A
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conductive member
press
electronic component
outer conductive
component mounting
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JP5427547B2 (en
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Beji Sasaki
ベジ 佐々木
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Freesia Makurosu Kk
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Freesia Makurosu Kk
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Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability by enhancing bondability between a conductive member also serving as a heat dissipation member and a through-hole. <P>SOLUTION: A through-hole 13a is formed at a laminate 13 having an insulated substrate 1 having copper plates 3, 9 formed on both surfaces, and a hollow outer conductive member 15 is press-fitted into the through-hole 13a from the copper plate 9 side. Furthermore, an inner conductive member 23 is press-fitted into a hollow portion 17 of the outer conductive member 15 from the copper plate 3 side. After the press fitting, a product is heated and compression-bonded by using a pair of upper and lower jigs to form a through-hole, and then metal plating layers 37, 39 are formed on surfaces of the copper plates 3, 9 and in the inner surface of the through-hole, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、絶縁基板の両面に設けた導体層相互を導電部材によって接続する電子部品搭載用基板の製造方法及び電子部品搭載用基板に関する。   The present invention relates to an electronic component mounting substrate manufacturing method and an electronic component mounting substrate in which conductor layers provided on both surfaces of an insulating substrate are connected to each other by a conductive member.

絶縁基板の両面に銅箔による導体層を設け、この絶縁基板に設けた貫通孔に放熱部材を圧入することによって両面の導体層相互を接続し、もって放熱特性を改善させるようにした電子部品搭載用基板が知られている（下記特許文献１）。   Electronic component mounting in which a conductor layer made of copper foil is provided on both sides of an insulating substrate, and a heat-dissipating member is press-fitted into a through-hole provided in the insulating substrate, thereby connecting the conductor layers on both sides to improve heat dissipation characteristics. A substrate is known (Patent Document 1 below).

特許第３１７４３９３号公報Japanese Patent No. 3174393

しかしながら、上記した従来の電子部品搭載用基板では、１本のピン状の放熱部材を、両面に導体層を設けた絶縁基板の貫通孔に圧入しているだけなので、放熱部材と貫通孔との間の密着性が充分とは言えず、改善が望まれている。   However, in the above-described conventional electronic component mounting board, a single pin-shaped heat radiating member is only press-fitted into the through hole of the insulating substrate provided with the conductor layer on both sides. The adhesion between them cannot be said to be sufficient, and improvement is desired.

そこで、本発明は、放熱部材を兼ねる導電部材と貫通孔との間の密着性を高めて信頼性を向上させることを目的としている。   Then, this invention aims at improving the reliability by improving the adhesiveness between the electroconductive member which serves as a heat radiating member, and a through-hole.

本発明は、絶縁基板の両面に導体層をそれぞれ設けてこれら絶縁基板及び各導体層を貫通する貫通孔を形成し、前記絶縁基板の一方の面に設けた導体層側から前記貫通孔に対して中空の外側導電部材を圧入した後、前記絶縁基板の他方の面に設けた導体層側から前記外側導電部材の中空部内に対して内側導電部材を圧入し、前記絶縁基板の両面の各導体層相互を前記外側導電部材及び内側導電部材を介して接続することを特徴とする。   In the present invention, conductor layers are provided on both surfaces of an insulating substrate to form through holes that penetrate the insulating substrate and each conductor layer, and the conductor layer side provided on one surface of the insulating substrate is connected to the through holes. After the hollow outer conductive member is press-fitted, the inner conductive member is press-fitted into the hollow portion of the outer conductive member from the conductor layer side provided on the other surface of the insulating substrate. The layers are connected to each other through the outer conductive member and the inner conductive member.

本発明によれば、絶縁基板の貫通孔に圧入した外側導電部材の中空部内に、さらに内側導電部材を圧入するので、外側導電部材及び内側導電部材からなる導電部材の貫通孔に対する密着性が高まり、放熱特性及び導電特性が向上するとともに耐振動性も向上し、信頼性を向上させることができる。   According to the present invention, since the inner conductive member is further press-fitted into the hollow portion of the outer conductive member press-fitted into the through hole of the insulating substrate, the adhesion of the outer conductive member and the conductive member made of the inner conductive member to the through hole is enhanced. Further, the heat dissipation characteristics and the conductive characteristics are improved, and the vibration resistance is also improved, so that the reliability can be improved.

本発明の第１の実施形態を示す電子部品搭載用基板の製造工程図で、（ａ）は一方の銅板を接合した絶縁基板と他方の銅板との間に接着シートを配置した状態、（ｂ）は（ａ）の３つの部材を重ね合わせて加熱プレスを行って積層体を形成している状態、（ｃ）は（ｂ）の積層体に貫通孔を形成した状態である。BRIEF DESCRIPTION OF THE DRAWINGS It is a manufacturing-process figure of the electronic component mounting board | substrate which shows the 1st Embodiment of this invention, (a) is the state which has arrange | positioned the adhesive sheet between the insulated substrate which joined one copper plate, and the other copper plate, (b ) Is a state in which the three members of (a) are overlapped and heated and pressed to form a laminated body, and (c) is a state in which through holes are formed in the laminated body of (b). 図１に続く電子部品搭載用基板の製造工程図で、（ａ）は図１（ｃ）の積層体に外側導電部材を圧入した状態、（ｂ）は（ａ）の外側導電部材の中空部に内側導電部材を圧入した状態、（ｃ）は（ｂ）の部材を加熱圧着する状態である。FIG. 2 is a manufacturing process diagram of an electronic component mounting substrate subsequent to FIG. 1, in which (a) shows a state in which an outer conductive member is press-fitted into the laminate of FIG. 1 (c), and (b) shows a hollow portion of the outer conductive member in FIG. (C) is a state in which the member (b) is thermocompression-bonded. 図２（ａ）に示す外側導電部材の断面図である。It is sectional drawing of the outer side electrically-conductive member shown to Fig.2 (a). 図２（ｂ）に示す内側導電部材の断面図である。It is sectional drawing of the inner side electrically-conductive member shown in FIG.2 (b). （ａ）は図３の外側導電部材及び図４の内側導電部材を圧入した状態を示す断面図で、（ｂ）は（ａ）の圧入後に、スルーホールとなる孔明け加工を実施して銅板表面に金属メッキ層を形成し、所定の後工程を経て完成したプリント配線板に電子部品を実装した状態を示す断面図である。(A) is sectional drawing which shows the state which press-fitted the outer side electroconductive member of FIG. 3, and the inner side electroconductive member of FIG. 4, (b) is the copper plate which implemented the drilling process used as a through hole after the press injection of (a) It is sectional drawing which shows the state which formed the metal plating layer in the surface and mounted the electronic component on the printed wiring board completed through the predetermined post process. 本発明の第２の実施形態を示す外側導電部材及び内側導電部材の断面図である。It is sectional drawing of the outer side conductive member and inner side conductive member which show the 2nd Embodiment of this invention. 第２の実施形態の図５に対応する断面図である。It is sectional drawing corresponding to FIG. 5 of 2nd Embodiment.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

［第１の実施形態］
まず、図１（ａ）に示すように、絶縁層となる例えばガラスエポキシなどからなる絶縁基板１の図中で上部側となる一方の面に、導体層としての銅板３を接合固定する。そして、この絶縁基板１及び銅板３と、絶縁基板１に対し銅板３と反対側に位置する導体層としての銅板９との間に、プリプレグで構成した接着シート１１を配置した状態で、図１（ｂ）に示すように、上下一対のプレス型１０，２０により加熱プレスし、絶縁基板１と銅板９とを互いに接合固定して積層体１３を製造する。 [First Embodiment]
First, as shown in FIG. 1A, a copper plate 3 as a conductor layer is bonded and fixed to one surface on the upper side in the figure of an insulating substrate 1 made of, for example, glass epoxy as an insulating layer. And in the state which has arrange | positioned the adhesive sheet 11 comprised with the prepreg between this insulating substrate 1 and the copper plate 3, and the copper plate 9 as a conductor layer located on the opposite side to the copper plate 3 with respect to the insulating substrate 1, FIG. As shown in (b), the laminated body 13 is manufactured by heat-pressing with a pair of upper and lower press dies 10 and 20 and bonding and fixing the insulating substrate 1 and the copper plate 9 to each other.

その後、図１（ｃ）に示すように、上記した積層板１３に対しドリルやプレス加工などによって圧入孔となる貫通孔１３ａを形成する。なお、ここでの貫通孔１３ａは円形としている。   Then, as shown in FIG.1 (c), the through-hole 13a used as a press-fit hole is formed with respect to the above-mentioned laminated board 13 by a drill, press work, etc. As shown in FIG. Here, the through hole 13a is circular.

次に、図２（ａ）に示すように、図１（ｃ）の積層体１３の上下を逆にした状態で、放熱部材となる外側導電部材１５を、銅板９側から貫通孔１３ａに圧入する。外側導電部材１５は、例えば銅板３，９と同材質の銅製（銅合金も含む）であって、外観がほぼ円柱形状であり、図３に示すように、先端側に中空部１７を備えた中空構造としている。   Next, as shown in FIG. 2A, the outer conductive member 15 serving as a heat radiating member is press-fitted into the through hole 13a from the copper plate 9 side in a state where the laminated body 13 of FIG. To do. The outer conductive member 15 is made of, for example, copper (including a copper alloy) made of the same material as the copper plates 3 and 9 and has a substantially cylindrical appearance, and has a hollow portion 17 on the distal end side as shown in FIG. It has a hollow structure.

上記した中空部１７は、先端側（図３中で下部側）の端部に先端側ほど内径が大きくなる円錐形状のテーパ面１７ａを備え、テーパ面１７ａより中空部１５の底部側（図３中で上部側）にほぼ球形状の凹部１７ｂを備えている。ここで、凹部１７ｂの上記圧入方向（図３中で上下方向）と直交する方向の幅寸法（内径）Ａは、テーパ面１７ａの最小内径Ｂより大きくしている。したがって、中空部１７はテーパ面１７ａと凹部１７ｂとの境界部に、内方に突出する環状の突起１７ｃが形成されることになる。すなわち、外側導電部材１５の中空部１７を凹部１７ｂで形成してこの凹部１７ｂの突起１７ｃで形成される開口部を、その（凹部１７ｂの）内部よりも狭くしていることになる。   The hollow portion 17 described above includes a conical tapered surface 17a whose inner diameter increases toward the distal end side at an end portion on the distal end side (lower side in FIG. 3), and the bottom portion side (FIG. 3) of the hollow portion 15 from the tapered surface 17a. A substantially spherical concave portion 17b is provided on the upper side. Here, the width dimension (inner diameter) A of the recess 17b in the direction orthogonal to the press-fitting direction (vertical direction in FIG. 3) is larger than the minimum inner diameter B of the tapered surface 17a. Therefore, in the hollow portion 17, an annular protrusion 17c protruding inward is formed at the boundary portion between the tapered surface 17a and the concave portion 17b. That is, the hollow portion 17 of the outer conductive member 15 is formed by the concave portion 17b, and the opening formed by the projection 17c of the concave portion 17b is narrower than the inside (in the concave portion 17b).

また、外側導電部材１５は、図３中の上部側に対応する基端部に、外側に拡がる平板形状の鍔部１９を形成してあり、鍔部１９と円柱部分の外周面との間には傾斜面２１を全周にわたり形成している。このため、図２（ａ）の圧入した状態では、傾斜面２１が銅板９の貫通孔９ａの開口部周縁に当接して鍔部１９は銅板９の表面に接触していない。   Further, the outer conductive member 15 is formed with a flat plate-shaped flange portion 19 extending outward at the base end portion corresponding to the upper side in FIG. 3, and between the flange portion 19 and the outer peripheral surface of the cylindrical portion. Forms an inclined surface 21 over the entire circumference. For this reason, in the press-fitted state of FIG. 2A, the inclined surface 21 abuts on the periphery of the opening of the through hole 9 a of the copper plate 9, and the flange portion 19 is not in contact with the surface of the copper plate 9.

また、外側導電部材１５の外径を貫通孔１３ａの内径よりも僅かに大きくしているので、外側導電部材１５を貫通孔１３ａに圧入した状態では、貫通孔１３ａの径が僅かに大きくなるよう弾性変形している。すなわち、圧入後の外側導電部材１５は、貫通孔１３ａの内面に押し付けるようにして密着した状態となる。   Further, since the outer diameter of the outer conductive member 15 is slightly larger than the inner diameter of the through hole 13a, the diameter of the through hole 13a is slightly increased when the outer conductive member 15 is press-fitted into the through hole 13a. It is elastically deformed. That is, the outer conductive member 15 after press-fitting is brought into close contact with the inner surface of the through hole 13a.

次に、図２（ｂ）に示すように、外側導電部材１５を圧入した積層体１３の上下を再度逆にし、この状態で図４に示す放熱部材となる内側導電部材２３を外側導電部材１５の中空部１７内に圧入する。すなわち、内側導電部材２３と外側導電部材１５とは、雄雌嵌合の関係になる。なお、この内側導電部材２３の圧入作業は、外側導電部材１５の圧入作業も同様であるが、図示しない自動圧入機によって行う。これにより、量産に適したものとなる。   Next, as shown in FIG. 2B, the laminated body 13 into which the outer conductive member 15 is press-fitted is turned upside down again, and in this state, the inner conductive member 23 serving as a heat dissipation member shown in FIG. Is press-fitted into the hollow portion 17. That is, the inner conductive member 23 and the outer conductive member 15 are in a male-female fitting relationship. The press-fitting work of the inner conductive member 23 is the same as the press-fitting work of the outer conductive member 15, but is performed by an automatic press-fitting machine (not shown). This makes it suitable for mass production.

内側導電部材２３は、前記した外側導電部材１５の凹部１７ｂの形状に対応させて先端側に膨大部２５を形成するとともに、突起１７ｃに対応する環状の凹み部２７、さらにテーパ面１７ａに対応するテーパ面２９をそれぞれ備えている。また、内側導電部材２３は、図４中の下部側に対応する基端部に、外側に拡がる平板形状の鍔部３１を形成してある。   The inner conductive member 23 corresponds to the shape of the concave portion 17b of the outer conductive member 15 described above, and forms an enormous portion 25 on the distal end side. The inner conductive member 23 also corresponds to the annular concave portion 27 corresponding to the protrusion 17c and the tapered surface 17a. Tapered surfaces 29 are provided. Further, the inner conductive member 23 is formed with a flat plate-shaped flange portion 31 that extends outward at a base end portion corresponding to the lower side in FIG. 4.

なお、テーパ面２９の傾斜方向に沿う長さを、外側導電部材１５の対応するテーパ面１７ａの長さよりも長く形成することで、内側導電部材２３を外側導電部材１５に圧入したときに、前記した外側導電部材１５の傾斜面２１と同様に、鍔部３１近傍のテーパ面２９の一部２９ａが貫通孔１３ａの開口部周縁から外部に突出し、鍔部３１が銅板３の表面に接触しない状態とする。   When the inner conductive member 23 is press-fitted into the outer conductive member 15 by forming the length along the inclined direction of the tapered surface 29 longer than the length of the corresponding tapered surface 17a of the outer conductive member 15, Similarly to the inclined surface 21 of the outer conductive member 15, a part 29 a of the tapered surface 29 in the vicinity of the flange portion 31 protrudes outside from the periphery of the opening of the through hole 13 a, and the flange portion 31 does not contact the surface of the copper plate 3. And

また、上記した内側導電部材２３の膨大部２５から凹み部２７及びテーパ面２９に至る、外側導電部材１５の中空部１７に挿入する部分は、前記圧入方向に直交する方向の寸法（外径）を、中空部１７の同寸法（内径）より僅かに大きく形成している。   Further, the portion inserted from the enormous portion 25 of the inner conductive member 23 to the recess portion 27 and the tapered surface 29 into the hollow portion 17 of the outer conductive member 15 is a dimension (outer diameter) in a direction orthogonal to the press-fitting direction. Are formed slightly larger than the same dimension (inner diameter) of the hollow portion 17.

このため、内側導電部材２３を外側導電部材１５の中空部１７に圧入した状態では、該中空部１７が押し広げられる方向に外側導電部材１５が弾性変形することになる。すなわち、圧入後の内側導電部材２３は、中空部１７の内面を押し付けるようにして密着した状態となる。   For this reason, in a state in which the inner conductive member 23 is press-fitted into the hollow portion 17 of the outer conductive member 15, the outer conductive member 15 is elastically deformed in a direction in which the hollow portion 17 is expanded. That is, the inner conductive member 23 after press-fitting is brought into close contact so as to press the inner surface of the hollow portion 17.

なお、内側導電部材２３は、外側導電部材１５と同様に、銅板３，９と同材質の銅製としてもよいが、これら外側導電部材１５及び内側導電部材２３は、銅製に限らず、アルミニウムやその合金、鉄やその合金など、熱放散性のある導電性の金属としてもよい。   The inner conductive member 23 may be made of copper of the same material as the copper plates 3 and 9, similarly to the outer conductive member 15. However, the outer conductive member 15 and the inner conductive member 23 are not limited to copper, but may be aluminum or the like. It is good also as an electroconductive metal with heat dissipation, such as an alloy, iron, and its alloy.

上記図２（ｂ）のように、内側導電部材２３を外側導電部材１５の中空部１７に圧入した後は、図２（ｃ）に示すように、上下一対の加圧用治具３３，３５により積層体１３に対して加熱圧着する。   After the inner conductive member 23 is press-fitted into the hollow portion 17 of the outer conductive member 15 as shown in FIG. 2 (b), as shown in FIG. 2 (c), a pair of upper and lower pressurizing jigs 33 and 35 are used. It heat-presses with respect to the laminated body 13.

その際、図５（ａ）に示すように、外側導電部材１５の傾斜面２１が貫通孔１３ａの周縁を押し潰して密着するとともに、鍔部１９も銅板９の表面に押し潰されて密着し一体化する。同様にして、内側導電部材２３の鍔部３１近傍のテーパ面２９の一部２９ａが、外側導電部材１５のテーパ面１７ａの端部を介してあるいは直接に貫通孔１３ａの周縁を押し潰して密着するとともに、鍔部３１も銅板３の表面に押し潰されて密着し一体化する。   At this time, as shown in FIG. 5A, the inclined surface 21 of the outer conductive member 15 crushes and closely adheres to the periphery of the through hole 13a, and the flange portion 19 also crushes and adheres to the surface of the copper plate 9. Integrate. Similarly, a portion 29a of the tapered surface 29 in the vicinity of the flange portion 31 of the inner conductive member 23 is in close contact with the edge of the tapered surface 17a of the outer conductive member 15 or directly by crushing the periphery of the through hole 13a. At the same time, the collar portion 31 is also crushed and adhered to the surface of the copper plate 3 to be integrated.

ここで、外側導電部材１５の鍔部１９及び内側導電部材２３の鍔部３１は、図５（ａ）に示すように、押し潰されて銅板９及び３内に埋没してその表面とほぼ同一面となっているが、多少の盛り上がり部が残るようであれば、表面全体が同一面となるように研磨処理を行う。   Here, the flange portion 19 of the outer conductive member 15 and the flange portion 31 of the inner conductive member 23 are crushed and buried in the copper plates 9 and 3 as shown in FIG. If it is a surface, but some raised portions remain, the polishing process is performed so that the entire surface becomes the same surface.

その後、スルーホールとなる所定の孔明け加工を実施してから、図５（ｂ）に示すように、外側導電部材１５及び内側導電部材２３を含む各銅板３，９の表面に銅などによる金属メッキ層３７，３９をそれぞれ形成するとともに、スルーホールの内面に同様のメッキ層を形成する。そして、上記金属メッキ層３７，３９及び銅板３，９に対してエッチング処理によって所要の回路パターンを形成した上で、所要の電子部品４１を実装する。   Thereafter, a predetermined drilling process for forming a through hole is performed, and then, as shown in FIG. 5B, a metal such as copper is formed on the surfaces of the copper plates 3 and 9 including the outer conductive member 15 and the inner conductive member 23. The plating layers 37 and 39 are formed, respectively, and a similar plating layer is formed on the inner surface of the through hole. Then, a required circuit pattern is formed on the metal plating layers 37 and 39 and the copper plates 3 and 9 by an etching process, and then a required electronic component 41 is mounted.

この際、外側導電部材１５及び内側導電部材２３は、電子部品４１からの発生する熱を金属メッキ層３７及び銅板３から、銅板９及び金属メッキ層３９に伝達して放熱すると同時に、上記所要の回路パターンによって、金属メッキ層３７及び銅板３から銅板９及び金属メッキ層３９に向けて電流が流れることになる。   At this time, the outer conductive member 15 and the inner conductive member 23 transmit the heat generated from the electronic component 41 from the metal plating layer 37 and the copper plate 3 to the copper plate 9 and the metal plating layer 39 to dissipate the heat. Depending on the circuit pattern, current flows from the metal plating layer 37 and the copper plate 3 toward the copper plate 9 and the metal plating layer 39.

このように、本実施形態によれば、積層体１３の貫通孔１３ａに圧入した外側導電部材１５の中空部１７内に、さらに内側導電部材２３を圧入するので、外側導電部材１５の貫通孔１３ａへの押し付けによる密着性を備える上に、内側導電部材２３の中空部１７への押し付けによりさらに貫通孔１３ａへの押し付け力が付加されて、外側導電部材１５及び内側導電部材２３からなる導電部材の貫通孔１３ａに対する密着性がより高まる。その結果、耐振動性が向上して経時劣化にも有効となり、放熱特性及び導電特性も向上して、電子部品搭載用基板として信頼性を向上させることができる。   Thus, according to this embodiment, since the inner conductive member 23 is further press-fitted into the hollow portion 17 of the outer conductive member 15 press-fitted into the through hole 13a of the multilayer body 13, the through hole 13a of the outer conductive member 15 is inserted. In addition to the adhesion by pressing to the hollow portion 17 of the inner conductive member 23, the pressing force to the through hole 13a is further applied by pressing the inner conductive member 23 to the hollow portion 17, so that the conductive member composed of the outer conductive member 15 and the inner conductive member 23 Adhesiveness with respect to the through hole 13a is further increased. As a result, vibration resistance is improved and effective against deterioration over time, heat dissipation characteristics and conductive characteristics are improved, and reliability as an electronic component mounting board can be improved.

また、外側導電部材１５の傾斜面２１が銅板９の貫通孔９ａ周縁の角部を押し潰すとともに、内側導電部材２３のテーパ面２９の一部２９ａが銅板３の貫通孔３ａの周縁の角部を押し潰すことで、銅板９と外側導電部材１５との密着性及び、銅板３と内側導電部材２３との密着性が高まるので、放熱特性及び導電特性がより向上する。   In addition, the inclined surface 21 of the outer conductive member 15 crushes the corner portion of the peripheral edge of the through hole 9 a of the copper plate 9, and the portion 29 a of the tapered surface 29 of the inner conductive member 23 is the corner portion of the peripheral edge of the through hole 3 a of the copper plate 3. Since the adhesiveness between the copper plate 9 and the outer conductive member 15 and the adhesiveness between the copper plate 3 and the inner conductive member 23 are increased, the heat dissipation characteristics and the conductive characteristics are further improved.

さらに、外側導電部材１５及び内側導電部材２３のそれぞれの鍔部１９及び３１が銅板９及び３のそれぞれの表面に密着することで、接触面積が増大するので、これによっても放熱特性及び導電特性が向上することになる。   Further, since the flanges 19 and 31 of the outer conductive member 15 and the inner conductive member 23 are in close contact with the respective surfaces of the copper plates 9 and 3, the contact area is increased. Will improve.

なお、上記実施形態における外側導電部材１５の鍔部１９や傾斜面２１は特に設けなくてもよく、また内側導電部材２３の鍔部３１やテーパ面２９の一部２９ａについても特に設けなくてもよい。   It should be noted that the flange portion 19 and the inclined surface 21 of the outer conductive member 15 in the above-described embodiment are not particularly provided, and the flange portion 31 of the inner conductive member 23 and the portion 29a of the tapered surface 29 are not particularly provided. Good.

［第２の実施形態］
図６に示すように、本実施形態の外側導電部材１５０は、その中空部１７０が圧入方向（図６中で上下方向）に貫通して全体として円筒形状を呈しており、一方内側導電部材２３０は、上記中空部１７０に圧入される円柱形状の圧入部２５０を備えている。この圧入部２５０の外径は、中空部１７０の内径より僅かに大きくしている。 [Second Embodiment]
As shown in FIG. 6, the outer conductive member 150 of the present embodiment has a hollow portion 170 that penetrates in the press-fitting direction (vertical direction in FIG. 6) and has a cylindrical shape as a whole, while the inner conductive member 230. Includes a cylindrical press-fit portion 250 that is press-fit into the hollow portion 170. The outer diameter of the press-fit portion 250 is slightly larger than the inner diameter of the hollow portion 170.

上記した外側導電部材１５０は、圧入方向後方側（図６中で下部側）の端部に、前記図３に示した第１の実施形態における外側導電部材１５の傾斜面２１に相当する傾斜面２１０及び、該傾斜面２１０の外周側に連続する鍔部１９０を備えており、先端側についても、前記外側導電部材１５のテーパ面１７ａに相当するテーパ面１７０ａを備えている。   The outer conductive member 150 described above is an inclined surface corresponding to the inclined surface 21 of the outer conductive member 15 in the first embodiment shown in FIG. 3 at the end on the rear side in the press-fitting direction (lower side in FIG. 6). 210 and a flange 190 continuous to the outer peripheral side of the inclined surface 210, and a tapered surface 170a corresponding to the tapered surface 17a of the outer conductive member 15 is also provided on the distal end side.

一方、内側導電部材２３０は、圧入方向後方側（図６中で上部側）の端部に、前記図３に示した第１の実施形態における内側導電部材２３のテーパ面２９の一部２９ａ及び鍔部３１にそれぞれ相当するテーパ面２９０の一部２９０ａ及び鍔部３１０を備えている。   On the other hand, the inner conductive member 230 has a part 29a of the tapered surface 29 of the inner conductive member 23 in the first embodiment shown in FIG. 3 and an end portion on the rear side in the press-fitting direction (upper side in FIG. 6). A portion 290 a of the tapered surface 290 and the flange 310 corresponding to the flange 31 are provided.

したがって、本実施形態においても、図７（ａ）の加熱圧着後の状態や、その後の図７（ｂ）の金属メッキ層３７，３９を形成した状態で示すように、積層体１３の貫通孔１３ａに圧入した外側導電部材１５０の中空部１７０内に、さらに内側導電部材２３０を圧入するので、外側導電部材１５０及び内側導電部材２３０からなる導電部材の貫通孔１３ａに対する密着性が高まるなど、第１の実施形態と同様の効果を得ることができる。   Therefore, also in the present embodiment, as shown in the state after the thermocompression bonding in FIG. 7A and the state in which the metal plating layers 37 and 39 in FIG. Since the inner conductive member 230 is further press-fitted into the hollow portion 170 of the outer conductive member 150 press-fitted into 13a, the adhesion of the conductive member made of the outer conductive member 150 and the inner conductive member 230 to the through hole 13a is increased. The same effect as that of the first embodiment can be obtained.

また、本実施形態においては、外側導電部材１５０を円筒形状に形成するとともに、内側導電部材２３０を円柱形状に形成しているので、第１の実施形態に比較して導電部材を容易に製造することができ、生産コストを抑えることができる。   In the present embodiment, the outer conductive member 150 is formed in a cylindrical shape, and the inner conductive member 230 is formed in a columnar shape. Therefore, the conductive member is easily manufactured as compared with the first embodiment. Production costs can be reduced.

なお、前記した各実施形態における積層板１３の貫通孔１３ａは、円形である必要はなく、四角形や多角形であってもよく、これに対応して外側導電部材１５，１５０の外形も、円柱である必要はなく、四角柱や多角柱であっても構わない。その場合、外側導電部材１５，１５０の中空部１７，１７０の形状及び内側導電部材２３，２３０も、円周方向の形状を外側導電部材１５，１５０の外形に合わせた形状とすることが望ましい。   In addition, the through-hole 13a of the laminated board 13 in each above-mentioned embodiment does not need to be circular, and may be a quadrangle or a polygon, and the outer shape of the outer conductive members 15 and 150 corresponding to this is also a cylinder. There is no need to be a square column or a polygonal column. In that case, it is desirable that the shape of the hollow portions 17 and 170 of the outer conductive members 15 and 150 and the inner conductive members 23 and 230 also have a shape that matches the outer shape of the outer conductive members 15 and 150 in the circumferential direction.

また、第２の実施形態においては、内側導電部材２３０に外側導電部材１５０と同様に中空部を設けて、該中空部にさらに別の導電部材を圧入するようにしてもよい。この場合の内側導電部材２３０の中空部は、外側導電部材１５０のように軸方向に貫通していても、第１の実施形態の外側導電部材１５のように凹部としてもよい。   In the second embodiment, a hollow portion may be provided in the inner conductive member 230 in the same manner as the outer conductive member 150, and another conductive member may be press-fitted into the hollow portion. The hollow portion of the inner conductive member 230 in this case may penetrate in the axial direction like the outer conductive member 150 or may be a recess like the outer conductive member 15 of the first embodiment.

１ 絶縁基板
３，９ 銅板（導体層）
１３ａ 積層板の貫通孔
１５，１５０ 外側導電部材
１７，１７０ 外側導電部材の中空部
１７ｂ 中空部の凹部
１９，１９０ 外側導電部材の鍔部
２１，２１０ 外側導電部材の傾斜面
２３，２３０ 内側導電部材
２５ 内側導電部材の膨大部
２９ａ 内側導電部材のテーパ面の一部（傾斜面）
２９０ 内側導電部材のテーパ面（傾斜面）
３１，３１０ 内側導電部材の鍔部 1 Insulating substrate 3,9 Copper plate (conductor layer)
13a Laminate through hole 15,150 Outer conductive member 17,170 Hollow portion of outer conductive member 17b Recessed portion of hollow portion 19,190 Gutter portion of outer conductive member 21,210 Inclined surface of outer conductive member 23,230 Inner conductive member 25 Enlarged portion of inner conductive member 29a Part of tapered surface (inclined surface) of inner conductive member
290 Tapered surface (inclined surface) of inner conductive member
31, 310 butt portion of inner conductive member

Claims (7)

絶縁基板の両面に導体層をそれぞれ設けてこれら絶縁基板及び各導体層を貫通する貫通孔を形成し、前記絶縁基板の一方の面に設けた導体層側から前記貫通孔に対して中空の外側導電部材を圧入した後、前記絶縁基板の他方の面に設けた導体層側から前記外側導電部材の中空部内に対して内側導電部材を圧入し、前記絶縁基板の両面の各導体層相互を前記外側導電部材及び内側導電部材を介して接続することを特徴とする電子部品搭載用基板の製造方法。   Conductor layers are provided on both sides of the insulating substrate to form through holes that penetrate the insulating substrate and each of the conductor layers, and the outer side that is hollow with respect to the through hole from the conductor layer side provided on one surface of the insulating substrate. After press-fitting the conductive member, the inner conductive member is pressed into the hollow portion of the outer conductive member from the conductor layer side provided on the other surface of the insulating substrate, and the conductor layers on both sides of the insulating substrate are A method of manufacturing an electronic component mounting board, wherein the connection is made through an outer conductive member and an inner conductive member. 前記外側導電部材の中空部を凹部で形成してこの凹部の開口部をその内部よりも狭くする一方、前記内側導電部材の先端を、前記凹部の形状に対応させて先端側に膨大部を形成し、前記内側導電部材の膨大部を前記外側導電部材の凹部の内部に入り込ませて圧入することを特徴とする請求項１に記載の電子部品搭載用基板の製造方法。   The hollow portion of the outer conductive member is formed as a concave portion, and the opening of the concave portion is narrower than the inside thereof, while the front end of the inner conductive member is formed on the front end side corresponding to the shape of the concave portion. 2. The method of manufacturing an electronic component mounting board according to claim 1, wherein the enormous portion of the inner conductive member is pressed into the recess of the outer conductive member. 前記外側導電部材の中空部は前記圧入方向に向けて貫通しており、この貫通した中空部内に前記内側導電部材を圧入することを特徴とする請求項１に記載の電子部品搭載用基板の製造方法。   2. The electronic component mounting substrate according to claim 1, wherein the hollow portion of the outer conductive member penetrates in the press-fitting direction, and the inner conductive member is press-fitted into the penetrated hollow portion. Method. 前記外側導電部材と前記内側導電部材との少なくともいずれか一方の圧入方向後方側の端部に設けた鍔部を、前記導体層の表面に圧接させることを特徴とする請求項１ないし３のいずれか１項に記載の電子部品搭載用基板の製造方法。   The flange part provided in the edge part of the press-fit direction back side of at least any one of the said outer side conductive member and the said inner side conductive member is press-contacted to the surface of the said conductor layer, Any one of Claim 1 thru | or 3 characterized by the above-mentioned. A method for manufacturing an electronic component mounting board according to claim 1. 前記外側導電部材と前記内側導電部材との少なくともいずれか一方の圧入方向後方側の端部に設けた傾斜面を、前記貫通孔の周縁部に圧接させて、該周縁部を押し潰すことを特徴とする請求項１ないし３のいずれか１項に記載の電子部品搭載用基板の製造方法。   An inclined surface provided at an end on the rear side in the press-fitting direction of at least one of the outer conductive member and the inner conductive member is brought into pressure contact with a peripheral portion of the through hole, and the peripheral portion is crushed. The manufacturing method of the electronic component mounting board | substrate of any one of Claim 1 thru | or 3. 絶縁基板の両面に導体層をそれぞれ設けてこれら絶縁基板及び各導体層を貫通する貫通孔を形成し、この貫通孔に中空の外側導電部材が圧入されるとともに、前記外側導電部材の中空部内に内側導電部材が圧入された状態で、前記絶縁基板の両面の各導体層相互が、前記外側導電部材及び内側導電部材を介して電気的、熱的に接続されていることを特徴とする電子部品搭載用基板。   Conductive layers are provided on both sides of the insulating substrate to form through holes penetrating the insulating substrate and each conductive layer. A hollow outer conductive member is press-fitted into the through holes, and the hollow portions of the outer conductive member are inserted into the hollow portions. An electronic component characterized in that the conductor layers on both sides of the insulating substrate are electrically and thermally connected to each other through the outer conductive member and the inner conductive member in a state where the inner conductive member is press-fitted. Mounting board. 前記外側導電部材の中空部を凹部で形成してこの凹部の開口部をその内部よりも狭くする一方、前記内側導電部材の先端を、前記凹部の形状に対応させて先端側に膨大部を形成し、前記内側導電部材の膨大部が前記外側導電部材の凹部の内部に入り込んで圧入されていることを特徴とする請求項６に記載の電子部品搭載用基板。   The hollow portion of the outer conductive member is formed as a concave portion, and the opening of the concave portion is narrower than the inside thereof, while the front end of the inner conductive member is formed on the front end side corresponding to the shape of the concave portion. The electronic component mounting board according to claim 6, wherein the enormous portion of the inner conductive member is pressed into the recess of the outer conductive member.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015047032A (en) * 2013-08-29 2015-03-12 株式会社オートネットワーク技術研究所 Circuit structure
JP2016035538A (en) * 2014-08-04 2016-03-17 キヤノン株式会社 Zoom lens and imaging apparatus including the same
WO2017009922A1 (en) * 2015-07-13 2017-01-19 富士機械製造株式会社 Wiring formation method and wiring formation device
JP2017212305A (en) * 2016-05-24 2017-11-30 Koa株式会社 Wiring board
US20210352798A1 (en) * 2017-07-13 2021-11-11 Cellink Corporation Interconnect circuit methods and devices

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122873A (en) * 1978-03-16 1979-09-22 Takachiho Seisakushiyo Kk Method of producing single and double side energizing substrate
JPS5750498A (en) * 1980-09-11 1982-03-24 Matsushita Electric Ind Co Ltd Both-side wired board
JPS5846694A (en) * 1981-09-14 1983-03-18 株式会社日立製作所 Circuit pattern connecting structure for printed circuit board
JPS59114890A (en) * 1982-12-21 1984-07-03 棚沢　日佐司 Method of producing printed circuit board
JPS60101998A (en) * 1983-11-07 1985-06-06 イビデン株式会社 Plug-in package and method of producing same
JPS622291U (en) * 1976-11-22 1987-01-08

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622291U (en) * 1976-11-22 1987-01-08
JPS54122873A (en) * 1978-03-16 1979-09-22 Takachiho Seisakushiyo Kk Method of producing single and double side energizing substrate
JPS5750498A (en) * 1980-09-11 1982-03-24 Matsushita Electric Ind Co Ltd Both-side wired board
JPS5846694A (en) * 1981-09-14 1983-03-18 株式会社日立製作所 Circuit pattern connecting structure for printed circuit board
JPS59114890A (en) * 1982-12-21 1984-07-03 棚沢　日佐司 Method of producing printed circuit board
JPS60101998A (en) * 1983-11-07 1985-06-06 イビデン株式会社 Plug-in package and method of producing same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015047032A (en) * 2013-08-29 2015-03-12 株式会社オートネットワーク技術研究所 Circuit structure
JP2016035538A (en) * 2014-08-04 2016-03-17 キヤノン株式会社 Zoom lens and imaging apparatus including the same
WO2017009922A1 (en) * 2015-07-13 2017-01-19 富士機械製造株式会社 Wiring formation method and wiring formation device
JP2017212305A (en) * 2016-05-24 2017-11-30 Koa株式会社 Wiring board
US20210352798A1 (en) * 2017-07-13 2021-11-11 Cellink Corporation Interconnect circuit methods and devices
US11979976B2 (en) * 2017-07-13 2024-05-07 Cellink Corporation Methods of forming interconnect circuits
US12035459B2 (en) 2017-07-13 2024-07-09 Cellink Corporation Methods of forming flexible interconnect circuits

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