JP2011071374A - Multicavity wiring substrate and method of manufacturing the same - Google Patents

Multicavity wiring substrate and method of manufacturing the same Download PDF

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JP2011071374A
JP2011071374A JP2009221928A JP2009221928A JP2011071374A JP 2011071374 A JP2011071374 A JP 2011071374A JP 2009221928 A JP2009221928 A JP 2009221928A JP 2009221928 A JP2009221928 A JP 2009221928A JP 2011071374 A JP2011071374 A JP 2011071374A
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wiring board
metallized layer
metal frame
ceramic
mother
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Tetsuya Tojo
哲也 東條
Hiroshi Matsumoto
大志 松本
Hiroshi Makino
浩 牧野
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a multicavity wiring substrate capable of maintaning reliability by stable operation of an electronic component in which a mother board and a metal frame are jointed via a brazing material. <P>SOLUTION: In the multicavity wiring substrate, a metal frame 7 is bonded, via a brazing material 6, to a frame type metallized layer 2 formed surrounding a mounting part 1a of the electronic component at the upper surface of the mother board 1 formed of a ceramic sintered material, a diving channel 3 is formed along the boundary of a wiring board region at the lower surface of the mother board 1, a recessed area 4 is formed in contact with the external circumference of the metallized layer 2, and a projecting material 5 formed of the ceramic sintered material having a hole coefficient higher than that of the mother board 1 is provided to be projected from the upper surface of the metallized layer 2 from such recessed area 4. Since the projecting material 5 prevents displacement of the metal frame 7 against the mother board 1 to assure highly accurate bonding of the metal frame 7, an electronic component can be operated stably and air-tightness after a cover is bonded for sealing can be maintained. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、広面積の母基板中に各々が半導体素子や圧電振動子等の電子部品を搭載するための小型の配線基板となる多数の配線基板領域を縦横の並びに配列してなる多数個取り配線基板、およびその製造方法に関するものである。   In the present invention, a large number of wiring board regions, each of which is a small wiring board for mounting electronic components such as semiconductor elements and piezoelectric vibrators, are arranged in a vertical and horizontal arrangement on a large-area mother board. The present invention relates to a wiring board and a manufacturing method thereof.

従来、半導体素子や水晶振動子等の電子部品を搭載するために用いられる電子部品収納用パッケージとして、図３に断面図で示すように、上面に電子部品８の搭載部１ａを有するセラミック基板１と、セラミック基板１の上面の搭載部１ａの外周部にろう材を含む接合材６を介して接合された金属枠体７とを備える配線基板が用いられている。この金属枠体７は電子部品８を搭載後に電子部品８を封止するための蓋体９を接合するためのものである。   2. Description of the Related Art Conventionally, as an electronic component storage package used for mounting electronic components such as semiconductor elements and crystal resonators, as shown in a cross-sectional view in FIG. And a metal frame 7 that is joined to the outer peripheral portion of the mounting portion 1a on the upper surface of the ceramic substrate 1 via a joining material 6 containing a brazing material. The metal frame 7 is for joining a lid 9 for sealing the electronic component 8 after the electronic component 8 is mounted.

また、この電子部品収納用パッケージは、近年の電子装置の小型化の要求に伴い、その大きさが数ｍｍ角程度の極めて小さなものとなってきている。これにより、セラミック基板１は、複数個の配線基板の取り扱いを容易とするために、また配線基板および電子装置の製作を効率よくするために、１枚の広面積の母基板中から複数個の配線基板を同時集約的に得るようになした、いわゆる多数個取りの形態で製作されている（例えば、特許文献１を参照。）。   In addition, the electronic component storage package has become extremely small with a size of about several millimeters square in accordance with the recent demand for downsizing of electronic devices. As a result, the ceramic substrate 1 has a plurality of mother substrates out of one large area in order to facilitate the handling of the plurality of wiring substrates and to efficiently manufacture the wiring substrate and the electronic device. It is manufactured in a so-called multi-cavity form in which wiring boards are obtained simultaneously and collectively (see, for example, Patent Document 1).

特開2008−147348号公報JP 2008-147348 A

しかしながら、多数個取り配線基板の母基板に金属枠体をろう材を介して接合する場合には、母基板の寸法ばらつきや金属枠体をろう付けするための加熱通炉中の振動等によって、金属枠体の位置ずれが発生して、その結果、電子部品を搭載するときに、電子部品が金属枠体に接触して破損したり、蓋体を接合して封止した後に気密性が劣化して、信頼性が損なわれたりするといった問題点があった。   However, when joining a metal frame to a mother board of a multi-piece wiring board via a brazing material, due to variations in the dimensions of the mother board, vibration in a heating furnace for brazing the metal frame, etc. As a result of the displacement of the metal frame, as a result, when the electronic component is mounted, the electronic component contacts the metal frame and breaks, or the airtightness deteriorates after the lid is joined and sealed As a result, there is a problem that reliability is impaired.

本発明はかかる問題点に鑑み案出されたものであり、その目的は、セラミック焼結体からなる母基板に対する金属枠体の位置精度を向上させることができるとともに、電子部品を安定して動作させて信頼性を保つことが可能な多数個取り配線基板を提供することにある。   The present invention has been devised in view of such problems, and its purpose is to improve the positional accuracy of the metal frame relative to the mother substrate made of a ceramic sintered body and to operate the electronic component stably. It is an object of the present invention to provide a multi-piece wiring board that can maintain reliability.

本発明の多数個取り配線基板は、セラミック焼結体からなる母基板の上面に、電子部品の搭載部を有する四角形状の複数の配線基板領域が縦横の並びに配列され、前記搭載部を取り囲んで形成された枠状のメタライズ層にろう材を介して金属枠体が接合されるとともに、前記母基板の下面に前記配線基板領域の境界に沿って分割溝が形成された多数個取り配線基板であって、前記母基板の上面に、前記配線基板領域の境界に沿って前記メタライズ層の外周に接するように凹部が形成されているとともに、該凹部から前記メタライズ層の上面よりも上に突出する、前記母基板よりも空孔率が高いセラミック焼結体材料からなる突出材が設けられていることを特徴とするものである。   In the multi-piece wiring board of the present invention, a plurality of rectangular wiring board regions having mounting parts for electronic components are arranged vertically and horizontally on the upper surface of a mother board made of a ceramic sintered body, and surround the mounting part. A multi-piece wiring board in which a metal frame is bonded to the formed frame-shaped metallized layer via a brazing material, and a dividing groove is formed along the boundary of the wiring board region on the lower surface of the mother board. In addition, a recess is formed on the upper surface of the mother substrate so as to contact the outer periphery of the metallized layer along the boundary of the wiring board region, and protrudes above the upper surface of the metallized layer from the recess. A protruding member made of a ceramic sintered body material having a higher porosity than the mother substrate is provided.

また、本発明の多数個取り配線基板は、上記構成において、前記凹部および前記分割溝は、それぞれの幅方向の中央部同士が上下で重なる位置にあることを特徴とするものである。   Further, the multi-piece wiring board of the present invention is characterized in that, in the above configuration, the concave portion and the dividing groove are in positions where the central portions in the width direction overlap each other in the vertical direction.

また、本発明の多数個取り配線基板は、上記構成において、前記凹部は、底面が前記分割溝の先端と対向する部位で最も深くなっていることを特徴とするものである。   The multi-piece wiring board according to the present invention is characterized in that, in the above configuration, the concave portion is deepest at a portion where the bottom surface is opposed to the tip of the dividing groove.

本発明の多数個取り配線基板の製造方法は、セラミック焼結体からなる母基板の上面に、電子部品の搭載部を有する四角形状の複数の配線基板領域が縦横の並びに配列され、前記搭載部を取り囲んで形成された枠状のメタライズ層に金属枠体が接合されるとともに、前記母基板の下面に前記配線基板領域の境界に沿って分割溝が形成された多数個取り配線基板を製造する多数個取り配線基板の製造方法であって、複数のセラミックグリーンシートを加工し積層して、上面に電子部品の搭載部が枠状のメタライズ層で取り囲まれた四角形状の複数の配線基板領域を縦横の並びに配列した積層体を作製する工程と、前記積層体の下面に前記配線基板領域の境界に沿って分割溝を形成するとともに、前記積層体の上面の前記配線基板領域の境界に沿って前記メタライズ層の外周に接するように凹部を形成する工程と、前記セラミックグリーンシートよりも有機成分の割合が大きいセラミックペーストを、前記凹部に、前記凹部から前記メタライズ層の上面よりも上に突出するように塗布する工程と、前記セラミックペーストが塗布された前記積層体を焼成して母基板とした後、前記セラミックペーストが焼成されてなる突出材の内側に金属枠体を前記メタライズ層と位置合わせして配置して、前記金属枠体をろう材を介して前記メタライズ層に接合する工程とを備えることを特徴とするものである。   In the method for manufacturing a multi-cavity wiring board according to the present invention, a plurality of rectangular wiring board regions having mounting parts for electronic components are arranged vertically and horizontally on the upper surface of a mother board made of a ceramic sintered body, A metal frame body is bonded to a frame-shaped metallization layer formed so as to surround the substrate, and a multi-piece wiring board in which a dividing groove is formed along the boundary of the wiring board region on the lower surface of the mother board is manufactured. A method of manufacturing a multi-piece wiring board, in which a plurality of ceramic green sheets are processed and laminated, and a plurality of rectangular wiring board regions in which an electronic component mounting portion is surrounded by a frame-like metallized layer on the upper surface are formed. A step of producing stacked bodies arranged vertically and horizontally, and forming a dividing groove along the boundary of the wiring board region on the lower surface of the stacked body, and along the boundary of the wiring board region on the upper surface of the stacked body. Forming a recess so as to be in contact with the outer periphery of the metallized layer, and a ceramic paste having a larger organic component ratio than the ceramic green sheet, and projecting from the recess above the upper surface of the metallized layer. Applying the ceramic paste and firing the laminated body coated with the ceramic paste to form a mother substrate, and then positioning the metal frame and the metallized layer on the inner side of the protruding material formed by firing the ceramic paste And a step of joining the metal frame body to the metallized layer through a brazing material.

本発明の多数個取り配線基板によれば、母基板の上面に、配線基板領域の境界に沿ってメタライズ層の外周に接するように凹部が形成されているとともに、この凹部からメタライズ層の上面よりも上に突出する、母基板よりも空孔率が高いセラミック焼結体材料からなる突出材が設けられていることから、この突出材が母基板に対する金属枠体のメタライズ層の外周からの位置ずれを防止して、金属枠体をメタライズ層に精度よく接合することができるので、電子部品を搭載するときの電子部品の破損や、蓋体を接合して封止した後の気密性の劣化を効果的に防止することができる。また、突出材は母基板よりも空孔率が高いセラミック焼結体材料からなることから、母基板を配線基板領域の境界に沿って分割する際には境界に沿って突出材自体が確実に破断するので、それぞれの配線基板領域を精度よく分割することができる。   According to the multi-cavity wiring board of the present invention, the recess is formed on the upper surface of the mother board so as to contact the outer periphery of the metallization layer along the boundary of the wiring board region. Since the projecting material made of a ceramic sintered body material having a higher porosity than the mother substrate is provided, the projecting material is positioned from the outer periphery of the metallization layer of the metal frame to the mother substrate. The metal frame can be bonded to the metallized layer with high accuracy by preventing misalignment, so damage to the electronic components when mounting electronic components and deterioration of airtightness after bonding and sealing the lid Can be effectively prevented. In addition, since the projecting material is made of a sintered ceramic material having a higher porosity than the mother board, when the mother board is divided along the boundary of the wiring board region, the projecting material itself is surely aligned along the boundary. Since it breaks, each wiring board area | region can be divided | segmented accurately.

また、本発明の多数個取り配線基板によれば、凹部および分割溝は、それぞれの幅方向の中央同士が上下で重なる位置にあるときには、分割溝からの抗折力が重なる位置の凹部に向かって作用して、配線基板領域を分割溝および凹部に沿って良好に四角形状に分割することができることから、それぞれの配線基板領域を精度よく分割することができる。   Further, according to the multi-cavity wiring board of the present invention, when the center in the width direction of each of the recesses and the division grooves is in a position where they overlap each other, the recesses and the division grooves are directed toward the depressions where the bending force from the division grooves overlaps. Thus, the wiring board region can be divided into a quadrangular shape well along the dividing groove and the recess, so that each wiring board region can be divided with high accuracy.

また、本発明の多数個取り配線基板によれば、凹部は、底面が分割溝の先端と対向する部位で最も深くなっているときには、分割溝からの抗折力を凹部に向けて垂直方向に確実に作用させることができることから、配線基板領域に分割したときのクラックやバリの発生を効果的に防止することができる。   Further, according to the multi-cavity wiring board of the present invention, when the concave portion is deepest at the portion where the bottom surface is opposed to the tip of the dividing groove, the bending force from the dividing groove is directed vertically toward the concave portion. Since it can act reliably, generation | occurrence | production of a crack and a burr | flash when it divides | segments into a wiring board area | region can be prevented effectively.

本発明の多数個取り配線基板の製造方法によれば、複数のセラミックグリーンシートを加工し積層して、上面に電子部品の搭載部が枠状のメタライズ層で取り囲まれた四角形状の複数の配線基板領域を縦横の並びに配列した積層体を作製する工程と、積層体の下面に配線基板領域の境界に沿って分割溝を形成するとともに、積層体の上面の配線基板領域の境界に沿ってメタライズ層の外周に接するように凹部を形成する工程と、セラミックグリーンシートよりも有機成分の割合が大きいセラミックペーストを、凹部に、凹部からメタライズ層の上面よりも上に突出するように塗布する工程と、セラミックペーストが塗布された積層体を焼成して母基板とした後、セラミックペーストが焼成されてなる突出材の内側に金属枠体をメタライズ層と位置合わせして配置して、金属枠体をろう材を介してメタライズ層に接合する工程とを具備することから、メタライズ層の外周に接するように形成した凹部に突出材として空孔率の高いセラミック焼結体材料からなるものを形成することができるので、金属枠体と母基板のメタライズ層との位置ずれを防止できるとともに、配線基板領域に分割したときのクラックやバリの発生を効果的に防止することができる。   According to the method of manufacturing a multi-cavity wiring board of the present invention, a plurality of rectangular green wirings in which a plurality of ceramic green sheets are processed and laminated, and an electronic component mounting portion is surrounded by a frame-like metallized layer on the upper surface. A step of manufacturing a laminated body in which substrate regions are arranged vertically and horizontally, and a dividing groove is formed on the lower surface of the laminated body along the boundary of the wiring substrate region, and metallization is performed along the boundary of the wiring substrate region on the upper surface of the laminated body. A step of forming a recess so as to be in contact with the outer periphery of the layer, and a step of applying a ceramic paste having a larger organic component ratio than the ceramic green sheet to the recess so as to protrude above the upper surface of the metallized layer from the recess. After firing the laminated body coated with the ceramic paste to form a mother substrate, the metal frame and the metallized layer on the inside of the protruding material obtained by firing the ceramic paste The metal frame body is bonded to the metallized layer through the brazing material, and the porosity is high as a projecting material in the recess formed to be in contact with the outer periphery of the metallized layer. Since it is possible to form a ceramic sintered body material, it is possible to prevent misalignment between the metal frame and the metallization layer of the mother board, and to effectively generate cracks and burrs when divided into wiring board areas. Can be prevented.

本発明の多数個取り配線基板の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the multi-piece wiring board of this invention. 図１におけるａ部を拡大した断面図である。It is sectional drawing to which the a part in FIG. 1 was expanded. 従来の配線基板を用いた電子部品収納用パッケージの一例を示す断面図である。It is sectional drawing which shows an example of the package for electronic component accommodation using the conventional wiring board.

本発明の多数個取り配線基板について、添付の図面を参照しつつ説明する。   A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

図１は本発明の多数個取り配線基板の実施の形態の一例を示す断面図であり、図２は図１におけるａ部を拡大した断面図である。図１および図２において、１はセラミック焼結体からなる母基板、１ａは電子部品（図示せず）の搭載部、２はメタライズ層、３は分割溝、４は凹部、５は突出材、６はろう材、７は金属枠体である。また、破線で示す９は電子部品を搭載した後に金属枠体７に接合される蓋体である。   FIG. 1 is a cross-sectional view showing an example of an embodiment of the multi-piece wiring board of the present invention, and FIG. 2 is an enlarged cross-sectional view of a part in FIG. 1 and 2, 1 is a mother substrate made of a ceramic sintered body, 1a is a mounting portion for an electronic component (not shown), 2 is a metallized layer, 3 is a dividing groove, 4 is a recess, 5 is a protruding material, 6 is a brazing material and 7 is a metal frame. Reference numeral 9 shown by a broken line is a lid that is joined to the metal frame 7 after mounting an electronic component.

母基板１は、例えば酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体またはガラスセラミックス等のセラミック焼結体からなり、上面には、電子部品の搭載部１ａを有する四角形状の複数の配線基板領域が縦横の並びに配列されている。また、それぞれの搭載部１ａを取り囲むようにして、金属枠体７がろう材６を介して接合されるメタライズ層２が形成されている。   The mother board 1 is made of a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, and a square having an electronic component mounting portion 1a on the upper surface. A plurality of wiring board regions having a shape are arranged vertically and horizontally. Further, the metallized layer 2 to which the metal frame 7 is joined via the brazing material 6 is formed so as to surround each mounting portion 1a.

このような母基板１は、例えば酸化アルミニウム質焼結体からなる場合であれば、アルミナ，シリカ，マグネシアおよびカルシア等の原料粉末に適当な有機バインダおよび溶剤を添加混合して泥漿状となすとともに、これを周知のドクターブレード法を採用してシート状に形成してセラミックグリーンシートを準備するとともに、これに例えば打ち抜き金型を用いて打ち抜き加工を施し、これらのセラミックグリーンシートに、電子部品の搭載部１ａを有する四角形状の複数の配線基板領域に対応して配線導体となる配線メタライズ層（図示せず）および金属枠体７を接合するためのメタライズ層２となるタングステン，モリブデンおよびマンガン等の金属ペーストをスクリーン印刷法によりそれぞれ所定のパターンに印刷塗布し、しかる後、これらのセラミックグリーンシートを上下に積層してセラミックグリーンシート積層体として、このセラミックグリーンシート積層体を還元雰囲気中にて約1600℃の温度で焼成することによって形成される。   If such a mother substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with raw material powders such as alumina, silica, magnesia, and calcia to form a slurry. The ceramic green sheet is prepared by adopting a well-known doctor blade method to form a sheet, and subjected to punching using, for example, a punching die. Corresponding to a plurality of rectangular wiring board regions having the mounting portion 1a, a wiring metallized layer (not shown) serving as a wiring conductor and tungsten, molybdenum, manganese, etc. serving as a metallized layer 2 for joining the metal frame 7 Each metal paste is printed and applied in a predetermined pattern by screen printing. Laminating these ceramic green sheets vertically as a ceramic green sheet laminate is formed by firing the ceramic green sheet laminate at a temperature of about 1600 ° C. in a reducing atmosphere.

母基板１の下面には、搭載部１ａを有する複数の配線基板領域の境界に沿って分割溝３が形成されている。分割溝３は、その断面形状が略Ｖ字状であり、母基板１の厚さや材質等により異なるが、母基板１の厚さが0.2〜３ｍｍである場合に、その深さが0.05〜1.5ｍｍ程度であり、その開口幅が0.01〜0.2ｍｍ程度である。このような分割溝３は、母基板１用のセラミックグリーンシート積層体の下面にカッター刃や金型等を押し付けて切り込みを入れておくことによって形成される。   Divided grooves 3 are formed on the lower surface of the mother board 1 along boundaries of a plurality of wiring board regions having the mounting portions 1a. The dividing groove 3 has a substantially V-shaped cross section, and varies depending on the thickness and material of the mother substrate 1, but when the thickness of the mother substrate 1 is 0.2 to 3 mm, the depth is 0.05 to 1.5. The opening width is about 0.01 to 0.2 mm. Such a dividing groove 3 is formed by pressing a cutter blade, a mold or the like on the lower surface of the ceramic green sheet laminate for the mother substrate 1 to make a cut.

母基板１の上面には、複数の配線基板領域の境界に沿って、少なくともメタライズ層２の外周と接する範囲に凹部４が形成されており、この凹部４からメタライズ層２の上面よりも上に突出する突出材５が形成されている。凹部４の形状は、その断面形状が四角形状、Ｕ字形状またはＶ字形状等であり、母基板１の厚さや材質等により異なるが、母基板１の厚さが0.2〜３ｍｍである場合に、その深さが0.01〜0.1ｍｍ程度であり、その開口幅が0.01〜0.1ｍｍ程度である。このような凹部４は、母基板１用のセラミックグリーンシート積層体の上面に金型等を押し付けて切り込みを入れておくことによって形成される。   On the upper surface of the mother substrate 1, a recess 4 is formed at least in a range in contact with the outer periphery of the metallized layer 2 along the boundary between the plurality of wiring substrate regions. A protruding material 5 that protrudes is formed. The shape of the concave portion 4 is a square shape, a U-shape or a V-shape, etc., and varies depending on the thickness or material of the mother substrate 1, but the thickness of the mother substrate 1 is 0.2 to 3 mm. The depth is about 0.01 to 0.1 mm, and the opening width is about 0.01 to 0.1 mm. Such a recess 4 is formed by pressing a die or the like on the upper surface of the ceramic green sheet laminate for the mother substrate 1 to make a cut.

分割溝３と凹部４とは、それぞれの幅方向の中央同士が上下で重なる位置になるように形成することが好ましい。分割溝３と凹部４とをこのように形成すると、分割溝３からの抗折力を上下で重なる位置の凹部４に向けて作用させることができることから、個々の配線基板領域に分割したときの配線基板の外周部でのクラックやバリの発生を効果的に防止することができる。   The dividing grooves 3 and the recesses 4 are preferably formed so that the respective centers in the width direction overlap each other in the vertical direction. When the dividing grooves 3 and the recesses 4 are formed in this way, the bending force from the dividing grooves 3 can be applied to the recesses 4 at the positions where they overlap each other. Generation of cracks and burrs at the outer periphery of the wiring board can be effectively prevented.

また、凹部４は、底面が分割溝３の先端と対向する部位で最も深くなるように形成することが好ましい。凹部４をこのように形成すると、分割溝３の先端からの抗折力を凹部４の最深部分に向けて垂直方向に確実に作用させることができることから、個々の配線基板領域に分割したときの配線基板の外周部でのクラックやバリの発生を効果的に防止することができる。   Moreover, it is preferable to form the recessed part 4 so that a bottom face may become deepest in the site | part facing the front-end | tip of the division | segmentation groove | channel 3. When the recess 4 is formed in this manner, the bending force from the tip of the dividing groove 3 can be surely acted in the vertical direction toward the deepest portion of the recess 4, and therefore when divided into individual wiring board regions. Generation of cracks and burrs at the outer periphery of the wiring board can be effectively prevented.

突出材５は、母基板１よりも空孔率の高いセラミック焼結体材料で形成される。これにより、配線基板領域の境界に沿って分割する際に突出材５自体が境界に沿って確実に破断するので、個々の配線基板領域に分割したときの配線基板の外周部でのクラックやバリの発生を効果的に防止することができる。ここで、空孔率とは、それぞれのセラミック焼結体材料の任意の断面において空孔が占める面積の割合をいう。   The protruding material 5 is formed of a ceramic sintered body material having a higher porosity than the mother substrate 1. As a result, the projecting member 5 itself is surely broken along the boundary when dividing along the boundary of the wiring board region. Therefore, cracks and burrs at the outer periphery of the wiring substrate when divided into individual wiring board regions are obtained. Can be effectively prevented. Here, the porosity means the ratio of the area occupied by the pores in an arbitrary cross section of each ceramic sintered body material.

突出材５の空孔率は、母基板１の空孔率に対して、例えば１〜10％高いものとすることが好ましい。突出材５の空孔率の高さが母基板１の空孔率に対して１％未満である場合には、分割溝３からの抗折力が凹部４から突出材５に向かって作用しにくくなる傾向があり、配線基板領域に分割したときに配線基板の外周部でのクラックやバリが発生しやすい傾向がある。一方、突出材５の空孔率の高さが母基板１の空孔率に対して10％を超えると、突出材５からの脱粒やセラミック屑が発生しやすくなる傾向があり、それらが電子部品の搭載部１ａに付着して電子部品を安定して搭載させにくくなる傾向がある。具体的には、母基板１の空孔率が２〜10％であるのに対して、突出材５の空孔率は、それよりも１〜10％高く、３〜20％であるものとすることが好ましい。   It is preferable that the porosity of the protruding member 5 is, for example, 1 to 10% higher than the porosity of the base substrate 1. When the height of the porosity of the protruding member 5 is less than 1% with respect to the porosity of the base substrate 1, the bending force from the dividing groove 3 acts from the concave portion 4 toward the protruding member 5. It tends to be difficult, and when divided into wiring board regions, cracks and burrs tend to occur on the outer periphery of the wiring board. On the other hand, if the porosity of the protruding member 5 exceeds 10% with respect to the porosity of the base substrate 1, there is a tendency that the protruding member 5 is likely to be shattered and ceramic waste, which is an electron. There is a tendency that it is difficult to stably mount electronic components by adhering to the component mounting portion 1a. Specifically, while the porosity of the base substrate 1 is 2 to 10%, the porosity of the protruding member 5 is 1 to 10% higher than that and 3 to 20%. It is preferable to do.

突出材５は、例えば酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体またはガラスセラミックス等のセラミック焼結体材料からなるものであり、母基板１と同じ材料であってもよい。   The protruding material 5 is made of a ceramic sintered body material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, and is the same material as the mother substrate 1. Also good.

このような突出材５は、例えば酸化アルミニウム質焼結体からなる場合であれば、アルミナ，シリカ，マグネシアおよびカルシア等の原料粉末に適当な有機バインダおよび溶剤を添加混合してセラミックペーストとなすとともに、これを周知のスクリーン印刷法やディスペンス塗布法等によって、母基板１用のセラミックグリーンシート積層体の上面に形成された、凹部４となる部位に塗布することによって形成される。この際に、セラミックペーストをセラミックグリーンシートよりも有機成分の割合が大きいものとすることによって、母基板１よりも空孔率が高い突出材５を形成することができる。なお、セラミックペーストにおける有機成分の割合は、突出材５の空孔率に応じて適宜調整すればよい。   If such a protruding material 5 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as alumina, silica, magnesia and calcia to form a ceramic paste. This is formed by applying this to a portion to be the concave portion 4 formed on the upper surface of the ceramic green sheet laminate for the mother substrate 1 by a known screen printing method, a dispense coating method, or the like. At this time, the projecting material 5 having a higher porosity than the mother substrate 1 can be formed by making the ceramic paste have a larger proportion of the organic component than the ceramic green sheet. The proportion of the organic component in the ceramic paste may be adjusted as appropriate according to the porosity of the protruding member 5.

また、突出材５は、母基板１の上面に形成されたメタライズ層２の上面よりも上に突出するように配置されている。突出材５がメタライズ層２の上面よりも上に突出していることから、メタライズ層２にろう材６を介して金属枠体７と母基板１とを接合するときの金属枠体７の位置ずれを突出材５が当接することによって防止することができるので、電子部品を搭載するときの電子部品の破損や、蓋体９を接合して封止した後の気密性の劣化を効果的に防止することができる。   Further, the protruding member 5 is arranged so as to protrude above the upper surface of the metallized layer 2 formed on the upper surface of the mother substrate 1. Since the protruding material 5 protrudes above the upper surface of the metallized layer 2, the metal frame 7 is displaced when the metal frame 7 and the mother substrate 1 are joined to the metallized layer 2 via the brazing material 6. Can be prevented by the projecting material 5 coming into contact, so that it is possible to effectively prevent damage to the electronic component when mounting the electronic component and deterioration of the airtightness after the lid 9 is joined and sealed. can do.

また、突出材５は、金属枠体７の位置決めを安定して行なうことができるようにする点から、メタライズ層２の上面から0.02ｍｍよりも高く、金属枠体７の上面から0.05ｍｍまでの高さに形成することが好ましい。メタライズ層２の上面からの突出材５の高さが0.02ｍｍより低い場合には、金属枠体７をろう材６を介してメタライズ層２に接合するときに位置ずれが生じやすくなりやすい。一方、金属枠体７の上面からの突出材５の高さが0.05ｍｍを超えると、電子部品を搭載した後に、金属枠体７に蓋体９を接合するときの障害になりやすい。   Further, the protruding member 5 is higher than 0.02 mm from the upper surface of the metallized layer 2 and 0.05 mm from the upper surface of the metal frame 7 from the viewpoint that the positioning of the metal frame 7 can be performed stably. It is preferable to form it at a height. When the height of the protruding member 5 from the upper surface of the metallized layer 2 is lower than 0.02 mm, a positional shift is likely to occur when the metal frame 7 is joined to the metallized layer 2 via the brazing material 6. On the other hand, if the height of the projecting member 5 from the upper surface of the metal frame 7 exceeds 0.05 mm, it tends to be an obstacle when the lid 9 is joined to the metal frame 7 after the electronic component is mounted.

金属枠体７は、母基板１とともに搭載部１ａに搭載される電子部品を収納する容器を構成する蓋体９を接合するためのものであり、母基板１の上面に電子部品の搭載部１ａを取り囲むようにして、メタライズ層２にろう材６を介して接合されている。この金属枠体７は、一般的に熱膨張係数が小さく、かつ母基板１のセラミック焼結体との接合信頼性の高い材料を選択する。例えば、母基板１が酸化アルミニウム質焼結体（アルミナセラミックス）からなるものである場合は、熱膨張係数が比較的近い値である鉄（Ｆｅ），ニッケル（Ｎｉ）およびコバルト（Ｃｏ）を含む合金（Ｆｅ−Ｎｉ−Ｃｏ合金）からなるものが用いられる。金属枠体７は、例えば、圧延ロールされたＦｅ−Ｎｉ−Ｃｏ合金の板材に、打ち抜き金型を用いて打ち抜き加工を施したり、硝酸等の薬液でエッチング加工を施したりすることにより、母基板１の電子部品の搭載部１ａを取り囲むように枠状に加工される。   The metal frame 7 is for joining a lid 9 constituting a container for storing an electronic component mounted on the mounting portion 1 a together with the mother substrate 1, and the electronic component mounting portion 1 a on the upper surface of the mother substrate 1. Is joined to the metallized layer 2 via a brazing material 6. For the metal frame 7, a material having a generally low thermal expansion coefficient and a high bonding reliability with the ceramic sintered body of the mother board 1 is selected. For example, when the mother substrate 1 is made of an aluminum oxide sintered body (alumina ceramic), it includes iron (Fe), nickel (Ni), and cobalt (Co), which have relatively close thermal expansion coefficients. What consists of an alloy (Fe-Ni-Co alloy) is used. The metal frame 7 is formed by, for example, subjecting a rolled and rolled Fe-Ni-Co alloy plate material to a punching process using a punching die or performing an etching process using a chemical such as nitric acid. It is processed into a frame shape so as to surround the mounting portion 1a of one electronic component.

ろう材６は、母基板１の上面に形成されたメタライズ層２に金属枠体７を接合するものであり、例えば、母基板１が酸化アルミニウム質焼結体（アルミナセラミックス）からなるものである場合は、銀ろう，銅ろうおよびそれらの合金ろう等からなるろう材６を、母基板１の上面に電子部品の搭載部１ａを取り囲んで形成されたメタライズ層２の上に載置し、その上に金属枠体７を重ね合わせて載置する。その後、還元雰囲気中でろう材６の融点以上の温度まで加熱することによって、金属枠体７が母基板１の上面に形成されたメタライズ層２に、ろう材６を介して接合される。その際に、メタライズ層２の外周に接するように凹部４が形成されているとともに、この凹部４からメタライズ層２の上面よりも上に突出する突出材５が設けられていることから、金属枠体７の位置ずれを抑制して所望の位置精度で金属枠体７を安定して接合することができる。   The brazing material 6 is for joining the metal frame 7 to the metallized layer 2 formed on the upper surface of the mother substrate 1. For example, the mother substrate 1 is made of an aluminum oxide sintered body (alumina ceramic). In this case, a brazing material 6 made of silver brazing, copper brazing, or an alloy brazing thereof is placed on the metallized layer 2 formed on the upper surface of the base substrate 1 so as to surround the electronic component mounting portion 1a. The metal frame 7 is placed on top of the other. Thereafter, the metal frame 7 is joined to the metallized layer 2 formed on the upper surface of the mother substrate 1 via the brazing material 6 by heating to a temperature equal to or higher than the melting point of the brazing material 6 in a reducing atmosphere. At this time, the recess 4 is formed so as to contact the outer periphery of the metallized layer 2, and the protruding material 5 that protrudes above the upper surface of the metallized layer 2 from the recess 4 is provided. The metal frame 7 can be stably joined with a desired positional accuracy by suppressing the displacement of the body 7.

以上のようにして得られた本発明の多数個取り配線基板を用いることにより、電子部品を搭載するときの電子部品の破損や、蓋体を接合して封止した後の気密性の劣化を効果的に防止することができる。   By using the multi-cavity wiring board of the present invention obtained as described above, damage to the electronic component when mounting the electronic component and deterioration of the airtightness after the lid is joined and sealed It can be effectively prevented.

本発明の多数個取り配線基板の実施例について、以下に具体的に説明する。   Examples of the multi-piece wiring board of the present invention will be specifically described below.

まず、セラミック無機成分としてアルミナ粉末を85質量部と、焼結助剤としてシリカ，マグネシア，およびカルシアを合わせて15質量部との割合で調合したセラミック粉末100質量部に対して、有機バインダとしてアクリル樹脂を15質量部の割合で調合し、有機溶剤としてトルエンおよび酢酸エチルを添加してボールミルにより混合し、セラミックスラリーを調製した。このセラミックスラリーをドクターブレード法によりシート状に塗布し、乾燥させて、厚み100μｍのアルミナセラミックグリーンシートを形成した。   First, 85 parts by mass of alumina powder as a ceramic inorganic component and 100 parts by mass of ceramic powder prepared by combining 15 parts by mass of silica, magnesia, and calcia as sintering aids, acrylic as an organic binder. The resin was blended at a ratio of 15 parts by mass, and toluene and ethyl acetate were added as organic solvents and mixed by a ball mill to prepare a ceramic slurry. This ceramic slurry was applied to a sheet by the doctor blade method and dried to form an alumina ceramic green sheet having a thickness of 100 μm.

次に、このアルミナセラミックグリーンシートの表面に、タングステン粉末を100質量部と、アクリル樹脂を10質量部と、有機溶剤としてのα−テルピネオールを３質量部とを加え、攪拌脱泡機により十分に混合した後に３本ロールにて十分に混練した金属ペーストを、スクリーン印刷法によってメタライズ層２のパターンで15μｍの厚みに塗布し、70℃で30分乾燥した。   Next, 100 parts by mass of tungsten powder, 10 parts by mass of acrylic resin, and 3 parts by mass of α-terpineol as an organic solvent are added to the surface of the alumina ceramic green sheet, and the mixture is sufficiently mixed with a stirring deaerator. After mixing, the metal paste sufficiently kneaded with three rolls was applied to the thickness of 15 μm in the pattern of the metallized layer 2 by screen printing, and dried at 70 ° C. for 30 minutes.

次に、このアルミナセラミックグリーンシートを積み重ねて、20ＭＰａの圧力と50℃の温度で加熱圧着して、50×50ｍｍの四角形状のアルミナセラミックグリーンシートの積層体を作製した。   Next, the alumina ceramic green sheets were stacked and thermocompression bonded at a pressure of 20 MPa and a temperature of 50 ° C. to produce a 50 × 50 mm square alumina ceramic green sheet laminate.

次に、この積層体の下面にカッター刃を押圧することによって、深さ0.1ｍｍで開口幅が0.05ｍｍの分割溝３を、３×３ｍｍの大きさの四角形状の複数の配線基板領域が縦横に並びに区画されるように、縦方向と横方向とに形成した。   Next, by pressing a cutter blade against the lower surface of the laminate, the dividing groove 3 having a depth of 0.1 mm and an opening width of 0.05 mm is formed into a plurality of 3 × 3 mm square wiring board regions in the vertical and horizontal directions. It was formed in the vertical direction and the horizontal direction so as to be partitioned.

次に、この積層体の上面に金型を押圧することによって、深さ0.03ｍｍで開口幅が0.05ｍｍの凹部４を、複数の配線基板領域の境界に沿ってメタライズ層２の外周に接するように、下面に形成した分割溝３に対応させて、それぞれ幅方向の中央部同士が上下で重なる位置になるように形成した。   Next, by pressing a mold against the upper surface of the laminate, the recess 4 having a depth of 0.03 mm and an opening width of 0.05 mm is brought into contact with the outer periphery of the metallized layer 2 along the boundaries of the plurality of wiring board regions. In addition, in correspondence with the dividing grooves 3 formed on the lower surface, the central portions in the width direction are formed so as to overlap each other in the vertical direction.

次に、セラミック無機成分としてアルミナ粉末を90質量部と、焼結助剤としてシリカ，マグネシア，およびカルシアを合わせて10質量部との割合で調合したセラミック粉末100質量部に対して、有機バインダとしてアクリル樹脂を30質量部の割合で調合し、有機溶剤としてα−テルピネオールを５質量部の割合で加え、攪拌脱泡機により十分に混合した後に３本ロールにて十分に混練したセラミックペーストを、スクリーン印刷法によって積層体の上面の凹部４に充填するように100μｍの厚みに塗布し、70℃で30分乾燥した。   Next, 90 parts by mass of alumina powder as a ceramic inorganic component and 100 parts by mass of ceramic powder prepared by combining silica, magnesia, and calcia as sintering aids in a ratio of 10 parts by mass, as an organic binder A ceramic paste prepared by blending acrylic resin at a ratio of 30 parts by mass, adding α-terpineol as an organic solvent at a ratio of 5 parts by mass, thoroughly mixing with a stirring deaerator, and then kneading sufficiently with three rolls, The film was applied to a thickness of 100 μm so as to fill the concave portion 4 on the upper surface of the laminate by screen printing, and dried at 70 ° C. for 30 minutes.

次に、この積層体を、加湿窒素雰囲気中で1600℃にて１時間の条件で焼成して、３×３ｍｍの搭載部１ａを有する四角形状の複数の配線基板領域に区画されて、その配線基板領域の境界に沿って、それぞれ下面に分割溝３が設けられるとともに、上面に枠状のメタライズ層２と凹部４に充填された突出材５とが形成された母基板１を作製した。   Next, this laminate is fired in a humidified nitrogen atmosphere at 1600 ° C. for 1 hour, and is partitioned into a plurality of rectangular wiring board regions having a 3 × 3 mm mounting portion 1a. A dividing substrate 3 was provided on the lower surface along the boundary of the substrate region, and a mother substrate 1 having a frame-like metallized layer 2 and a protruding material 5 filled in the recess 4 formed on the upper surface was produced.

次に、メタライズ層２の表面に、ろう材６との濡れ性を向上させるために、ニッケルめっき膜を３μｍの厚みで形成した。   Next, in order to improve the wettability with the brazing material 6 on the surface of the metallized layer 2, a nickel plating film was formed with a thickness of 3 μm.

次に、凹部４および突出材５を形成しない以外の構成は上記と同様にして、比較例としての母基板を作製した。   Next, a mother substrate as a comparative example was manufactured in the same manner as above except that the concave portion 4 and the protruding member 5 were not formed.

次に、銀ろう（Ａｇ：Ｃｕ≒85：15（質量比））からなる、厚みが0.05ｍｍの箔状体のろう材６と、鉄−ニッケル−コバルト合金（Ｆｅ−Ｎｉ−Ｃｏ合金）（鉄：ニッケル：コバルト＝54：29：17（質量比））からなる、厚みが0.2ｍｍの金属枠体７を、実施例としての母基板１および比較例としての母基板の電子部品の搭載部１ａを取り囲むメタライズ層２の上面にそれぞれ載置して、還元雰囲気において900℃で加熱して接合することにより、実施例および比較例の多数個取り配線基板を作製した。   Next, a brazing material 6 made of silver brazing (Ag: Cu≈85: 15 (mass ratio)) having a thickness of 0.05 mm and an iron-nickel-cobalt alloy (Fe-Ni-Co alloy) ( A metal frame body 7 made of iron: nickel: cobalt = 54: 29: 17 (mass ratio) and having a thickness of 0.2 mm is mounted on an electronic component mounting portion of the mother board 1 as an example and the mother board as a comparative example. The multi-layer wiring boards of the example and the comparative example were manufactured by placing each on the upper surface of the metallized layer 2 surrounding 1a and bonding them by heating at 900 ° C. in a reducing atmosphere.

得られた多数個取り配線基板の実施例について、母基板１の部分と突出材５の部分とをそれぞれ断面研磨した後、0.1×0.05ｍｍの範囲の断面を1000倍の電子顕微鏡で観察して空孔率を測定した。   About the example of the obtained multi-cavity wiring board, after polishing the cross section of the base substrate 1 and the protruding material 5 respectively, the cross section in the range of 0.1 × 0.05 mm was observed with a 1000 × electron microscope. The porosity was measured.

その結果、実施例における母基板１の部分のセラミック焼結体材料の空孔率は５％であり、突出材５の部分のセラミック焼結体材料の空孔率は11％であった。   As a result, the porosity of the ceramic sintered body material in the portion of the mother substrate 1 in the example was 5%, and the porosity of the ceramic sintered body material in the portion of the protruding member 5 was 11%.

また、得られた多数個取り配線基板の中から1000個の配線基板領域について、50倍の顕微鏡で外観状態を観察して、金属枠体７の位置ずれが生じている配線基板領域の数を測定した。   Further, the appearance of 1000 wiring board areas out of the obtained multi-cavity wiring boards was observed with a 50 × microscope, and the number of wiring board areas where the metal frame 7 was displaced was determined. It was measured.

その結果、実施例の多数個取り配線基板では、金属枠体７の位置ずれが生じている配線基板領域の発生は見られなかった。一方、比較例の多数個取り配線基板では、35％の発生率で金属枠体７の位置ずれが生じていた。   As a result, in the multi-cavity wiring board of the example, the generation of the wiring board region in which the position shift of the metal frame 7 was not observed. On the other hand, in the multi-cavity wiring board of the comparative example, the displacement of the metal frame 7 occurred at an incidence of 35%.

以上により、本発明の多数個取り配線基板によれば、突出材５が金属枠体７のメタライズ層２の外周からの位置ずれを防止して、金属枠体７をメタライズ層２に精度よく接合することができることか確認できた。また、個々の配線基板領域に分割したところ、分割溝３と凹部４とによって確実に分割することができ、突出材５は母基板１よりも空孔率が高いセラミック焼結体材料からなることから、配線基板領域の境界に沿って突出材５自体が確実に破断して、それぞれの配線基板領域を精度よく分割することができた。   As described above, according to the multi-cavity wiring board of the present invention, the protruding member 5 prevents the metal frame 7 from being displaced from the outer periphery of the metallized layer 2, and the metal frame 7 is bonded to the metallized layer 2 with high accuracy. I was able to confirm that I could do it. Further, when divided into individual wiring board regions, it can be surely divided by the dividing grooves 3 and the recesses 4, and the protruding material 5 is made of a ceramic sintered body material having a higher porosity than the mother board 1. Thus, the protruding member 5 itself is surely broken along the boundary of the wiring board area, and each wiring board area can be divided with high accuracy.

なお、本発明は、上述の実施の形態の例および実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更が可能であることは言うまでもない。例えば、上述の実施例では、箔状体のろう材６を用いてメタライズ層２と金属枠体７とを接合したが、ろう材粉末と有機バインダとを混合したろう材ペーストをメタライズ層２の上面に印刷塗布しておき、このろう材ペーストのろう材６によってメタライズ層２と金属枠体７とを接合してもよい。   The present invention is not limited to the above-described embodiments and examples, and it goes without saying that various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the metallized layer 2 and the metal frame 7 are joined using the brazing material 6 in the form of a foil, but the brazing material paste in which the brazing material powder and the organic binder are mixed is used as the metallizing layer 2. Alternatively, the metallized layer 2 and the metal frame 7 may be bonded to each other with the brazing material 6 of the brazing material paste.

１・・・母基板
１ａ・・・搭載部
２・・・メタライズ層
３・・・分割溝
４・・・凹部
５・・・突出材
６・・・ろう材
７・・・金属枠体 DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... Mounting part 2 ... Metallizing layer 3 ... Dividing groove 4 ... Recessed part 5 ... Protruding material 6 ... Brazing material 7 ... Metal frame

Claims (4)

セラミック焼結体からなる母基板の上面に、電子部品の搭載部を有する四角形状の複数の配線基板領域が縦横の並びに配列され、前記搭載部を取り囲んで形成された枠状のメタライズ層にろう材を介して金属枠体が接合されるとともに、前記母基板の下面に前記配線基板領域の境界に沿って分割溝が形成された多数個取り配線基板であって、
前記母基板の上面に、前記配線基板領域の境界に沿って前記メタライズ層の外周に接するように凹部が形成されているとともに、該凹部から前記メタライズ層の上面よりも上に突出する、前記母基板よりも空孔率が高いセラミック焼結体材料からなる突出材が設けられていることを特徴とする多数個取り配線基板。 A plurality of rectangular wiring board regions having mounting parts for electronic components are arranged vertically and horizontally on the upper surface of a mother board made of a ceramic sintered body, and a frame-like metallization layer formed around the mounting parts. A metal frame is bonded through a material, and a multi-piece wiring board in which dividing grooves are formed along the boundary of the wiring board region on the lower surface of the mother board,
A recess is formed on the upper surface of the mother board so as to contact the outer periphery of the metallized layer along a boundary of the wiring board region, and the mother board protrudes above the upper surface of the metallized layer from the recess. A multi-cavity wiring board comprising a protruding member made of a sintered ceramic material having a higher porosity than that of the substrate. 前記凹部および前記分割溝は、それぞれの幅方向の中央部同士が上下で重なる位置にあることを特徴とする請求項１記載の多数個取り配線基板。 The multi-cavity wiring board according to claim 1, wherein the concave portion and the dividing groove are in positions where the central portions in the width direction overlap each other vertically. 前記凹部は、底面が前記分割溝の先端と対向する部位で最も深くなっていることを特徴とする請求項２記載の多数個取り配線基板。 The multi-cavity wiring board according to claim 2, wherein the recess has a deepest bottom surface at a portion facing the tip of the dividing groove. セラミック焼結体からなる母基板の上面に、電子部品の搭載部を有する四角形状の複数の配線基板領域が縦横の並びに配列され、前記搭載部を取り囲んで形成された枠状のメタライズ層に金属枠体が接合されるとともに、前記母基板の下面に前記配線基板領域の境界に沿って分割溝が形成された多数個取り配線基板を製造する多数個取り配線基板の製造方法であって、
複数のセラミックグリーンシートを加工し積層して、上面に電子部品の搭載部が枠状のメタライズ層で取り囲まれた四角形状の複数の配線基板領域を縦横の並びに配列した積層体を作製する工程と、
前記積層体の下面に前記配線基板領域の境界に沿って分割溝を形成するとともに、前記積層体の上面の前記配線基板領域の境界に沿って前記メタライズ層の外周に接するように凹部を形成する工程と、
前記セラミックグリーンシートよりも有機成分の割合が大きいセラミックペーストを、前記凹部に、前記凹部から前記メタライズ層の上面よりも上に突出するように塗布する工程と、
前記セラミックペーストが塗布された前記積層体を焼成して母基板とした後、前記セラミックペーストが焼成されてなる突出材の内側に金属枠体を前記メタライズ層と位置合わせして配置して、前記金属枠体をろう材を介して前記メタライズ層に接合する工程と
を備えることを特徴とする多数個取り配線基板の製造方法。 A plurality of rectangular wiring board regions having mounting parts for electronic components are arranged vertically and horizontally on the upper surface of a mother board made of a ceramic sintered body, and a metal is formed on a frame-like metallization layer formed surrounding the mounting parts. A manufacturing method of a multi-cavity wiring board for manufacturing a multi-cavity wiring board in which a frame is bonded and a dividing groove is formed along a boundary of the wiring board region on a lower surface of the mother board,
Processing and laminating a plurality of ceramic green sheets to produce a laminate in which a plurality of rectangular wiring board regions in which electronic component mounting parts are surrounded by a frame-like metallization layer are arranged vertically and horizontally; ,
A dividing groove is formed on the lower surface of the multilayer body along the boundary of the wiring board region, and a recess is formed on the upper surface of the multilayer body so as to contact the outer periphery of the metallized layer along the boundary of the wiring board region. Process,
Applying a ceramic paste having a larger organic component ratio than the ceramic green sheet to the concave portion so as to protrude above the upper surface of the metallized layer from the concave portion;
After firing the laminate to which the ceramic paste has been applied to form a mother substrate, a metal frame is disposed in alignment with the metallized layer on the inside of the protruding material formed by firing the ceramic paste, And a step of joining a metal frame to the metallized layer through a brazing material.
JP2009221928A 2009-09-28 2009-09-28 Multicavity wiring substrate and method of manufacturing the same Pending JP2011071374A (en)

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