JP2011014525A - 保護回路基板、二次電池及び電池パック - Google Patents
保護回路基板、二次電池及び電池パック Download PDFInfo
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- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 229920001155 polypropylene Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000032953 Device battery issue Diseases 0.000 description 1
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- 239000011888 foil Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000625 lithium cobalt oxide Inorganic materials 0.000 description 1
- BFZPBUKRYWOWDV-UHFFFAOYSA-N lithium;oxido(oxo)cobalt Chemical compound [Li+].[O-][Co]=O BFZPBUKRYWOWDV-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/147—Lids or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/584—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
- H01M50/59—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries characterised by the protection means
- H01M50/591—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
- H01M2200/10—Temperature sensitive devices
- H01M2200/106—PTC
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Protection Of Static Devices (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】充放電可能な二次電池または二次電池を含む電池パック300と、これらに備えられる保護回路基板100に関し、前記保護回路基板100の基板ボディ110の内部に2次保護素子を設置して、製造工程を簡素化し、2次保護回路の性能を向上させながら2次保護素子と二次電池の絶縁構造を省略することができる。このため、差別化された電池パックの開発を実現でき、他の製品に比べて競争力を向上させることができる。
【選択図】図6
Description
前記基板ボディの上下面には、絶縁層が形成される。
110:基板ボディ
120:PTC素子
200:二次電池
210:ベアセル
300:電池パック
Claims (23)
- 基板ボディ;及び
前記基板ボディに内蔵された2次保護素子を含むことを特徴とする保護回路基板。 - 前記基板ボディは、略直方体形状に形成され、中央に形成されたホール、一面に実装されて電流を外部に伝達する外部端子、及び他側面に実装された充放電素子を有することを特徴とする請求項1に記載の保護回路基板。
- 前記基板ボディは、少なくとも2層または4層の回路層を含み、前記2次保護素子は、上端部が前記回路層の最上層と連結され、下端部が前記回路層の最下層と連結されたことを特徴とする請求項1に記載の保護回路基板。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項1に記載の保護回路基板。
- 前記絶縁層はPSRからなることを特徴とする請求項4に記載の保護回路基板。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項1に記載の保護回路基板。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項1に記載の保護回路基板。
- 前記PTC素子は、略直方体に形成されたPTC本体と、前記PTC本体の少なくとも二面を取り囲む第1導電部と、前記第1導電部と離隔して前記PTC本体の前記第1導電部が取り囲まない他の面を取り囲む第2導電部とを含むことを特徴とする請求項7に記載の保護回路基板。
- ベアセル;及び
前記ベアセルに電気的に連結される保護回路基板を含み、
前記保護回路基板は、2次保護素子が内蔵された基板ボディを含むことを特徴とする二次電池。 - 前記ベアセルは、缶、前記缶に収容される電極組立体、及び前記缶の開口部を密封するキャップ組立体を含むことを特徴とする請求項9に記載の二次電池。
- 前記保護回路基板において、前記基板ボディの中央に前記ベアセルの第1電極と接続される電極端子が具備され、前記基板ボディの両端部下面には前記ベアセルの第2電極と接続されるリードプレートが設けられたことを特徴とする請求項9に記載の二次電池。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項9に記載の二次電池。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項9に記載の二次電池。
- 前記絶縁層はPSRからなることを特徴とする請求項13に記載の二次電池。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項9に記載の二次電池。
- ベアセル;
前記ベアセルに電気的に連結される保護回路基板;及び
前記保護回路基板を前記ベアセルの一面に結合するトップケース及び前記ベアセルの他側面に結合されるボトムケースを含み、
前記保護回路基板は、2次保護素子が内蔵された基板ボディを含むことを特徴とする電池パック。 - 前記ベアセルは、缶、前記缶に収容される電極組立体、及び前記缶の開口部を密封するキャップ組立体を含むことを特徴とする請求項16に記載の電池パック。
- 前記保護回路基板において、前記基板ボディの中央に前記ベアセルの第1電極と接続される電極端子が具備され、前記基板ボディの両端部下面には前記ベアセルの第2電極と接続されるリードプレートが設けられたことを特徴とする請求項16に記載の電池パック。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項16に記載の電池パック。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項16に記載の電池パック。
- 前記絶縁層はPSRからなることを特徴とする請求項20に記載の電池パック。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項16に記載の電池パック。
- 前記ベアセルとトップケース及びボトムケースの側面を包むラベル紙をさらに含むことを特徴とする請求項16に記載の電池パック。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090060165A KR20110002616A (ko) | 2009-07-02 | 2009-07-02 | 보호회로 기판 및 이차 전지 및 전지 팩 |
KR10-2009-0060165 | 2009-07-02 |
Publications (2)
Publication Number | Publication Date |
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JP2011014525A true JP2011014525A (ja) | 2011-01-20 |
JP5286244B2 JP5286244B2 (ja) | 2013-09-11 |
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Application Number | Title | Priority Date | Filing Date |
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JP2009289670A Expired - Fee Related JP5286244B2 (ja) | 2009-07-02 | 2009-12-21 | 保護回路基板、二次電池及び電池パック |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110003179A1 (ja) |
EP (1) | EP2271192A3 (ja) |
JP (1) | JP5286244B2 (ja) |
KR (1) | KR20110002616A (ja) |
CN (1) | CN101944584A (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2372827A1 (en) * | 2010-03-29 | 2011-10-05 | Samsung SDI Co., Ltd. | Sencodary battery pack |
US20110236727A1 (en) * | 2010-03-29 | 2011-09-29 | Young-Cheol Jang | Secondary battery pack |
USD716304S1 (en) * | 2012-02-09 | 2014-10-28 | Hid Global Gmbh | RFID reader |
KR20130104489A (ko) * | 2012-03-14 | 2013-09-25 | 삼성에스디아이 주식회사 | 연결부재, 이를 구비한 배터리 팩 및 그 제조방법 |
US9093723B2 (en) * | 2012-06-08 | 2015-07-28 | Samsung Sdi Co., Ltd. | Rechargeable battery |
USD709894S1 (en) * | 2012-09-22 | 2014-07-29 | Apple Inc. | Electronic device |
TWI504037B (zh) * | 2013-03-11 | 2015-10-11 | Hitachi Maxell | Lithium secondary battery pack, and the use of this electronic machine, charging system and charging method |
KR102040194B1 (ko) * | 2013-03-25 | 2019-11-04 | 삼성에스디아이 주식회사 | 이차전지 연결용 회로기판 |
KR101650027B1 (ko) * | 2013-09-27 | 2016-08-22 | 주식회사 엘지화학 | 보호회로 모듈을 포함하는 이차전지 팩 |
CN104810878B (zh) * | 2014-01-28 | 2017-05-10 | 广东欧珀移动通信有限公司 | 过压过流保护电路和移动终端 |
USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
USD754131S1 (en) * | 2014-09-01 | 2016-04-19 | Samsung Electronics Co., Ltd. | Portable solid state disk |
USD743395S1 (en) * | 2015-01-09 | 2015-11-17 | Square, Inc. | Card reader |
USD792409S1 (en) * | 2015-11-11 | 2017-07-18 | Samsung Electronics Co., Ltd. | External solid state drive |
CN115425481A (zh) * | 2016-08-02 | 2022-12-02 | 伯恩斯公司 | 具有集成式自恢复热熔丝的连接器 |
USD837790S1 (en) * | 2016-08-03 | 2019-01-08 | Transcend Information, Inc. | Mobile storage device |
US10355317B2 (en) | 2016-11-29 | 2019-07-16 | Microsoft Technology Licensing, Llc | Battery circuit in sealed pouch |
USD950564S1 (en) * | 2021-04-08 | 2022-05-03 | Guangjun Zhou | Video capture card |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198654A (ja) * | 2000-12-25 | 2002-07-12 | Kyocera Corp | 電気素子内蔵配線基板およびその製造方法 |
JP2002231201A (ja) * | 2001-01-30 | 2002-08-16 | Sanyo Electric Co Ltd | パック電池とその製造方法 |
JP2002280746A (ja) * | 2001-03-20 | 2002-09-27 | Polytronics Technology Corp | 埋込み機能素子を備えたプリント回路基板 |
JP2002353628A (ja) * | 2001-05-24 | 2002-12-06 | Hitachi Ltd | 多層プリント配線基板及び電子機器 |
WO2009057654A1 (ja) * | 2007-11-01 | 2009-05-07 | Dai Nippon Printing Co., Ltd. | 部品内蔵配線板、部品内蔵配線板の製造方法 |
EP2058845A1 (en) * | 2006-08-28 | 2009-05-13 | Mitsubishi Heavy Industries, Ltd. | Thin film manufacturing apparatus using discharge electrode, and solar cell manufacturing method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5117976A (en) * | 1991-01-09 | 1992-06-02 | Sanyo Energy (U.S.A.) Corp. | Display packaging for batteries |
US6124781A (en) * | 1998-10-06 | 2000-09-26 | Bourns, Inc. | Conductive polymer PTC battery protection device and method of making same |
US6319631B1 (en) * | 1999-09-08 | 2001-11-20 | Motorola, Inc. | Contact system for interconnection of substrate and battery cell |
US7563535B2 (en) * | 2002-02-06 | 2009-07-21 | Sony Corporation | Battery pack with insulating film sheath material and method of producing the same |
JP2005535110A (ja) * | 2002-06-25 | 2005-11-17 | タイコ・エレクトロニクス・コーポレイション | データバスインターフェースに過電流及び過電圧の保護とコモンモードフィルタリングを与える集積化デバイス |
KR20040037547A (ko) * | 2002-10-29 | 2004-05-07 | (주)포스앤테크 | 이차 전지팩 |
KR100477752B1 (ko) * | 2002-12-26 | 2005-03-21 | 삼성에스디아이 주식회사 | 보호소자 및 이를 구비한 리튬 이차 전지 |
KR100496305B1 (ko) * | 2003-05-22 | 2005-06-17 | 삼성에스디아이 주식회사 | 파우치형 리튬 이차 전지와 이의 제조 방법 |
US6986199B2 (en) * | 2003-06-11 | 2006-01-17 | The United States Of America As Represented By The Secretary Of The Navy | Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials |
US7113381B2 (en) * | 2004-06-25 | 2006-09-26 | Shallco, Inc. | Overcurrent protection circuit including auto-reset breaker and PTC resistor |
TWI301739B (en) * | 2004-12-03 | 2008-10-01 | Via Tech Inc | Structure and method for embedded passive component assembly |
KR100704936B1 (ko) * | 2005-06-22 | 2007-04-09 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제작방법 |
KR100867923B1 (ko) * | 2007-10-30 | 2008-11-10 | 삼성에스디아이 주식회사 | 보호회로기판을 구비하는 이차 전지 |
KR100928120B1 (ko) * | 2007-11-07 | 2009-11-24 | 삼성에스디아이 주식회사 | 이차 전지 |
KR100954029B1 (ko) * | 2007-11-12 | 2010-04-20 | 삼성에스디아이 주식회사 | 이차 전지용 보호회로모듈 및 이를 이용한 이차 전지 |
KR100998303B1 (ko) * | 2007-12-13 | 2010-12-03 | 삼성에스디아이 주식회사 | 보호회로 조립체 및 이를 구비하는 배터리 팩 |
KR100959871B1 (ko) * | 2007-12-17 | 2010-05-27 | 삼성에스디아이 주식회사 | 보호회로기판 및 이를 구비하는 배터리 팩 |
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2009
- 2009-07-02 KR KR1020090060165A patent/KR20110002616A/ko active Search and Examination
- 2009-12-21 JP JP2009289670A patent/JP5286244B2/ja not_active Expired - Fee Related
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2010
- 2010-06-11 US US12/814,250 patent/US20110003179A1/en not_active Abandoned
- 2010-07-01 CN CN2010102203498A patent/CN101944584A/zh active Pending
- 2010-07-02 EP EP10168198A patent/EP2271192A3/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198654A (ja) * | 2000-12-25 | 2002-07-12 | Kyocera Corp | 電気素子内蔵配線基板およびその製造方法 |
JP2002231201A (ja) * | 2001-01-30 | 2002-08-16 | Sanyo Electric Co Ltd | パック電池とその製造方法 |
JP2002280746A (ja) * | 2001-03-20 | 2002-09-27 | Polytronics Technology Corp | 埋込み機能素子を備えたプリント回路基板 |
JP2002353628A (ja) * | 2001-05-24 | 2002-12-06 | Hitachi Ltd | 多層プリント配線基板及び電子機器 |
EP2058845A1 (en) * | 2006-08-28 | 2009-05-13 | Mitsubishi Heavy Industries, Ltd. | Thin film manufacturing apparatus using discharge electrode, and solar cell manufacturing method |
WO2009057654A1 (ja) * | 2007-11-01 | 2009-05-07 | Dai Nippon Printing Co., Ltd. | 部品内蔵配線板、部品内蔵配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110003179A1 (en) | 2011-01-06 |
JP5286244B2 (ja) | 2013-09-11 |
EP2271192A2 (en) | 2011-01-05 |
EP2271192A3 (en) | 2011-01-12 |
KR20110002616A (ko) | 2011-01-10 |
CN101944584A (zh) | 2011-01-12 |
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