JP2010177607A - Work stage and exposure apparatus employing the same - Google Patents
Work stage and exposure apparatus employing the same Download PDFInfo
- Publication number
- JP2010177607A JP2010177607A JP2009021150A JP2009021150A JP2010177607A JP 2010177607 A JP2010177607 A JP 2010177607A JP 2009021150 A JP2009021150 A JP 2009021150A JP 2009021150 A JP2009021150 A JP 2009021150A JP 2010177607 A JP2010177607 A JP 2010177607A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum suction
- work
- suction hole
- vacuum
- work stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
本発明は、露光等の加工処理される基板を保持するワークステージに係わり、特に、反りが生じているウエハ等の基板（ワーク）を吸着保持することのできるワークステージ、及び該ワークステージを使った露光装置に関する。 The present invention relates to a work stage for holding a substrate to be processed such as exposure, and in particular, a work stage capable of sucking and holding a substrate (work) such as a warped wafer, and the work stage. The present invention relates to an exposure apparatus.
従来、半導体、プリント基板、液晶基板等（以下ワークとも呼ぶ）を製造する工程において、露光等の加工処理を行う際、ワークが位置ずれを起こさないように、ワークを吸着保持するワークステージが使われる。 Conventionally, in the process of manufacturing a semiconductor, a printed circuit board, a liquid crystal substrate, etc. (hereinafter also referred to as a work), a work stage that holds and holds the work is used to prevent the work from being displaced when performing processing such as exposure. Is called.
図８は、従来技術に係るワークを吸着保持するワークステージを備えた露光装置の一例を示す図である。
同図に示すように、この露光装置１００は、紫外線を出射する光照射部１０１、パターンが形成されたマスク１０２、マスク１０２を保持するマスクステージ１０３、レジストが塗布されているウエハやプリント基板等のワーク１０４を保持するワークステージ１０５、ワークステージ１０５上に保持されたワーク１０４上にマスク１０２のパターン像を投影する投影レンズ１０６等から構成される。なお、露光装置１００中に、投影レンズ１０６を備えないものもある。更に、光照射部１０１は、紫外線を含む光を放射するランプ１０１１と、ランプ１０１１からの光を反射するミラー１０１２を備えている。また、ワークステージ１０５の表面には、真空吸着溝（または複数の真空吸着孔）１０５１が形成されている。ワークステージ１０５には配管１０５２が接続され、配管１０５２を介して、真空吸着孔（真空吸着溝）１０５１に、ワーク１０４を保持する際には真空が、またワーク１０４をワークステージ１０５から取外す際にはエアーが供給される。
FIG. 8 is a view showing an example of an exposure apparatus provided with a work stage for sucking and holding a work according to the prior art.
As shown in the figure, the exposure apparatus 100 includes a light irradiation unit 101 that emits ultraviolet rays, a mask 102 on which a pattern is formed, a mask stage 103 that holds the mask 102, a wafer or a printed circuit board on which a resist is applied, and the like. The workpiece stage 105 that holds the workpiece 104, the projection lens 106 that projects the pattern image of the mask 102 onto the workpiece 104 held on the workpiece stage 105, and the like. Note that some exposure apparatuses 100 do not include the projection lens 106. Further, the light irradiation unit 101 includes a lamp 1011 that emits light including ultraviolet rays, and a mirror 1012 that reflects light from the lamp 1011. A vacuum suction groove (or a plurality of vacuum suction holes) 1051 is formed on the surface of the work stage 105. A pipe 1052 is connected to the work stage 105. When holding the work 104 in the vacuum suction hole (vacuum suction groove) 1051 via the pipe 1052, a vacuum is applied, and when removing the work 104 from the work stage 105. Air is supplied.
この露光装置の動作を以下に簡単に説明する。不図示の搬送手段により、露光装置１００のワークステージ１０５上にプリント基板等のワーク１０４が置かれる。ワーク１０４の表面（パターンを形成する側）には、レジストが塗布されている。ワークステージ１０５の真空吸着孔（真空吸着溝）１０５１に真空が供給され、ワーク１０４はワークステージ１０５上に吸着保持される。ワークステージ１０５への真空の供給は、露光処理中、ワーク１０４が移動しないように続けられる。露光処理が終わると、制御部１０８によって電磁弁１０７を切り替え、真空吸着孔（真空吸着溝）１０５１への真空の供給を止めてワーク１０４の吸着保持を解除し、真空吸着孔（真空吸着溝）１０５１にエアーを供給し、真空吸着孔（真空吸着溝）１０５１からはエアーを吹き出させる。これにより、ワーク１０４はワークステージ１０５から外れ、不図示の搬送手段により、露光装置１００外に搬送される。 The operation of this exposure apparatus will be briefly described below. A workpiece 104 such as a printed circuit board is placed on the workpiece stage 105 of the exposure apparatus 100 by a conveyance unit (not shown). A resist is applied to the surface of the workpiece 104 (pattern forming side). A vacuum is supplied to the vacuum suction hole (vacuum suction groove) 1051 of the work stage 105, and the work 104 is sucked and held on the work stage 105. The supply of vacuum to the work stage 105 is continued so that the work 104 does not move during the exposure process. When the exposure process is completed, the control unit 108 switches the electromagnetic valve 107, stops supplying the vacuum to the vacuum suction hole (vacuum suction groove) 1051, releases the suction holding of the work 104, and vacuum suction hole (vacuum suction groove). Air is supplied to 1051, and air is blown out from the vacuum suction hole (vacuum suction groove) 1051. As a result, the workpiece 104 is detached from the workpiece stage 105, and is conveyed outside the exposure apparatus 100 by a conveying means (not shown).
一般に、露光等の処理を行うワークには、ウエハやガラス基板、やや厚いプリント基板、薄くて柔らかいフイルム状基板等様々な種類がある。また、例えば、ＣＶＤ工程やエッチング工程を繰り返すうちに反りや変形を生じるものもある。最近は用途によっては、ガラス基板の上にシリコンウエハを貼り付けたり、サファイヤ基板上に窒化ガリウムを貼り付けたりした特殊な基板も使用されるようになってきている。このように、材質の異なる２枚の基板を貼り合わせたワークは、各材質の熱膨張係数の違いから反りが発生しやすい。ワークステージは、上記のような様々な材質や変形しているワークを吸着保持するために、真空吸着溝（孔）の形状や真空吸着方法が、種々提案されている。以下その一例について説明する。 In general, there are various types of workpieces for processing such as exposure, such as a wafer, a glass substrate, a slightly thick printed substrate, and a thin and soft film substrate. Further, for example, there are some that warp or deform while repeating a CVD process or an etching process. Recently, a special substrate in which a silicon wafer is attached on a glass substrate or gallium nitride is attached on a sapphire substrate has been used depending on applications. In this way, a workpiece in which two substrates of different materials are bonded together is likely to warp due to the difference in thermal expansion coefficient of each material. Various types of vacuum suction grooves (holes) and vacuum suction methods have been proposed for the work stage in order to suck and hold various materials as described above and deformed workpieces. One example will be described below.
特許文献１に記載されたステージ装置は、真空を供給する孔と、その孔から放射状に延びる複数の真空吸着溝を備えており、このように構成することにより、薄くて軟らかいフレキシブルな基板を、空気だまりを発生させずに吸着保持することができるものである。
また、特許文献２に記載されたワークテーブルは、ワークを吸着保持する多孔質プレートを、周縁部空気室に連通する周縁部領域と、中央部空気室に連通する中央部領域とに区分しており、例えば、周縁部領域から中央部領域へ順番に真空を供給することにより、反りが生じた薄手のワークを吸着保持することができるものである。
The stage apparatus described in Patent Document 1 includes a hole for supplying a vacuum and a plurality of vacuum suction grooves extending radially from the hole. By configuring in this way, a thin and soft flexible substrate can be obtained. It can be adsorbed and held without generating air pockets.
Further, the work table described in Patent Document 2 divides the porous plate that adsorbs and holds the work into a peripheral region that communicates with the peripheral air chamber and a central region that communicates with the central air chamber. For example, by supplying a vacuum in order from the peripheral area to the central area, a thin work having warpage can be sucked and held.
本件発明者等は、反りが生じたウエハを、反りを矯正して全面で吸着保持できるワークステージについて鋭意検討した。反りを生じたウエハは、例えば、図９（ａ）に示すように、椀形に反っており、φ１２０ｍｍのウエハ２０１において、周辺部２０１１は中央部２０１２に対して１ｍｍまたはそれ以上反っている。また、ウエハによっては、図９（ｂ）に示すように、周辺部２０２１が波状に変形しているものもある。このような反りが生じているウエハ２０２を吸着保持するために、例えば、特許文献１や特許文献２に記載されているようなワークステージ用いて実験したが、全面を吸着保持することはできなかった。なお、これらの図では、分かり易いように、ワーク反り量は誇張して示されている。以下に、全面吸着が困難である理由について説明する。 The inventors of the present invention diligently studied a work stage that can correct and warp a warped wafer over the entire surface. For example, as shown in FIG. 9A, the warped wafer is warped in a bowl shape. In the wafer 201 having a diameter of 120 mm, the peripheral portion 2011 is warped by 1 mm or more with respect to the central portion 2012. Also, depending on the wafer, as shown in FIG. 9B, the peripheral portion 2021 may be deformed in a wave shape. In order to suck and hold the wafer 202 with such warpage, for example, an experiment was performed using a work stage as described in Patent Document 1 or Patent Document 2, but the entire surface cannot be sucked and held. It was. In these drawings, the amount of workpiece warpage is exaggerated for easy understanding. The reason why the entire surface adsorption is difficult will be described below.
従来技術に係る図１０（ａ）のワークステージ３０１の断面図に示すように、放射状に延びる複数の真空吸着溝３０１１を備えたワークステージ３０１を用いた場合は、真空吸着溝３０１１に真空を供給しても、空気がウエハ３０２の反っている周辺部３０２１から真空吸着溝３０１１に向かって流れ込み、真空吸着溝３０１１の真空吸着圧が低下し、ウエハ３０２を吸着することができなかった。 As shown in the sectional view of the work stage 301 in FIG. 10A according to the prior art, when a work stage 301 having a plurality of radially extending vacuum suction grooves 3011 is used, a vacuum is supplied to the vacuum suction grooves 3011. Even so, air flows from the peripheral portion 3021 where the wafer 302 is warped toward the vacuum suction groove 3011, the vacuum suction pressure of the vacuum suction groove 3011 is lowered, and the wafer 302 cannot be sucked.
また、従来技術に係る図１０（ｂ）のワークステージ３０３の断面図に示すように、表面に多数の真空吸着孔３０３１を備えたワークステージ３０３を用いた場合は、ウエハ３０４の中央部３０４１は、接しているワークステージ３０３の中央部の真空吸着孔３０３１には吸着されるが、やはり、空気がウエハ３０４の反っている周辺部３０４２から真空吸着孔３０３１に流れ込むので、それ以上は真空吸着圧が低下し、ウエハ３０４全面を吸着保持することができなかった。 Further, as shown in the cross-sectional view of the work stage 303 in FIG. 10B according to the prior art, when the work stage 303 having a large number of vacuum suction holes 3031 on the surface is used, the central portion 3041 of the wafer 304 is However, since air flows into the vacuum suction hole 3031 from the peripheral part 3042 of the wafer 304 which is warped, the vacuum suction pressure is more than that. As a result, the entire surface of the wafer 304 could not be sucked and held.
また、従来技術に係る図１１（ａ）、（ｂ）のワークステージの断面図及び平面図に示すように、リング状の真空吸着溝を、ワークステージ４０１の中央部から第１の真空吸着溝４０１１、第２の真空吸着溝４０１２、第３の真空吸着溝４０１３・・・を複数形成し、内側の真空吸着溝から順番に、第１の真空吸着溝４０１１、第２の真空吸着溝４０１２、第３の真空吸着溝４０１３・・・に真空を供給するようにした。しかし、同図に示すように、ウエハ４０２のワークステージ４０１に近い部分４０２１が吸着され、そこから外側に向かって吸着されていく傾向にはあるものの、吸着されている部分の反対側が逆にワークステージ４０１から離れてしまい、そこからリークして真空吸着圧が低下し、やはりウエハ４０２全面を吸着保持をすることができなかった。 Further, as shown in the sectional views and plan views of the work stage of FIGS. 11A and 11B according to the prior art, the ring-shaped vacuum suction groove is formed from the center of the work stage 401 to the first vacuum suction groove. 4011, a second vacuum suction groove 4012, a third vacuum suction groove 4013..., And in order from the inner vacuum suction groove, the first vacuum suction groove 4011, the second vacuum suction groove 4012, A vacuum is supplied to the third vacuum suction grooves 4013. However, as shown in the figure, although the portion 4021 of the wafer 402 close to the work stage 401 tends to be attracted and then attracted toward the outside, the opposite side of the attracted portion is reversed to the workpiece. The wafer was separated from the stage 401, leaked from the stage 401, and the vacuum suction pressure decreased, and the entire surface of the wafer 402 could not be sucked and held.
本発明の目的は、上記の従来技術の問題点に鑑みて、真空吸着により基板（ワーク）を吸着保持するワークステージにおいて、椀形の反りが生じている基板（ワーク）であっても、その反りを矯正して基板（ワーク）全面を吸着保持することのできるワークステージ及び該ワークステージを用いた露光装置を提供することにある。 The object of the present invention is to solve the above-mentioned problems of the prior art, even in the case of a substrate (work) having a bowl-shaped warp in a work stage that holds the substrate (work) by vacuum suction. An object of the present invention is to provide a work stage capable of correcting and warping the entire surface of a substrate (work) and an exposure apparatus using the work stage.
本発明は、上記の課題を解決するために、次のような手段を採用した。
第１の手段は、真空吸着によりワークを吸着保持するワークステージにおいて、ワークを吸着保持するワークステージの表面に、第１の配管に接続された複数の真空吸着孔からなる真空吸着孔列を放射状に複数列配置した第１の真空吸着孔群と、上記第１の真空吸着孔群に挟まれる領域に形成され、第２の配管に接続された第２の真空吸着孔群と、上記ワークを吸着保持する際に、上記第１の配管から上記第１の真空吸着孔群に真空を供給し、次に、上記第２の配管から上記第２の真空吸着孔群に真空を供給する制御部と、を備えたことを特徴とするワークステージである。
第２の手段は、光を出射する光出射部と、パターンが形成されたマスクを保持するマスクステージと、上記マスクに形成されたパターンが転写されるワークを保持するワークステージとを備える露光装置において、上記ワークステージは、前記第１の手段に記載のワークステージであることを特徴とする露光装置である。
The present invention employs the following means in order to solve the above problems.
In a work stage that sucks and holds a work by vacuum suction, the first means radially arranges a vacuum suction hole array including a plurality of vacuum suction holes connected to the first pipe on the surface of the work stage that sucks and holds the work. A plurality of first vacuum suction hole groups arranged in a row, a second vacuum suction hole group formed in a region sandwiched between the first vacuum suction hole groups and connected to a second pipe, and the workpiece A controller for supplying a vacuum from the first pipe to the first vacuum suction hole group and then supplying a vacuum from the second pipe to the second vacuum suction hole group when sucking and holding. And a work stage characterized by comprising
The second means is an exposure apparatus comprising a light emitting part for emitting light, a mask stage for holding a mask on which a pattern is formed, and a work stage for holding a work on which the pattern formed on the mask is transferred In the above, the work stage is the work stage described in the first means.
本発明のワークステージによれば、椀形の反りが生じているワークや波うっているようなワークであっても、反りを矯正しながら、ワークをワークステージ全面に確実に吸着保持することができる。
また、本発明の露光装置によれば、椀形の反りが生じているワークや波うっているようなワークをワークステージ全面に確実に吸着保持することのできる露光装置を提供することができる。
According to the work stage of the present invention, it is possible to reliably suck and hold the work on the entire surface of the work stage while correcting the warp even if the work is wavy or wavy. it can.
Further, according to the exposure apparatus of the present invention, it is possible to provide an exposure apparatus that can reliably hold a workpiece having a saddle-shaped warpage or a wavy workpiece on the entire surface of the workpiece stage.
本発明の一実施形態を図１ないし図６を用いて説明する。
図１は、本実施形態の発明に係るワークステージを備えた露光装置の概略構成を示す断面図である。なお、以下においては、露光装置に用いるワークステージを例にして説明しているが、露光装置以外であっても、ワーク（基板）を吸着保持して処理する装置であれば、本発明に係るワークステージを適用することができる。
同図に示すように、この露光装置１は、紫外線を出射する光照射部２、パターンが形成されたマスク３、マスク３を保持するマスクステージ４、レジストが塗布されているウエハやプリント基板等のワーク５を保持するワークステージ６、ワークステージ６上に保持されたワーク５上にマスク３のパターン像を投影する投影レンズ７等から構成される。なお、露光装置１中に、投影レンズ７を備えないものもある。光照射部２は、紫外線を含む光を放射するランプ２１と、ランプ２１からの光を反射するミラー２２を備える。また、ワークステージ６の表面には、真空吸着孔群６１、６２が形成されている。
An embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a sectional view showing a schematic configuration of an exposure apparatus provided with a work stage according to the invention of this embodiment. In the following description, the work stage used in the exposure apparatus is described as an example. However, any apparatus other than the exposure apparatus can be used as long as it is an apparatus that holds and processes a work (substrate). Work stage can be applied.
As shown in FIG. 1, the exposure apparatus 1 includes a light irradiation unit 2 that emits ultraviolet rays, a mask 3 on which a pattern is formed, a mask stage 4 that holds the mask 3, a wafer on which a resist is applied, a printed board, and the like. The workpiece stage 6 that holds the workpiece 5, the projection lens 7 that projects the pattern image of the mask 3 onto the workpiece 5 held on the workpiece stage 6, and the like. Some exposure apparatuses 1 do not include the projection lens 7. The light irradiation unit 2 includes a lamp 21 that emits light including ultraviolet rays, and a mirror 22 that reflects light from the lamp 21. Further, vacuum suction hole groups 61 and 62 are formed on the surface of the work stage 6.
ワークステージ６には第１の真空配管７１及び第２の真空配管７２が接続され、制御部９から第１の電磁弁８１及び第２の電磁弁８２を制御することによって第１の真空配管７１及び第２の真空配管７２を介して、真空吸着孔に、ワーク５を保持する際には真空が、またワーク５をワークステージ６から取外す際にはエアーが供給される。ワークステージ６への真空の供給機構について詳述すると、第１の真空配管７１には第１の電磁弁８１が、第２の真空配管７２には第２の電磁弁８２が取り付けられている。第１の電磁弁８１と第２の電磁弁８２は、それぞれ制御部９に接続されており、制御部９からの動作信号により動作する。第１の真空配管７１と第２の真空配管７２には独立して真空が供給されるように構成されており、第１の電磁弁８１が動作すると第１の真空配管７１に真空が供給され、第２の電磁弁８２が動作すると第２の真空配管７２に真空が供給される。 A first vacuum pipe 71 and a second vacuum pipe 72 are connected to the work stage 6, and the first vacuum pipe 71 is controlled by controlling the first electromagnetic valve 81 and the second electromagnetic valve 82 from the controller 9. The vacuum suction hole is supplied with a vacuum when the work 5 is held, and when the work 5 is removed from the work stage 6, air is supplied via the second vacuum pipe 72. The mechanism for supplying vacuum to the work stage 6 will be described in detail. The first electromagnetic valve 81 is attached to the first vacuum pipe 71, and the second electromagnetic valve 82 is attached to the second vacuum pipe 72. The first electromagnetic valve 81 and the second electromagnetic valve 82 are each connected to the control unit 9 and operate according to an operation signal from the control unit 9. The first vacuum pipe 71 and the second vacuum pipe 72 are configured to be supplied with a vacuum independently. When the first electromagnetic valve 81 is operated, a vacuum is supplied to the first vacuum pipe 71. When the second electromagnetic valve 82 is operated, a vacuum is supplied to the second vacuum pipe 72.
図２は、図１に示したワークステージ６の拡大平面図、図３（ａ）は、図２のＡ−Ａ部分における断面図、図３（ａ）は、図２のＢ−Ｂ部分における断面図である。
図２に示すように、ワークステージ６には、第１の真空吸着孔群６１と第２の真空吸着孔群６２を備える。第１の真空吸着孔群６１は、複数の真空吸着孔Ｘをワークステージ６の中央部から周辺部（外側）に向かって並べた真空吸着孔列を、放射状に複数列配置して形成する（図中Ｘで示す）。なお、同図においては、第１の真空吸着孔群６１は、直線状に並べられているが、ある範囲であれば、蛇行（カーブ）したり千鳥状（ジグザグ）に配置してもよい。また、第２の真空吸着孔群６２は、第１の真空吸着孔群６１に挟まれる領域に形成する（図中Ｙで示す）。本実施形態においては、各真空吸着孔の直径はφ１ｍｍであり、その個数は、第１の真空吸着孔群６１の真空吸着孔Ｘは１０個、第２の真空吸着孔群６２の真空吸着孔Ｙは１９個である。第１の真空吸着孔群６１の真空吸着孔Ｘは全て第１の真空配管７１に接続され、また、第２の真空吸着孔群６２の真空吸着孔Ｙは全て第２の真空配管７２に接続される。第１の真空配管７１と第２の真空配管７２には独立してワーク吸着用の真空が供給される。
2 is an enlarged plan view of the work stage 6 shown in FIG. 1, FIG. 3 (a) is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 3 (a) is taken along the line BB in FIG. It is sectional drawing.
As shown in FIG. 2, the work stage 6 includes a first vacuum suction hole group 61 and a second vacuum suction hole group 62. The first vacuum suction hole group 61 is formed by arranging a plurality of vacuum suction hole rows in which a plurality of vacuum suction holes X are arranged from the central portion toward the peripheral portion (outside) of the work stage 6 in a radial manner ( Indicated in the figure by X). In the figure, the first vacuum suction hole groups 61 are arranged in a straight line, but may be meandering (curved) or arranged in a zigzag form within a certain range. The second vacuum suction hole group 62 is formed in a region sandwiched between the first vacuum suction hole group 61 (indicated by Y in the figure). In the present embodiment, the diameter of each vacuum suction hole is φ1 mm, and the number thereof is 10 vacuum suction holes X of the first vacuum suction hole group 61 and vacuum suction holes of the second vacuum suction hole group 62. Y is 19. All the vacuum suction holes X of the first vacuum suction hole group 61 are connected to the first vacuum pipe 71, and all the vacuum suction holes Y of the second vacuum suction hole group 62 are connected to the second vacuum pipe 72. Is done. The vacuum for workpiece adsorption is supplied to the first vacuum pipe 71 and the second vacuum pipe 72 independently.
図４、図５、及び図６を使用して、本発明のワークステージの動作について説明する。図４（ａ）〜図４（ｃ）は図３（ａ）の場合に相当し、図５（ａ）〜図５（ｃ）は図３（ｂ）の場合に相当する。なお、これらの図では、分かり易いように、ワーク反り量は誇張して示されている。また、図６はワークステージ６を上から見た図であり、ワーク５が吸着されていく様子を模式的に示したものである。 The operation of the work stage according to the present invention will be described with reference to FIGS. 4, 5, and 6. 4 (a) to 4 (c) correspond to the case of FIG. 3 (a), and FIGS. 5 (a) to 5 (c) correspond to the case of FIG. 3 (b). In these drawings, the amount of workpiece warpage is exaggerated for easy understanding. FIG. 6 is a view of the work stage 6 as viewed from above, and schematically shows a state in which the work 5 is attracted.
まず、図４（ａ）に示すように、ワークステージ６に、反りが発生しているワーク（ウエハ等）５が、不図示の搬送機構により搬送され、載置される。図１に示した制御部９が第１の電磁弁８１を動作させ、第１の真空配管７１にワーク吸着用の真空を供給する。第１の真空吸着孔群７１の真空吸着孔Ｘに真空が供給される。ワーク５は椀形に反っており、その中央部かその周辺でワークステージ６と接している。そのため、ワーク５はワークステージ６の中央に設けた第１の真空吸着孔群６１の真空吸着孔Ｘにより吸着される。 First, as shown in FIG. 4A, a workpiece (wafer or the like) 5 in which a warp is generated is transferred to and placed on the workpiece stage 6 by a transfer mechanism (not shown). The control unit 9 shown in FIG. 1 operates the first electromagnetic valve 81 to supply a vacuum for workpiece adsorption to the first vacuum pipe 71. A vacuum is supplied to the vacuum suction holes X of the first vacuum suction hole group 71. The work 5 is warped in a bowl shape and is in contact with the work stage 6 at the center or the periphery thereof. Therefore, the work 5 is sucked by the vacuum suction hole X of the first vacuum suction hole group 61 provided in the center of the work stage 6.
次に、図４（ｂ）に示すように、第１の真空吸着孔群６１は、放射状に３列形成されているので、反っているワーク５は、その３列の中でワーク５とワークステージ６との間隔が最も狭い列のワークステージ６の中央部（内側）の真空吸着孔Ｘに引かれて吸着される。すると、今度は、その列の外側にある真空吸着孔Ｘとワーク５との間隔が狭くなり、その真空吸着孔Ｘに引かれて吸着される（図６の矢印（１）に対応）。他の列の真空吸着孔Ｘは、この段階では、ワーク５を吸着できず、リークを生じている。しかし、ワークステージ６に形成されている真空吸着孔Ｘ（Ｙ）は径がφ１ｍｍと小さく、また真空吸着孔Ｘ（Ｙ）の個数も少ないので、第１の真空配管７１に供給する真空の圧力が上がってしまう（大気圧に近づいてしまう）ほどの大量の空気は流れ込まない。 Next, as shown in FIG. 4B, since the first vacuum suction hole group 61 is formed in three rows in a radial pattern, the warped workpiece 5 is the workpiece 5 and the workpiece in the three rows. It is attracted to the vacuum suction hole X in the central portion (inner side) of the work stages 6 in the row having the narrowest distance from the stage 6. Then, this time, the space between the vacuum suction hole X outside the row and the work 5 is narrowed, and the vacuum suction hole X is pulled and sucked (corresponding to the arrow (1) in FIG. 6). The vacuum suction holes X in the other rows cannot leak the workpiece 5 at this stage, causing a leak. However, since the vacuum suction hole X (Y) formed in the work stage 6 has a small diameter of φ1 mm and the number of vacuum suction holes X (Y) is small, the pressure of the vacuum supplied to the first vacuum pipe 71 is reduced. A large amount of air will not flow in so as to rise (approaching atmospheric pressure).
やがて、図４（ｃ）に示すように、反ったワーク５は、第１の真空吸着孔群７１の１列により吸着される（図６の矢印（１）に対応）。この状態を、図２のＢ−Ｂ断面図で見ると、図５（ａ）に示すようになる。 Eventually, as shown in FIG. 4C, the warped work 5 is sucked by one row of the first vacuum suction hole group 71 (corresponding to the arrow (1) in FIG. 6). When this state is seen in the BB sectional view of FIG. 2, it becomes as shown in FIG.
次に、図５（ａ）に示す状態で、制御部９は第２の電磁弁８２を動作させ、第２の真空配管７２にワーク吸着用の真空を供給すると、第２の真空吸着孔群６２に真空が供給される。第２の真空配管７２に真空を供給するタイミングは、第１の真空配管７１に真空を供給してから第２の真空配管７２に真空を供給するまでの時間（数秒から数十秒）であり、タイマーで設定しても良いし、ワーク５が第１の真空吸着孔群６１の１列に吸着されると、第１の真空配管７１に供給する真空の圧力が変動する（圧力が多少下がる）ので、その変動を真空センサにより検出し、第２の真空配管７２に供給するようにしてもよい。 Next, in the state shown in FIG. 5A, when the control unit 9 operates the second electromagnetic valve 82 and supplies a vacuum for workpiece suction to the second vacuum pipe 72, the second vacuum suction hole group. A vacuum is supplied to 62. The timing for supplying the vacuum to the second vacuum pipe 72 is the time from supplying the vacuum to the first vacuum pipe 71 to supplying the vacuum to the second vacuum pipe 72 (several seconds to several tens of seconds). The pressure may be set by a timer, or when the work 5 is sucked into one row of the first vacuum suction hole group 61, the pressure of the vacuum supplied to the first vacuum pipe 71 fluctuates (the pressure slightly decreases). Therefore, the fluctuation may be detected by a vacuum sensor and supplied to the second vacuum pipe 72.
次に、図５（ｂ）に示すように、ワーク５は、第１の真空吸着孔群６１の１列により吸着されているので、ワーク５を吸着している真空吸着孔Ｘの列の隣にある、第２の真空吸着孔群６２の真空吸着孔Ｙとワーク５の間隔は狭くなっている。そのため、ワーク５はこの第２の真空吸着孔群６２の真空吸着孔Ｙに引かれて吸着される（図６の矢印（２）に対応）。ワーク５が、第１の真空吸着孔群６１の隣にある第２の真空吸着孔群６２の真空吸着孔Ｙに吸着されると、第２の真空吸着孔群６２において、さらにその周方向に隣りの真空吸着孔Ｙや径方向（外側）の隣りの真空吸着孔Ｙにワーク５は吸着されていく（図６の矢印（３）に対応）。 Next, as shown in FIG. 5B, since the workpieces 5 are adsorbed by one row of the first vacuum suction hole group 61, next to the row of the vacuum suction holes X that suck the workpieces 5. The distance between the vacuum suction hole Y of the second vacuum suction hole group 62 and the work 5 is narrow. Therefore, the work 5 is attracted by being attracted by the vacuum suction hole Y of the second vacuum suction hole group 62 (corresponding to the arrow (2) in FIG. 6). When the work 5 is adsorbed by the vacuum suction hole Y of the second vacuum suction hole group 62 adjacent to the first vacuum suction hole group 61, the workpiece 5 is further moved in the circumferential direction in the second vacuum suction hole group 62. The workpiece 5 is sucked into the adjacent vacuum suction hole Y or the adjacent vacuum suction hole Y in the radial direction (outside) (corresponding to the arrow (3) in FIG. 6).
図５（ｃ）に示すように、ワーク５は、反りが矯正されながら順次周方向に吸着され、最初はワーク５が吸着されていなかった第１の真空吸着孔群６１の真空吸着孔列にまで達する。すると、現段階では、ワーク５は第２の真空吸着孔群６２により吸着されているので、ワーク５と第１の真空吸着孔群６１の真空吸着孔列との間隔は狭くなっており、ワーク５は第１の真空吸着孔群６１の真空吸着孔列により吸着される（図６の矢印（４）に対応）。ワーク５が第１の真空吸着孔群６１の真空吸着孔列Ｘに吸着されると、ワーク５はさらにその隣りにある第２の真空吸着孔群６２の真空吸着孔Ｙによりワークステージ６の周方向と径方向に順次吸着されていく（図６の矢印（５）に対応）。そして、最後に、ワーク５は反りが矯正されてワークステージ６全面で吸着保持される（図６の矢印（７）に対応）。 As shown in FIG. 5C, the workpieces 5 are sequentially sucked in the circumferential direction while warping is corrected, and the workpieces 5 are first placed in the vacuum suction hole rows of the first vacuum suction hole group 61 in which the workpieces 5 are not sucked. Reach up to. Then, at the present stage, since the work 5 is sucked by the second vacuum suction hole group 62, the interval between the work 5 and the vacuum suction hole row of the first vacuum suction hole group 61 is narrowed. 5 is adsorbed by the vacuum suction hole array of the first vacuum suction hole group 61 (corresponding to the arrow (4) in FIG. 6). When the work 5 is sucked by the vacuum suction hole row X of the first vacuum suction hole group 61, the work 5 is further surrounded by the vacuum suction hole Y of the second vacuum suction hole group 62 adjacent thereto. Adsorbed sequentially in the direction and the radial direction (corresponding to the arrow (5) in FIG. 6). Finally, the work 5 is warped and is held by suction on the entire surface of the work stage 6 (corresponding to the arrow (7) in FIG. 6).
本件発明者等は、本実施形態の発明に係るワークステージを用いて、実際に、ワークとして、周辺部が中央部に対して１ｍｍ程度反るとともに周辺部が波状に変形している１０枚のφ１２０ｍｍのウエハを使用したところ、１０枚全てのウエハが、ワークステージにより全面で吸着保持できることを確認した。 The inventors of the present invention, using the work stage according to the invention of the present embodiment, actually, as the work, the peripheral portion is warped about 1 mm with respect to the central portion, and the peripheral portion is deformed in a wavy shape When a φ120 mm wafer was used, it was confirmed that all 10 wafers could be sucked and held on the entire surface by the work stage.
図７は、第２の実施形態の発明に係るワークステージの構成を示す平面図である。
同図に示すように、このワークステージ６は、第１の実施形態のワークステージ６においては第１の真空吸着孔群６１が放射状に３列形成されていたのに対して、放射状に４列形成した点で相違する。本実施形態のワークステージ６においても、第１の実施形態のワークステージ６と同様に機能させることができる。
FIG. 7 is a plan view showing the configuration of the work stage according to the invention of the second embodiment.
As shown in the figure, this work stage 6 has four rows in the radial direction, whereas the first vacuum suction hole group 61 is formed in three rows in the work stage 6 of the first embodiment. It differs in the point formed. The work stage 6 of the present embodiment can also function in the same manner as the work stage 6 of the first embodiment.
上記の各実施形態の発明に係るワークステージの要点をまとめると以下のとおりである。第１に、ワークステージ６の表面に形成する真空吸着手段６１、６２は、溝ではなく孔にする。このことにより、リークによる真空吸着圧力の低下を防ぐことができる。第２に、放射状に形成する第１の真空吸着孔群６１の真空吸着孔Ｘの周方向の隣に形成する真空吸着孔は、第２の真空吸着孔群６２の真空吸着孔Ｙとする。なお、第２の真空吸着孔群６２の真空吸着孔Ｙの周方向隣には、第２の真空吸着孔群６２の真空吸着孔Ｙがあっても良い。このことにより、椀形に反ったワーク５を、まず１ケ所（または１列）径方向に吸着し、次に周方向に吸着していく。したがって、ワーク５は徐々に反りが矯正され、ワークステージ６全面に吸着される。 The main points of the work stage according to the invention of each of the above embodiments are summarized as follows. First, the vacuum suction means 61 and 62 formed on the surface of the work stage 6 are holes instead of grooves. This can prevent a decrease in the vacuum adsorption pressure due to leakage. Secondly, the vacuum suction hole formed next to the circumferential direction of the vacuum suction hole X of the first vacuum suction hole group 61 formed radially is the vacuum suction hole Y of the second vacuum suction hole group 62. In addition, the vacuum suction hole Y of the second vacuum suction hole group 62 may be adjacent to the second vacuum suction hole group 62 in the circumferential direction of the vacuum suction hole Y. As a result, the workpiece 5 warped in a bowl shape is first sucked in one (or one row) radial direction and then sucked in the circumferential direction. Accordingly, the workpiece 5 is gradually warped and is attracted to the entire surface of the workpiece stage 6.
１ 露光装置
２ 光照射部
２１ ランプ
２２ 反射ミラー
３ マスク
４ マスクステージ
５ ワーク
６ ワークステージ
６１ 第１の真空吸着孔群
６２ 第２の真空吸着孔群
６３ 第１の真空配管
６４ 第２の真空配管
６５ 第１の電磁弁
６６ 第２の電磁弁
６７ 制御部
７ 投影レンズ
Ｘ 第１の真空吸着孔群６１の真空吸着孔
Ｙ 第２の真空吸着孔群６２の真空吸着孔
DESCRIPTION OF SYMBOLS 1 Exposure apparatus 2 Light irradiation part 21 Lamp 22 Reflection mirror 3 Mask 4 Mask stage 5 Work 6 Work stage 61 1st vacuum suction hole group 62 2nd vacuum suction hole group 63 1st vacuum piping 64 2nd vacuum piping 65 First solenoid valve 66 Second solenoid valve 67 Control unit 7 Projection lens X Vacuum suction hole Y of first vacuum suction hole group 61 Vacuum suction hole of second vacuum suction hole group 62
Claims (2)
ワークを吸着保持するワークステージの表面に、第１の配管に接続された複数の真空吸着孔からなる真空吸着孔列を放射状に複数列配置した第１の真空吸着孔群と、上記第１の真空吸着孔群に挟まれる領域に形成され、第２の配管に接続された第２の真空吸着孔群と、上記ワークを吸着保持する際に、上記第１の配管から上記第１の真空吸着孔群に真空を供給し、次に、上記第２の配管から上記第２の真空吸着孔群に真空を供給する制御部と、を備えたことを特徴とするワークステージ。 In the work stage that sucks and holds workpieces by vacuum suction,
A first vacuum suction hole group in which a plurality of vacuum suction hole arrays each including a plurality of vacuum suction holes connected to a first pipe are radially arranged on the surface of a work stage that holds and holds a work; The second vacuum suction hole group formed in a region sandwiched between the vacuum suction hole groups and connected to the second pipe, and the first vacuum suction from the first pipe when holding the workpiece by suction. And a control unit for supplying a vacuum to the hole group and then supplying a vacuum from the second pipe to the second vacuum suction hole group.
上記ワークステージは、請求項１に記載のワークステージであることを特徴とする露光装置。
In an exposure apparatus comprising: a light emitting unit that emits light; a mask stage that holds a mask on which a pattern is formed; and a work stage that holds a work on which the pattern formed on the mask is transferred.
The exposure apparatus according to claim 1, wherein the work stage is a work stage according to claim 1.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009021150A JP5126091B2 (en) | 2009-02-02 | 2009-02-02 | Work stage and exposure apparatus using the work stage |
| TW098141001A TWI385489B (en) | 2009-02-02 | 2009-12-01 | A workpiece table and an exposure apparatus using the work table |
| KR1020090123415A KR101203356B1 (en) | 2009-02-02 | 2009-12-11 | Work stage and exposure apparatus using the same |
| CN2010100054075A CN101794726B (en) | 2009-02-02 | 2010-01-19 | Workpiece stage and exposure apparatus using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009021150A JP5126091B2 (en) | 2009-02-02 | 2009-02-02 | Work stage and exposure apparatus using the work stage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010177607A true JP2010177607A (en) | 2010-08-12 |
| JP5126091B2 JP5126091B2 (en) | 2013-01-23 |
Family
ID=42587313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009021150A Expired - Fee Related JP5126091B2 (en) | 2009-02-02 | 2009-02-02 | Work stage and exposure apparatus using the work stage |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5126091B2 (en) |
| KR (1) | KR101203356B1 (en) |
| CN (1) | CN101794726B (en) |
| TW (1) | TWI385489B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012119591A (en) * | 2010-12-02 | 2012-06-21 | Fuji Electric Co Ltd | Suction device and suction method |
| US20120285036A1 (en) * | 2011-05-12 | 2012-11-15 | Takahiro Matsuyama | Electrode dryer and method for drying electrode |
| KR101334085B1 (en) * | 2012-05-11 | 2013-12-02 | 쿠어스텍아시아 유한회사 | Wafer supporting unit |
| JP2014532292A (en) * | 2011-08-26 | 2014-12-04 | エルジー シルトロン インコーポレイテッド | Susceptor |
| JP2015220286A (en) * | 2014-05-15 | 2015-12-07 | 住友電気工業株式会社 | On-resistance measuring method for semiconductor element and on-resistance measuring device for semiconductor element |
| JP2018026414A (en) * | 2016-08-09 | 2018-02-15 | 東京エレクトロン株式会社 | Bonding device and bonding system |
| CN110957252A (en) * | 2018-09-27 | 2020-04-03 | 细美事有限公司 | Transfer robot and apparatus for processing substrate using the same |
| JP2020115593A (en) * | 2020-05-01 | 2020-07-30 | 東京エレクトロン株式会社 | Bonding apparatus and bonding system |
| WO2021014839A1 (en) * | 2019-07-19 | 2021-01-28 | 株式会社ジャパンディスプレイ | Transfer substrate |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219259B (en) * | 2012-01-19 | 2017-09-12 | 昆山思拓机器有限公司 | A kind of wafer processing jig |
| CN106154769A (en) * | 2016-08-25 | 2016-11-23 | 中国电子科技集团公司第十研究所 | Thin film circuit ceramics with holes photoetching vacuum fixture |
| JP6949521B2 (en) * | 2017-03-26 | 2021-10-13 | 株式会社アドテックエンジニアリング | Exposure equipment, operation method of exposure equipment, and substrate sticking prevention film |
| CN108735586B (en) | 2017-06-30 | 2021-05-28 | 上海微电子装备（集团）股份有限公司 | Vacuumizing device and vacuumizing method |
| JP6952515B2 (en) * | 2017-06-30 | 2021-10-20 | Ｔｏｗａ株式会社 | Work transfer device, electronic component manufacturing device, workpiece transfer method, and electronic component manufacturing method |
| SG11202004896TA (en) * | 2017-09-28 | 2020-06-29 | Shinkawa Kk | Suction stage |
| JP6986317B2 (en) * | 2017-12-05 | 2021-12-22 | 株式会社アドテックエンジニアリング | Mask unit and exposure equipment |
| CN108364904A (en) * | 2018-02-11 | 2018-08-03 | 武汉华星光电半导体显示技术有限公司 | Vacuum discrete absorption platform |
| CN110320758B (en) * | 2018-03-30 | 2021-06-29 | 上海微电子装备（集团）股份有限公司 | Substrate edge protection device, photoetching equipment and protection method |
| CN109856827A (en) * | 2019-03-26 | 2019-06-07 | 深圳市华星光电技术有限公司 | Absorption type microscope carrier |
| CN110703473B (en) * | 2019-10-29 | 2022-05-31 | 武汉华星光电技术有限公司 | Equipment for binding vacuum adsorption base and display panel |
| CN112847015B (en) * | 2021-01-11 | 2022-07-19 | 中国科学院西安光学精密机械研究所 | Device and method for processing optical element by cooperation of multiple robots |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63139632A (en) * | 1986-11-28 | 1988-06-11 | Hitachi Ltd | Vacuum suction device |
| JPH10128633A (en) * | 1996-10-28 | 1998-05-19 | Nippon Telegr & Teleph Corp <Ntt> | Vacuum sucker |
| JP2002134597A (en) * | 2000-10-27 | 2002-05-10 | Ushio Inc | Stage apparatus |
| JP2004119573A (en) * | 2002-09-25 | 2004-04-15 | Renesas Technology Corp | Manufacture of semiconductor device and film sticking apparatus |
| JP2004221323A (en) * | 2003-01-15 | 2004-08-05 | Nikon Corp | Substrate holding device, aligner and method for manufacturing device |
| JP2005191338A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Apparatus and method for holding substrate |
| JP2006135157A (en) * | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | Substrate holder and mthod of taking substrate out |
| JP2006310697A (en) * | 2005-05-02 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | Vacuum chuck |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3252074B2 (en) * | 1994-03-09 | 2002-01-28 | 日本電信電話株式会社 | Vacuum suction device, sealing tool for vacuum suction device, and vacuum suction method |
| KR100292612B1 (en) * | 1997-12-08 | 2001-08-07 | 윤종용 | Semiconductor wafer alignment system and method for aligning wafer using the same |
| JPH11240795A (en) * | 1998-02-27 | 1999-09-07 | Super Silicon Kenkyusho:Kk | Epitaxial growth apparatus |
| CN100469948C (en) * | 2000-10-03 | 2009-03-18 | 应用材料有限公司 | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| TWI236944B (en) * | 2001-12-17 | 2005-08-01 | Tokyo Electron Ltd | Film removal method and apparatus, and substrate processing system |
| JP3769618B2 (en) * | 2003-04-21 | 2006-04-26 | 防衛庁技術研究本部長 | Vacuum adsorption device |
| JP2007158190A (en) * | 2005-12-07 | 2007-06-21 | Nikon Corp | Suction device, polishing device, semiconductor device manufacturing method, and semiconductor device manufactured by the method |
| KR101059914B1 (en) * | 2006-01-10 | 2011-08-29 | 한미반도체 주식회사 | Semiconductor Manufacturing Process Table |
| CN100544889C (en) * | 2006-09-06 | 2009-09-30 | 财团法人工业技术研究院 | Negative pressure vacuum adsorption device and use the edging device of this device |
| JP2008066607A (en) * | 2006-09-11 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | Vacuum suction apparatus |
-
2009
- 2009-02-02 JP JP2009021150A patent/JP5126091B2/en not_active Expired - Fee Related
- 2009-12-01 TW TW098141001A patent/TWI385489B/en not_active IP Right Cessation
- 2009-12-11 KR KR1020090123415A patent/KR101203356B1/en active IP Right Grant
-
2010
- 2010-01-19 CN CN2010100054075A patent/CN101794726B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63139632A (en) * | 1986-11-28 | 1988-06-11 | Hitachi Ltd | Vacuum suction device |
| JPH10128633A (en) * | 1996-10-28 | 1998-05-19 | Nippon Telegr & Teleph Corp <Ntt> | Vacuum sucker |
| JP2002134597A (en) * | 2000-10-27 | 2002-05-10 | Ushio Inc | Stage apparatus |
| JP2004119573A (en) * | 2002-09-25 | 2004-04-15 | Renesas Technology Corp | Manufacture of semiconductor device and film sticking apparatus |
| JP2004221323A (en) * | 2003-01-15 | 2004-08-05 | Nikon Corp | Substrate holding device, aligner and method for manufacturing device |
| JP2005191338A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Apparatus and method for holding substrate |
| JP2006135157A (en) * | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | Substrate holder and mthod of taking substrate out |
| JP2006310697A (en) * | 2005-05-02 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | Vacuum chuck |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012119591A (en) * | 2010-12-02 | 2012-06-21 | Fuji Electric Co Ltd | Suction device and suction method |
| US9233455B2 (en) | 2010-12-02 | 2016-01-12 | Fuji Electric Co., Ltd. | Chucking device and chucking method |
| US20120285036A1 (en) * | 2011-05-12 | 2012-11-15 | Takahiro Matsuyama | Electrode dryer and method for drying electrode |
| JP2014532292A (en) * | 2011-08-26 | 2014-12-04 | エルジー シルトロン インコーポレイテッド | Susceptor |
| US9638376B2 (en) | 2011-08-26 | 2017-05-02 | Lg Siltron Inc. | Susceptor |
| KR101334085B1 (en) * | 2012-05-11 | 2013-12-02 | 쿠어스텍아시아 유한회사 | Wafer supporting unit |
| JP2015220286A (en) * | 2014-05-15 | 2015-12-07 | 住友電気工業株式会社 | On-resistance measuring method for semiconductor element and on-resistance measuring device for semiconductor element |
| JP2018026414A (en) * | 2016-08-09 | 2018-02-15 | 東京エレクトロン株式会社 | Bonding device and bonding system |
| CN110957252A (en) * | 2018-09-27 | 2020-04-03 | 细美事有限公司 | Transfer robot and apparatus for processing substrate using the same |
| CN110957252B (en) * | 2018-09-27 | 2023-09-29 | 细美事有限公司 | Transfer robot and apparatus for processing substrate using the same |
| WO2021014839A1 (en) * | 2019-07-19 | 2021-01-28 | 株式会社ジャパンディスプレイ | Transfer substrate |
| JP2020115593A (en) * | 2020-05-01 | 2020-07-30 | 東京エレクトロン株式会社 | Bonding apparatus and bonding system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101794726B (en) | 2013-07-03 |
| KR20100089016A (en) | 2010-08-11 |
| JP5126091B2 (en) | 2013-01-23 |
| TWI385489B (en) | 2013-02-11 |
| CN101794726A (en) | 2010-08-04 |
| TW201030476A (en) | 2010-08-16 |
| KR101203356B1 (en) | 2012-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5126091B2 (en) | Work stage and exposure apparatus using the work stage | |
| TWI785079B (en) | System and method for backside deposition of a substrate | |
| JP4707593B2 (en) | Heat treatment apparatus and substrate adsorption method | |
| JP3894562B2 (en) | Substrate adsorption apparatus, exposure apparatus, and device manufacturing method | |
| JP2010166085A (en) | Wafer chuck and exposure apparatus using the same, and method for manufacturing semiconductor device | |
| JP6024921B2 (en) | Plasma processing apparatus and plasma processing method | |
| JP6340693B2 (en) | Substrate holding device, contact exposure device, and proximity exposure device | |
| JP2016111343A (en) | Substrate holding device, lithographic apparatus, and manufacturing method of article | |
| KR20120085180A (en) | Work stage and exposure apparatus using the same | |
| JP4298739B2 (en) | Substrate adsorption device | |
| JP2016021544A (en) | Imprint system and imprint method | |
| JP2007180125A (en) | Exposure apparatus, exposing method, and method of manufacturing display panel substrate | |
| JP5305012B2 (en) | Work stage and exposure apparatus equipped with the work stage | |
| JP6376871B2 (en) | Contact exposure system | |
| JP2009206455A (en) | Vacuum chuck | |
| JP2009170761A (en) | Pasting apparatus of substrate body, and treating method of substrate body | |
| JPH06326174A (en) | Vacuum suction device for wafer | |
| JP2012009720A (en) | Wafer holder and exposure equipment | |
| JP2010062337A (en) | Suction device for substrate and handling method of substrate | |
| KR20180002859A (en) | Substrate holding device, substrate holding member, and substrate holding method | |
| JP7210896B2 (en) | SUBSTRATE PLACEMENT DEVICE AND SUBSTRATE PLACEMENT METHOD | |
| JP4298740B2 (en) | Substrate adsorption device | |
| JP2008256810A (en) | Exposure method and exposure device | |
| JP7250525B2 (en) | Wafer transfer tray | |
| JP2006019552A (en) | Plasma processing apparatus and manufacturing method of semiconductor device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110922 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120926 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121002 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121015 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5126091 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151109 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |