JP2010177484A - Stacked cooling device, and method of manufacturing cooling tube used for the same - Google Patents

Stacked cooling device, and method of manufacturing cooling tube used for the same Download PDF

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JP2010177484A
JP2010177484A JP2009019103A JP2009019103A JP2010177484A JP 2010177484 A JP2010177484 A JP 2010177484A JP 2009019103 A JP2009019103 A JP 2009019103A JP 2009019103 A JP2009019103 A JP 2009019103A JP 2010177484 A JP2010177484 A JP 2010177484A
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cooling
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JP5012824B2 (en
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Yoshiaki Fukatsu
喜明 深津
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Denso Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked cooling device capable of effectively cooling an electronic component on the downstream side. <P>SOLUTION: The stacked cooling device is constituted by alternately stacking cooling tubes 2 and the electronic components. The inside of cooling tube is divided into four layers, and includes a first cooling medium switching portion 5a which exchanges, inside the tube, a cooling medium 7 of a first flow channel and a cooling medium of a second flow channel. In addition, the inside of cooling tube includes a second cooling medium switching portion 5b which exchanges, inside the tube, a cooling medium 7 of a third flow channel and a cooling medium 7 of a fourth flow channel. Thus, the electronic component 3 on the downstream side can be cooled by the cooling medium 7 which is low in temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電子部品を効果的に冷却できる積層型冷却装置と、それに用いる冷却管の製造方法に関する。   The present invention relates to a stacked cooling apparatus capable of effectively cooling an electronic component and a method of manufacturing a cooling pipe used therefor.

従来から、通電により発熱する電子部品と、冷却管とを交互に積層し、この冷却管によって電子部品を冷却する積層型冷却装置が知られている。   2. Description of the Related Art Conventionally, a multilayer cooling device is known in which electronic components that generate heat when energized and cooling pipes are alternately stacked and the electronic components are cooled by the cooling pipes.

従来の積層型冷却装置の部分断面図を図１４に示す。図示するごとく、この積層型冷却装置９０は、冷却管９１と電子部品９２とを交互に積層して構成されている。各冷却管９１の片方の面には、それぞれ２つずつの電子部品９２（上流側電子部品９２ａと下流側電子部品９２ｂ）が接している。また、冷却管９１は、管内に冷媒９４が流れており、この冷媒９４によって電子部品９２ａ，９２ｂを冷却している。
また、冷却管９１の中に波板からなるインナフィン９５が設けられている。このインナフィン９５によって冷媒９４との接触面積が増加し、電子部品９２の冷却効率を上げることができるようになっている。 FIG. 14 shows a partial cross-sectional view of a conventional stacked cooling apparatus. As shown in the figure, the stacked cooling device 90 is configured by alternately stacking cooling pipes 91 and electronic components 92. Two electronic components 92 (an upstream electronic component 92 a and a downstream electronic component 92 b) are in contact with one surface of each cooling pipe 91. In the cooling pipe 91, a refrigerant 94 flows in the pipe, and the electronic components 92 a and 92 b are cooled by the refrigerant 94.
An inner fin 95 made of corrugated plates is provided in the cooling pipe 91. The inner fin 95 increases the contact area with the refrigerant 94, so that the cooling efficiency of the electronic component 92 can be increased.

特開２００５−１９１５２７号公報JP 2005-191527 A

従来の積層型冷却装置９０は、図１４に示すごとく、一つの冷却管９１によって上流側の電子部品９２ａと下流側の９２ｂを冷却している。そのため、上流側の電子部品９２ａの熱を受けて冷媒９４の温度が上昇してしまい、その温度が上昇した冷媒９４を使って下流側の電子部品９２ｂを冷却しているため、下流側の電子部品９２ｂの冷却効率が向上しないという問題がある。
図１４のＣ−Ｃ断面図を図１５に示す。同図に示すごとく、冷媒９４は、インナフィン９５の表面の近傍部分９４ａのみ温度が高く、表面から遠い部分９４ｂは温度が低い、層流と呼ばれる状態になっている。層流は冷却管内で攪拌されにくいため、そのまま下流側に流れてしまい、温度の高い部分９４ａによって下流側の電子部品９２ｂを冷却している。このような状態であるため、下流側の電子部品９２ｂの冷却効率が特に上がらないという問題がある。 As shown in FIG. 14, the conventional stacked cooling device 90 cools the upstream electronic component 92 a and the downstream 92 b by a single cooling pipe 91. Therefore, the temperature of the refrigerant 94 rises due to the heat of the electronic component 92a on the upstream side, and the electronic component 92b on the downstream side is cooled by using the refrigerant 94 whose temperature has increased. There is a problem that the cooling efficiency of the component 92b is not improved.
FIG. 15 is a sectional view taken along the line CC in FIG. As shown in the figure, the refrigerant 94 is in a state called laminar flow in which only the vicinity 94a of the surface of the inner fin 95 has a high temperature and the portion 94b far from the surface has a low temperature. Since the laminar flow is difficult to be stirred in the cooling pipe, it flows downstream as it is, and the electronic component 92b on the downstream side is cooled by the high temperature portion 94a. In such a state, there is a problem that the cooling efficiency of the electronic component 92b on the downstream side does not particularly increase.

本発明は、かかる従来の問題点に鑑みてなされたもので、下流側の電子部品を効果的に冷却できる積層型冷却装置を提供しようとするものである。   The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a stacked cooling device capable of effectively cooling a downstream electronic component.

本発明は、通電により発熱する電子部品と、管内に冷媒が流れる冷却管とを交互に積層し、上記電子部品を両面から冷却するよう構成した積層型冷却装置であって、
上記冷却管は、その両外面においてそれぞれ上記電子部品に接触する第１管壁及び第２管壁を有し、
上記第１管壁と上記第２管壁との間には、上記第１管壁側から順次第１流路、第２流路、第３流路、及び第４流路を形成するよう順次第１隔壁、第２隔壁、及び第３隔壁を並列配置してなり、
上記第１隔壁の途中には、上記第１流路を流れてきた冷媒が上記第２流路に流入するとともに、上記第２流路を流れてきた冷媒が上記第１流路に流入するよう冷媒の流れ方向を切り替える第１冷媒切替部を有し、
上記第３隔壁の途中には、上記第３流路を流れてきた冷媒が上記第４流路に流入するとともに、上記第４流路を流れてきた冷媒が上記第３流路に流入するよう冷媒の流れ方向を切り替える第２冷媒切替部を有し、
上記第１管壁は、上記第１冷媒切替部よりも上流側及び下流側に位置する第１上流側冷却面及び第１下流側冷却面においてそれぞれ上記電子部品に接触し、
上記第２管壁は、上記第２冷媒切替部よりも上流側及び下流側に位置する第２上流側冷却面及び第２下流側冷却面においてそれぞれ上記電子部品に接触するよう構成されていることを特徴とする積層型冷却装置（請求項１）にある。 The present invention is a stacked cooling device configured to alternately stack electronic components that generate heat when energized and cooling tubes in which refrigerant flows in the tubes, and cool the electronic components from both sides,
The cooling pipe has a first pipe wall and a second pipe wall that come into contact with the electronic components on both outer surfaces thereof,
A first flow path, a second flow path, a third flow path, and a fourth flow path are sequentially formed between the first tube wall and the second tube wall from the first tube wall side. The first partition, the second partition, and the third partition are arranged in parallel,
In the middle of the first partition, the refrigerant flowing through the first flow path flows into the second flow path, and the refrigerant flowing through the second flow path flows into the first flow path. A first refrigerant switching unit that switches a flow direction of the refrigerant;
In the middle of the third partition, the refrigerant flowing through the third flow path flows into the fourth flow path, and the refrigerant flowing through the fourth flow path flows into the third flow path. A second refrigerant switching unit that switches a flow direction of the refrigerant;
The first pipe wall is in contact with the electronic component at a first upstream cooling surface and a first downstream cooling surface located upstream and downstream of the first refrigerant switching unit, respectively.
The second pipe wall is configured to be in contact with the electronic component at a second upstream cooling surface and a second downstream cooling surface located upstream and downstream of the second refrigerant switching unit, respectively. The present invention resides in a stacked cooling device (claim 1).

次に、本発明の作用効果につき説明する。
本発明では、第１流路の冷媒と第２流路の冷媒とを冷却管内で入れ替えている。すなわち、第１流路の上流側を流れ、第１上流側冷却面にて電子部品よって暖められた冷媒を第２流路の下流側に流している。また、第２流路の上流側を流れ、温度が低い冷媒を第１流路の下流側に流している。そのため、温度が低い冷媒を使って下流側の電子部品を冷却することができる。
また、本発明では、第３流路の冷媒と第４流路の冷媒とを冷却管内で入れ替えている。すなわち、第４流路の上流側を流れ、第２上流側冷却面にて電子部品によって暖められた冷媒を第３流路の下流側に流している。そして、第３流路の上流側を流れ、温度が低い冷媒を第４流路の下流側に流している。そのため、温度が低い冷媒を使って下流側の電子部品を冷却することができる。 Next, the effects of the present invention will be described.
In the present invention, the refrigerant in the first channel and the refrigerant in the second channel are exchanged in the cooling pipe. That is, the refrigerant that flows upstream of the first flow path and is warmed by the electronic component on the first upstream cooling surface flows downstream of the second flow path. Moreover, the refrigerant | coolant which flows the upstream of a 2nd flow path and is low temperature is flowed to the downstream of the 1st flow path. Therefore, the downstream electronic component can be cooled using a refrigerant having a low temperature.
Moreover, in this invention, the refrigerant | coolant of a 3rd flow path and the refrigerant | coolant of a 4th flow path are replaced in the cooling pipe. That is, the refrigerant that flows upstream of the fourth flow path and is warmed by the electronic component on the second upstream cooling surface flows downstream of the third flow path. And the refrigerant | coolant which flows the upstream of the 3rd flow path and is low temperature is flowed to the downstream of the 4th flow path. Therefore, the downstream electronic component can be cooled using a refrigerant having a low temperature.

以上のごとく、本発明によれば、下流側の電子部品を効果的に冷却できる積層型冷却装置を提供することができる。   As described above, according to the present invention, it is possible to provide a stacked cooling device capable of effectively cooling downstream electronic components.

実施例１における、積層型冷却装置の分解斜視図。FIG. 3 is an exploded perspective view of the stacked cooling device according to the first embodiment. 実施例１における、冷却管の一部切欠斜視図であって、図１の冷却管を縦長に縮尺変更して書いたもの。FIG. 2 is a partially cutaway perspective view of the cooling pipe in the first embodiment, which is written with the cooling pipe of FIG. 図２の冷却管のうち第１流路と第２流路とを取り除いて記載した、一部切欠斜視図。FIG. 3 is a partially cutaway perspective view in which the first flow path and the second flow path are removed from the cooling pipe of FIG. 2. 図２のＡ−Ａ断面図。AA sectional drawing of FIG. 図２のＢ−Ｂ断面図。BB sectional drawing of FIG. 実施例１における、第１冷媒切替部およびその周辺の拡大斜視図。FIG. 3 is an enlarged perspective view of the first refrigerant switching unit and its periphery in the first embodiment. 実施例１における、第２冷媒切替部およびその周辺の拡大斜視図。FIG. 3 is an enlarged perspective view of a second refrigerant switching unit and its periphery in the first embodiment. 実施例１における、第１冷媒切替部用部品の拡大斜視図。The expanded perspective view of the components for 1st refrigerant | coolant switching parts in Example 1. FIG. 実施例１における、冷却管の製造工程を説明するための図。The figure for demonstrating the manufacturing process of the cooling pipe in Example 1. FIG. 実施例１における、電子部品を組み合わせた回路図。FIG. 3 is a circuit diagram in which electronic components are combined in the first embodiment. 実施例２における、冷却管の製造工程を説明するための図。The figure for demonstrating the manufacturing process of the cooling pipe in Example 2. FIG. 図１１に続く図。The figure following FIG. 実施例３における、冷却管の断面図。Sectional drawing of the cooling pipe in Example 3. FIG. 従来例における、積層型冷却装置の断面図。Sectional drawing of the laminated | stacked cooling device in a prior art example. 図１４のＣ−Ｃ断面図。CC sectional drawing of FIG.

上述した本発明における好ましい実施の形態につき説明する。
本発明において、上記第１流路における上記第１上流側冷却面および上記第１下流側冷却面に対応する位置と、上記第４流路における上記第２上流側冷却面および上記第２下流側冷却面に対応する位置とには、上記冷媒との接触面積を増やして冷却効率を上げるためのインナフィンが各々設けられ、上記第２流路および上記第３流路には上記インナフィンが設けられていないことが好ましい（請求項２）。
このようにすると、電子部品を冷却するために必要な流路（第１流路および第４流路）のみにインナフィンを配置するため、全ての流路にインナフィンを配置した場合と比較して、冷媒の抵抗を小さくすることができる。 A preferred embodiment of the present invention described above will be described.
In the present invention, positions corresponding to the first upstream cooling surface and the first downstream cooling surface in the first flow path, and the second upstream cooling surface and the second downstream side in the fourth flow path. Inner fins for increasing the contact area with the refrigerant and increasing the cooling efficiency are provided at positions corresponding to the cooling surface, and the inner fins are provided in the second flow path and the third flow path. It is preferable that there is no (claim 2).
In this case, since the inner fins are arranged only in the flow paths (first flow path and fourth flow path) necessary for cooling the electronic component, compared to the case where the inner fins are arranged in all the flow paths, The resistance of the refrigerant can be reduced.

また、上記第１冷媒切替部は、上記第１隔壁を上流側と下流側に分断するよう切り欠いた第１切欠部と、
上記第１隔壁に直交するように上記第１切欠部に設けられ上記第１流路及び上記第２流路を幅方向に区画する第１仕切板と、
上記第１切欠部の上流側端縁において、上記第１仕切板によって区画された上記第１流路の幅方向一方側を閉塞する第１混合防止板と、上記第１仕切板によって区画された上記第２流路の幅方向他方側を閉塞する第２混合防止板と、
上記第１切欠部の下流側端縁において、上記第１仕切板によって区画された上記第１流路の幅方向他方側を閉塞する第３混合防止板と、上記第１仕切板によって区画された上記第２流路の幅方向一方側を閉塞する第４混合防止板とにより構成されており、
上記第２冷媒切替部は、上記第３隔壁を上流側と下流側に分断するよう切り欠いた第２切欠部と、
上記第３隔壁に直交するように上記第２切欠部に設けられ上記第３流路及び上記第４流路を幅方向に区画する第２仕切板と、
上記第２切欠部の上流側端縁において、上記第２仕切板によって区画された上記第３流路の幅方向一方側を閉塞する第５混合防止板と、上記第２仕切板によって区画された上記第４流路の幅方向他方側を閉塞する第６混合防止板と、
上記第２切欠部の下流側端縁において、上記第２仕切板によって区画された上記第３流路の幅方向他方側を閉塞する第７混合防止板と、上記第２仕切板によって区画された上記第４流路の幅方向一方側を閉塞する第８混合防止板とにより構成されていることが好ましい（請求項３）。
このようにすると、上記第１流路を流れてきた冷媒は、上記第１冷媒切替部において、上記第１混合防止板にて一部が堰き止められ、上記第１仕切板と上記第３混合防止板の存在により第１切欠部を通って第２流路に流入し進んでいく。同様に上記第２流路を流れてきた冷媒は、上記第２混合防止板にて一部が堰き止められ、上記第１仕切板と上記第４混合防止板の存在により第１切欠部を通って第１流路に流入し進んでいく。
そして、上記第３流路と第４流路を流れてきた冷媒は、上記と同様に第２冷媒切替部において流れ方向を変えていく。これにより、冷却管内で冷媒の流れを確実に切り替えることができ、温度の高い冷媒と温度の低い冷媒とが混合するような問題が生じにくくなる。そのため、下流側の電子部品を効果的に冷却することが可能となる。 Further, the first refrigerant switching unit includes a first cutout portion cut out so as to divide the first partition wall into an upstream side and a downstream side,
A first partition plate provided in the first notch so as to be orthogonal to the first partition wall and partitioning the first flow path and the second flow path in the width direction;
At the upstream end edge of the first cutout portion, the first mixing prevention plate that blocks one side in the width direction of the first flow path defined by the first partition plate and the first partition plate A second mixing prevention plate for closing the other side in the width direction of the second flow path;
At the downstream edge of the first notch, the third mixing prevention plate that blocks the other side in the width direction of the first flow path defined by the first partition plate and the first partition plate A fourth mixing prevention plate for closing one side in the width direction of the second flow path,
The second refrigerant switching unit includes a second cutout portion cut out to divide the third partition wall into an upstream side and a downstream side;
A second partition plate provided in the second notch so as to be orthogonal to the third partition wall, and dividing the third channel and the fourth channel in the width direction;
At the upstream end edge of the second notch, the fifth mixing prevention plate that closes one side in the width direction of the third flow path defined by the second partition plate and the second partition plate A sixth mixing prevention plate for closing the other side in the width direction of the fourth flow path;
At the downstream edge of the second notch, the seventh mixing prevention plate that blocks the other side in the width direction of the third flow path defined by the second partition plate and the second partition plate Preferably, the fourth flow path is constituted by an eighth mixing prevention plate that closes one side in the width direction of the fourth flow path.
In this case, a part of the refrigerant flowing through the first flow path is blocked by the first mixing preventing plate in the first refrigerant switching unit, and the first partition plate and the third mixing plate are blocked. Due to the presence of the prevention plate, it flows into the second flow path through the first notch and proceeds. Similarly, a part of the refrigerant flowing through the second flow path is blocked by the second mixing prevention plate, and passes through the first notch due to the presence of the first partition plate and the fourth mixing prevention plate. And flows into the first flow path.
And the refrigerant | coolant which flowed through the said 3rd flow path and the 4th flow path changes a flow direction in a 2nd refrigerant | coolant switching part similarly to the above. Thereby, the flow of the refrigerant can be switched reliably in the cooling pipe, and the problem that the high temperature refrigerant and the low temperature refrigerant are mixed is less likely to occur. Therefore, it is possible to effectively cool the electronic component on the downstream side.

また、上記積層型冷却装置に用いられる冷却管の製造方法は、板金をプレス加工することにより、上記第１仕切板と上記第１〜第４混合防止板とが一体にされた第１冷媒切替部用部品を製造する工程と、上記第２仕切板と上記第５〜第８混合防止板とが一体にされた第２冷媒切替部用部品を製造する工程と、上記第１切欠部に上記第１冷媒切替部用部品を配置して固定する工程と、上記第２切欠部に上記第２冷媒切替部用部品を配置して固定する工程と、を備えることを特徴とする（請求項４）。
このようにすると、一枚の板金をプレス加工して第１冷媒切替部用部品および第２冷媒切替部用部品を形成するため、個々の防止板をロウ付け等して形成する場合と比較して、第１冷媒切替部用部品、第２冷媒切替部用部品を容易に製造することができる。 The method of manufacturing the cooling pipe used in the stacked cooling device includes the first refrigerant switching in which the first partition plate and the first to fourth mixing prevention plates are integrated by pressing a sheet metal. Manufacturing a part part, manufacturing a second refrigerant switching part part in which the second partition plate and the fifth to eighth mixing prevention plates are integrated, and the first notch part A step of arranging and fixing the first refrigerant switching part component and a step of arranging and fixing the second refrigerant switching part component in the second notch portion are provided (claim 4). ).
In this case, since the first refrigerant switching part component and the second refrigerant switching part component are formed by pressing one sheet metal, compared with the case where the individual prevention plates are formed by brazing or the like. Thus, the first refrigerant switching part component and the second refrigerant switching part component can be easily manufactured.

また、上記積層型冷却装置に用いられる冷却管の製造方法は、上記第１隔壁を加工して上記第１〜第４混合防止板および上記第１切欠部を形成する工程と、該第１切欠部に上記第１仕切板を配置して固定する工程と、上記第３隔壁を加工して上記第５〜第８混合防止板および上記第２切欠部を形成する工程と、上記第２切欠部に上記第２仕切板を配置して固定する工程と、を備えることを特徴とする（請求項５）。
第１〜第４混合防止板および第１仕切板が一体になったものをプレス加工により形成する場合は比較的複雑な形状の型が必要になるが、上述のように、第１隔壁を加工して第１〜第４混合防止板を形成すると、比較的簡単な形状の型ですむ。また、第５〜第８混合防止板も、同じ形状の型で製造することが可能となる。 In addition, a method of manufacturing a cooling pipe used in the stacked cooling device includes the steps of processing the first partition to form the first to fourth mixing prevention plates and the first notch, and the first notch. A step of arranging and fixing the first partition plate at a portion, a step of processing the third partition wall to form the fifth to eighth mixing prevention plates and the second cutout portion, and the second cutout portion. And a step of disposing and fixing the second partition plate (Claim 5).
When the first to fourth mixing prevention plates and the first partition plate are integrated by pressing, a relatively complicated shape is required, but the first partition is processed as described above. When the first to fourth mixing prevention plates are formed, a mold having a relatively simple shape can be used. In addition, the fifth to eighth mixing prevention plates can be manufactured with a mold having the same shape.

（実施例１）
本発明の実施例にかかる積層型冷却装置につき、図１〜図１０を用いて説明する。図１は積層型冷却装置１の分解斜視図であり、図２は冷却管２の一部切欠斜視図である。また、図３は、図２の下側半分のみを示した一部切欠斜視図である。さらに、図４は図２のＡ−Ａ断面図であり、図５は図２のＢ−Ｂ断面図である。 Example 1
A stacked cooling apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view of the laminated cooling apparatus 1, and FIG. 2 is a partially cutaway perspective view of the cooling pipe 2. FIG. 3 is a partially cutaway perspective view showing only the lower half of FIG. 4 is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line BB in FIG.

本発明は、図１に示すごとく、通電により発熱する電子部品３と、管内に冷媒７が流れる冷却管２とを交互に積層し、電子部品３を両面から冷却するよう構成した積層型冷却装置１である。
図２に示すごとく、冷却管２は、その両外面においてそれぞれ電子部品３に接触する第１管壁２ａ及び第２管壁２ｂを有する。
また、図２、図４、図５に示すごとく、第１管壁２ａと第２管壁２ｂとの間には、第１管壁２ａ側から順次第１流路２１、第２流路２２、第３流路２３、及び第４流路２４を形成するよう順次第１隔壁４ａ、第２隔壁４ｂ、及び第３隔壁４ｃを並列配置してなる。
第１隔壁４ａの途中には、第１流路２１を流れてきた冷媒７が第２流路２２に流入すると共に、第２流路２２を流れてきた冷媒７が第１流路２１に流入するよう冷媒７の流れ方向を切り替える第１冷媒切替部５ａを有する。
さらに、図３〜図５に示すごとく、第３隔壁４ｃの途中には、第３流路２３を流れてきた冷媒７が第４流路２４に流入するとともに、第４流路２４を流れてきた冷媒７が第３流路２３に流入するよう冷媒７の流れ方向を切り替える第２冷媒切替部５ｂを有する。
また、図４、図５に示すごとく、第１管壁２ａは、第１冷媒切替部５ａよりも上流側及び下流側に位置する第１上流側冷却面２０ａ及び第１下流側冷却面２０ｂにおいてそれぞれ電子部品３に接触している。
そして、第２管壁２ｂは、第２冷媒切替部５ｂよりも上流側及び下流側に位置する第２上流側冷却面２０ｃ及び第２下流側冷却面２０ｄにおいてそれぞれ電子部品３に接触するよう構成されている。
以下、さらに詳説する。 As shown in FIG. 1, the present invention is a stacked cooling apparatus in which electronic parts 3 that generate heat when energized and cooling pipes 2 in which a refrigerant 7 flows are alternately stacked, and the electronic parts 3 are cooled from both sides. 1.
As shown in FIG. 2, the cooling pipe 2 has a first pipe wall 2 a and a second pipe wall 2 b that are in contact with the electronic component 3 on both outer surfaces thereof.
As shown in FIGS. 2, 4, and 5, the first flow path 21 and the second flow path 22 are sequentially arranged between the first tube wall 2a and the second tube wall 2b from the first tube wall 2a side. The first partition 4a, the second partition 4b, and the third partition 4c are sequentially arranged in parallel so as to form the third channel 23 and the fourth channel 24.
In the middle of the first partition wall 4a, the refrigerant 7 flowing through the first flow path 21 flows into the second flow path 22, and the refrigerant 7 flowing through the second flow path 22 flows into the first flow path 21. It has the 1st refrigerant | coolant switching part 5a which switches the flow direction of the refrigerant | coolant 7 so that it may do.
Further, as shown in FIGS. 3 to 5, in the middle of the third partition wall 4 c, the refrigerant 7 flowing through the third flow path 23 flows into the fourth flow path 24 and flows through the fourth flow path 24. A second refrigerant switching unit 5b that switches the flow direction of the refrigerant 7 so that the refrigerant 7 flows into the third flow path 23.
As shown in FIGS. 4 and 5, the first pipe wall 2 a is formed on the first upstream cooling surface 20 a and the first downstream cooling surface 20 b that are located upstream and downstream of the first refrigerant switching unit 5 a. Each is in contact with the electronic component 3.
And the 2nd pipe wall 2b is comprised so that it may contact with the electronic component 3 in the 2nd upstream cooling surface 20c and the 2nd downstream cooling surface 20d located in the upstream and downstream rather than the 2nd refrigerant | coolant switching part 5b, respectively. Has been.
Further details will be described below.

図１に示すごとく、積層型冷却装置１は、隣接する冷却管２を互いに接続するための接続部１０と、冷媒７の導入管１１と、導出管１２とを備える。導入管１１から冷媒７を導入することにより、全ての冷却管２に冷媒７が流れ、電子部品３を冷却するようになっている。
電子部品３の内部にはＩＧＢＴ素子とフライホイールダイオードが封止されており（図１０参照）、この電子部品３を用いて、後述するインバータを構成している。 As shown in FIG. 1, the stacked cooling apparatus 1 includes a connecting portion 10 for connecting adjacent cooling pipes 2 to each other, an introduction pipe 11 for the refrigerant 7, and a lead-out pipe 12. By introducing the refrigerant 7 from the introduction pipe 11, the refrigerant 7 flows through all the cooling pipes 2 and cools the electronic component 3.
An IGBT element and a flywheel diode are sealed inside the electronic component 3 (see FIG. 10), and this electronic component 3 constitutes an inverter described later.

一方、図２に示すごとく、冷却管２は、第１側壁２ｃ、第２側壁２ｄを備える。上述した第１管壁２ａ、第２管壁２ｂと、第１側壁２ｃ、第２側壁２ｄによって、断面四角形状の冷却管２の外壁を構成している。   On the other hand, as shown in FIG. 2, the cooling pipe 2 includes a first side wall 2c and a second side wall 2d. The first tube wall 2a, the second tube wall 2b, the first side wall 2c, and the second side wall 2d described above constitute the outer wall of the cooling tube 2 having a square cross section.

また、図２〜図５に示すごとく、第１流路２１における第１上流側冷却面２０ａおよび第１下流側冷却面２０ｂに対応する位置と、第４流路２４における第２上流側冷却面２０ｃおよび第２下流側冷却面２０ｄに対応する位置とには、冷媒７との接触面積を増やして冷却効率を上げるためのインナフィン６が各々設けられ、第２流路２２および第３流路２３にはインナフィン６が設けられていない。
このインナフィン６は、図２に示すごとく波板から構成されており、第１管壁２ａまたは第２管壁２ｂに接触している。電子部品３から発生した熱は第１管壁２ａまたは第２管壁２ｂを通ってインナフィン６に伝わり、冷媒７によって冷却される。 2-5, the position corresponding to the 1st upstream cooling surface 20a and the 1st downstream cooling surface 20b in the 1st flow path 21, and the 2nd upstream cooling surface in the 4th flow path 24 are shown. Inner fins 6 for increasing the contact area with the refrigerant 7 and increasing the cooling efficiency are provided at positions corresponding to the 20c and the second downstream cooling surface 20d, respectively, and the second flow path 22 and the third flow path 23 are provided. Are not provided with inner fins 6.
The inner fin 6 is formed of a corrugated plate as shown in FIG. 2, and is in contact with the first tube wall 2a or the second tube wall 2b. The heat generated from the electronic component 3 is transmitted to the inner fin 6 through the first tube wall 2a or the second tube wall 2b and is cooled by the refrigerant 7.

また、図６に示すごとく、第１冷媒切替部５ａは、第１隔壁４ａを上流側と下流側に分断するよう切り欠いた第１切欠部２０１を備える。
また、第１隔壁４ａに直交するように第１切欠部２０１に設けられ第１流路２１及び第２流路２２を幅方向に区画する第１仕切板６１を備える。
そして、第１切欠部２０１の上流側端縁２０３において、第１仕切板６１によって区画された第１流路２１の幅方向一方側を閉塞する第１混合防止板５１と、第１仕切板６１によって区画された第２流路２２の幅方向他方側を閉塞する第２混合防止板５２を備える。
さらに、第１切欠部２０１の下流側端縁２０４において、第１仕切板６１によって区画された第１流路２１の幅方向他方側を閉塞する第３混合防止板５３と、第１仕切板６１によって区画された第２流路２２の幅方向一方側を閉塞する第４混合防止板５４とを備える。 Moreover, as shown in FIG. 6, the 1st refrigerant | coolant switching part 5a is provided with the 1st notch part 201 notched so that the 1st partition 4a might be divided into the upstream and the downstream.
Moreover, the 1st partition plate 61 provided in the 1st notch part 201 so as to be orthogonal to the 1st partition 4a and partitioning the 1st flow path 21 and the 2nd flow path 22 in the width direction is provided.
A first mixing prevention plate 51 that closes one side in the width direction of the first flow path 21 partitioned by the first partition plate 61 at the upstream edge 203 of the first notch 201 and the first partition plate 61. The second mixing prevention plate 52 is provided to close the other side in the width direction of the second flow path 22 partitioned by.
Furthermore, a third mixing prevention plate 53 that closes the other side in the width direction of the first flow path 21 defined by the first partition plate 61 at the downstream edge 204 of the first notch 201, and the first partition plate 61. And a fourth mixing prevention plate 54 that closes one side in the width direction of the second flow path 22 partitioned by.

一方、図７に示すごとく、第２冷媒切替部５ｂは、第３隔壁４ｃを上流側と下流側に分断するよう切り欠いた第２切欠部２０２を備える。
また、第３隔壁４ｃに直交するように第２切欠部２０２に設けられ第３流路２３及び第４流路２４を幅方向に区画する第２仕切板６２を備える。
そして、第２切欠部２０２の上流側端縁２０５において、第２仕切板６２によって区画された第３流路２３の幅方向一方側を閉塞する第５混合防止板５５と、第２仕切板６２によって区画された第４流路２４の幅方向他方側を閉塞する第６混合防止板５６を備える。
さらに、第２切欠部２０２の下流側端縁２０６において、第２仕切板６２によって区画された第３流路２３の幅方向他方側を閉塞する第７混合防止板５７と、第２仕切板６２によって区画された第４流路２４の幅方向一方側を閉塞する第８混合防止板５８とを備える。 On the other hand, as shown in FIG. 7, the 2nd refrigerant | coolant switching part 5b is provided with the 2nd notch part 202 notched so that the 3rd partition 4c might be divided into the upstream and downstream.
In addition, a second partition plate 62 is provided in the second notch 202 so as to be orthogonal to the third partition wall 4c and partitions the third flow path 23 and the fourth flow path 24 in the width direction.
Then, at the upstream edge 205 of the second notch 202, a fifth mixing prevention plate 55 that closes one side in the width direction of the third flow path 23 partitioned by the second partition plate 62, and the second partition plate 62. The sixth mixing prevention plate 56 is provided to close the other side in the width direction of the fourth flow path 24 partitioned by.
Further, a seventh mixing prevention plate 57 that closes the other side in the width direction of the third flow path 23 partitioned by the second partition plate 62 at the downstream end edge 206 of the second notch 202, and the second partition plate 62. And an eighth mixing prevention plate 58 that closes one side in the width direction of the fourth flow path 24 partitioned by.

換言すると、図６に示すごとく、第１混合防止板５１は、第１切欠部２０１の上流側端縁２０３と、第１仕切板６１の上流側端縁６１ａと、第１側壁２ｃ（図６では一部省略している）と、第１管壁２ａとによって囲まれる部分を閉塞している。また、第２混合防止板５２は、第１切欠部２０１の上流側端縁２０３と、第１仕切板６１の上流側端縁６１ａと、第２側壁２ｄと、第２隔壁４ｂとによって囲まれる部分を閉塞している。
さらに、第３混合防止板５３は、第１切欠部２０１の下流側端縁２０４と、第１仕切板６１の下流側端縁６１ｂと、第２側壁２ｄと、第１管壁２ａとによって囲まれる部分を閉塞している。そして、第４混合防止板５４は、第１切欠部２０１の下流側端縁２０４と、第１仕切板６１の下流側端縁６１ｂと、第１側壁２ｃと、第２隔壁４ｂとによって囲まれる部分を閉塞している。 In other words, as shown in FIG. 6, the first mixing prevention plate 51 includes the upstream edge 203 of the first notch 201, the upstream edge 61 a of the first partition 61, and the first side wall 2 c (FIG. 6). And a portion surrounded by the first tube wall 2a is closed. The second mixing prevention plate 52 is surrounded by the upstream edge 203 of the first notch 201, the upstream edge 61a of the first partition 61, the second side wall 2d, and the second partition 4b. The part is blocked.
Further, the third mixing prevention plate 53 is surrounded by the downstream end edge 204 of the first notch 201, the downstream end edge 61b of the first partition plate 61, the second side wall 2d, and the first tube wall 2a. The part to be closed is blocked. The fourth mixing prevention plate 54 is surrounded by the downstream edge 204 of the first notch 201, the downstream edge 61b of the first partition 61, the first side wall 2c, and the second partition 4b. The part is blocked.

また、図７に示すごとく、第５混合防止板５５は、第２切欠部２０２の上流側端縁２０５と、第２仕切板６２の上流側端縁６２ａと、第１側壁２ｃ（図７では一部省略している）と、第２隔壁４ｂとによって囲まれる部分を閉塞している。そして、第６混合防止板５６は、第２切欠部２０２の上流側端縁２０５と、第２仕切板６２の上流側端縁６２ａと、第２側壁２ｄと、第２管壁２ｂとによって囲まれる部分を閉塞している。
さらに、第７混合防止板５７は、第２切欠部２０２の下流側端縁２０６と、第２仕切板６２の下流側端縁６２ｂと、第２側壁２ｄと、第２隔壁４ｂとによって囲まれる部分を閉塞している。そして、第８混合防止板５８は、第２切欠部２０２の下流側端縁２０６と、第２仕切板６２の下流側端縁６２ｂと、第１側壁２ｃと、第２管壁２ｂとによって囲まれる部分を閉塞している。 Further, as shown in FIG. 7, the fifth mixing prevention plate 55 includes an upstream end edge 205 of the second notch 202, an upstream end edge 62a of the second partition plate 62, and a first side wall 2c (in FIG. 7). And a portion surrounded by the second partition wall 4b is closed. The sixth mixing prevention plate 56 is surrounded by the upstream end edge 205 of the second notch 202, the upstream end edge 62a of the second partition plate 62, the second side wall 2d, and the second tube wall 2b. The part to be closed is blocked.
Furthermore, the seventh mixing prevention plate 57 is surrounded by the downstream end edge 206 of the second notch 202, the downstream end edge 62b of the second partition plate 62, the second side wall 2d, and the second partition wall 4b. The part is blocked. The eighth mixing prevention plate 58 is surrounded by the downstream end edge 206 of the second notch 202, the downstream end edge 62b of the second partition plate 62, the first side wall 2c, and the second tube wall 2b. The part to be closed is blocked.

次に、本例の積層型冷却装置１に用いる冷却管２の製造方法について説明する。まず、板金をプレス加工することにより、図８に示すごとく、第１仕切板６１と第１〜第４混合防止板５４とが一体にされた第１冷媒切替部用部品５０ａを製造する。また、同様にして、板金をプレス加工することにより、第２仕切板６２と第５〜第８混合防止板５８とが一体にされた第２冷媒切替部用部品５０ｂを製造する。   Next, the manufacturing method of the cooling pipe 2 used for the laminated cooling apparatus 1 of this example is demonstrated. First, as shown in FIG. 8, the first coolant switching part component 50 a in which the first partition plate 61 and the first to fourth mixing prevention plates 54 are integrated is manufactured by pressing a sheet metal. Similarly, the second refrigerant switching part component 50b in which the second partition plate 62 and the fifth to eighth mixing prevention plates 58 are integrated is manufactured by pressing the sheet metal.

一方、図９に示すごとく、第１側壁２ｃおよび第２側壁２ｄの一部と第１管壁２ａとが一体になった部材Ａと、第１側壁２ｃおよび第２側壁２ｄの一部と第２管壁２ｂとが一体になった部材２Ｂとを用意する。そして図示するごとく、部材２Ｂと、インナフィン６と、第３隔壁４ｃと、第２冷媒切替部用部品５０ｂと、第２隔壁４ｂと、第１冷媒切替部用部品５０ａと、第１隔壁４ａと、インナフィン６と、部材２Ａとを順次配置する。第１〜第３隔壁４ｃと、第１冷媒切替部用部品５０ａ，第２冷媒切替部用部品５０ｂにはロウ材が付着しており、加熱することによりロウ付けされ、これらの部材が固定される。   On the other hand, as shown in FIG. 9, a member A in which a part of the first side wall 2c and the second side wall 2d and the first tube wall 2a are integrated, a part of the first side wall 2c and the second side wall 2d, A member 2B in which the two pipe walls 2b are integrated is prepared. As shown in the figure, the member 2B, the inner fin 6, the third partition 4c, the second refrigerant switching part component 50b, the second partition 4b, the first refrigerant switching part component 50a, and the first partition 4a The inner fin 6 and the member 2A are sequentially arranged. A brazing material is attached to the first to third partition walls 4c, the first refrigerant switching part component 50a, and the second refrigerant switching part component 50b, and is brazed by heating so that these members are fixed. The

次に、電子部品３を接続して構成したインバータ８の回路図を図１０に示す。図示するごとく、電子部品３にはＩＧＢＴ素子３１と、フライホイールダイオード３２とが封止されている。一方の電子部品３ａのコレクタ端子と、他方の電子部品３ｂのエミッタ端子とが、直流入力端子となっている。また、一方の電子部品３ａのエミッタ端子と、他方の電子部品３ｂのコレクタ端子とが接続され、交流出力端子になっている。この交流出力端子に、三相交流モータ８１，８２が接続されている。
また、直流電源８０の電圧を昇圧するためのコンバータ８３と、平滑用コンデンサ８４が設けられている。
上記インバータ８は車両に搭載されるもので、直流電源８０の電圧をインバータ８で交流に変換し、三相交流モータ８１，８２を駆動して車両を走行させている。 Next, a circuit diagram of the inverter 8 configured by connecting the electronic component 3 is shown in FIG. As illustrated, the electronic component 3 is sealed with an IGBT element 31 and a flywheel diode 32. The collector terminal of one electronic component 3a and the emitter terminal of the other electronic component 3b are DC input terminals. Also, the emitter terminal of one electronic component 3a and the collector terminal of the other electronic component 3b are connected to form an AC output terminal. Three-phase AC motors 81 and 82 are connected to the AC output terminal.
Further, a converter 83 for boosting the voltage of the DC power supply 80 and a smoothing capacitor 84 are provided.
The inverter 8 is mounted on a vehicle. The inverter 8 converts the voltage of the DC power source 80 into AC, and drives the three-phase AC motors 81 and 82 to drive the vehicle.

次に、本例の積層型冷却装置１の作用効果につき説明する。
図２〜図５に示すごとく、本例では冷却管２を４層に分けており、第１冷媒切替部５ａによって第１流路２１と第２流路２２の冷媒７を入れ替えている。すなわち、第１流路２１の上流を流れ電子部品３（第１上流側冷却面２０ａ）に暖められた冷媒７を第２流路２２の下流側に流し、第２流路２２の上流側を流れた温度の低い冷媒７を第１流路２１の下流側に流している。これにより、温度の低い冷媒７を使って下流側の電子部品３（第１下流側冷却面２０ｂ）を冷却することができる。
また、第２冷媒切替部５ｂによって第３流路２３と第４流路２４の冷媒７を入れ替えている。すなわち、第４流路２４の上流側を流れ電子部品３（第２上流側冷却面２０ｃ）で電子部品３に暖められた冷媒７を第３流路２３の下流側に流し、第３流路２３の上流側を流れた温度の低い冷媒７を第４流路２４の下流側に流している。これにより、温度の低い冷媒７を使って下流側の電子部品３（第２下流側冷却面２０ｄ）を冷却することができる。 Next, the effect of the laminated cooling apparatus 1 of this example will be described.
As shown in FIGS. 2 to 5, in this example, the cooling pipe 2 is divided into four layers, and the refrigerant 7 in the first flow path 21 and the second flow path 22 is switched by the first refrigerant switching portion 5 a. That is, the refrigerant 7 that flows upstream of the first flow path 21 and is warmed by the electronic component 3 (first upstream cooling surface 20a) flows to the downstream side of the second flow path 22, and the upstream side of the second flow path 22 flows. The flowing refrigerant 7 having a low temperature is caused to flow downstream of the first flow path 21. Thereby, the downstream electronic component 3 (1st downstream cooling surface 20b) can be cooled using the refrigerant | coolant 7 with low temperature.
Further, the refrigerant 7 in the third flow path 23 and the fourth flow path 24 is exchanged by the second refrigerant switching unit 5b. That is, the refrigerant 7 that flows upstream of the fourth flow path 24 and is warmed to the electronic component 3 by the electronic component 3 (second upstream cooling surface 20c) flows to the downstream side of the third flow path 23. The refrigerant 7 having a low temperature that has flowed upstream of the flow channel 23 flows downstream of the fourth flow path 24. Thereby, the downstream electronic component 3 (2nd downstream cooling surface 20d) can be cooled using the refrigerant | coolant 7 with low temperature.

また、図２〜図５に示すごとく、本例では、冷却管２の第１流路２１および第４流路２４にのみインナフィン６を設けており、第２流路２２および第３流路２３にはインナフィン６を設けていない。
このようにすると、電子部品３を冷却するために必要な流路（第１流路２１および第４流路２４）のみにインナフィン６を配置するため、全ての流路にインナフィン６を配置した場合と比較して、冷媒７の抵抗を小さくすることができる。 As shown in FIGS. 2 to 5, in this example, the inner fin 6 is provided only in the first flow path 21 and the fourth flow path 24 of the cooling pipe 2, and the second flow path 22 and the third flow path 23. No inner fin 6 is provided.
In this case, since the inner fins 6 are disposed only in the flow paths (the first flow path 21 and the fourth flow path 24) necessary for cooling the electronic component 3, the inner fins 6 are disposed in all the flow paths. As compared with, the resistance of the refrigerant 7 can be reduced.

また、本例では、第１冷媒切替部５ａと第２冷媒切替部５ｂを、図６、図７に示す形状にしている。このようにすると、第１流路２１を流れてきた冷媒７は、第１冷媒切替部５ａにおいて、第１混合防止板５１にて一部が堰き止められ、第１仕切板６１と第３混合防止板５３の存在により第１切欠部２０１を通って第２流路２２に流入し進んでいく。同様に第２流路２２を流れてきた冷媒７は、第２混合防止板５２にて一部が堰き止められ、第１仕切板６１と第４混合防止板５４の存在により第１切欠部２０１を通って第１流路２１に流入し進んでいく。
そして、第３流路２３と第４流路２４を流れてきた冷媒７は、上記と同様に第２冷媒切替部５ｂにおいて流れ方向を変えていく。これにより、冷却管２内で冷媒７の流れを確実に切り替えることができ、温度の高い冷媒７と温度の低い冷媒７とが混合するような問題が生じにくくなる。そのため、下流側の電子部品３を効果的に冷却することが可能となる。 Moreover, in this example, the 1st refrigerant | coolant switching part 5a and the 2nd refrigerant | coolant switching part 5b are made into the shape shown in FIG. 6, FIG. If it does in this way, a part of refrigerant 7 which has flowed through the 1st channel 21 will be blocked by the 1st mixing prevention board 51 in the 1st refrigerant change part 5a, and the 1st partition plate 61 and the 3rd mixing Due to the presence of the prevention plate 53, it flows into the second flow path 22 through the first notch 201 and proceeds. Similarly, a part of the refrigerant 7 flowing through the second flow path 22 is blocked by the second mixing prevention plate 52, and the first notch 201 is provided by the presence of the first partition plate 61 and the fourth mixing prevention plate 54. It flows into the 1st flow path 21 through, and advances.
Then, the refrigerant 7 that has flowed through the third flow path 23 and the fourth flow path 24 changes the flow direction in the second refrigerant switching section 5b in the same manner as described above. Thereby, the flow of the refrigerant | coolant 7 can be switched reliably within the cooling pipe 2, and it becomes difficult to produce the problem that the refrigerant | coolant 7 with a high temperature and the refrigerant | coolant 7 with a low temperature mix. Therefore, it is possible to effectively cool the downstream electronic component 3.

また、本例では、板金をプレス加工することにより図８に示す形状の第１冷媒切替部用部品５０ａおよび第２冷媒切替部用部品５０ｂを製造する。そして図９に示すごとく、この第１冷媒切替部用部品５０ａおよび第２冷媒切替部用部品５０ｂをその他の部品とともに配置し、ロウ付けにより固定して、冷却管２を製造する。
このようにすると、一枚の板金をプレス加工して第１冷媒切替部５ａおよび第２冷媒切替部５ｂを形成するため、個々の部品をロウ付け等して形成する場合と比較して、第１冷媒切替部用部品５０ａおよび第２冷媒切替部用部品５０ｂを容易に製造することができる。 Moreover, in this example, the 1st refrigerant | coolant switching part component 50a and the 2nd refrigerant | coolant switching part component 50b of the shape shown in FIG. 8 are manufactured by pressing a sheet metal. Then, as shown in FIG. 9, the first refrigerant switching part component 50 a and the second refrigerant switching part component 50 b are arranged together with other components, and fixed by brazing to manufacture the cooling pipe 2.
In this case, since the first refrigerant switching unit 5a and the second refrigerant switching unit 5b are formed by pressing one sheet metal, the first part is compared with the case where each part is formed by brazing or the like. The first refrigerant switching part component 50a and the second refrigerant switching part component 50b can be easily manufactured.

以上のごとく、本例によれば、下流側の電子部品３を効果的に冷却できる積層型冷却装置１を提供することができる。   As described above, according to this example, it is possible to provide the stacked cooling device 1 that can effectively cool the electronic component 3 on the downstream side.

（実施例２）
本例は、冷却管２の製造方法を変えた例である。まず、図１１に示すごとく、切欠部が形成されていない第１隔壁４ａを用意する。そして図１２に示すごとく、第１隔壁４ａをプレス加工することにより第１〜第４混合防止板５４および第１切欠部２０１を形成する。その後、第１切欠部２０１に第１仕切板６１を配置してロウ付け等により固定する。
同様にして、切欠部が形成されていない第３隔壁４ｃを用意する。そして図１２に示すごとく、第３隔壁４ｃをプレス加工することにより第５〜第８混合防止板５８および第２切欠部２０２を形成する。その後、第２切欠部２０２に第２仕切板を配置して固定する。
その他、実施例１と同様の構成を有する。 (Example 2)
In this example, the manufacturing method of the cooling pipe 2 is changed. First, as shown in FIG. 11, the 1st partition 4a in which the notch part is not formed is prepared. And as shown in FIG. 12, the 1st-4th mixing prevention board 54 and the 1st notch part 201 are formed by pressing the 1st partition 4a. Thereafter, the first partition plate 61 is disposed in the first notch 201 and fixed by brazing or the like.
Similarly, a third partition 4c in which a notch is not formed is prepared. And as shown in FIG. 12, the 5th-8th mixing prevention board 58 and the 2nd notch part 202 are formed by pressing the 3rd partition 4c. Then, a 2nd partition plate is arrange | positioned and fixed to the 2nd notch part 202. FIG.
In addition, the configuration is the same as that of the first embodiment.

第１〜第４混合防止板および第１仕切板が一体になったものをプレス加工により形成する場合は比較的複雑な形状の型が必要になるが、上述のように、第１隔壁を加工して第１〜第４混合防止板を形成すると、比較的簡単な形状の型ですむ。また、第５〜第８混合防止板も、同じ形状の型で製造することが可能となる。
その他、実施例１と同様の作用効果を有する。 When the first to fourth mixing prevention plates and the first partition plate are integrated by pressing, a relatively complicated shape is required, but the first partition is processed as described above. When the first to fourth mixing prevention plates are formed, a mold having a relatively simple shape can be used. In addition, the fifth to eighth mixing prevention plates can be manufactured with a mold having the same shape.
In addition, the same effects as those of the first embodiment are obtained.

（実施例３）
本例は、冷却管２の形状を変更した例である。本例では図１３に示すごとく、第１管壁２ａを含み端部２０７，２０８が折り曲げられた部材２Ａ’と、第２管壁２ｂを含み端部２０７，２０８が折り曲げられた部材２Ｂ’とを用いる。そして、部材２Ａ’と第２隔壁４ｂと部材２Ｂ’とを重ね、端部２０７，２０８にて圧着している。
このようにすると、部材２Ａ’と２Ｂ’をしっかりと接続することができる。
その他、実施例１と同様の構成および作用効果を有する。 (Example 3)
In this example, the shape of the cooling pipe 2 is changed. In this example, as shown in FIG. 13, a member 2A ′ including the first tube wall 2a and having the end portions 207 and 208 bent, and a member 2B ′ including the second tube wall 2b and having the end portions 207 and 208 bent. Is used. Then, the member 2A ′, the second partition wall 4b, and the member 2B ′ are overlapped and crimped at the end portions 207 and 208.
If it does in this way, member 2A 'and 2B' can be connected firmly.
In addition, the configuration and operational effects are the same as those of the first embodiment.

１ 積層型冷却装置
２ 冷却管
２ａ 第１管壁
２ｂ 第２管壁
２ｃ 第１側壁
２ｄ 第２側壁
２０ａ 第１上流側冷却面
２０ｂ 第１下流側冷却面
２０ｃ 第２上流側冷却面
２０ｄ 第２下流側冷却面
２１ 第１流路
２２ 第２流路
２３ 第３流路
２４ 第４流路
３ 電子部品
４ａ 第１隔壁
４ｂ 第２隔壁
４ｃ 第３隔壁
５ａ 第１冷媒切替部
５ｂ 第２冷媒切替部
６ インナフィン
７ 冷媒 DESCRIPTION OF SYMBOLS 1 Stack type cooling device 2 Cooling pipe 2a 1st pipe wall 2b 2nd pipe wall 2c 1st side wall 2d 2nd side wall 20a 1st upstream cooling surface 20b 1st downstream cooling surface 20c 2nd upstream cooling surface 20d 2nd Downstream cooling surface 21 1st flow path 22 2nd flow path 23 3rd flow path 24 4th flow path 3 Electronic component 4a 1st partition 4b 2nd partition 4c 3rd partition 5a 1st refrigerant | coolant switching part 5b 2nd refrigerant | coolant switching Part 6 Inner fin 7 Refrigerant

Claims (5)

通電により発熱する電子部品と、管内に冷媒が流れる冷却管とを交互に積層し、上記電子部品を両面から冷却するよう構成した積層型冷却装置であって、
上記冷却管は、その両外面においてそれぞれ上記電子部品に接触する第１管壁及び第２管壁を有し、
上記第１管壁と上記第２管壁との間には、上記第１管壁側から順次第１流路、第２流路、第３流路、及び第４流路を形成するよう順次第１隔壁、第２隔壁、及び第３隔壁を並列配置してなり、
上記第１隔壁の途中には、上記第１流路を流れてきた冷媒が上記第２流路に流入するとともに、上記第２流路を流れてきた冷媒が上記第１流路に流入するよう冷媒の流れ方向を切り替える第１冷媒切替部を有し、
上記第３隔壁の途中には、上記第３流路を流れてきた冷媒が上記第４流路に流入するとともに、上記第４流路を流れてきた冷媒が上記第３流路に流入するよう冷媒の流れ方向を切り替える第２冷媒切替部を有し、
上記第１管壁は、上記第１冷媒切替部よりも上流側及び下流側に位置する第１上流側冷却面及び第１下流側冷却面においてそれぞれ上記電子部品に接触し、
上記第２管壁は、上記第２冷媒切替部よりも上流側及び下流側に位置する第２上流側冷却面及び第２下流側冷却面においてそれぞれ上記電子部品に接触するよう構成されていることを特徴とする積層型冷却装置。 An electronic component that generates heat when energized and a cooling tube in which a refrigerant flows in the tube are alternately stacked, and is a stacked cooling device configured to cool the electronic component from both sides,
The cooling pipe has a first pipe wall and a second pipe wall that come into contact with the electronic components on both outer surfaces thereof,
A first flow path, a second flow path, a third flow path, and a fourth flow path are sequentially formed between the first tube wall and the second tube wall from the first tube wall side. The first partition, the second partition, and the third partition are arranged in parallel,
In the middle of the first partition, the refrigerant flowing through the first flow path flows into the second flow path, and the refrigerant flowing through the second flow path flows into the first flow path. A first refrigerant switching unit that switches a flow direction of the refrigerant;
In the middle of the third partition, the refrigerant flowing through the third flow path flows into the fourth flow path, and the refrigerant flowing through the fourth flow path flows into the third flow path. A second refrigerant switching unit that switches a flow direction of the refrigerant;
The first pipe wall is in contact with the electronic component at a first upstream cooling surface and a first downstream cooling surface located upstream and downstream of the first refrigerant switching unit, respectively.
The second pipe wall is configured to be in contact with the electronic component at a second upstream cooling surface and a second downstream cooling surface located upstream and downstream of the second refrigerant switching unit, respectively. A laminated cooling device characterized by the above. 請求項１において、上記第１流路における上記第１上流側冷却面および上記第１下流側冷却面に対応する位置と、上記第４流路における上記第２上流側冷却面および上記第２下流側冷却面に対応する位置とには、上記冷媒との接触面積を増やして冷却効率を上げるためのインナフィンが各々設けられ、上記第２流路および上記第３流路には上記インナフィンが設けられていないことを特徴とする積層型冷却装置。   2. The position according to claim 1, corresponding to the first upstream cooling surface and the first downstream cooling surface in the first flow path, and the second upstream cooling surface and the second downstream position in the fourth flow path. Inner fins for increasing the contact area with the refrigerant and increasing the cooling efficiency are respectively provided at positions corresponding to the side cooling surfaces, and the inner fins are provided in the second flow path and the third flow path. A laminated cooling device characterized by not having any. 請求項１または請求項２において、上記第１冷媒切替部は、上記第１隔壁を上流側と下流側に分断するよう切り欠いた第１切欠部と、
上記第１隔壁に直交するように上記第１切欠部に設けられ上記第１流路及び上記第２流路を幅方向に区画する第１仕切板と、
上記第１切欠部の上流側端縁において、上記第１仕切板によって区画された上記第１流路の幅方向一方側を閉塞する第１混合防止板と、上記第１仕切板によって区画された上記第２流路の幅方向他方側を閉塞する第２混合防止板と、
上記第１切欠部の下流側端縁において、上記第１仕切板によって区画された上記第１流路の幅方向他方側を閉塞する第３混合防止板と、上記第１仕切板によって区画された上記第２流路の幅方向一方側を閉塞する第４混合防止板とにより構成されており、
上記第２冷媒切替部は、上記第３隔壁を上流側と下流側に分断するよう切り欠いた第２切欠部と、
上記第３隔壁に直交するように上記第２切欠部に設けられ上記第３流路及び上記第４流路を幅方向に区画する第２仕切板と、
上記第２切欠部の上流側端縁において、上記第２仕切板によって区画された上記第３流路の幅方向一方側を閉塞する第５混合防止板と、上記第２仕切板によって区画された上記第４流路の幅方向他方側を閉塞する第６混合防止板と、
上記第２切欠部の下流側端縁において、上記第２仕切板によって区画された上記第３流路の幅方向他方側を閉塞する第７混合防止板と、上記第２仕切板によって区画された上記第４流路の幅方向一方側を閉塞する第８混合防止板とにより構成されていることを特徴とする積層型冷却装置。 In Claim 1 or Claim 2, the 1st refrigerant change part is the 1st notch which notched so that the 1st partition might be divided into the upper stream side and the lower stream side,
A first partition plate provided in the first notch so as to be orthogonal to the first partition wall and partitioning the first flow path and the second flow path in the width direction;
At the upstream end edge of the first cutout portion, the first mixing prevention plate that blocks one side in the width direction of the first flow path defined by the first partition plate and the first partition plate A second mixing prevention plate for closing the other side in the width direction of the second flow path;
At the downstream edge of the first notch, the third mixing prevention plate that blocks the other side in the width direction of the first flow path defined by the first partition plate and the first partition plate A fourth mixing prevention plate for closing one side in the width direction of the second flow path,
The second refrigerant switching unit includes a second cutout portion cut out to divide the third partition wall into an upstream side and a downstream side;
A second partition plate provided in the second notch so as to be orthogonal to the third partition wall, and dividing the third channel and the fourth channel in the width direction;
At the upstream end edge of the second notch, the fifth mixing prevention plate that closes one side in the width direction of the third flow path defined by the second partition plate and the second partition plate A sixth mixing prevention plate for closing the other side in the width direction of the fourth flow path;
At the downstream edge of the second notch, the seventh mixing prevention plate that blocks the other side in the width direction of the third flow path defined by the second partition plate and the second partition plate A laminated cooling apparatus comprising: an eighth mixing prevention plate that closes one side in the width direction of the fourth flow path. 請求項３に記載の積層型冷却装置に用いられる冷却管の製造方法であって、板金をプレス加工することにより、上記第１仕切板と上記第１〜第４混合防止板とが一体にされた第１冷媒切替部用部品を製造する工程と、上記第２仕切板と上記第５〜第８混合防止板とが一体にされた第２冷媒切替部用部品を製造する工程と、上記第１切欠部に上記第１冷媒切替部用部品を配置して固定する工程と、上記第２切欠部に上記第２冷媒切替部用部品を配置して固定する工程と、を備えることを特徴とする冷却管の製造方法。   4. A method of manufacturing a cooling pipe used in the stacked cooling device according to claim 3, wherein the first partition plate and the first to fourth mixing prevention plates are integrated by pressing a sheet metal. Manufacturing the first refrigerant switching part component, manufacturing the second refrigerant switching part component in which the second partition plate and the fifth to eighth mixing prevention plates are integrated, and the second And a step of arranging and fixing the first refrigerant switching part component in one notch, and a step of arranging and fixing the second refrigerant switching part component in the second notch. Manufacturing method for cooling pipe. 請求項３に記載の積層型冷却装置に用いられる冷却管の製造方法であって、上記第１隔壁を加工して上記第１〜第４混合防止板および上記第１切欠部を形成する工程と、該第１切欠部に上記第１仕切板を配置して固定する工程と、上記第３隔壁を加工して上記第５〜第８混合防止板および上記第２切欠部を形成する工程と、上記第２切欠部に上記第２仕切板を配置して固定する工程と、を備えることを特徴とする冷却管の製造方法。   It is a manufacturing method of the cooling pipe used for the lamination type cooling device according to claim 3, and processes the above-mentioned 1st partition, and forms the above-mentioned 1st-the 4th mixed prevention board and the above-mentioned 1st notch part, A step of arranging and fixing the first partition plate in the first notch, a step of processing the third partition wall to form the fifth to eighth mixing prevention plates and the second notch, And a step of disposing and fixing the second partition plate in the second notch.
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Publication number Priority date Publication date Assignee Title
JP2014053471A (en) * 2012-09-07 2014-03-20 Sumitomo Precision Prod Co Ltd Cooling device
JP2016062919A (en) * 2014-09-12 2016-04-25 株式会社ティラド heat sink
JP2018006688A (en) * 2016-07-07 2018-01-11 株式会社デンソー Cooling apparatus
JP2019079908A (en) * 2017-10-24 2019-05-23 三菱電機株式会社 Cooling device and semiconductor module including the same
CN111699623A (en) * 2018-02-13 2020-09-22 日本电产株式会社 Electronic component with cooler and inverter

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JP2005191527A (en) * 2003-12-03 2005-07-14 Denso Corp Stacked cooler
JP2005311046A (en) * 2004-04-21 2005-11-04 Denso Corp Cooler
JP2008166423A (en) * 2006-12-27 2008-07-17 Denso Corp Cooling tube and manufacturing method therefor

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Publication number Priority date Publication date Assignee Title
JP2005191527A (en) * 2003-12-03 2005-07-14 Denso Corp Stacked cooler
JP2005311046A (en) * 2004-04-21 2005-11-04 Denso Corp Cooler
JP2008166423A (en) * 2006-12-27 2008-07-17 Denso Corp Cooling tube and manufacturing method therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014053471A (en) * 2012-09-07 2014-03-20 Sumitomo Precision Prod Co Ltd Cooling device
JP2016062919A (en) * 2014-09-12 2016-04-25 株式会社ティラド heat sink
JP2018006688A (en) * 2016-07-07 2018-01-11 株式会社デンソー Cooling apparatus
JP2019079908A (en) * 2017-10-24 2019-05-23 三菱電機株式会社 Cooling device and semiconductor module including the same
CN111699623A (en) * 2018-02-13 2020-09-22 日本电产株式会社 Electronic component with cooler and inverter
CN111699623B (en) * 2018-02-13 2023-10-24 日本电产株式会社 Electronic component with cooler and inverter

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