JP2010153521A5 - - Google Patents
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- Publication number
- JP2010153521A5 JP2010153521A5 JP2008328904A JP2008328904A JP2010153521A5 JP 2010153521 A5 JP2010153521 A5 JP 2010153521A5 JP 2008328904 A JP2008328904 A JP 2008328904A JP 2008328904 A JP2008328904 A JP 2008328904A JP 2010153521 A5 JP2010153521 A5 JP 2010153521A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008328904A JP5058144B2 (ja) | 2008-12-25 | 2008-12-25 | 半導体素子の樹脂封止方法 |
| US12/644,477 US7985629B2 (en) | 2008-12-25 | 2009-12-22 | Resin sealing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008328904A JP5058144B2 (ja) | 2008-12-25 | 2008-12-25 | 半導体素子の樹脂封止方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010153521A JP2010153521A (ja) | 2010-07-08 |
| JP2010153521A5 true JP2010153521A5 (ja) | 2011-11-10 |
| JP5058144B2 JP5058144B2 (ja) | 2012-10-24 |
Family
ID=42285444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008328904A Expired - Fee Related JP5058144B2 (ja) | 2008-12-25 | 2008-12-25 | 半導体素子の樹脂封止方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7985629B2 (ja) |
| JP (1) | JP5058144B2 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190095394A (ko) * | 2017-01-20 | 2019-08-14 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 점착성 필름 및 전자 장치의 제조 방법 |
| CN109659267B (zh) * | 2018-12-21 | 2021-04-23 | 中芯集成电路（宁波）有限公司 | 半导体器件制作方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3094481B2 (ja) * | 1991-03-13 | 2000-10-03 | 松下電器産業株式会社 | 電子回路装置とその製造方法 |
| KR100437437B1 (ko) * | 1994-03-18 | 2004-06-25 | 히다치 가세고교 가부시끼가이샤 | 반도체 패키지의 제조법 및 반도체 패키지 |
| JP4283987B2 (ja) | 2000-11-20 | 2009-06-24 | 富士フイルム株式会社 | 感光性熱硬化性樹脂組成物、それを用いた感光性熱硬化性樹脂層転写材料及び画像形成方法 |
| TW200302685A (en) * | 2002-01-23 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Circuit component built-in module and method of manufacturing the same |
| JP4159431B2 (ja) * | 2002-11-15 | 2008-10-01 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JPWO2004070826A1 (ja) * | 2003-02-06 | 2006-06-01 | 富士通株式会社 | 電極間接続構造体の形成方法および電極間接続構造体 |
| JP4865197B2 (ja) * | 2004-06-30 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP4477966B2 (ja) * | 2004-08-03 | 2010-06-09 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP4874005B2 (ja) * | 2006-06-09 | 2012-02-08 | 富士通セミコンダクター株式会社 | 半導体装置、その製造方法及びその実装方法 |
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2008
- 2008-12-25 JP JP2008328904A patent/JP5058144B2/ja not_active Expired - Fee Related
-
2009
- 2009-12-22 US US12/644,477 patent/US7985629B2/en not_active Expired - Fee Related