JP2010129866A - Conductive ball mounting device - Google Patents

Conductive ball mounting device Download PDF

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Publication number
JP2010129866A
JP2010129866A JP2008304537A JP2008304537A JP2010129866A JP 2010129866 A JP2010129866 A JP 2010129866A JP 2008304537 A JP2008304537 A JP 2008304537A JP 2008304537 A JP2008304537 A JP 2008304537A JP 2010129866 A JP2010129866 A JP 2010129866A
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Prior art keywords
flux
substrate
ball mounting
stage
transfer
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Yoshihisa Kajii
良久 梶井
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Shibuya Corp
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Shibuya Kogyo Co Ltd
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Priority to JP2008304537A priority Critical patent/JP2010129866A/en
Priority to KR1020090115410A priority patent/KR20100061380A/en
Priority to TW098140508A priority patent/TW201028062A/en
Publication of JP2010129866A publication Critical patent/JP2010129866A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive ball mounting device which includes both mechanisms of a flux coating mechanism of a pin transfer method and a flux coating mechanism of a screen printing method, but suppresses the increasing of an installation area, elongation of a conveyance distance, and elongation of a tact time. <P>SOLUTION: The conductive ball mounting device employs the following means. Firstly, there are provided a substrate stage 5, a stage conveyance means, a flux coating means to a substrate on the stage, and a ball mounting means to the substrate. Secondly, after coating the flux by the flux coating means, the conductive ball is mounted to the substrate on the stage by the ball mounting means. Thirdly, the flux coating means is provided with a moving body movable in a direction perpendicularly intersecting with the stage conveyance means. Fourthly, the moving body is provided with a screen printing mechanism printing flux through a printing mask, and a transfer mechanism depositing flux by a transfer pin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は，基板にフラックスを塗布した後，導電性ボールを搭載する導電性ボール搭載装置の改良に関するもので，主としてフラックス塗布手段に特徴を有する導電性ボール搭載装置である。   The present invention relates to an improvement of a conductive ball mounting apparatus that mounts a conductive ball after applying a flux to a substrate, and is a conductive ball mounting apparatus mainly characterized by flux application means.

半田ボールなどの導電性ボールの搭載装置では，基板などに半田ボールなどを搭載する前に、予めフラックスを基板に塗布する必要があり，そのため，従来より導電性ボール搭載装置にはフラックス塗布機構が備えられていた。   In a mounting apparatus for conductive balls such as solder balls, it is necessary to apply flux to the substrate in advance before mounting the solder balls or the like on the substrate. For this reason, conventional conductive ball mounting apparatuses have a flux application mechanism. It was provided.

従来のこの種のフラックス塗布機構には，特許文献１や特許文献２に示されるような転写ヘッドに設けられた転写ピンにフラックスを付着させ，該転写ピンを基板に接触させて，フラックスを基板に塗布するピン転写方式のフラックス塗布機構と，特許文献３や特許文献４に示されるような印刷ヘッドに設けられた印刷マスクにフラックスを供給し，印刷マスクを介してフラックスを基板に塗布するスクリーン印刷方式のフラックス塗布機構が存在した。   In this type of conventional flux application mechanism, flux is attached to a transfer pin provided in a transfer head as shown in Patent Document 1 or Patent Document 2, and the transfer pin is brought into contact with the substrate to supply the flux to the substrate. A flux transfer mechanism of a pin transfer system that is applied to a screen, and a screen that supplies flux to a print mask provided in a print head as shown in Patent Document 3 and Patent Document 4 and applies the flux to the substrate via the print mask There was a printing flux application mechanism.

上記ピン転写方式のフラックス塗布機構は，処理速度がスクリーン印刷方式のフラックス塗布機構に比べて，格段に速いという利点がある。他方，スクリーン印刷方式のフラックス塗布機構は，導電性ボールが極小ボール径で搭載ピッチが狭ピッチの導電性ボールの搭載装置では，ピン転写方式のフラックス塗布機構に比べ，正確な位置へのフラックスの塗布が可能であるという利点を有していた。   The pin transfer type flux coating mechanism has the advantage that the processing speed is much faster than the screen printing type flux coating mechanism. On the other hand, the flux application mechanism of the screen printing method uses a conductive ball mounting device with a conductive ball with a very small ball diameter and a narrow mounting pitch. It had the advantage that it could be applied.

したがって，導電性ボールの搭載対象物に応じて，両フラックス塗布機構を使い分けることが理想的であるが，両機構を単に組み合わせると，図５（Ａ）（Ｂ）に示すような配置となる。図５（Ａ）のような配置になると，設置面積が拡大し，搬送距離が長くなってしまう問題点を有していた。また，図５（Ｂ）のような配置にすると，搬送距離の延長は防げるが，設置面積が幅広となってしまい，且つ，ピン転写方式にてフラックスを塗布する場合にタクト時間が長くなってしまう問題点を有していた。   Therefore, it is ideal to use both flux application mechanisms according to the mounting object of the conductive balls, but when both mechanisms are simply combined, the arrangement shown in FIGS. 5A and 5B is obtained. When the arrangement as shown in FIG. 5A is used, there is a problem that the installation area is enlarged and the conveyance distance becomes long. In addition, the arrangement as shown in FIG. 5B can prevent the conveyance distance from being extended, but the installation area becomes wide and the tact time becomes longer when the flux is applied by the pin transfer method. Had the problem.

特開２００１−７１２５号公開特許公報Japanese Patent Laid-Open No. 2001-7125 特許４０４５５１７号特許公報Japanese Patent No. 4045517 特開２００１−３５８７１号公開特許公報Japanese Patent Laid-Open No. 2001-35871 特開２００２−２２４８８４号公開特許公報Japanese Patent Laid-Open No. 2002-224884

本発明は，ピン転写方式のフラックス塗布機構とスクリーン印刷方式のフラックス塗布機構の両機構を有する導電性ボールの搭載装置であっても，設置面積の拡大や，搬送距離の延長や，タクト時間が長くなることのない導電性ボール搭載装置を提供することを目的とする。   Even if the conductive ball mounting apparatus has both a pin transfer type flux application mechanism and a screen printing type flux application mechanism, the present invention can increase the installation area, the conveyance distance, and the tact time. It is an object of the present invention to provide a conductive ball mounting device that does not become long.

第１の発明は，上記課題を解決するため導電性ボール搭載装置に次の手段を採用する。
第１に，基板を支持するステージと，該ステージを所定方向に移動させる搬送手段と，該ステージ上の基板にフラックスを塗布するフラックス塗布手段と，該ステージ上の基板に導電性ボールを搭載するボール搭載手段とを備える。
第２に，ステージ上の基板の所定位置に，フラックス塗布手段によりフラックスを塗布した後，ボール搭載手段により導電性ボールを搭載する装置とする。
第３に，前記フラックス塗布手段は，前記搬送手段と直交する方向に移動可能な移動体を備える。
第４に，該移動体に，印刷マスクを介してフラックスを印刷するスクリーン印刷機構と，転写ピンによりフラックスを付着させる転写機構を設けた装置とする。 The first invention employs the following means in the conductive ball mounting apparatus in order to solve the above-mentioned problems.
First, a stage for supporting the substrate, a conveying means for moving the stage in a predetermined direction, a flux applying means for applying flux to the substrate on the stage, and a conductive ball mounted on the substrate on the stage Ball mounting means.
Secondly, a device is used in which a conductive ball is mounted by ball mounting means after flux is applied to a predetermined position of the substrate on the stage by flux applying means.
Thirdly, the flux applying means includes a moving body that is movable in a direction orthogonal to the conveying means.
Fourthly, the moving body is provided with a screen printing mechanism for printing flux through a printing mask and a transfer mechanism for attaching flux with a transfer pin.

第２の発明は，第１の発明に，前記スクリーン印刷機構と転写機構を，共通の移動体に設けることを付加した導電性ボール搭載装置である。   A second invention is a conductive ball mounting apparatus obtained by adding the screen printing mechanism and the transfer mechanism to a common moving body to the first invention.

第３の発明は，第１の発明または第２の発明に，前記搬送手段は，平行に複数列設けられ，各搬送手段に前記ステージが設けられ，フラックス塗布手段は，前記ステージ上の基板に順番にフラックスを塗布するものであることを付加した導電性ボール搭載装置である。   A third invention is the first invention or the second invention, wherein the conveying means is provided in a plurality of rows in parallel, the stages are provided in each conveying means, and the flux applying means is provided on the substrate on the stage. This is a conductive ball mounting device to which the flux is applied in order.

本発明は，導電性ボール搭載装置のフラックス塗布手段として，搬送手段と直交する方向に移動可能な移動体を備え，該移動体に，印刷マスクを介してフラックスを印刷するスクリーン印刷機構と，転写ピンによりフラックスを付着させる転写機構を設けたものであるので，両機構を有するにもかかわらず，設置面積の拡大，搬送距離の延長，タクト時間が長くなることのない導電性ボール搭載装置となった。   The present invention includes a moving body that is movable in a direction orthogonal to the conveying means as a flux applying means of the conductive ball mounting apparatus, and a screen printing mechanism that prints flux on the moving body via a printing mask; Since it has a transfer mechanism that attaches flux by pins, it becomes a conductive ball mounting device that does not increase the installation area, extend the transport distance, and increase the tact time despite having both mechanisms. It was.

また，第２の発明の効果ではあるが，スクリーン印刷機構と転写機構を，共通の移動体に設けたので，１つの移動体で両機構を移動でき，駆動軸構成が簡略となり，省スペースである。さらに，第３の発明の効果ではあるが，搬送手段を複数設けて，各搬送手段により搬送される基板に対して順番にフラックスを塗布するようにしたので，生産速度を上げることが可能となった。   In addition, as an effect of the second invention, since the screen printing mechanism and the transfer mechanism are provided on a common moving body, both mechanisms can be moved by one moving body, the drive shaft configuration is simplified, and the space is saved. is there. Furthermore, as an effect of the third invention, since a plurality of transfer means are provided and the flux is sequentially applied to the substrate transferred by each transfer means, the production speed can be increased. It was.

以下，図面にしたがって，実施例とともに本発明の実施の形態について説明する。
実施例は、導電性ボールとして半田ボールを用いた半田ボール搭載装置に関するものであり，基板１１上に所定の配列パターンで形成された各電極に、フラックスを塗布した後，半田ボールを搭載する装置である。 Hereinafter, embodiments of the present invention will be described together with examples according to the drawings.
The embodiment relates to a solder ball mounting apparatus using a solder ball as a conductive ball. The apparatus mounts a solder ball after applying a flux to each electrode formed in a predetermined array pattern on the substrate 11. It is.

半田ボール搭載装置は、図１及び図２に示されるように、基板供給部１、フラックス塗布部２、ボール搭載部３及び基板搬出部４を備えており、基板供給部１からボール搭載部３まで基板１１を載置する基板ステージ５の搬送路が形成されている。この搬送路には搬送手段６，６１が設けられ，基板１１を基板供給部１よりフラックス塗布部２を通過してボール搭載部３へ搬送するようになっている。   As shown in FIG. 1 and FIG. 2, the solder ball mounting apparatus includes a substrate supply unit 1, a flux application unit 2, a ball mounting unit 3, and a substrate carry-out unit 4, from the substrate supply unit 1 to the ball mounting unit 3. A transport path for the substrate stage 5 on which the substrate 11 is placed is formed. Conveying means 6 and 61 are provided in the conveying path, and the substrate 11 is conveyed from the substrate supplying unit 1 to the ball mounting unit 3 through the flux applying unit 2.

基板供給部１は，基板１１を一枚ずつ供給する搬入コンベア７と，搬入コンベア７より基板１１をピックアップし，各基板ステージ５上に載置する搬入用ピックアンドプレイス８とが備えられている。尚，搬入用ピックアンドプレイス８には，各搬送路の上方で基板ステージ５上の基板１１を撮像するための第２位置認識カメラ２９が装着されている。この第２位置認識カメラ２９により基板１１のアライメントマークまたはボール搭載位置を正確に認識することが可能となる。   The substrate supply unit 1 is provided with a carry-in conveyor 7 for supplying the substrates 11 one by one, and a carry-in pick and place 8 for picking up the substrates 11 from the carry-in conveyor 7 and placing them on each substrate stage 5. . The carry-in pick and place 8 is equipped with a second position recognition camera 29 for imaging the substrate 11 on the substrate stage 5 above each transport path. The second position recognition camera 29 can accurately recognize the alignment mark or the ball mounting position of the substrate 11.

本発明におけるステージ（基板ステージ５）を搬送路（図２中左右方向）に沿って移動させる搬送手段６，６１は，実施例では２台並列に設けられており，左右の搬送手段６，６１上に基板ステージ５が，各１台備えられている。２台の搬送手段６，６１を用いるのは，生産速度を上げるためであるので，１台であっても複数台であってもよいことは勿論である。   In the embodiment, two transport means 6, 61 for moving the stage (substrate stage 5) in the present invention along the transport path (left-right direction in FIG. 2) are provided in parallel in the embodiment. One substrate stage 5 is provided on each. The reason for using the two transport means 6 and 61 is to increase the production speed, so that it is of course possible to use one or more.

基板ステージ５は，上面に基板載置面９が形成されている。基板ステージ５には、基板載置面９に載置された基板１１を吸着する吸着手段と、基板１１をθ軸方向（回転方向）に駆動する回動装置１０を備えている。   The substrate stage 5 has a substrate mounting surface 9 formed on the upper surface. The substrate stage 5 includes a suction unit that sucks the substrate 11 placed on the substrate placement surface 9 and a rotation device 10 that drives the substrate 11 in the θ-axis direction (rotation direction).

基板ステージ５には，後に述べる転写機構１２，印刷機構１３及びボール搭載ヘッド３０を撮像するための第１位置認識カメラ１９が装着されている。第１位置認識カメラ１９は，少なくともいずれか一方の基板ステージ５に１台取り付けられておればよく，第１位置認識カメラ１９による転写機構１２，印刷機構１３及びボール搭載ヘッド３０の撮像は，各機構１２，１３の仕様変更後の生産開始前のみに行われることでよい。   The substrate stage 5 is equipped with a first position recognition camera 19 for imaging a transfer mechanism 12, a printing mechanism 13, and a ball mounting head 30, which will be described later. The first position recognition camera 19 only needs to be attached to at least one of the substrate stages 5, and the transfer mechanism 12, the printing mechanism 13, and the ball mounting head 30 are imaged by the first position recognition camera 19. It may be performed only before the start of production after changing the specifications of the mechanisms 12 and 13.

この第１位置認識カメラ１９により，転写機構１２のアライメントマークや転写ピンの位置または印刷機構１３の印刷マスク１８のアライメントマークやフラックスが通過する貫通孔の位置を認識し，第２位置認識カメラ２９の画像と合わせて，正確なフラックス塗布を可能とする。   This first position recognition camera 19 recognizes the position of the alignment mark and transfer pin of the transfer mechanism 12 or the position of the alignment mark of the printing mask 18 of the printing mechanism 13 and the position of the through hole through which the flux passes, and the second position recognition camera 29. Together with the above image, it enables accurate flux application.

本発明の特徴はフラックス塗布部２にある。フラックス塗布部２には，上方に図３に示されるように転写機構１２と印刷機構１３とが設けられる移動体１４及び移動体１４の移動装置１５が配備される。すなわち，転写機構１２と印刷機構１３は，共通の移動体１４に装着されている。   The feature of the present invention resides in the flux application part 2. As shown in FIG. 3, a moving body 14 provided with a transfer mechanism 12 and a printing mechanism 13 and a moving device 15 for the moving body 14 are disposed in the flux application unit 2. That is, the transfer mechanism 12 and the printing mechanism 13 are mounted on a common moving body 14.

移動体１４の下方には，基板ステージ５の２列の搬送路を挟んで，一方には転写機構１２へのフラックス供給部１６，他方には印刷機構１３の印刷マスク１８をクリーニングするクリーニング部１７が配備されている。すなわち搬送手段６，６１の搬送路に直交する方向（図４中左右方向）の一方に転写機構１２用のフラックス供給部１６を，他方に印刷機構１３の印刷マスク１８のクリーニング部１７を配置している。   Below the moving body 14, sandwiching two rows of conveyance paths of the substrate stage 5, one side is a flux supply unit 16 to the transfer mechanism 12, and the other side is a cleaning unit 17 that cleans the printing mask 18 of the printing mechanism 13. Is deployed. That is, the flux supply unit 16 for the transfer mechanism 12 is arranged in one of the directions orthogonal to the conveyance path of the conveyance means 6 and 61 (left and right direction in FIG. 4), and the cleaning unit 17 of the printing mask 18 of the printing mechanism 13 is arranged in the other. ing.

転写機構１２には，基板１１にフラックスを転写するための転写ピンが設けられている。転写ピンは，基板１１の電極パターンに合わせて配列されている。尚，転写機構１２は，転写機構の昇降装置２０を備えている。また，転写機構１２の転写ピンにフラックスを供給するフラックス供給部１６は，転写ピン配設領域の大きさに対応した大きさとされている。   The transfer mechanism 12 is provided with a transfer pin for transferring the flux to the substrate 11. The transfer pins are arranged in accordance with the electrode pattern of the substrate 11. The transfer mechanism 12 includes a transfer mechanism lifting / lowering device 20. Further, the flux supply unit 16 that supplies flux to the transfer pin of the transfer mechanism 12 has a size corresponding to the size of the transfer pin arrangement region.

印刷機構１３には，基板１１にフラックスを印刷するための印刷マスク１８が装着されている。印刷マスク１８は、基板１１上の電極のパターンに合わせて配列された複数の貫通孔が形成されており、型枠に張り付けられている。この型枠はマスク支持装置２８に支持されており，このマスク支持装置２８は印刷機構の昇降装置２１を介して移動体１４に設けられている。尚，印刷機構１３には，図示しないフラックス供給装置が設けられ，印刷マスク１８上に，適当量のフラックスが供給されるようになっている。   A printing mask 18 for printing flux on the substrate 11 is attached to the printing mechanism 13. The printing mask 18 has a plurality of through holes arranged in accordance with the pattern of the electrodes on the substrate 11 and is attached to the mold. This mold is supported by a mask support device 28, and this mask support device 28 is provided on the moving body 14 via an elevating device 21 of a printing mechanism. The printing mechanism 13 is provided with a flux supply device (not shown) so that an appropriate amount of flux is supplied onto the printing mask 18.

印刷機構１３によるフラックスの印刷は，２つのスキージ２４と、各スキージ２４をそれぞれ支持してその上下方向の位置を変更する２つのエアシリンダ２２と、エアシリンダ２２を介してスキージ２４を水平方向に移動させるスキージ移動装置２３により行われる。   The printing of the flux by the printing mechanism 13 includes two squeegees 24, two air cylinders 22 that support each squeegee 24 and change its vertical position, and the squeegee 24 through the air cylinders 22 in the horizontal direction. This is performed by the squeegee moving device 23 to be moved.

印刷機構１３での基板１１へのフラックスの印刷は，印刷マスク１８上面に沿ってスキージ２４が摺動移動することによって行われ、スキージ２４が印刷マスク１８を上から下に押さえ込みながら、フラックスを印刷マスク１８の貫通孔内に刷り込み、貫通孔を通して基板１１の電極上に供給されるようになっている。   Printing of the flux on the substrate 11 by the printing mechanism 13 is performed by sliding the squeegee 24 along the upper surface of the printing mask 18, and the flux is printed while the squeegee 24 presses the printing mask 18 from the top to the bottom. The mask 18 is imprinted in the through hole and supplied onto the electrode of the substrate 11 through the through hole.

印刷マスク１８の上面を摺動するスキージ２４は、ゴム、合成樹脂、金属などで製作される。スキージ２４は、印刷マスク１８の貫通孔形成領域の幅より広い幅で、印刷マスク１８の幅よりは狭い幅で形成されている。   The squeegee 24 that slides on the upper surface of the printing mask 18 is made of rubber, synthetic resin, metal, or the like. The squeegee 24 is formed with a width wider than the width of the through-hole forming region of the print mask 18 and narrower than the width of the print mask 18.

印刷機構１３のクリーニング部１７は，クリーニングシート２５を送り出しローラ２６と巻き取りローラ２７に掛け渡してあり，印刷マスク１８をクリーニングシート２５に押し当てて，滑らすことによりクリーニングする。   The cleaning unit 17 of the printing mechanism 13 spans the cleaning sheet 25 between the feeding roller 26 and the take-up roller 27, and cleans the printing mask 18 by pressing it against the cleaning sheet 25 and sliding it.

移動体１４の移動装置１５には，移動体１４が取り付けられており，移動体１４が搬送手段６，６１の搬送路と直交する方向に，転写機構１２が，フラックス供給部１６と転写位置である基板ステージ５上の基板１１間を往復でき，且つ，印刷機構１３が，基板１１とクリーニング部１７間を往復できるものとされている。
ボール搭載部３には，上方にボール搭載ヘッド３０及び搭載後の基板１１の取り出し用ピックアンドプレイス３１が，共通の搭載ヘッド移動装置３２に装着されて前後方向（図３中上下方向）に個別に移動可能に配備されている。ボール搭載ヘッド３０の下方には，多数の半田ボールが貯留されているボール供給部３３及びボール搭載ヘッド３０に半田ボールが適正に吸着されているか否かを検査する吸着検査部３４が配備されている。 The moving body 14 is attached to the moving device 15 of the moving body 14, and the transfer mechanism 12 is located at the transfer position in the direction perpendicular to the conveying path of the conveying means 6, 61 at the transfer position. The substrate 11 on a certain substrate stage 5 can be reciprocated, and the printing mechanism 13 can reciprocate between the substrate 11 and the cleaning unit 17.
In the ball mounting portion 3, a ball mounting head 30 and a pick-and-place 31 for taking out the substrate 11 after mounting are mounted on a common mounting head moving device 32 and individually in the front-rear direction (vertical direction in FIG. 3) It is deployed to be movable. Below the ball mounting head 30, a ball supply unit 33 storing a large number of solder balls and an adsorption inspection unit 34 for inspecting whether or not the solder balls are properly adsorbed to the ball mounting head 30 are provided. Yes.

以下、半田ボール搭載装置の動作について説明する。予め，第１位置認識カメラ１９によって，次に使用される転写機構１２と印刷機構１３のアライメントマークまたは，転写ピンか印刷マスク１８の貫通孔を撮像し，さらにボール搭載ヘッド３０を撮像して各位置を測定しておく。
搬入コンベア７により搬入されてきた基板１１は，搬入用ピックアンドプレイス８によって，搬入コンベア７より取り出され，基板供給部１に待機している各基板ステージ５に交互に載置される。
基板ステージ５に載置された基板１１は，搬入用ピックアンドプレイス８に装着されている第２位置認識カメラ２９により，基板１１に付されたアライメントマークまたは，ボール搭載位置が撮像され，基板１１の位置が測定される。その後，基板１１は基板ステージ５の移動によりフラックス塗布部２へと搬送される。
転写機構１２によるフラックスの塗布の場合には，まず，基板１１がフラックス塗布部２に搬送されてくる前に，フラックス供給部１６のフラックスをスキージでならし，均一な厚さとし，フラックス供給部１６の上方に位置していた転写機構１２を転写機構の昇降装置２０にて下降させて，転写ピンの先端にフラックスを付着させておく。 Hereinafter, the operation of the solder ball mounting apparatus will be described. The first position recognition camera 19 images in advance the alignment mark of the transfer mechanism 12 and the printing mechanism 13 to be used next, or the through hole of the transfer pin or the print mask 18, and further images the ball mounting head 30. Measure the position.
The substrates 11 carried in by the carry-in conveyor 7 are taken out from the carry-in conveyor 7 by the carry-in pick and place 8 and are alternately placed on the respective substrate stages 5 waiting in the substrate supply unit 1.
The substrate 11 placed on the substrate stage 5 is imaged of the alignment mark or ball mounting position attached to the substrate 11 by the second position recognition camera 29 mounted on the pick-up place 8 for loading. The position of is measured. Thereafter, the substrate 11 is transported to the flux application unit 2 by the movement of the substrate stage 5.
In the case of applying the flux by the transfer mechanism 12, first, before the substrate 11 is transported to the flux application unit 2, the flux of the flux supply unit 16 is smoothed with a squeegee so as to have a uniform thickness. The transfer mechanism 12 located above is lowered by the lifting device 20 of the transfer mechanism, and the flux is attached to the tip of the transfer pin.

そして，基板１１がフラックス塗布部２に搬送される際に，移動体１４の移動装置１５により転写機構１２が，基板１１の上方へ移動するとともに，基板ステージ５の回動装置１０も回動して，第１位置認識カメラ１９と第２位置認識カメラ２９の撮像にもとづいた基板１１と転写機構１２の位置合わせをする。続いて，転写機構１２を転写機構の昇降装置２０にて下降させ，基板１１にフラックスを付着させる。このようにしてフラックス塗布後，次の転写に備え，転写機構１２は転写機構の昇降装置２０により上昇し，さらに，移動体１４の移動装置１５によりフラックス供給部１６まで移動する。尚，転写動作の間にフラックス供給部１６では，フラックスのスキージでのならし動作が行われる。   Then, when the substrate 11 is conveyed to the flux application unit 2, the transfer mechanism 12 is moved above the substrate 11 by the moving device 15 of the moving body 14, and the rotating device 10 of the substrate stage 5 is also rotated. Thus, the substrate 11 and the transfer mechanism 12 are aligned based on the images of the first position recognition camera 19 and the second position recognition camera 29. Subsequently, the transfer mechanism 12 is lowered by the elevating device 20 of the transfer mechanism, and the flux is attached to the substrate 11. In this way, after the flux application, in preparation for the next transfer, the transfer mechanism 12 is raised by the lifting device 20 of the transfer mechanism, and further moved to the flux supply unit 16 by the moving device 15 of the moving body 14. During the transfer operation, the flux supply unit 16 performs a smoothing operation with a flux squeegee.

印刷機構１３によるフラックスの塗布の場合には，基板１１がフラックス塗布部２に搬送される際に，移動体１４の移動装置１５により印刷機構１３が，基板１１の上方へ移動するとともに，基板ステージ５の回動装置１０も回動して，第１位置認識カメラ１９と第２位置認識カメラ２９の撮像にもとづいた基板１１と印刷機構１３の位置合わせをする。続いて，基板１１の上面と印刷マスク１８の下面とが所定の距離になる位置まで印刷機構１３を印刷機構の昇降装置２１により下降させる。その後，一方のスキージ２４が下降して，印刷マスク１８を下方に押し付けながら横移動して，フラックスを印刷マスク１８の貫通孔内に刷り込み，基板１１にフラックスを印刷する。その後，スキージ２４を上昇させる。   In the case of flux application by the printing mechanism 13, when the substrate 11 is conveyed to the flux application unit 2, the printing mechanism 13 is moved above the substrate 11 by the moving device 15 of the moving body 14 and the substrate stage. 5 also rotates, and the substrate 11 and the printing mechanism 13 are aligned based on the images of the first position recognition camera 19 and the second position recognition camera 29. Subsequently, the printing mechanism 13 is lowered by the lifting device 21 of the printing mechanism to a position where the upper surface of the substrate 11 and the lower surface of the printing mask 18 become a predetermined distance. Thereafter, one of the squeegees 24 is lowered and moved laterally while pressing the print mask 18 downward, and the flux is imprinted in the through hole of the print mask 18 to print the flux on the substrate 11. Thereafter, the squeegee 24 is raised.

その後，印刷機構１３は，印刷機構の昇降装置２１により上昇し，移動体１４の移動装置１５により，クリーニング部１７に移動して，印刷マスク１８のクリーニングを行う。勿論，クリーニングは毎回行う必要はなく，必要時のみ行えばよい。次の基板１１が、フラックス塗布部２に搬送されたら，その基板１１の上方に移動し，他方のスキージ２４で同様に印刷する。尚，フラックス塗布部２には各搬送手段６，６１で基板１１が交互に搬送されるため，転写動作または印刷動作は搬送されてきた順に交互に行われる。   Thereafter, the printing mechanism 13 is lifted by the lifting device 21 of the printing mechanism, and moved to the cleaning unit 17 by the moving device 15 of the moving body 14 to clean the printing mask 18. Of course, cleaning does not have to be performed every time, but only when necessary. When the next substrate 11 is conveyed to the flux application unit 2, it moves above the substrate 11 and prints in the same manner with the other squeegee 24. In addition, since the board | substrate 11 is alternately conveyed by the each conveyance means 6 and 61 to the flux application part 2, a transfer operation or printing operation is performed alternately in the order conveyed.

実施例でのフラックス塗布部２での転写機構１２と印刷機構１３とは，共通の移動体１４に取り付けられ，移動体１４の移動装置１５により両者一体となって，水平移動をすることになるが，転写機構１２と印刷機構１３とを別にし，共通の移動路に移動可能に設けてもよい。   In the embodiment, the transfer mechanism 12 and the printing mechanism 13 in the flux application unit 2 are attached to a common moving body 14 and are moved horizontally as a unit by the moving device 15 of the moving body 14. However, the transfer mechanism 12 and the printing mechanism 13 may be separately provided so as to be movable on a common moving path.

フラックス塗布部２でフラックスの塗布が完了した基板１１は，基板ステージ５の移動によりボール搭載部３へと搬送される。この際，第１位置認識カメラ１９で撮像したボール搭載ヘッド３０の位置と第２位置認識カメラ２９で撮像した基板１１の位置にもとづいて，基板１１とボール搭載ヘッド３０を位置合わせするように，搭載ヘッド移動装置３２及び回動装置１０で移動する。続いて，ボール搭載ヘッド３０により基板１１上に半田ボールを搭載する。   The substrate 11 on which flux application has been completed in the flux application unit 2 is transferred to the ball mounting unit 3 by the movement of the substrate stage 5. At this time, the substrate 11 and the ball mounting head 30 are aligned based on the position of the ball mounting head 30 imaged by the first position recognition camera 19 and the position of the substrate 11 imaged by the second position recognition camera 29. It moves with the mounting head moving device 32 and the rotating device 10. Subsequently, solder balls are mounted on the substrate 11 by the ball mounting head 30.

ボール搭載部３で，ボール搭載ヘッド３０により半田ボールの搭載が完了した基板１１は，取り出し用ピックアンドプレイス３１により，取り出され，搭載検査部３５へと移送される。半田ボールの搭載検査が完了した基板１１は基板搬出部４で，搬出用ピックアンドプレイス３８により，適正搭載基板１１は，搬出コンベア３６へ，不適正搭載基板１１’は回収部３７へと移送される。   The substrate 11 on which the mounting of the solder ball by the ball mounting head 30 in the ball mounting unit 3 is taken out by the picking-and-place 31 for taking out and transferred to the mounting inspection unit 35. The board 11 for which the solder ball mounting inspection has been completed is transferred to the board unloading unit 4 by the pick-and-place 38 for unloading. The

本実施例にかかる半田ボール搭載装置の全体を示す概略正面図The schematic front view which shows the whole solder ball mounting apparatus concerning a present Example 同装置のヘッド部を省略した状態の平面説明図Plane explanatory drawing in a state where the head of the device is omitted 同装置のヘッド部を示す平面説明図Plane explanatory view showing the head part of the apparatus フラックス塗布部の側面図Side view of flux application part 従来例での各部の配置説明図で，（Ａ）は，ボール搭載部手前に，フラックス塗布部のスクリーン印刷部とピン転写部と進行方向に設けた状態の配置図であり，（Ｂ）は，ボール搭載部の進行方向手前に，フラックス塗布部のスクリーン印刷部を，ボール搭載部の向かいにピン転写部を設けた状態の配置図である。(A) is an arrangement diagram of a state in which the screen printing part and the pin transfer part of the flux application part are provided in the traveling direction before the ball mounting part, and (B) is an explanatory diagram of the arrangement of each part in the conventional example. FIG. 5 is a layout view in which a screen printing part of a flux application part is provided in front of the moving direction of the ball mounting part, and a pin transfer part is provided opposite to the ball mounting part.

符号の説明Explanation of symbols

１・・・基板供給部
２・・・フラックス塗布部
３・・・ボール搭載部
４・・・基板搬出部
５・・・基板ステージ
６，６１・・・搬送手段
７・・・搬入コンベア
８・・・搬入用ピックアンドプレイス
９・・・基板載置面
１０・・・回動装置
１１・・・基板
１２・・・転写機構
１３・・・印刷機構
１４・・・移動体
１５・・・移動体の移動装置
１６・・・フラックス供給部
１７・・・クリーニング部
１８・・・印刷マスク
１９・・・第１位置認識カメラ
２０・・・転写機構の昇降装置
２１・・・印刷機構の昇降装置
２２・・・エアシリンダ
２３・・・スキージ移動装置
２４・・・スキージ
２５・・・クリーニングシート
２６・・・送り出しローラ
２７・・・巻き取りローラ
２９・・・第２位置認識カメラ
２８・・・マスク支持装置
３０・・・ボール搭載ヘッド
３１・・・取り出し用ピックアンドプレイス
３２・・・搭載ヘッド移動装置
３３・・・ボール供給部
３４・・・吸着検査部
３５・・・搭載検査
３６・・・搬出コンベア
３７・・・回収部
３８・・・搬出用ピックアンドプレイス DESCRIPTION OF SYMBOLS 1 ... Substrate supply part 2 ... Flux application part 3 ... Ball mounting part 4 ... Substrate carrying-out part 5 ... Substrate stage 6, 61 ... Conveying means 7 ... Incoming conveyor 8 ..Pick-and-place for loading 9 ... Substrate mounting surface 10 ... Rotating device 11 ... Substrate 12 ... Transfer mechanism 13 ... Printing mechanism 14 ... Moving body 15 ... Movement Body moving device 16 ... Flux supply unit 17 ... Cleaning unit 18 ... Print mask 19 ... First position recognition camera 20 ... Elevating device for transfer mechanism 21 ... Elevating device for printing mechanism DESCRIPTION OF SYMBOLS 22 ... Air cylinder 23 ... Squeegee moving device 24 ... Squeegee 25 ... Cleaning sheet 26 ... Sending roller 27 ... Winding roller 29 ... Second position recognition camera 28 ... Mask support Device 30... Ball mounting head 31... Pick and place for taking out 32... Mounting head moving device 33... Ball supply unit 34. Conveyor 37 ... Recovery unit 38 ... Pick and place for unloading

Claims (3)

基板を支持するステージと，該ステージを所定方向に移動させる搬送手段と，該ステージ上の基板にフラックスを塗布するフラックス塗布手段と，該ステージ上の基板に導電性ボールを搭載するボール搭載手段とを備え，
ステージ上の基板の所定位置に，フラックス塗布手段によりフラックスを塗布した後，ボール搭載手段により導電性ボールを搭載する導電性ボール搭載装置において，
前記フラックス塗布手段は，前記搬送手段と直交する方向に移動可能な移動体を備え，
該移動体に，印刷マスクを介してフラックスを印刷するスクリーン印刷機構と，転写ピンによりフラックスを付着させる転写機構を設けたことを特徴とする導電性ボール搭載装置。
A stage for supporting the substrate; a conveying means for moving the stage in a predetermined direction; a flux applying means for applying a flux to the substrate on the stage; and a ball mounting means for mounting a conductive ball on the substrate on the stage; With
In a conductive ball mounting apparatus in which a conductive ball is mounted by a ball mounting means after flux is applied to a predetermined position of a substrate on a stage by a flux applying means.
The flux applying means includes a movable body movable in a direction orthogonal to the conveying means,
A conductive ball mounting apparatus, wherein the moving body is provided with a screen printing mechanism for printing flux through a printing mask and a transfer mechanism for attaching flux with a transfer pin.
前記スクリーン印刷機構と転写機構は，共通の移動体に設けたものである請求項１に記載の導電性ボール搭載装置。
The conductive ball mounting apparatus according to claim 1, wherein the screen printing mechanism and the transfer mechanism are provided on a common moving body.
前記搬送手段は，平行に複数列設けられ，各搬送手段に前記ステージが設けられ，フラックス塗布手段は，前記各ステージ上の基板に順番にフラックスを塗布するものである請求項１又は２に記載の導電性ボール搭載装置。   The said conveyance means is provided in multiple rows in parallel, the said stage is provided in each conveyance means, and a flux application | coating means applies a flux in order to the board | substrate on each said stage. Conductive ball mounting device.
JP2008304537A 2008-11-28 2008-11-28 Conductive ball mounting device Pending JP2010129866A (en)

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JP2010177250A (en) * 2009-01-27 2010-08-12 Minami Kk Flux printing and solder ball loading apparatus to substrate
JP7285604B1 (en) 2022-09-22 2023-06-02 アスリートＦａ株式会社 Ball loading device and ball loading method

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JP2014011231A (en) * 2012-06-28 2014-01-20 Hitachi Ltd Solder ball printing mounting device
JP2019165175A (en) * 2018-03-20 2019-09-26 東芝メモリ株式会社 Semiconductor fabrication apparatus and semiconductor fabrication method
KR102330427B1 (en) * 2020-06-03 2021-11-24 주식회사 프로텍 Method of Mounting Conductive Ball Using Electrostatic Chuck
KR102606828B1 (en) * 2021-08-30 2023-11-29 에스케이하이닉스 주식회사 Semiconductor Fabricating System Including Inspecting and Repairing Apparatus And Method of Driving The Same

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JPH10226043A (en) * 1997-02-12 1998-08-25 Itsukou:Kk Screen printer
JP2001007125A (en) * 1999-06-18 2001-01-12 Shibuya Kogyo Co Ltd Positioning device of work and head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010177250A (en) * 2009-01-27 2010-08-12 Minami Kk Flux printing and solder ball loading apparatus to substrate
JP7285604B1 (en) 2022-09-22 2023-06-02 アスリートＦａ株式会社 Ball loading device and ball loading method

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