JP2010107572A - Optical scanner - Google Patents

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JP2010107572A
JP2010107572A JP2008276904A JP2008276904A JP2010107572A JP 2010107572 A JP2010107572 A JP 2010107572A JP 2008276904 A JP2008276904 A JP 2008276904A JP 2008276904 A JP2008276904 A JP 2008276904A JP 2010107572 A JP2010107572 A JP 2010107572A
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substrate
mirror
optical scanning
scanning device
vibration
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Yukio Shinozuka
幸男 篠塚
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Shinano Kenshi Co Ltd
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Shinano Kenshi Co Ltd
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Priority to JP2008276904A priority Critical patent/JP2010107572A/en
Priority to PCT/JP2009/068469 priority patent/WO2010050495A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical scanner in which the variation in the center position of a mirror part in vertical direction is small, an influence of an oscillation component other than a deriving frequency is small, and the scanning accuracy of laser light is high. <P>SOLUTION: A substrate 1 is fixed at its both end parts in a longitudinal direction on respective supporting parts 5 in an axial symmetry with respect to a beam part 3 for supporting a mirror part 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、光源より照射された光ビームを揺動するミラー部で反射して走査を行う光走査装置に関する。   The present invention relates to an optical scanning apparatus that performs scanning by reflecting a light beam emitted from a light source by a oscillating mirror.

光源より照射されたレーザー光等の光ビームを走査する光走査装置は、バーコードリーダ、レーザープリンタ、ヘッドマウントディスプレー等の光学機器、あるいは赤外線カメラ等撮像装置の光取り入れ装置として用いられている。
例えば、図７（ａ）において、支持部材５１に片持ち支持されたステンレス基板やシリコン基板などの基板５２の自由端側に開口部５３が形成され、当該開口部５３内に梁部５４により両側が連結されたミラー部５５が設けられている。ミラー部５５は鏡面仕上げされているか、反射膜が形成されているか、ミラーが貼付けられている。 An optical scanning device that scans a light beam such as a laser beam emitted from a light source is used as an optical device such as a barcode reader, a laser printer, or a head-mounted display, or a light intake device of an imaging device such as an infrared camera.
For example, in FIG. 7A, an opening 53 is formed on the free end side of a substrate 52 such as a stainless steel substrate or a silicon substrate that is cantilevered by the support member 51, and both sides are formed by beams 54 in the opening 53. Are connected to each other. The mirror part 55 is mirror-finished, is formed with a reflective film, or has a mirror attached thereto.

また、基板５２に圧電体、磁歪体、または永久磁石のいずれかによる薄膜よりなる振動源５６を設け、例えば圧電体の場合、図示しない駆動源より正電圧を印加すると延びが発生し、負電圧を印加すると縮みが発生するため、基板５２に撓みが発生する。この基板５２の上下方向の撓みに対して梁部５４にねじれ振動が発生してミラー部５５が揺動する。   Further, the substrate 52 is provided with a vibration source 56 made of a thin film of a piezoelectric body, a magnetostrictive body, or a permanent magnet. For example, in the case of a piezoelectric body, when a positive voltage is applied from a driving source (not shown), an extension occurs and a negative voltage Since the shrinkage occurs when the voltage is applied, the substrate 52 is bent. Torsional vibration is generated in the beam portion 54 with respect to the vertical deflection of the substrate 52, and the mirror portion 55 swings.

このミラー部５５と梁部５４との共振周波数付近で駆動周波数を維持して、振動するミラー部５５によりレーザー光を反射することで光走査する。これによって、ＭＥＭＳ（Micro Electro Mechanical System）を用いて製造された微小ミラーを揺動させる光走査装置より製造コストがかからず、小型の振動源でミラー部に大きな振動を発生させるようになっている（特許文献１）。
特開２００６−２９３１１６号公報 The driving frequency is maintained near the resonance frequency between the mirror portion 55 and the beam portion 54, and the laser beam is reflected by the vibrating mirror portion 55 to perform optical scanning. As a result, the manufacturing cost is lower than that of an optical scanning device that swings a micro mirror manufactured using MEMS (Micro Electro Mechanical System), and a large vibration is generated in the mirror portion by a small vibration source. (Patent Document 1).
JP 2006-293116 A

上述した光走査装置の起動時の過渡応答特性解析をした結果を図７（ｂ）のグラフ図に示す。図７（ｂ）は、時間変化と、ミラー部５５の中心点Ｍの位置（図７（ａ）参照）における基板５２の面に対して鉛直な方向（以下「上下方向」という）の変位との関係を示す。このグラフ図から、時間変化にともなって、中心点Ｍが上下方向に不規則に変位していることが分かる。   The graph of FIG. 7B shows the result of the transient response characteristic analysis when the optical scanning device described above is started. FIG. 7B shows a change with time and a displacement in a direction (hereinafter referred to as “vertical direction”) perpendicular to the surface of the substrate 52 at the position of the center point M of the mirror portion 55 (see FIG. 7A). The relationship is shown. From this graph, it can be seen that the center point M is irregularly displaced in the vertical direction with time.

また、図７（ｂ）の結果を分析すると少なくとも２つ以上の周波数成分が含まれていることがわかる。一つは駆動周波数に相当する高周波数成分の正弦波であり、その他は前記高周波数成分よりも低い周波数の振動である。これら少なくとも２つ以上の周波数成分が重畳されて中心点Ｍは不規則な変位となっている。このため、ミラー部５５で反射されたレーザー光の位置は、中心点Ｍが上下方向に不規則に変位することにより、設計値に対し微小に変化してしまう。このように、複数の周波数成分が含まれる原因としては基板５２に片持ち梁構造の自由端が存在する為、高次の周波数で駆動したときに低次の振動モードの影響を受け易いことが原因であると考えられる。また、中心点Ｍの上下方向に変位する振幅は小さいほうが望ましい。
この結果、この光走査装置をレーザービームプリンタ用スキャナに用いた場合、駆動周波数３ｋＨｚ以上の高速走査が要求されるレーザー光の走査範囲や走査速度が安定しないか若しくは走査精度が低下するという不具合が想定される。 Moreover, when the result of FIG.7 (b) is analyzed, it turns out that at least 2 or more frequency component is contained. One is a sine wave having a high frequency component corresponding to the driving frequency, and the other is vibration having a frequency lower than that of the high frequency component. The center point M is irregularly displaced by superimposing at least two of these frequency components. For this reason, the position of the laser beam reflected by the mirror unit 55 slightly changes with respect to the design value when the center point M is irregularly displaced in the vertical direction. As described above, the cause of the inclusion of a plurality of frequency components is that the free end of the cantilever structure exists on the substrate 52, and therefore it is easily affected by the low-order vibration mode when driven at a high-order frequency. It is thought to be the cause. Further, it is desirable that the amplitude of displacement in the vertical direction of the center point M is small.
As a result, when this optical scanning device is used in a scanner for a laser beam printer, there is a problem that the scanning range and scanning speed of the laser beam that requires high-speed scanning with a driving frequency of 3 kHz or more are unstable or the scanning accuracy is lowered. is assumed.

本発明は、ミラー部の中心位置の上下方向の変位が小さく、駆動周波数以外の振動成分の影響を受けにくくレーザー光の走査精度が高い光走査装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide an optical scanning device in which the vertical displacement of the center position of a mirror portion is small and is not easily affected by vibration components other than the driving frequency, and the laser beam scanning accuracy is high.

基板に形成された開口部内に両側を梁部により支持されたミラー部が形成され、前記基板上に設けられた振動源を作動させて当該基板を撓ませることにより前記梁部を揺動軸として前記ミラー部を揺動させながら照射光を反射することで走査する光走査装置であって、前記基板は、前記ミラー部を支持する前記梁部を軸対称として長手方向両端部が支持部に各々固定されていることを特徴とする。   A mirror part supported on both sides by a beam part is formed in an opening formed on the substrate, and the beam part is used as an oscillation axis by operating the vibration source provided on the substrate to bend the substrate. An optical scanning device that scans by reflecting irradiation light while oscillating the mirror portion, wherein the substrate has an axial symmetry with respect to the beam portion supporting the mirror portion, and both longitudinal ends thereof are supported by the support portion, respectively. It is fixed.

また、前記梁部を中心として軸対称となる前記基板上に前記振動源が各々配置され、各振動源に交番電圧を印加して前記梁部を中心として前記基板を両側で反対方向に撓ませる動作を交互に繰り返すことにより前記ミラー部を所定の振幅で揺動させることを特徴とする。   The vibration sources are respectively arranged on the substrate that is axially symmetric with respect to the beam portion, and an alternating voltage is applied to each vibration source to bend the substrate in opposite directions around the beam portion on both sides. The mirror portion is swung with a predetermined amplitude by repeating the operation alternately.

また、前記各振動源は、前記基板の反対面側に設けられ、同一の駆動源から同相の交番電圧が印加されて駆動されることを特徴とする。   Each of the vibration sources is provided on the opposite side of the substrate and is driven by applying an in-phase alternating voltage from the same drive source.

また、前記各振動源は、前記基板の同一面側に設けられ、異なる駆動源によって位相が反転した交番電圧が印加されて駆動されることを特徴とする。   Further, each of the vibration sources is provided on the same surface side of the substrate, and is driven by applying an alternating voltage whose phase is inverted by a different driving source.

また、前記基板の両側固定端付近には、抜き孔部が前記梁部を中心として軸対称となる位置に各々形成されていることを特徴とする。   In addition, in the vicinity of the fixed ends on both sides of the substrate, punched holes are formed at positions that are axially symmetric with respect to the beam.

また、前記基板と両側固定端との連結は当該基板より幅狭な単数又は複数の基板連結部により連結されていることを特徴とする。   Further, the connection between the substrate and the fixed ends on both sides is connected by a single or a plurality of substrate connecting portions narrower than the substrate.

基板は、ミラー部を支持する梁部を軸対称として長手方向両端部が各々支持部に固定されているので、基板上に設けられた振動源を作動させると梁部を揺動軸として両側の基板を撓ませてミラー部を揺動させることができる。   Since the substrate is symmetrical with respect to the beam portion supporting the mirror portion and both ends in the longitudinal direction are fixed to the support portion, when the vibration source provided on the substrate is operated, the beam portion serves as an oscillation axis on both sides. The mirror portion can be swung by bending the substrate.

また、梁部によって軸対称となる基板上に振動源が各々配置され、梁部を中心として基板を両側で反対方向に撓ませる動作を交互に繰り返すことによりミラー部を所要の振幅で高速で揺動させることができる。このとき、梁部の両側で基板が反対方向に撓むが対称軸位置にあるミラー部の中心点は変位しない。したがって、振動源の駆動電圧を変えてミラー部を揺動させてもミラー部の中心点の上下方向の変位は小さく駆動周波数以外の振動成分の影響を受けにくいので、基板の撓みにより安定した定在波を形成して一定の振幅でミラー部を振動させることができる。また、フィードバック制御を行なうにあたっては過渡応答が安定するので、制御性が向上する。   In addition, vibration sources are arranged on the substrate that is symmetric with respect to the beam portion, and the mirror portion is swung at a required amplitude at a high speed by alternately repeating the operation of bending the substrate in opposite directions around the beam portion. Can be moved. At this time, the substrate bends in opposite directions on both sides of the beam portion, but the center point of the mirror portion at the symmetrical axis position is not displaced. Therefore, even if the mirror unit is swung by changing the drive voltage of the vibration source, the vertical displacement of the center point of the mirror unit is small and is not easily affected by vibration components other than the drive frequency. A standing wave can be formed and the mirror section can be vibrated with a constant amplitude. Further, when performing feedback control, the transient response is stabilized, so that controllability is improved.

また、各振動源は、基板の反対面側に設けられ、同一の駆動源から同相の駆動電圧が印加されて駆動されることにより、同一の駆動源により各振動源を作動することができるため、駆動源を簡略化することができる。また、正弦波駆動のみならず矩形パルス駆動も可能になるので、制御動作も簡略化することができる。   In addition, each vibration source is provided on the opposite surface side of the substrate, and is driven by applying a driving voltage having the same phase from the same driving source, so that each vibration source can be operated by the same driving source. The drive source can be simplified. Further, since not only sinusoidal driving but also rectangular pulse driving is possible, the control operation can be simplified.

また、各振動源は、基板の同一面側に設けられ、異なる駆動源によって位相が反転した駆動電圧が印加されて加振されるようにしてもよい。この場合には、駆動源は個別に必要となるが、梁部を対称軸として両側の基板を反対方向に撓ませてミラー部を揺動させることができる。   In addition, each vibration source may be provided on the same surface side of the substrate, and may be excited by applying a driving voltage whose phase is reversed by a different driving source. In this case, a separate drive source is required, but the mirror portion can be swung by bending the substrates on both sides in opposite directions with the beam portion as the axis of symmetry.

また、基板の両側固定端付近には、抜き孔部が梁部を中心として軸対称となる位置に各々形成されていると、梁部の両側の基板部を振動源の作動により撓ませ易くすることができ、ミラー部の振幅をかせぐことができる。   Also, if the punched holes are formed in the vicinity of the fixed ends on both sides of the substrate at positions that are axially symmetric with respect to the beam portion, the substrate portions on both sides of the beam portion are easily bent by the operation of the vibration source. And the amplitude of the mirror portion can be increased.

また、基板と両側固定端との連結は基板より幅狭な単数又は複数の基板連結部により連結されていると、基板の可撓性が高まるため、梁部の両側の基板全体を振動源の作動により撓ませ易くなりミラー部のより大きな振幅を実現可能になる。   In addition, if the substrate and the fixed ends on both sides are connected by a single or a plurality of substrate connecting portions that are narrower than the substrate, the flexibility of the substrate increases. It becomes easy to bend by the operation, and a larger amplitude of the mirror part can be realized.

以下、本発明に係る光学走査装置の最良の実施形態について図面を参照して説明する。本実施例では、レーザービームプリンタ用に用いられる光走査装置（スキャナー）を例示して説明するものとする。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an optical scanning device according to an embodiment of the invention will be described with reference to the drawings. In this embodiment, an optical scanning device (scanner) used for a laser beam printer will be described as an example.

図１を参照して光走査装置の概略構成について説明する。
基板１は金属板（ステンレススチール；ＳＵＳ３０４）若しくはシリコン基板（Ｓｉ）などの矩形基板が好適に用いられる。基板１の長手方向中央部には開口部（貫通孔）２が設けられている。この開口部２の中心部に梁部３が形成されて中央部にミラー部４が一体に支持されている。梁部３は、基板１の対称軸となる位置に形成されている。基板１は、ミラー部４を支持する梁部３を軸対称として長手方向両端部が各々支持部５に固定されている。 A schematic configuration of the optical scanning device will be described with reference to FIG.
The substrate 1 is preferably a rectangular substrate such as a metal plate (stainless steel; SUS304) or a silicon substrate (Si). An opening (through hole) 2 is provided at the center in the longitudinal direction of the substrate 1. A beam 3 is formed at the center of the opening 2, and a mirror 4 is integrally supported at the center. The beam portion 3 is formed at a position that is the axis of symmetry of the substrate 1. In the substrate 1, both end portions in the longitudinal direction are fixed to the support portions 5 with the beam portions 3 supporting the mirror portions 4 being axially symmetrical.

また、基板１上であって梁部３によって軸対称となる位置に振動源６が各々配置されている。本実施例では、振動源６が基板1の振動の腹部へ形成された図を示したが、振動の節部でも良い。さらに、振動源６として圧電素子（ＰＺＴ；チタン酸ジルコン酸鉛）が用いられている。   In addition, vibration sources 6 are arranged on the substrate 1 at positions that are axially symmetric with the beam portion 3. In the present embodiment, the vibration source 6 is formed on the vibration abdomen of the substrate 1, but it may be a vibration node. Further, a piezoelectric element (PZT; lead zirconate titanate) is used as the vibration source 6.

ここで、ミラー部４の振動原理について具体的に説明すると、たとえば圧電素子の表層側電極にプラスの電圧を印加すると圧電層が延びるため、図２（ａ）に示すように基板１は上下に凸となるように撓む。また、圧電素子の表層側電極にマイナスの電圧を印加すると圧電層は縮むため、図２（ｂ）に示すように基板１は上下に凹となるように撓む。このとき、基板１に発生した定在波は、梁部３により支持された水平状態にあるミラー部４に、梁部３の捻れによる回転モーメントを発生させて、捻れ振動を生じさせる。   Here, the vibration principle of the mirror unit 4 will be described in detail. For example, when a positive voltage is applied to the surface layer side electrode of the piezoelectric element, the piezoelectric layer extends, so that the substrate 1 moves up and down as shown in FIG. Bends to be convex. Further, when a negative voltage is applied to the surface layer side electrode of the piezoelectric element, the piezoelectric layer contracts, so that the substrate 1 bends up and down as shown in FIG. 2B. At this time, the standing wave generated on the substrate 1 generates a rotational moment due to torsion of the beam portion 3 in the horizontal mirror portion 4 supported by the beam portion 3 to generate torsional vibration.

また、各振動源６に交番電圧を印加して梁部３の両側の基板１を反対方向に撓ませる動作を交互に繰り返すことによりミラー部４を所要の振幅で揺動させる。上記梁部３を捻れ軸としてミラー部４を所定の振幅で揺動させた状態でミラー部４へレーザー光Ｌを光照射することで、反射光（レーザービーム）を走査することができるようになっている。   Further, by alternately applying an alternating voltage to each vibration source 6 to bend the substrate 1 on both sides of the beam portion 3 in the opposite direction, the mirror portion 4 is swung with a required amplitude. The reflected light (laser beam) can be scanned by irradiating the mirror part 4 with laser light L in a state where the mirror part 4 is swung with a predetermined amplitude with the beam part 3 as a twist axis. It has become.

本実施例は、各振動源６が、基板１の反対面側に設けられ、図示しない同一の駆動源から同相の駆動電圧で各々駆動される。これにより、駆動源や制御回路を簡略化することができる。また、正弦波駆動のみならず矩形波駆動も可能であるので、制御動作も簡略化することができる。
尚、各振動源６は、基板６の同一面側に設けられ、異なる駆動源によって位相が反転した駆動電圧が印加されて駆動されるようにしてもよい。 In this embodiment, each vibration source 6 is provided on the opposite side of the substrate 1 and is driven by the same driving source (not shown) with a driving voltage of the same phase. Thereby, a drive source and a control circuit can be simplified. Further, since not only sinusoidal driving but also rectangular wave driving is possible, the control operation can be simplified.
Each vibration source 6 may be provided on the same side of the substrate 6 and may be driven by applying a driving voltage whose phase is reversed by a different driving source.

また、振動源６としては、圧電素子のほかに、圧電体、磁歪体又は永久磁石体のいずれかが基板上に膜状に直接形成されていてもよい。成膜法としては、例えばエアロゾルデポジション法（AD法）、真空蒸着法、スパッタリング法や化学的気相成長法（CVD: Chemical Vapor Deposition）、ゾル−ゲル法などの薄膜形成技術を用いて、圧電体、磁歪体又は永久磁石体のいずれかが基板上に膜状に直接形成されていると、低電圧駆動で低消費電力の光走査装置を提供できる。   Further, as the vibration source 6, in addition to the piezoelectric element, any one of a piezoelectric body, a magnetostrictive body, and a permanent magnet body may be directly formed in a film shape on the substrate. As a film formation method, for example, an aerosol deposition method (AD method), a vacuum deposition method, a sputtering method, a chemical vapor deposition method (CVD: Chemical Vapor Deposition), or a sol-gel method is used. When any one of the piezoelectric body, the magnetostrictive body, and the permanent magnet body is directly formed in a film shape on the substrate, an optical scanning device that is driven at a low voltage and consumes low power can be provided.

磁歪体や永久磁石体を用いる場合、外部から印加する交番磁界は、上記磁歪膜、永久磁石膜が形成された基板部近傍に設けられたコイルに交流電流を流すことで交番磁界を発生させる。尚、磁歪膜や永久磁石膜で基板に形成する場合、基板材料は非磁性材料である方が、より効率的に撓みを発生することができる。   When a magnetostrictive body or a permanent magnet body is used, an alternating magnetic field applied from the outside generates an alternating magnetic field by passing an alternating current through a coil provided in the vicinity of the substrate portion on which the magnetostrictive film and the permanent magnet film are formed. In addition, when forming on a board | substrate with a magnetostriction film | membrane or a permanent magnet film, the direction where a board | substrate material is a nonmagnetic material can generate | occur | produce bending more efficiently.

上述した光学走査装置の過渡応答特性解析をした結果を、図３（ｂ）に示す。図３（ｂ）は、時間変化と、ミラー部４の中心点Ｍの位置（図３（ａ）参照）における基板１の面に対して鉛直な方向（以下、“上下方向”とする）の変位との関係を示す。   FIG. 3B shows the result of the transient response characteristic analysis of the optical scanning device described above. FIG. 3B shows a change in time and a direction perpendicular to the surface of the substrate 1 at the position of the center point M of the mirror unit 4 (see FIG. 3A) (hereinafter referred to as “vertical direction”). The relationship with displacement is shown.

図３（ｂ）において、梁部３の両側で基板１が反対方向に撓むが、梁部３が対称軸位置にあるため中心点Ｍは上下方向へ不規則な変化が非常に小さい。図７（ｂ）と比較しても低周波数成分が大幅に低減し、振幅自体も小さくなっていることが分かる。したがって、振動源６の駆動電圧を変えてミラー部４を揺動させても揺動軸の中心点Ｍの上下方向の変位が小さく駆動周波数以外の振動成分の影響を受けにくいので、駆動周波数に相当する高周波数成分の正弦波に非常に近い安定した定在波を形成して一定の振幅でミラー部４を振動させることができる。また、フィードバック制御を行なうにあたって過渡応答が安定し、制御性が向上する。
また、図７（ｂ）と比較すると低周波数成分が無く、設計上極めて有利であることがわかる。 In FIG. 3B, the substrate 1 bends in opposite directions on both sides of the beam portion 3, but since the beam portion 3 is in a symmetrical axis position, the center point M is very little irregularly changed in the vertical direction. Even when compared with FIG. 7B, it can be seen that the low frequency components are greatly reduced and the amplitude itself is also reduced. Therefore, even if the mirror unit 4 is swung by changing the driving voltage of the vibration source 6, the vertical displacement of the center point M of the rocking shaft is small and hardly affected by vibration components other than the driving frequency. A stable standing wave very close to a corresponding high frequency component sine wave can be formed to vibrate the mirror section 4 with a constant amplitude. Further, when performing feedback control, the transient response is stabilized and controllability is improved.
Further, it can be seen that there is no low frequency component compared to FIG.

また、基板１の両側を支持部５に固定したことにより基板１の所期の撓み量が得られないことも想定される。そこで、図４（ａ）（ｂ）において、基板１の両側固定端（支持部５）付近には、抜き孔部７が軸対称に形成されている。図４（ａ）は、基板１に端部近傍に抜き孔部７が形成されており、支持部５とは基板短手方向全体で支持されている。また図４（ｂ）は、基板１の端部に抜き孔部７が形成されており、支持部５とは基板短手方向で基板１より幅狭な基板連結部８によって３箇所で支持されている。このように、基板１の両側固定端付近に、抜き孔部７が軸対称に形成されているので、梁部３の両側の基板部を振動源６の作動により撓ませ易くすることができ、ミラー部４の振幅をかせぐことができる。   It is also assumed that the desired amount of bending of the substrate 1 cannot be obtained by fixing both sides of the substrate 1 to the support portion 5. Therefore, in FIGS. 4A and 4B, the hole 7 is formed in the vicinity of both side fixed ends (supporting portions 5) of the substrate 1 in an axial symmetry. In FIG. 4A, a hole 7 is formed in the vicinity of the end portion of the substrate 1, and the support portion 5 is supported in the entire short direction of the substrate. In FIG. 4B, a hole 7 is formed at the end of the substrate 1, and the support portion 5 is supported at three locations by a substrate connecting portion 8 that is narrower than the substrate 1 in the lateral direction of the substrate. ing. In this way, since the hole 7 is formed axially symmetrical near the fixed ends on both sides of the substrate 1, the substrate portions on both sides of the beam portion 3 can be easily bent by the operation of the vibration source 6, The amplitude of the mirror part 4 can be earned.

また、図４（ｃ）において、基板１と両側固定端（支持部５）との接続は単数（又は複数）の基板連結部８により連結されていてもよい。この場合には、基板１の可撓性が高まるため、梁部３の両側の基板全体を振動源６の作動により撓ませ易くなりミラー部４のより大きな振幅を実現可能になる。この場合、基板連結部８の長手方向延長線上に振動源６を設けることにより振動伝達性が良く、梁部３の両側で均一な基板１の撓みによる定在波を形成するうえで好ましい。   Further, in FIG. 4C, the connection between the substrate 1 and both side fixed ends (support portions 5) may be connected by a single (or plural) substrate connecting portion 8. In this case, since the flexibility of the substrate 1 is increased, the entire substrate on both sides of the beam portion 3 is easily bent by the operation of the vibration source 6, and a larger amplitude of the mirror portion 4 can be realized. In this case, by providing the vibration source 6 on the longitudinal extension line of the substrate connecting portion 8, vibration transmission is good, and it is preferable for forming a standing wave due to uniform bending of the substrate 1 on both sides of the beam portion 3.

尚、ミラー部４は、基板１に金属板を使用する場合には鏡面仕上げされた基板１を用いると良い。金属板以外の基板や、金属板においてもより高い反射性能が要求され場合には、真空蒸着、スパッタリング、ＣＶＤ（化学的気相成長法）等の薄膜形成技術により、ミラー部４へ薄膜を形成するか、或いはミラー部４へ別途ミラー用反射材料を貼付けてもよい。   The mirror unit 4 may be a mirror-finished substrate 1 when a metal plate is used for the substrate 1. When a substrate other than a metal plate or a metal plate is required to have higher reflection performance, a thin film is formed on the mirror portion 4 by a thin film forming technique such as vacuum deposition, sputtering, or CVD (chemical vapor deposition). Alternatively, a mirror reflection material may be separately attached to the mirror unit 4.

また、薄膜を形成する材料には、金（Au）、二酸化ケイ素（SiO2）、アルミニウム（Al）、あるいはフッ化マグネシウム（MgF2）から１つを選択、或いは２つ以上の材料を組み合わせ、さらに前記薄膜成形技術による同一層(=単層)、或いは２層以上の多層構成を適度な膜厚に制御することによって、反射性能を向上する薄膜が形成できる。あるいは、ミラー部４へ別途ミラー用反射材を貼付ける材料には、鏡面仕上げしたシリコン（Si）またはアルミナチタンカーバイト（Al2O3-TiC）のセラミック等へ、前記薄膜成形技術にて薄膜を形成しても良い。 In addition, the material for forming the thin film is selected from gold (Au), silicon dioxide (SiO 2 ), aluminum (Al), or magnesium fluoride (MgF 2 ), or a combination of two or more materials. Furthermore, by controlling the same layer (= single layer) or a multilayer structure of two or more layers by the thin film forming technique to an appropriate film thickness, a thin film that improves reflection performance can be formed. Alternatively, as a material for separately attaching a reflector for mirror to the mirror part 4, a thin film is formed on the mirror-finished silicon (Si) or alumina titanium carbide (Al 2 O 3 -TiC) ceramic by the above-mentioned thin film forming technique. May be formed.

また、基板１の厚みに関しては、動作中のミラーの平坦性やプロジェクターデバイスなどへの応用で要求されるミラーサイズを考慮し、シリコン（Ｓｉ）、ステンレススチール（ＳＵＳ３０４等）等の、或いはさらにカーボンナノチューブを前記材料へ成長させた基板を想定すると、少なくとも１０μｍ以上の厚みが望ましい。   Regarding the thickness of the substrate 1, considering the flatness of the mirror in operation and the mirror size required for application to a projector device, etc., silicon (Si), stainless steel (SUS304, etc.), or even carbon Assuming a substrate with nanotubes grown on the material, a thickness of at least 10 μm or more is desirable.

また、振動源６である圧電素子を設けた場合に、駆動電圧を印加するための配線接続する必要がある。この基板配線例を図５及び図６を参照して説明する。
図５（ａ）（ｂ）において、基板１の梁部３を対称軸として対称位置に反対面側に設けられた振動源６に対して、固定端である両側支持部５から直線的にフレキシブルケーブル９が設けられている。フレキシブル配線部９は、図５（ｃ）に示すようにポリイミド材などの絶縁層９ｂに、金めっき，銅めっき，有機ＥＬ層などの導電層９ａが挟み込まれて積層されたものが用いられる。 Further, when a piezoelectric element that is the vibration source 6 is provided, it is necessary to connect a wiring for applying a driving voltage. An example of this substrate wiring will be described with reference to FIGS.
5 (a) and 5 (b), it is linearly flexible from both side support portions 5 which are fixed ends with respect to a vibration source 6 provided on the opposite surface side in a symmetrical position with the beam portion 3 of the substrate 1 as a symmetry axis. A cable 9 is provided. As shown in FIG. 5C, the flexible wiring portion 9 is formed by laminating a conductive layer 9a such as gold plating, copper plating, or organic EL layer in an insulating layer 9b such as a polyimide material.

また、図６（ａ）（ｂ）において、基板１が梁部３を対称軸として両側に設けられた振動源６によって撓むことを考慮すると、基板上に貼付けられたフレキシブル配線部９も撓むことから、導電層９ａの接続信頼性が求められる。よって、基板１が撓んでも特定個所に応力集中がおこり難いように配線路を直線的ではなく曲げて形成することにより、導電層９ａの接続信頼性を維持しようとするものである。   6A and 6B, considering that the substrate 1 is bent by the vibration source 6 provided on both sides with the beam portion 3 as the axis of symmetry, the flexible wiring portion 9 attached on the substrate is also bent. Therefore, connection reliability of the conductive layer 9a is required. Therefore, it is intended to maintain the connection reliability of the conductive layer 9a by forming the wiring path by bending rather than linearly so that stress concentration does not easily occur at a specific location even if the substrate 1 is bent.

例えば、図６（ａ）に示すように、ミラー部４の中心点Ｍに対して点対状となる位置に基板１の長手方向両端に沿ってＬ字状に振動源６に各々配線接続してもよいし、図６（ｂ）に示すようにクランク形状に各振動源６各々配線接続するようにしてもよい。   For example, as shown in FIG. 6A, wiring connection is made to the vibration source 6 in an L shape along both longitudinal ends of the substrate 1 at a point-paired position with respect to the center point M of the mirror portion 4. Alternatively, as shown in FIG. 6B, each vibration source 6 may be connected to each other in a crank shape.

尚、図４（ａ）〜（ｃ）において、基板１に抜き孔部７が形成され、基板連結部８が形成される場合には、抜き孔部７を回避した基板面若しくは基板連結部８を利用して配線接続することが望ましい。また、フレキシブル配線部９は、予めケーブル状に形成されたものを基板面に固着してもよいし、基板上にパターン形成して一体につくり込んでもよい。
また、図示しないが、配線接続の態様については振動源と電源部を直接配線接続する仕様であっても良い。 4A to 4C, when the hole 7 is formed in the substrate 1 and the substrate connecting portion 8 is formed, the substrate surface or the substrate connecting portion 8 avoiding the hole 7. It is desirable to make wiring connection using In addition, the flexible wiring portion 9 may be formed in a cable shape in advance, and may be fixed to the substrate surface, or may be integrally formed by forming a pattern on the substrate.
Although not shown, the wiring connection mode may be a specification in which the vibration source and the power supply unit are directly connected by wiring.

光学走査装置の平面図及び垂直断面図である。It is the top view and vertical sectional view of an optical scanning device. 光学走査装置の動作状態を示す説明図及び斜視図である。It is explanatory drawing and the perspective view which show the operation state of an optical scanning device. 光学走査装置の平面図及びミラー部中心点の時間変位を示すグラフ図である。It is a graph which shows the time view of the top view of an optical scanning device, and a mirror part center point. 基板と固定端との接続構成を示す平面図である。It is a top view which shows the connection structure of a board | substrate and a fixed end. 基板の配線例を示す平面図、部分断面図及び部分拡大断面図である。It is the top view which shows the example of wiring of a board | substrate, the fragmentary sectional view, and the fragmentary expanded sectional view. 他例に係る基板配線例を示す平面図である。It is a top view which shows the board wiring example which concerns on another example. 従来の光学走査装置の平面図及びミラー部中心点の時間変位を示すグラフ図である。It is a graph which shows the time view of the top view of the conventional optical scanning device, and a mirror part center point.

符号の説明Explanation of symbols

１ 基板
２ 開口部
３ 梁部
４ ミラー部
５ 支持部
６ 振動源
７ 抜き孔部
８ 基板連結部
９ フレキシブル配線部
９ａ 導電層
９ｂ 絶縁層
Ｌ レーザー光 DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Opening part 3 Beam part 4 Mirror part 5 Support part 6 Vibration source 7 Punching hole part 8 Board | substrate connection part 9 Flexible wiring part 9a Conductive layer 9b Insulating layer L Laser beam

Claims (6)

基板に形成された開口部内に両側を梁部により支持されたミラー部が形成され、前記基板上に設けられた振動源を作動させて当該基板を撓ませることにより前記梁部を揺動軸として前記ミラー部を揺動させながら照射光を反射することで走査する光走査装置であって、
前記基板は、前記ミラー部を支持する前記梁部を軸対称として長手方向両端部が支持部に各々固定されていることを特徴とする光走査装置。 A mirror part supported on both sides by a beam part is formed in an opening formed on the substrate, and the beam part is used as an oscillation axis by operating the vibration source provided on the substrate to bend the substrate. An optical scanning device that scans by reflecting irradiation light while swinging the mirror part,
The optical scanning device according to claim 1, wherein both ends of the substrate in the longitudinal direction are fixed to a support portion with the beam portion supporting the mirror portion being axially symmetrical. 前記梁部を中心として軸対称となる前記基板上に前記振動源が各々配置され、各振動源に交番電圧を印加して前記梁部を中心として前記基板を両側で反対方向に撓ませる動作を交互に繰り返すことにより前記ミラー部を所定の振幅で揺動させる請求項１記載の光走査装置。   The vibration sources are respectively disposed on the substrate that is axially symmetric with respect to the beam portion, and an operation is performed in which an alternating voltage is applied to each vibration source to bend the substrate in opposite directions around the beam portion. The optical scanning device according to claim 1, wherein the mirror unit is swung with a predetermined amplitude by repeating alternately. 前記各振動源は、前記基板の反対面側に設けられ、同一の駆動源から同相の交番電圧が印加されて駆動される請求項１又は２記載の光走査装置。   3. The optical scanning device according to claim 1, wherein each of the vibration sources is provided on an opposite surface side of the substrate and is driven by applying an in-phase alternating voltage from the same driving source. 前記各振動源は、前記基板の同一面側に設けられ、異なる駆動源によって位相が反転した交番電圧が印加されて駆動される請求項１又は２記載の光走査装置。   3. The optical scanning device according to claim 1, wherein each of the vibration sources is provided on the same surface side of the substrate and is driven by applying an alternating voltage whose phase is inverted by a different driving source. 前記基板の両側固定端付近には、抜き孔部が前記梁部を中心として軸対称となる位置に各々形成されている請求項１乃至４のいずれか１項記載の光走査装置。   5. The optical scanning device according to claim 1, wherein a punched hole portion is formed at a position that is axially symmetric with respect to the beam portion in the vicinity of both side fixed ends of the substrate. 前記基板と両側固定端との連結は当該基板より幅狭な単数又は複数の基板連結部により連結されている請求項１乃至５のいずれか１項記載の光走査装置。   6. The optical scanning device according to claim 1, wherein the connection between the substrate and the fixed ends on both sides is connected by a single or a plurality of substrate connecting portions narrower than the substrate.
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