JP2010087304A - Electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus Download PDF

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JP2010087304A
JP2010087304A JP2008255728A JP2008255728A JP2010087304A JP 2010087304 A JP2010087304 A JP 2010087304A JP 2008255728 A JP2008255728 A JP 2008255728A JP 2008255728 A JP2008255728 A JP 2008255728A JP 2010087304 A JP2010087304 A JP 2010087304A
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suction nozzle
electronic component
component
image
light
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JP5412076B2 (en
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Yoshiaki Ikeda
善紀 池田
Tetsuji Ono
哲治 小野
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Hitachi High Tech Instruments Co Ltd
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Hitachi High Tech Instruments Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To surely grasp a position of a suction nozzle in a plane direction by irradiating the suction nozzle with light from an illumination device, picking up an image of the suction nozzle from a lower position by a component recognizing camera and performing recognition processing of the picked-up image. <P>SOLUTION: When recognizing the position of the suction nozzle 5, the suction nozzle 5 which does not hold an electronic component is irradiated with light more than the light quantity of light applied from a coaxial illuminating LED 25 of the illuminating device 8 to the electronic component when recognizing the electronic component sucked and held to/on the suction nozzle 5. When the suction nozzle 5 is imaged from a lower position by the component recognizing camera 20, an image of the suction nozzle 5 is picked up so that the lower surface of a suction part 5B3 which is the lower surface of the suction nozzle 5 is white, a suction hole 5H is black and other side face portions of the suction nozzle 5 are gray. Thereby the image of the suction nozzle is picked up so that respective portions can be clearly distinguished. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置に関する。   In the present invention, an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head, and light is emitted from an illumination device to the electronic component sucked and held by the suction nozzle. The present invention relates to an electronic component mounting apparatus that takes an image with a recognition camera.

この種の電子部品装着装置は、例えば特許文献１などに開示されている。そして、装着ヘッドに設けられる吸着ノズルの平面方向における位置をオフセットデータとして記憶手段に格納しておき、電子部品の取出し時や装着時にこのオフセットデータを活用して吸着ノズルの平面方向における位置を把握して、部品供給装置から電子部品を確実に取出したり、プリント基板上の装着すべき位置に電子部品を装着するように図られている。
特開２００５−１５９２０９公報 This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. The position in the plane direction of the suction nozzle provided in the mounting head is stored in the storage means as offset data, and the position of the suction nozzle in the plane direction is grasped by using this offset data when taking out or mounting the electronic component. Thus, the electronic component is reliably taken out from the component supply device, or the electronic component is mounted at a position to be mounted on the printed board.
JP 2005-159209 A

しかし、部品認識カメラを使用して、吸着ノズルを照明装置で光を照射して下方から撮像して、これを認識処理して吸着ノズルの平面方向における位置を把握することが考えられるが、その画像は吸着ノズルの底面はグレー色で、その他の部分は黒色となるので、底面とその他の部分との差がなく、吸着ノズルの平面方向における位置を把握するのには向かないと思われる。そして、反射照明の場合には、吸着ノズル端面は部品認識時、照明されても光らないようにしている。   However, it is conceivable to use a component recognition camera to illuminate the suction nozzle with a lighting device and take an image from below, and recognize this to recognize the position of the suction nozzle in the plane direction. In the image, since the bottom surface of the suction nozzle is gray and the other portions are black, there is no difference between the bottom surface and the other portions, and it is not suitable for grasping the position of the suction nozzle in the plane direction. In the case of reflected illumination, the suction nozzle end face is prevented from being illuminated even when illuminated during component recognition.

そこで本発明は、吸着ノズルを照明装置で光を照射して、部品認識カメラで下方から撮像して、これを認識処理して吸着ノズルの平面方向における位置を確実に把握できるようにすることを目的とする。   Therefore, the present invention is to irradiate the suction nozzle with light with an illuminating device, pick up an image from below with a component recognition camera, and perform recognition processing so that the position of the suction nozzle in the plane direction can be reliably grasped. Objective.

このため第１の発明は、部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記吸着ノズルに吸着保持された電子部品を前記部品認識カメラが撮像する際の電子部品に前記照明装置から照射する光の光量よりも多く、前記電子部品を保持していない前記吸着ノズルに光を照射して前記部品認識カメラが撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする。   For this reason, in the first invention, the electronic component supplied from the component supply device is taken out by the suction nozzle provided in the mounting head, and light is emitted from the illumination device to the electronic component sucked and held by the suction nozzle. In an electronic component mounting apparatus in which an electronic component is imaged by a component recognition camera, the amount of light emitted from the illumination device to the electronic component when the component recognition camera images the electronic component sucked and held by the suction nozzle More than the above, the suction nozzle that does not hold the electronic component is irradiated with light and the component recognition camera picks up an image. Based on this image, the recognition processing device performs recognition processing and the position of the suction nozzle in the plane direction It is characterized by having grasped.

第２の発明は、部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記電子部品を保持していない前記吸着ノズルを撮像する際の前記部品認識カメラの露光時間を前記吸着ノズルに吸着保持された電子部品を撮像する際の前記部品認識カメラの露光時間よりも長くして撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする。   According to a second aspect of the present invention, an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head, and light is irradiated from the illumination device to the electronic component sucked and held by the suction nozzle. In the electronic component mounting apparatus in which an image is picked up by the component recognition camera, the exposure time of the component recognition camera when picking up the suction nozzle not holding the electronic component is sucked and held by the suction nozzle The image is taken longer than the exposure time of the component recognition camera at the time of imaging, and the recognition processing device performs recognition processing based on this image to grasp the position of the suction nozzle in the plane direction. And

第３の発明は、部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記電子部品を保持していない前記吸着ノズルを撮像する際の前記部品認識カメラの露光時間を前記吸着ノズルに吸着保持された電子部品を撮像する際の前記部品認識カメラの露光時間よりも長くして撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする。   According to a third aspect of the present invention, an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head, and light is emitted from an illumination device to the electronic component sucked and held by the suction nozzle. In the electronic component mounting apparatus in which an image is picked up by the component recognition camera, the exposure time of the component recognition camera when picking up the suction nozzle not holding the electronic component is sucked and held by the suction nozzle The image is taken longer than the exposure time of the component recognition camera at the time of imaging, and the recognition processing device performs recognition processing based on this image to grasp the position of the suction nozzle in the plane direction. And

本発明は、吸着ノズルを照明装置で光を照射して、部品認識カメラで下方から撮像して、これを認識処理して吸着ノズルの平面方向における位置を確実に把握できるようにすることができる。このため、吸着ノズルが部品供給装置から確実に電子部品をとりだすことができると共にプリント基板上の正確な位置に電子部品を装着することができる。   According to the present invention, the suction nozzle is irradiated with light by an illumination device, picked up from below by a component recognition camera, and recognition processing can be performed so that the position of the suction nozzle in the plane direction can be surely grasped. . For this reason, the suction nozzle can reliably take out the electronic component from the component supply device, and the electronic component can be mounted at an accurate position on the printed circuit board.

以下図１に基づき、プリント基板Ｐ上に電子部品を装着する電子部品装着装置１についての実施の形態を説明する。電子部品装着装置１には、プリント基板Ｐを搬送する搬送装置２と、電子部品を供給する部品供給装置３と、駆動源により一方向（Ｙ方向）に移動可能な一対のビーム４Ａ、４Ｂと、それぞれ複数の吸着ノズル５を備えて前記各ビーム４Ａ、４Ｂに沿った方向に各駆動源により移動可能な装着ヘッド６とが設けられている。   Hereinafter, an embodiment of an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P will be described with reference to FIG. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P, a component supply device 3 that supplies electronic components, and a pair of beams 4A and 4B that can be moved in one direction (Y direction) by a drive source. A mounting head 6 that includes a plurality of suction nozzles 5 and that can be moved by each drive source in a direction along each of the beams 4A and 4B is provided.

前記搬送装置２は電子部品装着装置１の中間部に配設され、上流側装置からプリント基板Ｐを受け継ぐ基板供給部と、前記各装着ヘッド６の吸着ノズル５に吸着保持された電子部品を装着するために基板供給部から供給されたプリント基板Ｐを位置決め固定する基板位置決め部と、この位置決め部で電子部品が装着されたプリント基板Ｐを受け継いで下流側装置に搬送する基板排出部とから構成される。   The transport device 2 is disposed at an intermediate portion of the electronic component mounting device 1 and mounts a substrate supply unit that inherits the printed circuit board P from the upstream device and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head 6. In order to do so, the printed circuit board P is supplied with a printed circuit board P. The printed circuit board P is positioned and fixed, and the printed circuit board P on which the electronic component is mounted is transferred to the downstream device. Is done.

前記部品供給装置３は前記搬送装置２の手前側と奥側との両外側にそれぞれ配設され、電子部品装着装置１の装置本体に取り付けられるフィーダベース３Ａと、このフィーダベース３Ａ上に複数並設され種々の電子部品を夫々その部品取出し部（部品吸着位置）に１個ずつ供給する部品供給ユニット３Ｂ群とから構成される。   The component supply device 3 is disposed on both the front side and the rear side of the transport device 2, and is provided with a feeder base 3A that is attached to the device main body of the electronic component mounting device 1, and a plurality of components on the feeder base 3A. And a component supply unit 3B group that supplies various electronic components one by one to the component take-out portion (component suction position).

Ｘ方向に長い前後一対の前記ビーム４Ａ、４Ｂは、Ｙ方向リニアモータ４０の駆動により左右一対の前後に延びたガイドに沿って前記各ビーム４Ａ、４Ｂに固定されたスライダが摺動して個別にＹ方向に移動する。前記Ｙ方向リニアモータ４０は左右一対の基体１Ａ、１Ｂに沿って固定された上下一対の固定子と、前記ビーム４Ａ、４Ｂの両端部に設けられた取付板の下部に固定された可動子７Ａとから構成される。   The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved by sliding sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 40. Move in the Y direction. The Y-direction linear motor 40 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

また、前記ビーム４Ａ、４Ｂにはその長手方向（Ｘ方向）にＸ方向リニアモータ４１によりガイドに沿って移動する前記装着ヘッド６が夫々内側に設けられており、前記Ｘ方向リニアモータ４１は各ビーム４Ａ、４Ｂに固定された前後一対の固定子と、各固定子の間に位置して前記装着ヘッド６に設けられた可動子とから構成される。   The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 41, and the X direction linear motor 41 A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

従って、各装着ヘッド６は向き合うように各ビーム４Ａ、４Ｂの内側に設けられ、前記搬送装置２の位置決め部上のプリント基板Ｐや部品供給ユニット３Ｂの部品取出し位置上方を移動する。   Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

そして、各装着ヘッド６には各バネにより下方へ付勢されている１２本の吸着ノズル５が円周に沿って所定間隔を存して配設されており、各装着ヘッド６の３時と９時の位置に位置する吸着ノズル５により並設された複数の部品供給ユニット３Ｂから電子部品を同時に取出しすることも可能である。この吸着ノズル５は上下軸モータ４２により昇降可能であり、またθ軸モータ４３により装着ヘッド６を鉛直軸周りに回転させることにより、結果として各装着ヘッド６の各吸着ノズル５はＸ方向及びＹ方向に移動可能であり、垂直線回りに回転可能で、且つ上下動可能となっている。   Each mounting head 6 is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor 42, and the mounting head 6 is rotated around the vertical axis by a θ-axis motor 43. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

次に、図２乃至図４に基づいて、各吸着ノズル５に吸着保持された電子部品に照明光を照射する照明装置８について詳述する。照明装置８の装置本体９は、上面及び下面を開口した中空筒状体を呈しており、詳述すると、外形が直方体形状を呈し、その中央部に平面視円形を呈すると共に下方に行くに従って径が小さくなるような貫通孔１０が形成されている。この貫通孔１０は、平面視円形に限らず、例えば８角形などの多角形でもよい。
そして、この貫通孔１０の内周面の上部には、前記吸着ノズル５に吸着保持された電子部品がＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）であったときに、その部品に向けて傾斜した状態で照明光を照射する複数のＢＧＡ反射照明灯であるＢＧＡ照明用ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）１５を前記内周面の全周に沿って横方向の列の複数列（複数段）、例えば４列に亘って並設すると共に千鳥状に配設する。
即ち、断面がＬ字形状の最上部の取付部１３Ａに下方に行くに従って中心に近くなるように傾斜させた状態で環状のプリント基板１４Ａを取り付け、このプリント基板１４Ａ上に横方向の列の複数列、例えば横方向（水平方向）の４列（上下方向の４列）に亘ってＢＧＡ照明用ＬＥＤ１５が所定間隔を存して複数並設すると共に千鳥状に配設する。 Next, the illuminating device 8 that irradiates the electronic components sucked and held by the suction nozzles 5 with illumination light will be described in detail with reference to FIGS. The device main body 9 of the lighting device 8 has a hollow cylindrical body with an upper surface and a lower surface opened. Specifically, the outer shape has a rectangular parallelepiped shape, a circular shape in plan view at the center thereof, and a diameter as it goes downward. A through-hole 10 is formed so as to decrease. The through hole 10 is not limited to a circular shape in plan view, and may be a polygon such as an octagon.
And when the electronic component sucked and held by the suction nozzle 5 is a BGA (Ball Grid Array), the illumination light is tilted toward the component at the upper part of the inner peripheral surface of the through hole 10. A plurality of BGA illumination LEDs (Light Emitting Diodes) 15, which are a plurality of BGA reflecting illumination lamps, for example, are arranged in a plurality of rows (a plurality of rows), for example, four rows along the entire circumference of the inner peripheral surface. They are arranged side by side and arranged in a staggered pattern.
That is, the annular printed circuit board 14A is attached to the uppermost attachment part 13A having an L-shaped cross section so as to be closer to the center as it goes downward, and a plurality of rows in the horizontal direction are mounted on the printed circuit board 14A. A plurality of BGA illumination LEDs 15 are arranged side by side at a predetermined interval and arranged in a zigzag manner across four rows, for example, four rows in the horizontal direction (horizontal direction) (four rows in the vertical direction).

このように、横方向（水平方向）の４列（上下方向の４列）に亘ってＢＧＡ照明用ＬＥＤ１５が所定間隔を存して複数並設すると共に千鳥状に配設したから、吸着ノズル５に吸着保持された電子部品であるＢＧＡが大きくてもＢＧＡ照明用ＬＥＤ１５より遠い部位にも光を明るく照射でき、また複数の吸着ノズル５に保持されている複数のＢＧＡに対しても光を明るく照射できる。しかも、最上部の取付部１３Ａ及び環状のプリント基板１４Ａの上下方向の長さ方向の寸法を長くすることなく、より大きな光量を得ることができ、しかもＢＧＡにあっては突起電極がわかる鮮明な画像を得るためになるべく水平方向から部品認識カメラ２０で撮像しなければないが、斯かるＢＧＡの撮像に好適である。   Thus, since the plurality of BGA illumination LEDs 15 are arranged in parallel at predetermined intervals over four rows (four rows in the vertical direction) in the horizontal direction (horizontal direction), the suction nozzles 5 are arranged. Even if the BGA, which is an electronic component held by suction, is large, it is possible to radiate light brightly even to a portion farther than the LED 15 for BGA illumination. Can be irradiated. In addition, a larger amount of light can be obtained without increasing the vertical dimension of the uppermost mounting portion 13A and the annular printed board 14A, and in the case of BGA, the protruding electrodes can be clearly seen. In order to obtain an image, the component recognition camera 20 must capture the image from the horizontal direction as much as possible, but this is suitable for such BGA imaging.

また、前記最上部の取付部１３Ａの下方には、取付部１３Ａより内径が小さい取付部１３Ｂが形成され、この取付部１３Ｂに下方に行くに従って中心に近くなるよう且つ前記プリント基板１４Ａよりも１５度程度寝かせた角度に傾斜させた状態で環状のプリント基板１４Ｂを取り付けている。このプリント基板１４Ｂ上には横方向の列の複数列、例えば横方向（水平方向）の３列（上下方向の３列）に亘って一般反射照明灯である一般反射照明用ＬＥＤ１６が所定間隔を存して複数並設されている。   An attachment portion 13B having an inner diameter smaller than that of the attachment portion 13A is formed below the uppermost attachment portion 13A. The attachment portion 13B is closer to the center as it goes downward, and is 15 than the printed board 14A. The annular printed circuit board 14B is attached in a state where it is inclined at an angle where it is laid down to a certain degree. On this printed circuit board 14B, general reflective illumination LEDs 16 that are general reflective illumination lamps are arranged at a predetermined interval over a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction). There are several in parallel.

また、前記取付部１３Ｂの下方には、取付部１３Ｂよりさらに内径が小さい取付部１３Ｃが形成され、この取付部１３Ｃに下方に行くに従って中心に近くなるように且つ前記プリント基板１４Ｂよりも１５度程度寝かせた角度に傾斜させた状態で環状のプリント基板１４Ｃを取り付け、このプリント基板１４Ｃ上には横方向の列の複数列、例えば横方向（水平方向）の３列（上下方向の３列）に亘って一般反射照明用ＬＥＤ１６が所定間隔を存して複数並設されている。   A mounting portion 13C having an inner diameter smaller than that of the mounting portion 13B is formed below the mounting portion 13B. The mounting portion 13C is closer to the center as it goes downward and is 15 degrees from the printed board 14B. An annular printed circuit board 14C is attached in a state of being inclined at an angle that is laid down to a certain degree, and a plurality of rows in the horizontal direction, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on the printed circuit board 14C. A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

更に、前記取付部１３Ｃの下方には、取付部１３Ｃよりさらに内径が小さい取付部１３Ｄが形成され、この取付部１３Ｄに下方に行くに従って中心に近くなるように且つ前記プリント基板１４Ｃよりも１５度程度寝かせた角度に傾斜させた状態で環状のプリント基板１４Ｄを取り付け、このプリント基板１４Ｃ上には横方向の列の複数列、例えば横方向（水平方向）の３列（上下方向の３列）に亘って一般反射照明用ＬＥＤ１６が所定間隔を存して複数並設されている。   Further, an attachment portion 13D having an inner diameter smaller than that of the attachment portion 13C is formed below the attachment portion 13C. The attachment portion 13D is closer to the center as it goes downward and is 15 degrees from the printed board 14C. An annular printed circuit board 14D is attached in a state of being inclined to a certain level, and a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on the printed circuit board 14C. A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

言い換えると、上方に位置した各プリント基板より最も寝かせた角度に傾斜させた状態で環状のプリント基板１４Ｄを最も下の段の取付部１３Ｄに設ける。また、この取付部１３Ｄの上には、プリント基板１４Ｄよりも立たせた角度に傾斜させた状態でプリント基板１４Ｃを取付部１３Ｃに設ける。このとき、プリント基板１４Ｄ上の最も外側に位置した一般反射照明用ＬＥＤ１６の上部が取付部１３Ｃに極力覆われないようにする。   In other words, the annular printed circuit board 14D is provided in the lowermost mounting portion 13D in a state where the printed circuit board is inclined at the most laid-down angle with respect to each printed circuit board located above. Further, a printed circuit board 14C is provided on the mounting part 13C on the mounting part 13D in a state where the printed circuit board 14C is inclined at an angle that stands more than the printed circuit board 14D. At this time, the upper part of the LED 16 for general reflection illumination located on the outermost side on the printed circuit board 14D is prevented from being covered with the attachment portion 13C as much as possible.

また、取付部１３Ｃの上には、プリント基板１４Ｂよりも更に立たせた角度に傾斜させた状態でプリント基板１４Ｂを取付部１３Ｂに設ける。このとき、取付部１３Ｂの内縁がプリント基板１４Ｃ上の最上段であり最も外側に位置した一般反射照明用ＬＥＤ１６の上部より外側に位置し、最も外側に位置した一般反射照明用ＬＥＤ１６は取付部１３Ｂに覆われていないため、このＬＥＤからの光をＢＧＡ照明に有効に利用することができる。   Further, the printed circuit board 14B is provided on the mounting part 13B on the mounting part 13C in a state where the printed circuit board 14B is inclined at an angle that is further raised than the printed circuit board 14B. At this time, the inner edge of the attachment portion 13B is the uppermost stage on the printed circuit board 14C and is located outside the upper part of the outermost general reflection illumination LED 16, and the outermost general reflection illumination LED 16 is the attachment portion 13B. Therefore, the light from this LED can be used effectively for BGA illumination.

更に、取付部１３Ｂの上には、プリント基板１４Ａよりも更に立たせた角度に傾斜させた状態でプリント基板１４Ａを取付部１３Ａに設ける。このとき、取付部１３Ａの内縁がプリント基板１４Ｂ上の最上段であり最も外側に位置した一般反射照明用ＬＥＤ１６の上部より外側に位置し、最も外側に位置した一般反射照明用ＬＥＤ１６は取付部１３Ａに覆われていないため、このＬＥＤからの光をＢＧＡ照明に有効に利用することができる。
上述したように、プリント基板１４Ｄの上端部より上の段のプリント基板１４Ｃの下端部の内縁が内方に位置し、プリント基板１４Ｃの上端部よりも上の段のプリント基板１４Ｂの下端部の内縁が内方に位置し、更に、プリント基板１４Ｂの上端部よりも上の段のプリント基板１４Ａの下端部の内縁が内方に位置するように配設すると共に、各プリント基板の配置角度がより上の段に行くに従って順次立たせた状態となるように（より垂直に近くなるように）配設される。このように、各ＬＥＤを取り付けた各プリント基板を配設することにより、プリント基板１４Ｃ、１４Ｂ及び１４Ａの上端を極力内側に位置させ、プリント基板１４Ａの外径、即ち、取付部１３の外径を抑えることができ、この結果、特に水平方向の寸法を抑えることができ、この結果、その照明量を保ちつつ、照明装置８のコンパクト化を図ることができる。 Further, the printed circuit board 14A is provided on the mounting portion 13A on the mounting portion 13B in a state where the printed circuit board 14A is inclined at an angle that is further raised than the printed circuit board 14A. At this time, the inner edge of the mounting portion 13A is the uppermost stage on the printed board 14B and is positioned outside the upper part of the LED 16 for general reflection illumination that is positioned on the outermost side. Therefore, the light from this LED can be used effectively for BGA illumination.
As described above, the inner edge of the lower end of the printed circuit board 14C above the upper end of the printed circuit board 14D is positioned inward, and the lower edge of the printed circuit board 14B above the upper end of the printed circuit board 14C. The inner edge is located inward, and the inner edge of the lower end portion of the printed board 14A, which is higher than the upper end part of the printed board 14B, is located inward, and the arrangement angle of each printed board is It arrange | positions so that it may be in the state where it stood up sequentially as it goes to the upper stage (approaching more perpendicularly). In this way, by arranging each printed circuit board to which each LED is attached, the upper ends of the printed circuit boards 14C, 14B, and 14A are positioned as much as possible inside, and the outer diameter of the printed circuit board 14A, that is, the outer diameter of the mounting portion 13 is assured. As a result, the dimension in the horizontal direction can be particularly suppressed. As a result, the lighting device 8 can be made compact while maintaining the illumination amount.

以上のように、前記ＢＧＡ照明用ＬＥＤ１５の下方の前記装置本体９の内周面に下段に向かうに従って前記ＢＧＡ照明用ＬＥＤ１５の並設角度より順次より寝かせた配置角度となるように前記吸着ノズル５に吸着保持された電子部品に向けて照明光を照射する複数の一般反射照明用ＬＥＤ１６を３段並設する。   As described above, the suction nozzle 5 is arranged such that the arrangement angle is gradually laid down from the parallel angle of the BGA illumination LEDs 15 toward the lower stage on the inner peripheral surface of the apparatus body 9 below the BGA illumination LEDs 15. A plurality of general reflection illumination LEDs 16 that irradiate illumination light toward the electronic components sucked and held in the three-stage are arranged in parallel.

１７は前記ＢＧＡ反射照明灯の外方の直方体形状を呈する装置本体９の４隅に形成された取付空間内にそれぞれ配設されたプリント基板１４Ｅ上に取付けられた透過照明用ＬＥＤで、装置本体９の天面９Ａに開設された各開口部１８を介して前記吸着ノズル５に固定された拡散板に向けて光を照射し、その反射光が吸着ノズル５に吸着保持された電子部品に上方から照射される構成である。   Reference numeral 17 denotes a transmission illumination LED mounted on a printed circuit board 14E disposed in each of mounting spaces formed at four corners of the apparatus main body 9 having a rectangular parallelepiped shape outside the BGA reflection illumination lamp. The light is irradiated toward the diffusion plate fixed to the suction nozzle 5 through the openings 18 formed on the top surface 9A of the top 9, and the reflected light is directed upward to the electronic component held by the suction nozzle 5 It is the structure irradiated from.

図３に示す直方体形状の装置本体９の一辺はＸ方向（ビーム４Ａ、４Ｂの長手方向）に向き、もう一辺はＹ方向に向き、Ｘ方向は図１に示すように、フィーダ３の並び方向で基板Ｐの搬送方向でもある。従って、透過照明用ＬＥＤ１７は電子部品装着装置１の水平面スペースの空きスペースに配置されており、電子部品装着装置１のＸＹ方向サイズのコンパクト化がなされている。   One side of the rectangular parallelepiped apparatus main body 9 shown in FIG. 3 faces in the X direction (longitudinal direction of the beams 4A and 4B), the other side faces in the Y direction, and the X direction is the direction in which the feeders 3 are arranged as shown in FIG. It is also the transport direction of the substrate P. Accordingly, the LED 17 for transmitted illumination is arranged in an empty space in the horizontal plane space of the electronic component mounting apparatus 1, and the electronic component mounting apparatus 1 is downsized in the XY direction.

また、前記照明装置８の中央部の下方に部品認識カメラ２０が配設され、この部品認識カメラ２０の上方位置にはレンズ２１、ハーフミラー２２及びレンズ２３が配設され、このレンズ２３は照明装置８の装置本体９の貫通孔１０に面するように配置される。そして、プリント基板１４Ｆに取り付けられた同軸照明用ＬＥＤ２５から照射された光は前記ハーフミラー２２により半分の量が透過して半分の量が反射して上昇して、レンズ２３を介して吸着ノズル５に吸着保持された電子部品に照射され、その反射像がレンズ２１、ハーフミラー２２及びレンズ２３を介して部品認識カメラ２０により撮像される構成である。   In addition, a component recognition camera 20 is disposed below the central portion of the illumination device 8, and a lens 21, a half mirror 22, and a lens 23 are disposed above the component recognition camera 20. It arrange | positions so that the through-hole 10 of the apparatus main body 9 of the apparatus 8 may be faced. The light emitted from the coaxial illumination LED 25 attached to the printed circuit board 14F is transmitted through the half mirror 22 and half of the light is reflected and rises. The suction nozzle 5 passes through the lens 23 and rises. In this configuration, the electronic component held by suction is irradiated onto the electronic component, and the reflection image is captured by the component recognition camera 20 via the lens 21, the half mirror 22, and the lens 23.

次に、制御ブロック図である図５に基づき、以下説明する。先ず、３０は電子部品装着装置１におけるプリント基板Ｐ上に電子部品を装着する部品装着動作及び吸着ノズル５に吸着保持された電子部品Ｄに光を照射する各種照明灯の点灯に係る動作等を統括制御する制御部としての操作系ＣＰＵ（セントラル・プロセッシング・ユニット）、３１は記憶装置としてのＲＡＭ（ランダム・アクセス・メモリ）、３２はＲＯＭ（リ−ド・オンリー・メモリ）で、ＣＰＵ３０は前記ＲＡＭ３１に記憶されたデータに基づき、前記ＲＯＭ３２に格納されたプログラムに従い、部品装着に係る動作の制御を行う。   Next, description will be made based on FIG. 5 which is a control block diagram. First, reference numeral 30 denotes a component mounting operation for mounting an electronic component on the printed circuit board P in the electronic component mounting apparatus 1 and an operation related to lighting of various illumination lamps that irradiate light to the electronic component D sucked and held by the suction nozzle 5. An operation system CPU (Central Processing Unit) as a control unit for overall control, 31 is a RAM (Random Access Memory) as a storage device, 32 is a ROM (Read Only Memory), and the CPU 30 is Based on the data stored in the RAM 31, the operation related to component mounting is controlled according to the program stored in the ROM 32.

前記ＲＡＭ３１には、装着順序毎にプリント基板Ｐへの電子部品の装着座標を示すＮＣデータや、電子部品の特徴である部品ライブラリデータや、レンズの倍率及び照明ユニット１０の照明灯である各ＬＥＤの輝度データなどの装置データ、各種オフセットデータ等が格納されている。   In the RAM 31, NC data indicating the mounting coordinates of the electronic component on the printed circuit board P for each mounting order, component library data that is a characteristic of the electronic component, each magnification that is a lens, and each LED that is an illumination lamp of the lighting unit 10 Device data such as brightness data, various offset data, and the like are stored.

前記操作系ＣＰＵ３０には表示部としてのモニター３３及び入力装置としてのキーボード３４が接続されると共に制御系ＣＰＵ３５が接続されている。この制御系ＣＰＵ３５には、駆動回路３６を介してＸ方向リニアモータ４１、Ｙ方向リニアモータ４０等が接続されている。   A monitor 33 as a display unit and a keyboard 34 as an input device are connected to the operation system CPU 30 and a control system CPU 35 is connected. An X direction linear motor 41, a Y direction linear motor 40, and the like are connected to the control system CPU 35 via a drive circuit 36.

４５は画像処理ＣＰＵで、この画像処理ＣＰＵ４５は照明コントロール部４６に接続される。４７は照明コントロール部４６を構成する露光タイミング回路で、ビーム４Ａ、４Ｂのいずれかの移動により部品認識カメラ２０の上方位置に装着ヘッド６が移動して来ると、画像処理ＣＰＵ４５が画像取込信号を部品認識カメラ２０に出力して露光させると共に照明コントロール部４６を構成するＬＥＤコントロール・駆動回路４８にフラッシュ点灯信号を出力する。   An image processing CPU 45 is connected to the illumination control unit 46. Reference numeral 47 denotes an exposure timing circuit that constitutes the illumination control unit 46. When the mounting head 6 moves to a position above the component recognition camera 20 due to movement of one of the beams 4A and 4B, the image processing CPU 45 outputs an image capture signal. Is output to the component recognition camera 20 for exposure, and a flash lighting signal is output to the LED control / drive circuit 48 constituting the illumination control unit 46.

前記ＬＥＤコントロール・駆動回路４８は、吸着ノズル５に吸着保持されている電子部品の種類に応じて輝度とどのＬＥＤを１回だけフラッシュ点灯させるかが格納されており、このフラッシュ点灯により電子部品を保持した吸着ノズル５が移動しながら部品認識カメラ２０が電子部品を撮像するフライ認識が行われる。   The LED control / drive circuit 48 stores the brightness and which LED is lit only once according to the type of the electronic component sucked and held by the suction nozzle 5. Fly recognition in which the component recognition camera 20 images the electronic component is performed while the held suction nozzle 5 is moved.

即ち、電子部品がＢＧＡである場合にはＢＧＡ照明用ＬＥＤ１５をフラッシュ点灯させ、円筒形状の電子部品やＰＬＣＣ（Ｐｌａｓｔｉｃ Ｌｅａｄｅｄ Ｃｈｉｐ Ｃａｒｒｉｅｒ）である場合にはＢＧＡ照明用ＬＥＤ１５、一般反射照明用ＬＥＤ１６及び同軸照明用ＬＥＤ２５をフラッシュ点灯させ、通常の反射照明が必要な電子部品である場合には一般反射照明用ＬＥＤ１６及び同軸照明用ＬＥＤ２５をフラッシュ点灯させ、透過照明が必要な電子部品である場合には透過照明用ＬＥＤ１７をフラッシュ点灯させるように、前記ＬＥＤコントロール・駆動回路４５は制御する。   That is, when the electronic component is a BGA, the BGA illumination LED 15 is flashed on, and when the electronic component is a cylindrical electronic component or PLCC (Plastic Leaded Chip Carrier), the BGA illumination LED 15, the general reflective illumination LED 16, and the coaxial The illumination LED 25 is turned on in a flash, and the general reflection illumination LED 16 and the coaxial illumination LED 25 are turned on in a flash when the electronic component requires normal reflection illumination, and the transmission is transmitted in the case where the transmission illumination is an electronic component. The LED control / drive circuit 45 controls the lighting LED 17 so as to light the flash.

そして、前記部品認識カメラ２０の露光が終了すると、この部品認識カメラ２０よりビデオ信号が画像入力部４９に入力され、その画像メモリ５０に撮像画像を格納し、画像処理ＣＰＵ４５が認識処理する構成であり、撮像画像は画像モニター５４に表示される。   When the exposure of the component recognition camera 20 is completed, a video signal is input from the component recognition camera 20 to the image input unit 49, the captured image is stored in the image memory 50, and the image processing CPU 45 performs a recognition process. Yes, the captured image is displayed on the image monitor 54.

なお、前記照明コントロール部４６は、入出力部５１と、ＣＰＵ５２と、メモリ５３と、ＬＥＤコントロール・駆動回路４８と、露光タイミング回路４７とを備えている。   The illumination control unit 46 includes an input / output unit 51, a CPU 52, a memory 53, an LED control / drive circuit 48, and an exposure timing circuit 47.

なお、前記吸着ノズル５は、図６に示すように、大きく分けて、ステンレス製で黒色の上部ノズル５Ａと、この上部ノズル５Ａに接着されるセラミック製の黒色の下部ノズル５Ｂとから構成され、上部ノズル５Ａは円筒部５Ａ１とその下部の円錐台部（下方に向かって径が小さい）５Ａ２とから構成され、下部ノズル５Ｂは円筒部５Ｂ１とその下部の円錐台部（下方に向かって径が小さい）５Ｂ２と最下部の横断平面形状が長円形状の吸着部５Ｂ３とから構成される。   As shown in FIG. 6, the suction nozzle 5 is roughly composed of a stainless steel black upper nozzle 5A and a ceramic black lower nozzle 5B bonded to the upper nozzle 5A. The upper nozzle 5A is composed of a cylindrical portion 5A1 and a lower truncated cone portion (diameter is small downward) 5A2, and the lower nozzle 5B is a cylindrical portion 5B1 and a lower truncated cone portion (diameter downward). (Small) 5B2 and an adsorption part 5B3 having an elliptical cross-sectional shape at the bottom.

そして、モニター３３を見ながらキーボード３４を操作して、電子部品を保持していない前記吸着ノズル５に同軸照明用ＬＥＤ２５から光を照射して、部品認識カメラ２０により吸着ノズル５を下方から撮像して、これを認識処理して、平面方向における吸着ノズル５の位置を把握して、ＲＡＭ３１に格納されている基準位置とのズレ量がオフセット値として、ＲＡＭ３１に基準位置とは別に格納させることができる。   Then, the keyboard 34 is operated while observing the monitor 33 to irradiate light to the suction nozzle 5 that does not hold the electronic component from the LED 25 for coaxial illumination, and the component recognition camera 20 images the suction nozzle 5 from below. Then, this is recognized, the position of the suction nozzle 5 in the plane direction is grasped, and the deviation amount from the reference position stored in the RAM 31 is stored as an offset value in the RAM 31 separately from the reference position. it can.

この場合、吸着ノズル５の撮像画像において、吸着ノズル５の下面とその他とを明確に区別できるようにするために、以下のような３つの方法が考えられる。即ち、吸着ノズル５の位置認識の場合には、第１に吸着ノズル５に吸着保持された電子部品を認識処理する場合の電子部品に前記照明装置８の同軸照明用ＬＥＤ２５から照射する光の光量よりも多く、電子部品を保持していない吸着ノズル５に照射して部品認識カメラ２０で撮像したり、又は第２に電子部品を認識処理する場合の電子部品に光を照射する同軸照明用ＬＥＤ２５の点灯時間よりも長く、電子部品を保持していない吸着ノズル５に照射して部品認識カメラ２０で撮像したり（図９参照）、又は第３に電子部品を撮像するときの前記部品認識カメラ２０の露光時間よりも長くして電子部品を保持していない前記吸着ノズルを撮像する（図１０参照）。   In this case, in order to clearly distinguish the lower surface of the suction nozzle 5 from the others in the captured image of the suction nozzle 5, the following three methods are conceivable. That is, when the position of the suction nozzle 5 is recognized, first, the amount of light emitted from the coaxial illumination LED 25 of the lighting device 8 to the electronic component when the electronic component sucked and held by the suction nozzle 5 is recognized. LED 25 for coaxial illumination that irradiates the suction nozzle 5 that does not hold the electronic component and images it with the component recognition camera 20 or irradiates light to the electronic component when the electronic component is secondly recognized. The component recognition camera when the suction nozzle 5 that is not longer holding the electronic component is irradiated and imaged by the component recognition camera 20 (see FIG. 9), or thirdly when the electronic component is imaged. The suction nozzle that is longer than the exposure time of 20 and does not hold the electronic component is imaged (see FIG. 10).

従って、前記メモリ５３には、前記光量、点灯時間又は露光時間を格納し、吸着ノズル５の位置認識の場合に、このいずれかとなるように制御して、部品認識カメラ２０が吸着ノズル５を下方から撮像するものであり、以下詳述する。   Therefore, the light quantity, lighting time or exposure time is stored in the memory 53, and when the position of the suction nozzle 5 is recognized, control is performed so as to be any of these, and the component recognition camera 20 moves the suction nozzle 5 downward. The following is described in detail.

即ち、初めにモニター３３を見ながらキーボード３４を操作して、例えば前述した第１の方法を選択し、電子部品を保持していない前記吸着ノズル５に同軸照明用ＬＥＤ２５から光を照射する（図６とは９０度異なる方向から見た吸着ノズルの側面図である図７参照）。このとき、上部ノズル５Ａの円錐台部５Ａ２や下部ノズル５Ｂの円錐台部５Ｂ２に照射された光は側方や上方に反射されるが、長円形状の吸着部５Ｂ３に照射された光は下方へと反射されるので、部品認識カメラ２０により吸着ノズル５を下方から撮像した場合に、図８に示すように、吸着ノズル５の撮像画像は吸着ノズル５の下面である吸着部５Ｂ３の下面は白色となり、吸着孔５Ｈは黒色となり、その他の吸着ノズル５側面部は灰色となるので、これらは明確に区別できるように撮像される。従って、この撮像された画像は画像入力部４９に入力されて、画像メモリ５０に格納され、画像処理ＣＰＵ４５がこの画像を認識処理して、平面方向における吸着ノズル５の位置を把握して、ＲＡＭ３１に格納されている基準位置とのズレ量がオフセット値として、ＲＡＭ３１に基準位置とは別に格納させることができる。なお、第２又は第３の方法を選択しても、吸着ノズル５の撮像画像は吸着ノズル５の下面である吸着部５Ｂ３の下面と、吸着孔５Ｈと、その他の吸着ノズル５側面部とは、明確に区別できるように撮像される。   That is, first, the keyboard 34 is operated while looking at the monitor 33, for example, the first method described above is selected, and light is emitted from the coaxial illumination LED 25 to the suction nozzle 5 that does not hold an electronic component (see FIG. 6 is a side view of the suction nozzle as viewed from a direction 90 degrees different from 6) (see FIG. 7). At this time, the light irradiated on the truncated cone part 5A2 of the upper nozzle 5A and the truncated cone part 5B2 of the lower nozzle 5B is reflected sideways and upward, but the light irradiated on the oval adsorption part 5B3 is below As shown in FIG. 8, when the suction nozzle 5 is imaged from below by the component recognition camera 20, the captured image of the suction nozzle 5 is the lower surface of the suction portion 5 </ b> B <b> 3 that is the lower surface of the suction nozzle 5. Since the suction hole 5H is black and the other side surfaces of the suction nozzle 5 are gray, these are imaged so that they can be clearly distinguished. Therefore, the captured image is input to the image input unit 49 and stored in the image memory 50, and the image processing CPU 45 recognizes the image, grasps the position of the suction nozzle 5 in the plane direction, and the RAM 31. Can be stored in the RAM 31 separately from the reference position as an offset value. Even if the second or third method is selected, the picked-up image of the suction nozzle 5 is not the lower surface of the suction portion 5B3, which is the lower surface of the suction nozzle 5, the suction holes 5H, and the other suction nozzle 5 side portions. Images are taken so that they can be clearly distinguished.

なお、画像処理ＣＰＵ４５が前記画像を認識処理する場合に、画像の明度の違いに基づいて、二値化処理又は多値化処理し、得られた二値化画像又は多値化画像から平面方向における吸着ノズル５の位置を把握するが、例えば吸着ノズル５の吸着部５Ｂ３下面のエッジ認識や、吸着ノズルの吸着孔５Ｈの位置認識により、或いはパターンマッチングを用いて、平面方向における吸着ノズル５の位置、即ち、例えばビーム１４Ａ又はビーム１４Ｂの原点位置を座標の原点とした吸着ノズル５の平面方向における中心位置を把握することができる。なお、吸着ノズルの位置を把握するときの位置は、吸着ノズル５の中心位置でなくてもよく、例えば吸着ノズル5の下面の重心でもよい。   When the image processing CPU 45 recognizes the image, the binarization process or the multi-value process is performed based on the difference in the brightness of the image. The position of the suction nozzle 5 in the plane direction is grasped by, for example, edge recognition on the lower surface of the suction portion 5B3 of the suction nozzle 5, position recognition of the suction hole 5H of the suction nozzle, or using pattern matching. The position, that is, the center position in the planar direction of the suction nozzle 5 with the origin position of the beam 14A or the beam 14B, for example, as the origin of coordinates can be grasped. Note that the position when grasping the position of the suction nozzle does not have to be the center position of the suction nozzle 5, and may be, for example, the center of gravity of the lower surface of the suction nozzle 5.

以上の構成により、以下装着動作について説明する。先ず、プリント基板Ｐが上流側装置（図示せず）より受継がれて搬送装置２の基板供給部上に存在すると、この基板供給部上のプリント基板Ｐを基板位置決め部へ移動させ、このプリント基板Ｐを位置決めして固定する。   With the above configuration, the mounting operation will be described below. First, when the printed circuit board P is inherited from an upstream device (not shown) and exists on the substrate supply unit of the transport device 2, the printed circuit board P on the substrate supply unit is moved to the substrate positioning unit, and this print The substrate P is positioned and fixed.

そして、プリント基板Ｐの位置決めがされると、奥側のビーム４ＡがＹ方向リニアモータ４０の駆動により前後に延びたガイドに沿ってスライダが摺動してＹ方向に移動すると共にＸ方向リニアモータ４１により装着ヘッド６がＸ方向に移動し、対応する部品供給ユニット３Ｂの部品取出し位置上方まで移動して上下軸モータ４２の駆動により吸着ノズル５を下降させて部品供給ユニット３Ｂから電子部品を取出す。この場合、装着ヘッド６をＸ方向に移動させると共に回転させ、更に吸着ノズル５を昇降させることにより、複数の吸着ノズル５が次々と部品供給ユニット３Ｂから電子部品を取出すことができる。   When the printed circuit board P is positioned, the slider 4 slides along the guide extending in the front-rear direction by the driving of the Y-direction linear motor 40, and the X-direction linear motor moves. The mounting head 6 is moved in the X direction by 41, moved to above the component take-out position of the corresponding component supply unit 3B, and the suction nozzle 5 is lowered by driving the vertical axis motor 42 to take out the electronic component from the component supply unit 3B. . In this case, the mounting head 6 is moved and rotated in the X direction, and the suction nozzle 5 is moved up and down, so that the plurality of suction nozzles 5 can take out electronic components from the component supply unit 3B one after another.

また、奥側の装着ヘッド６の吸着ノズル５による電子部品の取出しの後、或いは取出しているときに、手前側のビーム４ＢがＹ方向リニアモータ４０の駆動によりＹ方向に移動すると共にＸ方向リニアモータ４１により装着ヘッド６がＸ方向に移動し、対応する部品供給ユニット３Ｂの部品取出し位置上方まで移動して上下軸モータの駆動により吸着ノズル５を下降させて部品供給ユニット３Ｂから電子部品を取出すことができる。但し、奥側及び手前側のビーム４Ａ、４Ｂの吸着ノズル５が併行して取出し動作をする場合には、両ビーム４Ａ、４Ｂの装着ヘッド６が衝突しないように対応するＹ方向リニアモータ４０及びＸ方向リニアモータ４１が制御系ＣＰＵ３５により制御される。   Also, after or after taking out the electronic component by the suction nozzle 5 of the mounting head 6 on the back side, the beam 4B on the near side moves in the Y direction by driving the Y direction linear motor 40 and is linear in the X direction. The mounting head 6 is moved in the X direction by the motor 41, moved to above the component extraction position of the corresponding component supply unit 3B, and the suction nozzle 5 is lowered by driving the vertical axis motor to take out the electronic component from the component supply unit 3B. be able to. However, when the suction nozzles 5 of the rear and front beams 4A and 4B perform the extraction operation in parallel, the corresponding Y-direction linear motors 40 and 40 corresponding to prevent the mounting heads 6 of the beams 4A and 4B from colliding with each other. The X direction linear motor 41 is controlled by the control system CPU 35.

なお、吸着ノズル５が部品供給ユニット３Ｂから電子部品を取出しする際に、吸着ノズル５を部品供給ユニット３Ｂの部品取出し位置上方へ移動させるが、この場合にＲＡＭ３１に格納されている基準位置及びこの基準位置とのズレ量であるオフセット値を活用して、制御系ＣＰＵ３５はＸ方向リニアモータ４１及びＹ方向リニアモータ４０を制御することにより、正確に吸着ノズル５を前記部品取出し位置上方へ移動させることにより、確実に電子部品を取出することができる。   When the suction nozzle 5 takes out the electronic component from the component supply unit 3B, the suction nozzle 5 is moved above the component extraction position of the component supply unit 3B. In this case, the reference position stored in the RAM 31 and this The control system CPU 35 controls the X-direction linear motor 41 and the Y-direction linear motor 40 by utilizing the offset value that is the amount of deviation from the reference position, thereby accurately moving the suction nozzle 5 to above the component extraction position. Thus, the electronic component can be reliably taken out.

そして、取出した後は両装着ヘッド６の吸着ノズル５を上昇させて、両ビーム４Ａ、４Ｂの装着ヘッド６を各部品認識カメラ２０の上方を通過させ、この移動中に両装着ヘッド６の吸着ノズル５に吸着保持された複数の電子部品を一括して撮像して、この撮像された画像を認識処理装置が認識処理して吸着ノズル５に対する位置ズレを把握することができる（フライ認識）。この場合、吸着ノズル５に吸着保持されている電子部品の種類に応じた照度で必要なＬＥＤが１回だけフラッシュ点灯する。   After the removal, the suction nozzles 5 of both mounting heads 6 are raised so that the mounting heads 6 of both beams 4A and 4B pass over the respective component recognition cameras 20, and the suction of both mounting heads 6 is performed during this movement. A plurality of electronic components sucked and held by the nozzle 5 can be picked up at once, and the picked-up image can be recognized by the recognition processing device, and the positional deviation with respect to the sucking nozzle 5 can be grasped (fly recognition). In this case, the necessary LED is flashed only once with the illuminance corresponding to the type of electronic component sucked and held by the suction nozzle 5.

この場合、前記ＬＥＤコントロール・駆動回路４８には、吸着ノズル５に吸着保持されている電子部品の種類に応じて輝度とどのＬＥＤを１回だけフラッシュ点灯させるかが格納されており、即ち電子部品がＢＧＡである場合には、ＢＧＡ照明用ＬＥＤ１５をフラッシュ点灯させて装着ヘッド６に設けられた複数の吸着ノズル５に吸着保持されたＢＧＡに斜め下方から光を照射する。円筒形状の電子部品やＰＬＣＣである場合には、ＢＧＡ照明用ＬＥＤ１５、一般反射照明用ＬＥＤ１６及び同軸照明用ＬＥＤ２５をフラッシュ点灯させて装着ヘッド６に設けられた複数の吸着ノズル５に吸着保持された電子部品に斜め下方から光を照射して円筒形状の電子部品などに対して、均一に明るく照明できるように照射する。通常の反射照明が必要な電子部品である場合には、一般反射照明用ＬＥＤ１６及び同軸照明用ＬＥＤ２５をフラッシュ点灯させて装着ヘッド６に設けられた複数の吸着ノズル５に吸着保持された電子部品に斜め下方から光を照射する。透過照明が必要な電子部品である場合には、透過照明用ＬＥＤ１７をフラッシュ点灯させて装置本体９の天面９Ａに開設された各開口部１８を介して複数の前記吸着ノズル５に固定された拡散板１９に向けて光を照射し、この拡散板１９を介して上方から光を複数の吸着ノズル５に吸着保持された電子部品に照射する。   In this case, the LED control / drive circuit 48 stores the luminance and which LED is to be lit only once according to the type of electronic component sucked and held by the suction nozzle 5, that is, the electronic component. Is a BGA, the BGA illumination LED 15 is flashed and light is irradiated obliquely from below to the BGA sucked and held by the plurality of suction nozzles 5 provided on the mounting head 6. In the case of a cylindrical electronic component or PLCC, the BGA illumination LED 15, the general reflection illumination LED 16, and the coaxial illumination LED 25 are flashed and held by a plurality of suction nozzles 5 provided in the mounting head 6. The electronic component is irradiated with light from obliquely below, so that the cylindrical electronic component or the like can be illuminated uniformly and brightly. In the case of an electronic component that requires normal reflected illumination, the general reflected illumination LED 16 and the coaxial illumination LED 25 are flash-lit to the electronic component that is sucked and held by the plurality of suction nozzles 5 provided in the mounting head 6. Irradiate light from diagonally below. In the case of an electronic component that requires transmitted illumination, the LED 17 for transmitted illumination is flashed and fixed to the plurality of suction nozzles 5 through the openings 18 formed in the top surface 9A of the apparatus body 9. Light is radiated toward the diffusion plate 19, and light is emitted from above through the diffusion plate 19 onto the electronic components that are sucked and held by the plurality of suction nozzles 5.

また、以上のいずれの前記ＬＥＤをフラッシュ点灯させる場合においても、前記部品認識カメラ２０の露光が終了すると、撮像された画像は画像入力部４９を介して画像メモリ５０に格納され、画像処理ＣＰＵ４５がこの撮像画像について認識処理し、各電子部品の吸着ノズル５に対する位置が把握され、この位置は画像メモリ５０に格納される。   In addition, when any of the above LEDs is flashed, when the exposure of the component recognition camera 20 is completed, the captured image is stored in the image memory 50 via the image input unit 49, and the image processing CPU 45 Recognition processing is performed on the captured image, the position of each electronic component with respect to the suction nozzle 5 is grasped, and the position is stored in the image memory 50.

その後、ＲＡＭ３１に格納された装着データの電子部品の装着座標に前記電子部品の吸着ノズル５に対する位置を加味して、吸着ノズル５が位置ずれを補正しつつ、それぞれ電子部品をプリント基板Ｐ上に装着する。即ち、Ｘ及びＹ方向については各ビーム４に対応するＹ方向リニアモータ４０及びその装着ヘッド６に係るＸ方向リニアモータ４１により、装着角度についてはθ軸モータ４３により、結果として各装着ヘッド６の各吸着ノズル５はＸ・Ｙ方向及び装着角度が補正され、吸着ノズル５が位置ずれを補正しつつ、各電子部品をプリント基板Ｐ上に装着する。このようにして、プリント基板Ｐ上に全ての電子部品の装着をしたら、このプリント基板Ｐを基板位置決め部から基板排出部を介して下流装置に受け渡す。   Thereafter, the position of the electronic component with respect to the suction nozzle 5 is added to the mounting coordinates of the electronic component stored in the RAM 31 so that the suction nozzle 5 corrects the positional shift, and the electronic component is placed on the printed circuit board P. Installing. That is, in the X and Y directions, the Y direction linear motor 40 corresponding to each beam 4 and the X direction linear motor 41 related to the mounting head 6, the mounting angle by the θ axis motor 43, and as a result, each mounting head 6. Each suction nozzle 5 has its X / Y direction and mounting angle corrected, and the suction nozzle 5 mounts each electronic component on the printed circuit board P while correcting the positional deviation. When all the electronic components are mounted on the printed board P in this way, the printed board P is transferred from the board positioning unit to the downstream device via the board discharging unit.

なお、このプリント基板Ｐへの電子部品の装着に際して、吸着ノズル５をプリント基板Ｐにおける装着位置上方へ移動させるが、ＲＡＭ３１に格納された装着データの電子部品の装着座標に前記電子部品の吸着ノズル５に対する位置を加味し、更にＲＡＭ３１に格納されている基準位置及びこの基準位置とのズレ量であるオフセット値を活用して、制御系ＣＰＵ３５はＸ方向リニアモータ４１及びＹ方向リニアモータ４０を制御することにより、正確に吸着ノズル５を前記装着位置上方へ移動させることにより、装着すべき位置に正確に電子部品を装着することができる。   When the electronic component is mounted on the printed circuit board P, the suction nozzle 5 is moved above the mounting position on the printed circuit board P, but the electronic component suction nozzle is placed in the mounting position of the electronic component stored in the RAM 31. 5, the control system CPU 35 controls the X-direction linear motor 41 and the Y-direction linear motor 40 by utilizing the reference position stored in the RAM 31 and the offset value that is the amount of deviation from this reference position. By doing so, it is possible to accurately mount the electronic component at the position to be mounted by accurately moving the suction nozzle 5 above the mounting position.

以上のように本発明の実施態様について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の種々の代替例、修正又は変形を包含するものである。   Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

電子部品装着装置の概略平面図である。It is a schematic plan view of an electronic component mounting apparatus. 照明装置の概略縦断面図である。It is a schematic longitudinal cross-sectional view of an illuminating device. 照明装置の平面図である。It is a top view of an illuminating device. 図３の中間部の図示を省略したＡ−Ａ断面図である。It is AA sectional drawing which abbreviate | omitted illustration of the intermediate part of FIG. 制御ブロック図である。It is a control block diagram. 図１の丸Ａ部を拡大した吸着ノズルの拡大側面図である。FIG. 2 is an enlarged side view of a suction nozzle in which a circle A portion in FIG. 1 is enlarged. 吸着ノズルに下方から照明装置が光を照射した状態を示す図である。It is a figure which shows the state which the illuminating device irradiated light from the downward direction to the adsorption nozzle. 吸着ノズルを下方から部品認識カメラにより撮像した画像を示す図である。It is a figure which shows the image which imaged the suction nozzle from the downward direction with the components recognition camera. 吸着ノズルの位置認識の場合の部品認識カメラの露光時間と照明時間との関係を示す図である。It is a figure which shows the relationship between the exposure time of a components recognition camera in the case of position recognition of a suction nozzle, and illumination time. 吸着ノズルの位置認識の場合の部品認識カメラの露光時間と照明時間との関係を示す図である。It is a figure which shows the relationship between the exposure time of a components recognition camera in the case of position recognition of a suction nozzle, and illumination time.

符号の説明Explanation of symbols

１ 電子部品装着装置
２ 搬送装置
３ 部品供給装置
３Ｂ 部品供給ユニット
４ ビーム
５ 吸着ノズル
６ 装着ヘッド
８ 照明装置
２０ 部品認識カメラ DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 3B Component supply unit 4 Beam 5 Suction nozzle 6 Mounting head 8 Illumination apparatus 20 Component recognition camera

Claims (3)

部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記吸着ノズルに吸着保持された電子部品を前記部品認識カメラが撮像する際の電子部品に前記照明装置から照射する光の光量よりも多く、前記電子部品を保持していない前記吸着ノズルに光を照射して前記部品認識カメラが撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする電子部品装着装置。   The electronic component supplied from the component supply device is taken out by the suction nozzle provided in the mounting head, and the electronic component is irradiated with light from the illumination device to the suction nozzle and imaged by the component recognition camera. In the electronic component mounting apparatus, the electronic component is picked up and held by the suction nozzle, and the electronic component is imaged more than the amount of light emitted from the illumination device to the electronic component when the component recognition camera images the electronic component. The suction nozzle that has not been held is irradiated with light, and the component recognition camera captures an image. Based on this image, the recognition processor recognizes the position of the suction nozzle in the plane direction. An electronic component mounting device. 部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記吸着ノズルに吸着保持された電子部品を前記部品認識カメラが撮像する際の電子部品に光を照射する照明装置の点灯時間よりも長く、前記電子部品を保持していない前記吸着ノズルに光を照射して前記部品認識カメラが撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする電子部品装着装置。   The electronic component supplied from the component supply device is taken out by the suction nozzle provided in the mounting head, and the electronic component is irradiated with light from the illumination device to the suction nozzle and imaged by the component recognition camera. In the electronic component mounting apparatus, the electronic component is longer than a lighting time of an illumination device that irradiates the electronic component with light when the component recognition camera images the electronic component sucked and held by the suction nozzle. The suction nozzle that has not been held is irradiated with light, and the component recognition camera captures an image. Based on this image, the recognition processor recognizes the position of the suction nozzle in the plane direction. An electronic component mounting device. 部品供給装置より供給された電子部品を装着ヘッドに設けられた吸着ノズルにより取り出し、照明装置から光を前記吸着ノズルに吸着保持された電子部品に照射して、この電子部品を部品認識カメラで撮像するようにした電子部品装着装置において、前記電子部品を保持していない前記吸着ノズルを撮像する際の前記部品認識カメラの露光時間を前記吸着ノズルに吸着保持された電子部品を撮像する際の前記部品認識カメラの露光時間よりも長くして撮像し、この画像に基づいて認識処理装置が認識処理してこの吸着ノズルの平面方向における位置を把握するようにしたことを特徴とする電子部品装着装置。   The electronic component supplied from the component supply device is taken out by the suction nozzle provided in the mounting head, and the electronic component is irradiated with light from the illumination device to the suction nozzle and imaged by the component recognition camera. In the electronic component mounting apparatus, the exposure time of the component recognition camera when imaging the suction nozzle that does not hold the electronic component is the time when the electronic component suctioned and held by the suction nozzle is imaged. An electronic component mounting apparatus characterized in that the image is taken longer than the exposure time of the component recognition camera, and the recognition processing device performs recognition processing based on the image to grasp the position of the suction nozzle in the plane direction. .
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228583A (en) * 2010-04-22 2011-11-10 Fuji Mach Mfg Co Ltd Imaging determining method for electronic component and component mounter
JP2012059735A (en) * 2010-09-03 2012-03-22 Panasonic Corp Component mounting method and component mounting apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340700A (en) * 1999-05-12 1999-12-10 Yamaha Motor Co Ltd Component recognizer of surface mounting machine
JP2005159209A (en) * 2003-11-28 2005-06-16 Hitachi High-Tech Instruments Co Ltd Electronic component mounter
JP2006114809A (en) * 2004-10-18 2006-04-27 Matsushita Electric Ind Co Ltd Device and method for mounting electronic component
JP2006228789A (en) * 2005-02-15 2006-08-31 Yamaha Motor Co Ltd Method and apparatus of acquiring image, surface mounting machine, solder printer for printed circuit board, wafer chip feeder, electronic part transfer device, and appearance inspection apparatus for electronic part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340700A (en) * 1999-05-12 1999-12-10 Yamaha Motor Co Ltd Component recognizer of surface mounting machine
JP2005159209A (en) * 2003-11-28 2005-06-16 Hitachi High-Tech Instruments Co Ltd Electronic component mounter
JP2006114809A (en) * 2004-10-18 2006-04-27 Matsushita Electric Ind Co Ltd Device and method for mounting electronic component
JP2006228789A (en) * 2005-02-15 2006-08-31 Yamaha Motor Co Ltd Method and apparatus of acquiring image, surface mounting machine, solder printer for printed circuit board, wafer chip feeder, electronic part transfer device, and appearance inspection apparatus for electronic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228583A (en) * 2010-04-22 2011-11-10 Fuji Mach Mfg Co Ltd Imaging determining method for electronic component and component mounter
JP2012059735A (en) * 2010-09-03 2012-03-22 Panasonic Corp Component mounting method and component mounting apparatus

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