JP2010080463A - Protection circuit board - Google Patents

Protection circuit board Download PDF

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Publication number
JP2010080463A
JP2010080463A JP2008243488A JP2008243488A JP2010080463A JP 2010080463 A JP2010080463 A JP 2010080463A JP 2008243488 A JP2008243488 A JP 2008243488A JP 2008243488 A JP2008243488 A JP 2008243488A JP 2010080463 A JP2010080463 A JP 2010080463A
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connection tab
board
circuit board
tab
protection circuit
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Takashi Goshu
貴司 郷州
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Tokin Corp
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NEC Tokin Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Structure Of Printed Boards (AREA)
  • Battery Mounting, Suspending (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a protection circuit board which prevents solder scattering on a part for soldering a tab for board connection, and prevents removal of a tab for battery connection from the protection circuit board even if resistance welding of the tab for battery connection is removed. <P>SOLUTION: The tab 12 for board connection of which a cross section has a projected shape is fitted and soldered so as to pass through a perforated part 15 of the protection circuit board 11. The tab 13 for battery connection is inserted between the tab 12 for board connection and a rear surface of a pad 14 of the protection circuit board 11, and is caulked after welded with the tab 12 for board connection. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電池接続用タブが接続される保護回路基板に関するものである。   The present invention relates to a protection circuit board to which a battery connection tab is connected.

近年、小型の携帯用電気機器には電池パックが使用されている。殆どの電池パックには保護回路基板が搭載されており、保護回路基板と電池は、抵抗溶接等により電池接続用タブで接続されている。   In recent years, battery packs have been used for small portable electrical devices. Most battery packs are equipped with a protection circuit board, and the protection circuit board and the battery are connected by a battery connection tab by resistance welding or the like.

保護回路基板には基板接続用タブを接続する為、保護回路基板上にパッドがあり、パッドに半田付けすることにより基板接続用タブが実装されている。電池接続用タブは保護回路基板上に半田を介して接合された基板接続用タブ上に、抵抗溶接されることで接続されている。   In order to connect a board connection tab to the protection circuit board, a pad is provided on the protection circuit board, and the board connection tab is mounted by soldering to the pad. The battery connection tab is connected by resistance welding on the board connection tab joined to the protective circuit board via solder.

図３は、従来の保護回路基板上へのタブ接続構成を示す斜視図であり、図３（ａ）は基板接続用タブが保護回路基板からはみ出している状態を示す図、図３（ｂ）は基板接続用タブが保護回路基板からはみ出していない状態を示す図、図３（ｃ）は基板接続用タブを半田付けする部分に溝状の切欠き部がある図、図３（ｄ）は基板接続用タブを半田付けする部分に四角い穴開き部がある図である。   FIG. 3 is a perspective view showing a conventional tab connection configuration on the protection circuit board. FIG. 3A is a view showing a state in which the board connection tab protrudes from the protection circuit board. FIG. FIG. 3C shows a state where the board connection tab does not protrude from the protection circuit board, FIG. 3C shows a groove-shaped notch in the portion where the board connection tab is soldered, and FIG. It is a figure which has a square hole part in the part which solders the board | substrate connection tab.

図３（ａ）において、基板接続用タブ３２が、保護回路基板３１上のパッド３４に半田付けされる。この場合、基板接続用タブ３２の長さがパッド３４の長さより長く、基板接続用タブ３２が保護回路基板３１からはみ出すように半田付けしている為、半田付け後の基板接続用タブを含む長さは保護回路基板３１の長さより長くなる。また、基板接続用タブ３２を保護回路基板３１のパッド３４に半田付けする際、保護回路基板３１に対しての位置決めが難しい。電池接続用タブ３３は、基板接続用タブ３２の保護回路基板３１の端部からはみ出している部分に抵抗溶接により接続される。   In FIG. 3A, the board connection tab 32 is soldered to the pad 34 on the protection circuit board 31. In this case, since the length of the board connection tab 32 is longer than the length of the pad 34 and the board connection tab 32 is soldered so as to protrude from the protection circuit board 31, the board connection tab after soldering is included. The length is longer than the length of the protection circuit board 31. Further, when the board connection tab 32 is soldered to the pad 34 of the protection circuit board 31, it is difficult to position the board connection tab 32 with respect to the protection circuit board 31. The battery connection tab 33 is connected to the portion of the board connection tab 32 that protrudes from the end of the protection circuit board 31 by resistance welding.

図３（ｂ）において、基板接続用タブ３２が、保護回路基板３１上のパッド３４に半田付けされる。基板接続用タブ３２の長さは、パッド３４の長さと同じ長さであり、保護回路基板３１からはみ出すことなく半田付けされる。電池接続用タブ３３は、基板接続用タブ３２上に抵抗溶接により接続される。保護回路基板３１上に半田付けされた基板接続用タブ３２上へ電池接続用タブ３３を抵抗溶接する際、抵抗溶接による熱が、基板接続用タブ３２を通して保護回路基板３１上に半田付けしているところに伝わり、半田を溶かすことによって半田の飛散が発生しやすくなる。これを防ぐ為、通常の基板接続用タブ３２の厚さは０．１０ｍｍ〜０．１５ｍｍ程度であるが、この厚さを０．３ｍｍ〜０．５ｍｍ程度に設定する必要があり、基板接続用タブ３２のコストが高くなる。   In FIG. 3B, the board connection tab 32 is soldered to the pad 34 on the protection circuit board 31. The length of the board connection tab 32 is the same as the length of the pad 34 and is soldered without protruding from the protection circuit board 31. The battery connection tab 33 is connected to the substrate connection tab 32 by resistance welding. When the battery connection tab 33 is resistance-welded onto the board connection tab 32 soldered onto the protection circuit board 31, heat from the resistance welding is soldered onto the protection circuit board 31 through the board connection tab 32. Solder is easily scattered by melting the solder. In order to prevent this, the thickness of the normal board connection tab 32 is about 0.10 mm to 0.15 mm, but it is necessary to set this thickness to about 0.3 mm to 0.5 mm. The cost of the tab 32 increases.

図３（ｃ）において、基板接続用タブ３２が、保護回路基板３１上のパッド３４に半田付けされる。保護回路基板３１上の基板接続用タブ３２を半田付けする部分には溝状の切欠き部３６があって、基板接続用タブ３２は切欠き部３６をまたぐようにしてパッド３４上に半田付けされる。電池接続用タブ３３は基板接続用タブ３２上に抵抗溶接により接続される。   In FIG. 3C, the board connection tab 32 is soldered to the pad 34 on the protection circuit board 31. A portion of the protection circuit board 31 to which the board connection tab 32 is soldered has a groove-like notch 36, and the board connection tab 32 is soldered onto the pad 34 so as to straddle the notch 36. Is done. The battery connection tab 33 is connected to the substrate connection tab 32 by resistance welding.

図３（ｄ）において、基板接続用タブ３２が、保護回路基板３１上のパッド３４に半田付けされる。保護回路基板３１上の基板接続用タブ３２を半田付けする部分には四角い穴開き部３５があって、基板接続用タブ３２は穴開き部３５をまたぐようにしてパッド３４上に半田付けされる。電池接続用タブ３３は基板接続用タブ３２上に抵抗溶接により接続される。   In FIG. 3D, the board connection tab 32 is soldered to the pad 34 on the protection circuit board 31. A portion where the board connection tab 32 on the protection circuit board 31 is soldered has a square hole 35, and the board connection tab 32 is soldered onto the pad 34 so as to straddle the hole 35. . The battery connection tab 33 is connected to the substrate connection tab 32 by resistance welding.

上記のような従来の方法による電池接続用タブの溶接としては、例えば特許文献１に記載されている。   The welding of the battery connection tab by the conventional method as described above is described in Patent Document 1, for example.

特開２００８−１０５０１号公報JP 2008-10501 A

上記記載の従来例では、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田飛びの影響を考慮する必要がある。   In the above-described conventional example, when resistance-welding the battery connection tab to the board connection tab, it is necessary to consider the influence of solder fly soldering the board connection tab.

また、電池接続用タブと基板接続用タブの抵抗溶接が万が一外れてしまった場合、電池接続用タブが保護回路基板から外れてしまうことも考慮する必要がある。   In addition, in the unlikely event that resistance welding between the battery connection tab and the board connection tab is detached, it is necessary to consider that the battery connection tab is detached from the protection circuit board.

抵抗溶接が外れた場合を考慮し、電池パックでは電池接続用タブを両面テープやテープで固定し、又はカバー等により電池接続用タブや保護回路基板を覆う構造にすることにより、電池接続用タブの溶接が外れても機能上問題ないよう考慮した設計がなされる必要がある。   In consideration of the case where resistance welding is removed, the battery connection tab is fixed to the battery pack with double-sided tape or tape, or the battery connection tab is covered with a cover or the like to cover the battery connection tab or the protection circuit board. Therefore, it is necessary to design in such a way that there is no functional problem even if the welding is removed.

本発明では、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生をなくす必要がある。   In the present invention, when resistance-welding the battery connection tab to the board connection tab, it is necessary to eliminate the occurrence of solder jumps by reducing the influence of heat on the solder portion where the board connection tab is soldered. is there.

また、電池接続用タブと基板接続用タブの抵抗溶接が万が一外れた場合でも電池接続用タブが保護回路基板から外れることなく、より自由度のある保護回路基板の構成を可能とする必要がある。   In addition, even if the resistance welding between the battery connection tab and the board connection tab is removed, the battery connection tab does not come off from the protection circuit board, and it is necessary to enable a more flexible protection circuit board configuration. .

すなわち、本発明の技術的課題は、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生がなく、電池接続用タブの抵抗溶接が万が一外れた場合でも電池接続用タブが外れることのない保護回路基板を提供することにある。   That is, the technical problem of the present invention is that when the battery connection tab is resistance-welded to the board connection tab, the influence of heat on the soldered portion soldering the board connection tab is reduced to reduce solder jump. It is an object of the present invention to provide a protection circuit board that does not cause the battery connection tab to come off even if the resistance welding of the battery connection tab is removed.

本発明の保護回路基板は、両端に穴開き部を有する保護回路基板であって、前記穴開き部を貫通するように断面が凸形状の基板接続用タブが挿入され、前記保護回路基板の表面で半田付けされ、平板状の電池接続用タブが前記基板接続用タブと前記保護回路基板の裏面の間に挿入され、前記基板接続用タブと前記電池接続用タブが溶接されたことを特徴とする。   The protection circuit board of the present invention is a protection circuit board having a hole at both ends, and a board connection tab having a convex section is inserted so as to penetrate the hole, and the surface of the protection circuit board The flat battery connection tab is inserted between the board connection tab and the back surface of the protection circuit board, and the board connection tab and the battery connection tab are welded. To do.

本発明の保護回路基板は、前記基板接続用タブと前記電池接続用タブを溶接した後、前記基板接続用タブの断面凸形状部をカシメたことを特徴とする。   The protection circuit board according to the present invention is characterized in that after the board connection tab and the battery connection tab are welded, the convex section of the cross section of the board connection tab is crimped.

本発明によれば、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生がなく、電池接続用タブの抵抗溶接が万が一外れた場合でも電池接続用タブが外れることのない保護回路基板が得られる。   According to the present invention, when the battery connection tab is resistance-welded to the board connection tab, there is no occurrence of solder jump by reducing the influence of heat on the soldered portion where the board connection tab is soldered. Even if the resistance welding of the battery connection tab is removed, a protection circuit board is obtained in which the battery connection tab does not come off.

本発明の実施の形態を説明する。   An embodiment of the present invention will be described.

図１は、本発明の保護回路基板上へのタブ接続構成を示す斜視図であり、図１（ａ）は保護回路基板上へのタブ接続構成を示す上方斜視図、図１（ｂ）は保護回路基板上に基板接続用タブを半田付けした上方斜視図、図１（ｃ）はタブが保護回路基板に接続された状態を示す上方斜視図、図１（ｄ）はタブが保護回路基板に接続された状態を示す下方斜視図である。   FIG. 1 is a perspective view showing a tab connection configuration on a protection circuit board according to the present invention, FIG. 1A is an upper perspective view showing a tab connection configuration on the protection circuit board, and FIG. FIG. 1C is an upper perspective view showing a state where the tab is connected to the protective circuit board, and FIG. 1D is a state where the tab is the protective circuit board. It is a downward perspective view which shows the state connected to.

図１（ｂ）に示すように断面が凸形状の基板接続用タブ１２が、保護回路基板１１上の四角い穴開き部に嵌め込まれ、保護回路基板の表面の穴開き部の周囲にあるパッドに半田付けされる。また図１（ｄ）に示すように電池接続用タブ１３は、保護回路基板１１の半田付けしているパッドの面の裏面にて、基板接続用タブ１２と保護回路基板１１の裏面の間を通すように挿入して配置し、基板接続用タブ１２と抵抗溶接にて接続される。   As shown in FIG. 1B, a board connection tab 12 having a convex cross section is fitted into a square hole on the protective circuit board 11 and is applied to a pad around the hole on the surface of the protective circuit board. Soldered. Further, as shown in FIG. 1D, the battery connection tab 13 is between the board connection tab 12 and the back surface of the protection circuit board 11 on the back surface of the soldered pad surface of the protection circuit board 11. It is inserted and arranged so as to pass through, and is connected to the board connecting tab 12 by resistance welding.

図２は本発明の保護回路基板上へのタブ接続構成を示す平面図であり、図２（ａ）は保護回路基板上にタブ接続された平面図、図２（ｂ）は図２（ａ）のＡ−Ａ断面図である。   FIG. 2 is a plan view showing a tab connection configuration on the protection circuit board of the present invention, FIG. 2 (a) is a plan view of the tab connection on the protection circuit board, and FIG. 2 (b) is FIG. It is AA sectional drawing of).

断面が凸形状の基板接続用タブ２２は、保護回路基板２１の四角い穴開き部２５に嵌め込まれ、保護回路基板２１の基板部品実装部２６の反対面である表面のパッド２４に半田付けされる。断面が凸形状の基板接続用タブ２２は、パッド２４が保護回路基板２１の基板部品実装部２６側に設けられている場合にはそちらに半田付けされてもよい。電池接続用タブ２３は断面が凸形状の基板接続用タブ２２と保護回路基板２１の裏面の間に挿入し配置される。   The board connecting tab 22 having a convex cross section is fitted into the square hole opening 25 of the protection circuit board 21 and soldered to the surface pad 24 opposite to the board component mounting part 26 of the protection circuit board 21. . When the pad 24 is provided on the board component mounting portion 26 side of the protection circuit board 21, the board connection tab 22 having a convex cross section may be soldered thereto. The battery connection tab 23 is inserted and arranged between the board connection tab 22 having a convex cross section and the back surface of the protection circuit board 21.

電池接続用タブ２３と断面が凸形状の基板接続用タブ２２を抵抗溶接した後、断面が凸形状の基板接続用タブ２２を図２（ｂ）の矢印方向に押し込むことで、電池接続用タブ２３は、断面が凸形状の基板接続用タブ２２と保護回路基板２１の裏面の間でカシメが行われる。押し込む方向は、矢印方向と逆の方向であっても、両方の方向からであってもよい。   After resistance-welding the battery connection tab 23 and the board connection tab 22 having a convex section, the battery connection tab is pushed by pushing the board connection tab 22 having a convex section in the direction of the arrow in FIG. In 23, caulking is performed between the board connection tab 22 having a convex cross section and the back surface of the protection circuit board 21. The direction of pushing in may be opposite to the arrow direction or from both directions.

なお、カシメを行わずに抵抗溶接で接続するだけであっても十分な接続強度が得られるが、抵抗溶接後にカシメを行うことにより、抵抗溶接だけで接続するよりもさらに大きな接続強度が得られる。   In addition, although sufficient connection strength is obtained even if it connects only by resistance welding, without performing crimping, even greater connection strength is obtained by performing crimping after resistance welding than when connecting only by resistance welding. .

断面が凸形状の基板接続用タブや電池接続用タブのカシメ部分の形状は、カシメを行える形状であればよい。例えば円形のように、抵抗溶接をした後に押し込みやすいような形状であることが、特性上好ましい。   The shape of the caulking portion of the board connecting tab or the battery connecting tab having a convex cross section may be any shape that can be caulked. For example, a shape that is easy to push in after resistance welding, such as a circular shape, is preferable.

電池接続用タブと基板接続用タブの材質は、ニッケル又はニッケル化合物であるのが溶接上、導電上好ましい。   The material for the battery connection tab and the substrate connection tab is preferably nickel or a nickel compound in terms of welding and conductivity.

電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生をなくする為に、本発明では、基板上の四角い穴開き部の周囲にあるパッドに半田付けされる基板接続用タブの形状を、断面が凸形状となるようにし、基板上の四角い穴開き部に嵌め込むようにして半田付けする。   In order to eliminate the occurrence of solder jumps by reducing the influence of heat on the soldered portion soldering the board connection tab when resistance welding the battery connection tab to the board connection tab, the present invention Then, the shape of the board connection tab to be soldered to the pad around the square hole portion on the board is made to have a convex cross section and soldered so as to be fitted into the square hole portion on the board. .

すなわち、保護回路基板に半田付けされる基板接続用タブを、断面が凸形状とすることで、抵抗溶接する位置は、半田付け部分からの距離を従来よりも基板の厚さ以上長くすることができ、抵抗溶接時の半田付け部分への熱の影響を小さくすることができる。また電池接続用タブを基板接続用タブに溶接した後に、断面が凸形状の基板接続用タブを電池接続用タブに押し込むことで、確実にカシメを行うことが可能となる。   In other words, the board connection tab to be soldered to the protection circuit board has a convex cross section, so that the position where resistance welding is performed can be made longer than the thickness of the board by a distance from the soldering part. It is possible to reduce the influence of heat on the soldered portion during resistance welding. Further, after the battery connection tab is welded to the board connection tab, the board connection tab having a convex cross section is pushed into the battery connection tab, so that the crimping can be surely performed.

基板接続用タブの形状は、必ずしも断面が凸形状である必要はなく、さまざまな形状であってよい。すなわち電池接続用タブを基板接続用タブに抵抗溶接する位置が、基板接続用タブを半田付けしている半田部分からできるだけ離れているのが熱の影響上好ましく、カシメを行うことが可能な形状であればよい。穴開き部は溝状や切欠状であってもよい。   The shape of the board connection tab does not necessarily have a convex cross section, and may be various shapes. In other words, the position where the battery connection tab is resistance-welded to the board connection tab is preferably as far as possible from the soldered portion where the board connection tab is soldered, because of the influence of heat, and can be caulked. If it is. The perforated part may be grooved or notched.

電池接続用タブと基板接続用タブのカシメを行って固定することにより、電池接続用タブと基板接続用タブの抵抗溶接が万が一外れた場合でも、電池接続用タブが保護回路基板から外れることがなく、電池接続用タブを固定する為の両面テープ等を使用した保護回路基板の場合には、これらの両面テープ等が不要となる。   By crimping and fixing the battery connection tab and the board connection tab, even if the resistance welding of the battery connection tab and the board connection tab is removed, the battery connection tab may come off from the protection circuit board. In the case of a protective circuit board using a double-sided tape or the like for fixing the battery connection tab, the double-sided tape or the like becomes unnecessary.

カシメを行うことのみにて電池接続用タブと基板接続用タブの接続が電気的、機械的にも十分保持可能な場合には、抵抗溶接をなくすることも可能となる。   If the connection between the battery connection tab and the board connection tab can be sufficiently maintained both electrically and mechanically only by caulking, resistance welding can be eliminated.

以下に、本発明の実施例を詳述する。   Examples of the present invention are described in detail below.

（実施例１）
本発明の実施例として図２（ｂ）を参照して説明する。図２（ｂ）に示すように、保護回路基板の四角い穴開き部２５に断面が凸形状の基板接続用タブ２２を嵌め込み、保護回路基板上の表面の四角い穴開き部２５の周囲にあるパッド２４に半田付けした。次いで、電池接続用タブ２３を、断面が凸形状の基板接続用タブ２２と保護回路基板２１の裏面の間に挿入し、抵抗溶接を行った。 Example 1
An embodiment of the present invention will be described with reference to FIG. As shown in FIG. 2 (b), a board connection tab 22 having a convex cross section is fitted into the square hole portion 25 of the protective circuit board, and a pad around the square hole portion 25 on the surface of the protective circuit board. 24 was soldered. Next, the battery connection tab 23 was inserted between the substrate connection tab 22 having a convex cross section and the back surface of the protection circuit board 21 to perform resistance welding.

基板接続用タブ２２から電池接続用タブ２３の方向に押し込むことでカシメを行い、保護回路基板を製作した。   The protective circuit board was manufactured by crimping by pushing it in the direction of the battery connection tab 23 from the board connection tab 22.

Ｌ１２は保護回路基板２１の厚さであり、０．７ｍｍであった。またＬ１１は穴開き部２５の幅で３．５ｍｍ、Ｌ２１は断面が凸形状の基板接続用タブ２２の幅で３．０ｍｍ、Ｌ２２は基板接続用タブ２２の高さで１．２ｍｍ、Ｌ２３は基板接続用タブ２２の厚さで０．１ｍｍであった。Ｌ３１は電池接続用タブ２３の幅で２．５ｍｍ、Ｌ３２は電池接続用タブ２３の厚さで０．１ｍｍであった。さらにＬ４１は断面が凸形状の基板接続用タブ２２と保護回路基板２１の間の寸法で０．３ｍｍであった。   L12 is the thickness of the protective circuit board 21 and was 0.7 mm. L11 is 3.5 mm in width of the perforated portion 25, L21 is 3.0 mm in width of the board connecting tab 22 having a convex cross section, L22 is 1.2 mm in height of the board connecting tab 22, L23 is The thickness of the board connection tab 22 was 0.1 mm. L31 was 2.5 mm in width of the battery connection tab 23, and L32 was 0.1 mm in thickness of the battery connection tab 23. Furthermore, L41 was 0.3 mm in the dimension between the board connection tab 22 having a convex cross section and the protection circuit board 21.

保護回路基板に半田付けされる基板接続用タブを、断面が凸形状とすることで、半田付け部分からの距離を従来よりも、基板の厚さである０．７ｍｍ以上長くとることができ、抵抗溶接時の半田付け部分への熱の影響を小さくすることができた。   The tab for connecting the board to be soldered to the protective circuit board has a convex cross section, so that the distance from the soldered portion can be longer than the conventional thickness of 0.7 mm or more, The effect of heat on the soldered part during resistance welding could be reduced.

基板接続用タブと電池接続用タブを溶接した際に、本発明の保護回路基板１００個のうち、基板接続用タブが半田付けされているパッド周辺に半田が飛散したものはなかった。   When the board connection tab and the battery connection tab were welded, none of the 100 protection circuit boards of the present invention had solder scattered around the pad where the board connection tab was soldered.

本発明の保護回路基板は、電池接続用タブを基板接続用タブに抵抗溶接した後にカシメを行っており、カシメにより電池接続用タブは基板接続用タブと接続されたままであり、抵抗溶接が外れたものはなかった。   The protection circuit board of the present invention is crimped after resistance welding of the battery connection tab to the board connection tab, and the battery connection tab remains connected to the board connection tab by crimping, and the resistance welding is released. There was nothing.

（実施例２）
電池接続用タブを基板接続用タブに抵抗溶接しない以外は実施例１と同様に保護回路基板を作製した。 (Example 2)
A protective circuit board was produced in the same manner as in Example 1 except that the battery connection tab was not resistance-welded to the board connection tab.

基板接続用タブと電池接続用タブを溶接していない実施例２の保護回路基板１００個のうち、半田が飛散したものはなかった。   Of the 100 protection circuit boards of Example 2 in which the board connection tab and the battery connection tab were not welded, no solder was scattered.

実施例２の保護回路基板で、電池接続用タブを基板接続用タブに抵抗溶接せずにカシメを行ったもの１００個を作製したが、カシメにより電池接続用タブは基板接続用タブと接続されたままであった。   In the protection circuit board of Example 2, 100 battery connecting tabs that were crimped without resistance welding to the board connecting tabs were produced, but the battery connecting tabs were connected to the board connecting tabs by caulking. It remained.

（比較例）
基板接続用タブが板状である以外は実施例１と同様に保護回路基板を作製した。 (Comparative example)
A protective circuit board was produced in the same manner as in Example 1 except that the board connection tab was plate-shaped.

基板接続用タブと電池接続用タブを溶接した際に、比較例の保護回路基板１００個のうち、基板接続用タブが半田付けされているパッド周辺に半田が飛散したものは６個あった。   When the board connection tab and the battery connection tab were welded, among the 100 protection circuit boards of the comparative example, there were 6 pieces of solder scattered around the pads where the board connection tabs were soldered.

比較例の保護回路基板は、電池接続用タブを基板接続用タブに抵抗溶接した後にカシメを行っており、カシメにより電池接続用タブは基板接続用タブと接続されたままであり、抵抗溶接が外れたものはなかった。   The protective circuit board of the comparative example is crimped after resistance welding the battery connection tab to the board connection tab, and the battery connection tab remains connected to the board connection tab by crimping, and the resistance welding is released. There was nothing.

実施例１と比較例より、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生をなくすことができた。実施例１と実施例２より、電池接続用タブと基板接続用タブとの抵抗溶接の有無にかかわらず、カシメが外れたものはなかったので、抵抗溶接が万が一外れた場合でも電池接続用タブは基板接続用タブと接続されたままであることが確認できた。   From Example 1 and Comparative Example, when the battery connection tab is resistance-welded to the board connection tab, solder jumps are generated by reducing the effect of heat on the soldered portion where the board connection tab is soldered. Was able to be eliminated. From Example 1 and Example 2, there was no caulking, regardless of whether or not resistance welding between the battery connection tab and the board connection tab was performed. Therefore, even if the resistance welding was removed, the battery connection tab Was confirmed to remain connected to the board connection tab.

実施例の結果を総合して考慮すれば、電池接続用タブを基板接続用タブに抵抗溶接する際に、基板接続用タブを半田付けしている半田部分への熱の影響を小さくすることで半田飛びの発生をなくし、その抵抗溶接が万が一外れた場合でも電池接続用タブが保護回路基板から外れることのない保護回路基板が得られた。   Considering the results of the examples in total, when resistance welding the battery connection tab to the board connection tab, it is possible to reduce the influence of heat on the solder portion soldering the board connection tab. A protective circuit board was obtained in which the occurrence of solder jumps was eliminated and the battery connection tab did not come off from the protective circuit board even if the resistance welding was removed.

以上、実施例を用いて、この発明の実施の形態を説明したが、この発明は、これらの実施例に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更があっても本発明に含まれる。すなわち、当業者であれば、当然なしえるであろう各種変形、修正もまた本発明に含まれる。   The embodiments of the present invention have been described above using the embodiments. However, the present invention is not limited to these embodiments, and the present invention is not limited to the scope of the present invention. Included in the invention. That is, various changes and modifications that can be naturally made by those skilled in the art are also included in the present invention.

本発明の保護回路基板上へのタブ接続構成を示す斜視図、図１（ａ）は保護回路基板上へのタブ接続構成を示す上方斜視図、図１（ｂ）は保護回路基板上に基板接続用タブを半田付けした上方斜視図、図１（ｃ）はタブが保護回路基板に接続された状態を示す上方斜視図、図１（ｄ）はタブが保護回路基板に接続された状態を示す下方斜視図。1 is a perspective view showing a tab connection configuration on a protection circuit board of the present invention, FIG. 1A is an upper perspective view showing a tab connection configuration on the protection circuit board, and FIG. 1B is a board on the protection circuit board. FIG. 1C is an upper perspective view showing a state where the tab is connected to the protection circuit board, and FIG. 1D is a state where the tab is connected to the protection circuit board. The lower perspective view shown. 本発明の保護回路基板上へのタブ接続構成を示す平面図、図２（ａ）は保護回路基板上にタブ接続された平面図、図２（ｂ）は図２（ａ）のＡ−Ａ断面図。The top view which shows the tab connection structure on the protection circuit board of this invention, Fig.2 (a) is a top view which tab-connected on the protection circuit board, FIG.2 (b) is AA of Fig.2 (a). Sectional drawing. 従来の、保護回路基板上へのタブ接続構成を示す斜視図、図３（ａ）は基板接続用タブが保護回路基板からはみ出している状態を示す図、図３（ｂ）は基板接続用タブが保護回路基板からはみ出していない状態を示す図、図３（ｃ）は基板接続用タブを半田付けする部分に溝状の切欠き部がある図、図３（ｄ）は基板接続用タブを半田付けする部分に四角い穴開き部がある図。FIG. 3A is a perspective view showing a conventional tab connection configuration on the protection circuit board, FIG. 3A is a view showing a state where the board connection tab protrudes from the protection circuit board, and FIG. 3B is a board connection tab. FIG. 3C shows a state in which the board connection tab is soldered to the portion where the board connection tab is soldered, and FIG. 3D shows the board connection tab. The figure which has a square hole part in the part to solder.

符号の説明Explanation of symbols

１１、２１、３１ 保護回路基板
１２、２２、３２ 基板接続用タブ
１３、２３、３３ 電池接続用タブ
１４、２４、３４ パッド
１５、２５、３５ 穴開き部
２６ 基板部品実装部
３６ 切欠き部
Ｌ１１ 穴開き部の幅
Ｌ１２ 保護回路基板の厚さ
Ｌ２１ 基板接続用タブの幅
Ｌ２２ 基板接続用タブの高さ
Ｌ２３ 基板接続用タブの厚さ
Ｌ３１ 電池接続用タブの幅
Ｌ３２ 電池接続用タブの厚さ
Ｌ４１ 基板接続用タブと保護回路基板の間の寸法 11, 21, 31 Protection circuit board 12, 22, 32 Board connection tabs 13, 23, 33 Battery connection tabs 14, 24, 34 Pads 15, 25, 35 Hole part 26 Board component mounting part 36 Notch part L11 Hole width L12 Protective circuit board thickness L21 Board connection tab width L22 Board connection tab height L23 Board connection tab thickness L31 Battery connection tab width L32 Battery connection tab thickness L41 Dimensions between board connection tab and protection circuit board

Claims (2)

両端に穴開き部を有する保護回路基板であって、前記穴開き部を貫通するように断面が凸形状の基板接続用タブが挿入され、前記保護回路基板の表面で半田付けされ、平板状の電池接続用タブが前記基板接続用タブと前記保護回路基板の裏面の間に挿入され、前記基板接続用タブと前記電池接続用タブが溶接されたことを特徴とする保護回路基板。   A protective circuit board having a perforated portion at both ends, and a board connection tab having a convex cross section is inserted so as to penetrate the perforated part, and is soldered on the surface of the protective circuit board. A protection circuit board, wherein a battery connection tab is inserted between the board connection tab and a back surface of the protection circuit board, and the board connection tab and the battery connection tab are welded. 前記基板接続用タブと前記電池接続用タブを溶接した後、前記基板接続用タブの断面凸形状部をカシメたことを特徴とする請求項１に記載の保護回路基板。   2. The protection circuit board according to claim 1, wherein after the board connection tab and the battery connection tab are welded, the convex section of the cross section of the board connection tab is crimped.
JP2008243488A 2008-09-24 2008-09-24 Protection circuit board Withdrawn JP2010080463A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020013979A (en) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and battery module comprising the same
JP2020013978A (en) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and battery module comprising the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020013979A (en) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and battery module comprising the same
JP2020013978A (en) * 2018-07-13 2020-01-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and battery module comprising the same
JP7294585B2 (en) 2018-07-13 2023-06-20 サムソン エレクトロ－メカニックス カンパニーリミテッド． Printed circuit board and battery module containing same

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