JP2009231062A - Terminal structure of switch for base board mounting - Google Patents

Terminal structure of switch for base board mounting Download PDF

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JP2009231062A
JP2009231062A JP2008075336A JP2008075336A JP2009231062A JP 2009231062 A JP2009231062 A JP 2009231062A JP 2008075336 A JP2008075336 A JP 2008075336A JP 2008075336 A JP2008075336 A JP 2008075336A JP 2009231062 A JP2009231062 A JP 2009231062A
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switch
terminal
housing
solder
mounting
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Sota Kawashima
壮太 川島
Nobuyasu Ito
誠康 伊藤
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SMK Corp
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SMK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To enhance soldering strength of a switch for mounting on a substrate and, at the same time, to prevent infiltration of flux into an inside of the switch. <P>SOLUTION: By providing an opening 32 at a terminal 30 protruded from the side face of a housing, a soldering fillet is formed around an inside of the opening 32 as a soldering connection face of the terminal 30 is soldered on a solder-mounting face 51 of the substrate 50, so that soldering connection strength is enhanced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、各種電子機器の基板（例えばプリント配線基板）に実装されるスイッチ（例えば押釦スイッチ）の端子構造に係り、特に基板の切欠き部に実装される押釦スイッチに好適な端子構造に関するものである。 The present invention relates to a terminal structure of a switch (for example, a push button switch) mounted on a substrate (for example, a printed wiring board) of various electronic devices, and more particularly to a terminal structure suitable for a push button switch mounted on a notch portion of the substrate. It is.

従来、この種の押釦スイッチ１００は、図９、図１０に示すように、接点部を収納し基板１７０に取付けられるハウジング１１０と、ハウジング１１０の一側面１１１から露出し基板１７０の板面と平行方向に操作可能な押釦１２０とを備え、ハウジング１１０は接点部と導通した端子１３０を側面１１１から導出させ、端子１３０は基板１７０に対する半田付け面１３１を有し、端子１３０は押釦１２０の操作方向に前後一対づつハウジング１１０の側面１１１から導出されている。〔特許文献１〕特開２００６−２１０１９５号公報 Conventionally, as shown in FIGS. 9 and 10, this type of pushbutton switch 100 includes a housing 110 that houses a contact portion and is attached to a substrate 170, and is exposed from one side 111 of the housing 110 and parallel to the plate surface of the substrate 170. A push button 120 that can be operated in a direction, the housing 110 leads a terminal 130 that is electrically connected to the contact portion from the side surface 111, the terminal 130 has a soldering surface 131 to the substrate 170, and the terminal 130 is an operation direction of the push button 120. The pair of front and rear is led out from the side surface 111 of the housing 110. [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-210195

しかしながら、前述の従来例では、端子１３０に貫通孔や切欠きなどの開口部が形成されていないので、押釦スイッチの基板１７０への半田接続における半田接続面積を大きくすることが難しく、半田付け強度を大きくすることができないという問題点があった。また、端子１３０に開口部が形成されていないので、押釦スイッチの基板１７０への半田接続時に半田が溶融すると、フラックスが、ハウジング１１０とハウジング１１０の外側に固定された金属製カバー１６０の間から毛細管現象で押釦スイッチ１００内へ侵入し易いという問題点があった。また、端子１３０の半田接続側の板面が、ハウジング１１０の底面と同一平面上に形成されるとともに、その一部がハウジング１１０の座面から露出するように形成されているので、半田接続時にフラックスが端子１３０とハウジング１１０の間から押釦スイッチ１００内へ侵入し易いという問題点があった。 However, in the above-described conventional example, since an opening such as a through hole or a notch is not formed in the terminal 130, it is difficult to increase the solder connection area in the solder connection to the board 170 of the pushbutton switch, and the soldering strength There was a problem that it could not be increased. Further, since no opening is formed in the terminal 130, when the solder melts when the push button switch is connected to the substrate 170, the flux is passed from between the housing 110 and the metal cover 160 fixed to the outside of the housing 110. There has been a problem that it is easy to enter the push button switch 100 due to capillary action. In addition, since the plate surface on the solder connection side of the terminal 130 is formed on the same plane as the bottom surface of the housing 110 and part of the plate surface is exposed from the seating surface of the housing 110, There is a problem that the flux easily enters the push button switch 100 from between the terminal 130 and the housing 110.

また、押釦スイッチを基板に実装する際、基板実装高さを抑制するために基板に切欠き部を形成し、この切欠き部に押釦スイッチを組み入れ実装する方法があるが、前述の従来例の押釦スイッチを単純に利用した場合、端子１３０の板面がハウジング１１０の底面と同一平面上に形成されるとともに、その一部がハウジング１１０の底面から露出して形成されているので、実装機を用いて押釦スイッチ１００を切り欠き基板１７０に実装するときに、図１０に示すように、実装機によって押釦スイッチ１００に対して下方向の力が加わり、その反作用で端子１３０に対して上方向の力が加わり、端子１３０が変形したり、基板１７０から浮き上がったりして、押釦スイッチの基板１７０への半田接続が難しいという問題点があった。 In addition, when mounting the pushbutton switch on the board, there is a method of forming a notch in the board in order to suppress the board mounting height, and mounting the pushbutton switch in this notch. When the push button switch is simply used, the plate surface of the terminal 130 is formed on the same plane as the bottom surface of the housing 110, and a part thereof is exposed from the bottom surface of the housing 110. When the push button switch 100 is mounted on the notch substrate 170, a downward force is applied to the push button switch 100 by the mounting machine as shown in FIG. There is a problem in that it is difficult to connect the push button switch to the substrate 170 because force is applied and the terminal 130 is deformed or lifted from the substrate 170.

本発明は、上述の問題点に鑑みてなされたもので、基板への半田接続強度を大きくすることができるとともに、スイッチ内部へのフラックスの浸入を抑制することのできる基板実装用スイッチの端子構造を提供することを目的とするものである。また、基板面からの高さを抑制するために基板に切欠き部を形成し、この切欠き部に実装することの可能な基板実装用スイッチの端子構造を提供することを目的とするものである。 The present invention has been made in view of the above-described problems, and it is possible to increase the solder connection strength to the substrate and to suppress the penetration of the flux into the switch, and to the terminal structure of the substrate mounting switch. Is intended to provide. It is another object of the present invention to provide a terminal structure of a board mounting switch that can be mounted in the notch by forming a notch in the board in order to suppress the height from the board surface. is there.

請求項１記載の発明は、ハウジングの側面から突出する端子の半田接続面を基板の半田実装面に半田接続する基板実装用スイッチの端子構造であって、前記端子には開口部が形成され、前記端子の半田接続面と前記基板の半田実装面とが半田接続される際に、前記開口部の内側周囲部に半田フィレットが形成されることを特徴とする。 The invention according to claim 1 is a terminal structure of a board mounting switch in which a solder connection surface of a terminal protruding from a side surface of the housing is solder-connected to a solder mounting surface of the board, and an opening is formed in the terminal. When the solder connection surface of the terminal and the solder mounting surface of the substrate are solder-connected, a solder fillet is formed on the inner periphery of the opening.

請求項２記載の発明は、請求項１記載の発明において、基板実装用スイッチが基板の切欠き部に実装されることを特徴とする。 According to a second aspect of the present invention, in the first aspect of the present invention, the board mounting switch is mounted in a notch portion of the board.

請求項３記載の発明は、請求項１又は２記載の発明において、端子の半田接続面がハウジングの底面と同一平面上に位置することなく、基板の側面から突出していることを特徴とする。 According to a third aspect of the present invention, in the first or second aspect of the present invention, the solder connection surface of the terminal protrudes from the side surface of the substrate without being located on the same plane as the bottom surface of the housing.

請求項４記載の発明は、請求項１，２又は３記載の発明において、基板実装用スイッチは、基板への実装時に押釦の操作方向が基板の板面と略平行となるように形成された基板実装用押釦スイッチであることを特徴とする。 The invention according to claim 4 is the invention according to claim 1, 2, or 3, wherein the board mounting switch is formed so that the operation direction of the push button is substantially parallel to the plate surface of the board when mounted on the board. It is a pushbutton switch for board mounting.

請求項１記載の発明は、ハウジングの側面から突出する端子の半田接続面を基板の半田実装面に半田接続する基板実装用スイッチにおいて、端子に、基板の半田実装面との半田接続時に、半田フィレットが内側周囲部に形成される開口部が形成されているので、半田接続強度を向上させることができるとともに、基板実装用スイッチ内へのフラックスの侵入を抑制することができる。すなわち、端子に開口部を形成し、半田付け時における半田の開口部への流れ込みによって半田付け面の接続強度を向上させることができるとともに、半田接続時におけるフラックスの開口部への流れ込みによるフラックスの基板実装用スイッチ内への侵入を抑制することができる。 According to the first aspect of the present invention, in the board mounting switch in which the solder connection surface of the terminal protruding from the side surface of the housing is solder-connected to the solder mounting surface of the substrate, the solder is connected to the terminal and the solder mounting surface of the substrate. Since the opening in which the fillet is formed in the inner peripheral portion is formed, it is possible to improve the solder connection strength and to suppress the flux intrusion into the board mounting switch. In other words, an opening is formed in the terminal, and the connection strength of the soldering surface can be improved by flowing the solder into the opening during soldering, and the flux generated by the flux flowing into the opening during solder connection can be improved. Intrusion into the board mounting switch can be suppressed.

請求項２記載の発明は、請求項１記載の発明において、基板実施用スイッチが基板の切欠き部に実装されるスイッチで形成されているので、基板からの高さを抑制することができる。 The invention according to claim 2 is the invention according to claim 1, wherein the substrate implementation switch is formed by a switch mounted on a notch portion of the substrate, so that the height from the substrate can be suppressed.

請求項３記載の発明は、請求項１又は２記載の発明において、端子は、その半田接続面がハウジングの座面と同一平面上に位置してないように、ハウジングの側面から突出しているので、端子のハウジングへの固着強度が増加し、実装機で基板実装用スイッチを基板に実装するときに基板実装用スイッチに対して下方向の力が作用し、その反作用で端子に対して上方向の力が作用しても、端子が変形したり、基板から浮き上がるのを抑制することができる。 According to a third aspect of the invention, in the first or second aspect of the invention, since the terminal protrudes from the side surface of the housing so that the solder connection surface is not located on the same plane as the seating surface of the housing. The strength of fixing the terminal to the housing increases, and when mounting the board mounting switch on the board with the mounting machine, a downward force acts on the board mounting switch, and the reaction acts upward to the terminal. Even if this force is applied, the terminal can be prevented from being deformed or lifted off the substrate.

請求項４記載の発明は、請求項１，２又は３記載の発明において、基板実装用スイッチは基板への実装時に押釦の操作方向が基板の板面と略並行となる基盤実装用押釦スイッチであるので、このような半田接続強度の向上とフラックスの侵入防止が要求される基板実装用押釦スイッチにおいて、簡単な構造で要求に応えることができ、基板実装用押釦スイッチの小形化を図ることができる。 According to a fourth aspect of the present invention, in the first, second, or third aspect of the invention, the board mounting switch is a board mounting pushbutton switch in which the operation direction of the pushbutton is substantially parallel to the board surface of the board when mounted on the board. Therefore, in such a board mounting pushbutton switch that requires improvement in solder connection strength and prevention of flux intrusion, it is possible to meet the demand with a simple structure, and to reduce the size of the board mounting pushbutton switch. it can.

次に本発明の実施形態について説明する。図１は本発明を実施した押釦スイッチの正面図、図２は図１のＡ−Ａ線断面図、図３は図１の右側側面図、図４は正面側斜視図であり、本発明を実施した押釦スイッチ１０は、接点部３４を含むハウジング２０に、導電性の接触板４０、操作部材６０を組み入れ、その上からカバー７０を被せて組み立てられる構造となっており、各個品は以下の通りのものである。 Next, an embodiment of the present invention will be described. 1 is a front view of a pushbutton switch embodying the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, FIG. 3 is a right side view of FIG. The implemented pushbutton switch 10 has a structure in which a conductive contact plate 40 and an operation member 60 are assembled in a housing 20 including a contact portion 34 and a cover 70 is put on the conductive plate 40. It is a street thing.

ハウジング２０は絶縁材料からなり、上面側に開口部２２を有し、底面部２３には開口側に互いに離間した接点部３４を露出する端子３０がハウジング２０に一体成形されたものである。 The housing 20 is made of an insulating material, has an opening 22 on the upper surface side, and a terminal 30 that exposes contact portions 34 that are spaced apart from each other on the opening side is integrally formed on the housing 20.

接触板４０は厚みが０．０１〜０．０５ｍｍ程度の導電性の薄板状金属からなり、凸状に湾曲した皿状の形状を有し、中央部がハウジング２０から露出した一方の接点部３４から離間され、外周部がハウジング２０の他方の接点部３４に載置される状態でハウジング２０に組み入れられる。 The contact plate 40 is made of a conductive thin plate metal having a thickness of about 0.01 to 0.05 mm, has a dish-like shape curved in a convex shape, and one contact portion 34 whose central portion is exposed from the housing 20. The outer peripheral portion is mounted on the other contact portion 34 of the housing 20 and is incorporated into the housing 20.

操作部材６０は先端部６１に半球状の押圧部６２を備えた押圧片６３と組み込み時にハウジング２０の外部に位置される操作方向に対して垂直な平面６４を有する操作部６５からなり、押圧部６２と押釦スイッチ１０に組み入れられた接触板４０の中央とを結ぶ仮の線が操作方向と一致するようにハウジングに組み込まれるものである。 The operating member 60 includes a pressing piece 63 having a hemispherical pressing portion 62 at the distal end portion 61 and an operating portion 65 having a plane 64 perpendicular to the operating direction positioned outside the housing 20 when assembled. The temporary line connecting 62 and the center of the contact plate 40 incorporated in the pushbutton switch 10 is incorporated in the housing so as to coincide with the operation direction.

そして、この操作部材６０を組み込んだ上から、薄板金属からなり天面部７１のほぼ中央を切り欠いて斜め下方へ突出する誘導舌部７２が形成され、ハウジング外形と略同形の天面部７１の端部から下方へ折り曲げ延出した複数の係止部７３をハウジング２０に形成した係止凸部２４へ係止することによって、ハウジングの開口部２２を塞ぎ押釦スイッチ１０の組み立てを完了させることができる。 Then, a guide tongue 72 made of a thin metal plate and projecting obliquely downward from the top surface 71 is formed by forming the operation member 60, and the end of the top surface 71 is substantially the same shape as the outer shape of the housing. By engaging the plurality of engaging portions 73 bent and extended downward from the portion to the engaging convex portion 24 formed on the housing 20, the opening 22 of the housing is closed and the assembly of the push button switch 10 can be completed. .

このように組み立てられた押釦スイッチ１０は、図２に示すように操作部６５の前記平面６４に対して略垂直な方向の力を加えることにより、操作部材６０の押圧部６２がカバー７０に形成された誘導舌部７２により下方へ移動し、接触板４０の中央凸部がハウジング２０に露出した一方の接点部に接触することで接触板４０を介して２つの接点部３４が電気的に導通され、スイッチがＯＮ状態となる。 The push button switch 10 assembled in this way forms a pressing portion 62 of the operating member 60 on the cover 70 by applying a force in a direction substantially perpendicular to the plane 64 of the operating portion 65 as shown in FIG. When the guide tongue 72 moves downward, the central convex portion of the contact plate 40 comes into contact with one of the contact portions exposed to the housing 20, so that the two contact portions 34 are electrically connected via the contact plate 40. The switch is turned on.

次に本押釦スイッチ１０を基板５０に実装する際に半田接合される本発明となる端子３０の構造について説明する。端子３０は導電性の薄板金属からなり、一端部には前述したようにハウジング内に一体成形され、ハウジング２０の開口部側に露出する接点部３４が形成されたものであり、他端には押釦スイッチ１０が実装される基板５０に半田付けされる半田接続部３１が形成されている。この半田接続部３１は長板状の形状を有し、両側が半円からなる長穴３２が板厚方向に開口されており、半田接続部３１の長手方向の端部には半円状の切り欠き部が設けられている。 Next, the structure of the terminal 30 according to the present invention that is soldered when the pushbutton switch 10 is mounted on the substrate 50 will be described. The terminal 30 is made of a conductive thin metal plate, and is integrally formed in the housing at one end portion as described above, and the contact portion 34 exposed to the opening side of the housing 20 is formed. A solder connection portion 31 to be soldered to the substrate 50 on which the pushbutton switch 10 is mounted is formed. The solder connection portion 31 has a long plate shape, and a long hole 32 having a semicircle on both sides is opened in the plate thickness direction. A semicircular shape is formed at the end of the solder connection portion 31 in the longitudinal direction. A notch is provided.

そして、押釦スイッチ１０の基板５０への実装は、基板に形成された半田接続部３１と相似形で大きく形成された実装パターン５１にペ−スト状の半田を印刷または塗布し、その上に実装機等により押釦スイッチ１０の半田接続部３１が実装パターン５１に合うように押釦スイッチ１０を基板５０に載置し、この基板５０に実装された押釦スイッチ１０を３００℃前後のリフロー槽に通すことにより半田を溶融させ基板の実装パターン５１と半田接続部３１とを半田接続し、押釦スイッチ１０と基板５０とを電気的に接続状態にする。 Then, the pushbutton switch 10 is mounted on the substrate 50 by printing or applying paste-like solder on a mounting pattern 51 formed in a similar shape and large to the solder connection portion 31 formed on the substrate, and mounting it thereon. The push button switch 10 is placed on the substrate 50 so that the solder connection portion 31 of the push button switch 10 matches the mounting pattern 51 by a machine or the like, and the push button switch 10 mounted on the substrate 50 is passed through a reflow bath at around 300 ° C. Thus, the solder is melted to solder-connect the board mounting pattern 51 and the solder connection portion 31, and the push button switch 10 and the board 50 are electrically connected.

この際、半田が溶融し、これによって半田接続部３１の板厚方向の壁面と基板の実装パターン５１で形成される角部に半田フィレットが形成される。よって本押釦スイッチ１０の半田接続部３１においては、長板状の外周に形成される半田フィレットだけでなく、前述の半田接合部３１に開口された長穴３２の壁面と、端部の半円状の切り欠き部３３にも半田フィレットが形成される。これにより長穴３２及び半円状の切り欠き３３が形成されていない通常の半田接続部に比較して本押釦スイッチ１０は長穴３２及び半円状の切り欠き３３によって形成される半田フィレットの分だけ基板５０との半田接合力が増し、従来の押釦スイッチ１００に比較して押釦スイッチ１０の実装パターン５１からの耐剥離強度を増すことができる。さらに、長穴部３２及び切り欠き部３３にフィレットが形成されると同時にフラックスが流れ込み、これによって押釦スイッチへ流れこもうとするフラックスの量が減り、押釦スイッチ内へのフラックスの侵入を抑制することができる。 At this time, the solder is melted, and a solder fillet is formed at the corner portion formed by the wall surface in the thickness direction of the solder connection portion 31 and the mounting pattern 51 of the substrate. Therefore, in the solder connection portion 31 of the pushbutton switch 10, not only the solder fillet formed on the outer periphery of the long plate shape, but also the wall surface of the long hole 32 opened in the solder joint portion 31 and the semicircle at the end portion. Solder fillets are also formed in the notch 33. As a result, the pushbutton switch 10 has a solder fillet formed by the long hole 32 and the semicircular cutout 33 as compared with a normal solder connection portion in which the long hole 32 and the semicircular cutout 33 are not formed. Compared with the conventional push button switch 100, the solder bonding strength with the substrate 50 can be increased by that amount, and the peel strength from the mounting pattern 51 of the push button switch 10 can be increased. Further, the flux flows at the same time as the fillet is formed in the long hole portion 32 and the notch portion 33, thereby reducing the amount of flux that tends to flow into the push button switch and suppressing the flux from entering the push button switch. be able to.

また押釦スイッチ１０の半田接続部３１は、その半田接続面３５がハウジング２０の底面２３と同一平面上に位置することなく、ハウジングの側面から突出している。これは、さまざまな電気機器の小型化、薄型化に対応すべく、図６に示すように押釦スイッチ１０の基板実装高さをできる限り小さくするため、基板の一部を切り欠き、その切り欠き部分５２に押釦スイッチ１０本体を組み入れる実装形態がとられる場合が多く、この実装形態に従来の図９に示すような半田接続面１３１がハウジング底面１１２と同一面上に位置している押釦スイッチ１００を実装機で基板に載置しようとした場合、押釦スイッチ１００のハウジング底面１１２に実装機からの押釦スイッチ載置のための下方向の力が加わり、これによってケース底面１１２から露出する端子の長さはハウジング底面１１２と同一面上に位置している半田接続面１３１をもつ半田接続部１３２と、半田接続部１３２から連続するハウジング外形内でハウジング底面１１２と同一面に位置する端子の出力部１３３を加えた長さとなり、端子１３０の変形やハウジング１１０からの浮きが生じやすくなり、電気機器組み立ての際、歩留まりが悪くなるものであった。これに比較して、本押釦スイッチ１０の半田接続部３１は、図５に示すようにその半田接続面３５がハウジング２０の底面２５と同一平面上に位置することなく、ハウジングの側面２１から突出しているため
、実装の際の押釦スイッチ１０への加圧によって変形しうる端子長さが短くなるため変形しにくく、またハウジング２０から端子３０が浮くこともないものである。また、本押釦スイッチ１０は実装機による加圧だけでなく電気機器組み立てにおけるハンドリングにおいても端子３０の変形、ハウジング２０からの浮きが生じる可能性を小さくすることができるものである。 The solder connection portion 31 of the pushbutton switch 10 protrudes from the side surface of the housing without the solder connection surface 35 being located on the same plane as the bottom surface 23 of the housing 20. This is because, as shown in FIG. 6, in order to reduce the board mounting height of the push button switch 10 as much as possible in order to cope with the reduction in size and thickness of various electric devices, a part of the board is cut out, In many cases, a mounting form in which the main body of the pushbutton switch 10 is incorporated in the portion 52 is employed. In this mounting form, the pushbutton switch 100 in which a solder connection surface 131 as shown in FIG. Is mounted on the board by the mounting machine, a downward force for mounting the push button switch from the mounting machine is applied to the bottom surface 112 of the housing of the push button switch 100, thereby the length of the terminal exposed from the case bottom surface 112. The solder connecting portion 132 having the solder connecting surface 131 located on the same plane as the housing bottom surface 112, and the outside of the housing continuous from the solder connecting portion 132. The terminal output portion 133 is located on the same plane as the housing bottom surface 112, and the terminal 130 is likely to be deformed and lifted from the housing 110, resulting in poor yield when assembling electrical equipment. there were. In comparison, the solder connection portion 31 of the pushbutton switch 10 protrudes from the side surface 21 of the housing without the solder connection surface 35 being located on the same plane as the bottom surface 25 of the housing 20 as shown in FIG. Therefore, the length of the terminal that can be deformed by pressurizing the push button switch 10 during mounting is shortened, so that it is difficult to deform and the terminal 30 does not float from the housing 20. Further, the push button switch 10 can reduce the possibility of deformation of the terminal 30 and floating from the housing 20 not only in pressurization by the mounting machine but also in handling in assembling electric equipment.

そしてさらに、ハウジング底面２５に露出する端子部が無いことにより、ハンダ付けの際、フラックスが端子を介してハウジング内部に侵入しにくくなることとなる。 Further, since there is no terminal portion exposed on the bottom surface 25 of the housing, it becomes difficult for flux to enter the inside of the housing through the terminals when soldering.

このように本押釦スイッチ１０は基板５０への実装が容易に行なえ、また、実装状態においても、より大きな押釦スイッチ１０への負荷に耐え、基板５０から押釦スイッチ１０が剥離するのを防止しることができ、さらには実装の際にフラックスが押釦スイッチ１０内部へ浸入することを防止できるものである。 As described above, the pushbutton switch 10 can be easily mounted on the substrate 50, and even in a mounted state, the pushbutton switch 10 can withstand a larger load on the pushbutton switch 10 and prevent the pushbutton switch 10 from being detached from the substrate 50. In addition, the flux can be prevented from entering the push button switch 10 during mounting.

本実施例においては実装時に半田フィレットの形成領域を増やすために端子の半田接続部に両側が半円からなる長穴および端部への半円状の切り欠き部を一つづつ各々の半田接続部に形成したが、本発明を実施する形態は、これに限るものではなく、円形、楕円形および角状の穴、または図７（ａ）（ｂ）にあるように円状または角状の切り欠きでも可能であり、またそれらを各々の半田接続部に複数づつ形成することによっても本発明を実施できるものである。 In this embodiment, in order to increase the solder fillet formation area at the time of mounting, each terminal is connected to a solder connection portion by a semi-circular hole on both sides and a semi-circular notch to the end one by one. However, the embodiment for carrying out the present invention is not limited to this, and is not limited to a circular, elliptical or square hole, or a circular or angular shape as shown in FIGS. Notches are possible, and the present invention can also be implemented by forming a plurality of them in each solder connection portion.

本発明に係る押釦スイッチの正面図Front view of pushbutton switch according to the present invention 図１Ａ−Ａ箇所における断面図1A-A cross-sectional view 図１の右側側面図Right side view of FIG. 本発明に係る押釦スイッチの正面側斜視図Front side perspective view of pushbutton switch according to the present invention 本発明に係る押釦スイッチの背面側斜視図The back side perspective view of the pushbutton switch concerning the present invention 本発明に係る押釦スイッチの基板実装時の背面側斜視図The back side perspective view at the time of board mounting of the pushbutton switch concerning the present invention 図６Ｂ−Ｂ箇所における半田付実装時の断面図6B-B sectional view at the time of solder mounting 本発明に係る押釦スイッチに関するその他の端子形状Other terminal shapes for pushbutton switches according to the present invention 従来の押釦スイッチの正面側斜視図Front side perspective view of a conventional pushbutton switch 従来の押釦スイッチの基板実装時の背面側斜視図Rear side perspective view of conventional pushbutton switch when mounted on board

符号の説明Explanation of symbols

１０ 押釦スイッチ ２０ ハウジング ２１ ハウジング側面 ２２ 開口部 ２３ 底面部 ２４ 係止凸部 ２５ ハウジング底面 ３０ 端子 ３１ 端子の半田接続部 ３２ 開口部（長穴） ３３ 切り欠き部 ３４ 接点部 ３５ 半田接続面 ４０ 接触板 ５０ 基板 ５１ 基板の半田実装面（実装パターン） ５２ 基板切り欠き部 ６０ 操作部材 ６１ 先端部 ６２ 押圧部 ６３ 押圧片 ６４ 垂直な平面 ６５ 操作部 ７０ カバー ７１ 天面部 ７２ 誘導舌部 ７３ 係止部 ８０ 半田フィレット １００ 従来の押釦スイッチ １０１ 接点部 １１０ ハウジング １１１ ハウジング側面 １１２ ハウジング底面 １２０ 押釦 １３０ 端子 １３１ 半田付け面 １３２ 半田接続部 １３３ 出力部 １６０ 金属製カバー １７０ 基板 DESCRIPTION OF SYMBOLS 10 Pushbutton switch 20 Housing 21 Housing side surface 22 Opening part 23 Bottom part 24 Locking convex part 25 Housing bottom part 30 Terminal 31 Terminal solder connection part 32 Opening part (elongate hole) 33 Notch part 34 Contact part 35 Solder connection surface 40 Contact Plate 50 Substrate 51 Solder mounting surface (mounting pattern) of substrate 52 Notch portion 60 Operation member 61 Tip portion 62 Press portion 63 Press piece 64 Vertical plane 65 Operation portion 70 Cover 71 Top surface portion 72 Guiding tongue portion 73 Locking portion 80 Solder Fillet 100 Conventional Push Button Switch 101 Contact Point 110 Housing 111 Housing Side 112 Housing Bottom 120 Push Button 130 Terminal 131 Soldering Surface 132 Solder Connection Portion 133 Output Portion 160 Metal Cover 170 Board

Claims (4)

ハウジングの側面から突出する端子の半田接続面を基板の半田実装面に半田接続する基板実装用スイッチの端子構造であって、前記端子には開口部が形成され、前記端子の半田接続面と前記基板の半田実装面とが半田接続される際に、前記開口部の内側周囲部に半田フィレットが形成されることを特徴とする基板実装用スイッチの端子構造。 A terminal structure of a board mounting switch for solder-connecting a solder connection surface of a terminal protruding from a side surface of a housing to a solder mounting surface of a substrate, wherein an opening is formed in the terminal, and the solder connection surface of the terminal and the terminal A terminal structure for a substrate mounting switch, wherein a solder fillet is formed in an inner peripheral portion of the opening when the solder mounting surface of the substrate is soldered. 基板実装用スイッチが基板の切欠き部に実装されることを特徴とする請求項１記載の基板実装用スイッチの端子構造。 2. The terminal structure of a board mounting switch according to claim 1, wherein the board mounting switch is mounted in a notch portion of the board. 前記端子の半田接続面がハウジングの底面と同一平面上に位置することなく、基板の側面から突出していることを特徴とする請求項１又は２記載の基板実装用スイッチの端子構造。 3. The terminal structure for a substrate mounting switch according to claim 1, wherein the solder connection surface of the terminal is not located on the same plane as the bottom surface of the housing but protrudes from the side surface of the substrate. 基板実装用スイッチは、基板への実装時に押釦の操作方向が基板の板面と略平行となるように形成された基板実装用押釦スイッチであることを特徴とする請求項１，２又は３記載の基板実装用スイッチの端子構造。 4. The board mounting switch is a board mounting push button switch formed so that an operation direction of the push button is substantially parallel to a plate surface of the board when mounted on the board. Terminal structure of the switch for board mounting.
JP2008075336A 2008-03-24 2008-03-24 Terminal structure of switch for base board mounting Pending JP2009231062A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118336A (en) * 2008-10-14 2010-05-27 Panasonic Corp Push switch, and electronic device loading the same
JP2011210602A (en) * 2010-03-30 2011-10-20 Panasonic Corp Push switch
WO2015022745A1 (en) * 2013-08-15 2015-02-19 松尾電機株式会社 Chip-type fuse

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123526U (en) * 1982-02-16 1983-08-23 オムロン株式会社 switch
JPH0590932U (en) * 1992-04-30 1993-12-10 日本電気株式会社 Surface mount components
JP2001210176A (en) * 2000-01-25 2001-08-03 Matsushita Electric Ind Co Ltd Push-on switch and electronic equipment mounting the switch, and method of mounting the same
JP2005228898A (en) * 2004-02-12 2005-08-25 Densei Lambda Kk Circuit board
JP2006210195A (en) * 2005-01-28 2006-08-10 Alps Electric Co Ltd Push-button switch

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123526U (en) * 1982-02-16 1983-08-23 オムロン株式会社 switch
JPH0590932U (en) * 1992-04-30 1993-12-10 日本電気株式会社 Surface mount components
JP2001210176A (en) * 2000-01-25 2001-08-03 Matsushita Electric Ind Co Ltd Push-on switch and electronic equipment mounting the switch, and method of mounting the same
JP2005228898A (en) * 2004-02-12 2005-08-25 Densei Lambda Kk Circuit board
JP2006210195A (en) * 2005-01-28 2006-08-10 Alps Electric Co Ltd Push-button switch

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118336A (en) * 2008-10-14 2010-05-27 Panasonic Corp Push switch, and electronic device loading the same
JP2011210602A (en) * 2010-03-30 2011-10-20 Panasonic Corp Push switch
US8455776B2 (en) 2010-03-30 2013-06-04 Panasonic Corporation Push switch
WO2015022745A1 (en) * 2013-08-15 2015-02-19 松尾電機株式会社 Chip-type fuse

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